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1. General description
The 74HC73 is a high-speed Si-gate CMOS device and is pin compatible with low-power
Schottky TTL (LSTTL). The 74HC73 is specified in compliance with JEDEC
standard no. 7A.
The J and K inputs must be stable one set-up time prior to the HIGH-to-LOW clock
transition for predictable operation.
The reset (nR) is an asynchronous active LOW input. When LOW, it overrides the clock
and data inputs, forcing the nQ output LOW and the nQ output HIGH.
Schmitt-trigger action in the clock input makes the circuit highly tolerant to slower clock
rise and fall times.
2. Features
■ Low-power dissipation
■ Complies with JEDEC standard no. 7A
■ ESD protection:
◆ HBM EIA/JESD22-A114-B exceeds 2000 V
◆ MM EIA/JESD22-A115-A exceeds 200 V.
■ Multiple package options
■ Specified from −40 °C to +80 °C and from −40 °C to +125 °C.
Philips Semiconductors 74HC73
Dual JK flip-flop with reset; negative-edge trigger
[1] CPD is used to determine the dynamic power dissipation (PD in µW).
PD = CPD × VCC2 × fi × N + ∑(CL × VCC2 × fo) where:
fi = input frequency in MHz;
fo = output frequency in MHz;
CL = output load capacitance in pF;
VCC = supply voltage in V;
N = number of inputs switching;
∑(CL × VCC2 × fo) = sum of outputs.
4. Ordering information
Table 2: Ordering information
Type number Package
Temperature range Name Description Version
74HC73N −40 °C to +125 °C DIP14 plastic dual in-line package; 14 leads (300 mil) SOT27-1
74HC73D −40 °C to +125 °C SO14 plastic small outline package; 14 leads; body width 3.9 mm SOT108-1
74HC73DB −40 °C to +125 °C SSOP14 plastic shrink small outline package; 14 leads; body width SOT337-1
5.3 mm
74HC73PW −40 °C to +125 °C TSSOP14 plastic thin shrink small outline package; 14 leads; body SOT402-1
width 4.4 mm
9397 750 13815 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
5. Functional diagram
14 1J 1Q 12
J Q
FF1
1 1CP
CP
3 1K 1Q 13
K Q
R
2 1R
7 2J 2Q 9
J Q
FF2
5 2CP
CP
10 2K 2Q 8
K Q
R
6 2R
001aab981
4
1J 12
1
14 1J 1Q 12 C1
J Q 3
7 2J 2Q 9 1K 13
FF 2
1 1CP R
CP
5 2CP
3 1K 1Q 13 7
K Q 1J 9
10 2K 2Q 8 5
R C1
10
1K 8
1R 2R 6
R
2 6
001aab979
001aab980
9397 750 13815 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
C C C C
K
J
C C C C
R Q
C
CP
C 001aab982
6. Pinning information
6.1 Pinning
1CP 1 14 1J
1R 2 13 1Q
1K 3 12 1Q
VCC 4 73 11 GND
2CP 5 10 2K
2R 6 9 2Q
2J 7 8 2Q
001aab978
9397 750 13815 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
7. Functional description
8. Limiting values
Table 5: Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to
GND (ground = 0 V).
Symbol Parameter Conditions Min Max Unit
VCC supply voltage −0.5 +7 V
IIK input diode current VI < −0.5 V or VI > VCC + 0.5 V - ±20 mA
IOK output diode current VO < −0.5 V or VO > VCC + 0.5 V - ±20 mA
IO output source or sink VO = −0.5 V to VCC + 0.5 V - ±25 mA
current
ICC, IGND VCC or GND current - ±50 mA
Tstg storage temperature −65 +150 °C
Ptot power dissipation
DIP14 package [1] - 750 mW
SO14, SSOP14 and [2] - 500 mW
TSSOP14 packages
9397 750 13815 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
9397 750 13815 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
9397 750 13815 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
9397 750 13815 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
9397 750 13815 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
9397 750 13815 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
9397 750 13815 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
[1] CPD is used to determine the dynamic power dissipation (PD in µW).
PD = CPD × VCC2 × fi × N + ∑(CL × VCC2 × fo) where:
fi = input frequency in MHz;
fo = output frequency in MHz;
CL = output load capacitance in pF;
VCC = supply voltage in V;
N = number of inputs switching;
∑(CL × VCC2 × fo) = sum of outputs.
9397 750 13815 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
12. Waveforms
nJ, nK VM
input
th th
tsu tsu
1/f max
nCP input VM
tW
tPHL tPLH
nQ output VM
tTHL tTLH
nQ output VM
tTLH tTHL
tPLH tPHL
001aab983
The shaded areas indicate when the input is permitted to change for predictable output
performance.
VM = 0.5 × VI.
Fig 6. Waveforms showing the clock (nCP) to output (nQ, nQ) propagation delays, the
clock pulse width, the J and K to nCP set-up and hold times, the output transition
times and the maximum clock frequency
nCP input VM
trem
tW
nR input VM
tPHL
nQ output
tPLH
nQ input
001aab984
VM = 0.5 × VI.
Fig 7. Waveforms showing the reset (nR) input to output (nQ, nQ) propagation delays
and the reset pulse width and the nR to nCP removal time
9397 750 13815 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
VCC
VI VO
PULSE
D.U.T.
GENERATOR
RT CL
mna101
9397 750 13815 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
D ME
seating plane
A2 A
L A1
c
Z e w M
b1
(e 1)
b
14 8 MH
pin 1 index
E
1 7
0 5 10 mm
scale
UNIT
A A1 A2
b b1 c D (1) E (1) e e1 L ME MH w Z (1)
max. min. max. max.
1.73 0.53 0.36 19.50 6.48 3.60 8.25 10.0
mm 4.2 0.51 3.2 2.54 7.62 0.254 2.2
1.13 0.38 0.23 18.55 6.20 3.05 7.80 8.3
0.068 0.021 0.014 0.77 0.26 0.14 0.32 0.39
inches 0.17 0.02 0.13 0.1 0.3 0.01 0.087
0.044 0.015 0.009 0.73 0.24 0.12 0.31 0.33
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
99-12-27
SOT27-1 050G04 MO-001 SC-501-14
03-02-13
SO14: plastic small outline package; 14 leads; body width 3.9 mm SOT108-1
D E A
X
y HE v M A
14 8
Q
A2
(A 3) A
A1
pin 1 index
θ
Lp
1 7 L
e w M detail X
bp
0 2.5 5 mm
scale
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
99-12-27
SOT108-1 076E06 MS-012
03-02-19
SSOP14: plastic shrink small outline package; 14 leads; body width 5.3 mm SOT337-1
D E A
X
c
y HE v M A
14 8
Q
A2 A
A1 (A 3)
pin 1 index
θ
Lp
L
1 7 detail X
w M
e bp
0 2.5 5 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
99-12-27
SOT337-1 MO-150
03-02-19
TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm SOT402-1
D E A
X
y HE v M A
14 8
Q
A2 (A 3)
A
A1
pin 1 index
θ
Lp
L
1 7
detail X
w M
e bp
0 2.5 5 mm
scale
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
99-12-27
SOT402-1 MO-153
03-02-18
9397 750 13815 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Level Data sheet status [1] Product status [2] [3] Definition
I Objective data Development This data sheet contains data from the objective specification for product development. Philips
Semiconductors reserves the right to change the specification in any manner without notice.
II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in
order to improve the design and supply the best possible product.
III Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant
changes will be communicated via a Customer Product/Process Change Notification (CPCN).
[1] Please consult the most recently issued data sheet before initiating or completing a design.
[2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at
URL http://www.semiconductors.philips.com.
[3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
9397 750 13815 © Koninklijke Philips Electronics N.V. 2004. All rights reserved.
19. Contents
1 General description . . . . . . . . . . . . . . . . . . . . . . 1
2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
3 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2
4 Ordering information . . . . . . . . . . . . . . . . . . . . . 2
5 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3
6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
7 Functional description . . . . . . . . . . . . . . . . . . . 5
7.1 Function table . . . . . . . . . . . . . . . . . . . . . . . . . . 5
8 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5
9 Recommended operating conditions. . . . . . . . 6
10 Static characteristics. . . . . . . . . . . . . . . . . . . . . 6
11 Dynamic characteristics . . . . . . . . . . . . . . . . . . 9
12 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 15
14 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 19
15 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 20
16 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
17 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
18 Contact information . . . . . . . . . . . . . . . . . . . . 20