Passive Component Technology: Sponsored by Res-Net Microwave, Inc. Wavetronix Corp

Passive Component
Technology
Bob Froelich, Besser Associates
Sponsored by
Res-net Microwave, Inc.
Wavetronix Corp.
www.BesserAssociates.com
©Besser Associates, Inc.
At a Glance
“Thinking at a Higher Frequency”
 In business for over 25 years

 Leading supplier of passive components
to 26.5 GHz
 Custom & standard parts available
 ISO 9001:2000 certified
www.res-netmicrowave.com
 Microwave Resistors & Terminations

 DC to 26.5 GHz
 Coaxial, Flange, & Rod
 Available in AlN & BeO
 Microwave Attenuators
 DC to 26.5 GHz up to 2,000 watts
 Coaxial & Flange
 Available in AlN & BeO
Wavetronix Corp.
“Drawn to your Specifications”
 Semi-Rigid Coaxial Cable

 Over 28 years experience
 Cable drawn on site
 ISO 9001:2000 certified
www.wavetronix-eti.com
Wavetronix Corp
 MIL-C-17U
 Low loss cable
 0.034 to .250 diameters
 Custom assemblies available
 Typical VSRW 1.2:1 @ 18GHz
www.wavetronix-eti.com
Passive Component
Technology
Dr. Bob Froelich
Senior Principal Engineer
Cobham
The Ideal Elements
Element Principle Relation Impedance
Ohm’s V = IR R
“Law”
Faraday’s V = L dI/dt jωL
Law
Gauss’ Law I = C dV/dt 1/jωC
Real Elements
• Are never ideal
• Can often be modeled as a simple
equivalent circuit of ideal elements
• Come in many physical forms, depending
on
– Cost
– Frequency
– Power Levels
– Etc.
Some Surface Mount Sizes
Metric LxW US LxW
W
(mm) (mils)
0603 0201
(= 0.6 x 0.3) (= 24 x 12)
1005 0402
L (= 1 x 0.5) (= 40 x 20)
1608 0603
2012 0805
3216 1206
Models and Parasitic Elements
• An ideal element of the type desired is usually
the main feature of the model network.
• The other elements in the model are often called
parasitic elements.
• How parasitics arise
– Energy loss (as heat) => resistance
– Physical area => capacitance
– Physical length => inductance
• All elements in the model can vary with
frequency and temperature.
Lumped vs. Distributed
• Lumped element:
– Small compared to the wavelength of the highest
frequency which is significant.
– Can be treated (electrically) as having zero size.
• Distributed element:
– Not small compared to wavelength. (>~ λ / 10)
– Voltage or current phase differs from one side to the
other due to distance.
– Model must include transmission line or many
“incremental” lumped elements.
Inductors
• In HF/RF/Microwave circuits, inductors are
mainly used for
– RF blocking element to feed DC power or
connect DC ground. (“RF chokes”)
– Impedance matching.
• Manufacturers often furnish equivalent
circuit model or S-parameters.
• Many forms, but all include a conducting
spiral that couples to a magnetic field.
Some RF/Microwave Inductors
Wire on ceramic
Laminated Spiral
Conical
Wire on
Ferrite Toroid
Example of an Inductor Model
• Model approximates
the real inductor from
3nH 7Ω 44nH
DC to above first self-
resonance.
• Parasitic elements 0.4pF
are 7500Ω
– Loss: The spiral has
finite conductivity. 47nH, 0402 SMT Inductor
– Capacitance: Turns in
the spiral act as
capacitor plates.
Primary Inductor Properties
• Inductance: Primary function of the part
• Self Resonance: As some frequency there
is a parallel resonance between the
inductor the parasitic capacitor.
• Quality factor (Q): characterizes the loss
– Defined as Im(Z) / Re(Z)
– Differs from the Q definition used for
resonators:
2π(peak stored energy)/(energy loss in 1 cycle)
Modeled Inductor Reactance and Q
4000 20
Reactance, Ohms
2000 15
0 10
Q
-2000 5
-4000 0
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6
freq, GHz
Some Inductor Types
• Different cores
– Air: lowest loss and lowest C
– Ceramic: close to air, better structure
– Ferrite: more L in a small space. Can be lossy and
frequency-dependent.
• Different windings
– Wire: low loss
– Printed/laminated windings: low cost / low Q
• Planar Spiral
– Used in RFICs
– Usually have poor performance: low Q and high C.
82 uH Multilayer Inductor
• Black: Simple Reflection Coefficient
Swp Max
1.0
Measured
0.8
3000MHz
model with 1.4pF
6
0.
15 MHz
0
Modeled
2.
parallel r=12.1
4
0. 0
3.
x=-1004.
0
capacitance 0.2 5.0
10.0
10.0
0.2
0.6
0.8
3.0
4.0
5.0
0.4
1.0
2.0
• Blue: Measured 0 -10.0
814 2
MHz
response -0.
0
-5.
r=0.644 -4
.0
x=-3.1e-3 -3
.0
.4
-0
.0
-2
.6
-0
-0.8
-1.0
Swp Min
0.1MHz
Using Inductors
• RF choke
– Goal is high reactance with low resistance
– OK to use an inductor at self-resonance
• Impedance matching
– Goal is accurate reactance and (usually) low resistance
– Usually must stay well below self-resonance
• Some things to look for
– Tolerance and SRF
– Q
– Current handling
• Try to use the lowest L that can do the job.
Capacitors
• In HF/RF/Microwave circuits, capacitors are
mainly used for
– DC blocking to isolate bias or create an RF ground
(“RF bypass”)
– Impedance matching
• Manufacturers often furnish a circuit model or S-
parameters
• Possibly the most complicated passive due to
effects of structure, temperature, materials, etc.
Multilayer Capacitor Structure
Example of Capacitor Model
• Model approximates the
real capacitor from DC
to above first self- 0.3nH 0.07Ω 27pF
resonance.
• Parasitic elements are

– Loss: Contact and plate 36kΩ
resistance, plus loss in
27pF, 0402 SMT Capacitor
dielectric
– Inductance: Current flow
sets up magnetic field
Primary Capacitor Properties
• Capacitance: Primary function of the part
• Self-resonance: At some frequency there is a
series resonance between the capacitor and the
parasitic inductance.
• Quality factor
– Defined the same as for an inductor
– RF/Microwave capacitors often have higher Q than
inductors.
• Other
– Breakdown voltage
Modeled Capacitor Susceptance
and Q
10 400
Susceptance, mhos
5 300
0 200
Q
-5 100
-10 0
0.0 0.5 1.0 1.5 2.0 2.5
freq, GHz
1
Susceptance, mhos
-1
0.0 0.5 1.0 1.5 2.0 2.5
Some Capacitor Types
• Plate Configuration
– Multi-layer is an encapsulated stack of metal plates.
– Single-layer is just two plates; used with chip-and-
wire
• Dielectric (Insulator) Material
– Ceramic: many kinds
– Oxide (i.e. MOS capacitor): primarily single-layer
• Electrolytic and tantalum capacitors are seldom
used at high frequencies.
Dielectric Materials
• Ceramics
– Most common material
– Ceramics with high dielectric constant (ε) deliver more
capacitance in a small package.
– High-ε ceramics are temperature- and voltage-dependent, and
they are often more lossy than low-ε materials.
• Oxide
– Very temperature stable
– Producible in thin layers for high capacitance
– Thin layers result in low breakdown voltage
– Used mainly in single-layer capacitors.
• Categories for ceramics have been defined by the
Electronic Industries Alliance
Some EIA Categories for
Temperature Stability of εr
• EIA Designations for Category 2
Low High Allowed
temperature Temperature change from
limit limit +25C
X: -55C 5: +85C R: +/-15%
Y: -30C 6: +105C S: +/-22%
Z: +10C 7: +125C T: +22 / -33%
U: +22 / -56%
• E.G. Z5U: +22/-56% between +10 and +85C
• Category 1: NPO/COG: +/-0.1% from -55 to + 105C

Other Dielectric Properties
Material εr at room Dissipation factor, % of Change with

type temperature, typ. energy converted to heat voltage (0V to rated
(low frequency), typ. voltage), typ.
SiO2 3.9 < 0.1 ~0
NPO 60 0.1 ~0
X7R 3500 3.5 -50%
Y5V >16000 9 -90%
Using Capacitors
• DC block or RF bypass:
– Requires high susceptance
– OK to use a capacitor near self-resonance
• Impedance matching
– Requires accurate susceptance
– Usually must be well below self-resonance
• Watch out for
– Temperature sensitivity
– Tolerance and SRF
– Breakdown voltage
• Try to use the lowest C than can do the job.
Resistors
• In HF/RF/Microwave circuits, resistors are
used mainly for
– Attenuators
– Terminations
– Feedback
• Manufacturers sometimes furnish model or
S-parameters.
Example of Resistor Model
• Model approximates
the real resistor from 50Ω 0.17nH
dc to about 6GHz.
• Parasitic elements
are
– Inductance: due to
length 0.08pF 0.08pF
– Capacitance: due to
contact area 50Ω 0603 SMT Resistor
Modeled Resistor Impedance
56 7
55 6
Resistance, Ohms
Reactance, Ohms
5
54
4
53
3
52
2
51 1
50 0
1 2 3 4 5 6 7 8
freq, GHz
Other Resistive Forms for
RF/Microwave
• Attenuator (coaxial or
surface mount)
– Fixed
– Temperature-
dependent
• Termination
– High power (with heat
sink)
– Small/high frequency
Watch Out For
• Leaded resistors (or capacitors, inductors)
– Leads add series inductance and/or length
• Wire-wound, carbon film and MELF
cylindrical resistors
– Resistive element is often in the form of a
spiral. At RF it becomes a lossy inductor.
• 1/F noise: Some resistor types generate
more than others.
Passive Component
Technology
Bob Froelich, Besser Associates
Sponsored by
Res-net Microwave, Inc., www.res-netmicrowave.com
Wavetronix Corp., www.wavetronix-eti.com

Passive Component Technology: Sponsored by Res-Net Microwave, Inc. Wavetronix Corp

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Passive Component

“Thinking at a Higher Frequency”

 In business for over 25 years

 Microwave Resistors & Terminations

 Semi-Rigid Coaxial Cable

capacitance 0.2 5.0

• Parasitic elements are

• E.G. Z5U: +22/-56% between +10 and +85C

• Category 1: NPO/COG: +/-0.1% from -55 to + 105C

Material εr at room Dissipation factor, % of Change with

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