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RUBY KUMARI
B.SC(MATHS),B.E(ECE)
PCB is an acronym for Printed Circuit Board.
Printed Circuit Board is a plate used for placing the different elements that
conform an electrical circuits that contains the electrical interconnection between
them.
It is a board that has lines and pads that connects various points together.
Before printed circuits became the common component used in electronics, Point to
point construction was used.
This means some bulky and unreliable designs that required large sockets and regular
replacement.
Most of these issues were directly addressed when PCB went into direct production.
Pcbs are rugged, inexpensive and can be highly reliable.
Mass manufacturing .
Professional.
Reduced space and time.
Bulky construction
The first Printed Circuit Board can be traced all the back on early 1900 and a
patent for Printed wire.
In 1925 that Charles Ducas first submitted a patent that involved creating an
electrical path directly on an insulated surface.
It was a revolutionary idea because it could eliminate complex wiring and provide
consistent results.
Still, they didn’t really catch on until after WWII, when Dr. Paul Eisler in Austria
began making the first real operational printed circuit boards in 1943.
PCBs may be classified in many different ways according to their various
attributes. One fundamental structure common to all of them is that they must
provide electrical conductor paths that interconnect components to be mounted
on them.
There are two basic ways to form these conductors:
Subtractive. In the subtractive process, the unwanted portion of the copper foil
on the base substrate is etched away, leaving the desired conductor pattern in
place.
Additive. In the additive process, formation of the conductor pattern is
accomplished by adding copper to a bare (no copper foil) substrate in the
pattern and places desired. This can be done by plating copper, screening
conductive paste, or laying down insulating wire onto the substrate on the
predetermined conductor paths.
The PCB classifications given in next slide take into consideration all these
factors, i.e., fabrication processes as well as substrate materials.
Column 1 shows the classification of PCBs by the nature of the
substrate.
Column 2 shows the classification of PCBs by the way the
conductor pattern is imaged.
Column 3 shows the classification of PCBs by their physical
nature.
Column 4 shows the classification of PCBs by the method of
conductor formation.
Column 5 shows the classification of PCBs by the number of
conductor layers.
Column 6 shows the classification of PCBs...
Single sided PCB.
Multilayer PCB.
Flexible PCB.
With the appearance of electronic transistor, single side PCB was developed in the
early 1950,which is mainly manufactured in U.S.A.
In 1956 single sided PCB technology was made big progress with the appearance
of professional PCB manufacturer from Japan.
Rigid Flex circuits are designed for the rigors of aerospace, medical and military
applications, with dependable reliability. Flex assemblies have the ability to be
folded or creased and positioned into the smallest areas makes miniaturization
of many devices possible, while offering a substantial weight reduction
Each type of flex circuit offers different advantages. While some types of flex
circuits can offer lower production costs, others have additional increased
functionality.
Flex and Rigid-Flex circuits gives the ability to design your circuitry to fit the
device, instead of building a device to fit the circuit board. They are designed for
the rigors of aerospace, medical and military applications, with dependable
reliability.
Flex and Rigid-Flex circuits gives the ability to design your circuitry to fit the
device, instead of building a device to fit the circuit board. They are designed
for the rigors of aerospace, medical and military applications, with dependable
reliability.
Flex circuits offer multiple advantages for anyone considering to use this
technology in a future project or if you’re trying to decide on re-engineering
your current design. Below you will find some key benefits of using flex and
rigid-flex circuit technology.
They have the ability to be folded or creased and positioned into the smallest areas
makes miniaturization of many devices possible.
Utilizing a flex circuit solution into your design can offer a substantial weight
reduction benefit over using wires and wire harnesses.
Flexible circuits can be used to replace wiring reduces the errors common in hand
wired assemblies.
The increasing complexity of electronic components and switches continually
requires faster signal flow rates, and thus higher transmission frequencies.
Because of short pulse rise times in electronic components, it has also become
necessary for high frequency (HF) technology to view conductor widths as an
electronic component.
Critical for the impedances in high frequency circuit boards are principally the
conductor trace geometry, the layer buildup, and the dielectric constant (er) of the
materials used.
In recent years, semiconductor packaging has evolved with an increased
demand for greater functionality, smaller size, and added utility. A modern
PCBA design has two main methods for mounting components onto a
PCB: Through-Hole Mounting and Surface Mounting.
Through-hole mounting is the process by which component leads are placed into
drilled holes on a bare PCB. The process was standard practice until the rise of
surface mount technology (SMT) in the 1980s, at which time it was expected to
completely phase out through-hole. Yet, despite a severe drop in popularity over the
years, through-hole technology has proven resilient in the age of SMT, offering a
number of advantages and niche applications: namely, reliability.
Through-hole components are best used for high-reliability products that
require stronger connections between layers. Whereas SMT components are
secured only by solder on the surface of the board, through-hole component
leads run through the board, allowing the components to withstand more
environmental stress. This is why through-hole technology is commonly used in
military and aerospace products that may experience extreme accelerations,
collisions, or high temperatures. Through-hole technology is also useful in test
and prototyping applications that sometimes require manual adjustments and
replacements.
There are two types of through-hole components:Axial and Radial lead
components. Axial leads run through a component in a straight line ("axially"),
with each end of the lead wire exiting the component on either end. Both ends
are then placed through two separate holes in the board, allowing the
component to fit closer, flatter fit. Radial lead components, on the other hand,
protrude from the board, as its leads are located on one side of the component.
Both through-hole component types are "twin" lead components, and
both have their distinct advantages. While axial lead components are
used for their snugness to the board, radial leads occupy less surface
area, making them better for high density boards. Generally, axial lead
configuration may come in the form of carbon resistors, electrolytic
capacitors, fuses, and light-emitting diodes (LEDs). Radial lead
components are available as ceramic disk capacitors.
Advantages: THM provides stronger mechanical bonds than SMT, making
through-hole ideal for components that might undergo mechanical stress,
such as connectors or transformers. Good for test and prototyping.
Disadvantages: On the bare PCB side, THM requires the drilling holes, which
is expensive and time consuming. THM also limits the available routing area
on any multilayer boards, because the drilled holes must pass through all the
PCB’s layers. On the assembly side, component placement rates for THM are a
fraction of surface mount placement rates, making THM prohibitively
expensive. Further, THM requires the use of wave, selective, or hand-soldering
techniques, which are much less reliable and repeatable than reflow ovens used
for surface mount. Most of all, through-hole technology requires soldering on
both sides of the board, as opposed to surface-mounts, which only -- for the
most part -- require attention to one side of the board.
SMT the process by which components are mounted directly onto the
surface of the PCB. Known originally as “planar mounting,” the method
was developed in the 1960s and has grown increasingly popular since the
1980s. Nowadays, virtually all electronic hardware is manufactured using
SMT. It has become essential to PCB design and manufacturing, having
improved the quality and performance of PCBs overall, and has reduced
the costs of processing and handling greatly.
The key differences between SMT and through-hole mounting are
(a) SMT does not require holes to be drilled through a PCB,
(b) SMT components are much smaller, and
(c) SMT components can be mounted on both side of the board.
Active component —1. A component which adds energy to the signal it passes.
2. A device that requires an external source of power to operate upon its input
signal(s). 3. Any device that switches or amplifies by the application of low-level
signals. Examples of active devices which fit one or more of the above definitions:
transistors, rectifiers, diodes, amplifiers, oscillators, mechanical relays and almost
all IC's
Analog circuit — A circuit in which the output varies as a continuous function of
the input, as contrasted with digital circuit.
Anode —1. The positive element such as the plate of a vacuum tube; the element to
which the principal stream of electrons flows. 2. In a cathode-ray tube, the
electrodes connected to a source of positive potential. These anodes are used to
concentrate and accelerate the electron beam for focusing.
Aperture—1. An indexed shape with a specified x and y dimension, or line-type
with a specified width, used as a basic element or object by a photoplotter in
plotting geometric patterns on film. The index of the aperture is its Position (a
number used in an aperture list to identify an aperture) or D code .
2. A small, thin, trapezoidal piece of plastic used to limit and shape a light source
for plotting light patterns on film, and mounted in a mechanical disk called an
" aperture wheel" which in turn is mounted on the lamp head of a vector
photoplotter. An aperture is mostly opaque, but with a transparent portion that
controls the size and shape of the light pattern. A vector photoplotter plots images
from a CAD database on photographic film in a darkroom by drawing each line
with a continuous lamp shined through an annular-ring aperture, and creating each
shape (or pad) by flashing the lamp through a specially sized and shapedaperture.
3. A line of textual data in an aperture list describing the index names (D code and
position), the shape, the usage (flash or draw) and the X and Y dimensions of
an aperture. Some aperture lists leave out certain of those types of data. For
example, laser photoplotters don't need to know whether an aperture is a flash or
draw, so a modern-day aperture list might leave that datum out.
Aperture list —1. An ASCII text data file which describes the size and shape of the
apertures used by a photoplotter for any one photoplot. 2. A print-out of this file. 3. A
binary version of this file. [Also called "aperture table."]
Aperture wheel —A component of a Vector photoplotter , it is a metal disk
having cut-outs with brackets and screw holes arranged near its rim for
attaching apertures . Its center hole is attached to a motorized spindle on the
lamp head of the photoplotter. When a D code denoting a particular position
on the wheel is retreived from a Gerber File by the photoplotter, the wheel is
caused to rotate so that the aperture in that position is placed between the lamp
and the film.
In preparation for a photoplotting, the aperture wheel is set up by a technician
who reads a printed aperture list, selects the correct aperture from a set of
them stored in a box with compartments and, using a small screw driver,
installs the aperture onto the position on the wheel which is called for on the
list. This process is subject to human error and is one of the disadvantages of
vector photoplotters as compared with laser photoplotter.
Artwork —Artwork for printed circuit design is photoplotted film (or merely the Gerber
files used to drive the photoplotter), NC Drill file and documentation which are all used
by a board house to manufacture a bare printed circuit board.
Assembly —1. The process of positioning and soldering components to a PCB 2. Act or
process of fitting together parts to make a whole. .
AWG —American Wire Gauge. A PCB Designer needs to know diameters of wire gauges
to properly size E-Pads. The American Wire Gauge, formerly known as the Brown and
Sharpe (B + S) Gauge, originated in the wire drawing industry. The gauge is calculated
so that the next largest diameter always has a cross-sectional area that is 26% greater.
Assembly house —A manufacturing facility for attaching and soldering components
to a printed circuit.
Ball grid array — (Abbrev. BGA). A flip- chip type of package in which the
internal die terminals form a grid-style array, and are in contact with solder balls (
solder bumps), which carry the electrical connection to the outside of the package.
The PCB footprint will have round landing pads to which the solder balls will be
soldered when the package and PCB are heated in a reflow oven.
Advantages of the ball grid array package are
(1) that its size is compact and
(2) its leads do not get damaged in handling (unlike the formed "gull-wing" leads
of a QFP' ) and thus has a long shelf life.
Disadvantages of the BGA are 1) they, or their solder joints, are subject to stress-
related failure. For example, the intense vibration of rocket-powered space vehicles
can pop them right off the PCB, 2) they can not be hand-soldered (they require a
reflow oven), making first-article prototypes a bit more expensive to stuff, 3) except
for the outer rows, the solder joints can not be visually inspected and 4) they are
difficult to rework.
Base —The electrode of a transistor which controls the movements of electrons or
holes by means of an electric field on it. It is the element which corresponds to the
control grid of an electron tube.
Board —printed circuit board. Also, a CAD database which represents the layout
of a printed circuit.
BOM [pronounced "bomb"]—Bill of Materials. A list of components to
be included on an assembly such as a printed circuit board. For a PCB
the BOM must include reference designator for the components used
and descriptions which uniquely identify each component. A BOM is
used for ordering parts and, along with an assembly drawing, directing
which parts go where when the board is stuffed.
Body —The portion of an electronic component exclusive of its pins or leads.
CAD —Computer Aided Design. A system where engineers create a design and see
the proposed product in front of them on a graphics screen or in the form of a
computer printout or plot. In electronics, the result would be a printed circuit
layout.
CADCAM —Simply a concatenation of the two terms CAD and CAM.
CAE —Computer Assisted Engineering. In electronics work, CAE refers to
schematic software packages.
CAF —Conductive Anodic Filamentation (or Conductive Anodic Filament growth)
- An electrical short which occurs in PCBs when a conductive filament forms in the
laminate dielectric material between two adjacent conductors under an electrical
bias. CAF is a potentially dangerous source of electrical failure in the PCB. As
PCB designs have increased in density, with hole-to-hole spacings reduced to
25 mils or less, CAF has become an everyday concern.
CAM —Computer Aided Manufacturing.
CAM files — CAM means Computer Aided Manufacturing. These are the data
files used directly in the manufacture of printed wiring. . The types of CAM
files are
1) Gerber file, which controls a photoplotter,
2) NC Drill file, which controls an NC Drill machine and
3) fab and assembly drawings in soft form (pen-plotter files).
CAM files represent the valuable final product of PCB design. They are
handed off to the board house which further refines and manipulates CAM data
in their processes, for example in step- and-repeat panelization. Some PCB
design software companies refer to all plotter or printer files as CAM files ,
although some of the plots may be check plots which are not used in
manufacture.
Card —another name for a printed circuit board.
Capture —Extract information automatically through the use of software, as
opposed to hand-entering of data into a computer file.
Cathode —1. In an electron tube the electrode through which a primary source of
electrons enters the interelectrode space.
2. General name for any negative electrode.
3. When a semiconductor diode is biased in the forward direction, that terminal of
the diode which is negative with respect to the other terminal.
4. In electrolytic plating, the workpiece being plated.
Clad —A copper object on a printed circuit board. Specifying certain text items
for a board to be "in clad" means that the text should be made of copper,
not silkscreen
Collector —1. An electrode in a transistor that collects electrons or holes. 2. In
certain electron tubes, an electrode to which electrons or ions flow after they
have completed their function.
Component library — A representation of components as decals, stored in a
computer data file which can be accessed by a PCB CAD program.
Connection —One leg of a net. Also called a "pin pair" (PADS) and "from-to"
(Protel).
Connectivity —The intelligence inherent in PCB CAD software which maintains
the correct connections between pins of components as defined by the schematic.
Connector —A plug or receptacle which can be easily joined to or separated from
its mate. Multiple-contact connectors join two or more conductors with others in
one mechanical assembly.
E-pad —"Engineering-pad." A plated-through hole or surface mount pad on a PCB
placed on the board for the purpose of attaching a wire by soldering. These are
usually labeled with silkscreen. E-pads are used to facilitate proto-typing, or simply
because wires are used for interconnections instead of headers or terminal block.
ECL —Emitter Coupled Logic. A type of unsaturated performed by emitter-
coupled transistors. Higher speeds may be achieved with ECL than are obtainable
with standard logic circuits. ECL is costly, power hungry, and difficult to use, but it
is four times faster than TTL.
Electrical Object — [Protel] A graphical object (in a PCB or schematic database)
to which an electrical connection can be made, such as a component pin or a wire.
Emitter —An electrode on a transistor from which a flow of electrons
or holes enters the region between the electrodes.
EMC —electromagnetic compatibility. (1) The ability of electronic equipment to
operate without degradation in an intended electromagnetic environment (2) The
ability of equipment to operate in its electromagnetic environment without creating
interference with other devices.
. End-to-end design —a version of CADCAMCAE in which the software packages
used and their inputs and outputs are integrated with each other and allow design
to flow smoothly with no manual intervention necessary (other than a few
keystrokes or menu selections) to get from one step to the other. Flow can occur in
both directions. In the field of PCB design,end-to-end design sometimes refers to
only the electronic schematic/pcb layout interface, but this is a narrow view of the
potentialities of the concept. For example, end-to-end systems can also implement
electronic circuit simulation, parts procurement and beyond.
Excellon —NC Drill file format. An ASCII format used in a file which drives an NC
Drill machine. The earliest NC Drill machines were made by Excellon Automation
Company. The format is in broad use, although the company has been sold.
Fab —Short for fabrication.
Fabrication drawing —A drawing used to aid the construction of a printed board.
It shows all of the locations of the holes to be drilled, their sizes and tolerances,
dimensions of the board edges, and notes on the materials and methods to be used.
Called "fab drawing" for short. It relates the board edge to at least on hole location
as a reference point so that the NC Drill file can be properly lined up.
FC —Flexible Circuit, flexible circuitry, flexcircuit or flex circuit.
Fine line design —Printed circuit design permitting two (rarely three) traces
between adjacent DIP pins. It entails the use of a either dry film solder mask or
liquid photoimageable solder mask (LPI), both of which are more accurate than
wet solder mask.
Fine pitch —Refers to chip packages with lead pitches below 0.050". The largest
pitch in this class of parts is 0.8mm, or about 0.031". Lead pitches as small as
0.5mm (0.020") are used.
Finger —A gold-plated terminal of a card-edge connector.
Flash —1. v. To turn a vector photoplotter lamp on for a brief but precise duration
and then off, during which time the relative positions of the lamp and film remain
fixed. This exposes the film with the image of a small object (the size and shape of
which is controlled by the transparent portion of an aperture). 2. n. A small image
on film created in such wise or as directed by a command in a Gerber file .) The
maximum size (x or y dimension)for a flash varies from one photoplotting shop to
another, but is commonly ½ inch.
Flexible circuitry —An array of conductors bonded to a thin, flexible dielectric. It
has the unique property of being a three-dimensional circuit that can be shaped in
multiplanar configurations, rigidized in specific areas, and molded to backer
boards for specific applications. As an interconnect, the main advantages of flex
over traditional cabling are greater reliability, size and weight reduction,
elimination of mechanical connectors, elimination of wiring errors, increased
impedance control and signal quality, circuit simplification, greater operating
temperature range, and higher circuit density. In many applications, lower cost is
another advantage of using flexible circuits.
Flip-chip —A mounting approach in which the chip is inverted and connected
directly to the substrate rather than using the more common wire
bonding technique. Examples of this kind of flip-chip mounting are beam
lead and solder bump.
First article —A sample part or assembly manufactured prior to the start of
production for the purpose of ensuring that the manufacturer is capable of
manufacturing a product which will meet the requirements.
Footprint —1. The pattern and space on a board taken up by a component.