EE 229 : Research Topic Proposal

INTEGRATION OF SILICON PHOTONICS IN CMOS TECHNOLOGY FOR THE

APPLICATION OF DLP TELEVISION

Edward Lau

006433401

Abstract
This report details the proposal of integrating silicon photonic circuits with
electronic circuits in CMOS technology processes for the application of
Digital Light Processing Televisions (DLP TV) in 3D. By implementing
photonic circuits with electronic circuits, we can increase data rates and
improve control over a single DLP unit to create better picture for such
technology as 3D picture. Photonic integrated circuits have gained interest
the past few years due to the emergence of various fabrication techniques
using conventional CMOS processes to allow for simple and economical
fabrication of photonic circuits using well understood fabrication techniques.
Silicon photonics have shown to provide data rates of 25Gb/s – much higher
than what electronic circuits can provide. With these high data rates, control
system units used for DLP units can now receive and process larger amounts
of data at higher speeds, and therefore allowing higher control of DLP units
for better picture in DLP Television.
 1. Topic : Silicon Photonic Circuits and its application in DLP
Television

a. Objectives of Proposed Work

The objective of this proposal is the integration of photonic circuits with

electronic circuits using streamlined CMOS silicon processes and without the
use of expensive or exotic materials such as GaI, InP, et al. By integrating
photonic circuits with electronic circuits, the first objective is to show a
circuit can get higher data rates. These data rates will be compared against
state-of-the-art electronic circuits to compare data rates. The second
objective, the application of the first objective, is to control a single Digital
Light Processing (DLP) unit and observe if integrated photonic and electronic
integrated circuits can better control a single DLP unit, using conventional
control systems analysis as a meter.

The application of high performance control systems for control of DLP units
can be found in television, notably 3D television. This report will further
detail the limitations and motivations for higher performance picture in
television and its part in the growth of 3D television.

b. History of Photonics

Photonics is the scientific field dealing with the manipulation of light, by

means of emission, detection, transmission, sensing, et al. The field of
photonics began in the 1960's (1) with the finding of the first LASER (Light
Emission by Stimulation Emission of Radiation) followed by the finding of the
first laser diode in the 1970's. Since then, various photonic devices and
means of transmission have been researched and developed to give
photonic engineers the ability to manipulate and control light for applications
ranging from signal processing, to imaging to aid in research, and to
research for their unique abilities. Since the 1970’s, photonics has been one
of the fastest growing fields, driven by demands in industries such as
information, communication, manufacturing and life sciences (2).

Why photonics? What advantages does it offer over electronics? The simplest
answer is speed. Light travels at the speed of light. Unlike electrons in
conventional electronics, photons have no weight and create no resistance
(3). At high speeds, light can carry far more data and carry high amount of
energy within a small amount of focused light with a much higher bandwidth
(4). When comparing a voltage pulse to a laser pulse, a laser pulse is on the
order of magnitude of one quadrillionth (10^-15) of a second for an atomic
reaction to take place (5). Light also does not suffer from environmental
limitations that electronics suffers from, such as temperature affecting its
performance (6). In short, the limitations of electronics are starting to get
taken away when using photonics to the overall integration of electronic and
photonic integrated circuits.

c. Myth: Limitations of Silicon in the application of

photonics

In the last decade, the field of photonic integrated circuits (PIC) has been of
particular interest. Compared to its counterpart – movement of electrons in
electronics – photonics offers higher speed, higher bandwidth and lower
power possibilities. However, silicon's relatively large bandgap (1.3um to
1.5um) has seemingly rendered it non-transparent for photonic application
until recently (7). As a result, photonics has historically suffered from the
reputation of being expensive, which will be explained in Section 3.2.
Electronics, on the other hand, has taken off with Moore's Law as CMOS
processes using silicon have pushed the development of electronic
integrated circuits to double the number of transistors every 18 months (8).

d. State of the Art: Integrated Photonic Circuits

A photonic integrated circuit consists of a laser, a waveguide a modulator
and a photodetector. As previously stated in Section 1.c, silicon has been
thought of to be inadequate for photonic applications and photonics has
been historically suffered from the reputation of being expensive in both
fabrication and its usage of exotic materials. However, all is not grim for the
usage of silicon as a material for use in photonics. Silicon material offers high
index contrast between silicon (n=3.45) and SiO2 (n = 1.45) making it
possible to scale down photonic devices at the nanometer scale for state-of-
the-art sub-micron CMOS processes (9). The high index contrast makes
silicon desirable for using 3rd order nonlinear interactions, namely, the
Raman and Kerr effect (10). Silicon also offers high thermal conductivity and
high optical damage threshold making it desirable to use for photonic circuits
as well (11).

Considering the silicon laser first, silicon’s indirect bandgap makes the
design for its usage as a laser a challenge. As a result of its indirect bandgap,
specific phonons must be emitted or absorbed to conserve momentum;
otherwise, the resulting transition will suffer from hysteresis resulting in
electrical-to-optical conversion efficiency of 10-4 to 10-3 in even the highest
purity of silicon (12). To overcome this limitation, many approaches have
been considered with only the Raman scattering approach has been proven
successful, first proposed in 2002, demonstrated in 2004 as a pulse mode
laser followed by a demonstration as a continuous-wave (CW) laser in 2005
(13). Intel has demonstrated the first cascaded Raman silicon laser up to
mid-IR (1.848um) emitting mW magnitudes of power, enabling the possibility
for cheap powerful semiconductor lasers to be used (14). The main
challenges for silicon Raman devices are to overcome the loss of free
carriers due to 2-photon-absorption (15). The carrier density can be reduced
by using a reverse-bias p-n junction to sweep carriers out (thus, CW gain);
however, the free-carriers screening occurs in high power saturation
intensities, in addition to heat being produced (16).
Unfortunately, silicon lasing has only been demonstrated using Raman
amplification thus far and does not allow for laser packaging on-chip (i.e.
Raman amplification requires optical pumping) (17). Off-chip laser sources
are relatively high cost and large for packaging with the silicon chip (18).
(Note that there are advantages to having the laser off-chip, such as heat
dissipation.) Another method is bonding or soldering low-cost lasers onto the
chip; however, this requires submicron alignment accuracy to couple into
single-mode waveguides (19). While the optically pumped laser off-chip is a
major step in the developments towards a photonic-integrated circuit, an
electrically pumped silicon laser is desired (20). The most recent proposal is
a hybrid approach of wafer-bonding processes (21). Multiple hybrid lasers
are fabricated simultaneously across the patterned silicon wafer, so that
alignment is unnecessary between the III-V wafer and the patterned silicon
wafer (22). Fabrication can then take place at the wafer, partial-wafer or die-
level.

The next consideration is the silicon modulator. While silicon does not offer
the same electro-optic effects as LiNbO3 offers due to silicon’s centro-
symmetric crystal structure, silicon can make use of plasma dispersion to
achieve high speed modulation (23). Plasma dispersion makes use of
changing the real and imaginary parts of the refractive index of the free
carriers in silicon, mimicking that of a MOS capacitor. When a positive
voltage is applied to the p-type silicon, charge carriers accumulate at the
oxide interface and thus change the refractive index to encode the binary
data of an incoming optical beam (24). The liming factor in speed is due to
the parasitic capacitance in silicon (i.e. RC time constant) but mitigated by
making use of co-propagation of electrical and photonic signals through a
waveguide to lower the RF attenuation (25). In 2008, Intel was able to reach
speeds of 30GHz (40Gb/s) with the goal of reaching 1Tb/s (26).
The next component to consider is the silicon photodetector. Recently,
Luxtera has developed a silicon-germanium photodetector to be integrated
in large-scale integration for applications in infrared wavelength, useful for
silicon applications (27). By depositing small amounts of pure germanium to
a silicon wafer where light-to-electron conversion is required, silicon can now
be effectively used as a photodetector (28). This process gives the
advantage of being low cost production, highly reliable and high yield.
Current downsides include thermal budget for fabrication and an inherent
mismatch in lattice constant between germanium and silicon, making it
difficult to achieve low dark current in the photodetector (29).

Fig XX : Description of the components comprising a photonic integrated

circuit. Image courtesy of http://memebox.com/futureblogger/show/1461

The current state of the art in the application of silicon photonics are found in
Nortal’s add/drop multiplexors for optical attenuators (30), Luxtera’s wave-
division multiplexing transceivers and optical interconnects in Sony
Playstation 3 (31). In the current research, IBM has introduced silicon
nanophotonics targeted towards on-chip integration of ultra-compact
nanophotonic circuits for computer chips (32).

e. Application: 3D and DLP Television

 Fig XX : Description of the operation of a DLP unit and how it is used to project
an image on a screen for televisions. Image courtesy of
http://www.pctechguide.com/57Projectors_DLP.htm

The 2009-release of the American Film “Avatar” has shown early signs of
positive growth in the industry of 3D television. Previous to the release of
Avatar, 3D productions had been released, but one of the major limitations
was the quality of picture for 3D. Lack of sharpness, missing features, offset
polarized picture all contribute to a disagreement between what the human
eyes see and what the brain interprets, leading to headaches for many
viewing 3D productions (33). In a competitive and action-driven industry,
televisions and films are driven by high quality picture and contrast. This can
be seen in television going from cathode ray tubes to Plasma or LCD (Liquid
Crystal Displays) to DLP (Digital Light Processing), television broadcast going
from analog to digital and storage media from limited memory CD's
(Compact Disc) to DVD (Digital Versatile Disc) to Blue-Ray - all with the
underlying trend of more data, more contrast, more quality, and soon, in 3D.

2. Hypothesis

a. Motivation for Silicon Integrated Photonic Circuits

Since 1965, Moore's Law detailing the exponential growth of CMOS

technology has proven true (34). However, as we push transistor dimensions
of less than 20nm (grain size of polysilicon) we are starting to see the
limitations of Moore's Law for electronics in CMOS technology, leading rise to
the motivation for other possible sciences to supplement or replace current
designs in CMOS technology. Several research options ranging from carbon
nanotubes to spintronics to plasmonics to spinplasmonics have offered
various opportunities to solve the limitations of electronics in CMOS
technology; However, most of these options are limited in their application
for various reasons, ranging from their ability to be mass produced in a
realistic process, other technologies required for their operation or
downsides to the application of their respective science..

Silicon Photonics may be one solution to the question of what will be the next
step when electronic integrated circuits can't be made any smaller. Silicon
has been the primary semiconductor in which a whole generation of
electronics has been built upon (35): Silicon wafers have the lowest cost per
unit area (36) and its fabrication techniques and platforms are well
understood and established for large scale integration (37). Despite its
indirect bandgap, silicon offers some desirable photonic qualities. Its high
index contrast between silicon and silicon dioxide (n-3.45 and n-1.45,
respectively) make it possible to scale down photonic devices to nanometer
scale and making high optical intensities easily observable for on-chip
devices to the 3rd order (i.e. Raman and Kerr effects). Silicon's high thermal
conductivities and high optical damage threshold also make it desirable in
the application of photonics in silicon.

b. Motivation: Application of 3D Television

The motivation for the application of integrating photonic circuits with electronic
circuits is to provide higher data rates to DLP control systems to show higher
performing control systems for a single DLP unit. Should the experiment show that
the use of photonic integrated circuits improve control systems for a single DLP
unit, it will be possible to further implement the integration of photonic circuits to
get higher quality picture in DLP TV (38), paving way for the growth of 3D in not just
movies, but household TV's.

c. Hypothesis

Develop the integration of silicon photonic integrated circuits (PIC) with

silicon electronic integrated circuits on a single chip for the application for
the integration of 3D television (Using high-precision DLP control) with large-
volume storage media. Various silicon photonic components will be explored
(i.e. silicon modulators, silicon photodetectors, silicon multiplexors, et al) to
overcome the limiting factor in data rates. Using higher speed, large volume
data transmission using optical interconnects similar to Sony’s Playstation 3
(25Gb/s), future large volume storage media will enable higher frequency
control over DLP for higher precision detail for 3D. As a result, conventional
issues playing 3D such as lack of precision and visual distortion causing
headaches can be mitigated. Particular attention will be focused on
determining what are the limiting factors in controlling the response of the
DLP. By improving the frequency of DLP’s refresh rate, the DLP can more
accurately detail the wavelength of light emitted for each cell by receiving
the data early and using conventional control system methods in electronic
IC’s.
 3. Procedure (3 / 2-4 pages)

a. Test

The test for positive results will be broken two components.

1. Observe the transient and frequency response of the circuit (photonic

components complementing electronic components) and compare its
results against current industry results against current technology
using only electronics for DLP TV. The results to be measured include
data rates (bit/sec), frequency response, stability, noise and linearity. A
bus of a train of pulses will be fed into the input of the circuit. The
number of bits, and the data rate being fed into the circuits input will
be gradually increased, and measurements will be taken at the output.
These results are to be done in silicon test.

2. Using the data in (1), the signal is to be fed into a produced control
systems unit for DLP (which can take data rates up to the maximum
data rate done in (1) to control the movement of a single DLP unit. The
angle and percent overshoot of the DLP will be measured in intervals
as short as possible to analyze the response of the DLP for both
settling time at a desired percent overshoot and percent overshoot at
a desired settling time.

b. Measuring Metric

Similar to the description of the test, (1) and (2) will have measurement
metrics to show correlation between the output of the circuit and control
over the DLP.

c. Procedure

Experiment : Test 1
The first test will be to test the data rates of the circuit. After the hybrid
silicon/electronic integrated circuit, and its peripherals have been designed
and fabricated, a silicon test will be done to observe its performance. The
entire system will be designed to perform the same function as the current
functions performed by DLP systems, that is, the current state-of-the-art for
controlling a single DLP unit. A large package of data (i.e. 100TB) of data will
be sent into the black box and the output will be measured for how long it
takes for the data to reach the output. This will demonstrate the speed of
data rate transmission for the silicon/electronic integrated circuit.

Aside from measuring data rates, distortion, linearity, et al will be measured

to evaluate how accurate the data is. By knowing the input data, and the
expected output data, the evaluated output will be compared against the
theoretical output to evaluate the bit error rates. Signal-to-noise will also be
measured to evaluate how well the overall system discriminates signals from
noise generated in the system. During the design, tap-out pads will be
placed at intervals of stages to evaluate the signal integrity at each tap-out
so that sub-systems can be analyzed for its limitations.

Experiment : Test 2

In this experiment, the hybrid photonic/electronic system will be connected

to a single DLP unit and designed and programmed to control a single DLP
unit. During this experiment, data rates similar to that of a movie will be
input into the system and performance of the DLP unit will be evaluated. A
Matlab and Simulink model will be used to gather data of the DLP unit. The
Matlab-Simulink setup will measure how fast the system responds to input
data, to determine how fast the DLP unit has taken to reach 1% of its
expected settling angle (in 3-dimensions (x-y-z). We note that the 1%
overshoot or undershoot is of all 3 dimensions versus 1 dimension.
A physical setup will also be used to measure the wavelengths of light
emitted. A spectrophotometer will be used to measure the lights intensity for
particular wavelengths. Experimental results for wavelengths’ intensity of
light will be compared theoretical expected wavelengths’ intensity based on
the input data in the system to see how well the DLP is able to reflect (or
“emit”) the desired colour of light. Deviations from its expected value will be
used to generate a percentage error on how closely a DLP unit is able to
match the desired colour of light, and these deviations will be plotted against
the wavelengths in the visible spectrum to present forth the accuracy and
clarity in which the DLP system with hybrid photonic/electronic control
systems are able to display desired colour. This test (i.e. test for the output
wavelength of light) will be repeated multiple times (i.e. 100 times) to show
the mean and deviation of the spectrum of output wavelengths to observe
the overall accuracy of the entire system.

d. Analysis

The first part of the experiment will be to determine the data rates of the
hybrid silicon/electronic integrated circuit, performed as a system. As
described in Section 3.c, a large package of data (i.e. 100TB) will be sent into
the output and the amount of time it takes to process the data will determine
the data rate of the hybrid integrated circuit, found by dividing the amount
of data over the length of time to get the data rate.

The second part of the experiment will make use of Matlab Simulink to
acquire and process data, in its entirety, for the specification listed in Section
4.b. The hardware to be used will be an Analog Plant Simulator (APS) to
study the behavior of the dynamics of a DLP unit (39). Data Acquisition
Systems will also be used to measure the digital-to-analog conversion, i.e.
the digital data package and the analog response signal. A universal power
module will also be required to power the overall system.
Matlab/Simulink with Control Systems Toolbox will be the software used to
simulate acquire the data through a block-diagram connections (40). WinCon
offers real-time control systems to run the Matlab/Simulink generated code
to acquire data real time to a computer (41).

Finally, a photodiode will be connected to the output of DLP unit to read the
electromagnetic spectrum generated by the DLP unit. Data results will be
taken using LabView (42).

e. Evaluation

i. Positive Results

Positive results expected here will be that the photonic/electronic circuit can
process higher data rates for test 1, and as a result, a faster and faster and
higher precision response will be measured in the rotation of the DLP unit.

ii. Negative Results

Possible negative results that are not being heavily considered (but are
being measured) includes the frequency response, linearity and the noise of
hybrid electronic/photonic circuit that ma degrade the performance of the
control system. Should higher data rates (expected from test 1) not correlate
to higher precision DLP (in test 2) the data analyzed for frequency response
and stability should be analyzed to refine or disprove the hypothesis.

iii. Range of Results

The range of uncertainty will rely in the other factors (than data rates)
contributing to the amount of control of the DLP control system, as noted
above in Negative Results. While the hypothesis suggests that hybrid
electronic/photonic circuits will improve DLP performance, other observations
are to be recorded and analyzed to consider the overall performance of the
hybrid circuit.

f. Qualifications

I believe I am qualified to perform the research topic on silicon photonics

because my BSc Electrical Engineering specialization was in the field of
photonics and MEMS/nanotechnology. I have studied extensively in
photonics, starting from the fundamentals of how electromagnetic waves
propagate through mediums and materials, optics of beams and components
to manipulate electromagnetic waves, light-matter interaction with both
laser optics and plasma. I also have studied laser systems ranging from
specific properties of laser light to its photon lifetime, laser oscillators and it
s respective threshold properties and conditions, and different light beams
with focus on the more conventional Gaussian beams and its gain saturation
over its photon lifetime.

I also have experience working with the production of MEMS (micro-

electrical-mechanical machines) for the understanding and analysis of a DLP
unit. I have fabricated both passive and active components in
microfabrication facilities in the full entirety of the fabrication process in
conventional CMOS fabrication processes. I also performed tests and
experiments on my fabricated active components to understand the
interaction between applied electrical signals on the mechanical movement
of MEMS. I have also worked at a microfabrication facility in the
development of MEMS, and have experience understanding the process
considerations and failures in the fabrication of MEMS.

I hope to put my knowledge and understanding of both photonics and MEMS

together to perform the research and experiment detailed in this report.
 4. Plan (2 / 2-4 pages)

a. Scope

The scope of the work will be two-fold. The first will be to design a integrate
a photonic-electronic circuit for a DLP unit control system and observe the
data rates, while also recording its transmission performance and comparing
it against conventional CMOS electronic circuits. The second scope of work
will be to control a single DLP unit and observe how the control system
performances for a single DLP unit, using control systems theory and
knowledge to observe the test and compare it against conventional CMOS
electronic circuits.

b. Specifications

Test 1 : Data Rates

• Data Rate for the hybrid photonic/electronic integrated circuit,

compared to the electronic integrated circuit.

Test 2: Control Systems Analysis

• Slew Rate using conventional metrics (10% to 90%)

• Percent overshoot over incremental settling times

• Frequency Response of the system; Flatness (i.e. amount of ripple) of

the system to its -3dB pt

• Stability of the system (Measured by Bode Plots and s-plane for poles
and zeros)

• Linearity Measurements for a slow ramping signal over its input range
 • Noise analysis in the frequency domain, in terms of its input-referred
noise.

• The settled angle the DLP unit has settled will be compared against the
“theoretical” or expected angle to show better control over the DLP
unit.

c. Expected Results

In Test 1, the expected result is that the data rates the hybrid
photonic/electronic circuit will increase, as predicted in the hypothesis.

In Test 2, we will analyze the system using control systems theory. With
improved data rates, it is hypothesized that we can improve the accuracy of
the feed-back transfer function (as well as the feed-forward transfer function
for an overall accurate closed-loop transfer function. This should improve the
slew rate and minimize the percent overshoot (i.e. improve the settling
time). Stability and frequency response should not change as a as the
function remains constant, and linearity should not change as the signal
processing is performed using the same logic using CMOS electronics. Input
referred noise should also remain the same, as the same CMOS electronic
integrated circuits will be used as before.

The final expected result is whether the experiment improves control of a

single DLP unit. A signal will be fed into the overall system (i.e. the hybrid
photonic/electronic integrated circuit) and the output will be the wavelength
of light emitted. This output wavelength of light will be carried out multiple
times, and compared against the desired result to show whether the
experiment was a success.

5. Conclusion
This report details the proposed application of silicon photonics in DLP
Television to improve television quality and 3-Dimensional presentation. By
integrating photonics with electronic integrated circuits in conventional
CMOS fabrication processes, the hybrid integrated circuit can achieve high
speed operation and deliver high data rates without many of the limitations
facing conventional electronics. By increasing the data rates offered by the
hybrid integrated circuit, more data can be provided and used in the control
systems for the control of a single digital light processor unit (DLP) used in
DLP Television. It is proposed in this report that by increasing the amount of
data at higher speeds, we can improve both the accuracy and the speed of
the control system for the DLP to emit a more accurate wavelength of a
single pixel on a television. As a result, improving the accuracy of a DLP unit
improves the quality of picture shown on an overall DLP Television, taking
away limitations and paving way for the continued growth of 3D Television.
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