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Micro Compact

System
Model Name MM-E430D

Model Code MM-E430D/XN

SERVICE MANUAL
Micro Compact System Contents

1. Precaution

2. Product Specification

3. Disassembly and Reassembly

4. Troubleshooting

5. PCB Diagram

6. Schematic Diagram
MM-E430D

Refer to the service manual in the GSPN (see the rear cover) for more information.
Contents

Contents
1. Precaution........................................................................................................................................ 1 − 1
1.1. Safety Precautions ................................................................................................................... 1 − 1
1.2. Servicing Precautions ............................................................................................................... 1 − 3
1.3. Precautions for Electrostatically Sensitive Devices (ESDs) .............................................................. 1 − 4
2. Product Specification ......................................................................................................................... 2 − 1
2.1. Product Feature ....................................................................................................................... 2 − 1
2.2. Specifications.......................................................................................................................... 2 − 2
2.2.1. MX-E430 Specifications ............................................................................................... 2 − 2
2.2.2. MX-E430D Specifications............................................................................................. 2 − 3
2.3. Specifications Analysis ............................................................................................................. 2 − 4
2.4. Disc Types And Disc Format...................................................................................................... 2 − 5
2.4.1. Disc types that can be played ......................................................................................... 2 − 5
2.4.2. Supported Audio Formats ............................................................................................. 2 − 5
2.5. Accessories ............................................................................................................................ 2 − 6
2.5.1. Supplied Accessories ................................................................................................... 2 − 6
3. Disassembly and Reassembly .............................................................................................................. 3 − 1
3.1. MAIN Disassembly and Reassembly ........................................................................................... 3 − 1
3.2. DECK Disassembly and Reassembly ........................................................................................... 3 − 6
4. Troubleshooting ................................................................................................................................ 4 − 1
4.1. Checkpoints by Error Mode ....................................................................................................... 4 − 1
4.1.1. No Power................................................................................................................... 4 − 2
4.1.2. No Output .................................................................................................................. 4 − 4
4.2. Measures to be taken when the Protection Circuit operates............................................................... 4 − 5
4.2.1. Operation of Power Block Protection Circuit .................................................................... 4 − 5
4.2.2. Check AMP in Power Protection .................................................................................... 4 − 6
4.3. MICOM, MPEG Initialization & Update ...................................................................................... 4 − 7
4.4. Buyer-Region Code Setting Method ............................................................................................ 4 − 8
4.4.1. The inserting method of Region Code after replacing the Main PBA ..................................... 4 − 8
5. PCB Diagram ................................................................................................................................... 5 − 1
5.1. Wiring Diagram....................................................................................................................... 5 − 1
5.2. MAIN PCB Top ...................................................................................................................... 5 − 2
5.2.1. Pin Connection ........................................................................................................... 5 − 3
5.2.2. Test Point Wave Form .................................................................................................. 5 − 4
5.3. MAIN PCB Bottom.................................................................................................................. 5 − 5
5.4. FRONT PCB Top .................................................................................................................... 5 − 6
5.5. FRONT PCB Bottom ............................................................................................................... 5 − 7
5.6. JACK PCB Top ....................................................................................................................... 5 − 8
5.6.1. Pin Connection ........................................................................................................... 5 − 9

i Copyright© 1995-2013 SAMSUNG. All rights reserved.


Contents

5.7. JACK PCB Bottom .................................................................................................................. 5 − 10


5.8. TOUCH KEY PCB Top ............................................................................................................ 5 − 11
5.8.1. Pin Connection ........................................................................................................... 5 − 12
5.9. TOUCH KEY PCB Bottom ....................................................................................................... 5 − 13
5.10. SMPS PCB Top....................................................................................................................... 5 − 14
5.10.1. Pin Connection ........................................................................................................... 5 − 15
5.11. SMPS PCB Bottom .................................................................................................................. 5 − 16
6. Schematic Diagram ........................................................................................................................... 6 − 1
6.1. Overall Block Diagram ............................................................................................................. 6 − 1
6.2. MAIN-1................................................................................................................................. 6 − 2
6.3. MAIN-2................................................................................................................................. 6 − 3
6.4. MAIN-3................................................................................................................................. 6 − 4
6.5. MAIN-4................................................................................................................................. 6 − 5
6.5.1. Test Point Wave Form .................................................................................................. 6 − 6
6.6. MAIN-5................................................................................................................................. 6 − 7
6.7. MAIN-6................................................................................................................................. 6 − 8
6.8. MAIN-7................................................................................................................................. 6 − 9
6.9. MAIN-8................................................................................................................................. 6 − 10
6.10. FRONT ................................................................................................................................. 6 − 11
6.11. JACK .................................................................................................................................... 6 − 12
6.12. TOUCH KEY-1 ....................................................................................................................... 6 − 13
6.13. TOUCH KEY-2 ....................................................................................................................... 6 − 14
6.14. SMPS .................................................................................................................................... 6 − 15

Copyright© 1995-2013 SAMSUNG. All rights reserved. ii


1. Precaution

1. Precaution
Follow these safety instructions while servicing the ESD to prevent damage and to protect against potential hazards
such as electrical shock and X-rays.

1.1. Safety Precautions

1) When reinstalling the chassis and its assemblies, be sure to restore all of the protective devices, including the control
knobs and the compartment covers.

2) Make sure that there are no cabinet openings through which people (particularly children) can make contact with
dangerous internal components.

3) Design Alteration Warning : Never alter or add to the mechanical or electrical design of the unit.
Example : Do not add auxiliary audio or video connectors. Such alterations might create a safety hazard. Also, any
design changes or additions will void the manufacturer’s warranty.

4) Leakage Current Hot Check Figure 1.1 AC Leakage Test :

WARNING

Do not use an isolation transformer during this test. Use a leakage-current tester or a metering system that complies
with American National Standards Institute (ANSI C101.1, Leakage Current for Appliances), and Underwriters
Laboratories (UL Publication UL1410, 59.7).

With the unit completely reassembled, plug the AC cord directly into a 120 V AC outlet. With the unit’s power switched
from the ON to the OFF position, measure the current between a known ground and all exposed metal parts.
Known Grounds - Earth
Known Metal parts - Screwheads, Metal Cabinets, etc.

LEAKAGE (READING
DEVICE CURRENT SH OULD NOT BE
UNDER TES TER ABOVE 0.5mA)
TES T
TES T ALL
EXPO S ED METAL
SU RFACES
2-WIRE CORD
ALSO TES T WITH
PLUG REVER S ED
(US ING AC EARTH
ADAPTER P LUG GROUND
AS R EQ UIRED)

Figure 1.1 AC Leakage Test

1-1 Copyright© 1995-2013 SAMSUNG. All rights reserved.


1. Precaution

5) Insulation Resistance Cold Check :


(1) With the unit’s AC plug disconnected from the AC source, connect an electrical jumper across the two AC prongs.
(2) Set the power switch to ON.
(3) Measure the resistance between the shorted AC plug and any exposed metallic parts.
Example : Screwheads, Metal Cabinets, Antenna Port, etc. If any of the exposed metallic parts has a return path to
the chassis, the measured resistance should be between 1 and 5.2 megohms. If there is no return path, the measured
resistance should be “infinite”. If the resistance is outside these limits, a shock hazard might exist.
See Figure 1.2 Insulation Resistance Test

Ante nna
Term inal

Expo s ed
Meta l P a rt

oh m
Ohmmet er

Figure 1.2 Insulation Resistance Test

6) Components, parts and wiring that appear to have overheated or that are otherwise damaged should be replaced with
parts that meet the original specifications. Always determine the cause of damage or overheating, and correct any
potential hazards.

7) Observe the original lead dress, especially near the following areas :
Antenna wiring, sharp edges, and especially the AC and high voltage power supplies. Always inspect for pinched,
out-of-place, or frayed wiring. Do not change the spacing between components and the printed circuit board. Check the
AC power cord for damage. Make sure that no wires or components touch thermally hot parts.

8) Product Safety Notice :


Some electrical and mechanical parts have special safety-related characteristics which might not be obvious from visual
inspection. These safety features and the protection they give might be lost if the replacement component differs from
the original–even if the replacement is rated for higher voltage, wattage, etc.

9) Components that are critical for safety are indicated in the circuit diagram by shading, or .
Use replacement components that have the same ratings, especially for flame resistance and dielectric strength
specifications. A replacement part that does not have the same safety characteristics as the original might create
shock, fire or other hazards.

Copyright© 1995-2013 SAMSUNG. All rights reserved. 1-2


1. Precaution

1.2. Servicing Precautions

1) Servicing precautions are printed on the cabinet. Follow them.

2) Always unplug the unit’s AC power cord from the AC power source before attempting to :
(a) Remove or reinstall any component or assembly, (b) Disconnect an electrical plug or connector, (c) Connect a
test component in parallel with an electrolytic capacitor.

3) Some components are raised above the printed circuit board for safety. An insulation tube or tape is sometimes used.
The internal wiring may be clamped to prevent contact with thermally hot components. Reinstall all such elements
to their original position.

4) After servicing, always check that the screws, components and wiring have been correctly reinstalled. Make sure that
the portion around the serviced part has not been damaged.

5) Check the insulation between the blades of the AC plug and accessible conductive parts (examples : metal panels,
input terminals and earphone jacks).

6) Insulation Checking Procedure :


Disconnect the power cord from the AC source. Connect an insulation resistance meter (500 V) to the blades of the
AC plug. The insulation resistance between each blade of the AC plug and accessible conductive parts (see above)
should be greater than 1 megohm.

7) Never defeat any of the B+ voltage interlocks. Do not apply AC power to the unit (or any of its assemblies) unless all
solid-state heat sinks are correctly installed.

8) Always connect a test instrument’s ground lead to the instrument chassis ground before connecting the positive lead;
always remove the instrument’s ground lead last.

CAUTION

First read the “Safety Precautions” section of this manual. If some unforeseen circumstance creates a conflict between the
servicing and safety precautions, always follow the safety precautions.

1-3 Copyright© 1995-2013 SAMSUNG. All rights reserved.


1. Precaution

1.3. Precautions for Electrostatically Sensitive Devices (ESDs)

Some semiconductor (“solid state”) devices are easily damaged by static electricity.
Such components are called Electrostatically Sensitive Devices (ESDs).
Examples include integrated circuits and some field-effect transistors.
The following techniques will reduce the occurrence of component damage caused by static electricity :

1) Immediately before handling any semiconductor components or assemblies, drain the electrostatic charge from your
body by touching a known earth ground. Alternatively, wear a discharging wrist-strap device. (Be sure to remove it
prior to applying power–this is an electric shock precaution.)

2) After removing an ESD-equipped assembly, place it on a conductive surface such as aluminum foil to prevent
accumulation of electrostatic charge.

3) Do not use freon-propelled chemicals. These can generate electrical charges that damage ESDs.

4) Use only a grounded-tip soldering iron when soldering or unsoldering ESDs.

5) Use only an anti-static solder removal device. Many solder removal devices are not rated as “anti-static” (these can
accumulate sufficient electrical charge to damage ESDs).

6) Do not remove a replacement ESD from its protective package until you are ready to install it.
Most replacement ESDs are packaged with leads that are electrically shorted together by conductive foam, aluminum
foil or other conductive materials.

7) Immediately before removing the protective material from the leads of a replacement ESD, touch the protective material
to the chassis or circuit assembly into which the device will be installed.

8) Minimize body motions when handling unpackaged replacement ESDs. Motions such as brushing clothes together, or
lifting a foot from a carpeted floor can generate enough static electricity to damage an ESD.

Copyright© 1995-2013 SAMSUNG. All rights reserved. 1-4


2. Product Specification

2. Product Specification

2.1. Product Feature

■ Power
• 2.0 ch : 120 W Total RMS / 1400 W PMPO ( Front : 60 W / ch)
• TI Amp

■ Special Functions in 2012


• Total Ripping : Record all tracks of DISC, the file is copied into USB device totally.
• Bluetooth
• iPod, galaxy
• DAB (only E460D) : DAB is a new form of radio that is broadcast digitally, Digital audio provides a superior of sound
compared to regular analogue broadcasting.

■ Connectivity
• USB Host
• Bluetooth
• Galaxy & iPod
• Portable Audio In (3.5 phi Stereo Jack)
• MIC Input (3.5 phi Stereo Jack)
• AUX
• HDMI (E430D / 460D)

■ Disc
• Type : 1 Tray
• Compatible
- E430 : MP3, CD / CD-R, RW, WMA
- E430D / 460D : DVD, DVD±R, DVD±RW, MP3, CD / CD-R, RW, WMA

2-1 Copyright© 1995-2013 SAMSUNG. All rights reserved.


2. Product Specification

2.2. Specifications

2.2.1. MX-E430 Specifications

■ Basic Specification
Weight 1.95 Kg

Dimensions 230 (W) X 120 (H) X 230 (D) mm


General Operating Temperature
+5 °C ~ +35 °C
Range

Operating Humidity Range 10 % to 75 %

Signal/Noise ratio 55 dB

FM Tuner Usable sensitivity 12 dB

Total harmonic distortion 0.2 %

CD : 12 cm (COMPACT Reading Speed : 4.8 ~ 5.6 m/sec.


Disc (1 Disc)
DISC) Maximum Play Time : 74 min.

Speaker output 60 W/CH (4 Ω) x 2

Frequency range 20 Hz ~ 20 KHz

Amplifier S/N Ratio 75 dB

Channel separation 65 dB

Input sensitivity (AUX) 800 mV

NOTE

• Samsung Electronics Co., Ltd reserves the right to change the specifications without notice.
• Weight and dimensions are approximate.
• Design and specifications are subject to change without prior notice.
• For the power supply and Power Consumption, refer to the label attached to the product.

Copyright© 1995-2013 SAMSUNG. All rights reserved. 2-2


2. Product Specification

2.2.2. MX-E430D Specifications

■ Basic Specification
Weight 1.95 Kg

Dimensions 230 (W) X 120 (H) X 230 (D) mm


General Operating Temperature
+5 °C ~ +35 °C
Range

Operating Humidity Range 10 % to 75 %

Signal/Noise ratio 55 dB

FM Tuner Usable sensitivity 12 dB

Total harmonic distortion 0.6 %

Reading Speed : 3.49 ~ 4.06 m/sec.


DVD (Digital Versatile Disc)
Approx. Play Time (Single Sided, Single Layer Disc) : 135 min.
Disc (1 Disc)
CD : 12 cm (COMPACT Reading Speed : 4.8 ~ 5.6 m/sec.
DISC) Maximum Play Time : 74 min.

Y : 1.0 Vp-p (75 Ω load)


Video
Component Video Pr : 0.70 Vp-p (75 Ω load)
Output
Pb : 0.70 Vp-p (75 Ω load)

Video/Audio HDMI 1080p, 1080i, 720p, 480p(576p)

Speaker output 60 W/CH (4 Ω/100 Hz)

Frequency range 20 Hz ~ 20 KHz

Amplifier S/N Ratio 75 dB

Channel separation 65 dB

Input sensitivity (AUX) 800 mV

NOTE

• Samsung Electronics Co., Ltd reserves the right to change the specifications without notice.
• Weight and dimensions are approximate.
• Design and specifications are subject to change without prior notice.
• For the power supply and Power Consumption, refer to the label attached to the product.

2-3 Copyright© 1995-2013 SAMSUNG. All rights reserved.


2. Product Specification

2.3. Specifications Analysis

Model Name MM-E430 MM-E430D MM-E460D MM-D430D

Photo

Speaker FR/FL : 60 W FR/FL : 60 W FR/FL : 60 W FR/FL : 120 W

Tuner O O O O

AUX O O O O

USB O O O O

MIC O O O O

Video X X O O

TOUCH KEY O O O O

IPOD X O O X

REMO POD O O O X

HDMI X X O O

GALAXY O O O X

BT O O O X

TIP

O : Feature Included
X : Not Included

Copyright© 1995-2013 SAMSUNG. All rights reserved. 2-4


2. Product Specification

2.4. Disc Types And Disc Format

2.4.1. Disc types that can be played

Disc Types & Recorded Disc


Max. Playing Time
Mark (Logo) Signals Size

Approx. 240 min.


(single-sided)
VIDEO 12 cm
Approx. 480 min.
DVD-VIDEO (double-sided)

AUDIO 12 cm 74 min.
AUDIO-CD
AUDIO
+ 12 cm -
VIDEO

2.4.2. Supported Audio Formats

Format Bit Rate Sampling Frequency

MP3 80 ~ 320 kbps


44.1 khz
WMA 56 ~ 128 kbps

AC3 128 ~ 384 kbps 44.1 khz / 48 khz

2-5 Copyright© 1995-2013 SAMSUNG. All rights reserved.


2. Product Specification

2.5. Accessories

2.5.1. Supplied Accessories

Accessories Item Item code Remark

Remote Control AH59-02427A

Batteries (AAA) 4301-000115

Video Cable AH39-40001V Local Samsung Dealer

FM Antenna AH42-00021A

AH68-02457B
User’s Manual
AH68-02457C

Copyright© 1995-2013 SAMSUNG. All rights reserved. 2-6


3. Disassembly and Reassembly

3. Disassembly and Reassembly

3.1. MAIN Disassembly and Reassembly


CAUTION

• Be careful to follow the disassembly sequence described in the manual. Otherwise, the product may be damaged.

• Be sure to carefully read and understand the safety instructions before performing any work as the IC chips on
the PCB are vulnerable to static electricity.

• In order to assemble reverse the order of disassembly.

Description Description Photo

1. Separate the door.

CAUTION

Be careful not to make any scratches as you remove them.

* S CRE W SIZE INFOR MATION

(M 1.7 X 4 B)
(Screw Type) (Screw Size) (Screw Color)
M : MACHINE M1.7 x L4 B : Blac k
T : TAP TYP E W : White
S : Silver

3-1 Copyright© 1995-2013 SAMSUNG. All rights reserved.


3. Disassembly and Reassembly

Description Description Photo

2. Unfasten 7 screws of the set.


: M 3 * 10 B

3. Separate the Top panel.

4. Unconnected the wire.

TOP a n d MAIN Co n n e c te r

Copyright© 1995-2013 SAMSUNG. All rights reserved. 3-2


3. Disassembly and Reassembly

Description Description Photo

5. Unfasten 6 screws.
:M3*8W

6. Detach two hooks at the same time.

3-3 Copyright© 1995-2013 SAMSUNG. All rights reserved.


3. Disassembly and Reassembly

Description Description Photo

7. Unfasten 12 screws.
:M3*8W

8. Unfasten 4 screws.
:M3*8W

Copyright© 1995-2013 SAMSUNG. All rights reserved. 3-4


3. Disassembly and Reassembly

Description Description Photo

9. Separate the shield, BT PCB and bottom part.

10. Unfasten 4 screws.


: M 3 * 10 B

11. Separate the deck and bottom part.

3-5 Copyright© 1995-2013 SAMSUNG. All rights reserved.


3. Disassembly and Reassembly

3.2. DECK Disassembly and Reassembly

Description Description Photo

1. Separate Tray - Disc from DECK.


OP
HOOK
EN/CLOS E

Copyright© 1995-2013 SAMSUNG. All rights reserved. 3-6


3. Disassembly and Reassembly

Description Description Photo

2. Lift up Holder-Cable, separate Traverse-DECK.

HOOK

3-7 Copyright© 1995-2013 SAMSUNG. All rights reserved.


3. Disassembly and Reassembly

Description Description Photo

Holde r-Ca ble

Holde r-Chuck Holde


Tra y-
r-Ca
disble
c

Copyright© 1995-2013 SAMSUNG. All rights reserved. 3-8


4. Troubleshooting

4. Troubleshooting

4.1. Checkpoints by Error Mode

Oscilloscope Setting Values Normal Voltage 24 MHz 32.768 KHz

Voltage/DIV 1 Vol/DIV 1 Vol/DIV 1 Vol/DIV

TIME/DIV 1 uS/DIV 10 ns/DIV 0.1 uS/DIV

4-1 Copyright© 1995-2013 SAMSUNG. All rights reserved.


4. Troubleshooting

4.1.1. No Power

No P owe r

Che ck MAIN P CB No Che ck MAIN P CB No


Che ck or re pla ce S MP S .
UIC1 UBD2 5.2V. P CN1 4, 5 # : 5.2V.

Ye s Ye s

Che ck MAIN P CB No Che ck MAIN P CB No


Che ck or re pla ce S MP S .
UIC1 1 # : 5V. P CN1 4, 5 # : 5.2V.

Ye s

Check VFD voltage No


in MAIN PCB PCN1 Che ck or re pla ce S MP S .
9~11 # (5v).

Ye s

(1)
Che ck re s e t circuit in No Che ck s igna l
MAIN PC B UIC3 pa rt ok? a nd s igna l pa tte rn.

* Re fe r to wa ve pa tte rn
Ye s ima ge of Fig. 4-1.

Che ck pa tte rn or re pla ce


MICOM IC.

Copyright© 1995-2013 SAMSUNG. All rights reserved. 4-2


W ER_TOUCHKEY

4-3
50V
470PF UR27RB751V-40TE-17

VFD_CLK
VFD_CE

VFD_DO
VPR2

POW ER_ON
REMO
10KOHM
UR30
UR29
UR28
UC14A

100
D
27KOHM UD100

100NF
NF
G
H3.3V_PW

UR57
UR57
UFET1
50V S

STK7002
220PF

UC14
1/10W 1/10W

1KOHM
1KOHM
1KOHM
4. Troubleshooting

18KOHM 10KOHM

100OHM
UC60

PCR0 1

100OHM
UR50
OPEN

IC 2
DGND
50V CER3 CER2
CECR1

H5.35V_PW

220PF

100
99
98
97
96
95
100 OHM 94
93
DBGP0 92
DBGP1 91
DBGP2 90
89
88
NC87
86
85
84
83
82
81
UC61
50V
220PF

PA2
PA1
PA0
PC0
PC1
PC2
PC3
PC4
PB0
PB1
PB2
PB3
PB4
PB5
PB6

VDD3
VSS3
R1 100OHM
UR53
8 7 1 8 80

DGND
UC62

PC5/DBGP 0
PC6/DBGP 1
PC7/DBGP 2
PA3/AN12 PB7 RESET_P
6 5 2 79 8 7
PA4/AN13 P36 IPOD_VD_SW
4 3 3 78 6

VPR1
5 UR15

1/16 W
PA5/AN14 P35/URX2
2 1 4 77 4 3 100OHM
P70/INT0/T0LCP/AN8 P34/UTX2

2.7KOH M
100OHM 5 76 2 1
UC4A T_RDS 1KOHM P71/INT1/T0HCP/AN9 P33/URX1
TXD 6 P72/INT2/T0IN/T0LCP P32/UTX1
75
UR2 7 P73/INT3/T0IN/T0HCP P31/PWM5
74
RST

DGND
RES
10NF 8 RES# P30/PWM4
73
UR44

2
1
9 XT1/AN10 P27/INT5/T1IN/T0LCP/T0HCP
72 KEY_SDA
UC4
10 XT2/AN11 P26/INT5/T1IN/T0LCP/T0HCP
71NC 100OHM

Q1
Q0

1
22PF 11 70

(1)
VSS1 P25/INT5/T1IN/T0LCP/T0HCP UR17
12 69NC

32.768 HZ
CF1 P24/INT5/T1IN/T0LCP/T0HCP/INT7/T0HCP1

X_TAL1

Q2
Q3
13 68NC

UIC3
CF2 P23/INT4/T1IN/T0LCP/T0HCP 100OHM
MGND1 14 67

3
4
VDD1 P22/INT4/T1IN/T0LCP/T0HCP T_SEN(T_CE)
15 66 8 7
UIC1

DGND
C2 P80/AN0 P21/INT4/T1IN/T0LCP/T0HCP T_SDIO

DGND
100NF 16 P81/AN1 P20/INT4/T1IN/T0LCP/T0HCP/INT6/T0LCP1
65 6 5 UR18 T_CLK
17 P82/AN2 P07/T7O
64 4 3

3
18 P83/AN3 P06/T6O
63NC 2 1

1MOHM
UR56
LC87F5WC8A
19 62

X_TAL2
P84/AN4 P05/CKO M_PWM_RST
20 61 100OHM

<Fig. 4-1>
100OHM P85/AN5 P04 NC (TO MPEG)

UR5
UIC1
22KOHM 21NC 60

UR588
UR55 UR5 P86/AN6 P03

10MHZ
150OHM
22 P87/AN7 P02
59
23

(1)
UR11 P10/SO0 P01
58NC
24 P11/SI0/SB0 P00
57 T_RST
KEY_SCL
25 P12/SCK0 VSS2
56
26 55 C30
P13/SO1 VDD2

* 5.2. MAIN P CB Top


POWER_TOUCHKEY

100OHM
27
NC P14/SI1/SB1 PWM0
54NC 100NF
PU_CHECK 28 53NC
NC P15/SCK1 PWM1 NC
29 P16/T1PWML SI2P3/SCK20
52
100NF 30 P17/T1PWMH/BUZ P CN1 SI2P2/SCK2
51NC
0.01OHM
UC5
DGND
(1)

PF5
PF6
PF7

PE0
PE1
PE2
PE3
PE4
PE5
PE6
PE7
VSS4
VDD4
PF0
PF1
PF2
PF3
PF4
SI2P1/SI2/SB2

UC601
SI2P0/SO2

10V UR7

UR61
UBD2 100KOHM

M5.35V_PW
10UF

DGND
31
32
33
34
35
36
37
38
39
40
41
45
46
47
48
49
50

NC

NC
NC
UR8
43NC

100OHM
100KOHM
42 100OHM
100NF
44 100OHM
DGND

UR9

DGND
NC(IPOD_RST)

100KOHM
5
4
2
3

UD2
UR14

1N4148WS
C34

1/16W
UR60

47KOHM
UR62
47KOHM

100OHM
TC O N 1

UR63
DGND

UC10
UD1
TIP02
TIP01

GCC02-0096

UR67
UR20
10KOHM
UR19

10KOHM
10KOHM
UR12 1N4148WS

10V

* 6.5. MAIN-4
10UF

Copyright© 1995-2013 SAMSUNG. All rights reserved.


10KOH
10KOH
4. Troubleshooting

4.1.2. No Output

No output

Che ck US B P CB No Che ck MAIN P CB No


P CN1 1~2# : +22V a nd Che ck or re pla ce S MP S .
H/P OUTP UT.
5~6# : -22V.

Ye s Ye s

Che ck the IC30 working.

Che ck MAIN P CB Che ck IC30 (TAS 5342A)


No
IC30 (TAS 5342A) input a nd s igna l input a nd
output s igna l. s igna l pa tte rn.

Ye s

Che ck MICOM IC No Check signal input and signal


(UIC1) a nd MIC1 MP EG pattern or replace SMPS.
(ES S) sig na l.

Ye s

Re pla ce UIC1 a nd MIC1.

Copyright© 1995-2013 SAMSUNG. All rights reserved. 4-4


4. Troubleshooting

4.2. Measures to be taken when the Protection Circuit operates

4.2.1. Operation of Power Block Protection Circuit

■ Cases of the SMPS Protection.


1) If there is over current at the AMP IC. (Speaker Wire Short)

2) If temperature of the AMP IC is over 150 ℃.

3) There is no power supply for amp.

■ Protection Circuit operates when power problem occurs in the SMPS.


Protection
Location Pin No. Remark
Open Short

CNM802 (P9) +5.4V (9#) X X

SMPS PCB CNM802 (P1~2) +PVDD (+22V) (1~2#) X O


X : No Concern
CNM802 (P5~6) -PVDD (about -22V) (5~6#) X O
O : Concern
CNM802 (P10) +5.4VS (10#) X O

CNM802 (P7) -5V (7#) X X

4-5 Copyright© 1995-2013 SAMSUNG. All rights reserved.


4. Troubleshooting

4.2.2. Check AMP in Power Protection

If you think, there are problems at the AMP Part, you can check the PCB without disassembling the set.

CAUTION

Do not connect the power cord during bellow check!

Measurement Resistance using Tester

R CH 2 kΩ

L CH 2 kΩ

If Measured Resistance is very different from above


numbers, There is a Problem.
→ AMP Part Problem

S ET 2CH S P EAKER OUT

RIGHT

GND

LEFT

Copyright© 1995-2013 SAMSUNG. All rights reserved. 4-6


4. Troubleshooting

4.3. MICOM, MPEG Initialization & Update

■ Micom Reset & MPEG Reset


• During “No Disc” Displayed, push the ‘STOP’ button 5 Second, After displayed ‘INITIALIZE’ set will power off
automatically.

■ Micom Update (Only for Flash Micom)


• Method 1) MAIN PCB CN1 for update JIG. To update MICOM, it need Computer, Rom Writer, USB Cables.
• Method 2) Insert USB Memory, and play. ‘Updating’ will be displayed. Set will be power off when finish.

■ Micom & MPEG Version Check


1) Power On.

2) CD open status.

3) Push the number NEXT for 5 seconds, check the MICOM version.

4) Push the number PREVIOUS for 5 seconds, check the MPEG version.

■ MPEG Update
1) Prepare Rom file at USB Memory.

2) Insert USB Memory, and play. “Update” will be displayed. Set will be power off → on

3) The disc is automatically ejected. (If you use USB memory, detach USB memory)

4-7 Copyright© 1995-2013 SAMSUNG. All rights reserved.


4. Troubleshooting

4.4. Buyer-Region Code Setting Method

4.4.1. The inserting method of Region Code after replacing the Main PBA

NOTE

• When replacing the Main PBA and System Micom should be inserted the region code.

• The set is not working properly if you don't insert the region code.

• The region code is inserted by the remote control.

1) Press “FUNCTION” button several times to change to AUX mode.

FUNCTION

SOUND DISC SKIP

EQ DVD

1 2 3
DISC MENU TITLE MENU

4 5 6
SYNC
<MM-E430> <MM-E430D>

2) MM-E430 : Push the “ENTER” button on remocon 10 Second.


MM-E430D : Push the “D” button on remocon 10 Second.
TUNING

TOOLS INFO

RETUR N EXIT

DISPLAY MO/ST TUNING


A B C D
CD REC TIMER TIMER S LEEP
SPEED ON/OFF CLOCK

<MM-E430> <MM-E430D>

Copyright© 1995-2013 SAMSUNG. All rights reserved. 4-8


4. Troubleshooting

3) When displayed “TEST–” , input 46 to set the buyer.

TES T − −
4) When displayed “− − −”, input the buyer code.
The buyer setting code can find in the table named “E430, 430D OPTION Table”.

−−−
5) It will show the buyer that you set up.
Then the buyer setting is succeed.

4-9 Copyright© 1995-2013 SAMSUNG. All rights reserved.


4. Troubleshooting

Table 4.1 MM-E430 Option Table

Region Code Buyer

00 Africa, Pakistan

01 BRAZIL

02 CANADA

03 China (semi_mic)

04 Europe

05 Indonesia, HONGKONG

06 JAPAN

07 KOR

08 Latin American

09 Mexico

0A Philippines

0B Russia (full_mic)

0C Russia (semi_mic)

0D South Africa

0E Taiwan

0F USA

10 Newzealand

11 England

12 Australia

13 Iran (HACO)

14 India

15 Israel

16 Middle Asia

17 Asia

18 Singapore

Copyright© 1995-2013 SAMSUNG. All rights reserved. 4-10


4. Troubleshooting

Table 4.2 MM-E430D Option Table

Region Code Buyer

1E Africa, Pakistan

1F BRAZIL

20 CANADA

21 China (semi_mic)

22 Europe

23 Indonesia, HONGKONG

24 JAPAN

25 KOR

26 Latin American

27 Mexico

28 Philippines

29 Russia (full_mic)

2A Russia (semi_mic)

2B South Africa

2C Taiwan

2D USA

2E Newzealand

2F England

30 Australia

31 Iran (HACO)

32 India

33 Israel

34 Middle Asia

35 Asia

36 Singapore

4-11 Copyright© 1995-2013 SAMSUNG. All rights reserved.


4. Troubleshooting

Table 4.3 MM-E460D Option Table

Region Code Buyer

3C Africa, Pakistan

3D BRAZIL

3E CANADA

3F China (semi_mic)

40 Europe

41 Indonesia, HONGKONG

42 JAPAN

43 KOR

44 Latin American

45 Mexico

46 Philippines

47 Russia (full_mic)

48 Russia (semi_mic)

49 South Africa

4A Taiwan

4B USA

4C Newzealand

4D England

4E Australia

4F Iran (HACO)

50 India

51 Israel

52 Middle Asia

53 Asia

54 Singapore

Copyright© 1995-2013 SAMSUNG. All rights reserved. 4-12


5. PCB Diagram

5. PCB Diagram

5.1. Wiring Diagram


R FC N 2 R FC N 1 U CN 1 JK C N
D E `W S M P B E Q `E D M P B E Q `E D D E `W S E H O E E H O E
N QE M P B E O `E D M P B E O `E D N QE V T C `D P O `E Q V T C `D P O `E Q
D E `M E P T M F E `O T M F E `O D E `M E P V T C `D P O `E N V T C `D P O `E N
M E `H O E T M F E `Q T M F E `Q M E `H O E E H O E E H O E
TX JO T X JO T X TX E H O E E H O E
G P D V T `O P V UTX P V UTX G P D V T `O N JD ! ` T JH N JD ! ` T JH
U S B D L `O E H O E E H O E U S B D L `O E H O E E H O E
U S B D L `Q E D M P B E `Q E D M P B E `Q U S B D L `Q N JD ` T F O T F N JD ` T F O T F
G P D V T `Q E D M P B E `O E D M P B E `O G P D V T `Q I Q `S I Q `S
C C I Q `M I Q `M
D D I Q `T F O T F I Q `T F O T F
E E G `I Q `N V U F G `I Q `N V U F
B B V T C 6 W `Q X V T C 6 W `Q X
F F V T C 6 W `Q X V T C 6 W `Q X
G G B , 6 W `Q X B , 6 W `Q X
S G 6 W `Q X S G 6 W `Q X
N W S FG N W S FG J A C K !P C B
H O E H O E
E W E `W S E W E `W S
H O E D EC K H O E SM PS
E W E ME P E W E ME P CN M 852 CN M 853
QV I SG QV I SG E H O E N 6 /4 6 W ` Q X
S G 6 W `Q X S G 6 W `Q X S FN P E H O E
W G E `D F W G E `E P
W G E `D ML W G E `D M L
W G E `E P W G E `D F
G CN 1 TCO N 1 PCN 1 N 2 3 W `Q X .W Q
N 6 /4 6 W ` Q X N 6 /4 6 W ` Q X E H O E , Q W E E , 3 6 W `Q X .W Q
E H O E E H O E S FN P , Q W E E , 3 6 W `Q X .W G E
JQ P E ` H B M B Y Z ` Q X S JQ P E ` H B M B Y Z ` Q X S W G E `D F N 6 /4 6 W ` Q X .W G E
JQ P E ` H B M B Y Z ` Q X S JQ P E ` H B M B Y Z ` Q X S W G E `D M L N 6 /4 6 W ` Q X , W GE
E H O E E H O E W G E `E P E H O E , W GE
E H O E E H O E N 2 3 W `Q X E H O E E H O E
S U B _2 E H O E E H O E , Q W E E , 3 6 W `Q X FD P S FN P
MFE 3 MFE 3 , Q W E E , 3 6 W `Q X
E H O E E H O E N 6 /4 6 W ` Q X
V T C ` JQ P E ` E Q V T C ` JQ P E ` E Q N 6 /4 6 W ` Q X
V T C ` JQ P E ` E N V T C ` JQ P E ` E N E H O E
E H O E E H O E E H O E
TO U CH CN 2 E H O E E H O E FD P
TE B JQ P E ` W JE F P JQ P E ` W JE F P FC N 1
TDM Q P X F S `U P V D I L F Z Q P X F S `U P V D I L F Z N 6 /4 6 W ` Q X
I 4 /4 W ` Q X L F Z `T D M L F Z `T D M E H O E
S FTFU S FTFU S FTFU W G E `E P
E H O E L F Z `T E B L F Z `T E B W G E `D M L
MFE D MFE 2 MFE 2 W G E `D F
MFE D 4 E H O E E H O E V FD .W Q
.W Q
M A IN .W G E
.W G E
CN 2 , W GE
TE B , W GE
TDM E H O E
I 4 /4 W ` Q X T O U C H K E Y !S U B _ 1 S FN P
S FTFU
E H O E
MFE D
MFE D 4

5-1 Copyright© 1995-2013 SAMSUNG. All rights reserved.


5. PCB Diagram

5.2. MAIN PCB Top

FAN E TC N 1 HDC N 1 TUCN 1

B TC N 1
R F IC 1

IC 3 0
MIC1

AIC 1

UIC 1 TC O N 1 (5)
MIC 2
(4)
RFCN1

IC 2

UCN1
(1) U IC 3
PCN1
RFCN2

(3)
(2)
TP 1

Copyright© 1995-2013 SAMSUNG. All rights reserved. 5-2


5. PCB Diagram

5.2.1. Pin Connection

1) RFCN1 3) PCN1 5) TCON1


Deck Control (Focus/Data) MAIN PCB All power control GALAXY/IPOD control

Pin No. Signal Pin No. Signal Pin No. Signal


1 CD_VR 1 DGND 1 M5.35V_PW
2 MPD 2 REMO 2 DGND
3 CD_LDO 3 VFD_CE 3 IPOD_GALAXY_PWR
4 LD_GND 4 VFD_CLK 4 IPOD_GALAXY_PWR
5 SW 5 VFD_DO 5 DGND
6 FOCUS_N 6 M12V_PW 6 DGND
7 TRACK_N 7 +PVDD+25V_PW 7 DGND
8 TRACK_P 8 +PVDD+25V_PW 8 LED2
9 FOCUS_P 9 M5.35V_PW 9 DGND
10 B 10 M5.35V_PW 10 USB_IPOD_DP
11 C 11 DGND 11 USB_IPOD_DM
12 D 12 DGND 12 DGND
13 A 13 ECO 13 DGND
14 E 14 IPOD_VIDEO
15 F 4) UCN1 15 POWER_TOUCHKEY
16 RF5V_PW MIC/Head_phone/USB control 16 KEY_SCL
17 MVREF Pin No. Signal 17 RESET
18 GND 1 DGND 18 KEY_SDA
19 DVD_VR 2 USB_CON_DP 19 LED1
20 GND 3 USB_CON_DM 20 DGND
21 DVDLDO 4 DGND
22 PUHRF 5 DGND
23 RF5V_PW 6 MIC _SIG
7 DGND
2) RFCN2 8 MIC_SENSE
Deck Control (SP/SL) 9 HP_R
Pin No. Signal 10 HP_L
1 LOADP_DC 11 HP_SENSE
2 LOADN_DC 12 F_HP_MUTE
3 SLED_N 13 USB5V_PW
4 SLED_P 14 USB5V_PW
5 INSW 15 A+5V_PW
6 OUTSW
7 DGND
8 DCLOAD_P
9 DCLOAD_N

5-3 Copyright© 1995-2013 SAMSUNG. All rights reserved.


5. PCB Diagram

5.2.2. Test Point Wave Form

TP1

Copyright© 1995-2013 SAMSUNG. All rights reserved. 5-4


5. PCB Diagram

5.3. MAIN PCB Bottom

5-5 Copyright© 1995-2013 SAMSUNG. All rights reserved.


5. PCB Diagram

5.4. FRONT PCB Top

FCN1

Copyright© 1995-2013 SAMSUNG. All rights reserved. 5-6


5. PCB Diagram

5.5. FRONT PCB Bottom

5-7 Copyright© 1995-2013 SAMSUNG. All rights reserved.


5. PCB Diagram

5.6. JACK PCB Top

JK C N

(1)

Copyright© 1995-2013 SAMSUNG. All rights reserved. 5-8


5. PCB Diagram

5.6.1. Pin Connection

1) JKCN
MIC/Head_phone/USB control

Pin No. Signal

1 DGND

2 USB_DP

3 USB_DN

4 DGND

5 DGND

6 MIC_SIG

7 DGND

8 MIC_SENSE

9 HP_R

10 HP_L

11 HP_SENSE

12 F_HP_MUTE

13 USB_5V

14 USB_5V

15 A5V

5-9 Copyright© 1995-2013 SAMSUNG. All rights reserved.


5. PCB Diagram

5.7. JACK PCB Bottom

Copyright© 1995-2013 SAMSUNG. All rights reserved. 5-10


5. PCB Diagram

5.8. TOUCH KEY PCB Top

TIC1

CN2

GC N1

CN1

(1) TO U C H C N2

5-11 Copyright© 1995-2013 SAMSUNG. All rights reserved.


5. PCB Diagram

5.8.1. Pin Connection

1) TOUCHCN2
Touch key control

Pin No. Signal

1 SDA

2 SCL

3 H3.3V_PW

4 RESET

5 DGND

6 LEDC

7 LEDC3

Copyright© 1995-2013 SAMSUNG. All rights reserved. 5-12


5. PCB Diagram

5.9. TOUCH KEY PCB Bottom

5-13 Copyright© 1995-2013 SAMSUNG. All rights reserved.


5. PCB Diagram

5.10. SMPS PCB Top

(2)

C N M8 5 3
C N M8 5 2

(1)

Copyright© 1995-2013 SAMSUNG. All rights reserved. 5-14


5. PCB Diagram

5.10.1. Pin Connection

1) CNM852
MAIN PCB All power control

Pin No. Signal


1 DGND
2 REMO
3 VFD_CE
4 VFD_CLK
5 VFD_DO
6 M12V_PW
7 +PVDD+25V_PW
8 +PVDD+25V_PW
9 M5.35V_PW
10 M5.35V_PW
11 DGND
12 DGND
13 ECO

2) CNM853
VFD/Remocon_eye control

Pin No. Signal


1 M5.35V_PW
2 DGND
3 VFD_DO
4 VFD_CLK
5 VFD_CE
6 -VP
7 -VP
8 -VFD
9 -VFD
10 +VFD
11 +VFD
12 DGND
13 REMO

5-15 Copyright© 1995-2013 SAMSUNG. All rights reserved.


5. PCB Diagram

5.11. SMPS PCB Bottom

IC A8 5 2

IC A8 5 3

IC M8 0 1 5

Copyright© 1995-2013 SAMSUNG. All rights reserved. 5-16


6. Schematic Diagram

6. Schematic Diagram

6.1. Overall Block Diagram

• The Micom IC is LC87F5WC8A, 100P, MPEG IC is ES8398ASCD, same with 2011 year (MM-D470D).

Mic om Tu n er Con trol


• The Micom IC controls the set.
Up d a te
DVD
DVD/CD
D/C D Tu n er Con trol • IR AMP ICs are IRS4301.
En g in e To uchKe y
LC 87F5W • Audio signal comes from CD DECK, Ipod, Galaxy, TUNER, AUX, MIC and so on, decoded and convert to analogue signal

0
S OLT Me cha

0
AM5766 P T 6315
Mo t o r Driv e 8K- EEPROM F ro nt Micom VF D Driver VFD by MPEG IC.
S a nyo
0
• The signal is sent to the Crystal amplification circuit through MPEG IC.
8K- EEPROM F ro n t E n d F ro nt This Crystal amplification circuit is Low Pass Filtered.
0 0

u Co m DVD Op tion
Sound will be hear by Connecting the Speaker system.
0 0
2M F las h CVBS (S c a rt)
Con trol
Vid eo Y Pb Pr
128M 4 - Da c Vid eo
DRAM E S S_P3C (839 8A HDMI C EC Option
0

0
S C D)MPEGC hip
USB POWER
S MPS
S WTICH U SB H OST
I- P OD
iP OD o ver us b
0 0

FL
DAB OP TION Con trol TAS5342A
FM
0 FR
0

F u n c tion Au d io
In p u t De c od er He a d ph on e
ADC DAC O P AMP
H/P
Mic AMP
TR

6-1 Copyright© 1995-2013 SAMSUNG. All rights reserved.


6. Schematic Diagram

6.2. MAIN-1

POWER
ON-BOARD FM(WW)
AUDIO E3.3V_PW
T_RDS
VIDEO

100OHM
TUR6

0OHM
TUR3
10KOHM

TUR7
SI4705-D60-GMR

40.2KOHM
20
19
18
17
16
IC13

6V
MM-DG36 TUNER ANT JACK

0 NF 116V
DGND
1

TUC8
TUR9
GPO3/DCLK
MGND1GPO1
NC

DFS
GPO2/INT-

110NF
MGND2
MGND3
18PF 50V
1
2
NC DOUT
15
14
1/16W
100O HM
TUR122
TUR1
10V
10UF
TUC2 1
HDMI ARC CIRCUIT
TUCN1 FMI LOUT TUNER_L
TUC16
3 13 TUC2 2
TUNER_R

18PF 50V

TUC17
RFGND ROUT
MGND1 4 12

270NH

TUC11
VT1
10V

TL1
LPI GND TUR1 3
5 11

10NF
100O HM 10UF

16V
/RST VDD

10UF 10V
DGND

TUC12
40.2KOHM

RCLK
SCLK
SDIO
/SEN
HDC4 HDR8 1/10W

VIO
1UF 47OHM 100NF 330O HM

LOPIVA16G05
E3.3V_PW HEAC+ HARC
DGND 1/16W HDC8 HDR6

6
7
8
9
10
TUR18
HDMI_HPD

100OHM 1/16W
DGND
32.768HZ HDC5

100OHM
1UF

2
4
6
8
TUX1

100OHM

HDR9
HDR14
100NF 10V

10UF 10V

HDR13

HDR10
1/16W
100OHM

1/16W
HDR13
TUC14
TUC13

100OHM
10UF 10V
1 4

1/16W
TUC20
1/16W
Q0 Q3

DGND

1
3
5
7
2 Q1 Q2 3

TUR17

HDR11
HDR12

10OHM
10OHM
22PF 50V

1/16W
1/16W
22PF 50V
DGND

C1
C29
T_SDIO MP1.35V_PW
T_CLK
T_SEN
T_RST

7
5
3
1
DGND

10KOHM
TUR16
8
6
4
2
VD3.3V_PW HDMI OUT 1
MGND4
MGND2

TS5A23159RSER
2
COMPOSITE AOZ8804DI 3
10

VR5OPEN HDD2 4
DVD VIDEO OPTION IPIC2
0OHM 10 1 5
COM1

OUT_LINES
1 9 TX2P IN_LINES
6
IPO D_VD_SW IN1 NC1 CVBS1 9 2
2 8 TX2N 8
OUT_LINES IN_LINES
IN_LINES
3 7
IPO D_VIDEO 3
NO1 V+
7 GND GND
GND NC2 7 4 8
VTP_PB 4 6 TX1P OUT_LINES IN_LINES
9
VC8 NO2 COM2 C46 6 5
100NF

TX1N
IN2

OUT_LINES IN_LINES
10
10V

10P F 50V VBD3

HDCN1
0.01OHM TP TP 11
5

UDAC AUX_L AUX_R 12


DGND
13
DGND
75OHM
VR3

VC7

14
VC9

VL3
150PF

150PF
1/10W

50V
50V

1.8UH IPOD _VD_SW HEAC+


AUR6R 15
DGND H 220O HM 16
IPOD VIDEO 1/10W
AUX2_R 17
VTP_Y AUR6L
AOZ8804DI 18
L COMP O VIDEO 220O HM 19
DGND VC5 AUX2_L 1/10W HDD1
10P F 50V VBD2

50V
0.01OHM AUR7L

AUC5L
10 1

AUR7R
MGND3
MGND1

AUC5R
47KOHM
YDAC 47KOHM TX0P
9
OUT_LINES IN_LINES
2

220PF

220PF
VT13
12

VT12
1/10W

1/10W
TX0N DGND

50V
OUT_LINES IN_LINES
IN_LINES

12
8 GND GND
3
75OHM

VC4

VC6
VR2

VL2 7 4
150PF

150PF
1/10W

50V

TXCP DGND
50V

OUT_LINES IN_LINES
1.8UH L R 6 5
TXCN OUT_LINES IN_LINES

HDMI_HPD

47KOHM
VJK1 DGND DGND

HDR3
VTP_CVBS
DGND VC2 DGND HDMICEC
10P F 50V VBD1 HDD3
COMP

0.01OHM D5V_PW H5.35V_PW


PR
PB

11
Y

VDAC CVBS1 6 OUT_LINES


OUT_LINES IN_LINES
5
9 OUT_LINES IN_LINES

HANTID1
7 4

15KOHM
7
75OHM

BAT54A

1OHM
VC1
VR1

VL1
150PF

VC3

1/10W
150PF
1/10W

GND

HDR5A
50V

GND
50V

8 3
1.8UH C 5

HDC2

10V
OUT_LINES IN_LINES

HDR4

4.7UF
10KOHM
3 11. AUX_R 9 2
9.AUX_L
IN_LINES HDIC1

HDR6A
10 OUT_LINES 1
1 DGND
12 7.CVBS 1 5
U 2
IN OUT

1.8KOHM
12. PB
AOZ8804DI

1.8KOHM
VTP_PR 10

HDR1
DGND GND

HDR2
VC11 0 Y 8 10. PR STK7002 3 EN ADJ
4
10P F 50V VBD4 RCLAMP0502B.TCT 8.Y HDQ1
0.01OHM 6
V VT8

HDC1
HDR5
4 DSCL DGND DGND AP7311-WG-7
COMPOSITE

4.7UF
10V
STK7002

S
CDAC
0 2 HDQ2

G
VC12
75OHM

VC10
VR4

VL4
150PF

150PF
1/10W

50V
50V

DSDA

1.3KOHM
1.8UH

D
RCLAMP0502B.TCT
DGND

S
VD3.3V_PW

G
AUXCN1

10UF 10V
DGND VT9

HDC11
DGND DGND
4
2
3
1
DGND

DGND

Copyright© 1995-2013 SAMSUNG. All rights reserved. 6-2


6-3
POWER
6.3. MAIN-2
6. Schematic Diagram

TPBT2
TPBT5
TPBT4

TPBT1
TPBT3

BT5V
UART_TX
UART_RX
BT_GND
BT_RST
SPINDLE

SLEGN
FOC US

TRACK
MGND2
470NF

MGND1
10V C31

RAS2_P
S_P_OPTION
MA0
MA1
MA2
MA3
MA9
MA8

OTP
C67

RAS1_P

BTCN1
MA10
MA11
DGND

USB_DP

MA7
MA6
MA5
MA4

OPOUT
10UF

USB_DM

1
2
3
4
5
6
10NF C69
C71 10V
2.2KOHM
50V

DGND
50V

R105
R103
R57
R56
DGND
10PF 50V 100PF C37

RF3.3V_PW
BTR3 10NF 50V C80
1/16W 10NF
BTC1 4.7KOHM
50V C81 100NF

R112
R108
10PF

R60
BTR4 10V

MA12
1/16W

TP
VREG
1KOHM
1KOHM
BTC2 4.7KOHM

C
B

D
A

1.2KOHM
1.2KOHM
MIN
PUHRF

MVREF

DGND
BTR5

VD3.3V_PW
VD3.3V_PW

33OHM
33OHM
10V

100OHM
10UF

MPD

0.25O HM

BTBD3

DGND
BTC3

R97
4.7KOHM
10V

VD3.3V_PW

0.25O HM
100NF

BTBD2
10V 10UF
C61
C62

RAS0_P(PLL2)
CAS_P(PLL3)
BTC4

DWE_P(PLL1)
PLL0
33OHM
100NF 10V

BTBD4
0.25O HM
DGND
100N

RMA12_O PEN
10V
10V

C79
C77
C76
C72
DGND7.5KOHM
R137
C68
C64
C65
C43

100N
100NF

10V 100NF
50V

F
100NFF 10V

100NF
10V

10V
10V
10V
10V
50V 680P F
C82

C74

10V
C84

100NF
100NF
100NF
100NF
100NF
100NF

BT_RST
UART_TX
UART_R X
216
215
214
213
212
211
210
209
208
207
206
205
204
203
202
201
200
199
198
197
196
195
194
193
192
191
190
189
188
187
186
185
184
183
182
181
180
179
178
177
176
175
174
173
172
171
170
169
168
167
166
165
164
163

C83
RF3.3V_PW

0.01OH M
10V 10UF

BTBD1
1/16W
33OHM
H
G
F
E
D
C
B
A
DGND

VSS
VDD
VDD
VDD
VSS
TRO
SLO
FOO
DMO
SLV
MIN
VGA
VPA

VS33
VD33
VD33
DVCC
REFD
CDPD
DRFP
DRFN

10V C85 100NF

AVS33
AVD33
470KOHM

DCS1_B
DMA[0]
DMA[1]
DMA[2]
DMA[3]
DMA[9]
DMA[8]
MDA[7]
DMA[6]
SYSCLK
DMA[5]
DMA[4]
USB_DP
USB_DM

DRAS1_B
DRAS2_B
DMA[10]
DMA[11]

RF5V_PW
USB_AGND
USB_VCCA
USB_RREF
USB_VDDA
1 1 2 DSC0_B SPNP
162 R114 MVREF
CSO_P

VREG_FORCE
2 3 4 161 R115

R23
RAS0_P(PLL2) DRAS0_B SPNN 10KOHM MOCTL
3 5 6 DCAS_B AGC1
160 C86
CAS_P(PLL3)
4 7 8 DWE_B AGC2
159 50V
DWE_P(PLL1) 100PF
DGND

5 158 C87
VSS DVDPD 100PF MPD
33OHM R117 50V 6 157
DSCK 10V DSCK VBO MVREF
10PF C88 7 156 10PF
R118 VDD CDLD CDLD
50V 10V
100NF8 155 50V
DQM C102 DQM DVDLD DVDLD
100NF
1/16W C89 9 154 10KOHM
22NF R116 C90
33OHM VD33 REX MIN
33OHM 10 VS33 PI
153 50V C92
DB7
1 2 11 DB[7] V165O
152 DA
DB6
3 4R26 12 DB[6] FE
151
5 6 13 DB[5] TE
150
DB5
7 81/16W 14 DB[4] MB
149 50V
4.7NF 1NF C98
DB4
33OHM 15 VSS DB
148 10V
50V C99
1 2 16 147 100NF C101
DB3 DB[3] MP
3 4R29 17 146 10V C94
DB2 DB[2] VGB
5 6 18 145 100NF C103 C97
DB1 DB[1] VPB 100NF 10V
7 81/16W
10V 19 DB[0] OPEN/VOBS
144 100OHM R119
DB0 OPEN 1UF
R30 20 VDD OPENSW
143 100OHM R120
INSW
33OHM1 2 100NF C91 21 DB[8] CLOSE/VOBS1
142 100OHM R121
DB8 CLOSE
3 4 22 DB[9] CLOSESW
141 100OHM R122
DB9 OUTSW
5 6 23 140 100OHM R123
DGND

DB10 DB[10] AMPSTBY DRV


7 24 DB[11] SR[32]
139 1/16W
DB11
8 10V C93
25 138 33OHM BTR1
100NF VD33 SOUT UART_TX
C107

1/16W 26 137 BTR2


VS33 SIN UART_RX
100NF

1 233OHM 27 DB[12] VS33


136
DB12 R43
C108

3 4 28 135 33OHM
VD3.3V_PW

DB[13] VD33
100N

DB13 1/16W
5 6 29 DB[14] VDD
134
DB14
7 8 30 133100OHM R135 0.01OHM
MIC1

DB15 DB[15] HDMI_CEC DVD_CD 10UFC105


MP1.35V_PW

10V
100NFF 10V

31 VSS VSS
132 10V
DGND
1/16W 32 131 100NF
100NF AUX[7] HDMI_PGND2 50V
10V 33 130 C106
10KOHM 2.7KOHM RL2 AUX[6] HDMI_PVCC2 0.01OHM
RPD1 C36 34 129 10UFC109
VDD HDMI_AGND 10V BD9
35 128 100NF
ES8398ASCD

AUX[5] HDMI_TX2+ TX2P 10V


36 127

DGND
RXD 100NF AUX[4] HDMI_TX2- TX2N C33
M_PWM_RST 10V 37 AUX[3] HDMI_AVCC
126 BD10
2.7KOHM C119 38 125
VD33 HDMI_TX1+ TX1P
DGND 39 124
D15 VS33 HDMI_TX1- TX1N 100NF
40 123 C112 10V
RESET_P RESET_B HDMI_AGND
1KOHM R138 41 AUX[2] HDMI_TX0+
122 10UF
TX0P 0.01OHM
I2C_SCL R140 33OHM 42 AUX[1] HDMI_TX0-
121 10V

VD3.3V_PW
TX0N
I2C_DAT R141 33OHM 43 AUX[0] HDMI_AVCC
120 C113
R96 4.7KOHM 44 119
SPI_CS2 HDMI_TXC+ TXCP
45 118 470OHM BD11
SPI_CS3 HDMI_TXC- TXCN
R143 150OHM 46 117
SPI_CLK SPI_CLK HDMI_AGND R109
47 VSS EXT_SWING
116 R144
R145 33OHM 48 115 0.01OHM
SPI_DI 100NF SPI_DI HDMI_PVCC1 0OHM
R67 33OHM 49 114 C114 10V
SPI_DO 10V SPI_DO HDMI_PGND1
50 VDD HDMI_OTP_VPP
113 10UFC115 100NF
2.2KOHM 51 112 BD12
10V
VD3.3V_PW

BT_RST BTC5 SPDIF_OUT VSS_DFG_PLL


MPPU1 52 111
SPDIF_IN VDD_DFG_PLL
53 VS33PLL VD33
110 68OHM
54 VD33PLL VS33
109 R152
C122

DGND
C117 10V
10UF 100NF 10V
VS33
OP[5]
OP[6]
OP[7]
VDD
VSS
MCLK
VS33
VD33
PAD_REF
PAD_COMP
PAD_RSET
UDAC
VDAC
VD33VDAC
VS33VDAC
YDAC
CDAC
VD33
DAC_O1L
DAC_O2L
DAC_O2R
VD33ADAC
VS33ADAC
DAC_O3L
DAC_O3R
DAC_O1R
LINE_OL
LINE_OR
VS33AADC
MIC_R
MIC_L
VDDAADC
LINE_IN_R3
LINE_IN_L3
LINE_IN_R2
LINE_IN_L2
LINE_IN_R1
LINE_IN_L1
VD33AADC
VSS
VID_XO
VID_XI
VDD
HDMI_HPD
HDMI_HEAC
HDMI_DSDA
HDMI_DSCL

OP[0]
OP[1]
OP[2]
OP[3]
OP[4]
VD33

R155
33OHM
100NF C116
10V 100NF 10V
C7 10UF 10V
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
86
87
88
89
90
91
93
94
95

85
100
101
102
103
104
105
106
107
108

R187
R186

4.7KOHM R150
DGND

R151 C118
R153
4.7KOHM
DGND
R154 120OHM 10OHM
10OHM
96 R169
97 R168
98 R167
99 R166

4.7KOHM

MP1.35V_PW

R163
VD3.3V_PW

BD13

10KOHM
C124
92 4.7KOHMC125

PWR2
PWR1

C123
10V
10V

DGND

0.01OHM

VD3.3V_PW
DGND

4.7KOHM
4.7KOHM
4.7KOHM
4.7KOHM

RSTB1 4.7KOHM
10UF10UF

100NF 10V
UNDEFINED
DGND
MP1.35V_PW

CB2012UA300T

RTXD1 4.7KOHM
100OHM
100OHM

VDAC
10V

YDAC

SPI_CS
UDAC
CDAC

VD3.3V_PW

SPI_CS3

1/16W
C129
C128

C39
C38
R159

2.7KOHM
TP_MCLK
10V

10V
HARC

R165
DSCL

C17

RL1
DSDA

TP C134
C137
C139

10V

100KOHM
33OHM

10V

R164
10UF
10UF
10UF
10UF

10V

10V
HDMI_HPD

100NF

100NF
10V
100NF
100NF
OPLCH
OPRCH
C42
C41

X3

STB

TXD
ACK
390OHM
27MHZ

M_WP
50V
50V

27P F
27P F

VD3.3V_PW
MIC_SIG
AK27012013

AUX2_L

100NF
AUX2_R

IPOD_CP_RST
TUNER_L
TUNER_R

10V
C910V 100NF
C51 10UF DGND
C126 10V C18 C136
DGND

C45 DGND
MP1.35V_PW

100NF
DGND

100NF 10V
DGND

100NF 10V
DGND
VD3.3V_PW
BD15
1/10W
0OHM

10V
1/16W
BD14

R139
22O HM
0.01OHM

MP1.35V_PW

C135
DGND

220UF
16V
VD3.3V_PW

Copyright© 1995-2013 SAMSUNG. All rights reserved.


6. Schematic Diagram

6.4. MAIN-3

POWER
C11 10UF
VD3.3V_PW SDRAM
10V

0.25OHM

0.25OHM
MFL6

MFL7
K4S281632F-TC60
MIC2
10V
C12 100NF 1 VDD VSS
54
DB0
2 DQ0 DQ1 5
53 DB15 PLL2 PLL1 PLL0 MULTI FRE Q
C13 100NF 10V 3 VDDQ VSSQ
VSSQ
52
4 51 0 0 0 BYPASS N/A
DB1 DQ1 DQ1 4 100NF DB14
DB2
5 DQ2 DQ1 3
50 10V DB13
6 VSSQ
VSSQ VDDQ
49 C22 0 0 1 4.5 121.5
7 48
SPI FL ASH VD3.3V_PW DB3
DB4
C14 100NF 10V
8
9
DQ3
DQ4
VDDQ
DQ1 2
DQ1 1
VSSQ
VSSQ
47
46
DB12
DB11 0 1 1 4.75 128.25
1 0 0 5.0
& DB5
DB6
10
11
DQ5
DQ6
DQ1 0
DQ9
45
44
100NF
10V
DB10
DB9
135

12 43 C21 1 0 1 5.75 155.25


EEPROM

BAT54C
VSSQ
VSSQ VDDQ
DB7
13 DQ7 DQ8
42 DB8 1 1 0 162

D17
14 41

30
C15 100NF 10V 6.0
VDD VSS
DQM
15 LDQM NC
40
GND 2.2KO HM DWE_P(PLL1)
16 /WE UDQM
39 DQM 1 1 1 5.5 148.5
1/10W
CAS_P(PLL3)
17 /CAS CLK
38 DSCK
RR01 18 37 R9 4.7KOHM
RAS0_P(PLL2) /RAS CKE
IC7 CSO_P
19 /CS NC
36 MA12
C138 100NF 20 35 PLL3
SPI_CS 1 8 RAS1_P A13 A11 MA11 CLK SOURCE
/CS 10V 21 34
2 VCC
7 RAS2_P A12 A9 MA9 0 CRYSTAL OSC
SPI_DI
3
DO(IO1 )
/HOLD(IO3)
6 MA10
22 A10/AP A8
33 MA8
4
/WP(IO2 )
CLK
5 SPI_CLK
MA0
23 A0 A7
32 MA7
GND SPI_DO 24 31 DCLK INPUT
DI(IO0)
MA1 A1 A6 MA6 1
MA2
25 A2 A5
30 MA5
W25Q16B VSSIG 26 29
DGND MA3 A3 A4 MA4
C16 100NF 10V 27 VDD VSS
28
OTP

0
NORMAL MODE
DGND DGND
DGND DGND
DGND
DGND DGND TEST MODE
DGND 1
VD3.3V_PW
VD3.3V_PW
S_P S_P_OPTION
820OHM
R32 0 NORMAL MODE
MRUP1

RR50
2.2KOHM

2.2KOHM

ER1
R84

R70
1.5KOHM

R64

R69
IC8 1 TEST MODE

4.7KOHM

4.7KOHM

4.7KOHM

4.7KOHM
1 NC VCC
8
2 NC /WC
7 M_WP
3 E2 SCL
6 I2C_S CL
4 VSS SDA
5 I2C_DAT
PLL0
S-24CS08AFJ -TB-1G E DWE_P(PLL1)
RAS0_P(PLL2)
CAS_P(PLL3)
DGND OTP
S_P_OPTION

R258
R74
4.7KOHM

4.7KOHM
15PF

15PF

15PF

15PF
50V

50V

50V

50V
RC48

EC12
R51

R71
DGND

BACKEND J IG CON NECTORSPI_CLK


VD3.3V_PW
SPI_CS SPI_DI SPI_DO
SPI_CSA

SPI_CLKA
SPI_DIA
SPI_DOA

SPI_CS3
SPI_CLK
SPI_DI
VD3.3V_PWA

SPI_DO R197

10KOHM

VD3.3V_PW

Copyright© 1995-2013 SAMSUNG. All rights reserved. 6-4


6. Schematic Diagram

6.5. MAIN-4

POWER
MM-E430D MICOM PART FANET_TX
FANET_RX FANETCN1
1

GCC02-0096
3
2
H3.3V_PW
CECR1 4
5
OPEN
M5.35V_PW

UR27RB751V-40TE-17
H5.35V_PW
MICOM UPDATE JIG

UD100

T_SEN(T_CE)

M_PWM_RST
IPOD_VD_SW
NEAR TO HDMI JACK

(TO MPEG)
CN1

KEY_SDA

T_SDIO
RESET_P

T_RST
10KOHM

T_CLK
52045-0610

CER2
1

27KOHM

1/10W
2
3 DGND

G
1
3
4
5 HDMICEC

S
D
RST
6
UFET1

18KOHM

CER3
STK7002

1/10W

3 100OHM
2
4
6
8

5 UR18
47KOHM

100OHM
UR53

5 UR15
UR36

C30
100NF
DGND

7
3
1
100OHM
7

UR17

100OHM
UR44
1
3
5
7

DGND

100OHM
8
6
4
2

NC
8
6
4
2
DGND

68NC

63NC

54NC
53NC
51NC
58NC
71NC
69NC

NC
TP58A

80
79
78
77
76
75
74
73
72
70

67
66
65
64
62
61
60
59
57
56
55

52
M5.35V_PW
TP58

PWM0
PWM1
VDD2
P31/PWM5
P30/PWM4

VSS2
P05/CKO
P04
P03
P02
P01
P00
PB7
P36

P32/UTX1

P07/T7O
P06/T6O

SI2P2/SCK2
P35/URX2

P33/URX1

SI2P3/SCK20
P34/UTX2

P27/INT5/T1IN/T0LCP/T0HCP
P26/INT5/T1IN/T0LCP/T0HCP
P25/INT5/T1IN/T0LCP/T0HCP

P23/INT4/T1IN/T0LCP/T0HCP
P22/INT4/T1IN/T0LCP/T0HCP
P21/INT4/T1IN/T0LCP/T0HCP
TP57A

P24/INT5/T1IN/T0LCP/T0HCP/INT7/T0HCP1

P20/INT4/T1IN/T0LCP/T0HCP/INT6/T0LCP1
TIP01
2.2KOHM
2.2KOHM

TP57 UR28 1KOHM 81 50 10KOHM


2.2KOHM

PB6
(FROM MP EG) STB SI2P1/SI2/SB2
100NF

(TO MP EG) ACK UR29 1KOHM 82 PB5 SI2P0/SO2 49


C130

(TO MP EG) UR30 1KOHM 83 PB4 PF7 48 10KOHM


IC2 RXD TIP02
84 PB3 PF6 47 UR1 4
UR38

USB_SEL

UC14A
R10

R11

S-24CS08AFJ-TB-1GE 85 PB2
46 47KOHM

470PF