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Diagonal 4.5mm (Type 1/4) CCD Image Sensor for PAL Color Video Cameras
Description
The ICX279AK is an interline CCD solid-state 14 pin DIP (Plastic)
image sensor suitable for PAL color video cameras
with a diagonal 4.5mm (Type 1/4) system. Compared
with the current product ICX209AK, basic
characteristics such as sensitivity, smear and
dynamic range are improved drastically through the
adoption of EXview HAD CCDTM technology.
This chip features a field period readout system and
an electronic shutter with variable charge-storage time.
The package is a 10mm-square 14-pin DIP (Plastic).
EXview HAD CCD TM has different spectral
characteristics from the current CCD.
Features
Pin 1
• High sensitivity (+5dB compared with the ICX209AK)
2
• Low smear (–20dB compared with the ICX209AK)
• High D range (+2dB compared with the ICX209AK)
• Horizontal register: 3.3 to 5.0V drive V
• Reset gate: 3.3 to 5.0V drive
• No voltage adjustment
12
(Reset gate and substrate bias are not adjusted.)
3
• High resolution, low smear and low dark current H 40
Pin 8
• Excellent antiblooming characteristics
• Continuous variable-speed shutter
Optical black position
• Recommended range of exit pupil distance: –20 to –100mm
• Ye, Cy, Mg, and G complementary color mosaic filters on chip (Top View)
Device Structure
• Interline CCD image sensor
• Image size: Diagonal 4.5mm (Type 1/4)
• Number of effective pixels: 752 (H) × 582 (V) approx. 440K pixels
• Total number of pixels: 795 (H) × 596 (V) approx. 470K pixels
• Chip size: 4.43mm (H) ×3.69mm (V)
• Unit cell size: 4.85µm (H) × 4.65µm (V)
• Optical black: Horizontal (H) direction: Front 3 pixels, rear 40 pixels
Vertical (V) direction: Front 12 pixels, rear 2 pixels
• Number of dummy bits: Horizontal 22
Vertical 1 (even fields only)
• Substrate material: Silicon
TM
∗ EXview HAD CCD is a trademark of Sony Corporation.
EXview HAD CCD is a CCD that drastically improves light efficiency by including near infrared light region as a basic structure of
HAD (Hole-Accumulation-Diode) sensor.
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
–1–
E00Z51
ICX279AK
VOUT
GND
Vφ1
Vφ2
Vφ3
Vφ4
NC
7 6 5 4 3 2 1
Cy Ye Cy Ye
Vertical Register
Mg G Mg G
Cy Ye Cy Ye
G Mg G Mg
Cy Ye Cy Ye
Mg G Mg G Note)
Horizontal Register
Note) : Photo sensor
8 9 10 11 12 13 14
VDD
GND
φSUB
VL
RG
Hφ1
Hφ2
Pin Description
Bias Conditions
Item Symbol Min. Typ. Max. Unit Remarks
Supply voltage VDD 14.55 15.0 15.45 V
Protective transistor bias VL ∗1
Substrate clock φSUB ∗2
∗1 VL setting is the VVL voltage of the vertical transfer clock waveform, or the same power supply as the VL
power supply for the V driver should be used.
∗2 Do not apply a DC bias to the substrate clock and reset gate clock pins, because a DC bias is generated
within the CCD.
DC Characteristics
Waveform
Item Symbol Min. Typ. Max. Unit Remarks
diagram
Readout clock voltage VVT 14.55 15.0 15.45 V 1
VVH1, VVH2 –0.05 0 0.05 V 2 VVH = (VVH1 + VVH2)/2
VVH3, VVH4 –0.2 0 0.05 V 2
VVL1, VVL2,
–8.0 –7.0 –6.5 V 2 VVL = (VVL3 + VVL4)/2
VVL3, VVL4
VφV 6.3 7.0 8.05 V 2 VφV = VVHn – VVLn (n = 1 to 4)
Vertical transfer clock VVH3 – VVH –0.25 0.1 V 2
voltage
VVH4 – VVH –0.25 0.1 V 2
VVHH 0.3 V 2 High-level coupling
VVHL 0.3 V 2 High-level coupling
VVLH 0.3 V 2 Low-level coupling
VVLL 0.3 V 2 Low-level coupling
–3–
ICX279AK
Vφ1 Vφ2
CφV12
R1 R2
RφH RφH
Hφ1 Hφ2
CφHH
CφV1 CφV2
CφV41 CφV23 CφH1 CφH2
CφV24 CφV13
RGND
CφV4 CφV3
R4 R3
CφV34
Vφ4 Vφ3
Vertical transfer clock equivalent circuit Horizontal transfer clock equivalent circuit
RφRG
RGφ
CφRG
–4–
ICX279AK
φM
VVT φM
2
10%
0% 0V
tr twh tf
Vφ1 Vφ3
VVHL VVHL
VVHL
VVHL VVH3
VVL1 VVL3
VVLH VVLH
VVLL VVLL
VVL VVL
Vφ2 Vφ4
VVHH VVHH
VVHH VVHH VVH
VVH
VVHL
VVH2 VVHL VVHL VVHL
VVH4
VVLH
VVL2VVLH
VVLL
VVLL
VVL VVL4 VVL
tr twh tf
90%
VφH
twl
10%
VHL
VRGH
twl
VφRG
Point A
RG waveform
VRGLH
VRGL
VRGLL
VRGLm
Hφ1 waveform
VφH/2 [V]
VRGLH is the maximum value and VRGLL is the minimum value of the coupling waveform during the period from
Point A in the above diagram until the rising edge of RG. In addition, VRGL is the average value of VRGLH and
VRGLL.
VRGL = (VRGLH + VRGLL)/2
Assuming VRGH is the minimum value during the interval twh, then:
VφRG = VRGH – VRGL
Negative overshoot level during the falling edge of RG is VRGLm.
100%
90%
φM
VφSUB φM
2
10%
VSUB 0%
(A bias generated within the CCD) tr twh tf
–6–
ICX279AK
twh twl tr tf
Item Symbol Unit Remarks
Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. Min. Typ. Max.
During
Readout clock VT 2.3 2.5 0.5 0.5 µs
readout
250 ns ∗1
Vertical transfer Vφ1, Vφ2,
15
clock Vφ3, Vφ4
Hφ1 26 28.5 26 28.5 6.5 9.5 6.5 9.5
ns ∗2
transfer clock
During
imaging Hφ2 26 28.5 26 28.5 6.5 9.5 6.5 9.5
Horizontal
two
Item Symbol Unit Remarks
Min. Typ. Max.
Horizontal transfer clock Hφ1, Hφ2 22 26 ns ∗3
∗3 The overlap period for twh and twl of horizontal transfer clocks Hφ1 and Hφ2 is two.
–7–
ICX279AK
8
V
10
H H
8 8
582 (V)
Zone 0, I 6
Zone II, II'
V Ignored region
10 Effective pixel region
Measurement System
[∗A] [∗Y]
CCD signal output LPF1 Y signal output
S/H [∗C]
LPF2 Chroma signal output
S/H
(3dB down 1MHz)
Note) Adjust the amplifier gain so that the gain between [∗A] and [∗Y] , and between [∗A] and [∗C] equals 1.
–8–
ICX279AK
Measurement conditions
1) In the following measurements, the device drive conditions are at the typical values of the bias and clock
voltage conditions.
2) In the following measurements, spot blemishes are excluded and, unless otherwise specified, the optical
black level (OB) is used as the reference for the signal output, which is taken as the value of Y signal output
or chroma signal output of the measurement system.
Color coding of this image sensor & Composition of luminance (Y) and chroma (color difference) signals
As shown in the left figure, fields are read out. The charge is
Cy Ye Cy Ye
A1 mixed by pairs such as A1 and A2 in the A field. (pairs such
G Mg G Mg as B in the B field)
B As a result, the sequence of charges output as signals from
Cy Ye Cy Ye
A2 the horizontal shift register (Hreg) is, for line A1, (G + Cy),
Mg G Mg G (Mg + Ye), (G + Cy), and (Mg + Ye).
Hreg
These signals are processed to form the Y signal and chroma (color difference) signal. The Y signal is formed
by adding adjacent signals, and the chroma signal is formed by subtracting adjacent signals. In other words,
the approximation:
Y = {(G + Cy) + (Mg + Ye)} × 1/2
= 1/2 {2B + 3G + 2R}
is used for the Y signal, and the approximation:
R – Y = {(Mg + Ye) – (G + Cy)}
= {2R – G}
is used for the chroma (color difference) signal. For line A2, the signals output from Hreg in sequence are
(Mg + Cy), (G + Ye), (Mg + Cy), (G + Ye).
The Y signal is formed from these signals as follows:
Y = {(G + Ye) + (Mg + Cy)} × 1/2
= 1/2 {2B + 3G + 2R}
This is balanced since it is formed in the same way as for line A1.
In a like manner, the chroma (color difference) signal is approximated as follows:
– (B – Y) = {(G + Ye) – (Mg + Cy)}
= – {2B – G}
In other words, the chroma signal can be retrieved according to the sequence of lines from R – Y and – (B – Y)
in alternation. This is also true for the B field.
–9–
ICX279AK
1. Sensitivity
Set to standard imaging condition I. After selecting the electronic shutter mode with a shutter speed of
1/250s, measure the Y signal (Ys) at the center of the screen and substitute the value into the following
formula.
S = Ys × 250 [mV]
50
2. Sensitivity ratio
Set to standard imaging condition II. Adjust the luminous intensity so that the average value of the Y signal
output is 200mV, and then measure the Mg signal output (SMg [mV]) and G signal output (SG [mV]), and Ye
signal output (SYe [mV]) and Cy signal output (SCy [mV]) at the center of the screen with frame readout
method. Substitute the values into the following formula.
RMgG = SMg/SG
RYeCy = SYe/SCy
3. Saturation signal
Set to standard imaging condition II. After adjusting the luminous intensity to 10 times the intensity with
average value of the Y signal output, 200mV, measure the minimum value of the Y signal.
4. Smear
Set to standard imaging condition II. With the lens diaphragm at F5.6 to F8, adjust the luminous intensity to
500 times the intensity with average value of the Y signal output, 200mV. When the readout clock is stopped
and the charge drain is executed by the electronic shutter at the respective H blankings, measure the
maximum value (YSm [mV]) of the Y signal output and substitute the value into the following formula.
– 10 –
ICX279AK
7. Dark signal
Measure the average value of the Y signal output (Ydt [mV]) with the device ambient temperature 60°C and
the device in the light-obstructed state, using the horizontal idle transfer level as a reference.
9. Flicker
1) Fy
Set to standard imaging condition II. Adjust the luminous intensity so that the average value of the Y signal
output is 200mV, and then measure the difference in the signal level between fields (∆Yf [mV]). Then
substitute the value into the following formula.
2) Fcr, Fcb
Set to standard imaging condition II. Adjust the luminous intensity so that the average value of the Y signal
output is 200mV, insert an R or B filter, and then measure both the difference in the signal level between
fields of the chroma signal (∆Cr, ∆Cb) as well as the average value of the chroma signal output (CAr, CAb).
Substitute the values into the following formula.
– 11 –
ICX279AK
11. Lag
Adjust the Y signal output value generated by strobe light to 200mV. After setting the strobe light so that it
strobes with the following timing, measure the residual signal (Ylag). Substitute the value into the following
formula.
FLD
V1
Light
Strobe light
timing
– 12 –
Drive Circuit
15V
1 20 100k
2 19
3 18
1/35V 0.1
XSUB 4 17
XV2 5 16 –7.0V
CXD1267AN
XV1 6 15 3.3/16V
XSG1 7 14
22/16V
XV3 8 13
XSG2 9 12
XV4 10 11
– 13 –
22/20V
100
1 2 3 4 5 6 7
2SK523
Vφ4
Vφ3
Vφ2
Vφ1
NC
GND
VOUT
CCD OUT
ICX279 3.9k
(BOTTOM VIEW)
φSUB
GND
VDD
Hφ2
Hφ1
RG
VL
14 13 12 11 10 9 8
Hφ2
2200p 1M
Hφ1
0.01
3.3/20V
0.1
RG
ICX279AK
ICX279AK
Spectral Sensitivity Characteristics (excludes both lens characteristics and light source characteristics)
1.0
Ye
0.8
G
Cy
Relative Response
0.6
0.4
Mg
0.2
0
400 450 500 550 600 650 700
V1 2.6
V2
Odd Field
V3
V4
1.5 2.6 2.6 2.6
33.6
0.2
V1
V2
Even Field
V3
V4
Unit: µs
– 14 –
Drive Timing Chart (Vertical Sync)
FLD
VD
BLK
HD
620
625
1
2
3
4
5
10
15
20
25
310
315
320
325
330
335
340
– 15 –
V1
V2
V3
V4
ICX279AK
Drive Timing Chart (Horizontal Sync)
HD
BLK
H1
H2
745
750
752
1
3
5
10
20
30
40
1
2
3
5
10
20
22
1
2
3
1
2
3
10
20
– 16 –
RG
V1
V2
V3
V4
SUB
ICX279AK
ICX279AK
Notes on Handling
2) Soldering
a) Make sure the package temperature does not exceed 80°C.
b) Solder dipping in a mounting furnace causes damage to the glass and other defects. Use a ground 30W
soldering iron and solder each pin in less than 2 seconds. For repairs and remount, cool sufficiently.
c) To dismount an image sensor, do not use a solder suction equipment. When using an electric desoldering
tool, use a thermal controller of the zero cross On/Off type and connect it to ground.
4) Installing (attaching)
a) Remain within the following limits when applying a static load to the package. Do not apply any load
more than 0.7mm inside the outer perimeter of the glass portion, and do not apply any load or impact to
limited portions. (This may cause cracks in the package.)
Cover glass
– 17 –
ICX279AK
b) If a load is applied to the entire surface by a hard component, bending stress may be generated and the
package may fracture, etc., depending on the flatness of the bottom of the package. Therefore, for
installation, use either an elastic load, such as a spring plate, or an adhesive.
c) The adhesive may cause the marking on the rear surface to disappear, especially in case the regulated
voltage value is indicated on the rear surface. Therefore, the adhesive should not be applied to this area,
and indicated values should be transferred to the other locations as a precaution.
d) The notch of the package is used for directional index, and that can not be used for reference of fixing.
In addition, the cover glass and seal resin may overlap with the notch of the package.
e) If the lead bend repeatedly and the metal, etc., clash or rub against the package, the dust may be
generated by the fragments of resin.
f) Acrylate anaerobic adhesives are generally used to attach CCD image sensors. In addition, cyano-acrylate
instantaneous adhesives are sometimes used jointly with acrylate anaerobic adhesives. (reference)
5) Others
a) Do not expose to strong light (sun rays) for long periods, color filters will be discolored. When high
luminance objects are imaged with the exposure level control by electronic-iris, the luminance of the
image-plane may become excessive and discolor of the color filter will possibly be accelerated. In such
a case, it is advisable that taking-lens with the automatic-iris and closing of the shutter during the power-
off mode should be properly arranged. For continuous using under cruel condition exceeding the normal
using condition, consult our company.
b) Exposure to high temperature or humidity will affect the characteristics. Accordingly avoid storage or
usage in such conditions.
c) The brown stain may be seen on the bottom or side of the package. But this does not affect the CCD
characteristics.
d) This package has 2 kinds of internal structure. However, their package outline, optical size, and strength
are the same.
Structure A Structure B
Package
Chip
Metal plate
(lead frame)
Cross section of
lead frame
The cross section of lead frame can be seen on the side of the package for structure A.
– 18 –
Package Outline Unit: mm
14 pin DIP (400mil)
0˚ to 9˚
5.0
14 8 8 14
2.5
D C
~
10.0 ± 0.1
10.16
8.9
B
1.7
1.7
7.0
5.0
V
2.5
~
1.0 1 8.9 7 7 1
0.5
0.25
10.0 ± 0.1
3.35 ± 0.15
B'
1. “A” is the center of the effective image area.
7.0 2.5
1.0
2. The two points “B” of the package are the horizontal reference.
– 19 –
2.6
3. The bottom “C” of the package, and the top of the cover glass “D” are the height reference.
4. The center of the effective image area relative to “B” and “B'” is (H, V) = (5.0, 5.0) ± 0.15mm.
5. The rotation angle of the effective image area relative to H and V is ± 1˚.
1.27
1.27 0.3 6. The height from the bottom “C” to the effective image area is 1.41 ± 0.10mm.
3.5 ± 0.3
0.46 The height from the top of the cover glass “D” to the effective image area is 1.94 ± 0.15mm.
0.3 M
7. The tilt of the effective image area relative to the bottom “C” is less than 25µm.
The tilt of the effective image area relative to the top “D” of the cover glass is less than 25µm.
PACKAGE STRUCTURE 8. The thickness of the cover glass is 0.75mm, and the refractive index is 1.5.
PACKAGE MATERIAL Plastic 9. The notch of the package is used only for directional index, that must not be used for reference
of fixing.
LEAD TREATMENT GOLD PLATING
ICX279AK