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Micro Compact

System
Model Name MM-E430D

Model Code MM-E430D/XN

SERVICE MANUAL
Micro Compact System Contents

1. Precaution

2. Product Specification

3. Disassembly and Reassembly

4. Troubleshooting

5. PCB Diagram

6. Schematic Diagram
MM-E430D

Refer to the service manual in the GSPN (see the rear cover) for more information.
Contents

Contents
1. Precaution........................................................................................................................................ 1 − 1
1.1. Safety Precautions ................................................................................................................... 1 − 1
1.2. Servicing Precautions ............................................................................................................... 1 − 3
1.3. Precautions for Electrostatically Sensitive Devices (ESDs) .............................................................. 1 − 4
2. Product Specification ......................................................................................................................... 2 − 1
2.1. Product Feature ....................................................................................................................... 2 − 1
2.2. Specifications.......................................................................................................................... 2 − 2
2.2.1. MX-E430 Specifications ............................................................................................... 2 − 2
2.2.2. MX-E430D Specifications............................................................................................. 2 − 3
2.3. Specifications Analysis ............................................................................................................. 2 − 4
2.4. Disc Types And Disc Format...................................................................................................... 2 − 5
2.4.1. Disc types that can be played ......................................................................................... 2 − 5
2.4.2. Supported Audio Formats ............................................................................................. 2 − 5
2.5. Accessories ............................................................................................................................ 2 − 6
2.5.1. Supplied Accessories ................................................................................................... 2 − 6
3. Disassembly and Reassembly .............................................................................................................. 3 − 1
3.1. MAIN Disassembly and Reassembly ........................................................................................... 3 − 1
3.2. DECK Disassembly and Reassembly ........................................................................................... 3 − 6
4. Troubleshooting ................................................................................................................................ 4 − 1
4.1. Checkpoints by Error Mode ....................................................................................................... 4 − 1
4.1.1. No Power................................................................................................................... 4 − 2
4.1.2. No Output .................................................................................................................. 4 − 4
4.2. Measures to be taken when the Protection Circuit operates............................................................... 4 − 5
4.2.1. Operation of Power Block Protection Circuit .................................................................... 4 − 5
4.2.2. Check AMP in Power Protection .................................................................................... 4 − 6
4.3. MICOM, MPEG Initialization & Update ...................................................................................... 4 − 7
4.4. Buyer-Region Code Setting Method ............................................................................................ 4 − 8
4.4.1. The inserting method of Region Code after replacing the Main PBA ..................................... 4 − 8
5. PCB Diagram ................................................................................................................................... 5 − 1
5.1. Wiring Diagram....................................................................................................................... 5 − 1
5.2. MAIN PCB Top ...................................................................................................................... 5 − 2
5.2.1. Pin Connection ........................................................................................................... 5 − 3
5.2.2. Test Point Wave Form .................................................................................................. 5 − 4
5.3. MAIN PCB Bottom.................................................................................................................. 5 − 5
5.4. FRONT PCB Top .................................................................................................................... 5 − 6
5.5. FRONT PCB Bottom ............................................................................................................... 5 − 7
5.6. JACK PCB Top ....................................................................................................................... 5 − 8
5.6.1. Pin Connection ........................................................................................................... 5 − 9

i Copyright© 1995-2013 SAMSUNG. All rights reserved.


Contents

5.7. JACK PCB Bottom .................................................................................................................. 5 − 10


5.8. TOUCH KEY PCB Top ............................................................................................................ 5 − 11
5.8.1. Pin Connection ........................................................................................................... 5 − 12
5.9. TOUCH KEY PCB Bottom ....................................................................................................... 5 − 13
5.10. SMPS PCB Top....................................................................................................................... 5 − 14
5.10.1. Pin Connection ........................................................................................................... 5 − 15
5.11. SMPS PCB Bottom .................................................................................................................. 5 − 16
6. Schematic Diagram ........................................................................................................................... 6 − 1
6.1. Overall Block Diagram ............................................................................................................. 6 − 1
6.2. MAIN-1................................................................................................................................. 6 − 2
6.3. MAIN-2................................................................................................................................. 6 − 3
6.4. MAIN-3................................................................................................................................. 6 − 4
6.5. MAIN-4................................................................................................................................. 6 − 5
6.5.1. Test Point Wave Form .................................................................................................. 6 − 6
6.6. MAIN-5................................................................................................................................. 6 − 7
6.7. MAIN-6................................................................................................................................. 6 − 8
6.8. MAIN-7................................................................................................................................. 6 − 9
6.9. MAIN-8................................................................................................................................. 6 − 10
6.10. FRONT ................................................................................................................................. 6 − 11
6.11. JACK .................................................................................................................................... 6 − 12
6.12. TOUCH KEY-1 ....................................................................................................................... 6 − 13
6.13. TOUCH KEY-2 ....................................................................................................................... 6 − 14
6.14. SMPS .................................................................................................................................... 6 − 15

Copyright© 1995-2013 SAMSUNG. All rights reserved. ii


1. Precaution

1. Precaution
Follow these safety instructions while servicing the ESD to prevent damage and to protect against potential hazards
such as electrical shock and X-rays.

1.1. Safety Precautions

1) When reinstalling the chassis and its assemblies, be sure to restore all of the protective devices, including the control
knobs and the compartment covers.

2) Make sure that there are no cabinet openings through which people (particularly children) can make contact with
dangerous internal components.

3) Design Alteration Warning : Never alter or add to the mechanical or electrical design of the unit.
Example : Do not add auxiliary audio or video connectors. Such alterations might create a safety hazard. Also, any
design changes or additions will void the manufacturer’s warranty.

4) Leakage Current Hot Check Figure 1.1 AC Leakage Test :

WARNING

Do not use an isolation transformer during this test. Use a leakage-current tester or a metering system that complies
with American National Standards Institute (ANSI C101.1, Leakage Current for Appliances), and Underwriters
Laboratories (UL Publication UL1410, 59.7).

With the unit completely reassembled, plug the AC cord directly into a 120 V AC outlet. With the unit’s power switched
from the ON to the OFF position, measure the current between a known ground and all exposed metal parts.
Known Grounds - Earth
Known Metal parts - Screwheads, Metal Cabinets, etc.

LEAKAGE (READING
DEVICE CURRENT SH OULD NOT BE
UNDER TES TER ABOVE 0.5mA)
TES T
TES T ALL
EXPO S ED METAL
SU RFACES
2-WIRE CORD
ALSO TES T WITH
PLUG REVER S ED
(US ING AC EARTH
ADAPTER P LUG GROUND
AS R EQ UIRED)

Figure 1.1 AC Leakage Test

1-1 Copyright© 1995-2013 SAMSUNG. All rights reserved.


1. Precaution

5) Insulation Resistance Cold Check :


(1) With the unit’s AC plug disconnected from the AC source, connect an electrical jumper across the two AC prongs.
(2) Set the power switch to ON.
(3) Measure the resistance between the shorted AC plug and any exposed metallic parts.
Example : Screwheads, Metal Cabinets, Antenna Port, etc. If any of the exposed metallic parts has a return path to
the chassis, the measured resistance should be between 1 and 5.2 megohms. If there is no return path, the measured
resistance should be “infinite”. If the resistance is outside these limits, a shock hazard might exist.
See Figure 1.2 Insulation Resistance Test

Ante nna
Term inal

Expo s ed
Meta l P a rt

oh m
Ohmmet er

Figure 1.2 Insulation Resistance Test

6) Components, parts and wiring that appear to have overheated or that are otherwise damaged should be replaced with
parts that meet the original specifications. Always determine the cause of damage or overheating, and correct any
potential hazards.

7) Observe the original lead dress, especially near the following areas :
Antenna wiring, sharp edges, and especially the AC and high voltage power supplies. Always inspect for pinched,
out-of-place, or frayed wiring. Do not change the spacing between components and the printed circuit board. Check the
AC power cord for damage. Make sure that no wires or components touch thermally hot parts.

8) Product Safety Notice :


Some electrical and mechanical parts have special safety-related characteristics which might not be obvious from visual
inspection. These safety features and the protection they give might be lost if the replacement component differs from
the original–even if the replacement is rated for higher voltage, wattage, etc.

9) Components that are critical for safety are indicated in the circuit diagram by shading, or .
Use replacement components that have the same ratings, especially for flame resistance and dielectric strength
specifications. A replacement part that does not have the same safety characteristics as the original might create
shock, fire or other hazards.

Copyright© 1995-2013 SAMSUNG. All rights reserved. 1-2


1. Precaution

1.2. Servicing Precautions

1) Servicing precautions are printed on the cabinet. Follow them.

2) Always unplug the unit’s AC power cord from the AC power source before attempting to :
(a) Remove or reinstall any component or assembly, (b) Disconnect an electrical plug or connector, (c) Connect a
test component in parallel with an electrolytic capacitor.

3) Some components are raised above the printed circuit board for safety. An insulation tube or tape is sometimes used.
The internal wiring may be clamped to prevent contact with thermally hot components. Reinstall all such elements
to their original position.

4) After servicing, always check that the screws, components and wiring have been correctly reinstalled. Make sure that
the portion around the serviced part has not been damaged.

5) Check the insulation between the blades of the AC plug and accessible conductive parts (examples : metal panels,
input terminals and earphone jacks).

6) Insulation Checking Procedure :


Disconnect the power cord from the AC source. Connect an insulation resistance meter (500 V) to the blades of the
AC plug. The insulation resistance between each blade of the AC plug and accessible conductive parts (see above)
should be greater than 1 megohm.

7) Never defeat any of the B+ voltage interlocks. Do not apply AC power to the unit (or any of its assemblies) unless all
solid-state heat sinks are correctly installed.

8) Always connect a test instrument’s ground lead to the instrument chassis ground before connecting the positive lead;
always remove the instrument’s ground lead last.

CAUTION

First read the “Safety Precautions” section of this manual. If some unforeseen circumstance creates a conflict between the
servicing and safety precautions, always follow the safety precautions.

1-3 Copyright© 1995-2013 SAMSUNG. All rights reserved.


1. Precaution

1.3. Precautions for Electrostatically Sensitive Devices (ESDs)

Some semiconductor (“solid state”) devices are easily damaged by static electricity.
Such components are called Electrostatically Sensitive Devices (ESDs).
Examples include integrated circuits and some field-effect transistors.
The following techniques will reduce the occurrence of component damage caused by static electricity :

1) Immediately before handling any semiconductor components or assemblies, drain the electrostatic charge from your
body by touching a known earth ground. Alternatively, wear a discharging wrist-strap device. (Be sure to remove it
prior to applying power–this is an electric shock precaution.)

2) After removing an ESD-equipped assembly, place it on a conductive surface such as aluminum foil to prevent
accumulation of electrostatic charge.

3) Do not use freon-propelled chemicals. These can generate electrical charges that damage ESDs.

4) Use only a grounded-tip soldering iron when soldering or unsoldering ESDs.

5) Use only an anti-static solder removal device. Many solder removal devices are not rated as “anti-static” (these can
accumulate sufficient electrical charge to damage ESDs).

6) Do not remove a replacement ESD from its protective package until you are ready to install it.
Most replacement ESDs are packaged with leads that are electrically shorted together by conductive foam, aluminum
foil or other conductive materials.

7) Immediately before removing the protective material from the leads of a replacement ESD, touch the protective material
to the chassis or circuit assembly into which the device will be installed.

8) Minimize body motions when handling unpackaged replacement ESDs. Motions such as brushing clothes together, or
lifting a foot from a carpeted floor can generate enough static electricity to damage an ESD.

Copyright© 1995-2013 SAMSUNG. All rights reserved. 1-4


2. Product Specification

2. Product Specification

2.1. Product Feature

■ Power
• 2.0 ch : 120 W Total RMS / 1400 W PMPO ( Front : 60 W / ch)
• TI Amp

■ Special Functions in 2012


• Total Ripping : Record all tracks of DISC, the file is copied into USB device totally.
• Bluetooth
• iPod, galaxy
• DAB (only E460D) : DAB is a new form of radio that is broadcast digitally, Digital audio provides a superior of sound
compared to regular analogue broadcasting.

■ Connectivity
• USB Host
• Bluetooth
• Galaxy & iPod
• Portable Audio In (3.5 phi Stereo Jack)
• MIC Input (3.5 phi Stereo Jack)
• AUX
• HDMI (E430D / 460D)

■ Disc
• Type : 1 Tray
• Compatible
- E430 : MP3, CD / CD-R, RW, WMA
- E430D / 460D : DVD, DVD±R, DVD±RW, MP3, CD / CD-R, RW, WMA

2-1 Copyright© 1995-2013 SAMSUNG. All rights reserved.


2. Product Specification

2.2. Specifications

2.2.1. MX-E430 Specifications

■ Basic Specification
Weight 1.95 Kg

Dimensions 230 (W) X 120 (H) X 230 (D) mm


General Operating Temperature
+5 °C ~ +35 °C
Range

Operating Humidity Range 10 % to 75 %

Signal/Noise ratio 55 dB

FM Tuner Usable sensitivity 12 dB

Total harmonic distortion 0.2 %

CD : 12 cm (COMPACT Reading Speed : 4.8 ~ 5.6 m/sec.


Disc (1 Disc)
DISC) Maximum Play Time : 74 min.

Speaker output 60 W/CH (4 Ω) x 2

Frequency range 20 Hz ~ 20 KHz

Amplifier S/N Ratio 75 dB

Channel separation 65 dB

Input sensitivity (AUX) 800 mV

NOTE

• Samsung Electronics Co., Ltd reserves the right to change the specifications without notice.
• Weight and dimensions are approximate.
• Design and specifications are subject to change without prior notice.
• For the power supply and Power Consumption, refer to the label attached to the product.

Copyright© 1995-2013 SAMSUNG. All rights reserved. 2-2


2. Product Specification

2.2.2. MX-E430D Specifications

■ Basic Specification
Weight 1.95 Kg

Dimensions 230 (W) X 120 (H) X 230 (D) mm


General Operating Temperature
+5 °C ~ +35 °C
Range

Operating Humidity Range 10 % to 75 %

Signal/Noise ratio 55 dB

FM Tuner Usable sensitivity 12 dB

Total harmonic distortion 0.6 %

Reading Speed : 3.49 ~ 4.06 m/sec.


DVD (Digital Versatile Disc)
Approx. Play Time (Single Sided, Single Layer Disc) : 135 min.
Disc (1 Disc)
CD : 12 cm (COMPACT Reading Speed : 4.8 ~ 5.6 m/sec.
DISC) Maximum Play Time : 74 min.

Y : 1.0 Vp-p (75 Ω load)


Video
Component Video Pr : 0.70 Vp-p (75 Ω load)
Output
Pb : 0.70 Vp-p (75 Ω load)

Video/Audio HDMI 1080p, 1080i, 720p, 480p(576p)

Speaker output 60 W/CH (4 Ω/100 Hz)

Frequency range 20 Hz ~ 20 KHz

Amplifier S/N Ratio 75 dB

Channel separation 65 dB

Input sensitivity (AUX) 800 mV

NOTE

• Samsung Electronics Co., Ltd reserves the right to change the specifications without notice.
• Weight and dimensions are approximate.
• Design and specifications are subject to change without prior notice.
• For the power supply and Power Consumption, refer to the label attached to the product.

2-3 Copyright© 1995-2013 SAMSUNG. All rights reserved.


2. Product Specification

2.3. Specifications Analysis

Model Name MM-E430 MM-E430D MM-E460D MM-D430D

Photo

Speaker FR/FL : 60 W FR/FL : 60 W FR/FL : 60 W FR/FL : 120 W

Tuner O O O O

AUX O O O O

USB O O O O

MIC O O O O

Video X X O O

TOUCH KEY O O O O

IPOD X O O X

REMO POD O O O X

HDMI X X O O

GALAXY O O O X

BT O O O X

TIP

O : Feature Included
X : Not Included

Copyright© 1995-2013 SAMSUNG. All rights reserved. 2-4


2. Product Specification

2.4. Disc Types And Disc Format

2.4.1. Disc types that can be played

Disc Types & Recorded Disc


Max. Playing Time
Mark (Logo) Signals Size

Approx. 240 min.


(single-sided)
VIDEO 12 cm
Approx. 480 min.
DVD-VIDEO (double-sided)

AUDIO 12 cm 74 min.
AUDIO-CD
AUDIO
+ 12 cm -
VIDEO

2.4.2. Supported Audio Formats

Format Bit Rate Sampling Frequency

MP3 80 ~ 320 kbps


44.1 khz
WMA 56 ~ 128 kbps

AC3 128 ~ 384 kbps 44.1 khz / 48 khz

2-5 Copyright© 1995-2013 SAMSUNG. All rights reserved.


2. Product Specification

2.5. Accessories

2.5.1. Supplied Accessories

Accessories Item Item code Remark

Remote Control AH59-02427A

Batteries (AAA) 4301-000115

Video Cable AH39-40001V Local Samsung Dealer

FM Antenna AH42-00021A

AH68-02457B
User’s Manual
AH68-02457C

Copyright© 1995-2013 SAMSUNG. All rights reserved. 2-6


3. Disassembly and Reassembly

3. Disassembly and Reassembly

3.1. MAIN Disassembly and Reassembly


CAUTION

• Be careful to follow the disassembly sequence described in the manual. Otherwise, the product may be damaged.

• Be sure to carefully read and understand the safety instructions before performing any work as the IC chips on
the PCB are vulnerable to static electricity.

• In order to assemble reverse the order of disassembly.

Description Description Photo

1. Separate the door.

CAUTION

Be careful not to make any scratches as you remove them.

* S CRE W SIZE INFOR MATION

(M 1.7 X 4 B)
(Screw Type) (Screw Size) (Screw Color)
M : MACHINE M1.7 x L4 B : Blac k
T : TAP TYP E W : White
S : Silver

3-1 Copyright© 1995-2013 SAMSUNG. All rights reserved.


3. Disassembly and Reassembly

Description Description Photo

2. Unfasten 7 screws of the set.


: M 3 * 10 B

3. Separate the Top panel.

4. Unconnected the wire.

TOP a n d MAIN Co n n e c te r

Copyright© 1995-2013 SAMSUNG. All rights reserved. 3-2


3. Disassembly and Reassembly

Description Description Photo

5. Unfasten 6 screws.
:M3*8W

6. Detach two hooks at the same time.

3-3 Copyright© 1995-2013 SAMSUNG. All rights reserved.


3. Disassembly and Reassembly

Description Description Photo

7. Unfasten 12 screws.
:M3*8W

8. Unfasten 4 screws.
:M3*8W

Copyright© 1995-2013 SAMSUNG. All rights reserved. 3-4


3. Disassembly and Reassembly

Description Description Photo

9. Separate the shield, BT PCB and bottom part.

10. Unfasten 4 screws.


: M 3 * 10 B

11. Separate the deck and bottom part.

3-5 Copyright© 1995-2013 SAMSUNG. All rights reserved.


3. Disassembly and Reassembly

3.2. DECK Disassembly and Reassembly

Description Description Photo

1. Separate Tray - Disc from DECK.


OP
HOOK
EN/CLOS E

Copyright© 1995-2013 SAMSUNG. All rights reserved. 3-6


3. Disassembly and Reassembly

Description Description Photo

2. Lift up Holder-Cable, separate Traverse-DECK.

HOOK

3-7 Copyright© 1995-2013 SAMSUNG. All rights reserved.


3. Disassembly and Reassembly

Description Description Photo

Holde r-Ca ble

Holde r-Chuck Holde


Tra y-
r-Ca
disble
c

Copyright© 1995-2013 SAMSUNG. All rights reserved. 3-8


4. Troubleshooting

4. Troubleshooting

4.1. Checkpoints by Error Mode

Oscilloscope Setting Values Normal Voltage 24 MHz 32.768 KHz

Voltage/DIV 1 Vol/DIV 1 Vol/DIV 1 Vol/DIV

TIME/DIV 1 uS/DIV 10 ns/DIV 0.1 uS/DIV

4-1 Copyright© 1995-2013 SAMSUNG. All rights reserved.


4. Troubleshooting

4.1.1. No Power

No P owe r

Che ck MAIN P CB No Che ck MAIN P CB No


Che ck or re pla ce S MP S .
UIC1 UBD2 5.2V. P CN1 4, 5 # : 5.2V.

Ye s Ye s

Che ck MAIN P CB No Che ck MAIN P CB No


Che ck or re pla ce S MP S .
UIC1 1 # : 5V. P CN1 4, 5 # : 5.2V.

Ye s

Check VFD voltage No


in MAIN PCB PCN1 Che ck or re pla ce S MP S .
9~11 # (5v).

Ye s

(1)
Che ck re s e t circuit in No Che ck s igna l
MAIN PC B UIC3 pa rt ok? a nd s igna l pa tte rn.

* Re fe r to wa ve pa tte rn
Ye s ima ge of Fig. 4-1.

Che ck pa tte rn or re pla ce


MICOM IC.

Copyright© 1995-2013 SAMSUNG. All rights reserved. 4-2


W ER_TOUCHKEY

4-3
50V
470PF UR27RB751V-40TE-17

VFD_CLK
VFD_CE

VFD_DO
VPR2

POW ER_ON
REMO
10KOHM
UR30
UR29
UR28
UC14A

100
D
27KOHM UD100

100NF
NF
G
H3.3V_PW

UR57
UR57
UFET1
50V S

STK7002
220PF

UC14
1/10W 1/10W

1KOHM
1KOHM
1KOHM
4. Troubleshooting

18KOHM 10KOHM

100OHM
UC60

PCR0 1

100OHM
UR50
OPEN

IC 2
DGND
50V CER3 CER2
CECR1

H5.35V_PW

220PF

100
99
98
97
96
95
100 OHM 94
93
DBGP0 92
DBGP1 91
DBGP2 90
89
88
NC87
86
85
84
83
82
81
UC61
50V
220PF

PA2
PA1
PA0
PC0
PC1
PC2
PC3
PC4
PB0
PB1
PB2
PB3
PB4
PB5
PB6

VDD3
VSS3
R1 100OHM
UR53
8 7 1 8 80

DGND
UC62

PC5/DBGP 0
PC6/DBGP 1
PC7/DBGP 2
PA3/AN12 PB7 RESET_P
6 5 2 79 8 7
PA4/AN13 P36 IPOD_VD_SW
4 3 3 78 6

VPR1
5 UR15

1/16 W
PA5/AN14 P35/URX2
2 1 4 77 4 3 100OHM
P70/INT0/T0LCP/AN8 P34/UTX2

2.7KOH M
100OHM 5 76 2 1
UC4A T_RDS 1KOHM P71/INT1/T0HCP/AN9 P33/URX1
TXD 6 P72/INT2/T0IN/T0LCP P32/UTX1
75
UR2 7 P73/INT3/T0IN/T0HCP P31/PWM5
74
RST

DGND
RES
10NF 8 RES# P30/PWM4
73
UR44

2
1
9 XT1/AN10 P27/INT5/T1IN/T0LCP/T0HCP
72 KEY_SDA
UC4
10 XT2/AN11 P26/INT5/T1IN/T0LCP/T0HCP
71NC 100OHM

Q1
Q0

1
22PF 11 70

(1)
VSS1 P25/INT5/T1IN/T0LCP/T0HCP UR17
12 69NC

32.768 HZ
CF1 P24/INT5/T1IN/T0LCP/T0HCP/INT7/T0HCP1

X_TAL1

Q2
Q3
13 68NC

UIC3
CF2 P23/INT4/T1IN/T0LCP/T0HCP 100OHM
MGND1 14 67

3
4
VDD1 P22/INT4/T1IN/T0LCP/T0HCP T_SEN(T_CE)
15 66 8 7
UIC1

DGND
C2 P80/AN0 P21/INT4/T1IN/T0LCP/T0HCP T_SDIO

DGND
100NF 16 P81/AN1 P20/INT4/T1IN/T0LCP/T0HCP/INT6/T0LCP1
65 6 5 UR18 T_CLK
17 P82/AN2 P07/T7O
64 4 3

3
18 P83/AN3 P06/T6O
63NC 2 1

1MOHM
UR56
LC87F5WC8A
19 62

X_TAL2
P84/AN4 P05/CKO M_PWM_RST
20 61 100OHM

<Fig. 4-1>
100OHM P85/AN5 P04 NC (TO MPEG)

UR5
UIC1
22KOHM 21NC 60

UR588
UR55 UR5 P86/AN6 P03

10MHZ
150OHM
22 P87/AN7 P02
59
23

(1)
UR11 P10/SO0 P01
58NC
24 P11/SI0/SB0 P00
57 T_RST
KEY_SCL
25 P12/SCK0 VSS2
56
26 55 C30
P13/SO1 VDD2

* 5.2. MAIN P CB Top


POWER_TOUCHKEY

100OHM
27
NC P14/SI1/SB1 PWM0
54NC 100NF
PU_CHECK 28 53NC
NC P15/SCK1 PWM1 NC
29 P16/T1PWML SI2P3/SCK20
52
100NF 30 P17/T1PWMH/BUZ P CN1 SI2P2/SCK2
51NC
0.01OHM
UC5
DGND
(1)

PF5
PF6
PF7

PE0
PE1
PE2
PE3
PE4
PE5
PE6
PE7
VSS4
VDD4
PF0
PF1
PF2
PF3
PF4
SI2P1/SI2/SB2

UC601
SI2P0/SO2

10V UR7

UR61
UBD2 100KOHM

M5.35V_PW
10UF

DGND
31
32
33
34
35
36
37
38
39
40
41
45
46
47
48
49
50

NC

NC
NC
UR8
43NC

100OHM
100KOHM
42 100OHM
100NF
44 100OHM
DGND

UR9

DGND
NC(IPOD_RST)

100KOHM
5
4
2
3

UD2
UR14

1N4148WS
C34

1/16W
UR60

47KOHM
UR62
47KOHM

100OHM
TC O N 1

UR63
DGND

UC10
UD1
TIP02
TIP01

GCC02-0096

UR67
UR20
10KOHM
UR19

10KOHM
10KOHM
UR12 1N4148WS

10V

* 6.5. MAIN-4
10UF

Copyright© 1995-2013 SAMSUNG. All rights reserved.


10KOH
10KOH
4. Troubleshooting

4.1.2. No Output

No output

Che ck US B P CB No Che ck MAIN P CB No


P CN1 1~2# : +22V a nd Che ck or re pla ce S MP S .
H/P OUTP UT.
5~6# : -22V.

Ye s Ye s

Che ck the IC30 working.

Che ck MAIN P CB Che ck IC30 (TAS 5342A)


No
IC30 (TAS 5342A) input a nd s igna l input a nd
output s igna l. s igna l pa tte rn.

Ye s

Che ck MICOM IC No Check signal input and signal


(UIC1) a nd MIC1 MP EG pattern or replace SMPS.
(ES S) sig na l.

Ye s

Re pla ce UIC1 a nd MIC1.

Copyright© 1995-2013 SAMSUNG. All rights reserved. 4-4


4. Troubleshooting

4.2. Measures to be taken when the Protection Circuit operates

4.2.1. Operation of Power Block Protection Circuit

■ Cases of the SMPS Protection.


1) If there is over current at the AMP IC. (Speaker Wire Short)

2) If temperature of the AMP IC is over 150 ℃.

3) There is no power supply for amp.

■ Protection Circuit operates when power problem occurs in the SMPS.


Protection
Location Pin No. Remark
Open Short

CNM802 (P9) +5.4V (9#) X X

SMPS PCB CNM802 (P1~2) +PVDD (+22V) (1~2#) X O


X : No Concern
CNM802 (P5~6) -PVDD (about -22V) (5~6#) X O
O : Concern
CNM802 (P10) +5.4VS (10#) X O

CNM802 (P7) -5V (7#) X X

4-5 Copyright© 1995-2013 SAMSUNG. All rights reserved.


4. Troubleshooting

4.2.2. Check AMP in Power Protection

If you think, there are problems at the AMP Part, you can check the PCB without disassembling the set.

CAUTION

Do not connect the power cord during bellow check!

Measurement Resistance using Tester

R CH 2 kΩ

L CH 2 kΩ

If Measured Resistance is very different from above


numbers, There is a Problem.
→ AMP Part Problem

S ET 2CH S P EAKER OUT

RIGHT

GND

LEFT

Copyright© 1995-2013 SAMSUNG. All rights reserved. 4-6


4. Troubleshooting

4.3. MICOM, MPEG Initialization & Update

■ Micom Reset & MPEG Reset


• During “No Disc” Displayed, push the ‘STOP’ button 5 Second, After displayed ‘INITIALIZE’ set will power off
automatically.

■ Micom Update (Only for Flash Micom)


• Method 1) MAIN PCB CN1 for update JIG. To update MICOM, it need Computer, Rom Writer, USB Cables.
• Method 2) Insert USB Memory, and play. ‘Updating’ will be displayed. Set will be power off when finish.

■ Micom & MPEG Version Check


1) Power On.

2) CD open status.

3) Push the number NEXT for 5 seconds, check the MICOM version.

4) Push the number PREVIOUS for 5 seconds, check the MPEG version.

■ MPEG Update
1) Prepare Rom file at USB Memory.

2) Insert USB Memory, and play. “Update” will be displayed. Set will be power off → on

3) The disc is automatically ejected. (If you use USB memory, detach USB memory)

4-7 Copyright© 1995-2013 SAMSUNG. All rights reserved.


4. Troubleshooting

4.4. Buyer-Region Code Setting Method

4.4.1. The inserting method of Region Code after replacing the Main PBA

NOTE

• When replacing the Main PBA and System Micom should be inserted the region code.

• The set is not working properly if you don't insert the region code.

• The region code is inserted by the remote control.

1) Press “FUNCTION” button several times to change to AUX mode.

FUNCTION

SOUND DISC SKIP

EQ DVD

1 2 3
DISC MENU TITLE MENU

4 5 6
SYNC
<MM-E430> <MM-E430D>

2) MM-E430 : Push the “ENTER” button on remocon 10 Second.


MM-E430D : Push the “D” button on remocon 10 Second.
TUNING

TOOLS INFO

RETUR N EXIT

DISPLAY MO/ST TUNING


A B C D
CD REC TIMER TIMER S LEEP
SPEED ON/OFF CLOCK

<MM-E430> <MM-E430D>

Copyright© 1995-2013 SAMSUNG. All rights reserved. 4-8


4. Troubleshooting

3) When displayed “TEST–” , input 46 to set the buyer.

TES T − −
4) When displayed “− − −”, input the buyer code.
The buyer setting code can find in the table named “E430, 430D OPTION Table”.

−−−
5) It will show the buyer that you set up.
Then the buyer setting is succeed.

4-9 Copyright© 1995-2013 SAMSUNG. All rights reserved.


4. Troubleshooting

Table 4.1 MM-E430 Option Table

Region Code Buyer

00 Africa, Pakistan

01 BRAZIL

02 CANADA

03 China (semi_mic)

04 Europe

05 Indonesia, HONGKONG

06 JAPAN

07 KOR

08 Latin American

09 Mexico

0A Philippines

0B Russia (full_mic)

0C Russia (semi_mic)

0D South Africa

0E Taiwan

0F USA

10 Newzealand

11 England

12 Australia

13 Iran (HACO)

14 India

15 Israel

16 Middle Asia

17 Asia

18 Singapore

Copyright© 1995-2013 SAMSUNG. All rights reserved. 4-10


4. Troubleshooting

Table 4.2 MM-E430D Option Table

Region Code Buyer

1E Africa, Pakistan

1F BRAZIL

20 CANADA

21 China (semi_mic)

22 Europe

23 Indonesia, HONGKONG

24 JAPAN

25 KOR

26 Latin American

27 Mexico

28 Philippines

29 Russia (full_mic)

2A Russia (semi_mic)

2B South Africa

2C Taiwan

2D USA

2E Newzealand

2F England

30 Australia

31 Iran (HACO)

32 India

33 Israel

34 Middle Asia

35 Asia

36 Singapore

4-11 Copyright© 1995-2013 SAMSUNG. All rights reserved.


4. Troubleshooting

Table 4.3 MM-E460D Option Table

Region Code Buyer

3C Africa, Pakistan

3D BRAZIL

3E CANADA

3F China (semi_mic)

40 Europe

41 Indonesia, HONGKONG

42 JAPAN

43 KOR

44 Latin American

45 Mexico

46 Philippines

47 Russia (full_mic)

48 Russia (semi_mic)

49 South Africa

4A Taiwan

4B USA

4C Newzealand

4D England

4E Australia

4F Iran (HACO)

50 India

51 Israel

52 Middle Asia

53 Asia

54 Singapore

Copyright© 1995-2013 SAMSUNG. All rights reserved. 4-12


5. PCB Diagram

5. PCB Diagram

5.1. Wiring Diagram


R FC N 2 R FC N 1 U CN 1 JK C N
D E `W S M P B E Q `E D M P B E Q `E D D E `W S E H O E E H O E
N QE M P B E O `E D M P B E O `E D N QE V T C `D P O `E Q V T C `D P O `E Q
D E `M E P T M F E `O T M F E `O D E `M E P V T C `D P O `E N V T C `D P O `E N
M E `H O E T M F E `Q T M F E `Q M E `H O E E H O E E H O E
TX JO T X JO T X TX E H O E E H O E
G P D V T `O P V UTX P V UTX G P D V T `O N JD ! ` T JH N JD ! ` T JH
U S B D L `O E H O E E H O E U S B D L `O E H O E E H O E
U S B D L `Q E D M P B E `Q E D M P B E `Q U S B D L `Q N JD ` T F O T F N JD ` T F O T F
G P D V T `Q E D M P B E `O E D M P B E `O G P D V T `Q I Q `S I Q `S
C C I Q `M I Q `M
D D I Q `T F O T F I Q `T F O T F
E E G `I Q `N V U F G `I Q `N V U F
B B V T C 6 W `Q X V T C 6 W `Q X
F F V T C 6 W `Q X V T C 6 W `Q X
G G B , 6 W `Q X B , 6 W `Q X
S G 6 W `Q X S G 6 W `Q X
N W S FG N W S FG J A C K !P C B
H O E H O E
E W E `W S E W E `W S
H O E D EC K H O E SM PS
E W E ME P E W E ME P CN M 852 CN M 853
QV I SG QV I SG E H O E N 6 /4 6 W ` Q X
S G 6 W `Q X S G 6 W `Q X S FN P E H O E
W G E `D F W G E `E P
W G E `D ML W G E `D M L
W G E `E P W G E `D F
G CN 1 TCO N 1 PCN 1 N 2 3 W `Q X .W Q
N 6 /4 6 W ` Q X N 6 /4 6 W ` Q X E H O E , Q W E E , 3 6 W `Q X .W Q
E H O E E H O E S FN P , Q W E E , 3 6 W `Q X .W G E
JQ P E ` H B M B Y Z ` Q X S JQ P E ` H B M B Y Z ` Q X S W G E `D F N 6 /4 6 W ` Q X .W G E
JQ P E ` H B M B Y Z ` Q X S JQ P E ` H B M B Y Z ` Q X S W G E `D M L N 6 /4 6 W ` Q X , W GE
E H O E E H O E W G E `E P E H O E , W GE
E H O E E H O E N 2 3 W `Q X E H O E E H O E
S U B _2 E H O E E H O E , Q W E E , 3 6 W `Q X FD P S FN P
MFE 3 MFE 3 , Q W E E , 3 6 W `Q X
E H O E E H O E N 6 /4 6 W ` Q X
V T C ` JQ P E ` E Q V T C ` JQ P E ` E Q N 6 /4 6 W ` Q X
V T C ` JQ P E ` E N V T C ` JQ P E ` E N E H O E
E H O E E H O E E H O E
TO U CH CN 2 E H O E E H O E FD P
TE B JQ P E ` W JE F P JQ P E ` W JE F P FC N 1
TDM Q P X F S `U P V D I L F Z Q P X F S `U P V D I L F Z N 6 /4 6 W ` Q X
I 4 /4 W ` Q X L F Z `T D M L F Z `T D M E H O E
S FTFU S FTFU S FTFU W G E `E P
E H O E L F Z `T E B L F Z `T E B W G E `D M L
MFE D MFE 2 MFE 2 W G E `D F
MFE D 4 E H O E E H O E V FD .W Q
.W Q
M A IN .W G E
.W G E
CN 2 , W GE
TE B , W GE
TDM E H O E
I 4 /4 W ` Q X T O U C H K E Y !S U B _ 1 S FN P
S FTFU
E H O E
MFE D
MFE D 4

5-1 Copyright© 1995-2013 SAMSUNG. All rights reserved.


5. PCB Diagram

5.2. MAIN PCB Top

FAN E TC N 1 HDC N 1 TUCN 1

B TC N 1
R F IC 1

IC 3 0
MIC1

AIC 1

UIC 1 TC O N 1 (5)
MIC 2
(4)
RFCN1

IC 2

UCN1
(1) U IC 3
PCN1
RFCN2

(3)
(2)
TP 1

Copyright© 1995-2013 SAMSUNG. All rights reserved. 5-2


5. PCB Diagram

5.2.1. Pin Connection

1) RFCN1 3) PCN1 5) TCON1


Deck Control (Focus/Data) MAIN PCB All power control GALAXY/IPOD control

Pin No. Signal Pin No. Signal Pin No. Signal


1 CD_VR 1 DGND 1 M5.35V_PW
2 MPD 2 REMO 2 DGND
3 CD_LDO 3 VFD_CE 3 IPOD_GALAXY_PWR
4 LD_GND 4 VFD_CLK 4 IPOD_GALAXY_PWR
5 SW 5 VFD_DO 5 DGND
6 FOCUS_N 6 M12V_PW 6 DGND
7 TRACK_N 7 +PVDD+25V_PW 7 DGND
8 TRACK_P 8 +PVDD+25V_PW 8 LED2
9 FOCUS_P 9 M5.35V_PW 9 DGND
10 B 10 M5.35V_PW 10 USB_IPOD_DP
11 C 11 DGND 11 USB_IPOD_DM
12 D 12 DGND 12 DGND
13 A 13 ECO 13 DGND
14 E 14 IPOD_VIDEO
15 F 4) UCN1 15 POWER_TOUCHKEY
16 RF5V_PW MIC/Head_phone/USB control 16 KEY_SCL
17 MVREF Pin No. Signal 17 RESET
18 GND 1 DGND 18 KEY_SDA
19 DVD_VR 2 USB_CON_DP 19 LED1
20 GND 3 USB_CON_DM 20 DGND
21 DVDLDO 4 DGND
22 PUHRF 5 DGND
23 RF5V_PW 6 MIC _SIG
7 DGND
2) RFCN2 8 MIC_SENSE
Deck Control (SP/SL) 9 HP_R
Pin No. Signal 10 HP_L
1 LOADP_DC 11 HP_SENSE
2 LOADN_DC 12 F_HP_MUTE
3 SLED_N 13 USB5V_PW
4 SLED_P 14 USB5V_PW
5 INSW 15 A+5V_PW
6 OUTSW
7 DGND
8 DCLOAD_P
9 DCLOAD_N

5-3 Copyright© 1995-2013 SAMSUNG. All rights reserved.


5. PCB Diagram

5.2.2. Test Point Wave Form

TP1

Copyright© 1995-2013 SAMSUNG. All rights reserved. 5-4


5. PCB Diagram

5.3. MAIN PCB Bottom

5-5 Copyright© 1995-2013 SAMSUNG. All rights reserved.


5. PCB Diagram

5.4. FRONT PCB Top

FCN1

Copyright© 1995-2013 SAMSUNG. All rights reserved. 5-6


5. PCB Diagram

5.5. FRONT PCB Bottom

5-7 Copyright© 1995-2013 SAMSUNG. All rights reserved.


5. PCB Diagram

5.6. JACK PCB Top

JK C N

(1)

Copyright© 1995-2013 SAMSUNG. All rights reserved. 5-8


5. PCB Diagram

5.6.1. Pin Connection

1) JKCN
MIC/Head_phone/USB control

Pin No. Signal

1 DGND

2 USB_DP

3 USB_DN

4 DGND

5 DGND

6 MIC_SIG

7 DGND

8 MIC_SENSE

9 HP_R

10 HP_L

11 HP_SENSE

12 F_HP_MUTE

13 USB_5V

14 USB_5V

15 A5V

5-9 Copyright© 1995-2013 SAMSUNG. All rights reserved.


5. PCB Diagram

5.7. JACK PCB Bottom

Copyright© 1995-2013 SAMSUNG. All rights reserved. 5-10


5. PCB Diagram

5.8. TOUCH KEY PCB Top

TIC1

CN2

GC N1

CN1

(1) TO U C H C N2

5-11 Copyright© 1995-2013 SAMSUNG. All rights reserved.


5. PCB Diagram

5.8.1. Pin Connection

1) TOUCHCN2
Touch key control

Pin No. Signal

1 SDA

2 SCL

3 H3.3V_PW

4 RESET

5 DGND

6 LEDC

7 LEDC3

Copyright© 1995-2013 SAMSUNG. All rights reserved. 5-12


5. PCB Diagram

5.9. TOUCH KEY PCB Bottom

5-13 Copyright© 1995-2013 SAMSUNG. All rights reserved.


5. PCB Diagram

5.10. SMPS PCB Top

(2)

C N M8 5 3
C N M8 5 2

(1)

Copyright© 1995-2013 SAMSUNG. All rights reserved. 5-14


5. PCB Diagram

5.10.1. Pin Connection

1) CNM852
MAIN PCB All power control

Pin No. Signal


1 DGND
2 REMO
3 VFD_CE
4 VFD_CLK
5 VFD_DO
6 M12V_PW
7 +PVDD+25V_PW
8 +PVDD+25V_PW
9 M5.35V_PW
10 M5.35V_PW
11 DGND
12 DGND
13 ECO

2) CNM853
VFD/Remocon_eye control

Pin No. Signal


1 M5.35V_PW
2 DGND
3 VFD_DO
4 VFD_CLK
5 VFD_CE
6 -VP
7 -VP
8 -VFD
9 -VFD
10 +VFD
11 +VFD
12 DGND
13 REMO

5-15 Copyright© 1995-2013 SAMSUNG. All rights reserved.


5. PCB Diagram

5.11. SMPS PCB Bottom

IC A8 5 2

IC A8 5 3

IC M8 0 1 5

Copyright© 1995-2013 SAMSUNG. All rights reserved. 5-16


6. Schematic Diagram

6. Schematic Diagram

6.1. Overall Block Diagram

• The Micom IC is LC87F5WC8A, 100P, MPEG IC is ES8398ASCD, same with 2011 year (MM-D470D).

Mic om Tu n er Con trol


• The Micom IC controls the set.
Up d a te
DVD
DVD/CD
D/C D Tu n er Con trol • IR AMP ICs are IRS4301.
En g in e To uchKe y
LC 87F5W • Audio signal comes from CD DECK, Ipod, Galaxy, TUNER, AUX, MIC and so on, decoded and convert to analogue signal

0
S OLT Me cha

0
AM5766 P T 6315
Mo t o r Driv e 8K- EEPROM F ro nt Micom VF D Driver VFD by MPEG IC.
S a nyo
0
• The signal is sent to the Crystal amplification circuit through MPEG IC.
8K- EEPROM F ro n t E n d F ro nt This Crystal amplification circuit is Low Pass Filtered.
0 0

u Co m DVD Op tion
Sound will be hear by Connecting the Speaker system.
0 0
2M F las h CVBS (S c a rt)
Con trol
Vid eo Y Pb Pr
128M 4 - Da c Vid eo
DRAM E S S_P3C (839 8A HDMI C EC Option
0

0
S C D)MPEGC hip
USB POWER
S MPS
S WTICH U SB H OST
I- P OD
iP OD o ver us b
0 0

FL
DAB OP TION Con trol TAS5342A
FM
0 FR
0

F u n c tion Au d io
In p u t De c od er He a d ph on e
ADC DAC O P AMP
H/P
Mic AMP
TR

6-1 Copyright© 1995-2013 SAMSUNG. All rights reserved.


6. Schematic Diagram

6.2. MAIN-1

POWER
ON-BOARD FM(WW)
AUDIO E3.3V_PW
T_RDS
VIDEO

100OHM
TUR6

0OHM
TUR3
10KOHM

TUR7
SI4705-D60-GMR

40.2KOHM
20
19
18
17
16
IC13

6V
MM-DG36 TUNER ANT JACK

0 NF 116V
DGND
1

TUC8
TUR9
GPO3/DCLK
MGND1GPO1
NC

DFS
GPO2/INT-

110NF
MGND2
MGND3
18PF 50V
1
2
NC DOUT
15
14
1/16W
100O HM
TUR122
TUR1
10V
10UF
TUC2 1
HDMI ARC CIRCUIT
TUCN1 FMI LOUT TUNER_L
TUC16
3 13 TUC2 2
TUNER_R

18PF 50V

TUC17
RFGND ROUT
MGND1 4 12

270NH

TUC11
VT1
10V

TL1
LPI GND TUR1 3
5 11

10NF
100O HM 10UF

16V
/RST VDD

10UF 10V
DGND

TUC12
40.2KOHM

RCLK
SCLK
SDIO
/SEN
HDC4 HDR8 1/10W

VIO
1UF 47OHM 100NF 330O HM

LOPIVA16G05
E3.3V_PW HEAC+ HARC
DGND 1/16W HDC8 HDR6

6
7
8
9
10
TUR18
HDMI_HPD

100OHM 1/16W
DGND
32.768HZ HDC5

100OHM
1UF

2
4
6
8
TUX1

100OHM

HDR9
HDR14
100NF 10V

10UF 10V

HDR13

HDR10
1/16W
100OHM

1/16W
HDR13
TUC14
TUC13

100OHM
10UF 10V
1 4

1/16W
TUC20
1/16W
Q0 Q3

DGND

1
3
5
7
2 Q1 Q2 3

TUR17

HDR11
HDR12

10OHM
10OHM
22PF 50V

1/16W
1/16W
22PF 50V
DGND

C1
C29
T_SDIO MP1.35V_PW
T_CLK
T_SEN
T_RST

7
5
3
1
DGND

10KOHM
TUR16
8
6
4
2
VD3.3V_PW HDMI OUT 1
MGND4
MGND2

TS5A23159RSER
2
COMPOSITE AOZ8804DI 3
10

VR5OPEN HDD2 4
DVD VIDEO OPTION IPIC2
0OHM 10 1 5
COM1

OUT_LINES
1 9 TX2P IN_LINES
6
IPO D_VD_SW IN1 NC1 CVBS1 9 2
2 8 TX2N 8
OUT_LINES IN_LINES
IN_LINES
3 7
IPO D_VIDEO 3
NO1 V+
7 GND GND
GND NC2 7 4 8
VTP_PB 4 6 TX1P OUT_LINES IN_LINES
9
VC8 NO2 COM2 C46 6 5
100NF

TX1N
IN2

OUT_LINES IN_LINES
10
10V

10P F 50V VBD3

HDCN1
0.01OHM TP TP 11
5

UDAC AUX_L AUX_R 12


DGND
13
DGND
75OHM
VR3

VC7

14
VC9

VL3
150PF

150PF
1/10W

50V
50V

1.8UH IPOD _VD_SW HEAC+


AUR6R 15
DGND H 220O HM 16
IPOD VIDEO 1/10W
AUX2_R 17
VTP_Y AUR6L
AOZ8804DI 18
L COMP O VIDEO 220O HM 19
DGND VC5 AUX2_L 1/10W HDD1
10P F 50V VBD2

50V
0.01OHM AUR7L

AUC5L
10 1

AUR7R
MGND3
MGND1

AUC5R
47KOHM
YDAC 47KOHM TX0P
9
OUT_LINES IN_LINES
2

220PF

220PF
VT13
12

VT12
1/10W

1/10W
TX0N DGND

50V
OUT_LINES IN_LINES
IN_LINES

12
8 GND GND
3
75OHM

VC4

VC6
VR2

VL2 7 4
150PF

150PF
1/10W

50V

TXCP DGND
50V

OUT_LINES IN_LINES
1.8UH L R 6 5
TXCN OUT_LINES IN_LINES

HDMI_HPD

47KOHM
VJK1 DGND DGND

HDR3
VTP_CVBS
DGND VC2 DGND HDMICEC
10P F 50V VBD1 HDD3
COMP

0.01OHM D5V_PW H5.35V_PW


PR
PB

11
Y

VDAC CVBS1 6 OUT_LINES


OUT_LINES IN_LINES
5
9 OUT_LINES IN_LINES

HANTID1
7 4

15KOHM
7
75OHM

BAT54A

1OHM
VC1
VR1

VL1
150PF

VC3

1/10W
150PF
1/10W

GND

HDR5A
50V

GND
50V

8 3
1.8UH C 5

HDC2

10V
OUT_LINES IN_LINES

HDR4

4.7UF
10KOHM
3 11. AUX_R 9 2
9.AUX_L
IN_LINES HDIC1

HDR6A
10 OUT_LINES 1
1 DGND
12 7.CVBS 1 5
U 2
IN OUT

1.8KOHM
12. PB
AOZ8804DI

1.8KOHM
VTP_PR 10

HDR1
DGND GND

HDR2
VC11 0 Y 8 10. PR STK7002 3 EN ADJ
4
10P F 50V VBD4 RCLAMP0502B.TCT 8.Y HDQ1
0.01OHM 6
V VT8

HDC1
HDR5
4 DSCL DGND DGND AP7311-WG-7
COMPOSITE

4.7UF
10V
STK7002

S
CDAC
0 2 HDQ2

G
VC12
75OHM

VC10
VR4

VL4
150PF

150PF
1/10W

50V
50V

DSDA

1.3KOHM
1.8UH

D
RCLAMP0502B.TCT
DGND

S
VD3.3V_PW

G
AUXCN1

10UF 10V
DGND VT9

HDC11
DGND DGND
4
2
3
1
DGND

DGND

Copyright© 1995-2013 SAMSUNG. All rights reserved. 6-2


6-3
POWER
6.3. MAIN-2
6. Schematic Diagram

TPBT2
TPBT5
TPBT4

TPBT1
TPBT3

BT5V
UART_TX
UART_RX
BT_GND
BT_RST
SPINDLE

SLEGN
FOC US

TRACK
MGND2
470NF

MGND1
10V C31

RAS2_P
S_P_OPTION
MA0
MA1
MA2
MA3
MA9
MA8

OTP
C67

RAS1_P

BTCN1
MA10
MA11
DGND

USB_DP

MA7
MA6
MA5
MA4

OPOUT
10UF

USB_DM

1
2
3
4
5
6
10NF C69
C71 10V
2.2KOHM
50V

DGND
50V

R105
R103
R57
R56
DGND
10PF 50V 100PF C37

RF3.3V_PW
BTR3 10NF 50V C80
1/16W 10NF
BTC1 4.7KOHM
50V C81 100NF

R112
R108
10PF

R60
BTR4 10V

MA12
1/16W

TP
VREG
1KOHM
1KOHM
BTC2 4.7KOHM

C
B

D
A

1.2KOHM
1.2KOHM
MIN
PUHRF

MVREF

DGND
BTR5

VD3.3V_PW
VD3.3V_PW

33OHM
33OHM
10V

100OHM
10UF

MPD

0.25O HM

BTBD3

DGND
BTC3

R97
4.7KOHM
10V

VD3.3V_PW

0.25O HM
100NF

BTBD2
10V 10UF
C61
C62

RAS0_P(PLL2)
CAS_P(PLL3)
BTC4

DWE_P(PLL1)
PLL0
33OHM
100NF 10V

BTBD4
0.25O HM
DGND
100N

RMA12_O PEN
10V
10V

C79
C77
C76
C72
DGND7.5KOHM
R137
C68
C64
C65
C43

100N
100NF

10V 100NF
50V

F
100NFF 10V

100NF
10V

10V
10V
10V
10V
50V 680P F
C82

C74

10V
C84

100NF
100NF
100NF
100NF
100NF
100NF

BT_RST
UART_TX
UART_R X
216
215
214
213
212
211
210
209
208
207
206
205
204
203
202
201
200
199
198
197
196
195
194
193
192
191
190
189
188
187
186
185
184
183
182
181
180
179
178
177
176
175
174
173
172
171
170
169
168
167
166
165
164
163

C83
RF3.3V_PW

0.01OH M
10V 10UF

BTBD1
1/16W
33OHM
H
G
F
E
D
C
B
A
DGND

VSS
VDD
VDD
VDD
VSS
TRO
SLO
FOO
DMO
SLV
MIN
VGA
VPA

VS33
VD33
VD33
DVCC
REFD
CDPD
DRFP
DRFN

10V C85 100NF

AVS33
AVD33
470KOHM

DCS1_B
DMA[0]
DMA[1]
DMA[2]
DMA[3]
DMA[9]
DMA[8]
MDA[7]
DMA[6]
SYSCLK
DMA[5]
DMA[4]
USB_DP
USB_DM

DRAS1_B
DRAS2_B
DMA[10]
DMA[11]

RF5V_PW
USB_AGND
USB_VCCA
USB_RREF
USB_VDDA
1 1 2 DSC0_B SPNP
162 R114 MVREF
CSO_P

VREG_FORCE
2 3 4 161 R115

R23
RAS0_P(PLL2) DRAS0_B SPNN 10KOHM MOCTL
3 5 6 DCAS_B AGC1
160 C86
CAS_P(PLL3)
4 7 8 DWE_B AGC2
159 50V
DWE_P(PLL1) 100PF
DGND

5 158 C87
VSS DVDPD 100PF MPD
33OHM R117 50V 6 157
DSCK 10V DSCK VBO MVREF
10PF C88 7 156 10PF
R118 VDD CDLD CDLD
50V 10V
100NF8 155 50V
DQM C102 DQM DVDLD DVDLD
100NF
1/16W C89 9 154 10KOHM
22NF R116 C90
33OHM VD33 REX MIN
33OHM 10 VS33 PI
153 50V C92
DB7
1 2 11 DB[7] V165O
152 DA
DB6
3 4R26 12 DB[6] FE
151
5 6 13 DB[5] TE
150
DB5
7 81/16W 14 DB[4] MB
149 50V
4.7NF 1NF C98
DB4
33OHM 15 VSS DB
148 10V
50V C99
1 2 16 147 100NF C101
DB3 DB[3] MP
3 4R29 17 146 10V C94
DB2 DB[2] VGB
5 6 18 145 100NF C103 C97
DB1 DB[1] VPB 100NF 10V
7 81/16W
10V 19 DB[0] OPEN/VOBS
144 100OHM R119
DB0 OPEN 1UF
R30 20 VDD OPENSW
143 100OHM R120
INSW
33OHM1 2 100NF C91 21 DB[8] CLOSE/VOBS1
142 100OHM R121
DB8 CLOSE
3 4 22 DB[9] CLOSESW
141 100OHM R122
DB9 OUTSW
5 6 23 140 100OHM R123
DGND

DB10 DB[10] AMPSTBY DRV


7 24 DB[11] SR[32]
139 1/16W
DB11
8 10V C93
25 138 33OHM BTR1
100NF VD33 SOUT UART_TX
C107

1/16W 26 137 BTR2


VS33 SIN UART_RX
100NF

1 233OHM 27 DB[12] VS33


136
DB12 R43
C108

3 4 28 135 33OHM
VD3.3V_PW

DB[13] VD33
100N

DB13 1/16W
5 6 29 DB[14] VDD
134
DB14
7 8 30 133100OHM R135 0.01OHM
MIC1

DB15 DB[15] HDMI_CEC DVD_CD 10UFC105


MP1.35V_PW

10V
100NFF 10V

31 VSS VSS
132 10V
DGND
1/16W 32 131 100NF
100NF AUX[7] HDMI_PGND2 50V
10V 33 130 C106
10KOHM 2.7KOHM RL2 AUX[6] HDMI_PVCC2 0.01OHM
RPD1 C36 34 129 10UFC109
VDD HDMI_AGND 10V BD9
35 128 100NF
ES8398ASCD

AUX[5] HDMI_TX2+ TX2P 10V


36 127

DGND
RXD 100NF AUX[4] HDMI_TX2- TX2N C33
M_PWM_RST 10V 37 AUX[3] HDMI_AVCC
126 BD10
2.7KOHM C119 38 125
VD33 HDMI_TX1+ TX1P
DGND 39 124
D15 VS33 HDMI_TX1- TX1N 100NF
40 123 C112 10V
RESET_P RESET_B HDMI_AGND
1KOHM R138 41 AUX[2] HDMI_TX0+
122 10UF
TX0P 0.01OHM
I2C_SCL R140 33OHM 42 AUX[1] HDMI_TX0-
121 10V

VD3.3V_PW
TX0N
I2C_DAT R141 33OHM 43 AUX[0] HDMI_AVCC
120 C113
R96 4.7KOHM 44 119
SPI_CS2 HDMI_TXC+ TXCP
45 118 470OHM BD11
SPI_CS3 HDMI_TXC- TXCN
R143 150OHM 46 117
SPI_CLK SPI_CLK HDMI_AGND R109
47 VSS EXT_SWING
116 R144
R145 33OHM 48 115 0.01OHM
SPI_DI 100NF SPI_DI HDMI_PVCC1 0OHM
R67 33OHM 49 114 C114 10V
SPI_DO 10V SPI_DO HDMI_PGND1
50 VDD HDMI_OTP_VPP
113 10UFC115 100NF
2.2KOHM 51 112 BD12
10V
VD3.3V_PW

BT_RST BTC5 SPDIF_OUT VSS_DFG_PLL


MPPU1 52 111
SPDIF_IN VDD_DFG_PLL
53 VS33PLL VD33
110 68OHM
54 VD33PLL VS33
109 R152
C122

DGND
C117 10V
10UF 100NF 10V
VS33
OP[5]
OP[6]
OP[7]
VDD
VSS
MCLK
VS33
VD33
PAD_REF
PAD_COMP
PAD_RSET
UDAC
VDAC
VD33VDAC
VS33VDAC
YDAC
CDAC
VD33
DAC_O1L
DAC_O2L
DAC_O2R
VD33ADAC
VS33ADAC
DAC_O3L
DAC_O3R
DAC_O1R
LINE_OL
LINE_OR
VS33AADC
MIC_R
MIC_L
VDDAADC
LINE_IN_R3
LINE_IN_L3
LINE_IN_R2
LINE_IN_L2
LINE_IN_R1
LINE_IN_L1
VD33AADC
VSS
VID_XO
VID_XI
VDD
HDMI_HPD
HDMI_HEAC
HDMI_DSDA
HDMI_DSCL

OP[0]
OP[1]
OP[2]
OP[3]
OP[4]
VD33

R155
33OHM
100NF C116
10V 100NF 10V
C7 10UF 10V
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
86
87
88
89
90
91
93
94
95

85
100
101
102
103
104
105
106
107
108

R187
R186

4.7KOHM R150
DGND

R151 C118
R153
4.7KOHM
DGND
R154 120OHM 10OHM
10OHM
96 R169
97 R168
98 R167
99 R166

4.7KOHM

MP1.35V_PW

R163
VD3.3V_PW

BD13

10KOHM
C124
92 4.7KOHMC125

PWR2
PWR1

C123
10V
10V

DGND

0.01OHM

VD3.3V_PW
DGND

4.7KOHM
4.7KOHM
4.7KOHM
4.7KOHM

RSTB1 4.7KOHM
10UF10UF

100NF 10V
UNDEFINED
DGND
MP1.35V_PW

CB2012UA300T

RTXD1 4.7KOHM
100OHM
100OHM

VDAC
10V

YDAC

SPI_CS
UDAC
CDAC

VD3.3V_PW

SPI_CS3

1/16W
C129
C128

C39
C38
R159

2.7KOHM
TP_MCLK
10V

10V
HARC

R165
DSCL

C17

RL1
DSDA

TP C134
C137
C139

10V

100KOHM
33OHM

10V

R164
10UF
10UF
10UF
10UF

10V

10V
HDMI_HPD

100NF

100NF
10V
100NF
100NF
OPLCH
OPRCH
C42
C41

X3

STB

TXD
ACK
390OHM
27MHZ

M_WP
50V
50V

27P F
27P F

VD3.3V_PW
MIC_SIG
AK27012013

AUX2_L

100NF
AUX2_R

IPOD_CP_RST
TUNER_L
TUNER_R

10V
C910V 100NF
C51 10UF DGND
C126 10V C18 C136
DGND

C45 DGND
MP1.35V_PW

100NF
DGND

100NF 10V
DGND

100NF 10V
DGND
VD3.3V_PW
BD15
1/10W
0OHM

10V
1/16W
BD14

R139
22O HM
0.01OHM

MP1.35V_PW

C135
DGND

220UF
16V
VD3.3V_PW

Copyright© 1995-2013 SAMSUNG. All rights reserved.


6. Schematic Diagram

6.4. MAIN-3

POWER
C11 10UF
VD3.3V_PW SDRAM
10V

0.25OHM

0.25OHM
MFL6

MFL7
K4S281632F-TC60
MIC2
10V
C12 100NF 1 VDD VSS
54
DB0
2 DQ0 DQ1 5
53 DB15 PLL2 PLL1 PLL0 MULTI FRE Q
C13 100NF 10V 3 VDDQ VSSQ
VSSQ
52
4 51 0 0 0 BYPASS N/A
DB1 DQ1 DQ1 4 100NF DB14
DB2
5 DQ2 DQ1 3
50 10V DB13
6 VSSQ
VSSQ VDDQ
49 C22 0 0 1 4.5 121.5
7 48
SPI FL ASH VD3.3V_PW DB3
DB4
C14 100NF 10V
8
9
DQ3
DQ4
VDDQ
DQ1 2
DQ1 1
VSSQ
VSSQ
47
46
DB12
DB11 0 1 1 4.75 128.25
1 0 0 5.0
& DB5
DB6
10
11
DQ5
DQ6
DQ1 0
DQ9
45
44
100NF
10V
DB10
DB9
135

12 43 C21 1 0 1 5.75 155.25


EEPROM

BAT54C
VSSQ
VSSQ VDDQ
DB7
13 DQ7 DQ8
42 DB8 1 1 0 162

D17
14 41

30
C15 100NF 10V 6.0
VDD VSS
DQM
15 LDQM NC
40
GND 2.2KO HM DWE_P(PLL1)
16 /WE UDQM
39 DQM 1 1 1 5.5 148.5
1/10W
CAS_P(PLL3)
17 /CAS CLK
38 DSCK
RR01 18 37 R9 4.7KOHM
RAS0_P(PLL2) /RAS CKE
IC7 CSO_P
19 /CS NC
36 MA12
C138 100NF 20 35 PLL3
SPI_CS 1 8 RAS1_P A13 A11 MA11 CLK SOURCE
/CS 10V 21 34
2 VCC
7 RAS2_P A12 A9 MA9 0 CRYSTAL OSC
SPI_DI
3
DO(IO1 )
/HOLD(IO3)
6 MA10
22 A10/AP A8
33 MA8
4
/WP(IO2 )
CLK
5 SPI_CLK
MA0
23 A0 A7
32 MA7
GND SPI_DO 24 31 DCLK INPUT
DI(IO0)
MA1 A1 A6 MA6 1
MA2
25 A2 A5
30 MA5
W25Q16B VSSIG 26 29
DGND MA3 A3 A4 MA4
C16 100NF 10V 27 VDD VSS
28
OTP

0
NORMAL MODE
DGND DGND
DGND DGND
DGND
DGND DGND TEST MODE
DGND 1
VD3.3V_PW
VD3.3V_PW
S_P S_P_OPTION
820OHM
R32 0 NORMAL MODE
MRUP1

RR50
2.2KOHM

2.2KOHM

ER1
R84

R70
1.5KOHM

R64

R69
IC8 1 TEST MODE

4.7KOHM

4.7KOHM

4.7KOHM

4.7KOHM
1 NC VCC
8
2 NC /WC
7 M_WP
3 E2 SCL
6 I2C_S CL
4 VSS SDA
5 I2C_DAT
PLL0
S-24CS08AFJ -TB-1G E DWE_P(PLL1)
RAS0_P(PLL2)
CAS_P(PLL3)
DGND OTP
S_P_OPTION

R258
R74
4.7KOHM

4.7KOHM
15PF

15PF

15PF

15PF
50V

50V

50V

50V
RC48

EC12
R51

R71
DGND

BACKEND J IG CON NECTORSPI_CLK


VD3.3V_PW
SPI_CS SPI_DI SPI_DO
SPI_CSA

SPI_CLKA
SPI_DIA
SPI_DOA

SPI_CS3
SPI_CLK
SPI_DI
VD3.3V_PWA

SPI_DO R197

10KOHM

VD3.3V_PW

Copyright© 1995-2013 SAMSUNG. All rights reserved. 6-4


6. Schematic Diagram

6.5. MAIN-4

POWER
MM-E430D MICOM PART FANET_TX
FANET_RX FANETCN1
1

GCC02-0096
3
2
H3.3V_PW
CECR1 4
5
OPEN
M5.35V_PW

UR27RB751V-40TE-17
H5.35V_PW
MICOM UPDATE JIG

UD100

T_SEN(T_CE)

M_PWM_RST
IPOD_VD_SW
NEAR TO HDMI JACK

(TO MPEG)
CN1

KEY_SDA

T_SDIO
RESET_P

T_RST
10KOHM

T_CLK
52045-0610

CER2
1

27KOHM

1/10W
2
3 DGND

G
1
3
4
5 HDMICEC

S
D
RST
6
UFET1

18KOHM

CER3
STK7002

1/10W

3 100OHM
2
4
6
8

5 UR18
47KOHM

100OHM
UR53

5 UR15
UR36

C30
100NF
DGND

7
3
1
100OHM
7

UR17

100OHM
UR44
1
3
5
7

DGND

100OHM
8
6
4
2

NC
8
6
4
2
DGND

68NC

63NC

54NC
53NC
51NC
58NC
71NC
69NC

NC
TP58A

80
79
78
77
76
75
74
73
72
70

67
66
65
64
62
61
60
59
57
56
55

52
M5.35V_PW
TP58

PWM0
PWM1
VDD2
P31/PWM5
P30/PWM4

VSS2
P05/CKO
P04
P03
P02
P01
P00
PB7
P36

P32/UTX1

P07/T7O
P06/T6O

SI2P2/SCK2
P35/URX2

P33/URX1

SI2P3/SCK20
P34/UTX2

P27/INT5/T1IN/T0LCP/T0HCP
P26/INT5/T1IN/T0LCP/T0HCP
P25/INT5/T1IN/T0LCP/T0HCP

P23/INT4/T1IN/T0LCP/T0HCP
P22/INT4/T1IN/T0LCP/T0HCP
P21/INT4/T1IN/T0LCP/T0HCP
TP57A

P24/INT5/T1IN/T0LCP/T0HCP/INT7/T0HCP1

P20/INT4/T1IN/T0LCP/T0HCP/INT6/T0LCP1
TIP01
2.2KOHM
2.2KOHM

TP57 UR28 1KOHM 81 50 10KOHM


2.2KOHM

PB6
(FROM MP EG) STB SI2P1/SI2/SB2
100NF

(TO MP EG) ACK UR29 1KOHM 82 PB5 SI2P0/SO2 49


C130

(TO MP EG) UR30 1KOHM 83 PB4 PF7 48 10KOHM


IC2 RXD TIP02
84 PB3 PF6 47 UR1 4
UR38

USB_SEL

UC14A
R10

R11

S-24CS08AFJ-TB-1GE 85 PB2
46 47KOHM

470PF
PF5

1 8 DGND 86 45

50V
PB1 PF4
NC VCC 33OHM TI_SD
2 7 R12 NC87
PB0 PF3
44 100OHM UR1 2 1N4148WS
43NC UD1
NC /WC
3 E2 SCL
6 UR54 33OHM UC14 88 VSS3 PF2
UR6 0
TI_RST
4 VSS SDA
5 UR41 89 VDD3 PF1
42 100OHM LED2
100NF DBGP2 90
PC7/DBGP2 PF0
41
33OHM LED1
DBGP1 91 40 100NF C34
PC6/DBGP1 VDD4
DGND
DBGP0 92
PC5/DBGP0
UIC1
VSS4
39
TP59 TP60 TP61 TP61A HDMI_HPD
UR57 93 PC4 PE7
38
NC(IPOD_RST)
DGND 100OH M 94
100OHM PC3 PE6
37 USB_EN
TP59A TP60A NC
M5.35V_PW 95 PC2 PE5
36 DGND
NC USB_FAULT
96 PC1
LC87F 5WC8A
PE4
35
10KOHM 97 PC0 PE3 NC
34
PCR01
98 PA0 PE2
33 UR6
UR622

P73/INT3/T0IN/T0HCP
P71/INT1/T0HCP/AN9
P72/INT2/T0IN/T0LCP
POWER_M

P70/INT0/T0LCP/AN8
VPR2 99 32 100OHM MIC_SENSE

P17/T1PWMH/BUZ
PA1 PE1
HP_SENSE 100OHM 100 31

P16/T1PWML
PA2 PE0

P11/SI0/SB0

P14/SI1/SB1
100OHM MAIN_MUTE

PA3/AN12
PA4/AN13
PA5/AN14

P12/SCK0

P15/SCK1
XT1/AN10
XT2/AN11

P10/SO0

P13/SO1
P80/AN0
P81/AN1
P82/AN2
P83/AN3
P84/AN4
P85/AN5
P86/AN6
P87/AN7
HPSR01

VDD1
RES#

VSS1
8

CF1
CF2

47KOHM
21NC

UC10
UR63
1/16W

10UF
10V
1
2
3
4
5
6
7
8
9

NC
10
11
12
13
14
15
16
17
18
19
20
22
23
24
25
26
27
28
29
30
NC
DGND
1N4148WS
5VA UR61 UD2

7
5
3
1
ECO

100OHM

100OHM
5V M5.35V_PW

UR5
100OHM

100NF
C2
R1
OUTS W
KEYR1 M5.35V_PW
INSW
TCON1

8
6
4
2
10KOHM 0.01O HM UR50
KEYBD2 USB5V_PW REMO UR19
G5V G5VA GCONA
1 100OHM
100OH M 10KOHM

1KOHM
M5.35V_PW

UR2
GCON
2 POWER_ON
KEYC10

DGND DGND
3 10KOHM
10UF
10V

IPOD_G ALAXY_PWR VFD_CE RES UR20


4 VFD_CLK UR58
IPOD_G ALAXY_PWR 5 1/16W 100OHM
DGND VFD_DO 2.7KOHM

100KOHM
6

100KOHM

100KOHM
UR7
DGND

UR9
UC601
100NF
7

UR8
DGND VPR1 UR67
8
UC61

10KOHM
UC60
220PF

220PF

220PF

LED2
UC62

LED2
9
50V

50V

50V

DGND
USB_IPO D_DP 10
IPO D_CO N_DP X_TAL1 TP1
USB_IPO D_DM
11 32.768HZ
12 IPOD_CO N_DM
DGND 1 Q0 Q3 4
13 DGND
RST

DGND 100OHM
TXD

14
T_RDS

IPOD_VIDEO
POWER_TOUCHKEY
15
KEYR3 IPO D_VIDEO
POWER_TOUCHKEY 2 Q1 Q2 3 TP1
16 KEYR4 DGND
KEY_SCL KEY_SCL
RESET
17 100OHM
18 UR5 6
KEY_SDA KEY_SDA

150OHM
22PF

19 KEYR6 M5.35V_PW

KEY_SCL

PU_CHECK
UC4

POWER_TOUCHKEY
LED1 LED1 1MOHM

UR55
DGND
20
100OHM
X_TAL2

0.01OHM
UC4A

10NF

UBD2
DGND 10MHZ
SDA
SCLA GTP 1 LED POWER IM IP IPA
SCL
POWERA IV IVA IMA
GTP 1A LEDA DGND DGND
SDAA GTP 2
GTP 2A

UC5
MGND1

10UF
10V
22KOHM

UR11

UIC3 DGND
1 IN
GND
OUT
3
UC7

GND
UC8
UC6

100NF

1UF

KIA7042AF-RTF
UC9
100NF
2.2UF

DGND

6-5 Copyright© 1995-2013 SAMSUNG. All rights reserved.


6. Schematic Diagram

6.5.1. Test Point Wave Form

TP1

Copyright© 1995-2013 SAMSUNG. All rights reserved. 6-6


6. Schematic Diagram

6.6. MAIN-5

POWER

MOTOR DRIVER RFR5


DRV

3.3KOHM
1KOHM

22KOHM
RFR6

RFR9
M5V_PW RFR7
RFIC1 DA
RF5V_PW NEAR TO 23PIN CO NNECTOR

100NF
33OHM

RFC3
RFR 1 22KOHM 1 28 RFR10

10V
FOC US VINFC MUTE
OPOUT
L33 2 27

1MOHM
RFR 2 6.8KOHM DGND

MGND1
SLEGN TRB_1 BIAS RFR8 1KOHM

27KOHM
3 26

RFR12
FOCUS_NA
FOCUS_PA

TRACK_NA
FOCUS_N
TRACK_PA
TRACK_N
REGO2 VINTK TRACK

FOCUS_P

16V
TRACK_P
DVDLDOA
0.01OH M
0.01OHM RFR 3

RFR13
10KOHM 4 25
PUHRFA

RFC17
DVDLDO

DVDVRA
39KOHM

DVDVR
PUHRF VINSL+ TRB_2
M5V_PW 5 24
RF5VA

RFC16
CLOS E

10NF
RFR15

50V
RF5V

REGO1 OPOUT 1KOHM

470UF
RF5VB OPEN 6 23 RFR14
RFR4 FWD VINLD SPINDLE
RF5VBB
MD1
10KOHM 7 REV GND
22 RFR11

RFR16
8 21 10KOHM 1.2KOHM
1.2KOHM
RFCN1 Vcc1 VCTL

3.3KOHM
9 VOTR- OPIN
20
50V MD2

RFC2
DGND

330UF
RFR17

RFC1
10 MGND2 19

16V

100NF
100PF VOTR+ Vcc2 2.2OHM

10V
23 EMC2 11 18

MVREFA
SLED_N VOSL+ VOLD- LOADN_DCMON

MVREF
22 PUHRF SLED_P
12 VOSL- VOLD+
17 2.2OHM LOADP_DCMOP
10022HS-23C02

21 50V 13 16
100PF DVDLDO FOCUS _N VOFC- VOTK- RFR18 TRACK_N
20 EMC1 FOCUS _P
14 VOFC+ VOTK+
15 TRACK_P
19 DVDVR DGND
18 100NF AM5766
17 DGND
10V MVREF PARTTERN AT LEAST 0.4MM
16 RFC 18 PARTTERN AT LEAST 0.4MM
DGND
15 F
14 E
13 A
12 D
11 C
10 B
9 FOC US_P
8 TRACK_P
7 TRACK_N

BA DA EA
6 FOC US_N
DVDVR RF3.3V_PW

CA AA FA
5 SW (CD/DVD)
4

22OHM

10KOHM
3

RFR46
CDLDO
2

RFR48
MPD
1

CDVR
CDVRA CDVR
50V
100PF MPDA RFR47
50V EMC3 CDLDOA RFQ5
C
B
100PF DVD_CD
50V EMC4 TP1A SRC1203S E
1KOHM
EMC5 SWA B C D
DA E F
RF5V_PW

22OHM
SW

100PF
TP1

RFR42

10KOHM
LOADNA SLEDPA
CD_VR

LAYOUT 10MM DISTANCE DGND


MPD
LOADN
SLEDN

DECK DEBUG ONLY

RFR44
LOADP

LOADPA SLEDNA
SLEDP

C
RFR43
RFQ 3 B
SW (CD/DVD)
SRC12003S
SRC12 3S E
OPENACLOS EA 1KOHM
CLOSE
OPEN

RFCN2
OUTSW
INSW

RFR45
1 RFQ4
C
B
2 LOADP_DCMOP DGND
10022HS-09C

LOADN_DCMON IN OUT SRC1203S E


3 1KOHM
4 SLED_N
5 SLED_P
6 INSW
7 OUTSW DGND
8 VD3.3V_PW
18KOHM

18KOHM

DCLOAD_P
RFC20
RFC19
RFR49

9
RFR50
100NF

100NF
1/16W

1/16W

DCLOAD_N
10V

10V

L12
TP100
TP101

0.01OHM
0.01OH M

DGND RF5V_PW
NEED A PART GRADE CHANGE
DGND
100NF TP
10V MOCTL_P
RFC1 4

4.7KOHM
PU_CHECK

RFR32
TP RFIC2
10KOHM
RFR19

10KOHM

CDLD

RFR25

1KOHM
4.7OHM

RFC13
10V
10UF
RFR21

1 8
4.7OHM
10V

RFC5
10UF

RFR26

100KOHM
OUT1
2 VCC
7 RFR37 RFR39

RFR31
IN1- MOCTL
OUT2
3 IN1+ 6 LOADP_DCMOP
IN2-
RFR 20 0OHM 100KOHM 4 GND 5
IN2+ 10KOHM
E
2SA1979S-Y B CDLD

2.2KOHM
RFQ 1 C
SN358

1MOHM
220OHM RFR27 RFR28

RFR35
RFR 24

RFR35
RFC6

RFR34
RFC7

2SA1979S-Y
1NF
50V

1NF
50V

CB2012UA300T B DVDLD
RFQ 2 C
0.01OH M 220OHM 100KOHM RFR40 RFR41
CDLDO LOADN_DCMON
RFC11

RFC12
1NF
50V

1NF
50V

100KOHM
RFR29 680OHM 10KOHM
RFC4

RFBD1

RFR30
DGND CB2012UA300T

22KOHM
10NF
50V

18KOHM

3.3KOHM
RFBD2

RFC15

RFR38
RFR36
RFR33

100NF
10V
DVDLDO
RFC10

DGND
UNDEFINED
50V
10NF

0.01OHM
0.01OH M

DGND DGND
USE 100K 1% ONLY
DGND (2007-000060)
DGND
47KOHM
47KOHM

RFC9
RFC8

100NF
RFD1
1N4148WS

RFD2

10V

RFR23
100NF

75
RFR22

1N4148WS
75
10V

DGND
DGND

DGND

6-7 Copyright© 1995-2013 SAMSUNG. All rights reserved.


6. Schematic Diagram

6.7. MAIN-6

POWER
MM_E430D POWER
M5V_PW
H5.35V_PW H3.3V_PW

AO3415AS
VD3.3V_PW RF3.3V_PW
VD3.3V_PW VD3.3V_PW 1N4148WS

MPQ1
M5.35V_PW LD1117A G-3.3V-A
BD7 HDD4 HDD5 HDD6
HDD6
IC18
3 VIN VOUT
VOUT
2 1N4148WS 1N4148W S

D
100NF S
MPC16
MPR1
100KOHM

MPC1
ADJ 0.01OHM

1/16W

MPR5
G
25V
1UF

1OHM

C40

C95

C44

C47
470OHM

39KOHM
1/10W
10UF
100NF

R19C
470OHM
MR701/10W

C33A

C35A

C50
1/10W
MR63
1OHM
1

C96
MR71
0V
0 UF 110V
10KOHM
MPR2

MPC2

10UF
10UF
1/16W

10UF

100NF

10UF
MPC3

10UF
110UF

22UF
6.3V

10UF 10V
MC83
1/16W
3.3KOHM 220O HM C

MMBT2222A
B
POWER_M
MPR3 E DGND
MPR12

10KOHM
MPR4
DGND

MPQ2
PCR02

100OHM
DGND

DGND

VD3.3V_PW E3.3V_PW

L29
BD1 0.01OHM
H5.35V_PW
PP10 L30
PP13A PP15

100NF
0.01OHM
PP13 PP14A PP7A PP10A D5V_PW

C3
+PVDD+25V_PW

FRO M SMPS PP14 PP15A PP7 0.01OHM


PP1A

PP8A

PP0A

PP9A
PP2A

PCN1
PP1

PP8

PP0
PP9
PP2

M5.35V_PW
M12V_PW

1 1/10W
DGND M5.35V_PW SWITH PART 100O HM
REMO 2 REMO DGND POWER_ON
VFD_CE 3 VFD_CE MPR6

MPR7
4
TWG-P13P-A1

VFD_CLK MP1.35V_PW

47KOHM
5 VFD_CLK AOZ1051PI DP8L40FH-4R7M

1/10W
VFD_DO VFD_DO IC26 MPL1
M12V_PW 6 4.7UH 0.01OHM
+PVDD+25V_PW 7 1 PGND NC
8 L36
8 2 MGND1 7 0.01OHM

MPR11
+PVDD+25V_PW VIN SS L37

3.3KOHM
M5.35V_PW 9 3 AGND
LX
EN
6

1/10W
M5.35V_PW 10 4 FB COMP
5
DGND 11 MPR10

MPC9
12 3.6KOHM

220UF
DGND

16V
MLVS-0603-E08
100NF

10UF 10V

0V
1 0 UF 110V
10V
10UF 10V

10UF 10V

0 UF 10V
10V
13

1 0 UF 10V

MPC4
10UF 10V

10UF 10V
ECO

MPC5
470UF

MPC19

MPC18

MPC11
C110

C4

MPC17

6.3V
MPC20

MPC12
ECO 1/10W

D8

MPR9

22UF 6.3V
8.2KOHM

MPC8

MPC10
1/10W
10UF
110UF
10UF

33NF 16V
10KOHM
MPR8

MPC7

22UF
1/10W
DGND

MPC6
50V
2.2NF
P11A P9A
P16A
P12 P12A P11 P3A P14A P23A

P9 P3
P14 P16 P23

UCN1 DGND DGND DGND

DGND
1
USB_CO N_DP
2 ESD
USB_CO N_DP
USB_CO N_DM 3 USB_CO N_DM
DGND 4
AGND 5
MIC_SIG 6
AGND 7 1/10W MIC_SIG
8 1/10W
MIC_SENSE MIC_SENSE
HP_R
9 HPDR1 0OHM HP_R
HP_L 10 HPDR2 0OHM HP_L USB5V_PW
HP_SENSE 11 HP_SENSE
F_HP_MUTE 12 F_HP _MUTE
13 M5.35V_PW
USB5V_PW
USB5V_PW
14 BDU1
A+5V_PW
15

DGND
P2 PS2 P10 P7 P8
P2A PS2A P10A P7A P8A

Copyright© 1995-2013 SAMSUNG. All rights reserved. 6-8


6. Schematic Diagram

6.8. MAIN-7

POWER
USB/IPOD

VD3.3V_PW CURRENT LIMIT:2.4A


USB5V_PW
M5.35V_PW
C1007

10KOHM
R1003
100NF TPS2554DRCR

1/16W
IC1008
16V

10
0.01OHM
1 GND FAULT# 10 PBD1 USB_FAULT
2 9

VCC
USB_CO N_DM
1 9 USB_SE L
IN OUT

2 1D+ S
8 3 MGND1
IN OUT 8

USC2
USB_CO N_DP USB_DM 4 7 R3111 20KOHM

10UF
1D- D+
3 7 ILIM_SEL

10V
IPOD_CON_DM 2D+ D- USB_DP 5 ILIM0
6
4 6 USB_EN EN/EN#
IPOD_CON_DP 2D-
GND
/OE
ILIM1
R3112 20KOHM
S-> L:1D,H:2D

USC1

C3010
10UF
100OHM

100NF
R1004

10V
IC1001

16V
1/16W
5

TS3USB221ERSER
DGND
DGND

DGND

IPOD CERTIFICATION VD3.3V_PW


VD3.3V_PW R1010

MFI341S2162 10KOHM
IPIC1 1/16W

16
17
18
19
20
10KOHM

10KOHM
1/16W

1/16W
R1021

NC
NC
NC
NC
NC
R1022

STK7002 15 NC NC 1
IPQ1 14 P3/IRQ- P4/IRQ- 2 100O HM
13 3 1/16W
I2C_D AT P1/IRQ- NC R1020
D

12 4
S

STK7002 P2/IRQ- RES- IPOD_CP_RST


IPQ2 11 5
G

VSS VCC

I2C_S CL
D

IPC10
S

100NF

IPC9
100NF
10V
NC
NC
NC
NC
NC

10V
VD3.3V_PW
G

9
8
7
6
10

DGND

DGND

6-9 Copyright© 1995-2013 SAMSUNG. All rights reserved.


6. Schematic Diagram

6.9. MAIN-8
+PVDD+25V_PW
POWER M12V_PW
AR14
10OHM

3.3OHM
1/10W
1/4W

AR16
50V
10OHM 470UF
AC20

100NF

AC19
AR15

1UF
AC17

10NF
1/4W

AC18
1UF
1UF

AC16
AC15
TAS5342ADDV SPK_L_P
IC30

AC24L
18OHM 330PF
1 44

10NF
27KOHM
1/10W 50V

AC40L
GVDD_B
GVDD_A 33NF
2 43

1/10W
/OTW
BST_A

1NF
3 42

AC47
100NF
DGND

AR23
DGND NC
NC AC21

AC36
4 41

AR17L
NC

3.3OHM
3.3OHM
PVDD_A
TI_SD 5 40

1/10W
/SD

AR27
PVDD_A
6 39 L80

L+
OPLCH PWM_A

L-
OUT_ A
TI_RST
7 /RESET_ AB 38
8 PWM_B
GND_A
37 1 4
AR10 GND_B
1OHM 9 36

470NF
OC_ ADJ

AC34L
OUT_ B
10 35

3.3OHM
100PF

1/10W
AR11 GND 33NF DGND SPK_L_P

AR28
2 3

AC10
PVDD_B
22KOHM 11 AGND 34 AC22

18OHM

AR18L
BST_B SPK_L_M

1/10W
12 33 AC23

27KOHM
100NF

1NF
VREG

AC46
AR24
BST_C

100NF
13 32 AC26

1/10W
33NF

AC37
M3
PVDD_C DGND

AC41L
14 31

10NF
M2
OUT_ C
100NF
15 30 AC27

AC25L
330PF
M1
GND_C
AC11 16 29

50V
PWM_C
100NF 17 GND_D
28
/RESET_ CD
OUT_ D
DGND 18 PWM_D 27

MGND1 MGND2
OPRCH 19 PVDD_D
26 DGND
NC
PVDD_D SPK_L_M 4
20 NC 25 + -
21 NC
24 AC28 2
VDD
M12V_PW 22 BST_D
23 1
GVDD_C
GVDD_D 33NF SPK_R_P 3 - +

AC32R
330PF

27KOHM
5.6KOHM

3.3OHM

50V

AC42R
10NF
100NF
M12V_PW

1/10W
PPR4

100NF
1/10W

AR25
AR20
AC29
50V SPJ K1

1/10W

1NF

AC45
AC38
1/10W 470UF

1UF
AC40

AC31
100KO HM

18OHM

3.3OHM
AR21R
M12V_PW

AR21R
1/10W

1/10W

R+
AR19

AR29
L81

R-
10NF
PPR3 10OHM

AC30
DGND
PPC1
220UF

1/4W 1 4
16V

470NF
AR12 10OHM

AC35R
1.2KOHM

1/4W
PPR1

SPK_R_P
1/10W

1UF
AR13

AC106

18OHM
2 3

1/10W
DGND SPK_R_M

AC13 100NF

AC33R AR22R

27KOHM
PPQ1

3.3OHM
1/10W
1UF
1/4W

AR30
E DGND

1NF
PPD1

AC44
1/10W

AR26
100NF
B 10OHM DGND
C DGND

AC39
15KOHM

10UF

1N4148WS
AC12

AC14
PPR2

330PF
1/10W

SRA2203S

50V

AC43R
10NF
C SRC1203S
B
PPQ2
E
PPR5
1KOHM
1KOHM
PPR6

1/10W DGND SPK_R_M


1/10W

6.3V
47UF
DGND HPC18 0.25O HM
1N4148WS
PPD2

HP_R
HPC19 TDBD1 8.2KO HM M12V_PW
HPQ2L 1/10W
HPR22 C 47UF TDC1 HPR11
B
E
6.3V
4.7KOHM
KTD1304 HPR12 550V
0 V 222PF
2 PF
10UF 2.7KOHM HPC10
HPC4 HPR8 DGND 150PF
680OHM

10OHM
OPLCH

HPR13
10KOHM
2.2UF 47KO HM HPC20 HPR10

HPR18
1/10W
M5.35V_PW F_HP _MUTE
10V 1/10W
0V
0 UF 110V

HPQ1L 1/10W
47KOHM

HPQ2
HPC6

HPC7
HPR6

HPR1 HPR4 10KO HM


SRA2203S

1NF

C
110UF
C

B
E

HPR19
10UF 10V

10UF 10V

4.7KOHM E
10V 10UF

0OHM
B
HPC2

8
7
6
5
HPC1

HPC16
1/10W KTD1304

HPR17
HPC11

HPC17

10KOHM
25V 10UF

25V 10UF
VCC
OUT2
HPC3

IN2+
IN2-

100NF
HPR3

AIC1
HPC22

1/10W
1KOHM

HPC23

16V
22UF

22UF

OUT1
10V

10V

IN1+
VEE
HPQ1R IN1-
HPR5 E 1/10W
1

10KO HM
2
3
4
DGND
10UF 10V

1/10W HPQ1 B
47KOHM
HPR7

HPC9

C
HPC8

4.7KOHM
HPC25

4.7KOHM HPR21
HPC24

10KOHM

HPR20

C
1NF

B
22UF

1/10W
22UF

MAIN_MUTE KTD1304 TDC2


10V

E
HPR2
KTC3875SS-BL
50V 22PF HPC13
10V

HPC5 HPR9 10UF HPR15 150PF


OPRCH 680OHM
2.2UF 47KO HM HPC212.7KOHM HPR16
10V 1/10W
DGND HPR14
8.2KO HM
HPR23 E HPQ2R 1/10W
B
C DGND
4.7KOHM 6.3V
KTD1304 47UF
HPC14
0.25O HM
HP_L
HPC15 TDBD2
47UF
6.3V

Copyright© 1995-2013 SAMSUNG. All rights reserved. 6-10


6-11
POWER
6. Schematic Diagram

12517 HS-13
6.10. FRONT

-VP
-VP

VFD_CLK

DGND
VFD_CE

VFD_DO
VFD-
VFD-

5.3V_PW
+VFD
+VFD
DGND
REMO TE
FCN1

1
2
3
4
5
6
7
8
9
10
11
12
13
T
TP
TP38T
PTPT
PT
TP1
TP

DGND
PT
1P 3T
TP30
TP
PT
0P 3T
TP34
TP
PT
4P 3T
TP35
TP
PT
5P 3T
TP33
TP
PT
3P 3T
TP32
TP
TP31 1
PTP
2P 3TP36

-VP
+VFD

VFD-

VFD-
5.3V_PW

5.3V_PW

OPTION :
1/8W

RMR1

5.3V_PW
47OHM

VFR7

VFR8
UZ5.6BSB

VFR6
RMZD2

1/2W

VFR6/7 - -> OMIT


2.2OHM
UZ5.6BSB

15OHM
50V 15OHM RMZD1
VFR2

10UF VFC6
1/8W
47OHM

TP52
1/8W

TP
RMR2
47OHM

TPT
TP PT
TP PT
TP PT
TP TP
PT P
TP TPTP
TP TPT
TP
PTTP
PTTP
PTTP
PTTP
PTTP
P

DGND
VFC7 RMC2 10UF
T
TP16
P 1T
TP15
6P 1T
TP14
5P 1T
TP13
4P 1TP12
T3P 1TP11
T2P 1 1 TP10
TP 1TP9
T0P 9T
TP8
P 8T
TP7
P 7T
TP6
P 6T
TP5
P 5T
TP4
P 4T
TP3
P 3T
TP2
P2 100NF
50V
50V 50V
100N F
1N4148 RMC1
1 F- VFD2
2 F-
DGND

3 1G
1G
3
2
1

4 2G
HNA-09SS83T

2G
DGND

5 3G
3G
6 4G VFC4 10UF
4G
VFR5
VCC
OUT

GND

7 5G 50V
5G
51KOHM

8 6G
REMO

6G 100NF
9 7G
1/8W

7G VFC5 50V
10 8G
8G
11 9G
9G
11
10
9
8
7
6
5
4
3
2
1

12 NC
MGND2
MGND1

13 NC
14
K2
K1

NC 346HF12A
DIN

STB
CLK
OSC
LED4
LED3
LED2
LED1
0609- 001204

DOUT

15 P199
P1
P19
16 P188
P1 12 VSS VSS
44
P18
17 P177
P1 13 VDD VDD
43
P17
18 P166
P1 14 SG1/KS1 GR1
42
P16 P1 1G
19 P155
P1 15 SG2/KS2 GR2
41
P15 P2 2G
20 P144
P1 16 SG3/KS3 GR3
40
P14 P3 3G
21 P133
P1 17 SG4/KS4 GR4
39
P13 P4 4G
VFD
FIC1

22 P122
P1 18 SG5/KS5 SG 24/GR5
38
P12 P5 5G
23 P111
P1 19 SG6/KS6 SG 23/GR6
37
P11 P6 6G
24 P100
P1 20 SG7/KS7 SG 22/GR7
36
PT6315A

P10 P7 7G
25 P9 P8
21 SG8/KS8 SG 21/GR8
35 8G
P9
26 P8 P9
22 SG9/KS9 SG 20/GR9
34 9G
P8
27 P7
P7
P6
28 P6
SG10/KS10
SG11/KS11
SG12/KS12
SG13/KS13
SG14/KS14
SG15/KS15
SG16/KS16
SG17/GR12
SG18/GR11
SG19/GR10

VEE

P5
29 P5
30 P4
23
24
25
26
27
28
29
30
31
32
33

P4
P3
31 P3
P2
32 P2
P1
33 P1

34 F+
35 F+
P10
P11
P12
P13
P14
P15
P16
P17
P18
P19

VFC8 10UF
DGND

50V
VFC9
TP53
TP

100NF
-VP

TP29
T
TP28
P 2T
TP27
8P 2T
TP26
7P 2T6
TP25
P 2T
TP24
5P 2T
TP23
4P 2T
TP22
3P 2T
TP21
2P 2T
TP20
1P 2T
TP19
0P 1 9 TP17 50V
TP18
T
TP
PTTP
PTTP
PTTP
PTTP
PTTP
PTTP
PTTP
PTTP
PTTP
PTTP
PTTP
PTTP
P
+VFD

Copyright© 1995-2013 SAMSUNG. All rights reserved.


6. Schematic Diagram

6.11. JACK
5.3V_PW_J
POWER 1/8W
AUDIO 10KOHM
MR8

5.3V_PW_J 3857S T
1/8W MBD1 9 6
220OHM MIC_S EN
MR7
8 5
7 4

GCC02- 0077
50V
MC1

1UF
2

100KOHM
10

2.2KOHM
MC5 1UF 1
MIC_SIG

MR3
50V 11
3

2S C1008- Y
MC3
C 1UF 50V

GDZJ4.3B
MR2

MR5
B
MICJK

22KOHM
E 220O HM
DGND

10KOHM
USB5V_PW USBJK MQ1

0V
NF 550V
MGND1

10NF

11NF
16V
1 1
2 MGND3

MC4
MD1
MC6
USB_NO 2

MR6

MR4
UJC2

220U F
3

33OHM
UJC1

MC2
10V
USB_PO 3
470OHM

MR1
4 4
MGND2
1/8W

184- 0423231
UR1

50V
47NF
470UF
10V

DGND

5.3V_PW_J 1/8W
DGND
10KOHM 9 6
HPR5
8 5
7 4

GCC02- 0077
HP_ SENSE
TPTPTPTPTPTPTPTPTP
TPTPTPTPTPTPTP TP 33OHM
TP39
TP40
TP 4T
TP41
0P 4TP42
1T
TP43
P 4T3
TP44
P 4TP45
T4P 4TP46
T5P 4TP47
T6P 4TP48
7 TP50 L1 33UH HPR3
HP_R
USB5V_PW HP_L
L2 HPR4 2
JKCN 5.3V_PW_J 33UH 10
1/8W 33OHM 1
1 2.2KOHM C 11

100K OHM
5.3V_PW

100K OHM
B
2 HP_ MUTE 3
USB5V_PW 3 HPR6 E 2N5551AT

EMSC1 220P F

EMSC2 220P F
USB5V_PW HPQ3

HPR1
HPR2
HP_MUTE
4 HP_MUTE
5 HPC1 HPCK
HP_SENSE HP_SENS E
6 HP_L 10UF HPR7 C
HP_L 7 B
HP_R HP_R 16V
8 2.2KOHM E
MICSENSE MIC_SEN 1/8W HPQ4 2N5551AT
9
DGND 10
MIC_SIG MIC_SIG
11
DGND 12
DGND 13
USB_NO USB_NO
USB_PO
14 USB_PO DGND
15
DGND

DGND

Copyright© 1995-2013 SAMSUNG. All rights reserved. 6-12


6. Schematic Diagram

6.12. TOUCH KEY-1

POWER LEDC2
KTC3875S S-BL
VIDEO
IPOD JAC K
C
B Q2
E
KEYR45
3.9KOHM
CN1 1/10W

DGND
10UF
10UF
10UF
10UF
10UF
10UF
10UF

23

25

27

29

31

33

35
MGND1 MGND2
1 DGND 1 514S 0117

100N F
2 100UF GCN1

IPC1
2 DGND

10V
DGND
3

MGND2
3 N.C ST5V_PW
4

MGND3
4 USB D+ 16V

10V
10V
10V
10V
10V
10V
IPC2 10V
5 N.C 5 IPOD5V_PW

IPC1A
6 USB D- 6 20

IPC3
IPC4
IPC5
IPC6
IPC7
IPC8
7 N.C 7 M5.2V_P W 19 IPOD5V_PW
8 USB VBUS 8 DGND
9 18
9 N.C IPOD _DETECT IPOD_ GALAXY_PWR 17

LEDC2
1
2
3

5
10 IPOD_ GALAXY_PWR UNDEFINED
10 IDEN TIFY(N.C) IPOD _CON_DP 16
11 N .C 11 DGND H3.3V_PW
IPOD _CON_DM 15

150KOHM
12 N .C 12 GALAXY_L GALAXY_L TOUCHCN2
13 GALAXY_R
14 GALAXY_R

1/10W
13 N .C IPOD _VIDEO 13 10

IPR1
14

MGND2
14 N .C GALAXY_ID_CON
15 12
15 D GND DGND 11 7
16
MGND4

16 D GND USB_I POD_D+ 10 IPOD_CON_DP 6


17 N .C 17 USB_I POD_D- LEDC1
IPOD_CON_DM

30KO HM

IPOD5V _P W
18 IPOD RX (N.C) 18 9 5

1/16W

VIDEO
IPOD _DETECT IPOD_DE TECT

TP1
IPR4

IPOD_DETE CT
19 IPOD TX( N.C) 19 8 4 RESET
DGND 7 3
20 D ETECT(N .C) 20 IPOD_VIDEO
IPOD _VIDEO 6 2
21 PR 21 KEY_S DA GPC KEY_SCL
22 Y 22 KEY_SCL
5 1 KEY_SDA
4 KEY_SCL
23 PB/COMPOSIT E 23 <NC>RESET
24 3 KEY_SDA
24 R EMOTE S ENSE - GND POWER_TO UCHKEY 2
25 LINE_IN_L 25 <RESE T>LED1 MGND1
1 LED1

100KOHM
75OHM
IPR2

26
IPR3
26 LINE_IN_R DGND MGND1
27 LINE_OU T_L 27
28
MGND7 MGND5

28 LINE_OU T_R DGND


29 A/V RETURN (AGND) 29

11

13
30 IPOD DE TECT 30 DGND
MGND6

41
43

45

47
49
51
37
39
DGND DGND DGND

SEP ARATE FROM OTHER G ND

GALAXY JACK
MGND2

GSCN1
MGND4
1
GALAXY_DM
2
GALAXY_DP
3
4 330O HM
MGND3

ID_CON
5 7A7> GALAXY_DP
R2028
GALAXY_R 4A4<
KEYR44
365 KOHM

7A7> R2029 4A4<


GALAXY_DM GALAXY_L

50V

50V
MGND1

330O HM

50V

50V

220K OHM

220KOHM
330PF

C2033 330PF

330PF
AP1117E33G Z-13-89

IPOD5V_PW ST5V_PW MLVS-0603 -E08

330PF
MLVS-0603 -E08 11 11

C2031
C2032

C2034
R2034

R2035
GPQ1

VT2004

VT2005
DGND
MGND1

H3.3V_PW
D
S
GP C1
GP R1
100KOHM

1UF

G
16V
1/16 W

IC33
AO3415AS
5AS

1 3
47OHM

47OHM
OUT
1/16 AO341

KEYR41

KEYR42
IN OUT
GP R2
10KOHM
10KO HM
GP R3

GND
10UF
10V

1OHM
1/10W
2
C2035

LED2

LED4

1/16W MMBT2222A DGND


TCR1

3.3KO HM C
GPC B GPQ2
E
LEDC1
GRP4
10UF
10V

LEDC1
C2036

C
KTC3875S S-BL
LED1 B Q1
E
KEYR43
3.9KO HM
DGND 1/10W

6-13 Copyright© 1995-2013 SAMSUNG. All rights reserved.


6. Schematic Diagram

6.13. TOUCH KEY-2

FUNCTION

V_DOWN
POWER LED
POWER

PLAY
EJ ECT
ST3. 3V_PW

V_UP
REW
STOP

FF
H3.3V_PW

10OHM

10OHM

10OHM

10OHM

10OHM

10OHM

10OHM

10OHM

10OHM
KEYR38

KEYR37

KEYR35

KEYR34

KEYR33

KEYR36
KEYR40

KEYR32

KEYR39

LED13

LED11
LED18

LED15
LED1

LED7

LED5

LED3

LED9
DATA<0..8>
8

0
KEYR25 1KOHM 1/10W
1/10W

LEDC3
PLAY
KEYR24 1KOHM 1/10W
REW
KEYR23 1KOHM 1/10W
1/10W

KEYR22 1KOHM 1/10W VOLDOWN


KEYR9 1KOHM 1/10W VOLUP
POWER
TIC1
TOUCHCORE 380- ML24IP

24
23
22
21
20
19
VDDIO
P2.4/TS 2.4
P2.3/TS 2.3
P2.2/TS 2.2
P2.1/TS 2.1
P1.7/TS 1.7
220OHM KEYR11
1/10W
KEY-SDA KEYR17 10KOHM 1 18 0
RXD/SSB/I2C1_SDA/INT0/P3.0
1/16W P1.6/TS1.6
KEY_SCL KEYR18 220OHM 1/10W 2 TXD/SCLK/I2C1_SCL/INT1/P3.1 17 7
P1.5/TS1.5
KEYR21 1KOHM 1/10W
1/10W 3 MISO/INT2/P3.2/RESETB 16 6
STOP KEYR20 1KOHM 1/10W
1/10W 4 MGND1 P1.4/TS1.4
15 5
FF KEYR19 1KOHM 1/10W
1/10W
8 5
VDDINT
MOSI/I2C0_SDA/XTAL2/INT3/P3.3
P1.3/TS1.3
14 4
FUNTION KEYR16 1KOHM 1/10W
1/10W KEYC1
1UF 6.3V 6 I2C0_SCL/XTAL1/INT4/P3.4
P1.2/TS1.2
13 3
P1.1/TS1.1
EJECT

PWM0.3/P0.3
PWM0.4/P0.4
PWM0.5/P0.5
PWM0.6/P0.6
TS1.0/P 1.0
7 VDDINTS
8
9
10
11
12
6.3V
1UF
KEYC2

2
ST3. 3V_PW

KEYC3
6.3V
1UF
H3.3V_PW

KEYC4
KEYBD1 100NF
0.01O HM 16V

VAR2
MLVS-0603-E08

MLVS-0603-E08

H3.3V_PW
MLVS-0603-E08
VR2

FGND
VR3

KEY_SCL
KEY-SDA
KEYR5 KEYR8 LEDC1
3.9KOHM 3.9KOHM
3.9KOHM
1/10W 1/10W
KEYR47
3.9KOHM
SDA
1/10W
SCL
KEYC5

3.3V
16V 100NF

FGND
RESET
GND
LEDC1 LEDC3
1
2
3
4
5
6
7
MGND1
CN2

MGND2
UNDEFINED
10003H R-07 A00( P)
GND

GND
RESET
SDA

LEDC
SCL
H3.3V_P W

Copyright© 1995-2013 SAMSUNG. All rights reserved. 6-14


6. Schematic Diagram

6.14. SMPS

HS 801 HEAT S INK


LA851
+P VDD_+25V

2.9uH(0.7pi)
DA851 S FF1606G RA851
B+ TM801S 10KRF
120W : P Q3220

35V 470uF MK

35V 470uF MK
400V 470pF(K)+BEAD
3324110154ND RA854
CA851 RA855

35V 470uF MK
BM803 1000pF(K) 1KV 5.1KRF
8.2KRF

2.2KRF
RA852
BAS 3550TO

NC 3216

220nF 275V
FP 801S

RX801
NT801S

1
y

220nF 275V

NC
630V 10nF
AC250V T5.0AH

3W 100K
15D030

CY802S
BD801S

1
CN801S vu P CM801S A

CM801

RM802
2M 1/2W
KBJ 406G p p EL817M(B) p

RA858
CA856 RA856
‘

RA864
2.2KRF
450V 100uF WL
0.1uF 50V

CA857
p 4

NC 3216
14D751
2 r

VX801S

RX802

CA852

CA853
CY805S p 82KRF

2
NC
“

CA801
CX801S

RX804

400V 470pF(K)+BEAD
|

CX802S
CY801S
CA854 RA853

FLV420060 TR14

FLV420060 TR14
LX801S

LX802S
YW396-03AV
Z VPS

3
NC 3216
RX803

DM804
UF4007
DM801
˜rŒ “ ‰ ˜rŒ “ ‰ 0.1uF 50V 33KRF
S ARS 02
ICA851 RA857
v TL431G-AE2-R 10KRF

•rŒ “ ‰ GND

BM801
BAS 3550TO
˜rŒ “ ‰

S TF15NM65N
QM801

0.1uF 50V
HM801 HEAT S INK

CA860
LM851 M12V
TO-1005(33uH)
1N4148W 10RF 3216 GZ2012D800TF
DM803 RM801 BM802 A RA861
20KRF
CA863

RA859
RM818 RM819 RM820

100RF
ZDM805 NC
B+ ICA852 NR110K NC

25V 330uF MK
5.6KRF 3216 5.6KRF 3216 5.6KRF 3216
RA862
RM803 1 8

CM857
RM805 BS SS p 1KRF

RM806
HV

27KRF
100RF 3216 +P VDD_+25V
100KRF 2 7
SV Vin EN
S QS 1013K
4

3 6
ICM801S SW ISET

MB210
ST DRV DM802 US 1M RM816 BM804
4 5
8 GND 7 GND FB

0.1uF 50V
VCC

CM876
RA863
5.6RF 3216 GZ2012D800TF
1.5KRF

DA852
FB/OLP RA860 CM856
1 OCP 6
BA 470KRF 0.22uF 25V
MMS Z5221B(2.4V) RJ 801 RM814
ZDM801 •rŒ “ ‰ 0RJ 3216 330RF 3216 GND
2

1KV 68pF(K)
RM813
z

NC
˜rŒ “ ‰

CM802
MMS Z5239B(9.1V)
MMS Z5239B(9.1V)
4.7RF 3216

50V 47uF WL
RM808

TM802S
RM809

S S 16
470pF 50V

MMBT2222ALT1G
2.2nF 50V

0.1uF 50V
NC

ZDM803

ZDM802

RM804 M12V EE1312 DA855 RA885 2.2RF 3216 +VFD


QM802
330KRF

4.3KRF

{ 3324110155ND
5W 0.15RF
{

10V 470uF MK
NC

NC

ZDM804

A RA865
4

CA883
NC p p
0RJ

CM804 NC

2.2KRF
1nF 50V

CM811

RM810

CM806

RM811

RM812

CM807

CM809

DA856
CM813
CM814
RM807

S S 16 -VFD
z |
KTC3228

0.1uF 50V
|
3

P CM801S B QA851

CA864

10RF 3216
EL817M(B) DA853

RA886
1N4148W MMS Z5221B(2.4V)
CA866 ZDA801
•rŒ “ ‰
x
x }
0.1uF 50V

0.1uF 50V
39RF 3216

CA865
DA854 vu -VP
MMS Z5248B(18V) QA852 RA869
DA860 ZDA855 1N4148W DA857
BAV70 M12V KTC3209 1N4148W
v
M5.3V p CA867
‡ ±´ ¨ ° e Z DA861
ZDA854 MMS Z5236B(7.5V) y ~ 50V 47uF WL

˜rŒ “ ‰ 1N4148W p CA868


1N4148W +P VDD_+25V DA858 50V 47uF WL GND
ZDA856 ZDA853
RA884
e e 1KRF MMS Z5245B(15V) MMS Z5245B(15V) w

˜rŒ “ ‰

QA854
2N7002K RA883 CA881 8019P -02-220L(22uH)
150KRF 10nF 50V LM852 0RJ 3216
+PVDD_+25V RJ 802 M5.3V

CA876
100KRF
˜rŒ “ ‰ 0.1uF 50V RA876
RA875
6.8KRF

10V 1000uF MK
RA870
10RF ICA853 NR110K
QA856
M5.3V 1 8

CA879
MMBT2907ALT1G BS SS p
HS 801 HM801 RA874
A
45*10 40*10 2 7
˜rŒ “ ‰ •rŒ “ ‰ RA879 Vin EN 0RJ
750RF
3 6
SW ISET
RA877 M5.3V BM805 4 5
100KRF RA878 BAS 2550TO GND FB
CA888 1uF 50V

CA887 1uF 50V


100KRF

CA877 0.1uF 50V


RA872
DA893 MB210

DA892 MB210

RA882 RA871 CA878


1.2KRF
NC 0RJ 0.22uF 25V
20KRF
B+ QA855 RA881
CY804S 2N7002K
MMS Z5245B(15V)
RA880 150KRF

400V 470pF GND


˜rŒ “ ‰
ECO
10nF 50V
CA882
ZDA852

˜rŒ “ ‰

˜rŒ “ ‰
CY803S
400V 1500pF

6-15 Copyright© 1995-2013 SAMSUNG. All rights reserved.


GSPN (GLOBAL SERVICE PARTNER NETWORK)
Area Web Site

Europe, MENA,
https://gspn1.samsungcsportal.com
CIS, Africa
E.Asia, W.Asia,
https://gspn2.samsungcsportal.com
China, Japan
N.America, S.America https://gspn3.samsungcsportal.com

This Service Manual is a property of Samsung Electronics


Co.,Ltd.
© 2013 Samsung Electronics Co.,Ltd.
Any unauthorized use of Manual can be punished under
All rights reserved.
applicable International and/or domestic law.
Printed in Korea

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