LGE Internal Use Only Only For Training and Service Purposes

Table Of Contents
1. INTRODUCTION.................................. 5 4.13 SIM Detect Troubleshooting ..................115

1.1 Purpose ...................................................... 5 4.14 Camera Troubleshooting .......................117
1.2 Regulatory Information ............................... 5 4.15 Keypad Backlight Troubleshooting ........120
4.16 Main LCD Troubleshooting ....................121
2. PERFORMANCE ..................................7 4.17 Receiver Path ........................................122
4.18 Headset path .........................................124
2.1 System Overview.........................................7
4.19 Speaker phone path ..............................126
2.2 Usable environment.....................................8
4.20 Main microphone ...................................128
2.3 Radio Performance......................................8
4.21 Headset microphone..............................130
2.4 Current Consumption.................................14
4.22 Vibrator ..................................................132
2.5 RSSI BAR ..................................................14
2.6 Battery BAR ...............................................15
5. DOWNLOAD.....................................133
2.7 Sound Pressure Level ...............................16
2.8 Charging ....................................................16 5.1 KS20 DOWNLOAD..................................133
3. TECHNICAL BRIEF............................17 6. BLOCK DIAGRAM ...........................146

3.1 General Description ...................................17 6.1 GSM & UMTS RF Block ..........................146
3.2 GSM Mode.................................................19 6.2 Interface Diagram ....................................148
3.3 UMTS Mode...............................................23
3.4 LO generation and distribution circuits ......25
7. Circuit Diagram................................153
3.5 Off-chip RF Components ...........................25
3.6 Digital Baseband(DBB/MSM7200) ............35 8. BGA IC PIN MAP..............................163
3.7 Hardware Architecture ...............................37
3.8. Subsystem(MSM7200) .............................39 8. PCB LAYOUT ...................................169
3.9. Power Block..............................................42
3.10. External memory interface......................47 9. Calibration & RF Auto Test
3.11. H/W Sub System ....................................49 Program (Hot Kimchi) .....................177
3.12. Main Features.........................................76 9.1 Configuration of HOT KIMCHI .................177
9.2 How to use HOT KIMCHI.........................180
4. TROUBLE SHOOTING.......................82
4.1 RF Component ..........................................82 10. Phone Test Mode _ 3G smart
4.2 SIGNAL PATH_UMTS RF .........................85 Phone KS20 ...................................182
4.3 SIGNAL PATH_GSM RF ...........................86
4.4 Checking VCTCXO Block ..........................87 11. EXPLODED VIEW & REPLACEMENT
4.5 Checking Front-End Module Block ............89 PART LIST ..................................... 189
4.6 Checking UMTS Block...............................91 11.1 EXPLODED VIEW ................................ 189
4.7 Checking GSM Block.................................96 11.2 Replacement Parts
4.8 Checking Bluetooth Block........................102 <Mechanic component> ....................... 191
<Main component> ............................... 193
4.9 Checking WLAN Block.............................104
11.3 Accessory ............................................. 209
4.10 Power ON Troubleshooting ...................108
4.11 Charger Troubleshooting .......................110
4.12 USB Troubleshooting.............................113
Copyright © 2007 LG Electronics. Inc. All right reserved. -3- LGE Internal Use Only
Only for training and service purposes
LGE Internal Use Only -4- Copyright © 2007 LG Electronics. Inc. All right reserved.
1. INTRODUCTION
1. INTRODUCTION
1.1 Purpose
This manual provides the information necessary to repair, calibration, description and download the
features of this model.
1.2 Regulatory Information
A. Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example,
persons other than your company’s employees, agents, subcontractors, or person working on your
company’s behalf) can result in substantial additional charges for your telecommunications services.
System users are responsible for the security of own system.
There are may be risks of toll fraud associated with your telecommunications system. System users
are responsible for programming and configuring the equipment to prevent unauthorized use. The
manufacturer does not warrant that this product is immune from the above case but will prevent
unauthorized use of commoncarrier telecommunication service of facilities accessed through or
connected to it. The manufacturer will not be responsible for any charges that result from such
unauthorized use.
B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possibly
causing harm or interruption in service to the telephone network, it should disconnect telephone
service until repair can be done. A telephone company may temporarily disconnect service as long as
repair is not done.
C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. If these
changes could reasonably be expected to affect the use of the phones or compatibility with the net
work, the telephone company is required to give advanced written notice to the user, allowing the user
to take appropriate steps to maintain telephone service.
D. Maintenance Limitations
Maintenance limitations on the phones must be performed only by the manufacturer or its authorized
agent. The user may not make any changes and/or repairs expect as specifically noted in this manual.
Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system
and may void any remaining warranty.
1. INTRODUCTION
E. Notice of Radiated Emissions

This model complies with rules regarding radiation and radio frequency emission as defined by local
regulatory agencies. In accordance with these agencies, you may be required to provide information
such as the following to the end user.
F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly
different.
G. Interference and Attenuation

A phone may interfere with sensitive laboratory equipment, medical equipment, etc. Interference from
unsuppressed engines or electric motors may cause problems.
H. Electrostatic Sensitive Devices
ATTENTION
Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the sign.
Following information is ESD handling:
• Service personnel should ground themselves by using a wrist strap when exchange system boards.
• When repairs are made to a system board, they should spread the floor with anti-static mat which is
also grounded.
• Use a suitable, grounded soldering iron.
• Keep sensitive parts in these protective packages until these are used.
• When returning system boards or parts like EEPROM to the factory, use the protective package as
described.
2. PERFORMANCE
2. PERFORMANCE
2.1 System Overview
Item Specification
Shape GSM900/1800/1900 and WCDMA2100 - Bar type Handset
Size 99.8 X 58 X 12.9 mm
Weight Under 92.5g (with 1050mAh Battery)
Power 3.7 V normal, 1050 mAh Li-Polymer
Talk Time Over 100 min (WCDMA, Tx=-23 dBm, Voice)
(with 800mAh) Over 150 min (GSM, Tx=Level 5, Voice)
Standby Time Over 300 Hrs (WCDMA, DRX=1.28)
(with 800mAh) Over 400 Hrs (GSM, Paging period=9)
Antenna Internal type
LCD Main 2.8” 262K 240 X 320 pixel (TFT)
LCD Backlight White LED Back Light
Camera Auto Focus - 2.0 Mega pixel (CMOS) + VGA Video Call Camera
Vibrator Yes (Coin Type)
LED Indicator Yes
MIC Yes
Receiver Yes
Earphone Jack Yes (18 pin)
Connectivity Bluetooth, USB
Volume Key Push Type(+, -)
External Memory Yes
I/O Connect 18 Pin
2. PERFORMANCE
2.2 Usable environment
1) Environment
Item Specification
Voltage 3.7 V(Typ), 3.2 V(Min), [Shut Down : 3.2 V]
Operation Temp -20 ~ +60°C
Storage Temp -20 ~ +70°C
Humidity 85 % (Max)
2) Environment (Accessory)
Reference Spec. Min Typ. Max Unit
TA Power Available power 100 220 240 Vac

* CLA : 12 ~ 24 V(DC)
2.3 Radio Performance
1) Transmitter - GSM Mode

No Item GSM DCS & PCS
9k ~ 1GHz -39dBm
100k~1GHz -39dBm
MS allocated 1G~[A]MHz -33dBm
Channel [A]M~[B]MHz -39dBm

1G~12.75GHz -33dBm
Conducted [B]M~12.75GHz -33dBm
1 Spurious 100k~880MHz -60dBm 100k~880MHz -60dBm
Emission 880M~915MHz -62dBm 880M~915MHz -62dBm
915M~1GHz -60dBm 915M~1GHz -60dBm

Idle Mode
1G~[A]MHz -50dBm 1G~[A]MHz -50dBm
[A]M~[B]MHz -56dBm [A]M~[B]MHz -56dBm
[B]M~12.5GHz -50dBm [B]M~12.5GHz -50dBm

* In case of DCS : [A] -> 1710, [B] -> 1785 * In case of PCS : [A] -> 1850, [B] -> 1910
2. PERFORMANCE
30M~1GHz -36dBm
30M ~ 1GHz -36dBm
MS allocated 1G~[A]MHz -30dBm
Channel [A]M~[B]MHz -36dBm

1G ~ 4GHz -30dBm
Radiated [B]M~4GHz -30dBm
2 Spurious 30M ~ 880MHz -57dBm 30M~880MHz -57dBm
Emission 880M ~ 915MHz -59dBm 880M~915MHz -59dBm
915M~1GHz -57dBm 915M~1GHz -57dBm

Idle Mode
1G~[A]MHz -47dBm 1G~[A]MHz -47dBm
[A]M~[B]MHz -53dBm [A]M~[B]MHz -53dBm
[B]M~4GHz -47dBm [B]M~4GHz -47dBm
3 Frequency Error ±0.1ppm ±0.1ppm
±5(RMS) ±5(RMS)
4 Phase Error
±20(PEAK) ±20(PEAK)
3dB below reference sensitivity 3dB below reference sensitivity
Frequency Error RA250 : ±200Hz RA250: ±250Hz
5 Under Multipath and HT100 : ±100Hz HT100: ±250Hz
Interference Condition TU50 : ±100Hz TU50: ±150Hz
TU3 : ±150Hz TU1.5: ±200Hz
0 ~ 100kHz +0.5dB 0 ~ 100kHz +0.5dB
200kHz -30dB 200kHz -30dB

Due to 400kHz -60dB 400kHz -60dB
modulation 600 ~ 1800kHz -66dB 600 ~ 1800kHz -60dB

Output RF
6 1800 ~ 3000kHz -69dB 1800 ~ 6000kHz -65dB
Spectrum
3000 ~ 6000kHz -71dB ≥6000kHz -73dB
≥6000kHz -77dB

Due to
Switching
1200kHz -21dB 1200kHz -24dB
transient
1800kHz -24dB 1800kHz -27dB
* In case of DCS : [A] -> 1710, [B] -> 1785 * In case of PCS : [A] -> 1850, [B] -> 1910
2. PERFORMANCE
Frequency offset 800kHz
Intermodulation product should

7 Intermodulation attenuation –
be Less than 55dB below the
level of Wanted signal
Power control Power Tolerance Power control Power Tolerance
Level (dBm) (dB) Level (dBm) (dB)
5 33 ±3 0 30 ±3
6 31 ±3 1 28 ±3
7 29 ±3 2 26 ±3
8 27 ±3 3 24 ±3
9 25 ±3 4 22 ±3
10 23 ±3 5 20 ±3
8 Transmitter Output Power 11 21 ±3 6 18 ±3
12 19 ±3 7 16 ±3
13 17 ±3 8 14 ±3
14 15 ±3 9 12 ±4
15 13 ±3 10 10 ±4
16 11 ±5 11 8 ±4
17 9 ±5 12 6 ±4
18 7 ±5 13 4 ±4
19 5 ±5 14 2 ±5
15 0 ±5
9 Burst timing Mask IN Mask IN
LGE Internal Use Only - 10 - Copyright © 2007 LG Electronics. Inc. All right reserved.
2. PERFORMANCE
2) Transmitter - WCDMA Mode
No Item Specification
1 Maximum Output Power Class 3 : +24dBm(+1/-3dB)
2 Frequency Error ±0.1ppm
3 Open Loop Power control in uplink ±9dB@normal, ±12dB@extreme
Adjust output(TPC command)
cmd 1dB 2dB 3dB
+1 +0.5/1.5 +1/3 +1.5/4.5
4 Inner Loop Power control in uplink 0 -0.5/+0.5 -0.5/+0.5 -0.5/+0.5
-1 -0.5/-1.5 -1/-3 -1.5/-4.5
Group (10 equel command group)
+1 +8/+12 +16/+24
5 Minimum Output Power -50dBm(3.84MHz)
Qin/Qout : PCCH quality levels
6 Out-of-synchronization handling of output power Toff@DPCCH/Ior : -22 -> -28dB
Ton@DPCCH/Ior : -24 -> -18dB
7 Transmit OFF Power -56dBm(3.84MHz)
±25us
8 Transmit ON/OFF Time Mask
PRACH,CPCH,uplinlk compressed mode
±25us
Power varies according to the data rate

9 Change of TFC
DTX : DPCH off
(minimize interference between UE)
10 Power setting in uplink compressed ±3dB(after 14slots transmission gap)
11 Occupied Bandwidth(OBW) 5MHz(99%)
-35-15*(∆f-2.5)dBc@∆f=2.5~3.5MHz,30k
-35-1*(∆f-3.5)dBc@∆f=3.5~7.5MHz,1M
12 Spectrum emission Mask
-39-10*(∆f-7.5)dBc@∆f=7.5~8.5MHz,1M
-49dBc@∆f=8.5~12.5MHz,1M
Copyright © 2007 LG Electronics. Inc. All right reserved. - 11 - LGE Internal Use Only
2. PERFORMANCE
33dB@5MHz, ACP>-50dBm
13 Adjacent Channel Leakage Ratio(ACLR)
43dB@10MHz, ACP>-50dBm
-36dBm@f=9~150KHz, 1K BW
-36dBm@f=50KHz~30MHz, 10K BW
-36dBm@f=30MHz~1000MHz, 100K BW
Spurious Emissions -30dBm@f=1~12.5GHz, 1M BW

14
(*: additional requirement) (*)-41dBm@f=1893.5~1919.6MHz, 300K
(*)-67dBm@f=925~935MHz, 100K BW
(*)-79dBm@f=935~960MHz, 100K BW
(*)-71dBm@f=1805~1880MHz, 100K BW
-31dBc@5MHz,Interferer -40dBc
15 Transmit Intermodulation
-41dBc@10MHz, Interferer -40dBc
17.5%(>-20dBm)
16 Error Vector Magnitude (EVM)
(@12.2K, 1DPDCH+1DPCCH)
-15dB@SF=4.768Kbps, Multi-code
17 Transmit OFF Power
transmission
3)Receiver - GSM Mode

1 Sensitivity (TCH/FS Class II) -105dBm -105dBm
Co-Channel Rejection
2 C/Ic=7dB Storage -30 ~ +85
(TCH/FS Class II, RBER, TU high/FH)
3 Adjacent Channel 200kHz C/Ia1=-12dB C/Ia1=-12dB
Rejection 400kHz C/Ia2=-44dB C/Ia2=-44dB
Wanted Signal :-98dBm 1st Wanted Signal :-96dBm 1st
4 Intermodulation Rejection interferer:-44dBm 2nd interferer:-44dBm 2nd
interferer:-45dBm interferer:-44dBm
Blocking Response Wanted Signal :-101dBm Wanted Signal :-101dBm

5
(TCH/FS Class II, RBER) Unwanted : Depend on Frequency Unwanted : Depend on Frequency
2. PERFORMANCE
4) Receiver - WCDMA Mode
1 Reference Sensitivity Level -106.7 dBm(3.84 MHz)
-25dBm(3.84MHz)
2 Maximum Input Level -44dBm/3.84MHz(DPCH_Ec)
UE@+20dBm output power(Class3)
33dB
3 Adjacent Channel Selectivity (ACS)
-56dBm/3.84MHz@10MHz
4 In-band Blocking UE@+20dBm output power(Class3)
-44dBm/3.84MHz@15MHz
-44dBm/3.84MHz@f=2050~2095 and
2185~2230MHz
-30dBm/3.84MHz@f=2025~2050 and
5 Out-band Blocking 2230~2255MHz
-15dBm/3.84MHz@f=1~2025 and
2255~12500MHz
-44dBm CW
6 Spurious Response
-46dBm CW@10MHz
7 Intermodulation Characteristic -46dBm/3.84MHz@20MHz
-57dBm@f=9KHz~1GHz, 100K BW
8 Spurious Emissions -47dBm@f=1~12.5GHz, 1M BW
-60dBm@f=1920MHz~1980MHz, 3.84M BW
-60dBm@f=2110MHz~2170MHz, 3.84M BW
2. PERFORMANCE
2.4 Current Consumption
1) KS20 Current Consumption

Stand by Voice Call VT
Under 4.00 mA Under 600 mA Under 800mA
WCDMA
(DRX=1.28) (Tx=23dBm) (Tx=23dBm)
Under 3.00 mA Under 350 mA
GSM Paging=9 period (PCL=5)
(Stand by and Voice Call Test Condition : Bluetooth off, LCD backlight off,Neighbor Cell off) (VT Test
Condition : Speaker off, LCD backlight On)
2) KS20 Current Consumption
Stand by Voice Call VT

Under 2.5 mA Under 330 mA Under 500mA
WCDMA
(DRX=2.56) (Tx=10dBm) (Tx=10dBm)
Under 2.7 mA Under 270 mA
GSM Paging=5 period (PCL=7)
(Stand by and Voice Call Test Condition : Bluetooth off, LCD backlight off,Neighbor Cell off) (VT Test
Condition : Speaker off, LCD backlight On)
2.5 RSSI BAR

Level Change WCDMA GSM
BAR 4 → 3 -82 ± 2 dBm -91 ± 2 dBm
BAR 3 → 2 -92 ± 2 dBm -96 ± 2 dBm
BAR 2 → 1 -102 ± 2 dBm -101 ± 2 dBm
BAR 1 → 0 -112 ± 2 dBm -106 ± 2 dBm
2. PERFORMANCE
2.6 Battery BAR
Indication Standby
Bar 4 100% ~ 76%
Bar 4 → 3 75%
Bar 3 → 2 50%
Bar 2 → 1 25%
Bar 1 → Empty 5%
Low Voltage, 10%

Warning message+ Blinking 5%
Power Off 3.20 ± 0.05V / 0%
2. PERFORMANCE
2.7 Sound Pressure Level

No Test Item Specification
1 Sending Loudness Rating (SLR) 8 ±3 dB
Nor 2 ± 3 dB
2 Receiving Loudness Rating (RLR)
Max -13 dB
3 Side Tone Masking Rating (STMR) Min 23 dB
MS
4 Echo Loss (EL) Min 46 dB
5 Idle Noise-Sending (INS) Max -64 dBm0p
Nor
6 Idle Noise-Receiving (INR) Under -54 dBPA
Max
7 Sending Loudness Rating (SLR) 8±3dB
Nor -1 ±3 dB
8 Receiving Loudness Rating (RLR)
Max -12 ±3 dB
9 Side Tone Masking Rating (STMR) Min 25 dB
Headset
10 Echo Loss (EL) Min 40 dB
11 Idle Noise-Sending (INS) Max -55 dBm0p
Nor Under -45 dBPA
12 Idle Noise-Receiving (INR)
Max Under -40 dBPA
TDMA Noise
-. GSM : Power Level : 5
DCS/PCS : Power Level : 0
(Cell Power : -90 ~ -105 dBm)
MS and
13 Max Under -62 dBm
Headset
-. Acoustic (Max Vol.)
MS/Headset SLR : 8 ± 3dB
MS/Headset RLR : -15 ± 3dB/-12dB
(SLR/RLR : Mid-value setting)
2.8 Charging
• Charging Method : CC & CV (Constant Current and Constant Voltage)
• Maximum Charging Voltage : 4.2 V
• Maximum Charging Current : 900 mA
• Normal Battery Capacity : 1050 mAh
• Charging Time : Max 2.5 hours (except for trickle charging time)
• Full charging indication current (charging icon stop current) : 60 mA
• Cut-off voltage : 3.20 V
3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
3.1 General Description

The KS20 supports UMTS-2100, GSM-900, DCS-1800, and PCS-1900 based
GSM/GPRS/EDGE/UMTS. All receivers and the UMTS transmitter use the radioOne1Zero-IF
architecture to eliminate intermediate frequencies, directly converting signals between RF
and baseband. The quad-band GSM transmitters use a baseband-to-IF upconversion followed by an
offset phase-locked loop that translates the GMSK-modulated or 8-PSK-modulated signal to RF.
[Fig 1.1] Block diagram of RF part
1
QUALCOMM’s branded chipset that implements a Zero-IF radio architecture.
3. TECHNICAL BRIEF
A generic, high-level functional block diagram of KS20 is shown in Figure 1-1. One antenna collects
base station forward link signals and radiates handset reverse link signals. The antenna connects with
receive and transmit paths through a FEM(Front End Module).
The UMTS receive paths each include an LNA, an RF band-pass filter, and a downconverter that
translate the signal directly from RF-to-baseband using radioOne ZIF techniques. The RFIC’s Rx
analog baseband outputs, for the receive chains, connect to the MSM IC. The UMTS and GSM Rx
baseband outputs share the same inputs to the MSM IC.
For the transmit chains, the RTR6275 IC directly translates the Tx baseband signals (from the MSM
device) to an RF signal using an internal LO generated by integrated on-chip PLL and VCO. The
RTR6275 IC outputs deliver fairly high-level RF signals that are first filtered by Tx SAWs and then
amplified by their respective UMTS PAs. The high- and low-band UMTS RF transmit signals emerge
from the RTR6275 transceiver.
In the GSM receive path, the received RF signals are applied through their bandpass filters and down-
converted directly to baseband in the RTR6275 transceiver IC.
These baseband outputs are shared with the UMTS receiver and routed to the MSM IC for further
signal processing.
The GSM/EDGE transmit path employs one stage of up-conversion and, in order to improve efficiency,
is divided into phase and amplitude components to produce an open-loop Polar topology:
1. The on-chip quadrature up-converter translates the GMSK-modulated signal or 8-PSK modulated
signal, to a constant envelope phase signal at RF;
2. The amplitude-modulated (AM) component is applied to the ramping control pin of Polar power
amplifier from a DAC within the MSM
KS20 power supply voltages are managed and regulated by the PM7540 Power Management IC. This
versatile device integrates all wireless handset power management, general housekeeping, and user
interface support functions into a single mixed signal IC. It monitors and controls the external power
source and coordinates battery recharging while maintaining the handset supply voltages using low
dropout, programmable regulators.
The device’s general housekeeping functions include an ADC and analog multiplexer circuit for
monitoring on-chip voltage sources, charging status, and current flow, as well as user-defined off-chip
variables such as temperature, RF output power, and battery ID. Various oscillator, clock, and counter
circuits support IC and higher-level handset functions. Key parameters such as under-voltage lockout
and crystal oscillator signal presence are monitored to protect against detrimental conditions.
3. TECHNICAL BRIEF
3.2 GSM Mode
3.2.1 GSM Receiver

The Dual-mode KS20’s receiver functions are split between the three RFICs as follows:
• GSM-900, DCS-1800, and PCS-1900 UMTS-2100 modes bot use the RTR6275 IC only. Each mode
has independent front-end circuits and down-converters, but they share common baseband circuits
(with only one mode active at a time). All receiver control functions are beginning with SBI2-controlled
parameters.
RF Front end consists of antenna, antenna switch module(LSHS-M090U) which includes 3 RX saw
filters(GSM900, DCS and PCS). The antenna switch module allows multiple operating bands and
modes to share the same antenna. In KS20, a common antenna connects to one of six paths: 1)
UMTS-2100 Rx/Tx, 2) GSM-900 Rx, 3) GSM-900 Tx, 4) DCS-1800 Rx, and 5) DCS-1800, PCS-1900
Tx(High Band Tx’s share the same path), 6) PCS-1900 Rx. UMTS operation requires simultaneous
reception and transmission, so the UMTS Rx/Tx connection is routed to a duplexer that separates
receive and transmit signals. GSM900, DCS, and PCS operation is time division duplexed, so only the
receiver or transmitter is active at any time and a frequency duplexer is not required.
ANT_SEL0 ANT_SEL1 ANT_SEL2

GSM 850/GSM 900 TX HIGH HIGH LOW
GSM 1800/GSM 1900 TX HIGH LOW LOW
GSM 850 RX - - -
GSM 900 RX LOW LOW LOW
GSM 1900 RX LOW LOW HIGH
WCDMA HIGH LOW HIGH
[Table 1.1] Antenna Switch Module Control logic
2
The RFIC operating modes and circuit parameters are MSM-controlled through the proprietary 3-line Serial Bus Interface (SBI). The Application
Programming Interface (API) is used to implement SBI commands. The API is documented in AMSS Software - please see applicable AMSS
Software documentation for details.
3. TECHNICAL BRIEF
The GSM900, DCS, and PCS receiver inputs of RTR6275 are connected directly to the transceiver
front-end circuits(filters and antenna switch module). GSM900, DCS, and PCS receiver inputs use
differential configurations to improve common-mode rejection and second-order non-linearity
performance. The balance between the complementary signals is critical and must be maintained from
the RF filter outputs all the way into the IC pins
Since GSM900, DCS, and PCS signals are time-division duplex (the handset can only receive or
transmit at one time), switches are used to separate Rx and Tx signals in place of frequency duplexers -
this is accomplished in the switch module.
The GSM900, DCS, and PCS receive signals are routed to the RTR6275 through band selection filters
and matching networks that transform single-ended 50-Ω sources to differential impedances optimized
for gain and noise figure. The RTR input uses a differential configuration to improve second-order inter-
modulation and common mode rejection performance. The RTR6275 input stages include
MSMcontrolled gain adjustments that maximize receiver dynamic range.
The amplifier outputs drive the RF ports of the quadrature RF-to-baseband downconverters. The
downconverted baseband outputs are multiplexed and routed to lowpass filters (one I and one Q)
having passband and stopband characteristics suitable for GMSK or 8-PSK processing. These filter
circuits include DC offset corrections. The filter outputs are buffered and passed on to the MSM7200 IC
for further processing (an interface shared with the RFR6275 UMTS receiver outputs
3. TECHNICAL BRIEF
[Fig 1.2] RTR6275 RX feature
3. TECHNICAL BRIEF
3.2.2 GSM Transmitter

The RTR6275 transmitter outputs(DA_HB2_OUT and DA_LB1_OUT)include on-chip output matching
inductors. 50ohm output impedance is achieved by adding a series capacitor at the output pins. The
capacitor value may be optimized for specific applictions and PCB characteristics based on pass-band
symmetry about the band center frequency, the suggested starting value is shown in Figure1.2.
18Ω
300Ω 300Ω
18Ω
300Ω 300Ω
[Fig 1.3] GSM Transmitter matching
The RTR6275 IC is able to support GSM 900 and GSM 1800/1900 mode transmitting. This design
guideline shows a tri-band GSM application.
Both high-band and low band outputs are followed by resistive pads to ensure that the load Presented
to the outputs remains close to 50ohm. The low-band GSM. Tx path also includes a Tx-band SAW filter
to remove noise-spurious components and noise that would be amplified by the PA and appear in the
GSM Rx band
3. TECHNICAL BRIEF
3.3 UMTS Mode
3.3.1 Receiver
The UMTS duplexer receiver output is routed to LNA circuits within the RTR6275 device. The UMTS Rx
input is provided with an on-chip LNA that amplifies the signal before a second stage filter that provides
differential downconverter. This second stage input is configured differentially to optimize second-order
intermodulation and common mode rejection performance. The gain of the UMTS frontend amplifier and
the UMTS second stage differential amplifier are adjustable, under MSM control, to extend the dynamic
range of the receivers. The second stage UMTS Rx amplifiers drive the RF ports of the quadrature RF-
to-baseband downconverters. The downconverted UMTS Rx baseband outputs are routed to lowpass
filters having passband and stopband characteristics suitable for UMTS Rx processing. These filter
circuits allow DC offset corrections, and their differential outputs are buffered to interface shared with
GSM Rx to the MSM IC. The UMTS baseband outputs are turned off when the RTR6275 is
downconverting GSM signals and on when the UMTS is operating.
3.3.2 Transmitter
The UMTS Tx path begins with differential baseband signals (I and Q) from the MSM device.
These analog input signals are amplified, filtered, and applied to the quadrature upconverter mixers.
The up-converter output is amplified by multiple variable gain stages that provide transmit AGC control.
The AGC output is filtered and applied to the driver amplifier; this output stage includes an integrated
matching inductor that simplifies the external matching network to a single series capacitor to achieve
the desired 50-Ω interface.
The RTR6275 UMTS output is routed to its power amplifier through a bandpass filter, and delivers fairly
high-level signals that are filtered and applied to the PA. Transmit power is delivered from the duplexer
to the antenna through the switch module.
The transceiver LO synthesizer is contained within the RTR6275 IC with the exception of the off-chip
loop filter components and the VC-TCXO. This provides a simplified design for multimode applications.
The PLL circuits include a reference divider, phase detector, charge pump, feedback divider, and digital
logic generator.
UMTS Tx. Using only PLL1, the LO generation and distribution circuits create the necessary LO signals
for nine different frequency converters. The UMTS transmitter also employs the ZIF architecture to
translate the signal directly from baseband to RF.
This requires FLO to equal FRF, and the RTR6275 IC design achieves this without allowing FVCO to
equal FRF.
The RTR6275 IC is able to support UMTS 2100/1900 and UMTS 850 mode transmitting. This design
guideline shows only UMTS 2100 applications.
3. TECHNICAL BRIEF
WCDMA_2100_TX
WCDMA_2100_RX
[Figure 1.4] RTR6275 IC functional block diagram
3. TECHNICAL BRIEF
3.4 LO generation and distribution circuits

The integrated LO generation and distribution circuits are driven by internal VCOs to support various
modes to yield highly flexible quadrature LO outputs that drive all GSM/EDGE and UMTS band
upconverters and downconverters; with the help of these LO generation and distribution circuits, true
zero-IF architecture is employed in all GSM and UMTS band receivers and transmitters to translate the
signal directly from RF to baseband and from baseband to RF.
Two fully functional fractional-N synthesizers, including VCOs and loop filters, are integrated within the
RTR6275 IC. The first synthesizer (PLL1) creates the transceiver LOs that support the UMTS
2100/1900/1800 transmitter, and all four GSM band receivers and transmitters including: GSM 850,
GSM 900, GSM 1800, and GSM 1900. The second synthesizer (PLL2) provides the LO for the UMTS
2100/1900/1800 receiver. An external TCXO input signal is required to provide the synthesizer
frequency reference to which the PLL is phase and frequency locked.
The RTR6275 IC integrates most of PLL loop filter components on-chip except two off-chip loop filter
series capacitors, and significantly reduces off-chip component requirement. With the integrated
fractional-N PLL synthesizers, the RTR6275 has the advantages of more flexible loop bandwidth
control, fast lock time, and low-integrated phase error
3.5 Off-chip RF Components
3.5.1 WCDMA PAM (U503: ACPM-7381)

The UMTS PA output power is monitored by l power detector circuits(U500 : RTR6275).
This detector voltage can be used for transmitter calibration and monitor to meet RF system
specification.
FL503
L520 C553
1 4
RX_WCDMA_2100 RX PGND
1nH 2 3
33p TX ANT
ACMD-7602
C554 SDMY0001301
3p
VPWR
C555 C556 C557 SMPY0015501

10u 220p 100p
ACPM-7381 U503
(1608) 11
PGND
10 1 4 5 C559 L522
VCC2 VCC1 C558 L521
C560 U502 33p
9
GND3 RFIN
2 O1 G3
IN
1
WCDMA_2100_TX_OUT
8 3 2.7nH G2 G1
RFOUT VMODE1 33p 33p 4.7nH
SCDY0003402 7 4 3 2
33p C561 GND2 VMODE0
6 5 L524
2
C563 C564 GND1 VEN 10nH

IN
1.5p 10nH
NA C565
OUT
L523
20dB C566 100p
As close as possible100p FL504
50OHM
EFCH1950TDF1
COUP
3
WCDMA_PA_R0
R518 WCDMA_PA_ON
51
R519
PWR_DET
75
R520 R521
91 91
10dB
[Figure 1.5] WCDMA PAM, Duplexer, Coupler
3. TECHNICAL BRIEF
3.5.2 VCTCXO (X500 : TG-5010LH (19.2M))

The Voltage Controlled Temperature Compensated Crystal Oscillator (VCTCXO) provides the
reference frequency for all RFIC synthesizers as well as clock generation functions within the
MSM7200 IC. The oscillator frequency is controlled by the MSM7200 IC.s TRK_LO_ADJ pulse density
modulated signal in the same manner as the transmit gain control TX_AGC_ADJ. A two-pole RC
lowpass filter is recommended on this control line.
The PM7540 IC controls the handset power-up sequence, including a special VCTCXO warm-up
interval before other circuits are turned on. This warm-up interval (as well as other TCXO controller
functions) is enabled by the MSM TCXO_EN line . The PM7540 IC VREG_TCXO regulated output
voltage is used to power the VCTCXO and is enabled before most other regulated outputs.
Any GSM mode power control circuits within the MSM7200 IC require a reference voltage for proper
operation and sufficient accuracy. Connecting the PM7540 IC REF_OUT directly to the MSM6275 IC
GSM_PA_PWR_CTL_REF provides this reference. This sensitive analog signal needs a 0.1 µF low
frequency filter near to MSM side, and isolate from digital logic and clock traces with ground on both
sides, plus ground above and below if routed on internal layers.
3.5.3 Front-End Module (FL500 : LSHS-M090UE)

switch module select the operating frequency and band. UMTS operation requires simultaneous
reception and transmission, so the UMTS Rx/Tx connection is routed to a duplexer that separates
receive and transmit signals. The active connection is MSM-selected by three control lines (GPIO[75],
GPIO[74], and GPIO[731]). These GPIOs are programmed to be ANT_SEL0, ANT_SEL1, and
ANT_SEL2) respectively.

GSM 850 RX - - -
WCDMA HIGH LOW HIGH
[Table 1.2] Front End Module control logic
3. TECHNICAL BRIEF
3.5.4 PMIC Functional Block Diagram (U304 : PM7540)

• Complete power management, housekeeping, and user interface functions for wireless devices (CDMA,
non-CDMA handsets, and PDAs)
• Input power management
- Valid external supply attachment and removal detection
- Supports unregulated (closed-loop) external charger supplies and USB supplies as input power sources
- Supports lithium-ion main batteries
- Trickle, constant current, constant voltage, and pulsed charging of the main battery
- Supports coin cell backup battery (including charging)
- Battery voltage detectors with programmable thresholds
- VDD collapse protection
- Charger current regulation and real-time monitoring for over-current protection
- Charger transistor protection by power limit control
- Control drivers for two external pass transistors and one external battery MOSFET (MOSFET is optional)
- Voltage, current, and power control loops
- Automated recovery from sudden momentary power loss
• Output voltage regulation
- One boost (step-up) switched-mode power supply (SMPS) for driving white LEDs and hosting USB-OTG
- Four buck (step-down), switched-mode power supplies for efficiently generating MSMC1, MSMC2,
MSME, and PA supply voltages
- Supports dynamic voltage scaling (DVS) for MSMC1, MSMC2, and PA outputs
- 18 low-dropout regulator circuits with programmable output voltages, implemented using three different
current ratings: 300 mA (four), 150 mA (ten), and 50 mA (four). These can be used to power MSMA,
MSMP, MSME2, MMC, RFRX1, RFRX2, RFTX, TCXO, SYNT, RUIM1, RUIM2, USB, WLAN, MDDI,
CAM, BT, AUX1, and AUX2 circuits.
- One MIC bias regulator circuit
- All regulators can be individually enabled/disabled for power savings
- Low power mode available on most regulators
- All regulated outputs are derived from a common bandgap reference (close tracking)
• Integrated handset-level housekeeping functions reduces external parts count, size, and cost
- Analog multiplexer selects from five internal and up to 28 external inputs
- Multiplexer output's offset and gain are adjusted, increasing the effective ADC resolution
- Adjusted multiplexer output is buffered and routed to an MSM device ADC
- Dual oscillators: a 32.768 kHz off-chip crystal and an on-chip RC assure MSM device sleep clock
- Crystal oscillator detector and automated switch-over upon lost oscillation
- Real-time clock for tracking time and generating associated alarms
- On-chip adjustments minimize crystal oscillator frequency errors
- Control TCXO warm-up and synchronize, deglitch, and buffer the TCXO signal
- TCXO buffer control for optimal QPH/catnap timing
- Multistage over temperature protection (smart thermal control)
• Integrated handset-level user interfaces
- Four programmable current sinks recommended as keypad backlight, LCD backlight, camera flash, and
general-purpose drivers
3. TECHNICAL BRIEF
- Vibration motor driver programmable from 1.2 to 3.1 V in 100 mV increments

- Two-channel speaker driver with programmable gain, turn-on time, and muting; configurable inputs and
outputs capable of stereo or mono operation (drives external 8-Ω speakers with volume controlled 500
mW, each channel)
- Video (TV) amplifier allows use as a camcorder or for slide presentations
• IC-level interfaces
- Configurable SBI (three-wire or single-wire) for efficient initialization, status, and control
- Supports MSM interrupt processing with an internal interrupt manager
- Many functions monitored and reported through real-time and interrupt status signals
- Dedicated circuits for controlled poweron sequencing, including the MSM device's reset signal
- Several events continuously monitored for triggering poweron/poweroff sequences
- Supports and orchestrates soft resets
- USB-OTG transceiver for full-speed (12 Mb/s) and low-speed (1.5 Mb/s) interfacing of the MSM device to
computers as a USB peripheral, or connecting the MSM device to other peripherals
- Two sets of RUIM level translators enable MSM device interfacing with external modules
• 22 multipurpose pins that can be configured as digital or analog I/Os, bidirectional I/Os, or current sinks;
default functions support the two sets of RUIM level translators, poweron circuits, analog multiplexer
inputs, an LED driver, and a selectable reference voltage output.
• Highly integrated functionality in a small package - 137-pin CSP with a several center ground pins for
electrical ground, mechanical stability, and thermal relief
[Figure 1.6] MSM7200 Interface
3. TECHNICAL BRIEF
[Figure1.7] PM7540 Block Diagram
3. TECHNICAL BRIEF
3.5.5. GSM PAM (U501:TQM7M5003)

The TQM7M5003 is an extremely small (7 x 7 mm), GSM/EDGE PAM for handset
applications. This module has been optimized for excellent EDGE efficiency and Pout in a
Polar Loop environment at EDGE class E2+ operation while maintaining high GSM/GPRS efficiency.
The small size and high performance is achieved with high-reliability 3rd generation InGaP HBT
technology. With 50Ω and output, no external matching or bias components are required. The module
incorporates two highly-integrated InGaP power amplifier die with a CMOS controller. Each amplifier
has three gain stages with on-die inter-stage matching implemented with a high Q passives technology
for optimal performance. The CMOS controller implements a fully integrated power control within the
module for GSM operations, and serves as the AM/AM path in EDGE operations. This eliminates the
need for any external couplers, power detectors, current sensing etc., to assure the output power level.
The module has Tx enable and band select inputs. Module construction is a low-profile overmolded
landgrid array on laminate.
GSM_PA_BAND MODE
LOW GSM
HIGH DCS/PCS
R510
VBAT GSM_PA_RAMP
2.2K
C533
C534 C538
100p 68p GSM_PA_BAND
22u
(1608)
GSM_PA_EN
TQM7M5008
C539 C540 R511
14 1
GND6 DCS_PCS_IN DCS_PCS_TX
4.7p 33p 18
13 2 R512 R513
GND5 BS
L512 300 300
2.2nH 12 3
VCC TX_EN
U501 3 dB
11 TQM7M5008 4
GND4 VBATT
DCS_PCS_OUT
10 5
GND3 GND1
4 5
C541 L513 R514
9
GSM_OUT VRAMP
6 FL501 O1 G3
IN
1
GSM_TX
EFCH897MTDB1 G2 G1
GND8
GND7
6.8nH 18
15p 8 7 SFSY0030201 3 2
R515 R516
L514 GND2 GSM_IN
300 300
17
16
15
12nH
3 dB
[Figure 1. 8] GSM PAM Schematic
3. TECHNICAL BRIEF
3.5.6 UMTS Duplexer(FL503:ACMD-7602)

A UMTS duplexer splits a single operating band into receive and transmit paths. Important
performance requirements include;
• Insertion loss . this component is also in the receive and transmit paths ; In the KS20 typical losses :
UMTS2100_ Tx = 1.28 dB, UMTS2100_ Rx = 1.46 dB
• Out-of-band rejection or attenuation . the duplexer provides input selectivity for the receiver, output
filtering for the transmitter, and isolation between the two. Rejection levels for both paths are
specified over a number of frequency ranges. Two Tx-to-Rx isolation levels are critical to receiver
performance:
• Rx-band isolation . the transmitter is specified for out-of-band noise falling into the Rx band. This
noise leaks from the transmit path into the receive path, and must be limited to avoid degrading
receiver sensitivity. The required Rx-band isolation depends on the PA out of-band noise levels and
Rx-band losses between the PA and LNA. Minimum duplexer Rx band isolation value is about 46.7
dB.
• Tx-band isolation . the transmit channel power also leaks into the receiver. In this case, the leakage
is outside the receiver passband but at a relatively high level. It combines with Rx band jammers to
create cross-modulation products that fall in-band to desensitize the receiver. The required Tx-band
isolation depends on the PA channel power and Tx-band losses between the PA and LNA. Minimum
duplexer Tx-band isolation value is about 51.7dB.
• Passband ripple . the loss of this fairly narrowband device is not flat across its passband. Passband
ripple increases the receive or transmit insertion loss at specific frequencies, creating performance
variations across the band.s channels, and should be controlled.
• Return loss . minimize mismatch losses with typical return losses of 10 dB or more (VSWR <2:1).
• Power handling . high power levels in the transmit path must be accommodated without degraded
performance. The specified level depends on the operating band class and mobile station class (per
the applicable standard), as well as circuit losses and antenna EIRP. Several duplexer characteristics
depend upon its source and load impedances. QUALCOMM strongly recommends an isolator be
used between the UMTS PA and duplexer to assure proper performance.
3. TECHNICAL BRIEF
3.5.7 UMTS Rx RF filter (FL502 : EFCH2140TDE1)

• Frequency range : 2110 ~ 2170MHz
An RF filter is located between the UMTS LNA and mixer. Insertion loss is important, but not as
critical as losses before the LNA. The most important parameters of this component include:
• Out-of-band rejection or attenuation levels, usually specified to meet these conditions:
- Far out-of-band signals - ranging from DC up to the first band of particular concern and from the
last band of particular concern to beyond three times the highest passband frequency.
- Tx-band leakage - the transmitter channel power, although attenuated by the duplexer, still
presents a cross-modulation threat in combination with Rx-band jammers. The RF filter must
provide rejection of this Tx-band leakage.
- Other frequencies of particular concern . bands known to include other wireless transmitters that
may deliver significant power levels to the receiver input.
[Table 1.3] WCDMA Rx SAW Filter Specification
3. TECHNICAL BRIEF
3.5.8 Bluetooth (U403 : BCM2048SKUFBG)

The bluetooth components are an bluetooth module and Antenna. Figure1.5.12-1 shows the bluetooth
system architecture in the KS20.
[Figure1.9] Bluetooth system architecture
3. TECHNICAL BRIEF
3.5.9 WLAN (SWL-2700S)

The MSM7200 supports SDIO interface which can be used for WLAN baseband data communication
with a WLAN module. Because WLAN module includes RF components, the RF parts for KS20 WLAN
include only WLAN module and an antenna. Figure 1.10 shows KS20 WLAN system architecture.
[Figure1.10] WLAN system architecture
3. TECHNICAL BRIEF
3.6 Digital Baseband(DBB/MSM7200)
3.6.1 General Description
A. Features(MSM7200)
• Support for multimode operation - WCDMA(UMTS),GSM/GPRS,EDGE, HSDPA
• The ARM1136-J microprocessor can operate at up to 400 MHz.
• The ARM926EJ-S microprocessor can operate up to 256 MHz.
• Internal 256 MBits stacked DDR memory.
• Java hardware acceleration for faster Java-based games and other applets.
• Supports low-power, low-frequency crystal to enable TCXO shutoff.
• Integrated USIM Controller for direct interface to USIM card
• Software-controlled power management feature
• Integrated Bluetooth 2.0 baseband processor for wireless connectivity to peripherals
• High-speed, serial mobile-display, digital interface that optimizes the interconnection cost between
the MSM device and the LCD panel
• Receive chain diversity support for WCDMA, providing improved capacity and data throughput
• USB OTG core supports both slave and limited host functionality
• Integrated wideband stereo CODEC for digital audio applications
• Direct interface to digital camera module with video front end (VFE) image processing
• Vocoder support (GSM-HR, FR, EFR, AMR, W-AMR, and 4GV)
• Advanced 15 x 15 x 1.4 mm, 0.5 mm pitch, 543-pin lead-free CSP packaging technology
• HSDPA Features
- supports release 5, December 2004 standard for HSDPA
- HSDPA enables PS data speeds up to 7.2 Mbps on the downlink
• WCDMA Features
- supports release 99 June 2004 of the W-CDMA FDD standard
- PS data rates supporting 384kbps DL / 384kbps UL
- CS data rates supporting 64kbps DL / 64kbps UL
- AMR (all rates)
3. TECHNICAL BRIEF
• GSM Features
- Voice features (FR,EFR,AMR,HR)
- Circuit-switched data features(9.6K,14.4K,Fax)
• GPRS Features
- Simple Class A operation
- Multi-slot class 12 data services
- CS schemes CS1,CS2,CS3,CS4
• EDGE Features
- EDGE E2 power class for 8PSK
- Simple Class A, multi-slot class 12
- Downlink/Uplink coding schemes (CS1-4, MCS1-9)
• Operation and Services
- LCD & Camera Interface
- USIM Interface
- Dual Memory Buses(EBI1-SDRAM & EBI2-NAND Flash)
- External Memory Interface (Micro SD)
• Data Communication
- BlueTooth
- Slave USB
3. TECHNICAL BRIEF
3.7 Hardware Architecture
MSM7200
MSM7200
BCM2048
LOUT/ Speaker
Bluetooth
Bluetooth RCV Receiver
UART1
VGA
FM
FMRadio
Radio CAMERA
2M AF
WLAN
WLAN SDIO1 2.8î QVGA LCD
SWL-2700S
SWL-2700S MCP
MCP
EBI1/ DDR 1G
- Touch Controller EBI2
- Joy Stick NAND 2G
- Send, End, Hot, Power GPIO
- Vol. Up/Down
- Camera Shutter MDDI
Int. Mic. MIC1
T Flash WCDMA/HSDPA RF Block

SDIO2 WCDMA
WCDMA Duplexer
Duplexer
PAM
PAM
RTR6275
RTR6275
RF XCVR GSM Switch-
Switch-
XCVR GSM
PAM plexer
plexer
PAM
SIM Card
UART2 UART3
SBI USB1.1
Serial
SerialPort
Port
Cradle
18Pin Cradle
Connector
Connector
Battery
Battery PM7540
1050mAh PM7540 USB
USB
18Pin
RTC
RTCBattery
Battery
[Figure1.11] Simplified Block Diagram of System
3. TECHNICAL BRIEF
3.7.1. Block Diagram(MSM7200)
SDRAM NAND Flash LCD

1G 2G (2.8 inch)
EBI 1 EBI 2 MDDI

Camera 0.3M CAMERA
PROCESSING DUAL MEMORY BUS
(Default 8bit
Interface) MSM7200 GSM/GPRS/EDGE
Camera 2M processor
GRAPHICS ARM1136-J APPS
UMTS, WCDMA,
Open GL ES processor
3D, 2D PLL Modem QDSP4
BT 1.2
VIDEO processor
ARM 926ejs
APPS QDSP 4
MPEG-4 With Jazelle
H.263, H.264
GPIO
Stereo CONNECTIVITY
UART3 / PMIC SBI
18 PIN
Headset MMI
UART2 / RUIM1
AUDIO RF SBI
Keypad I/F
SD/SDIO1
SD/SDIO2
Mono
UART1
JTAG
MP3, AAC,
USB
Speaker Rx ADC
EVRC, QCELP
MIC AMR, CMX, MIDI Tx DAC
4 Bit
18 PIN
MMI
MicroSD
WLAN
PAD
KEY
PM7540
USB
USIM
[Figure1.12] Simplified Block Diagram of MSM7200
3. TECHNICAL BRIEF
3.8. Subsystem(MSM7200)
3.8.1. ARM Microprocessor Subsystem

The MSM7200 device uses an embedded ARM1136-J, ARM926EJ-S microprocessor. This
microprocessor, through the system software, controls most of the functionality for the MSM, including
control of the external peripherals such as the keypad, LCD, SDRAM, and NANDFlash devices.
Through a QUALCOMM proprietary serial bus interface (SBI) the ARM926EJ-S configures and
controls the functionality of the RTR6275 and PM7540 devices..
3.8.2. UMTS Subsystem

The UMTS Subsystem performs the digital UMTS signal processing. Its components include:
• Searcher engine
• Demodulating fingers
• Combining block
• Frame deinterleaver
• Viterbi decoder
• Up-link subsystem
• Turbo decoder
On the down-link channel the UMTS subsystem searches, demodulates, and decodes incoming
CPICH, CCPCH, SCH, and Traffic Channel information. It extracts packet data from the downlink
traffic channel and prepares the packet data for processing. For the up-link, the WCDMA subsystem
processes the packet data and modulates the up-link traffic channel (DCH).
3.8.3. GSM Subsystem

The GSM/GPRS/EGPRS subsystem reuses the MSM6280 GSM core. It performs the digital GSM
signal processing and PA gain controls for GPRS support. The PA output level is controlled by an
analog signal generated on the MSM. In GSM mode, the power profile ramps up before the burst and
ramps down after the burst. In GPRS mode, at the beginning of each burst (up to four active transmit
slots), PA must be smoothly ramped up to some desired output power level, held at that level for the
current slot, smoothly ramped down/up during the transition period and held to the new level for the
next slot until the last slot. Then it must be smoothly ramped down to near-zero level. The MSM6275
support differential GSM PA power control output. The RF interface communicates with the mobile
station external RF circuits. Signals to these circuits control signal gain in the Rx and Tx signal path,
control DC offset errors, and maintain the system frequency reference.
3.8.4. RF Interface
The RF interface communicates with the mobile station’s external RF and analog baseband circuits.
Signals to these circuits control signal gain in the Rx and Tx signal path and maintain The system’s
frequency reference.
3. TECHNICAL BRIEF
3.8.5. Serial Bus Interface(SBI)

The MSM7200 device’s SBI is designed specifically to be a quick, low pin count control protocol for
QUALCOMM’s RTR6275 and PM7540 ASICs. Using the SBI, the RTR6275 and PM7540 devices
can be configured for different operating modes and for minimum power consumption, extending
battery life in Standby mode. The SBI also controls DC baseband offset errors.
3.8.6. Wideband CODEC

The MSM7200 device integrates a wideband voice/audio CODEC into the mobile station modem
(MSM). The CODEC supports two differential microphone inputs, one differential earphone output, one
single-ended earphone output, and a differential analog auxiliary interface.
The CODEC integrates the microphone and earphone amplifiers into the MSM6280 device, reducing
the external component count to just a few passive components.
The microphone (Tx) audio path consists of a two-stage amplifier with the gain of the second stage set
externally. The Rx/Tx paths are designed to meet the ITU-G.712 requirements for digital transmission
systems.
3.8.7. Vocoder Subsystem

The MSM7200 device’s QDSP4000 supports AMR,FR,EFR and HR. In addition, the QDSP4000 has
modules to support the following audio functions: DTMF tone generation, DTMF tone detection, Tx/Rx
volume controls, Tx/Rx automatic gain control (AGC), Rx Automatic Volume Control (AVC), EarSeal
Echo Canceller (ESEC), Acoustic Echo Canceller (AEC), Noise Suppression (NS), and programmable,
13-tap, Type-I, FIR, Tx/Rx compensation filters. The MSM7200 device’s integrated ARM9TDMI
processor downloads the firmware into the QDSP4000 and configures QDSP4000 to support the
desired functionality.
3.8.8. ARM Microprocessor subsystem

The MSM7200 device uses an embedded ARM1136-J, ARM926EJ-S microprocessor. This
microprocessor, through the system software, controls most of the functionality for the MSM device,
including control of the external peripherals such as the keypad, LCD, RAM, ROM, and EEPROM
devices. Through a generic serial bus interface (SBI) the ARM926EJ-S configures and controls the
functionality of the RTR6275 and PM7540 devices.
3. TECHNICAL BRIEF
3.8.9. Mode Select and JTAG Interfaces

The mode pins to the MSM7200 device determine the overall operating mode of the ASIC. The options
under the control of the mode inputs are Native mode, which is the normal subscriber unit operation,
ETM mode, which enables the built-in trace mode, and test mode for factory testing. The MSM7200
device meets the intent of the ANSI/IEEE 1149.1A-1993 feature list. The JTAG interface can be used
to test digital interconnects between devices within the mobile station during manufacture.
3.8.10. General-Purpose Input/Output Interface

The MSM7200 device has general-purpose bidirectional input/output pins. Some of the GPIO pins
have alternate functions supported on them. The alternate functions include USB interface, additional
RAM, ROM, general-purpose chip selects, parallel LCD interface, and a UART interface. The function
of these pins is documented in the various software releases.
3.8.11. UART
The MSM7200 device employs three UARTs. UART1 has dedicated pins while UART2 and UART3
share multiplexed pins.
• UART1 for Bluetooth
• UART2 for USIM interface
• UART3 for data
3.8.12. USB
The MSM7200 device integrates a universal serial bus (USB) controller that supports both
unidirectional and bidirectional transceiver interfaces. The USB controller acts as a USB peripheral
communicating with the USB host.
3. TECHNICAL BRIEF
3.9. Power Block
3.9.1. General
MSM7200, included RF, is fully covered by PM7540(Qualcomm PMIC). PM7540 cover the power of
MSM7200, MSM memory, RF block, Bluetooth, USIM and TCXO. Major power components are :
PM7540(U304) : Phone power supply

MAX8645Y(U702) : LCD Backlight/Flash charge pump
3.9.2. PM7540
The PM7540 device (Figure) integrates all wireless handset power management. The power
management portion accepts power from all the most common sources - battery, external charger,
adapter, coin cell back-up - and generates all the regulated voltages needed to power the appropriate
handset electronics. It monitors and controls the power sources, detecting which sources are applied,
verifying that they are within acceptable operational limits, and coordinates battery and coin cell
recharging while maintaining the handset electronics supply voltages. Eight programmable output
voltages are generated using low dropout voltage regulators, all derived from a common trimmed
voltage reference.
A dedicated controller manages the TCXO warm-up and signal buffering, and key parameters (under-
voltage lockout and crystal oscillator signal presence) are monitored to protect against detrimental
conditions.
MSM device controls and statuses the PM7540 IC using Single Serial Bus Interface (SSBI)
supplemented by an Interrupt Manager for time-critical information. Another dedicated IC Interface
circuit monitors multiple trigger events and controls the power-on sequence.
3. TECHNICAL BRIEF
[Figure1.13] PM7540 Functional Block Diagram
3. TECHNICAL BRIEF
3.9.3. Charging control

A programmable charging block in PM7540 is used for battery charging. It is possible to set limits for
the charging current. The external supply typically connects directly to pin (VCHG). The voltage on this
pin (VCHG) is monitored by detection circuitry to ascertain whether a valid external supply is applied or
not. For additional accuracy or to capture variations over time, this voltage is routed internally to the
housekeeping ADC via the analog multiplexer. PM7540 circuits monitor voltages at VCHARGER and
ICHARGE pins to determine which supply should be used and when to switch between the two
supplies. These pins are connected to the Source (or emitter) and Drain (or collector) contacts of the
pass transistor respectively.
PM7540
Input Power
Management
100~76 (%) 75~51 (%) 50~26 (%) 25~6 (%) 5~0 (%)
KS20 Battery Bar Display(Stand By Condition)
3. TECHNICAL BRIEF
Trickle Charging
Trickle Charging of the main battery, enabled through SBI control and powered from VDD, is provided by
the PM7540 IC, The trickle charger is on-chip programmable current source that supplies current from
VDD to pin (VBAT). Trickle charging can be used for lithium-ion and nickelbased batteries, with its
performance specified below (3.2V). The charging current is set to 80mA.
Parameter Min Typ Max Unit
Trickle Current 60 80 100 mA
PM7540
Input Power
Managemen
t
3. TECHNICAL BRIEF
Constant Current Charging

The PM7540 IC supports constant current charging of the main battery by controlling the charger pass
transistor and the battery transistor. The constant current charging continues until the battery reaches
its target voltage, 4.2V.
Constant Voltage Charging

Constant voltage charging begins when the battery voltage reaches a target voltage, 4.2V.
The end of constant voltage charging is commonly detected 10% of the full charging current.
• Charging Method : CC & CV (Constant Current & Constant Voltage)
¶U Maximum Charging Voltage : 4.2V
¶U Maximum Charging Current : 900mA
¶U Nominal Battery Capacity : 1050mAh
¶U Charging time : Max 2.5h (Except time trickle charging)
¶U Full charge indication current (icon stop current) : 60mA
¶U Cut-off voltage : 3.20V
3. TECHNICAL BRIEF
3.10. External memory interface

A. MSM7200
The MSM7200 device was designed to provide two distinct memory interfaces. EBI1 was targeted for
supporting DDR synchronous memory devices. EBI2 was targeted towards supporting slower
asynchronous devices such as LCD, NAND flash, SRAM, NOR flash etc. To support the high-
bandwidth, high-density, and low-latency requirements of the advanced on-chip applications, the
MSM7200 IC has two high-speed, high-performance memory slave interfaces: the external bus
interface 1 (EBI1) and the stack memory interface (SMI). To achieve higher bandwidth and better use
of the memory device interface, the SMI accepts multiple commands for the external memory device.
The SMI interface acts as a slave device to all of the bus masters within the MSM device. The masters
arbitrate to gain access to the SMI, and upon obtaining the access, they issue commands to the SMI.
The bus masters are connected to the SMI through an advanced extensible interface (AXI) bus bridge
(or global interconnect block) and communicate over a 64-bit, non-blocking AXI bus protocol. The AXI
bus bridge provides the arbitration logic for all of the bus masters.
• EBI1 Features
- Support for only low-power memories at 1.8-V I/O power supply voltage
- AXI bus frequencies up to 133 MHz
- A 16-bit/32-bit static and dynamic memory interface
• DDR SDRAM interface features include:
- Supports both 32-bit DDR SDRAM devices, up to 133-MHz bus speed
- Supports auto precharge and manual precharge
- Supports partial refresh
- Separate CKE pin per chip-select to support partial operation mode
- Idle powerdown to save idling power consumption
• EBI2 Features
- Support for asynchronous FLASH and SRAM(16bit & 8bit).
- Interface support for byte addressable 16bit devices(UB_N & LB_N signals).
- 2Mbytes of memory per chip select.
- Support for 8 bit/16bit wide NAND flash.
- Support for parallel LCD interfaces, port mapped of memory mapped(8 or 16 bit)
• Multi Chip Package : DDR SDRAM and NAND Flash merged 1 package
• 2Gb NAND(8bit) flash memory + 1Gb DDR SDRAM (32bit)
Interface Spec
Device Part Name Maker Read Access Time Write Access Time
NAND SS 45 ns 200 us
KAL009001M-D1YY SS
SDRAM 7.5 ns 7.5 ns
[Table 1.4] External memory interface for KS20
3. TECHNICAL BRIEF
EBI1 EBI2
ADDRESS[15: 0]
NAND_CS*
DATA[31:0]
NAND_RE*
NAND_WE*
WE*
DDR NAND_CLE
CS* NAND
SDRAM CAS* NAND_WP*
MSM7200 2Gb
1Gb RAS* NAND_ALE
CLK_EN NAND_READY (256MB)
(128MB)
CLK[0:1] DATA[7:0]
DQM[3:0]
DQS[3:0]
[Figure1.14] Simplified Block Diagram of Memory Interface
3. TECHNICAL BRIEF
3.11. H/W Sub System
3.11.1. RF Interface
A. RTR6275(WCDMA_Tx, GSM_Tx/Rx)
MSM7200 controls RF part(RTR6275) using these signals.
• SSBDT : SSBI I/F signals for control Sub-chipset
• TX_ON : Power AMP on RF part
• RX0_I/Q_M/P,TX_I/Q_M/P : I/Q for T/Rx of RF
• TX_AGC_ADJ : control the gain of the Tx signal prior to the power amplifier
• DAC_REF : Reference input to the MSM Tx data DACs
[Figure1.15] Block Diagram of RF Interface
3. TECHNICAL BRIEF
B. the others
• TRK_LO_ADJ : TCXO(19.2M) Control
• PA_ON0/PA_RANGE0 : WCDMA(2100) TX Power Amp Enable
• ANT_SEL[0-2] : Ant Switch Module Mode Selection(WCDMA,GSM Tx/Rx,DCS-PCS Tx/Rx)
• GSM_PA_BAND : GSM/DCS-PCS Band Selection of Power Amp
• GSM_PA_RAMP : Power Amp Gain Control of APC_IC
• GSM_PA_EN : Power Amp Gain Control Enable of APC_IC
3. TECHNICAL BRIEF
3.11.2. MSM Sub System

3.11.2.1. USIM Interface
SIM interface scheme is shown in Figure.
And, there control signals are followed
• USIM_CLK : USIM Clock
• USIM_Reset : USIM Reset
• USIM_Data : USIM Data T/Rx
VREG_UIM 2.85V
USIM CLK USIM CLK
USIM Reset
PM7540 USIM Reset USIM
MSM7200 USIM Data USIM Data
[Figure1.16] SIM Interface
3.11.2.2. UART Interface

UART signals are connected to MSM GPIO through IO connector with 115200 bps speed.
GPIO_Map Name Note
GPIO_86 UART3_RX Data_Rx
GPIO_87 UART3_TX Data_Tx
[Table 1.5] UART Interface
3. TECHNICAL BRIEF
3.11.2.3. USB
The MSM7200 device contains a Universal Serial Bus (USB) interface to provide an efficient
interconnect between the mobile phone and a personal computer (PC). The USB interface of the
MSM7200 was designed to comply with the definition of a
peripheral as specified in USB Specification, Revision 1.1. Therefore, by definition, the USB interface
is also compliant as a peripheral with the USB Specification, Revision 2.0.
The USB Specification Revision 1.1 defines two speeds of operation, namely low-speed (1.5 Mbps)
and full-speed (12 Mbps), both of which are supported by the MSM7200.
Name Note
MSM_USB1_VM Data to/from MSM
MSM_USB1_VP Data to/from MSM
nUSB_OE1 Out-Put Enable of Transceiver
VUSB_5.0V USB_Power From Host(PC)
CRADLE_USB_DP USB Data+ to Host
CRADLE_USB_DN USB Data- to Host
[Table 1.6] USB Signal Interface
nUSB_OE1 VUSB_5.0V
MMI
MSM_USB1_VM CRADLE_USB_DP
PM7540 Conn.
MSM7200 MSM_USB1_VP CRADLE_USB_DN (18p)
[Figure1.17] USB block(MSM7200 Side & PM7540 Side)
3. TECHNICAL BRIEF
3.11.3. Key Pad

There are 13 main key buttons that are controlled by MSM7200. Refer to the Keypad circuit. ‘Power
Button’ Key is connected to PMIC(PM7540:GPIO83).
[Table 1.7] Key Matrix Mapping Table
Power Button
KB105
KPDPWR_ON
PRSB6.8C
INSTPAR
D119
[Figure1.18] Power Button Keypad circuit
3. TECHNICAL BRIEF
Button
Volume Up
KB100
KPD_COLUMN1 KPD_ROW1
PRSB6.8C
INSTPAR
PRSB6.8C
INSTPAR
D101
D102
Volume Down
KB101
KPD_ROW2
PRSB6.8C
INSTPAR
D108
Function Key
KB102
KPD_ROW3
PRSB6.8C
INSTPAR
D109
SEND
KB104
KPD_ROW4
D111 D112
PRSB6.8C PRSB6.8C
[Figure1.19] Main Keypad Circuit
Camera Button
KPD_COLUMN2
KPD_ROW1
4 1 KPD_ROW2
3 2
SW100
LS50D23
ESCY0004201
[Figure1.20] Camera Keypad Circuit
3. TECHNICAL BRIEF
END Button
KPD_COLUMN2
KB103
KPD_ROW0
EVLC14S02050
EVLC14S02050
D110
VA100
VA101
PRSB6.8C
[Figure1.21] END Keypad Circuit
5-Way Key
G2
COM2
C A
COM1 E
KPD_ROW0
KPD_COLUMN0 D B
KPD_ROW1
KPD_ROW2
COM3
KPD_ROW3
PRSB6.8C
G1
INSTPAR
KPD_ROW4
SW102
D113
EVQQ7GA50
ESCY0004001
PRSB6.8C
PRSB6.8C
PRSB6.8C
PRSB6.8C
PRSB6.8C
INSTPAR
INSTPAR
INSTPAR
INSTPAR
INSTPAR
D114
D115
D116
D117
D118
[Figure1.22] 5-Way Keypad Circuit
3. TECHNICAL BRIEF
3.11.4. Touch Interface

In KS20, 4-wire touch screen panel is used for user input method. Two resistive layers make up a 4-
wire touch screen panel and are separated by insulating dots. The inside surface of each layer is
coated with a transparent metal oxide coating that generates a gradient across each layer when
voltage is applied.
[Table 1.8] MSM7200 Touch screen connections
[Table 1.9] Recommeded operation conditions
TOUCH SCREEN CONNECTOR

CN101
G2
6
5
TOUCH_Y2YU
4
TOUCH_X2XL
3
TOUCH_Y1YD
2
TOUCH_X1XR
1
PRSB6.8C
PRSB6.8C
PRSB6.8C
PRSB6.8C
G1
ENQY0008602
04-6298-006-000-883
D103
D104
D105
D106
[Figure1.23] Touch screen circuit
3. TECHNICAL BRIEF
3.11.5. Camera Interface

KS20 Installed a 2M Pixel with auto focus and 0.3M Pixel Camera.
The CAM-FPCB with 34pin Board to Board connector (AXK7L34227G) is connected to MSM7200. Its
interface is dedicated camera interface port in MSM7200. The following figure is KS20 camera block
diagram.
MSM7200 2M CAM
CAMERA I/F: 8 CAMERA
CIF_DATA[7:0] CAM_DATA[7:0] POWER
CIF_LV CAM_HSYNC
CIF_FV CAM_VSYNC DVDD
CIF_PCLK CAM_PCLK IOVDD
CIF_MCLK CAM_MCLK LVDD
CIF_RESET# CAM_RST# AVDD
CAM_I2C_SCL CAM_I2C_SCL
CAM_PWR_ON
CAM_I2C_SDA CAM_I2C_SDA
CAM_2M_PWDN CAM_2M_PWDN
CAM_VGA_PWDN
GPIO I/F: CAM_PWR_ON

CAM_PWR_ON VGA CAM
FLASH_PWR_ON CAMERA
FLASH_PWR_ON
CAM_DATA[7:0] POWER
CAM_HSYNC VDD
CAM_VSYNC
CAM_PCLK
CAM_MCLK CAM_PWR_ON
CAM_RST#
CAM_I2C_SCL
CAM_I2C_SDA
CAM_VGA_PWDN
FLASH LED
MAX8631
FLASH_PWR_ON ENF
[Table 1.10] Interface between 2M/VGA Camera Module and MSM7200
3. TECHNICAL BRIEF
The following figures show the flow of camera I/F signals between MSM7200 and camera modules.
The CAM-FPCB with 34pin Board to Board connector (AXK7L34227G) is connected to MSM7200. Its
interface is dedicated camera interface port in MSM7200.
2M CAM CONNECTOR (T=0.9. SOCKET)
CN102
G1 G2
VGA CAM CONNECTOR
1 34
VCAM_1.8V
2 33
CAM_PCLK 3 32
VCAM1_2.6V
4 31
5 30
CN101
nCAM_RST 6 29
CAM_DATA7 1 20
7 28
CAM_DATA6 CAM_VGA_PWDN 2 19
VCAM3_2.6V
8 27
CAM_DATA5 CAM_MCLK 3 18
VCAM1_2.6V
I2C_SDA 9 26
CAM_DATA4 nCAM_RST
I2C_SCL CAM_DATA3 4 17
10 25
CAM_DATA2 CAM_PCLK 5 16
I2C_SCL
11 24 CAM_DATA0 I2C_SDA
12 23
CAM_DATA1 6 15
13 22
CAM_DATA0 CAM_DATA1 7 14
CAM_2M_PWDN 14 21 CAM_DATA2 8 13
CAM_HSYNC
15 20
CAM_MCLK CAM_DATA3 CAM_VSYNC
VCAM2_2.6V 9 12
16 19
CAM_VSYNC
CAM_DATA4 10 11
CAM_DATA7
VCAM3_2.6V
17 18
CAM_HSYNC CAM_DATA5 CAM_DATA6
G3 G4 ENBY0039601
ENBY0015601
GB042-20S-H10-E3000
AXK7L34227G
FPCB to SUB Connector

CN103
G1
1 34
VCAM_1.8V
2 33
3 32
CAM_PCLK 4 31
VCAM1_2.6V
5 30
nCAM_RST 6 29
CAM_DATA7
CAM_2M_PWDN 7 28
CAM_DATA6
CAM_VGA_PWDN 8 27
CAM_DATA5
I2C_SDA 9 26
CAM_DATA4
I2C_SCL 10 25
CAM_DATA3
11 24
CAM_DATA2
12 23
CAM_DATA1
13 22
CAM_DATA0
14 21
15 20
CAM_MCLK
VCAM2_2.6V
16 19
17 18
CAM_VSYNC
VCAM3_2.6V CAM_HSYNC
G2
[Figure1.24] Camera FPCB circuit
3. TECHNICAL BRIEF
VCAM_2.6V
SUB TO FPCB_CAM CONNECTOR (T=0.9. SOCKET)
2.2K
2.2K
R718
R719
FL600 ICVE21184E150R500FR
1 9
CAM_PCLK INOUT_A1 INOUT_B1
VCAM_1.8V
VCAM_2.6V
2 8
nCAM_RST 3
INOUT_A2 INOUT_B2
7
CAM_2M_PWDN DEFAULT_NET_TYPE
INOUT_A3 INOUT_B3
4 6
CAM_VGA_PWDN INOUT_A4 INOUT_B4
G1
G2
VCAM_2.6V
10
5
2.2K
2.2K
CN601
FB600
G1 G2
R601
R602
C725 NA 1 34
2 33
C726 NA R603 0 3 32
4 31 FL602 ICVE21184E150R500FR
5 30 1 9
I2C_SDA 6 29 2
INOUT_A1 INOUT_B1
8
CAM_DATA7
7 28 3
INOUT_A2 INOUT_B2
7
CAM_DATA6
I2C_SCL 8 27 4
INOUT_A3 INOUT_B3
6
CAM_DATA5
9 26
INOUT_A4 INOUT_B4 CAM_DATA4
G1
G2
10 25
10
5
11 24
12 23
13 22
14 21
FB601 15 20 FL603 ICVE21184E150R500FR
VCAM_2.6V
16 19 1 9
FB602 17 18 2
INOUT_A1 INOUT_B1
8
CAM_DATA3
3
INOUT_A2 INOUT_B2
7
CAM_DATA2
G3 G4 4
INOUT_A3 INOUT_B3
6
CAM_DATA1
ENBY0015601
G1
G2
AXK7L34227G
10
5
R621 0 1 9
2
INOUT_A1 INOUT_B1
8
CAM_MCLK
INOUT_A2 INOUT_B2
3 7 TP600
4
INOUT_A3 INOUT_B3
6 TP601
CAM_VSYNC
INOUT_A4 INOUT_B4 CAM_HSYNC
G1
G2
10
5
LCD BL/FLASH LED/CAMERA LDOs

VPWR
U702 MAX8631XETI
1 23
PIN C1P
2
IN C714
C715 1u
22
10u C1N
3 26
24
GND C2P VOUT
PGND C716
29
BGND 1u C717
27
C2N 10u
25
OUT
20
BL_PWR_ON 19
ENM1
ENM2
21 16
FLASH_PWR_ON 18
ENF M1
15
BLED1
CAM_PWR_ON 28
ENLDO M2
14
BLED2
R720
17
P1 M3
13
BLED3
P2 M4 BLED4
100K
100K
100K
12
DNI F1
11
FLED
F2
8 10
SETM F3
R710
R711
R712
9
F4
7
SETF
4 VCAM_2.6V
LDO1
6 5 VCAM_1.8V
6.8K
REFBP LDO2
13K
EUSY0263101
C720 C721 C722
0.01u 2.2u 2.2u
R730
R717
[Figure1.25] Camera module I/F and Camera LDO circuit
3. TECHNICAL BRIEF
The 2 MEGA Camera module is connected to CAM-FPCB with 34pin Board to Board connector
(AXK7L34227G). Its interface is dedicated camera interface port in MSM7200. The camera port
supply 24.576MHz master clock to camera module and receive 49.152MHz pixel clock (15fps),
vertical sync signal, horizontal sync signal, reset signal and 8bits data from camera module. The
camera module is controlled by I2C port from MSM7200.
No Name Port Note

1 GND GND GND
2 CAM_PCLK I Master Clock(45.152M)
3 GND GND GND
4 GND GND GND
5 M_CAM_RESET_N I Camera reset signal
6 GND GND GND
7 NC
8 I2C_SDA O I2C Data
9 I2C_SCL O I2C Clock
10 NC
11 NC
12 GND GND GND
13 M_CAM_PWDN I Camera power down
14 2M_CAM_LVDD_2.6V I LVDD1
15 2M_CAM_LVDD_2.6V I LVDD2
16 2M_CAM_AVDD_2.6V I AVDD1
17 2M_CAM_AVDD_2.6V I AVDD2
18 HSYNC O Horizontal Synch
19 VSYNC O Vertical Synch
20 GND GND GND
21 CLKIN I Master Clock(24.576M)
22 GND GND GND
23 CAM_DATA(0) O Data
31 2M_CAM_CVDD_1.8V O CVDD1
32 2M_CAM_CVDD_1.8V O CVDD2
33 2M_CAM_AVDD_2.6V O AVDD1
34 2M_CAM_AVDD_2.6V O AVDD2
[Table 1.11] Interface of 2 MEGA AF Camera Module
3. TECHNICAL BRIEF
The VGA Camera module is connected to LCD FPCB with 20pin Board to Board connector. Its
interface is dedicated camera interface port in MSM7200. The camera port supply 24.576MHz
master clock to camera module and receive 12.288MHz pixel clock (15fps), vertical sync signal,
horizontal sync signal, reset signal and 8bits data from camera module. The camera module is
controlled by I2C port from MSM7200.
No Name Port Note

1 CAM_PWDN i Camera power down
2 CAM_MCLK I Master Clock(24M)
3 GND GND GND
4 CAM_PCLK O Clock for Camera Data Out(12M)
13 CAM_VSYNC O Vertical Synch
14 CAM_HSYNC O Horizontal Sync
15 GND GND GND
16 I2C_SCD I I2C Clock
17 I2C_SCL I I2C Clock
18 CAM_RESET_N I Camera reset signal
19 VREG_MSMP_2.6V I Camera I/O Power
20 VREG_CAM_2.6V I Camera I/O Power
[Table 1.12] Interface of VGA Camera Module
3. TECHNICAL BRIEF
3.11.6. LED(KEY/Indicator) Light

There are 4 White LEDs in Main key backlight circuit, which are driven by KPD_DR_N line from
PM7540.
Power Keypad LED
100ohm R100 LD101

VPWR
SSC-TWH104-HLS
100ohm R101 LD102

KPD_DRV_N
SSC-TWH104-HLS
100ohm R102 LD103
SSC-TWH104-HLS
100ohm R103 LD104
SSC-TWH104-HLS
D107
PRSB6.8C
[Figure1.26] Schematic of Power Keypad back light circuit
In addition, there is 1 RGB LED in LED Notification-RGB backlight circuit, which are driven by
KEBY_BACKLIGHT line from MSM7200 GPIO78/84/85.
LED Notification-RGB
VPWR
LEMC-S11G LD100
1
4
BLUE
LEDCB1
RED
LEDCR1
GREEN
LEDCG1
[Figure1.27] Schematic of KEY back light circuit
3. TECHNICAL BRIEF
3.11.7. LCD Module Interface

- The LCD module is a Color TFT supplied by EPSON Imaging Devices.
This LCD Module has a 2.8 inch diagonally measured active display area with 240(RGB)X320
resolution. each pixel is divided into Red, Green and Blue sub-pixels and dots which are arranged in
vertical stripes.
* Features
- Display mode(Main LCD) : Normally Black, Transmissive VA mode 265K colors
- LCD Driver IC: S6D0165(SS)
- Driving Method : A-Si TFT Active Matrix
- 4 bit MDDI(Mobile Display Digital interface) I/F
MSM7200 2.8 QVGA MDDI LCD
MDDI I/F MDDI I/F

MDDI_P_STB_P MDDI_STB+ LCD
MDDI_P_STB_M MDDI_STB- POWER LDO LCD_PWR_ON
MDDI_P_DATA_P MDDI_DT+ Vci(2.6)
LCD PWR
MDDI_P_DATA_M MDDI_DT- VccIO(1.8)
GPIO
LCD_RESET RESET
FLM(VSYNC) FLM(VSYNC) LCD
LCD_PWR_ON BLIGHT Charge Pump
LED(AN) BL_PWR_ON
BL_PWR_ON
LED(CA) BL PWR
[Figure1.28] LCD Module Block Diagram
3. TECHNICAL BRIEF
LCD Connector
04-6293-027-001-829
C705
2.2u
ENQY0014201
VLCD_1.8V VLCD_2.6V
FXLP34L6X U700
27 VOUT 6 1
26 BLED1 VCC VCC1
25 BLED2 5 2
24 BLED3 NC A LCD_RESET
23 BLED4 4 3
22 Y GND
21 R706
20 FLM
19 0
18
TP700
17 MDDI_P_STB_M
16
TP701
15 MDDI_P_STB_P
14
13
VLCD_2.6V VLCD_1.8V
12
TP702
11 MDDI_P_DATA_M
10
TP703
9 MDDI_P_DATA_P
8
7
6
5
4
3
2
1 C710 C711 C712 C713
2.2u 0.01u 2.2u 0.01u
CN702 D707
PG05DBTFC
LCD BL/FLASH LED/CAMERA LDOs

VPWR
U702 MAX8631XETI
1 23
PIN C1P
2
IN C714
C715 1u
22
10u C1N
3 26
24
GND C2P VOUT
PGND C716
29
BGND 1u C717
27
C2N 10u
25
OUT
20
BL_PWR_ON 19
ENM1
ENM2
21 16
FLASH_PWR_ON 18
ENF M1
15
BLED1
CAM_PWR_ON 28
ENLDO M2
14
BLED2
R720
17
P1 M3
13
BLED3
P2 M4 BLED4
100K
100K
100K
12
DNI F1
11
FLED
F2
8 10
SETM F3
R710
R711
R712
9
F4
7
SETF
4 VCAM_2.6V
LDO1
6 5 VCAM_1.8V
6.8K
REFBP LDO2
13K
EUSY0263101
C720 C721 C722
0.01u 2.2u 2.2u
R730
R717
[Figure1.29] Display/ LCD FPCB I/F and LCD BL circuit
3. TECHNICAL BRIEF
3.11.8. Audio and Sound
3.11.8.1. Overview of Audio & Sound path
Headset
AMP Head_Set
(U402)
Analog
MSM7200 switch
(U100-1) (U400)
Receiver and
Loud Speaker
SPK
AMP
(U401)
MIC
Head_set MIC
[Figure1.30] Audio Path Block Diagram
3. TECHNICAL BRIEF
3.11.8.2. Audio Signal Processing & Interface

The MSM7200 device integrates a wideband audio CODEC into the mobile station modem. The
wideband codec allows the MSM device to support stereo music/ringer Melody applications in addition
to the 8 kHz voice band applications on the forward link. In the audio transmit path, the device
operates as 13-bit linear converter with software selectable 8 kHz and 16 kHz sampling rate. In the
audio receive path, the device operates as a software selectable 13-bit or 16-bit linear converter with
software selectable 8 kHz, 16 kHz, 22.05 kHz, 24 kHz, 32 kHz, 44.1 kHz, or 48 kHz sampling rate.
Through software, the Rx path can be configured as either a mono or stereo output.
The integrated CODEC contains all of the required conversion and amplification stages for the audio
front end. The CODEC operates as a 13-bit linear CODEC with the transmit (Tx) and receive (Rx)
filters designed to meet ITU-T G.712 requirements. The CODEC includes a programmable sidetone
path for summing a portion of the Tx audio into the Rx path. An on-chip Voltage/Current reference is
provided to generate the precise voltages and currents required by the CODEC. The on-chip voltage
reference also provides a microphone bias voltage required for electret condenser microphones
typically used in handset applications. The MICBIAS output pin is designed to provide 1.8 Volts DC
while delivering as much as 1 mA of current. Audio decoder summing and headset switch detection
are included.
The CODEC interface includes the amplification stages for both the microphone and earphone. The
interface supports two differential microphone inputs and a differential auxiliary input, each of which
can be configured as single-ended if desired. In addition, the interface supports one differential
earphone output, one single-ended earphone output, and one differential auxiliary output or two single-
ended line outputs. The CODEC is configured through the QDSP4000 command types and is not
directly controlled by the microprocessor. The CODEC configuration command is sent to the
QDSP4000 and then the QDSP4000 executes the command and configures the CODEC. Data is
exchanged between the codec interface and the QDSP4000 through its DMA interface. The
QDSP4000 uses the Ex_DMA_4 channel for reading data from the codec and uses the Ex_DMA_5
channel to transfer data to the codec. The CODEC interface is shown in more detail in Figure below.
[Figure1.31] Audio Interface Detailed Diagram(MSM7200)
H5
Q_IP_CH1
B6
LINE_L_IN
B5 C108 1u
LINE_L_IP FM_L
A6
LINE_R_IN
A5 C109 1u
LINE_R_IP FM_R
C1 C104 NA
WIPER
E7
AUXIN
D7 R102 2200 VMIC_BIAS
AUXIP C107 0.1u
B7 R106 2200
MIC1N
A7 C106 0.1u
MIC1P INTERNAL_MIC_P
E6 C110 0.1u
MIC2N
22
20
19
21
D6 C105 3300p
MIC2P HS_MIC
9
8
7
6
5
4
3
2
1
18
17
16
15
14
13
12
11
10
B4
HKAIN2 AMUX_OUT
CN300
F1
HKAIN1 D102
F2
ENRY0006001
HKAIN0 REM_ADC PG05DBTFC
HSEJ-18S04-25
U4 4.87K/1%
TVOUT TV_OUT
SD12T1G
T8 R105 4.7K
D306
TVDAC_R_SET
R4
DAC_IREF RTR_DAC_REF
T4
A_PWR_CTL_REF GSM_PA_DAC_REF
G7
C306 1u HPH_VREF
H9

HPH_L HPH_L
G9
MSM7200 BLK
HPH_R HPH_R
B9 R103 33
PG05DBTFC D304 EAR1_ON MODEM_RCV_N
A9 R104 33
EAR1_OP MODEM_RCV_P
P4
Head Set Jack BLK

I_OUT_N RTR_TXIM
PG05DBTFC D305 N4
FM_ANT
I_OUT_P RTR_TXIP C100 27p
P2
Q_OUT_N RTR_TXQM
R307 DNI P1
Q_OUT_P RTR_TXQP C101 27p
4
5
6
Copyright © 2007 LG Electronics. Inc. All right reserved.

D307
PLR0504F
3
2
1
VDD_RX
WLNA_OUT
VA301 EVLC14S02050
C543
22p
C307 33p
- 67 -
C308 390p
1nH
L516
C309 390p
C310 22p
C311 22p
FB301
FB300
33p
C547
C312 1000p
C550
0.75p
0
0
L518
3.3nH
R306
R305
FL502
1
IN
2
5
EFCH2140TDE1
3
4
G2 O2
G1 O1
HSR
HSL
USC1
USC2
CVBS
HS_MIC
nEAR_DET
MIC_Feedback
WCDMA LNA Circuit
REMOTE_PWR_ON
CRADLE_UART_RX
CRADLE_UART_TX
0.5p
C546
VBAT
L517
L519
1nH
1nH
VUSB_5.0V
VADP_5.0V
WCDMA_MIX_IN_P
WCDMA_MIX_IN_M
LGE Internal Use Only

3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
Handset main MIC BLK
MIC Connector
CN100
1 INTERNAL_MIC_P
2
capacitor
OSF213-42DC
SUMY0010508
NA
D100
Audio Amp for loud Speaker
Speaker Amp
R400 47K
R401 47K
1u
C400
U401 LM4898ITLX-NOPB
B1 C3
VPWR VDD VO2 AMP_OUT_P
C401 0.1u R402 20K C1 A3
LINE_ON IN- VO1 AMP_OUT_N
C402 0.1u R403 20K A1 A2 C403 1u
LINE_OP IN+ BYPASS
TP400 C2 B2
nSPEAKER_SHDN SD_SEL SD_MODE
B3
GND
VPWR
U400
FSA2267AL10X
10
VCC
1 9
MODEM_RCV_P 2
1B0 1A
8
SPKR_N
AMP_OUT_N 1B1 1S nRECEIVER_SW
3 7
MODEM_RCV_N 4
2B0 2S
6
AMP_OUT_P 2B1 2A SPKR_P
GND
5
3. TECHNICAL BRIEF
3.11.8.3. Audio Mode

There are three audio modes (Voice call, speaker phone, MIDI/MP3).
MODE Device Description
Voice Call Receiver Mode Receiver Voice Call
Loud Mode Speaker Phone
Headset Headset Voice Call
Speaker phone Loud Mode Speaker Phone
MIDI Loud Mode Speaker MIDI Bell
Headset Headset MIDI Bell
MP3 Loud Mode Speaker MP3
Headset Headset MP3
[Table 1.13] Audio Mode
3. TECHNICAL BRIEF
Voice Call Receiver Mode Path
Headset
AMP Head_Set
(U402)
Analog
MSM7200 switch
(U100-1) (U400)
Receiver and
Loud Speaker
AMP
(U401)
MIC
Head_set MIC
Voice
Voice + MP3 + MIDI
Voice Call Receiver Mode is routed as below
MSM7200 EAR1ON,EAR1OP -> Analog Switch( U400) -> Receiver
3. TECHNICAL BRIEF
Voice Call Headset Mode Path & Head video Telephony Mode
Headset
AMP Head_Set
(U402)
Analog
MSM7200 switch
(U100-1) (U400)
Receiver and
Loud Speaker
AMP
(U401)
MIC
Head_set MIC
Voice
Voice + MP3 + MIDI
Voice Call Headset Mode is routed as below
MSM7200 HPH_L, HPH_R -> 18Pin MMI -> Headset
3. TECHNICAL BRIEF
Voice Call Speaker Phone Mode
Head_Set
Headset
AMP Receiver and
(U402) Loud Speaker
Analog
MSM7200 switch
(U100-1) (U400)
AMP
(U401)
MIC
Head_set MIC
Voice
Voice + MP3 + MIDI
Voice Call Speaker Phone Mode is routed as below
MSM7200 LINE_ON, LINE_OP -> AMP(U401) ->Analog Switch( U400 ) -> Loud speaker
3. TECHNICAL BRIEF
MIDI Ring Tone/MP3 (Speaker)
Head_Set
Headset
AMP Receiver and
(U402) Loud Speaker
Analog
MSM7200 switch
(U100-1) (U400)
AMP
(U401)
MIC
Head_set MIC
Voice
Voice + MP3 + MIDI
MIDI Ring Tone/MP3 Mode is routed as below
MSM7200 HPH_L -> AMP(U401) -> Loud speaker
3. TECHNICAL BRIEF
MIDI Ring Tone/MP3 (Headset)
Headset
AMP Head_Set
(U402)
Analog
MSM7200 switch
(U100-1) (U400)
Receiver and
Loud Speaker
AMP
(U401)
MIC
Head_set MIC
Voice
Voice + MP3 + MIDI
MIDI Ring Tone/MP3 Headset Mode is routed as below
MSM7200 HPH_L, HPH_R -> 18PIn MMI ->Headset
3. TECHNICAL BRIEF
Audio & Sound Main Component

There are 6 main components in CU320.
Component Design No. Maker Part No. Note
1 MSM7200 U100 MSM7200 Base-Band Modem
2 Audio amp U401 LM4898 Class-AB Audio Amp
3 Analog Switch U400 FSA2267AL10X 1 Channel Analog SW
4 Receiver & CN701 EMS1810TPB1P 8 ohm receiver & Load

Load Speaker Speaker
5 MIC CN100 OSF213-42DC -42 dB microphone
6 MMI Conn CN300 HSEJ-18S04-25R 18Pin MMI Connector
[Table 1.14] Audio main component list
3. TECHNICAL BRIEF
3.12. Main Features
1. LG KS20 Main Features

- Bar Type Simple & Stylish design
- UMTS 2100 + GSM 900 + DCS 1800 + PCS 1900 based GSM/GPRS/EDGE/UMTS
- HSDPA 3.6Mbps
- 2.8” QVGA LCD (262K TFT)
- Touch Sensitive User Interface
- Dual Camera (2M Pixel w AF + VGA(0.3M Pixel))
- Stereo Headset & Speaker phone
- 72 Poly Sound
- MP3/AAC/AMR/MIDI/3GP/SMAF decoder and play
- MPEG4 encoder/decoder and play/save
- JPEG en/decoder
- Supports Bluetooth and USB
- Supports WLAN
- Internal User Memory over 128MB
- 1050 mAh (Li-Ion Polymer)
- Windows MobileTM 6 Professional
- Microsoft Office Mobile
3. TECHNICAL BRIEF
2. KS20 Main Component
RF Bluetooth PMIC BB/MEM/Logic
Main board, Top Main board, Bottom
SD/SIM CAM WLAN

Logic
Socket
Sub board, Top Sub board, Bottom
3. TECHNICAL BRIEF
KEY-FPCB/Folder Assy, Top Folder Assy, Bottom
CAM-FPCB
3. TECHNICAL BRIEF
RF
ANT501 FL500 FL503 U503 L504 U403
SW500
U500
FL502 X500 U501 FL501
Reference Description Reference Description
U500 RTR6275 FL500 Switch
FL502 UMTS2100 RX SAW filter SW500 Test Connector

FL503 UMTS 2100 Duplexer X500 VCTCXO
U503 UMTS PA U403 Bluetooth RF Transceiver
FL504 UMTS 2100 TX SAW Filter FL501 UMTS2100 RX SAW filter
U501 TX Dual PAM
3. TECHNICAL BRIEF
Logic / BB / MEM / Audio
U401
LD400 U400
U402
U304
CN300
ANT400
U301
U303 U100 CN301 U201 U300 U302
Reference Description Reference Description
LD400 Camera Flash U201 Memory, MCP
U304 PMIC, PM7540 U300 Charging/Power Switch

ANT400 Bluetooth ANT. U302 Over-voltage Protection
U301 Switch, UART CN300 MMI Connector(18p)
U303 Switch, USB U402 Audio, Headset Amp
U100 MCU, MSM7200 U400 Audio Sig. Switch
CN301 Battery Connector U401 Audio, Speaker Amp
3. TECHNICAL BRIEF
Logic
CN700
CN601
CN701
M600
CN600 CN702
CN602
U702 BAT700
CN603
F1_CN101
F1_CN103 F1_CN102
CN100
SW101
CN101 ANT100
Ref. Description Ref. Description

LCD BL/Flash Driver / 2 Sub Board to KEY
U702 CN600
LDO FPCB connector(27p)
U701 Speaker Contact PAD CN700 Vibrator Connector
Sub board to CAM Sub board to Main
CN601 CN602
FPCB connector . Board connector(90p)
CN702 LCD connector(27p) M600 WLAN
BAT700 Backup Battery CN603 WLAN Cable connector
F1_CN101 VGA connector(20p) F1_CN102 2M connector(34p)
CAM FPCB to Sub
F1_CN103 SW101 WLAN Cable connector
board connector(34p)
CN101 Touch connector(6p) CN100 MIC
ANT100 WLAN Antenna
4. TROUBLE SHOOTING
4. TROUBLE SHOOTING
4.1 RF Component
TOP SIDE
4. TROUBLE SHOOTING
BOTTOM SIDE
4. TROUBLE SHOOTING
4. TROUBLE SHOOTING
4.2 SIGNAL PATH_UMTS RF
➞ Common Tx/Rx
➞ UMTS 2100 Tx/Rx
➞ UMTS 2100 Tx
➞ UMTS 2100 Rx
➞ Tx I/Q
➞ LO
➞ Rx I/Q
4. TROUBLE SHOOTING
4.3 SIGNAL PATH_GSM RF
➞ Common Tx/Rx
➞ GSM900 Tx
➞ DCS/PCS Tx
➞ DCS Rx
➞ PCS Rx
➞ EGSM900 Rx
➞ Tx I/Q
➞ LO
➞ Rx I/Q
4. TROUBLE SHOOTING
4.4 Checking VCTCXO Block
The reference frequency (19.2MHz) from X100 (TCXO) is used in UMTS TX

part, GSM part and BB part.
TP1
TCXO Circuit VTCXO_2.85V

TP2
C542 C544
TP4
1000p 0.1uF
X500
R517 1 4
RTR_TRK_LO_ADJ VCONT VCC
100ohm
2 3 100p C548
C551 GND OUT TCXO_PM_19.2MHz
0.01u
19.2MHz
1000p C552
TCXO_RTR_19.2MHz
EXSK0007802
TG-5010LH_19_2M_75A
TP3
Schematic of the TCXO Block
TP4 TP2
TP3
TP1
Test Point of the TCXO Block
4. TROUBLE SHOOTING
Check C355 of PMIC (U304)
Check R112 of MSM (U100)
4. TROUBLE SHOOTING
4.5 Checking Front-End Module Block

ANT500 ANT501
TP1
R500
SW500
0
L500 C502 KMS-506 C503 L501
G2
ANT
G1
RF VRF_SMPS
3.9nH 4.7p 15nH
33p
C505 C506
ENWY0002301 L502
1.5p NA C509
100nH
0.1u
Rev.F
FL500
LSHS-M090UE
14 11
ANT_SEL0 15
VC1 ANT
ANT_SEL1 16
VC2
13
ANT_SEL2 VC3 VDD
1 7
GND1 NC
2
GND2
C514 C515 C516 4 3
33p 33p 33p GND3 DCS_PCS_TX
5 6
GND4 EGSM_TX
8 9
GND5 UMTS_TX_RX
10 19
GND6 DCS_RX2
12 20
GND7 DCS_RX1
17 21
GND8 PCS_RX2
18 22
GND9 PCS_RX1
25 23
PGND1 EGSM_RX2
26 24
PGND2 EGSM_RX1
SFAY0010001
Schematic of the Front-End Module Block
ANT_SEL0
ANT_SEL1
ANT_SEL2
TP1
Test Point of the Front-End Module Block
4. TROUBLE SHOOTING
Logic Table of the FEM

GSM 850 RX - - -
WCDMA HIGH LOW HIGH
Check VCC
TP1 VRF_SMPS
4. TROUBLE SHOOTING
4.6 Checking UMTS Block
4.6.1 Checking Tx level
ANT500 ANT501
R500
TP1
SW500
0
L500 C502 KMS-506
G2
ANT RF
G1
3.9nH 4.7p
C505 C506
1.5p NA ENWY0002301
MA L515
2.7nH VDD_RX
C543
L516
WCDMA LNA Circuit
L517
22p
1nH FL502
EFCH2140TDE1 1nH
C545
5 4
C549 C547 L518
0.5p 1 G2 O2
33p
TP2 WLNA_OUT
33p
C550
3.3nH
IN
2
G1 O1
3
C546
0.5p
0.75p
L519
1nH
FL503
C553
1 4
RX PGND
33p
2
TX
ACMD-7602
ANT
3
TP4
C554 SDMY0001301
3p
VPWR
TP3 C555
10u
C556
220p
C557
100p
SMPY0015501
ACPM-7381 U503
(1608) 11
PGND
10 1 4
VCC2 VCC1 C558 L521
C560 U502 33p
9
GND3 RFIN
2 O1 G
8 3 2.7nH G2 G
RFOUT VMODE1 33p
SCDY0003402 7 4 3
6 5
2

IN
1.5p NA C565
OUT
L523
20dB C566 100p
As close as possible100p FL5
50OHM
EFCH
COUP
3
WCDMA_PA_R0
R518 WCDMA_PA_ON
51
R519
PWR_DET
75
R520 R521
91 91
10dB
For testing, Max power of UMT 2100 is needed.
4. TROUBLE SHOOTING
Run a FTM program

set RF mode to IMT
set uplink freq. To
9750 click Tx on and
WCDMA set PA range
R1 on set Tx AGC to
410
Check coupler U103
U502
Check Tx SAW Check Duplexer

Filter FL104
FL503
Check PAM block Check FEM FL100

FL500
4. TROUBLE SHOOTING
4.6.2 Checking UMTS PAM Control Block

• PAM control signal
1. PWR_DET : UMTS Tx Power Detected value (Check R519)
2. TX_AGC_ADJ : UMTS RTR6275 Tx Amp Gain Control
3. +VPWR: UMTS PAM Main Voltage (3V < +VPWR < 4.2V)
4. PA_ON : Turns the PA on and off
5. PA_R0 : Control signals that step the active PA mode and bias
4. TROUBLE SHOOTING
4.6.3 Checking RF Rx Level
ANT500 ANT501
TP1
R500
SW500
0
L500 C502 KMS-506
G2
ANT RF
G1
3.9nH 4.7p
C505 C506
1.5p NA ENWY0002301
Vbias
WCDMA L515
2.7nH VDD_RX
C543
L516
WCDMA LNA Circuit
22p
1nH FL502
C545
0.5p
C549
TP2 C547
EFCH2140TDE1
L518 5
G2 O2
4
1
33p WLNA_OUT IN C546
G1 O1
TP3
3.3nH 0.5p
33p 2 3
C550
0.75p
FL503
L520 C553
1 4
RX_WCDMA_2100
1nH
33p
2
RX
TX
PGND
ANT
3
TP4
ACMD-7602
C554 SDMY0001301
3p
VPWR
C555 C556 C557 SMPY0015501

10u 220p 100p
ACPM-7381 U503
(1608) 11
PGND
10 1
VCC2 VCC1 C558 L521
C560 U502 33p
9
GND3 RFIN
2
8 3 2.7nH
RFOUT VMODE1 33p
SCDY0003402 7 4
6 5
2

IN
1.5p NA C565
OUT
L523
20dB C566 100p
As close as possible100p
50OHM
COUP
3
WCDMA_PA_R
R518 WCDMA_PA_O
51
R519
PWR_DET
75
R520 R521
91 91
4. TROUBLE SHOOTING
Check Vbias over 2V?
Check the RF S/W
Check TP2
Signal exist? Check FEM
Check TP3 Check the Duplexer

Signal exist? FL104
FL503
Check TP4
Check the RTR6275
Signal exist?
4. TROUBLE SHOOTING
4.7 Checking GSM Block
4. TROUBLE SHOOTING
4.7.1 Checking RF Tx level
4.7.2 Schematic of RF Tx level

ANT500 ANT501 TP1
R500
SW500
0
L500 C502 KMS-506 C503 L501
G2
ANT
G1
RF VRF_SMPS
3.9nH 4.7p 15nH
33p
C505 C506
ENWY0002301 L502
1.5p NA C509
100nH
0.1u
DCS(1805-1880 MHz)
Rev.F
FL500
LSHS-M090UE
14 11
ANT_SEL0 15
VC1 ANT
ANT_SEL1 16
VC2
13 PCS(1930-1990 MHz)
ANT_SEL2 VC3 VDD
1 7
GND1 NC
2
GND2
C514 C515 C516 4 3
33p 33p 33p GND3 DCS_PCS_TX
5 6
GND4 EGSM_TX
8 9
GND5 UMTS_TX_RX
10 19
12
GND6
GND7
DCS_RX2
DCS_RX1
20 GSM(925-960 MHz)
17 21
GND8 PCS_RX2
18 22
GND9 PCS_RX1
25 23
PGND1 EGSM_RX2
26 24
PGND2 EGSM_RX1
SFAY0010001
ANTENNA SWITCH MODULE LOGIC

GSM 850/GSM 900 TX HIGH HIGH LOW GSM_PA_BAND MODE
GSM 1800/GSM 1900 TX HIGH LOW LOW LOW GSM
HIGH DCS/PCS
GSM 850 RX - - -
TP2
GSM 1800 RX LOW LOW LOW VBAT
C533
GSM 1900 RX LOW LOW HIGH C534 C53
100p 68p
22u
WCDMA HIGH LOW HIGH (1608)
TQM7M5008
C539 C540
14 1
TP3
GND6 DCS_PCS_IN
4.7p 33p
13 2
GND5 BS
L512
2.2nH 12 3
VCC TX_EN
U501
11 TQM7M5008 4
GND4 VBATT
DCS_PCS_OUT
10 5
GND3 GND1
C541 L513
9 6
GSM_OUT VRAMP
GND8
GND7
6.8nH
15p 8 7
L514 GND2 GSM_IN
GSM
17
16
15
12nH
4. TROUBLE SHOOTING
4.7.3 Checking RF Tx level
4. TROUBLE SHOOTING
4.7.4 Checking PAM Block
TP1. GSM_PA_RAMP : Power Amp Gain Control. typically, 0.2V < Vramp < 1.6V
TP2. GSM_PA_EN : Power Amp Enable
(Power ON : higher than 1.25V , Power OFF : lower than 0.4V)
TP3. GSM_PA_BAND : Power Amp Band Selection Control
(GSM Mode : -0.2V < VBS < 0.4V , DCS/PCS Mode : 1.25V < VBS < 3.0V)
TP4. +VPWR : PAM Supply Voltage Vcc higher than 3.0V
Schematic of GSM PAM Block TP4 TP1

TP2
R510
VBAT GSM_PA_RAMP
2.2K
C533
C534 C538
22u
(1608)
GSM_PA_EN
TQM7M5008
C539 C540
14 1
GND6 DCS_PCS_IN
4.7p 33p
13 2
GND5 BS
L512
12 3
2.2nH VCC
U501
TX_EN
TP3
11 TQM7M5008 4
GND4 VBATT
DCS_PCS_OUT
10 5
GND3 GND1
4 5
C541 L513
9
GSM_OUT VRAMP
6 FL501 O1 G3
IN
1
EFCH897MTDB1 G2 G1
GND8
GND7
6.8nH
15p 8 7 SFSY0030201 3 2
L514 GND2 GSM_IN
17
16
15
12nH
4. TROUBLE SHOOTING
4.7.5 Checking RF Rx Block
TP1. DCS RX INPUT

TP2. PCS RX INPUT
TP3. GSM RX INPUT
Schematic of `GSM900/DCS/PCS Rx Block
C503 L501
VRF_SMPS
15nH
33p
L502
C509
100nH
0.1u
L503 5.6nH
TP1 DCS(1805-1880 MHz) L504

15nH
L505 5.6nH
0
11 L506 5.6nH
ANT
VDD
13
TP2 PCS(1930-1990 MHz) L507
12nH
7 5.6nH
NC L508
3
DCS_PCS_TX
6 L509 27nH
EGSM_TX
9
UMTS_TX_RX
DCS_RX2
19
20
TP3 GSM(925-960 MHz)
L510
33nH
DCS_RX1
21
PCS_RX2 L511 27nH
22
PCS_RX1
EGSM_RX2
EGSM_RX1
23
24 TP3
010001
4. TROUBLE SHOOTING
4. TROUBLE SHOOTING
4.8 Checking Bluetooth Block

Test Point of the Bluetooth Block
Top
TP1. VBT_2.6V
TP2. VBT_CORE_2.6V
TP3. TCXO_BT
TP4. BT ANT Output
Bottom
4. TROUBLE SHOOTING
Schematic of the Bluetooth Block
TP4
ISCA TYPE
SNGF0017401 BLUETOOTH_Broadcom
ANT400 C410 FL400 LFB212G45SG8A166
C411 2.2p
GND3 FEED IN OUT
GND2 GND1 GND1 GND2

33p
SNGF0022801 C412 L400 L401
10OL21C7AJ00005 3.3nH NA
NA
L405
10nH
TP1
C414 1000p
FM_ANT
C415
R406 150K H2 F7
47p
F1
RES UART_CTS_N
C9
BT_UART_RTS VBT_2.6V
L402
100nH
C417 C416 NA
G1
D4
RFIOP
RFION
UART_RTS_N
UART_RXD
UART_TXD
J9
K10
BT_UART_CTS
BT_UART_TXD
BT_UART_RXD
TP2
47p FMPLLCAP
D1 J6
FMRF_INP TM3
C1 F6
FMRF_INN TM2
A3 J7
FMVCO_LP TM1 R407
A2 K7
C418 0.1u FMVCO_LN TM0 NA
A1
VREG_FM_1.5V FM_CVAR
L403 K6 D5
56 nH
FM_R K5
AUDIOL VREG_CTL
B5
BT_REG_CTL
ELCH0012503 FM_L AUDIOR VREG_BT VREG_BT_1.5V
J5 A5
AUDIOGND VREGFM_DAC VREG_FM_1.5V
A6
VDDR5V VBT_CORE_2.6V
K2 B6
XTALP VDDR3V
K3 K8
XTALN U403 VDDO18_1
1u
1u
B4 A8
BT_32KHz LPOIN BCM2048SKUFBG VDDO18_2
F9
VDDO18_3 FB400
D10 G5
GPIO7 VDDC1 VREG_BT_1.5V
C419
C420
B8 D9
X400 FM_IRQ G6
GPIO6 VDDC2
G7 SFBH0008101
26MHz GPIO5 VDDC3
4 3 E6 A7
TP3
GPIO4 VDDC4
1 2 G9 J10
GPIO3 VDDC5
F10 E1 C421 1.8p
TSX-3225_26MHZ
EXXY0024401
WLAN_ACTIVE H9
GPIO2 VDDRF1
E2
BT_HOST_WAKEUP H10
GPIO1 VDDRF2
K1
C422 C423 BT_WAKEUP E7
GPIO0 VDDPLL
J3
10p 10p A_GPIO7 VDDXO
B7 J1
A_GPIO6 VDDLO
K9 A4
BT_ACTIVE E9
A_GPIO5 VDDFM1
B1
VREG_FM_1.5V
BT_PRIORITY TP402 A10
A_GPIO4 VDDFM2
B3
BT_PCM_OUT TP403 B10
A_GPIO3 VDDFM3
J4
C424 C425
BT_PCM_IN TP404 C10
A_GPIO2 VDDFM4
K4
0.1u 1u
BT_PCM_SYNC TP405 B9
A_GPIO1 VDDFM5
A9
BT_PCM_CLK A_GPIO0 VDDO33_1
E10
VBT_2.6V
R408 NA VDDO33_2
D6 J8
VBT_2.6V RST_N VDDO33_3
VSS10
VSS11
VSS12
VSS13
VSS14
VSS1
VSS2
VSS3
VSS4
VSS5
VSS6
VSS7
VSS8
VSS9
C426
0.1u
J2
F2
F4
F5
E4
E5
B2
C2
D2
D7
H1
G10
G2
G4
nBT_RESET
D400
PG05DBTFC
4. TROUBLE SHOOTING
Start
TP1,TP2 NO
Change th Main board
Signals exits?
YES
NO
TP3
Is clock ok? 26MHz Change the X400
YES
NO
TP4
Change the U403
Signals exits?
YES
Change the Main
4. TROUBLE SHOOTING
4.9 Checking WLAN Block

KS20 WLAN initial power sequence is :
WLAN_PWD controlled by MSM7200 GPIO goes to high (2.6V), SYS_RST_L in the WLAN module
goes to low by inverting WLAN_PWD signals -> WLAN_PWR_ON controlled by MSM7200 GPIO goes
to high (2.6V) ◊ VWLAN_3.3V goes to 3.3V first ◊ VWLAN_2.6V and VWLAN_1.8V go to 2.6V and
1.8V, respectively. -> WLAN_PWD is low, and SYS_RST_L is high after all WLAN power signals go on
KS20 WLAN initial operation is :
32KHZ_ON controlled by MSM7200 GPIO goes to low for turning on sleep clock oscillator -> A WLAN
32.768 kHz sleep clock starts to operate -> WLAN power goes to high -> WLAN module scans access
points for network access, for which RF parts in the module start to operate -> After association
process to the wireless network in the KS20 set, users can use Wireless LAN.
Start
NO Change Key FPCB or

Check WLAN antenna in the Key FPCB
YES
NO
RF cable is connected? Connect RF cable to RF switch
YES
NO
Check Sleep Clock in the R632 Check X600 sleep clock oscillator
YES
NO Check U600 for 1.8V, and U601 for

Check WLAN power in the C610 (1.8V),
611 (3.3V), and 613 (2.6V) 3.3V, and U605 for 2.6V
YES
Check WLAN_PWD and SYS_RST_L NO

power sequence in the R651 and C624. Check Q603 inverter
YES
Change the Sub board
4. TROUBLE SHOOTING
[ WLAN part 2 ( RF cable ) ]
WLAN RF Switch
WLAN Antenna
[ WLAN part 1 ( Key FPCB Front ) ]
WLAN RF Switch
[ WLAN part 3 ( Sub Board Bottom ) ]
4. TROUBLE SHOOTING
C624 to check SYS_RST_L

R651 to check WLAN_PWD
R632 (32.768kHz sleep clock measurement point)
U600 1.8V DC-DC converter
C 611 (3.3V)
C 610 (1.8V)
C 613 (2.6V)
4. TROUBLE SHOOTING
U601 3.3V LDO
U605 2.6V LDO
X600 Sleep Clock Oscillator
[ WLAN part 6 ( Sub Board Top ) ]
Waveform - R632 (32.768kHz sleep clock measurement point)
4. TROUBLE SHOOTING
4.10 Power ON Troubleshooting

Power On sequence of KS20 is :
PWR key press(Key FPCB) -> KPDPWR_ON go to low(D119),PM7540 KPDPWR_N pin(C12) ->
PM7540 Power Up -> VMSMC1_1.2V(C338), VMSMC2_1.2V(C339), VMSME_1.8V(C340),
VMSMP_2.6V(C352), VMSMA_2.6V(C351), VTCXO_2.85V(C355) power up and system reset
assert to MSM -> Phone booting and PS_HOLD(D311) assert to PMIC
Start
NO Change or charging the

Battery voltage. higher
than 3.20V? Battery
YES
D119 high to low NO Check the Key Dome

when key press?
YES
VMSMC1_1.2V, VMSMC2_1.2V, NO
VMSMP_2.6V, VMSME_1.8V, Change the Main board
VTCXO_2.85V, VMSMA_2.6V power up?
YES
Is clock ok? NO
R314 : 19.2M Check the TXCO
X300 : 32.768Khz
YES
Check an U100 SMT status

by X-ray
Exchange U100 or
Change the Main board
And Retest
4. TROUBLE SHOOTING
Waveform : R314, 19.2MHz
Waveform : X300, 32.768Khz
4. TROUBLE SHOOTING
D319
[ KS20 KEY FPCB Front ]
VMSMA_2.6V
VTCXO_2.85V
R314 : 19.2Mhz
VMSMP_2.6V
X300 : 32.768Khz
VMSMC1_1.2V
VMSMC1_1.2V VMSME_1.8V
[ KS20 Main PCB Bottom ]
4. TROUBLE SHOOTING
4.11 Charger Troubleshooting
TA OVP Circuit
TA
VADP_5.0V
(4.8V) NUS3065MUTAG U302
9
DRAIN_THERMAL
8 1
VCC IN
7 2
OUT GND
FL300
6 3 1 2
GATE CNTRL IN OUT VCHG_5.0V
5 4 3 4
SRC DRAIN G1 G2
NFM21PC105B1A3
C313
1u
Battery Charging Circuit
U300 NUS3116MTR2G
10 9
VBAT P_DRAIN P_COLLECTOR
1 8 Pass Tr
VCHG_5.0V EMITTER1 BASE1 CHG_CTL_N
(ON)
USB 2 7
Cable
VUSB_5.0V EMITTER2 BASE2 USB_CTL_N Pass Tr
(ON)
3 6 Battery FET
ISNS_P COLLECTOR GATE BAT_FET_N
(ON)
4 5
R304
0.1
SOURCE DRAIN VBAT

PG05DBTFC
PG05DBTFC
PG05DBTFC
Main
ISNS_M Battery
Charging
VPWR
Current Flow
D301
D302
D303
C304 C305
22u 0.01u
Charging Procedure Troubleshooting Setup

- Connect TA or USB Cable - Connect TA and battery to the phone
- Control the charging current by PM7540 IC Troubleshooting Procedure
- Charging current flows into the battery - Check the charger (TA or USB Cable)
Check Point connector
- Connection of TA or USB Cable - Check the OVP Circuit
- Charging current path - Check the charging current Path
- Battery - Check the battery
4. TROUBLE SHOOTING
Start
Check the pin and battery

Connect terminals of I/O
connector
NO
Change I/O connector
Connection OK?
Yes
NO
Is the TA (or USB Cable) Change TA
voltage 4.8V (or 5.0V)? (or USB Cable)
Yes
Is it charging properly Yes

END
After turning on U302, U300
NO

by X-ray
Exchange U100 or
And Retest
[ Charger Troubleshooting Flow ]
4. TROUBLE SHOOTING
R304
U302
U300
[ Charging part ( Main PCB Front ) ]
4. TROUBLE SHOOTING
4.12 USB Troubleshooting

USB Initial sequence of KS20 is :
USB connected to KS20 power on → VBUS_5.0V(Q400) go to 5V → MSM7200 48M PLL work →
USB_DAT is triggered → USB_CTL_N go to 0V → USB work.
Start
NO
Power is on? Go to power on trouble shooting
YES
NO
Cable is inserted? Insert cable
YES
NO
C314 is 5V? Check C314, CN300#16
YES
NO
USB_CTL_N is 0V? Check U300 (pin 7)
YES

by X-ray
Exchange U304 or
And Retest
4. TROUBLE SHOOTING
[ USB part 1 ( Main PCB) ]
C314 Battery Charging Circuit

47K
C314 U300 NUS3116MTR2G

2.2u 10 9
VBAT P_DRAIN P_COLLECTOR
R308
1 8
VCHG_5.0V EMITTER1 BASE1 CHG_CTL_N
2 7
VUSB_5.0V VUSB_5.0V EMITTER2 BASE2 USB_CTL_N
3 6
ISNS_P COLLECTOR GATE BAT_FET_N
VCHG_5.0V 4 5
R309 10
R304
0.1
SOURCE DRAIN VBAT

R310
PG05DBTFC
PG05DBTFC
PG05DBTFC
1u ISNS_M
C320
10K
VPWR
D301
D302
D303
C304 C305
22u 0.01u
[ USB part 2 ( Main PCB ) ]
4. TROUBLE SHOOTING
4.13 SIM Detect Troubleshooting

USIM Initial sequence of KS20 is :
SIM_CLK,SIM_RST,SIM_IO triggered → VRUIM_3.0V go to 2.8V → SIM IF work
Start
Re-insert the SIM card
Yes
Work well? End
No
NO
VRUIM_3.0V is 2.85V? Check CN400
SIM_CLK is run?
YES
Change SIM card
Yes
Work well? End
No
4. TROUBLE SHOOTING
1 VRUIM_3.0V
2 SIM_RST
3 SIM_CLK
7 SIM_IO
123567
VRUIM_3.0V
SIM_IO
SIM_RST
SIM_CLK
PLR0504F
0
R701 4 3
5 2
6 1
D701
15K
R702
C701 0.1u
D702
C702 33p
1 6
C703 33p
2 5
C704 33p
3 4
PLR0504F
20
16
15
14
13
12
11
21
S1
S5
S2
S6
S3
S7
G2
G3
S8
10
T8
9
T7
8
T6
7
T5
S700 6
T4
ENSY0018601 5
T3
49448-1611 4
T2
3
T1
2
S4
1
ST1
17
G1
ST2
18 D706
19
Figure .USIM part schematics
4. TROUBLE SHOOTING
4.14 Camera Troubleshooting

Camera control signals are generated by MSM7200.
4.14.1 2M AF CAMERA
Start
Check the camera connector and

reconnect the camera
Yes
Camera is OK? END
NO
NO
VCAM_2.6V(FB600, FB601, Change the Sub board
FB602 or C721) is 2.6V?
Yes
NO
VCAM_1.8V(C722) Change the Sub board
is 1.8V?
Yes
NO
Check the CAM_MCLK Change the Sub board
(R621)
Yes
Change the camera
Yes
Camera is OK END
NO

by X-ray
Exchange U100 or
And Retest
4. TROUBLE SHOOTING
4.14.2 VGA CAMERA
Start
Check the camera connector and

reconnect the camera
Yes
Camera is OK? END
NO
VCAM_2.6V(FB600, FB601, NO
FB602 or C721) is 2.6V?
Yes
Check the CAM_MCLK

NO Change the Sub board
(R621)
Yes
Change the camera
Yes
Camera is OK END
NO

by X-ray
Exchange U100 or
And Retest
4. TROUBLE SHOOTING
R621
VCAM_2.6V 1
9
INOUT_A1 INOUT_B1
CN601:
VCAM_1.8V
VCAM_2.6V
2 8
INOUT_A2 INOUT_B2
3 7
DEFAULT_NET_TYPE
INOUT_A3 INOUT_B3
14,15,16,17,31,32 4
INOUT_A4 INOUT_B4
6
G1
G2
VCAM_2.6V
10
5
VCAM_1.8V
CN601: 33,34
2.2K
2.2K
CN601
FB600
G1 G2
R601
R602
1 34
2 33
R603 0 3 32
4 31
5 30
6 29
7 28
8 27
9 26
10 25
11 24
12 23
13 22
14 21
FB601 15 20
VCAM_2.6V
16 19
FB602 17 18
G3 G4
ENBY0015601
AXK7L34227G
C722 19
ENM2
C721 21
18
ENF M1
16
15
BLED1
28
ENLDO M2
14
BLED2
17
P1 M3
13
BLED3
P2 M4
12
BLED4
F1
11
FLED
F2
8 10
SETM F3
9
F4
7
SETF
4 VCAM_2.6V
LDO1
6 5 VCAM_1.8V
REFBP LDO2
EUSY0263101
C720 C721 C722
0.01u 2.2u 2.2u
4. TROUBLE SHOOTING
4.15 Keypad Backlight Troubleshooting

Key Pad Back Light is on as below :
Key pressing -> KPD_DRV_N go to 0V -> Key Backlight LED On
Start
Key press
NO
+VPWR is above 2.6V? Check battery
Yes Yes
NO
KPD_DRV_N is 0V ?
or Check the Key FPCB
Yes

by X-ray Power Keypad LED
Exchange U100 or
100ohm R100 LD101
And Retest VPWR
SSC-TWH104-HLS
100ohm R101 LD102

KPD_DRV_N
SSC-TWH104-HLS
100ohm R102 LD103
SSC-TWH104-HLS
VPWR 100ohm R103 LD104
SSC-TWH104-HLS
D107
PRSB6.8C
KPD_DRV_N
4. TROUBLE SHOOTING
4.16 Main LCD Troubleshooting

Main LCD control signals are generated by MSM7200. The signal path is :
MSM7200 → CN400 → CN602 → CN702 LCD Module
Start
Press END key
NO
Key LED is on? GO to power on trouble shooting
Yes
Disconnect and reconnect
The LCD connector(CN702)
Yes
LCD display OK? END
No
Change the LCD module
Yes
LCD display OK? END
No
Yes
LCD display OK? END
No
Change the LCD FPCB
4. TROUBLE SHOOTING
4.17 Receiver Path

MSM7200 EAR1_OP, EAR1_ON → R103, R104 → Analog Switch(U400) → R421, R420 →
CN400 → CN602 → R751, R750 → L703, L702 → CN701 → Speaker
Start
Connect the phone to network

Equipment and setup call
Setup 1KHz tone out
YES
Can you hear the tone? END
NO
NO
Sine wave appears at Change the Main board
R103, R104?
YES
NO
The sine wave appears at Change the Main board
SPK+?
YES
The sine wave appears at YES

SPKR_N,SPKR_P SUB PCB
Change speaker
NO
YES Check SUB PCB.

The sine wave appears at
Pin 4, 1 CN400? Check CN602
NO

by X-ray
Exchange U100 or
And Retest
4. TROUBLE SHOOTING
R103, R104
Analog
Switch
SPK
+
4. TROUBLE SHOOTING
4.18 Headset path

MSM7200 HPH_R, HPH_L → C409, C406 → HEADSET AMP(U402) → R405, R404 → FB301,
FB300 → CN300 (MMI Connector)→
Start

equipment and setup call.
Setup 1KHz tone out
and insert headset.
YES
Can you hear the tone? END
NO
YES
Sine wave appears at
Change the Headset
FB301/FB300?
NO

by X-ray
Exchange U100 or
And Retest
4. TROUBLE SHOOTING
FB300
FB301
4. TROUBLE SHOOTING
4.19 Speaker phone path

MSM7200 LINE_OP,LINE_ON → C402/R403, C401/R402 → Speaker AMP(U401) → Analog
Switch(U400) → R421, R420 → CN400 → CN602 → R751, R750 L703, L702 → CN701 →
Speaker
Start

equipment and setup call
Setup 1KHz tone out
Sine wave appears at NO

C402/R403 and C401/R402?
YES
NO
nSPEAKER_SHDN(TP400) is Change the Main board
2.6V?
YES
NO
The sine wave appears at Change the Main board
SPK+?
YES

YES
SPKR_N,SPKR_P SUB PCB Change speaker
NO
YES Check SUB PCB.

Pin 4, 1 CN400? Check CN602
NO

by X-ray
Exchange U100 or
And Retest
4. TROUBLE SHOOTING
Analog
Speaker Amplifier
Switch
SPK
+
4. TROUBLE SHOOTING
4.20 Main microphone

MIC (OSF213-42DC) → CN602 → CN400 → C106 → MIC1P(MSM7200)
Start
Make a call
VMIC_BIAS(R102) NO
Change main board
is 2.6V
YES
Make sound to MIC
NO
Sine wave appears at Change the MIC
C106?
YES
YES
NO
Change the Main board Work well? END
4. TROUBLE SHOOTING
MIC
R102
C106
4. TROUBLE SHOOTING
4.21 Headset microphone

HS MIC (18 pin Connector) → C105 → MIC2P(MSM7200)
Start
Make a call
OK
Change the headset and retry END
NO YES
NO
nEAR_DET Change the MAIN board
(C312) is 0V?
Yes
NO
VMIC_BIAS2 is biased
Change MAIN board
by 2.6V? (R301)
Yes
NO
Sine wave appears at Change the headset or
C105 ? Main board and retry.
Yes
END
4. TROUBLE SHOOTING
MIC Input
R301
nEAR_DET
C105
4. TROUBLE SHOOTING
4.22 Vibrator
The PM7540 IC supports silent incoming-call alarms with its vibration motor driver. The vibration
driver is a programmable voltage output that is referenced to VDD; when off, its output voltage is
VDD. The motor is connected between VDD and pin N2 (VIB_DRV_N); the voltage across the motor
is Vm = VDD - Vout where Vout is the PM7540 IC voltage at pin N2.
A flyback diode is connected across the motor terminals to prevent inductive kickback during turn-off
and suppress voltage transients that could damage the IC. Short circuit current limiting is also
provided to limit the current when the motor is stalled or shorted. The driver is programmable from
1.2 to 3.1 V in 100-mV increments.
VPWR
L700 CN700
68nH
KDS160E D700 1
2
VIB_DRV_ON
L701
ICVL0518400V500FR
ICVL0518400V500FR
C700 68nH ENEY0003801

1u 24-8000-002-000-829
VA700
VA701
4. TROUBLE SHOOTING
Waveform : CN700, Vibrator
5. DOWNLOAD
5. DOWNLOAD
5.1 KS20 DOWNLOAD
5.1.1 Introduction
LGMDP is a LGE application that allow users to download images from PC to handset. LGMDP is a
download tool with capabilities to upload image files to the handset. LGMDP is designed to be simple
to use and easy enough for the beginner to upload executable images to the handset. LGMDP
supports Windows 2000/XP where the LG KS20 USB modem driver (Ver 1.0 or later) is installed.
Additionally, LGMDP allows multi downloading up to 9 handsets at the same time.
* KS20 does NOT use LG USB driver but LG KS20 USB driver. LG KS20 USB driver is used only for
KS20.
5.1.2 Downloading Procedure

* Before the image download, we must set the KS20 USB diag port as a composite USB port.
1. Press “2676625720#” in the phone dialer application to enter engineering menu.

2. 4. Port Setting → 1. Diag Setting → 1. USB Set for Diag → “OK” → “Back”.
3. (4. Port Setting → 1. Diag Setting →) 2. USB Switching → “LG Composite -DUN, DIAG”.
4. Press “Done” and reset the KS20.
Reset KS20
5. DOWNLOAD
• Connect the phone to your desktop PC using the USB cable and run the LGMDP application.
Before getting started, set up LGMDP preferences from the Preferences of the file menu the way
you want. Click on the File menu and select Preferences.
➢ Play a success sound

It will be played a .wav file when the download has been completed. To enable this simply check
the box.
➢ Always on Top
Check if LGMDP always appears at the top of the window so that user can monitor it all the time.
➢ Automatically run Select Port When LGMDP starts

When LGMDP starts, it will automatically select Select Port button to download new image file.
5. DOWNLOAD
5.1.2.1 Connecting to PC
• Click on the Select Port and then Select Port window will be pop up. Check if state shows Enable
for the port to be connected for downloading images. Then click on the Connect button.
(The port number(COM7) shall be different from that of the port number in the snapshot.)
• The status Ready is displayed when the application is ready for downloading. While the images are
transmitted from PC to the handset, a progressive bar (Red box) indicating the degree of
transmission of data is displayed.
5. DOWNLOAD
1) Image Folder indicates loot path where all image files are placed. To change location of the default
image path, select Browse… button. The edit box shows the file path where images are located.
Please note that all images should be located in a selected folder.
2) Click on the Browse… button to select image files to be downloaded on the handset.
3) NV Backup/Restore: Backup the NV data and restore the backed up NV data automatically.
1)
2)
3) 4) 6)
5)
7)
4) Reset database & Contents:

User related data including the setting data on the EFS is reset in the handset. The user contents in
the handset will be erased. If you want to reset all the user data back to the way they were before
you started downloading new images, check the option.
Erase_EFS:
The calibration data, user contents, media, and module are erased. Only calibration data is kept
when NV backup/restore is checked. The user contents and file system physically are wiped out.
Keep All Contents:
Maintain user data including WAP, AD, DRM, E-mail, Play lists, and images when downloading a
new S/W images. User data stated above are maintained if this option is selected.
5) Additional Options:
Display Information is defaultly not selected.
6) Clear: Clearing all directory paths of images in the dialog.
7) Start: Starting downloading the selected individual image.
5. DOWNLOAD
5.1.2.2 Choosing image files

• Select the image folder, where all the image files are located, by clicking on the Browse…. (The
folder name shall be different from that of the folder name in the snapshot. The folder name
indicates the path where the image files are located.)
5. DOWNLOAD
• Select the path on the Image Folder by clicking on the Browse..., then the LGMDP will automatically
load images accordingly. Also you can select images by manually. For instance, select the path of
AMSS Modem Image file by clicking on the Browse… button. The selected AMSS image will be
downloaded to the handset from the path directory in the PC. Make sure that you have chosen
correct file. In case of wrong AMSS Modem file is file is selected, the phone may not work.
(The file name shall be different from that of the file name in the snapshot.)
5. DOWNLOAD
• If NV restore is failed, then the NV Data(*.nv2) is erased permanently. In this case, choose the
desired NV file to be downloaded on the handset. To enable this simply check the box or select the
NV file from the LGMDP installation directory by clicking on the Browse… button.
• Click on the START button to start downloading. A summary of the selected images and option
information window will be displayed. Click on the No button if this is not the setting you are
downloading for. Otherwise click on the Yes button to continue downloading selected image file
with options.
5. DOWNLOAD
5.1.2.3 Downloading
• This message box informs that a new file for

NV backup will be created in the displayed
file name in the LGMDP installation
directory.
• Backing up NV data and backed up NV data

will be stored in the LGMDP installation
directory.
• Rebooting the handset and re-establishing

the connection. The handset will go
emergency mode.
• Downloading the all images.
5. DOWNLOAD
• Rebooting the handset and re-establishing

the connection.
• Restoring NV data which backed up in the

Backing up process. User can also restore
NV data using NV Default image selection.
• Downloading process has completed

successfully.
5. DOWNLOAD
5.1.3 Troubleshooting Download Errors
1) When the phone does not work after downloading has been completed.
5.1.3.1 When the phone does not work

• Reboot the phone in the emergency mode (Turn off the KS20 and turn on wile pressing “SEND” +
“Function” Key simultaneously) and then try to download all the images.
The phone supports a special mode called emergency mode. In this mode, minimum units for
downloading is running so that users can download the images again in case of emergency
situation.
Emergency Mode
Check the LCD is off.

USB Cable
Send Key
Check the LED is green.
Function Key
5. DOWNLOAD
• The below dialog shows parameters of Select Port when phone is booted in Emergency mode.
Click on the Connect button to continue.
• Choose Image file after clicking on the Browse… button. Make sure that you have chosen the right
image file. After choosing valid images, then click on the Start button to start downloading selected
images. The selected image will be downloaded to the handset from the path directory in the PC.
After downloading images successfully, it will boot to normal mode.
5. DOWNLOAD
5.1.4 Caution
1) Multi-downloading using the USB hub is not recommendable.

2) If you see the message ‘cal mode’ after ‘completing download’, you must do NV restore
and images download.
3) The NV data saved at LGMDP folder as following format.
D:\LGMDP\004400-01-429926\_COM14_
LGMDP folder name

IMEI number Port number
4) Recommended that the AMSS and Windows OS Image have to be downloaded at the
same time.
5) Erase EFS option will erase everything (nv items, and some settings) in the EFS area.
6. BLOCK DIAGRAM
6. BLOCK DIAGRAM
6.1 GSM & UMTS RF Block
32.768 kHz (Sleep X-tal)

MSM7200
RTR6275 LO
LOGeneration
Generation
&&Distribution PLL
PLL
Distribution 19.2MH USB 2
PLL Data I/O Port
Camera 3 zUSB PM7540
Data PM7540 USIM
VC-TCXO USB OTG
19.2MHz
IMT LPF
LPF Graphics
IMT UART 1 4
BT
Video 2
UART 2 / USIM
IMT SAW 2 TX,RX
HK ADCs UART 3 DM Port
LPF
LPF
2 4 GSM HB MODE Select
ARM1136J
Interface
WCDMA 4 GSM LB RX ADCs

Switchplexer
2 Memory I/F
Switchplexer
Duplexer
DDR SDRAM
GSM SAW LPF
LPF UMTS/HSDPA EBI1 MCP
MCPMemory
Memory
NAND
NANDFlash:
Flash:256MB
256MB
NAND DDR
EBI2 DDRSDRAM
SDRAM::64MB
64MB
SBI
LO PLL
PLL MIC
LOGeneration
Generation ARM926EJS
&&Distribution
Distribution
Vocoder HPH 2
MP3 / MIDI
gpsOne 2 RCV +/-
RF Mobile
SW
GSM TX DACs Integrated
SBI
SBI CODEC
AGC
PA RF Interface
LB GPIO
LPF
LPF GSM/GPRS/EDGE
IMT
HB
PA
MMC JTAG Interface 6 JTAG for Test
IMT SAW
48.00 MHz(for USB)
[Fig 2.1] KS20 RF Functional Block Diagram
6. BLOCK DIAGRAM
[Table 2.1] RF Block Component
6. BLOCK DIAGRAM
6.2 Interface Diagram
6.2.1 RTR6275 & MSM7200 Interface Diagram
32.768 kHz (Sleep X-tal)

MSM7200
RTR6275 LO
LOGeneration
Generation
&&Distribution PLL
PLL
Distribution 19.2MH USB 2
PLL Data I/O Port
Camera 3 zUSB PM7540
Data PM7540 USIM
VC-TCXO USB OTG
19.2MHz
IMT LPF
LPF Graphics
IMT UART 1 4
BT
Video 2
UART 2 / USIM
IMT SAW 2 TX,RX
HK ADCs UART 3 DM Port
LPF
LPF
2 4 GSM HB MODE Select
ARM1136J
Interface
WCDMA 4 GSM LB RX ADCs

Switchplexer
2 Memory I/F
Switchplexer
Duplexer
DDR SDRAM
GSM SAW LPF
LPF UMTS/HSDPA EBI1 MCP
MCPMemory
Memory
NAND
NANDFlash:
Flash:256MB
256MB
NAND DDR
EBI2 DDRSDRAM
SDRAM::64MB
64MB
SBI
LO PLL
PLL MIC
LOGeneration
Generation ARM926EJS
&&Distribution
Distribution
Vocoder HPH 2
MP3 / MIDI
gpsOne 2 RCV +/-
RF Mobile
SW
GSM TX DACs Integrated
SBI
SBI CODEC
AGC
PA RF Interface
LB GPIO
LPF
LPF GSM/GPRS/EDGE
IMT
HB
PA
MMC JTAG Interface 6 JTAG for Test
IMT SAW
48.00 MHz(for USB)
[Fig 2.2] RTR6275 & MSM7200 Interface Diagram
6. BLOCK DIAGRAM
Main RF signal
Main RF signal Description Comment

GSM 900 TX GSM 900 TX RF Signal
DCS TX DCS TX RF Signal
PCS TX PCS TX RF Signal
UMTS2100 TX UMTS2100 TX RF Signal
GSM 900 RX GSM 900 RX RF Signal
DCS RX DCS RX RF Signal
PCS RX PCS RX RF Signal
UMTS2100 RX UMTS2100 RX RF Signal
TX_I/Q I/Q for Tx of RF
RX_I/Q I/Q for Rx of RF
Control signal
Control signal Description Comment

UMTS PA_CTL signal
PA_R1 UMTS Tx High/Low Power Control
GSM PA_CTL signal
GSM_PA_BAND DCS or PCS /GSM Mode Selection
GSM_PA_EN Power Amp Gain Control Enable
GSM_PA_RAMP Power Amp Gain Control
UMTS,
GSM900Tx/Rx,
ANT_SEL 0,1,2,3 Ant Switch Module Mode Selection
DCS Tx/Rx,
PCS Tx/Rx
7. CIRCUIT DIAGRAM
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
A A
GSM_PA_DAC_REF
INTERNAL_MIC_P
VMIC_BIAS
MODEM_RCV_N
MODEM_RCV_P
RTR_DAC_REF
RTR_TRK_LO_ADJ
10K
HS_MIC
VMSMP_2.6V
R100
2200
nJTAG_RESOUT KDS114E D100
1K
VMSMP_2.6V
VMSME_1.8V
nPON_RST
R102
KDS114E D101
3300p
R101
PG05DBTFC
NA
27p
27p
33
33
0.1u
C103
33nF
D102
1000p
B B
C105
C100
C101
PG05DBTFC
R103
R104
C104
D103
C106
4.7K
MDDI_P_DATA_M
4.87K/1%
MDDI_P_DATA_P
RTR_TX_AGC_ADJ
C102
WCDMA_PA_ON
MDDI_P_STB_M
GSM_PA_RAMP
WCDMA_PA_R0
MSM_USB1_VM
MDDI_P_STB_P
FM_R
R105
MSM_USB1_VP
FM_L
RTR_TX_ON
nMSM_TRST
MSM_RTCK
PMIC_TCXO
RTR_TXQM
SLEEP_CLK
RTR_RXQM
RTR_TXQP
AMUX_OUT
RTR_RXQP
nUSB_OE1
MSM_TDO
RTR_TXIM
RTR_RXIM
RTR_TXIP
MSM_TMS
RTR_RXIP
MSM_TCK
REM_ADC
2200
MSM_TDI
TV_OUT
HPH_R
HPH_L
R106
0.1u
0.1u
100
100
100
1K
2K
DNI
1u
1u
C Array TP C
R108
R109
C108
C109
C110
C107
AG15 R107
AG14 R110
AG13 R111
R112
UAT100
AG27
AG26
AD10
AD12
AH15
AD13
AH14
AH13
AD14
AB10
AB12
AB14
AA14
AE13
AA15
AB15
AE14
AG8
AD4
AD6
AC5
AC4
AD7
AB5
AE5
AE9
AB4
AE6
AA7
AB8
AE7
R18
R11
W8
G5
G4
G1
G2
G7
G9
U5
R5
H7
H4
H5
C1
D7
D6
U4
R4
H9
N4
Y8
P7
B6
B5
A6
A5
E7
B7
A7
E6
B4
B9
A9
P4
P2
P1
T7
T5
F1
F2
T8
T4
2.5G 3G
J7
1
GND
TDI
TMS
TRST
RESIN
WDOG_EN
TCXO
TDO
RESOUT
MODE3
MODE2
MODE1
MODE0
SMI_FIXMEM
TX_ON
I_IM_CH0
I_IP_CH0
Q_IM_CH0
Q_IP_CH0
I_IM_CH1
I_IP_CH1
Q_IM_CH1
Q_IP_CH1
WIPER
MIC1N
MIC1P
MIC2N
MIC2P
TVOUT
HPH_VREF
HPH_R
I_OUT_N
I_OUT_P
Q_OUT_N
Q_OUT_P
GND
TCK
RTCK
USB_OE_INT
USB_SE0_VM
MDDI_C_STB_N
MDDI_C_STB_P
MDDI_E_STB_N
MDDI_E_STB_P
MDDI_P_STB_N
MDDI_P_STB_P
PA_ON0
LINE_R_IN
LINE_R_IP
AUXIN
AUXIP
TVDAC_R_SET
DAC_IREF
HPH_L
EAR1_ON
EAR1_OP
USB_DAT_VP
PLL_TEST_SE
MDDI_C_DATA0_N
MDDI_C_DATA0_P
MDDI_C_DATA1_N
MDDI_C_DATA1_P
MDDI_E_DATA_N
MDDI_E_DATA_P
MDDI_P_DATA_N
MDDI_P_DATA_P
PA_POWER_CTL
PA_POWER_CTL_M
PA_RANGE0
LINE_L_IN
LINE_L_IP
HKAIN2
HKAIN1
HKAIN0
GSM_PA_PWR_CTL_REF
USB_XTAL48_IN
USB_XTAL48_OUT
SLEEP_CLK
TX_AGC_ADJ
TRK_LO_ADJ
2
CRADLE_UART_RX 3
RX RX
CRADLE_UART_TX 4
TX TX
NC1 VCHAR
J25 5
nSDRAM_WE G19
EBI1_WE
A8
REMOTE_PWR_ON 6
ON_SW ON_SW
nSDRAM_RAS D17
EBI1_RAS LINE_ON
B8
LINE_ON VBAT
7
VBAT VBAT
L22
EBI1_WAIT0 LINE_OP
E4 C111 0.1u LINE_OP C112 C113 VUSB_5.0V
8
NC2 PWR
D22
EBI1_OE CCOMP
G8
10u 0.1u CRADLE_USB_DN 9
NC3 URXD
E20
EBI1_CS5 AUXOUT
E5
CRADLE_USB_DP 10
NC4 UTXD
EBI1_CS4 MICBIAS VMIC_BIAS DSR
E21 D1 11
D
D21
EBI1_CS3 YM_LR
E1
TOUCH_Y1YD 12
RTS D
H19
EBI1_CS2 YP_UR
D2
TOUCH_Y2YU CTS
B21
EBI1_CS1 XM_LL
E2
TOUCH_X2XL
nSDRAM_CS A23
EBI1_CS0 XP_UL TOUCH_X1XR
EBI1_CKE1
H18 M2
SDRAM_CKE B24
EBI1_CKE0 GPIO0
L4
nCAM_RST
SDRAM_CLK0 B25
EBI1_DCLK GPIO1
M4
CAM_2M_PWDN
SDRAM_CLK1 D14
EBI1_DCLKB GPIO2
M5
CAM_VGA_PWDN
K25
EBI1_MEM_CLK GPIO3
GPIO4
L7
N7
CAM_PWR_ON
CAM_DATA0 ARM9 JTAG
nRESETOUT1 E12
EBI1_RESOUT GPIO5
L5
CAM_DATA1
SDRAM_DQS3 B14
EBI1_DQS3 GPIO6
N8
CAM_DATA2
SDRAM_DQS2 D16
EBI1_DQS2 GPIO7
M1
CAM_DATA3 VMSMP_2.6V
SDRAM_DQS1 A21
EBI1_DQS1 GPIO8
L8
CAM_DATA4 CN100
SDRAM_DQS0 D12
EBI1_DQS0 GPIO9
M7
CAM_DATA5 G1 G2
SDRAM_DQM3 D15
EBI_DM3 GPIO10
M8
CAM_DATA6
E SDRAM_DQM2 E15
EBI_DM2 GPIO11
P5
CAM_DATA7 1 10 E
SDRAM_DQM1 B23
EBI_DM1 GPIO12
P11
CAM_PCLK MSM_TCK
SDRAM_DQM0 EBI_DM0 GPIO13
M11
CAM_HSYNC 2 9
A26
GPIO14
N11
CAM_VSYNC MSM_TDI MSM_TMS
B26
EBI1_ADR27 GPIO15
AA17
CAM_MCLK 3 8
B27
EBI1_ADR26 GPIO16
AD17
JTAG_PS_HOLD nMSM_TRST
D23
EBI1_ADR25 GPIO17
AB17
REMOCON_SW 4 7
E23
EBI1_ADR24 GPIO18
AE17
nJTAG_RESOUT MSM_TDO
SDRAM_ADDR23 D24
EBI1_ADR23 GPIO19
AA18
5 6
G20
EBI1_ADR22 GPIO20
AG18
nEAR_DET MSM_RTCK
E22
EBI1_ADR21 GPIO21
AD18
CALL_KEY
F24
EBI1_ADR20 GPIO22
AH18
BL_PWR_ON G3 G4
EBI1_ADR19 GPIO23 nHEADSET_SHDN
E25
L15
EBI1_ADR18 U100-1 GPIO24
AE18
AB18
nPM_INT AXT410164
G21
EBI1_ADR17 GPIO25
AD19
PS_HOLD ENBY0033101
SDRAM_ADDR16 EBI1_ADR16 GPIO26 FM_IRQ
F SDRAM_ADDR15
L16
J21
EBI1_ADR15 MSM7200_A GPIO27
AE19
AA19
F
H20
EBI1_ADR14 GPIO28
AB20
nTF_DETECT
F25
EBI1_ADR13 GPIO29
AB19
nREM_INT
SDRAM_ADDR12 L17
EBI1_ADR12 GPIO30
AH20
UART_SW
SDRAM_ADDR11 G24
EBI1_ADR11 GPIO31
AA20
nSPEAKER_SHDN
SDRAM_ADDR10 H22
EBI1_ADR10 GPIO32
AE20
FLASH_PWR_ON
SDRAM_ADDR9 EBI1_ADR9 GPIO33 KPD_COLUMN0
SDRAM_ADDR8
G25
H24
EBI1_ADR8 GPIO34
AD20
AG22
KPD_COLUMN1 Test TP
SDRAM_ADDR7 K24
EBI1_ADR7 GPIO35
AE21
KPD_COLUMN2
SDRAM_ADDR6 H25
EBI1_ADR6 GPIO36
AH22
KPD_ROW0
SDRAM_ADDR5 L21
EBI1_ADR5 GPIO37
AD21
KPD_ROW1
SDRAM_ADDR4 J24
EBI1_ADR4 GPIO38
AE22
KPD_ROW2
SDRAM_ADDR3 K21
EBI1_ADR3 GPIO39
AB21
KPD_ROW3 TP100
SDRAM_ADDR2 J22
EBI1_ADR2 GPIO40
AG23
KPD_ROW4 CRADLE_UART_RX
SDRAM_ADDR1 K22
EBI1_ADR1 GPIO41
AB22
BAT_I2C_SCL
SDRAM_ADDR0 EBI1_ADR0 GPIO42
AA10
BAT_I2C_SDA TP101
C
G10
GPIO43
AG6
BT_UART_RTS CRADLE_UART_TX C
SDRAM_D31 H10
EBI1_DQ31 GPIO44
AB9
BT_UART_CTS
SDRAM_D30 D11
EBI1_DQ30 GPIO45
AA9
UART1_RX TP102
SDRAM_D29 E11
EBI1_DQ29 GPIO46
AD8
UART1_TX REMOTE_PWR_ON
SDRAM_D28 G11
EBI1_DQ28 GPIO47
AH6
MSM_USIM_CLK
SDRAM_D27 H11
EBI1_DQ27 GPIO48
AE8
MSM_USIM_RST
SDRAM_D26 G12
EBI1_DQ26 GPIO49
AD9
SDRAM_D25 H12
EBI1_DQ25 GPIO50
AA11
MSM_USIM_DATA
SDRAM_D24 A13
EBI1_DQ24 GPIO51
AH8
WLAN_SD_D3
SDRAM_D23 B13
EBI1_DQ23 GPIO52
V13
WLAN_SD_D2
SDRAM_D22 D13
EBI1_DQ22 GPIO53
AD11
WLAN_SD_D1
SDRAM_D21 E13
EBI1_DQ21 GPIO54
AE10
WLAN_SD_D0
SDRAM_D20 A14
EBI1_DQ20 GPIO55
AB11
WLAN_SD_CMD
SDRAM_D19 E14
EBI1_DQ19 GPIO56
V7
WLAN_SD_CLK
SDRAM_D18 G13
EBI1_DQ18 GPIO57
V8
LCD_PWR_ON
SDRAM_D17 H13
EBI1_DQ17 GPIO58
W7
nRECEIVER_SW
D SDRAM_D16 G14
EBI1_DQ16 GPIO59
V11
SSBDT_RTR D
SDRAM_D15 H14
EBI1_DQ15 GPIO60
Y7
I2C_SCL
SDRAM_D14 H15
EBI1_DQ14 GPIO61 I2C_SDA
SDRAM_D13 G15
EBI1_DQ13
SDRAM_D12 G16
EBI1_DQ12
EBI2_DATA15
EBI2_DATA14
EBI2_DATA13
EBI2_DATA12
EBI2_DATA11
EBI2_DATA10
SDRAM_D11 EBI1_DQ11
EBI2_BUSY1
EBI2_BUSY0
EBI2_ADR20
EBI2_ADR19
EBI2_ADR18
EBI2_ADR17
EBI2_ADR16
EBI2_ADR15
EBI2_ADR14
EBI2_ADR13
EBI2_ADR12
EBI2_ADR11
EBI2_ADR10
EBI2_DATA9
EBI2_DATA8
EBI2_DATA7
EBI2_DATA6
EBI2_DATA5
EBI2_DATA4
EBI2_DATA3
EBI2_DATA2
EBI2_DATA1
EBI2_DATA0
MPM_GPIO2
MPM_GPIO1
MPM_GPIO0
EBI2_ADR9
EBI2_ADR8
EBI2_ADR7
EBI2_ADR6
EBI2_ADR5
EBI2_ADR4
EBI2_ADR3
EBI2_ADR2
EBI2_ADR1
EBI1_DQ10
EBI1_DQ9
EBI1_DQ8
EBI1_DQ7
EBI1_DQ6
EBI1_DQ5
EBI1_DQ4
EBI1_DQ3
EBI1_DQ2
EBI1_DQ1
EBI1_DQ0
EBI2_CS5
EBI2_CS4
EBI2_CS3
EBI2_CS2
EBI2_CS1
EBI2_CS0
EBI2_WE
EBI2_OE
EBI2_UB
EBI2_LB
GPIO97
GPIO96
GPIO95
GPIO94
GPIO93
GPIO92
GPIO91
GPIO90
GPIO89
GPIO88
GPIO87
GPIO86
GPIO85
GPIO84
GPIO83
GPIO82
GPIO81
GPIO80
GPIO79
GPIO78
GPIO77
GPIO76
GPIO75
GPIO74
GPIO73
GPIO72
GPIO71
GPIO70
GPIO69
GPIO68
GPIO67
GPIO66
GPIO65
GPIO64
GPIO63
GPIO62
E16
E17
D18
E18
G17
D19
H16
E19
D20
G18
H17
P22
R25
R24
R22
Y21
V21
Y25
Y22
W21
W22
Y24
V22
W24
U21
U18
V25
W25
V24
U22
T22
T21
U24
U25
T18
T25
T28
T24
T27
R21
P25
P18
N25
P21
N21
P24
N24
N22
N18
M25
M22
M24
M21
R8
U11
T11
N5
R7
V16
V18
V14
V15
AC27
AC28
L25
L24
AE1
AH16
AD16
AE16
AG16
AD25
AC25
AE28
AC24
AH26
AG25
AH25
AE25
AD24
AD23
AE23
AD22
AE24
AH23
AD2
AD1
AE12
AE11
AA24
AA25
AB16
AA16
AA21
AA4
AA5
AA13
AA12
E E
UART3_RX
BT_PCM_IN
BT_HOST_WAKEUP
TCXO_EN
SDMC_CMD
SDRAM_D10
SDRAM_D9
SDRAM_D8
SDRAM_D7
SDRAM_D6
SDRAM_D5
SDRAM_D4
SDRAM_D3
SDRAM_D2
SDRAM_D1
SDRAM_D0
nOE2
nWE2
FLM
UART3_TX
LEDR1
LEDG1
LCD_RESET
GSM_PA_EN
32KHZ_ON
BT_PCM_OUT
nUB2
WLAN_PWR_ON
nBT_RESET
BT_REG_CTL
WLAN_PWD
LEDB1
ANT_SEL0
ANT_SEL1
ANT_SEL2
SDMC_CLK
nLB2
EBI2_DATA7
EBI2_DATA6
EBI2_DATA5
EBI2_DATA4
EBI2_DATA3
EBI2_DATA2
EBI2_DATA1
EBI2_DATA0
BT_WAKEUP
GSM_PA_BAND
nNAND_FLASH_CS
NAND_FLASH_READY
PMIC_SSBI
BT_PCM_SYNC
SDMC_DAT0
SDMC_DAT1
SDMC_DAT2
SDMC_DAT3
BT_PCM_CLK
1 2 3 4 5 6 7 8 9
LG(42)-A-5505-10:01 LG Electronics Inc.
LGMC
7. CIRCUIT DIAGRAM
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
MSM7200 Power Part MCP
RTR_DAC_REF
A
NAND 2G/DDR 1G A
VMSMA_2.6V
C200
2200p
VMSMC2_1.2V_SENSE
VMSMC1_1.2V_SENSE
VMSMP_2.6V
VMSME_1.8V
VMSMA_2.6V
VMSMA_2.6V
VMSMP_2.6V
VMSME_1.8V
VMSMC1_1.2V
VMSMC2_1.2V
VAUX2_2.85V
B B
U201 KAL009001M-D1YY
K4
SDRAM_ADDR0 L1
A0
SDRAM_ADDR1 L2
A1
SDRAM_ADDR2 L3
A2
L4
SDRAM_ADDR3 C2
A3 DQ0
L5
SDRAM_D0
SDRAM_ADDR4 D2
A4 DQ1
L6
SDRAM_D1
SDRAM_ADDR5 E1
A5 DQ2
L7
SDRAM_D2
SDRAM_ADDR6 D3
A6 DQ3
K8
SDRAM_D3
SDRAM_ADDR7 E2
A7 DQ4
L8
SDRAM_D4
AD15
AE27
AG19
AG21
AG11
AG10
AA27
AF27
AB27
AD27
SDRAM_ADDR8 A8 DQ5 SDRAM_D5
E10
B16
AF2
AE2
AB2
AG3
AG9
AG7
AG4
AA2
AC2
AG2
AG5
B20
B19
B17
F27
E27
A25
B15
B12
B11
U27
N27
C27
L27
R27
V27
D27
G27
H27
W27
P27
K27
E8
E9
D5
B2
N2
P8
R2
T2
U2
H1
H2
J2
J4
V2
V5
W5
W2
D4 K7
SDRAM_ADDR9 K3
A9 DQ6
K5
SDRAM_D6
SDRAM_ADDR10 A10 DQ7 SDRAM_D7
VDD_EBI1_1P_0
VDD_EBI1_1P_1
VDD_EBI1_1P_2
VDD_EBI1_1P_3
VDD_EBI1_1P_4
VDD_EBI1_1P_5
VDD_EBI1_1P_6
VDD_EBI1_1P_7
VDD_EBI1_1P_8
VDD_EBI1_2P_0
VDD_EBI1_2P_1
VDD_EBI1_2P_2
VDD_PLL0_0
VDD_PLL1_0
VDD_PLL2_0
VDD_PLL3_0
VDD_SMIP_0
VDD_SMIP_1
VDD_SMIP_2
VDD_SMIP_3
VDD_SMIP_4
VDD_SMIP_5
VDD_SMIP_6
VDD_SMIP_7
VDD_SMIC_0
VDD_SMIC_1
VDD_SMIC_2
VDD_SMIC_3
VDD_SMIC_4
VDD_TS
VDD_MDDIP_0
VDD_CDC_EBI1
VDD_APC_0
VDD_APC_1
VDD_APC_2
VDD_APC_3
VDD_APC_4
VDD_APC_5
VDD_APC_6
VDD_APC_7
F2 K6
VDD_EAR
VDD_HPH
VDD_SENSE_DIG
VDD_GENP_0
VDD_GENP_1
VDD_GENP_2
VDD_GENP_3
VDD_GENP_4
VDD_GENP_5
VDD_CDC
VDD_AD2D_A
VDD_TXDAC
VDD_CAMP_0
VDDA1_BBR_CH0
VDDA2_BBR_CH0
VDDA1_BBR_CH1
VDDA2_BBR_CH1
VDD_PA_CTL_DAC
VDD_SENSE_APC
VDD_TV_OUT_DAC
VDD_EFUSE_PROG
C SDRAM_ADDR11 F1
A11 DQ8
G7
SDRAM_D8 C
SDRAM_ADDR12 A12 DQ9
J6
SDRAM_D9
A3 J3
DQ10
J5
SDRAM_D10
A4
VSS_DIG0 SDRAM_ADDR15 K2
BA0 DQ11
H6
SDRAM_D11
A10
VSS_DIG1 SDRAM_ADDR16 BA1 DQ12
H5
SDRAM_D12
A16
VSS_DIG2
G8
DQ13
J4
SDRAM_D13
A18
VSS_DIG3 SDRAM_CLK0 H8
CK DQ14
G3
SDRAM_D14
A22
VSS_DIG4
B3
SDRAM_CLK1 E3
CK_ DQ15
G4
SDRAM_D15
D25
VSS_DIG5 VDD_DIG_0
B18
VMSMC1_1.2V SDRAM_CKE G2
CKE DQ16
F4
SDRAM_D16
E24
VSS_DIG6 VDD_DIG_1
B10
nSDRAM_RAS H2
RAS_ DQ17
E4
SDRAM_D17
G22
VSS_DIG7 VDD_DIG_2
L2
SDRAM_ADDR23 K1
CAS_ DQ18
F5
SDRAM_D18
H21
VSS_DIG8 VDD_DIG_3
Y2
nSDRAM_WE J2
WED_ DQ19
H3
SDRAM_D19
J8
VSS_DIG9 VDD_DIG_4
AG17
nSDRAM_CS J8
CS_ DQ20
H4
SDRAM_D20
J28
VSS_DIG10 VDD_DIG_5
AG24
SDRAM_DQM0 G6
DQM0 DQ21
E6
SDRAM_D21
K1
VSS_DIG11 VDD_DIG_6
Y27
SDRAM_DQM1 F8
DQM1 DQ22
F7
SDRAM_D22
K2
VSS_DIG12 VDD_DIG_7
M27
SDRAM_DQM2 E7
DQM2 DQ23
F6
SDRAM_D23
D
K4
VSS_DIG13 VDD_DIG_8
AG12
SDRAM_DQM3 J7
DQM3 DQ24
D5
SDRAM_D24 D
K5
VSS_DIG14 VDD_DIG_9
J27
SDRAM_DQS0 G5
DQS0 DQ25
E8
SDRAM_D25
K7
VSS_DIG15 VDD_DIG_10
B22
SDRAM_DQS1 H7
DQS1 DQ26
D6
SDRAM_D26
K8
VSS_DIG16 VDD_DIG_11
AG20
SDRAM_DQS2 E5
DQS2 DQ27
D8
SDRAM_D27
L1
VSS_DIG17 VDD_DIG_12 SDRAM_DQS3 DQS3 DQ28
D7
SDRAM_D28
L12
VSS_DIG18
A1 C9
DQ29
C8
SDRAM_D29
L13
VSS_DIG19 VSS_THERMAL1
A2 D10
VDDQ1 DQ30
C7
SDRAM_D30
L14
A27
VMSME_1.8V
E9
VDDQ2 DQ31 SDRAM_D31
1000p
VSS_DIG21 VSS_THERMAL3 VDDQ3
0.1u
4.7u
L18 A28 F10 B8
VSS_DIG22 VSS_THERMAL4 VDDQ4 VDD1 VMSME_1.8V
M12 B1 G9 D1
1000p
VSS_DIG23 VSS_THERMAL5 VDDQ5 VDD2
0.1u
0.1u
4.7u
M13 B28 J10 H1
C203
C204
C201
M14 U7 K9 H10
M15 U8 L9 M1
C205
C206
C207
C202
M16 AA22 M10 P8
E
M17
M18
VSS_DIG28
VSS_DIG29
U100-2 VSS_THERMAL10
VSS_THERMAL11
AB13
AB24
N9
VDDQ10
E
M28 AB25 B6
VSS_DIG30 VSS_THERMAL12 nNAND_FLASH_CS CE_
N12
N13
VSS_DIG31
VSS_DIG32
MSM7200_B VSS_THERMAL13
VSS_THERMAL14
AG1
AG28
nWE2
nOE2
B7
B3
WEN_
RE_
IO0
IO1
N1
N2
EBI2_DATA0
EBI2_DATA1
N14 AH1 N3
N15
AH2 C4
IO2
M5
EBI2_DATA2
N16
AH27
nLB2 B4
ALE IO3
P7
EBI2_DATA3
N17
AH28
nUB2 CLE IO4
M6
EBI2_DATA4
P12
C3
IO5
N6
EBI2_DATA5
P13
VSS_DIG37
A20
nRESETOUT1 WP_ IO6
M8
EBI2_DATA6
P14
VSS_DIG38 VSS_EBI_1P_0
A19 C6
IO7 EBI2_DATA7
P15
VSS_DIG39 VSS_EBI_1P_1
A17
NAND_FLASH_READY R_B_
B5
VSS_DIG40 VSS_EBI_1P_2 VCC1 VMSME_1.8V
0.1u
4.7u
P16 F28 R200 10K B1 N5
VSS_DIG41 VSS_EBI_1P_3 VMSME_1.8V NC1 VCC2
P17 E28 R201 10K B2
VSS_DIG42 VSS_EBI_1P_4 NC2
R12 A24 B10 C10
C209
VSS_DIG43 VSS_EBI_1P_5 NC3 VSSQ1
C208
R13 A15 F3 D9
R14 A12 G1 E10
F VSS_DIG45 VSS_EBI_1P_7 NC5 VSSQ3 F
R15 A11 M3 F9
R16 M4 G10
VSS_DIG47 NC7 VSSQ5
R17 AA28 M7 J9
T12 U28 N4 K10
T13 N28 N7 L10
T14 N8 M9
VSS_DIG51 NC11 VSSQ9
T15 C28 P1 N10
VSS_DIG52 VSS_SMIC_0 NC12 VSSQ10
T16 L28 P2
VSS_DIG53 VSS_SMIC_1 NC13
T17 R28 P3 B9
VSS_DIG54 VSS_SMIC_2 NC14 VSS1
U12 V28 P4 C1
U13 AF28 P5 C5
U14 P10 H9
VSS_DIG57 NC17 VSS4
U15 J1
VSS_DIG58 VSS5
VSS_PA_CTL_DAC
VSS_TV_OUT_DAC
U16 A2 M2
VSS_GR1_EXTRA
VSSA1_BBR_CH0
VSSA1_BBR_CH1
VSSA2_BBR_CH0
VSSA2_BBR_CH1
VSS_PLL0N3_GR
VSS_PLL1N2_GR
VSS_DIG59 DNU1 VSS6

U17 A9 P6
VSS_MDDIP_0
VSS_DIG60 DNU2 VSS7

VSS_AD2D_A
VSS_CAMP_0
VSS_PLL0_0
VSS_PLL1_0
VSS_PLL2_0
VSS_PLL3_0
VSS_GENP_0
VSS_GENP_1
VSS_GENP_2
VSS_GENP_3
VSS_GENP_4
VSS_SMIP_0
VSS_SMIP_1
VSS_SMIP_2
VSS_SMIP_3
VSS_SMIP_4
VSS_SMIP_5
VSS_SMIP_6
VSS_SMIP_7
A10 P9
VSS_DIG61
VSS_DIG62
VSS_DIG63
VSS_DIG64
VSS_DIG65
VSS_DIG66
VSS_DIG67
VSS_DIG68
VSS_DIG69
VSS_DIG70
VSS_DIG71
VSS_DIG72
VSS_DIG73
VSS_DIG74
VSS_DIG75
VSS_DIG76
VSS_DIG77
VSS_DIG78
VSS_DIG79
VSS_TXDAC
C DNU3 VSS8 C
R1
VSS_EAR
VSS_HPH
VSS_CDC
DNU4
VSS_TS
R2
DNU5
R9
DNU6
R10
DNU7
J5
J1
F4
T1
F5
V12
V17
Y28
P28
Y1
V1
Y4
V4
Y5
D10
D28
H28
K28
D8
D9
D4
C2
N1
R1
U1
H8
AF1
G28
AE15
AE4
AH10
AH11
AH12
AH17
AH24
AH19
AH21
AB28
AD28
AA1
AA8
AB7
AC1
AD5
AH4
AH5
AH7
AH3
AB1
AH9
W28
W4
W1
D D
Near by U100
VMSME_1.8V_SENSE
VMSME_1.8V VMSMC1_1.2V
1000p
1000p
0.1u
0.1u
0.1u
0.1u
0.1u
0.1u
0.1u
10u
C220
10u
C215
C216
C217
C218
C219
C210
C211
C212
C213
C214
E VMSMA_2.6V E
1000p
VMSMC2_1.2V
0.1u
1000p
0.1u
0.1u
C223
10u C227
C221
C222
10u
C224
C225
C226
VMSMP_2.6V
0.01u
1000p
0.1u
C228
C229
C230
1 2 3 4 5 6 7 8 9
7. CIRCUIT DIAGRAM
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
IO Connector VMIC_BIAS2
UART Switch
Battery Charging Circuit
2.2K
R301
CALL_KEY
ICVL0518400V500FR
A TV OUT Filter A
270nH L301
VPWR
L300
BT_UART_TXD
2SA2030
U300 NUS3116MTR2G 68nH Q300
VA300
UART3_RX
C300 NA 10 9
VBAT P_DRAIN P_COLLECTOR C360 C301
10u 1u
FI-D2012-153KJT 1 8 CN300 D300
VCHG_5.0V EMITTER1 BASE1 CHG_CTL_N FM_ANT
L302 15uH PG05DBTFC
2 7 21
TV_OUT VIDEO_IN VUSB_5.0V EMITTER2 BASE2 USB_CTL_N 19
3 6 1
649/1%/1005
649/1%/1005 ISNS_P BAT_FET_N

NA
NA
COLLECTOR GATE
NA
NA
2
4 5 3
HS_MIC
R304
CVBS
0.1
VBAT
C302
C303
SOURCE DRAIN
R302
R303
U301 4 FB300
HSL
PG05DBTFC
PG05DBTFC
PG05DBTFC
16
15
14
13
NLAST9431MT 5 FB301
6 0 R305
HSR
B ISNS_M USC2 B
NC_D1
VCC
NO_A0
0 R306
COM_A
7
1 12 8
USC1
UART1_TX 2
NC_A1 COM_D
11
CRADLE_UART_RX 9
nEAR_DET
UART_SW SAB NO_D0 UART1_RX VPWR VBAT
D301
D302
D303
3 10 10
NO_B0 SCD
4 9 C305 11
BT_UART_RXD COM_B NC_C1 UART3_TX C304 REMOTE_PWR_ON
NC_B1
NO_C0
COM_C
0.01u 12
22u VADP_5.0V
GND
13
14
5
6
7
8
15
VUSB_5.0V
16
17
CRADLE_UART_TX
18
CRADLE_UART_RX
20
22
C C
DNI
HSEJ-18S04-25
UART1_TX
UART1_RX
CRADLE_UART_TX
ENRY0006001
EVLC14S02050
TA OVP Circuit D307
D304
D305
1000p
R307
390p
390p
33p
22p
22p
6 1
1u
VADP_5.0V SD12T1G
PG05DBTFC
PG05DBTFC
NUS3065MUTAG U302 5 2
C307
C308
C309
C310
C311
C312
9
DRAIN_THERMAL D306
C306
VA301
4 3
8 1
VCC IN
7 2 PLR0504F
OUT GND
FL300
6 3 1 2
GATE CNTRL IN OUT VCHG_5.0V
D D
5 4 3 4
SRC DRAIN G1 G2
NFM21PC105B1A3 Main Battery Connector

Route together C313
1u
VBAT
VPWR
ISNS_P
ISNS_M
VMSMP_2.6V
PSD05-LF
47K
INSTPAR
C314
VA302
C315
Place close to PM7540 pins
0.1u C316
2.2u
R308
33u
2.2K
2.2K
E VUSB_5.0V E
EVLC18S02015
C317 0.1u
ZD300
C318 0.1u
VCHG_5.0V
R309 10 C319 0.1u
R310
C321 0.1u
R311
R312
C322 0.1u CN301
1u
CHG_CTL_N
USB_CTL_N
BAT_FET_N
C323 0.1u 1
C320 VBAT
10K
C324 0.1u 7
C325 0.1u 2
VCOIN
C326 0.1u 6
C327 0.1u 3
C328 0.1u Place in PM7540 room at shield edge
BAT_I2C_SCL 5
C329 0.1u
BAT_I2C_SDA 4
C330 1000p ENZY0018901

C331 4.7u HSBC-4P30-20
These CAPs close to inductors
F F
C332 1000p
C333 4.7u
D308
PG05DBTFC
PG05DBTFC
D309
1000p
1000p
1000p
1000p
B11
L13
B10
K12
F12
F13
J12
M10
D12
0.1u
E2
D2
L1
D1
C1
C2
E4
F2
N9
N7
B9
D6
B8
D7
G2
4.7u
4.7u
4.7u
22u
10u
ISNS_P
ISNS_M
VCOIN
VDD_RUIN
VBAT
VDD_RF1
VDD_RF2
VDD_C1_E
BAT_FET_N
VDD_GP2
VDD_GP8
VCHG
USB_CTL_N
VDD_C2_PA
CHG_CTL_N
VDD_L_SPKR
VDD_ANA
USB_VBUS
VDD_TCXO
V_BACKUP
VDD_R_SPKR
VDD_MSME2
VDD_MSMP
VDD_WLAN
C334
C335
C336
C337
C338
C339
C340
C341
C342
C343
M7
MPP_1
N5 K1
MPP_2 VSW_5V
D8 J1
REMOTE_PWR_ON B12
MPP_3 VREG_5V
N8
4.7uH L303
MPP_4 VSW_MSMC1 VMSMC1_1.2V
D4 M8
MSM_USIM_RST A1
MPP_5 VREG_MSMC1
N6
VMSMC1_1.2V_SENSE 4.7uH L304
SIM_RST L12
MPP_6 VSW_MSMC2
M6
VMSMC2_1.2V
M11
MPP_7 VREG_MSMC2
N10
VMSMC2_1.2V_SENSE 4.7uH L305
GSM_PA_DAC_REF K8
MPP_8 VSW_MSME
M9
VMSME_1.8V
MSM_USIM_CLK VMSME_1.8V_SENSE 4.7uH L306
C
SIM_CLK
K9
K5
MPP_9
MPP_10
VREG_MSME
VSW_PA
N4
M4
VRF_SMPS USB Switch C
MSM_USIM_DATA K6
MPP_11 VREG_PA VRF_SMPS_SENSE
SIM_IO M3
MPP_12
A2
MPP_13 VREG_GP1
N1 J13 Differential lines, Line Width 0.2mm, at intervals of 0.3mm.
MPP_14 VREG_GP2 VHDAMP_3.0V
N3 N12 Differential lines, route as parallel as possible !! --> USC2, USC1
MPP_15 VREG_GP3 VBT_2.6V
M5 A9
MPP_16 VREG_GP4 Differential lines, route as parallel as possible !! --> CRADLE_USB_DP, CRADLE_USB_DN
B3 B13
MPP_17 VREF_GP5 VAUX2_2.85V
D5 E13
MPP_18 VREG_GP6 VBT_CORE_2.6V
F4 K13
MPP_19 VREG_MMC VTFLASH_3.0V
G4 A11 VMSMA_2.6V
MPP_20 VREG_MSMA C344 2.2u VPWR
J2 G13 U303 MAX4717ETB+T
MPP_21 U304 VREG_MSME2
K2 H13 11
Route together MPP_22 VREG_MSMP VMSMP_2.6V P_GND
A8 1
PM7540 VREG_RFRX1 V+
H2 A10 10
L2
USB_ID VREG_RFRX2
A3 2
NO2 REM_ADC
D CRADLE_USB_DP M2
USB_D_P VREG_RFTX
N11
nREM_INT NO1
9
D
CRADLE_USB_DN H4
USB_D_M VREG_RUIM1
E12
VRUIM_3.0V
3
COM2 USC1
nUSB_OE1 J4
USB_OE_N VREG_SYNT
D13
VSYNT_2.85V USC2 COM1
8
MSM_USB1_VP K4
USB_DAT VREG_TCXO
M1 1u C345 VTCXO_2.85V
4
IN2 REMOCON_SW
MSM_USB1_VM USB_SE0 VREG_USB IN1
2.2u
2.2u
2.2u
2.2u
2.2u
4.7u
4.7u
2.2u
G1 7
1u
1u
J10
VREG_WLAN
G12 5
NC2 CRADLE_USB_DN
VMSMP_2.6V
H10
SBST MIC_BIAS VMIC_BIAS2 CRADLE_USB_DP NC1
6
Route together SBCK GND
R313 121K 1%
C346
C347
C348
C349
C350
C351
C352
C353
C354
C355
K10 A12
PMIC_SSBI D10
SBDT_SSBI REF_ISET
A13
nPM_INT MSM_INT_N REG_GND
C13 0.1u C356
REF_BYP
B6
SPKR_IN_L_M
B7 H12
A6
SPKR_IN_L_P TCXO_IN
D9
TCXO_PM_19.2MHZ
A7
SPKR_OUT_L_M TCXO_EN
G10 R314 51
TCXO_EN
SPKR_OUT_L_P TCXO_OUT PMIC_TCXO
C357
22p
B4
SPKR_IN_R_P
B5 M13
E SPKR_IN_R_M XTAL_IN E
A4 N13 X300 Place crystal and load caps close to PM7540
SPKR_OUT_R_P XTAL_OUT
1
A5 FC-135
C358
SPKR_OUT_R_M
22p
K7 32.768KHz
SLEEP_CLK
2
SLEEP_CLK
B2 M12
VIDEO_IN 75 R315 B1
VIDEO_IN AMUX_OUT AMUX_OUT Route together
CVBS N2
VIDEO_OUT
C12
VIB_DRV_ON E1
VIB_DRV_N KPD_PWR_N
F10
KPDPWR_ON
KPD_DRV_N F1
KPD_DRV_N PON_RESET_N
E10
nPON_RST R316 D310
H1
LCD_DRV_N PS_HOLD PS_HOLD
FLSH_DRV_N 1K KDS114E
GND10
GND11
GND12
GND13
GND14
GND15
GND16
GND17
GND18
GND19
GND20
GND21
GND22
GND23
GND24
GND25
GND1
GND2
GND3
GND4
GND5
GND6
GND7
GND8
GND9
JTAG_PS_HOLD
J5
J6
J7
J8
J9
F5
F6
F7
F8
F9
E5
E6
E7
E8
E9
H5
H6
H7
H8
H9
G5
G6
G7
G8
G9
R317 200K
D311
F PG05DBTFC
1 2 3 4 5 6 7 8 9
LGMC
7. CIRCUIT DIAGRAM
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
Audio Switch
A
Speaker Amp SD_MODE SD_SEL SD_MODE A
0 0 SD MAIN to SUB Connector

VPWR 0 1 ON
R400 47K
1 0 ON
R401 47K
1 1 SD
1u
U400
FSA2267AL10X C400
10
U401 LM4898ITLX-NOPB CN400
B1 C3 91
VPWR VDD VO2 AMP_OUT_P 1 R420
VCC
1 9 1 90
MODEM_RCV_P 2
1B0 1A
8
SPKR_N C401 0.1u R402 20K C1 A3
SPKR_N 2 89
FLED
AMP_OUT_N 1B1 1S nRECEIVER_SW LINE_ON IN- VO1 AMP_OUT_N 32KHZ_ON 3 88
KPD_COLUMN2
3 7 C402 0.1u R403 20K A1 A2 C403 1u SPKR_P 1 R421 4 87
WLAN_SD_D0
MODEM_RCV_N 4
2B0 2S
6
LINE_OP IN+ BYPASS KPD_ROW0 5 86
WLAN_SD_D1
B AMP_OUT_P 2B1 2A SPKR_P KPD_ROW1 WLAN_SD_D2 B
GND
TP400 C2 B2 6 85
nSPEAKER_SHDN SD_SEL SD_MODE
B3
KPD_ROW2 7 84
WLAN_SD_D3
GND KPD_ROW3 WLAN_SD_CMD
5
8 83
KPD_COLUMN0 9 82
WLAN_SD_CLK
KPD_COLUMN1 10 81
BT_ACTIVE
KPD_ROW4 11 80
BT_PRIORITY
INTERNAL_MIC_P 12 79
WLAN_ACTIVE
BT_32KHZ 13 78
WLAN_PWR_ON
C404
14 77
KPDPWR_ON
NA VIB_DRV_ON
Headset Amp KPD_DRV_N
15
16
76
75
TOUCH_Y2YU
VMSMP_2.6V
17 74
TOUCH_X2XL
nCAM_RST 18 73
TOUCH_Y1YD
CAM_2M_PWDN 19 72
TOUCH_X1XR
CAM_VGA_PWDN 20 71
CAM_PWR_ON 21 70
SDMC_DAT3
C CAM_DATA0 22 69
SDMC_DAT2 C
CAM_DATA1 23 68
SDMC_DAT1
CAM_DATA2 24 67
SDMC_DAT0
CAM_DATA3 25 66
SDMC_CMD
CAM_DATA4 SDMC_CLK
B3
C3
U402 TPA4411YZH 26 65
B2 B4
CAM_DATA5 27 64
nTF_DETECT
_SDL PGND CAM_DATA6 VTFLASH_3.0V
NC1
NC2
TP401 B1 A2 28 63
nHEADSET_SHDN _SDR SGND CAM_DATA7 29 62
LEDR1
220n C409 A1 D2 R404 56 CAM_PCLK 30 61
LEDG1
HPH_R INR OUTL HSL CAM_HSYNC 31 60
LEDB1
220n C406 C1 C2 R405 56 CAM_VSYNC 32 59
WLAN_PWD
HPH_L INL OUTR HSR CAM_MCLK 33 58
LCD_PWR_ON
A3 D4
FLASH_PWR_ON 34 57
FLM
VHDAMP_3.0V
D1
PVDD PVSS
D3
VCOIN 35 56
VRUIM_3.0V
SVDD SVSS
36 55
LCD_RESET
SIM_IO BL_PWR_ON
1u
C408
C1P
C1N
37 54
D 1u SIM_CLK 38 53
D
SIM_RST MDDI_P_DATA_M
C405
A4
C4
39 52
VPWR
40 51
MDDI_P_DATA_P
C407
41 50
1u
42 49
43 48
MDDI_P_STB_P
I2C_SCL 44 47
I2C_SDA 45 46
MDDI_P_STB_M
VOUT
92
ENBY0035301
AXK890225WG
E E
F F
ISCA TYPE
SNGF0017401 BLUETOOTH_Broadcom
ANT400 C410 FL400 LFB212G45SG8A166
C411 2.2p
GND3 FEED IN OUT
GND2 GND1
SNGF0022801
33p GND1 GND2
FLASH LED
C412 L400 L401
10OL21C7AJ00005 3.3nH NA
NA
L405
10nH
VOUT FLED
C414 1000p LD400
C FM_ANT LMFL2P010 C
C415 EDLM0008803
R406 150K H2 F7
47p
F1
RES UART_CTS_N
C9
BT_UART_RTS VBT_2.6V
L402 G1
RFIOP UART_RTS_N
J9
BT_UART_CTS
100nH
RFION UART_RXD
K10
BT_UART_TXD
C417 C416 NA D4
UART_TXD BT_UART_RXD
47p FMPLLCAP
D1 J6
FMRF_INP TM3
C1 F6
FMRF_INN TM2
A3 J7
FMVCO_LP TM1 R407
A2 K7
C418 0.1u FMVCO_LN TM0 NA
A1
VREG_FM_1.5V FM_CVAR
L403 K6 D5
56 nH
FM_R K5
AUDIOL VREG_CTL
B5
BT_REG_CTL
ELCH0012503 FM_L AUDIOR VREG_BT VREG_BT_1.5V
J5 A5
AUDIOGND VREGFM_DAC VREG_FM_1.5V
A6
VDDR5V VBT_CORE_2.6V
K2 B6
D XTALP VDDR3V D
K3 K8
XTALN U403 VDDO18_1
B4 A8
1u
1u
BT_32KHz LPOIN BCM2048SKUFBG VDDO18_2
F9
VDDO18_3 FB400
D10 G5
GPIO7 VDDC1 VREG_BT_1.5V
B8 D9
C419
C420
X400 FM_IRQ G6
GPIO6 VDDC2
G7 SFBH0008101
26MHz GPIO5 VDDC3
4 3 E6 A7
GPIO4 VDDC4
1 2 G9 J10
GPIO3 VDDC5
F10 E1 C421 1.8p
TSX-3225_26MHZ
EXXY0024401
WLAN_ACTIVE H9
GPIO2 VDDRF1
E2
BT_HOST_WAKEUP H10
GPIO1 VDDRF2
K1
C422 C423 BT_WAKEUP E7
GPIO0 VDDPLL
J3
10p 10p A_GPIO7 VDDXO
B7 J1
A_GPIO6 VDDLO
K9 A4
BT_ACTIVE E9
A_GPIO5 VDDFM1
B1
VREG_FM_1.5V
BT_PRIORITY TP402 A10
A_GPIO4 VDDFM2
B3
E BT_PCM_OUT TP403 B10
A_GPIO3 VDDFM3
J4
C424 C425 E
BT_PCM_IN TP404 C10
A_GPIO2 VDDFM4
K4
0.1u 1u
BT_PCM_SYNC TP405 B9
A_GPIO1 VDDFM5
A9
BT_PCM_CLK A_GPIO0 VDDO33_1
E10
VBT_2.6V
R408 NA VDDO33_2
D6 J8
VBT_2.6V RST_N VDDO33_3
VSS10
VSS11
VSS12
VSS13
VSS14
VSS1
VSS2
VSS3
VSS4
VSS5
VSS6
VSS7
VSS8
VSS9
C426
0.1u
4/5
J2
F2
F4
F5
E4
E5
B2
C2
D2
D7
H1
G10
G2
G4
nBT_RESET
F
D400
PG05DBTFC
1 2 3 4 5 6 7 8 9
LGMC
7. CIRCUIT DIAGRAM
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
ANT500 ANT501
RTR_TXIP
C500
180p
R500 C501
SW500
0 180p
L500 C502 KMS-506 C503 L501 RTR_TXIM
G2
ANT RF VRF_SMPS
3.9nH
G1
15nH 55 2
A 4.7p 33p ENV_OUT ENV_LNP RTR_TXQP A
1
C505 C506 C504 6p ENV_LNN C508
ENWY0002301 L502 46
1.5p NA C509 WCDMA_2100_TX_OUT HB_RF_OUT1 180p
100nH C507 6p 44 51
0.1u DCS_PCS_TX HB_RF_OUT2 TX_IP
L503 5.6nH 50
C510 4p TX_IN C511
43 53
DCS(1805-1880 MHz) L504
GSM_TX
42
LB_RF_OUT1
LB_RF_OUT2
TX_QP
TX_QN
52
180p
RTR_TXQM
15nH
Rev.F L505 5.6nH 24 7
FL500 RTR_TX_ON RF_ON TCXO TCXO_RTR_19.2MHz
LSHS-M090UE 56 5 C512 3300p
RTR_TX_AGC_ADJ VCONTROL VTUNE1
14 11 L506 5.6nH 18 C513 1000p
ANT_SEL0 15
VC1 ANT
54
VTUNE2 VTUNE-Connected directly to GND
ANT_SEL1 16
VC2
13 PCS(1930-1990 MHz) L507
RTR_DAC_REF DAC_REF
12
ANT_SEL2
1
VC3 VDD
7 5.6nH
12nH
C517
R501
14
SBDT U500 RX_IP
RX_IN
13
RTR_RXIP
RTR_RXIM
GND1 NC L508 12p 12K (1%)
B
2
GND2
3
R_BIAS1
RTR6275 RX_QP
10
RTR_RXQP B
C514 C515 C516 4 3 27 11
33p 33p 33p GND3 DCS_PCS_TX R_BIAS2 RX_QN RTR_RXQM
5 6 L509 27nH R502
GND4 EGSM_TX SSBDT_RTR
8 9 680 (1%) 40
GND5 UMTS_TX_RX PWD_DET_IN PWR_DET
10 19 L510 Rev.H 31 21
12
GND6
GND7
DCS_RX2
DCS_RX1
20 GSM(925-960 MHz) 33nH 30
GCELL_INP
GCELL_INN
TEST
17 21 4 R503 5.1 VSYNT_2.85V

GND8 PCS_RX2 L511 27nH VDDA1
18 22 32 6 R504 2.2
GND9 PCS_RX1 EGSM_INP VDDA2 C518
25 23 33 8 1u
PGND1 EGSM_RX2 EGSM_INN VDDA3
26 24 9
PGND2 EGSM_RX1 VDDA4
38 15 R505 DNI
DCS_INP VDDA5
39 16 R506 2.2
DCS_INN VDDA6
SFAY0010001 36
VDDA7
19
20
R507 5.1 VRF_SMPS
GPCS_INP VDDA8 R508 10 C519 C520
37 28
GPCS_INN VDDA9 10u 1000p
41 smd_1608h_9_r
VDDA10
22 45
C Rev.F CAL_INP VDDA11 C
23 47
WLNA_OUT
WMIX_INP
WMIX_INN
CAL_INN VDDA12
48
VDDA13
ANTENNA SWITCH MODULE LOGIC 26 49
PGND
VDDM
RX_WCDMA_2100 WLNA_IN VDDA14 VRF_SMPS_SENSE
GND
29
34
35
25
57
17
VDD_RX
100p
0.1u
0.1u
0.1u
0.1u
0.1u
0.1u
0.1u
0.1u
0.1u
NA
100p
GSM 850/GSM 900 TX HIGH HIGH LOW GSM_PA_BAND MODE
WLNA_OUT
HIGH LOW LOW LOW GSM
C521
C522
C524
C525
C526
C527
C528
C529
C530
C531
C532
GSM 1800/GSM 1900 TX
WCDMA_MIX_IN_P
C523
HIGH DCS/PCS
GSM 850 RX - - -
WCDMA_MIX_IN_M
GSM 900 RX LOW LOW LOW R509
R510 VMSMP_2.6V
GSM 1800 RX LOW LOW LOW VBAT GSM_PA_RAMP 100
D 2.2K C535 C536 C537 D
C533
GSM 1900 RX LOW LOW HIGH C534 C538 0.01u 1000p 22p
22u
WCDMA HIGH LOW HIGH (1608)
GSM_PA_EN
TQM7M5008
C539 C540 R511
14 1
GND6 DCS_PCS_IN DCS_PCS_TX
4.7p 33p 18
13 2 R512 R513
GND5 BS
L512 300 300
E E
2.2nH 12 3
VCC TX_EN
U501 3 dB
11 TQM7M5008 4
GND4 VBATT
10 5
DCS_PCS_OUT
GND3 GND1
4 5
L513
C541
9
GSM_OUT VRAMP
6 FL501 O1 G3
IN
1
R514
GSM_TX
6.8nH EFCH897MTDB1 G2 G1
GND8
GND7
15p SFSY0030201 18
8 7 3 2
R515 R516
GND2 GSM_IN
GSM
L514
300 300
17
16
15
12nH
3 dB
F F
WCDMA L515
2.7nH VDD_RX
C543
L516
WCDMA LNA Circuit TCXO Circuit
C542 C544
VTCXO_2.85V
L517 1000p
22p
1nH FL502 WCDMA_MIX_IN_P
0.1uF
EFCH2140TDE1 1nH X500

R517 1 4
C C545 RTR_TRK_LO_ADJ VCONT VCC C
5 4
C549 C547 L518 100ohm
0.5p 1 G2 O2
2 3 100p C548
33p WLNA_OUT IN C546 C551 GND OUT TCXO_PM_19.2MHz
G1 O1
3.3nH 0.5p 0.01u
33p 2 3 19.2MHz
C550
0.75p 1000p C552
TCXO_RTR_19.2MHz
L519 EXSK0007802
1nH WCDMA_MIX_IN_M TG-5010LH_19_2M_75A
FL503
L520 C553
1 4
RX_WCDMA_2100 RX PGND
1nH 2 3
33p TX ANT
D D
ACMD-7602
C554 SDMY0001301
3p
VPWR
C555 C556 C557 SMPY0015501

10u 220p 100p
ACPM-7381 U503
(1608) 11
PGND
C560 U502 33p

10
9
VCC2 VCC1
1
2
C558 L521
4
O1 G3
5
1
C559 L522
Thermistor circuit deleted
GND3 RFIN IN WCDMA_2100_TX_OUT
8 3 2.7nH G2 G1
RFOUT VMODE1 33p 33p 4.7nH
SCDY0003402 7 4 3 2
6 5 L524
2

10nH
IN
1.5p NA C565 L523

OUT
20dB C566 100p

E As close as possible100p FL504 E
50OHM
EFCH1950TDF1
COUP
3
WCDMA_PA_R0
R518 WCDMA_PA_ON
51
R519
PWR_DET
75
R520 R521
91 91
10dB
1 2 3 4 5 6 7 8 9
LGMC
7. CIRCUIT DIAGRAM
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
A
SUB to MAIN 90Pin Connector SUB to FPCB_KEYPAD Connector VCAM_2.6V
SUB TO FPCB_CAM CONNECTOR (T=0.9. SOCKET)
A
2.2K
2.2K
R718
R719
CN602
91 FL600 ICVE21184E150R500FR
EVLC18S02015
1 90 1 9
SPKR_N 2 89
FLED CAM_PCLK 2
INOUT_A1 INOUT_B1
8
VCAM_1.8V
VCAM_2.6V
32KHZ_ON 3 88
KPD_COLUMN2 nCAM_RST 3
INOUT_A2 INOUT_B2
7
SPKR_P WLAN_SD_D0 CAM_2M_PWDN DEFAULT_NET_TYPE
INOUT_A3 INOUT_B3
4 87 4 6
KPD_ROW0 WLAN_SD_D1 CAM_VGA_PWDN INOUT_A4 INOUT_B4
1u
1u
5 86 04-6293-027-001-829
KPD_ROW1 WLAN_SD_D2 ENQY0014201
G1
G2
6 85
B KPD_ROW2 WLAN_SD_D3 VCAM_2.6V B
10
5
C626
C627
7 84
KPD_ROW3 WLAN_SD_CMD
VA600
8 83
KPD_COLUMN0 9 82
WLAN_SD_CLK
KPD_COLUMN1 10 81
BT_ACTIVE VPWR 27
KPD_ROW4 11 80
BT_PRIORITY 26 KPD_DRV_N
2.2K
2.2K
INTERNAL_MIC_P 12 79
WLAN_ACTIVE 25
BT_32KHZ 13 78
WLAN_PWR_ON 24 LEDCR1
C602
14 77
KPDPWR_ON VMSMP_2.6V 23
CN601
NA VIB_DRV_ON VMSMP_2.6V 22 LEDCG1 G1 G2
FB600
R601
R602
15 76 R600 680
KPD_DRV_N 16 75
TOUCH_Y2YU KPD_ROW4 21
C725 NA 1 34
17 74
TOUCH_X2XL NA 20 LEDCB1 2 33
nCAM_RST 18 73
TOUCH_Y1YD C603 19
C726 NA R603 0 3 32
CAM_2M_PWDN 19 72
TOUCH_X1XR 18
4 31 FL602 ICVE21184E150R500FR
CAM_VGA_PWDN 20 71
INTERNAL_MIC_P 17
R604 680 5 30 1 9
CAM_PWR_ON 21 70
SDMC_DAT3 16 KPD_COLUMN2 I2C_SDA 6 29 2
INOUT_A1 INOUT_B1
8
CAM_DATA7
CAM_DATA0 22 69
SDMC_DAT2 15
R605 680 7 28 3
INOUT_A2 INOUT_B2
7
CAM_DATA6
C CAM_DATA1 23 68
SDMC_DAT1 R606 47
14 KPD_COLUMN1 I2C_SCL 8 27 4
INOUT_A3 INOUT_B3
6
CAM_DATA5 C
CAM_DATA2 24 67
SDMC_DAT0 TOUCH_Y2YU 13
R607 680 9 26
CAM_DATA3 SDMC_CMD 12 KPD_COLUMN0
G1
G2
25 66 R608 47 10 25
CAM_DATA4 SDMC_CLK TOUCH_X1XR 11
10
5
26 65 R609 680 11 24
CAM_DATA5 27 64
nTF_DETECT R610 47
10 KPD_ROW3 12 23
CAM_DATA6 28 63
VTFLASH_3.0V TOUCH_Y1YD 9
R611 680 13 22
CAM_DATA7 29 62
LEDR1 R612 47
8 KPD_ROW2 14 21
CAM_PCLK 30 61
LEDG1 TOUCH_X2XL 7
R613 680 FB601 15 20 FL603 ICVE21184E150R500FR
CAM_HSYNC 31 60
LEDB1 6 KPD_ROW1 VCAM_2.6V
16 19 1 9
CAM_VSYNC 32 59
WLAN_PWD 5
R614 680 VMSMP_2.6V FB602 17 18 2
INOUT_A1 INOUT_B1
8
CAM_DATA3
CAM_MCLK 33 58
LCD_PWR_ON R615 680
4 KPD_ROW0 3
INOUT_A2 INOUT_B2
7
CAM_DATA2
PG05DBTFC
PG05DBTFC
PG05DBTFC
PG05DBTFC
FLASH_PWR_ON 34 57
FLM KPDPWR_ON 3
G3 G4 4
INOUT_A3 INOUT_B3
6
CAM_DATA1
VCOIN R721 $V 0 35 56
VRUIM_3.0V 2
ENBY0015601
LCD_RESET 1
G1
G2
36 55 AXK7L34227G
10K
10K
10K
10K
SIM_IO 37 54
BL_PWR_ON
10
5
CN600
SIM_CLK 38 53
D SIM_RST MDDI_P_DATA_M D
R616
R617
R618
R619
39 52
VPWR
40 51
MDDI_P_DATA_P
D708
D709
D710
D711
41 50 R620 10K FL604 ICVE21184E150R500FR
42 49 R621 0 1 9
43 48
MDDI_P_STB_P 2
INOUT_A1 INOUT_B1
8
CAM_MCLK
I2C_SCL 44 47 3
INOUT_A2 INOUT_B2
7 TP600
I2C_SDA MDDI_P_STB_M INOUT_A3 INOUT_B3 CAM_VSYNC
VOUT
45 46
POWER WLAN 4
INOUT_A4 INOUT_B4
6 TP601
CAM_HSYNC
G1
G2
92
AXK790327G
10
5
ENBY0035401
VPWR VWLAN_1.8V
R622
E E
0
L600
U600 LM3671IMFX-1.8NOPB 2.2uH
1 5
VIN SW
2
GND
WLAN 802.11 b/g 3 4

EN FB
LED Notification-RGB
C608 C609
4.7u 10u
VWLAN_1.8V
VWLAN_3.3V
VWLAN_1.8V
VWLAN_2.6V
VPWR VWLAN_3.3V LEDCG1

F F
LEDCR1
LEDCB1
R623
C610 C611
C612 C613
0
1u 1u 1u 1u
1.5K
6.8K
10K
U601 BH33MA3WHFV
1 2
VIN VOUT1
3
VOUT2
R624
R625
R626
5 4
GND NOISE
FXLP34L6X U602 6 7
6 1
WLAN_PWR_ON STBY PPAD
VWLAN_1.8V VCC VCC1 VWLAN_2.6V
5 2 KTK5132E D
NC A BT_ACTIVE C614 C615 C616 Q600
1u 0.1u 1u
4 3 G
Y GND LEDB1
C C617 C
1u S
FXLP34L6X U603
CN603 6 1
VWLAN_1.8V VCC VCC1 VWLAN_2.6V KTK5132E
20369-001E VPWR D
5 2 VWLAN_2.6V Q601
G1 C618 NC A BT_PRIORITY G
G2 33p LEDR1
4 3
G3 ANT Y GND
45
31
41
42
32
28
27
26
51
52
53
54
R627
VDD18_1
VDD18_2
VDD18_SDIO
VDD33_PA_1
VDD33_PA_2
VDD_SDIO
AVDD33
PGND_1
PGND_2
PGND_3
PGND_4
VDD_FLASH
L602 L603 U604 FXLP34L6X KTK5132E
0
D
NA NA 1 6 Q602
VWLAN_1.8V VCC1 VCC VWLAN_2.6V U605 R1114D261D-TR-F
1 3 G
4 R628 0 2 5
VDD VOUT LEDG1
BT_ACTIVE A NC
7 R629 10K 4 2 S
BT_FREQ NC GND1
100K
100K
100K
38 6 R630 0 3 4 6 5
WLAN_ACTIVE
C620
RF_IN_OUT_1 BT_PRIORITY GND Y CE GND2
100K
5 R631 0
NA
D RX_CLEAR D
R632 100K
C621 C622
23 R634 51K
WLAN_32KHZ
R635
R636
R637
LFXTALI 1u 1u
R638 68 12 24
WLAN_SD_CLK SDIO_CLK M600 LFXTALO
R639
16
WLAN_SD_CMD SDIO_CMD SWL-2700S 14
CLK_REQ
18 9 R642 100K
WLAN_SD_D0 19
SDIO_DATA_0 CHIP_PWD
17 R644 100K WLAN_PWD
WLAN_SD_D1 20
SDIO_DATA_1 SYS_RST_L
29 R646 10K
VWLAN_2.6V
WLAN_SD_D2 21
SDIO_DATA_2 SDIO_LDO_BYPASS
47 R648 10K
WLAN_SD_D3 SDIO_DATA_3 LDO_BYPASS
10 R649 10K
VWLAN_3.3V
GPIO_9
49 15 R650 10K
SPI_CK TDO VWLAN_2.6V
1 3
SPI_CS0_L GPIO_8
2 46
1000p
SPI_MISO GPIO_10
C624
48 30 D606
SPI_MOSI EJTAG_SEL
PG05DBTFC
WLAN/BT 32.768KHz
E E
GND10
GND11
GND12
GND13
GND14
GND15
R633
R655
R656
R657
R658
GND1
GND2
GND3
GND4
GND5
GND6
GND7
GND8
GND9
33K
33K
33K
33K
33K
D VMSMP_2.6V
Q603
13
22
33
34
35
37
39
40
43
44
11
25
36
50
8
KTK5132E
SI1305-E3
G
WLAN_PWD
Q604
100K
VWLAN_2.6V S
100K
C625
4.7u
R651
X600 SG-3030LC-32.768
1 12
G
VIO VDD
R652
6 7
32KHZ_ON GND OUT WLAN_32KHZ
R653
2 11
3
NC1 NC8
10
BT_32KHZ
F NC2 NC7 0
4 9
NC3 NC6
5 8
NC4 NC5
32.768MHz OJ600
1 2 3 4 5 6 7 8 9
LGMC
7. CIRCUIT DIAGRAM
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
Power Vibrator
A A
VPWR
MICRO SD I/F-TransFLASH
RTC Battery
VRUIM_3.0V
L700 CN700
SIM_IO
68nH
KDS160E D700 1
SIM_RST
SIM_CLK
2
VIB_DRV_ON
L701
ICVL0518400V500FR
C700 ICVL0518400V500FR 68nH ENEY0003801

1u 24-8000-002-000-829
B VCOIN B
2V, 0.5mA
BAT700
PLR0504F
VA700
NBL414R-F9J VA702
VA701
SBCL0001701 EVL5M02200 0
R701 4 3
5 2
VTFLASH_3.0V
6 1
VMSMP_2.6V
D701
15K
C C
R702
C701 0.1u
D702
C702 33p
1 6 D703
R703
R714
R716
R713
R715
33K
33K
33K
33K
33K
C703 33p
2 5 1 6
C704 33p
3 4 2 5
10K
3 4
R704
DNI
PLR0504F
LCD Connector
R705
20
16
15
14
13
12
11
21
Speaker Connector PLR0504F
S1
S5
S2
S6
S3
S7
G2
G3
S8
10
D T8
9
SDMC_DAT1 D
T7
8
SDMC_DAT0
T6
7
L702 T5 SDMC_CLK
CN701 S700 6
68nH 1 R750 T4
1 $V ENSY0018601 5 SDMC_CMD
04-6293-027-001-829 SPKR_N T3
4
ENQY0014201 49448-1611 T2 SDMC_DAT3
C705
2.2u
2 1 R751 3
$V SPKR_P T1 SDMC_DAT2
VLCD_1.8V VLCD_2.6V L703 2
S4
68nH 1
SUSY0026601
PG05DBTFC
FXLP34L6X U700
D704 PG05DBTFC
27 VOUT 6 1
EMS1810TPB1P
26 BLED1 VCC VCC1 ST1
17
nTF_DETECT
G1
25 BLED2 ST2
D706
0.1u
5 2 18
33p
BLED3 LCD_RESET
10p
24 NC A
19
NA
23 BLED4
D705
4 3 1 6
22 Y GND
C706
C709
C708
C707
E 21 R706 E
2 5
20 FLM
19 0
3 4
18
TP700
17 MDDI_P_STB_M
16
TP701 PLR0504F
15 MDDI_P_STB_P
14
13
VLCD_2.6V VLCD_1.8V
12
TP702
11 MDDI_P_DATA_M
10
TP703
9 MDDI_P_DATA_P
8
7
6
F 5 F
4
3
2
1 C710 C711 C712 C713
2.2u 0.01u 2.2u 0.01u
CN702 D707
PG05DBTFC
C C
Power LCD LCD BL/FLASH LED/CAMERA LDOs

VPWR
VPWR VLCD_2.6V
U702 MAX8631XETI
1 23
R708
PIN C1P
2
0
IN C714
U701 R1114D261D-TR-F C715 1u
1 3 22
D VDD VOUT 10u C1N D
3 26
4 2 24
GND C2P VOUT
NC GND1 PGND C716
6 5 29
LCD_PWR_ON CE GND2 BGND
27
1u C717
C2N 10u
25
C718 OUT
1u
20
BL_PWR_ON
R709
100K
C719 ENM1
19
1u ENM2
21 16
FLASH_PWR_ON 18
ENF M1
15
BLED1
CAM_PWR_ON 28
ENLDO M2
14
BLED2
R720
17
P1 M3
13
BLED3
P2 M4 BLED4
100K
100K
100K
12
DNI F1
11
FLED
F2
8 10
SETM F3
VPWR VLCD_1.8V 9
R710
R711
R712
E F4 E
7
SETF
4 VCAM_2.6V
LDO1
6 5 VCAM_1.8V
6.8K
REFBP LDO2
13K
R746
EUSY0263101
0
C720 C721 C722

U703 R1114D181D 0.01u 2.2u 2.2u
1 3
R730
R717
VDD VOUT
4 2
NC GND1
6 5
LCD_PWR_ON CE GND2
C723
1u
C724
1u
F
1 2 3 4 5 6 7 8 9
LGMC
7. CIRCUIT DIAGRAM
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
A
FPCB_KEYPAD to SUB Connector A
27
VPWR
26
25
24
KPD_DRV_N
MIC Connector LED Notification-RGB
23
LEDCR1
22
21
LEDCG1 CN100
KPD_ROW4 20 VPWR
LEDCB1 1 INTERNAL_MIC_P
19 2
B B
18
capacitor
17 OSF213-42DC
INTERNAL_MIC_P 16
KPD_COLUMN2 SUMY0010508
15
NA
14
13
KPD_COLUMN1
TOUCH_Y2YU
12
D100
KPD_COLUMN0 LEMC-S11G LD100
1
11
TOUCH_X2XL
10
9
KPD_ROW3
TOUCH_Y1YD
8
2
7
KPD_ROW2
TOUCH_X1XR BLUE
6
5
KPD_ROW1 LEDCB1
4 RED
3
KPD_ROW0 LEDCR1
C KPDPWR_ON 2 GREEN C
1
LEDCG1
FPCB_EDGE_CONN
D D
Button
Camera Button TOUCH SCREEN CONNECTOR Power Keypad LED
Volume Up
KB100
100ohm R100 LD101
VPWR
KPD_COLUMN1 KPD_ROW1 CN101
SSC-TWH104-HLS
KPD_COLUMN2 G2
PRSB6.8C
INSTPAR
6 100ohm R101 LD102

PRSB6.8C
KPD_ROW1 KPD_DRV_N
INSTPAR
D101
D102
5
TOUCH_Y2YU SSC-TWH104-HLS
4
E 4 1 KPD_ROW2 3
TOUCH_X2XL E
TOUCH_Y1YD
2 100ohm R102 LD103
3 2 TOUCH_X1XR
1
SSC-TWH104-HLS
Volume Down SW100
PRSB6.8C
PRSB6.8C
PRSB6.8C
PRSB6.8C
G1
LS50D23
KB101 ESCY0004201 ENQY0008602 100ohm R103 LD104
04-6298-006-000-883
SSC-TWH104-HLS
KPD_ROW2
PRSB6.8C
INSTPAR
D103
D104
D105
D106
D108
D107
PRSB6.8C
F F
Function Key END Button

KB102
KPD_ROW3
PRSB6.8C
INSTPAR
KPD_COLUMN2
D109
KB103
WLAN ANTENNA 5-Way Key
KPD_ROW0
C SEND C
10OL21C7AJ00006
EVLC14S02050
EVLC14S02050
KB104
SNGF0022802
GND3
GND2
KPD_ROW4
ANT100
SW101 ISCA TYPE
FEED
GND1
20369-001E
D110
G1
G2
COM2
G2
VA100
VA101
D111 D112 PRSB6.8C C A

G3 ANT
COM1 E
KPD_ROW0
PRSB6.8C PRSB6.8C ENWY0005601
KPD_COLUMN0 D B
KPD_ROW1
KPD_ROW2
COM3
KPD_ROW3
PRSB6.8C
G1
INSTPAR
KPD_ROW4
D SW102 D
D113
EVQQ7GA50
ESCY0004001
PRSB6.8C
PRSB6.8C
PRSB6.8C
PRSB6.8C
PRSB6.8C
INSTPAR
INSTPAR
INSTPAR
INSTPAR
INSTPAR
D114
D115
D116
D117
D118
Power Button
E E
KB105
KPDPWR_ON
PRSB6.8C
INSTPAR
D119
1 2 3 4 5 6 7 8 9
LGMC
7. CIRCUIT DIAGRAM
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
A A
B B
C C
D
2M CAM CONNECTOR (T=0.9. SOCKET) VGA CAM CONNECTOR FPCB to SUB Connector D
CN102
G1 G2 CN101 CN103
1 34 1 20 G1
2 33
VCAM_1.8V CAM_VGA_PWDN 2 19
VCAM3_2.6V
1 34
CAM_PCLK 3 32
CAM_MCLK 3 18
VCAM1_2.6V
2 33
VCAM_1.8V
4 31
VCAM1_2.6V
4 17
nCAM_RST 3 32
5 30
CAM_PCLK 5 16
I2C_SCL CAM_PCLK 4 31
VCAM1_2.6V
E nCAM_RST 6 29
I2C_SDA 5 30
E
7 28
nCAM_RST 6 29
CAM_DATA7
8 27
CAM_HSYNC CAM_2M_PWDN 7 28
CAM_DATA6
I2C_SDA 9 26
CAM_VSYNC CAM_VGA_PWDN 8 27
CAM_DATA5
I2C_SCL 10 25
CAM_DATA7 I2C_SDA 9 26
CAM_DATA4
11 24
CAM_DATA2 CAM_DATA5 CAM_DATA6 I2C_SCL 10 25
CAM_DATA3
12 23
CAM_DATA1 11 24
CAM_DATA2
CAM_DATA0 ENBY0039601 CAM_DATA1
13 22 GB042-20S-H10-E3000 12 23
CAM_2M_PWDN 14 21 13 22
CAM_DATA0
15 20
CAM_MCLK 14 21
VCAM2_2.6V
16 19 15 20
CAM_MCLK
17 18
CAM_VSYNC VCAM2_2.6V
16 19
VCAM3_2.6V CAM_HSYNC 17 18
CAM_VSYNC
G3 G4
VCAM3_2.6V CAM_HSYNC
ENBY0015601 G2
AXK7L34227G
F F
C C
D D
E E
1 2 3 4 5 6 7 8 9
LGMC
8. BGA IC PIN MAP
8. BGA IC PIN MAP
8.1 MSM7200 (EUSY0318901) : U101-1, U101-2
Fig.1 MSM7200 Pin Function Map (Top View)
8. BGA IC PIN MAP
MSM7200 (EUSY0318901) : U101-1, U101-2
: Us ed : Not us ed
Fig.2 MSM7200 Pin Map (Bottom View)
8. BGA IC PIN MAP
8.2 KAL009001M-D1YY (EUSY0316502) : U201
: Us ed
: Us ed
: Not us ed
Fig.3 KAL009001M Pin Map (Top View)
8. BGA IC PIN MAP
8.3 PM7540 (EUSY0342201) : U304
Fig.4 PM7540 Pin Function Map (Top View)
8. BGA IC PIN MAP
PM7540 (EUSY0342201) : U304
: Us ed : Not us ed
Fig.5 PM7540 Pin Map (Bottom View)
8. BGA IC PIN MAP
8.4 BCM2048SKUFBG (EUSY0319601) : U403
: Used : Not us ed
Fig.4 BCM2048 Pin Map (Bottom View)
9. PCB LAYOUT
U503 ACPM-7381
UMTS PAM
Low UMTS Tx Power
FL503 ACMD7602
Can’t make a call U403 BCM2048
Low UMTS Tx Power No Bluetooth/FM Radio
Low UMTS Rx Sensitivity Functions
No Service
U501 TQM7M5008
GSM TX Dual PAM
FL500 FEM Low GSM Tx Power
Can’t make a call
Low Tx Power
Low Rx Sensitivity
No Service X500 TCXO 19.2MHz
No Boot
CN400 Main to Sub 90P Con

U500 RTR6275 No LCD/Camera/WLAN/
(UMTS/GSMTransceiver) Touch/Key/Speaker/
Can’t make a call Vibrator Functions
Low Tx Power
Low Rx Sensitivity
No Service
CN301
No Boot
9. PCB LAYOUT
LD400 U401
No Camera Flash LED Low Speaker Sound
X400 U400
No Bluetooth/FM Function No Speaker/Receiver Sound
U304(PMIC) U402
No Power On No Headset Sound
No USB/USIM Function
U100 (BB/Modem)
ANT400
No Power/Boot On
Low Bluetooth Tx Power
No Display No Service
Low Bluetooth Rx Sensitivity
U201(Memory)
X300(32.768kHz)
No Boot
RTC Reset
U303
No USB Function U300
No TA/USB Charging
U301 U302
No UART Function No TA Charging
No Bluetooth Power On
9. PCB LAYOUT
CN701
No Speaker/Receiver Sound
CN600
U702 No Touch/Camera
No Camera On Shutter/LED/SEND/
No Backlight/Flash On END/Power/Jog Key
Functions
X600
Can’t make WLAN/Bluetooth
Sleep
9. PCB LAYOUT
CN700
CN601 No Vibrator Function
No 2M/VGA Camera
Functions
S700 M600
No USIM/T-Flash Functions No WLAN Function
CN602
No LCD/Camera/WLAN/ CN702
Touch/Key/Speaker/ No Display
Vibrator Functions
CN603
Low WLAN Tx Power
Low WLAN Rx Sensitivity
9. PCB LAYOUT
CN101
No VGA Camera Function
CN102
No 2M AF Camera Function
CN103
No 2M/VGA Camera
Functions
9. PCB LAYOUT
LD100
No Indicator LED On
KB105
No Power On
No Sleep/Resume Function
KB100
No Volume Up Key
KB101
No Volume Down Key
SW102
KB102
No 5-Way Key / Navigation
No Function Key
Key
KB103
LD102 No END Key
No Key LED On
SW100
KB104 Can’t take a picture
No SEND Key No AF Function
LD103
CN100 No Key LED On
Tx Mute
No Record Function
SW101
WLAN connector Low WLAN
CN101 Tx Power
No Touch Function Low WLAN Rx Sensitivity
ANT100
Low WLAN Tx Power
Low WLAN Rx Sensitivity
9. PCB LAYOUT
9. Calibration & RF Auto Test Program (Hot Kimchi)
9.1 Configuration of HOT KIMCHI
9.1.1 Configuration of directory
C: Cm_Grut Common Qualcomm Diag_NV6280.dll
Log Diag_NV.dll
At_Serial_Cmd.xml
Diag_Common.dll
DLL_E5515CD.DLL
DLL_PwrControlD.dll
Dll_SerialATD.dll
LG_CL_019.dll
PwrSupply_Cmd.xml
Debug Auto KS20
Cal KS20
: Directory CalAuto KS20
: File
Hot_Kimchi Log
ComLMPLib_1_11.dll
ComLMPLib_2_11.dll
Dll_EzLooksMQ_015.dll
GuiTk115d.dll
HK_33.exe
ShieldBox_DllD.dll
Model KS20 Log
LG_NsTest_E5515C_241.dll AutoSetup_001.xml
LG_RfTest_E5515C_108.dll Cal_Setup_Test.xml
QMSL_MSVC6R.dll Ezlooks.xml
LG_RfCal_Q3G6280TRev_100.dll
NstProcedure_KS20_001.xml
script_001.xml
: Directory
Spec_FullBand_013.xml
: File
dll,ocx (Win98)MFCD DLL COPY.bat
(Win2000)MFCD DLL COPY.bat
(WinXP)MFCD DLL COPY.bat
MFC42D.DLL
MFCD42D.DLL
MFCN42D.DLL
MFCO42D.DLL
MSVCP60D.DLL
MSVCRTD.DLL
Vsflex7L.ocx
vsflex7l_ocx_regist.bat
Result Auto KS20
Cal KS20
CalAuto KS20
UI LG_UI_Qu6275_004.dll
Multi_HK.reg
: Directory
: File
9.2 How to use HOT KIMCHI
2
3
* Procedure
1. Click “Logic Operation” of “SETTING” menu bar
2. Select “UART Port” that PC can communicate with the phone
3. Select “LOGIC MODE” that you want
- Logic Mode -> 1: Calibration Only

2: Auto Test Only
3: Calibration + Auto
5 Click "Start"
4 Select "KS20"
* Procedure
4. Select the model name “KS20”
5. Click “Start” button
10. Phone Test Mode _ 3G smart Phone KS20
1. Run Dialer, then insert “2676625720#” by tapping keypad

2. Tap 3. Device Test
3. Tap 6. Q_Test Program
4. Tap PTM(Phone Test Mode) Button.
Phone Test Mode Scenario_ 3G smart Phone KS20(1)
Item Order Description
* Phone Test mode
(1) Camera Test
1 Internal Camera
Off To start, press "Send" button
2 Internal Camera
On
3 Internal(Front)
Recording
& Save Internal Camera Record for 3 seconds.
Recorded file is saved in
/My Documents/My Pictures
Phone Test Mode Scenario_ 3G smart Phone KS20(2)
(1) Camera Test 4 External Camera

Off Flash LED Always ON during External camera testing
5External Camera
On
6 External(Rear)
Camera Preview
7 External(Rear)
Recording
& Save
For next test, press "SEND" button
Phone Test Mode Scenario_ 3G smart Phone KS20 Case(3)

Test Creating/Writing/Deleting a file in /Storage card.
(2) External 1 Check On
Memory if Pass, move next test automatically.
Test Break if not, the test is stopped.
z SD card should be inserted!!
(3) File Transfer 1 Check On Test Creating/Writing/Deleting a file in root(/)

if Pass, move next test automatically.
Break
if not, the test is stopped.
(4) Indicator LED 1 Color Test Red / Green / Blue

Test
Break 1) Red LED ON
2) If OK, press ìS end
3) Green LED ON
5) Blue LED ON
(5) Vibrator Test 1 Vibrator On

Break
Vibrating by pressing "Send" Key
2 Vibrator Off
(6) Key Press Test
OK
- Press a key that Red arrow indicate
(7) Acoustic Loop 1. Enable Handset acoustic loop Test

Test
Break 2. Enable Headset acoustic loop Test
(8) Sound Test Ringtone(MP3) is played repeatly.
Break
11. EXPLODED VIEW & REPLACEMENT PART LIST
11.1 EXPLODED VIEW
7 8
3 MGAD0137801
2
9
59
60
40
6 55
31 21
1
73 75
29
17 19 20
15
64 13 26 30 62
23
12 32 10
16 28
24
22
25 72
61
33 52 53
48 50
18 71 70 34 45
14 46 69
39
11
78
44 77
43
41 67
63 74 49 51 35
27 47
76
78
57
66 36
42 38 58
65
68
54 37 56
ASS'Y EXPLODED VIEW
E'
Q
R
S
D'
P F'
B' E'
D'
J
C'
B'
I A'
G Z
F
D Y
X
W
V
H Y U
T
T S
Z
C' R
F' Q
V
P
U O
A'
W N
M
L
K
O
J
L I
X H
K M G
F
E E
N D
A B C
C
B
A
11.2 Replacement Parts Note: This Chapter is used for reference, Part order
is ordered by SBOM standard on GCSC
<Mechanic component>
Location
Level Description Part Number Spec Color Remark
No.
1 GSM,BAR/FILP TGSM0048902
2 AAAY00 ADDITION AAAY0257802 Black
3 MLAZ00 LABEL MLAZ0037104 PRINTING, (empty), , , , , Metal Silver
4 MDAD00 DECO,CAMERA MDAD0028901 ELECTROFORMING, Cu, 0.2, , , , Silver
4 MPBZ00 PAD MPBZ0175301 COMPLEX, (empty), , , , , Black
4 MTAB00 TAPE,PROTECTION MTAB0185501 COMPLEX, (empty), , , , , Transparent
4 MTAZ00 TAPE MTAZ0184801 COMPLEX, (empty), , , , , Black
4 MWAE00 WINDOW,CAMERA MWAE0024201 CUTTING, PMMA MR 200, , , , , Black
4 MWAH00 WINDOW,FLASH MWAH0008501 MOLD, PC LUPOY GP-1000L, , , , , Milk
3 ACHA00 COVER SUB ASSY,FRONT ACHA0002502 Black
4 ACGK00 COVER ASSY,FRONT ACGK0101602 Silver
5 MBFF00 BRACKET,LCD MBFF0012401 MOLD, PA MXD6 RENY NXG5945S, , , , , Black
5 MBJC00 BUTTON,FUNCTION MBJC0021601 COMPLEX, (empty), , , , , Silver
5 MBJL00 BUTTON,SIDE MBJL0039001 COMPLEX, (empty), , , , , Silver
5 MBJN00 BUTTON,VOLUME MBJN0011801 COMPLEX, (empty), , , , , Silver
5 MBJP00 BUTTON,SHUTTER MBJP0006301 COMPLEX, (empty), , , , , Silver
5 MCCC00 CAP,EARPHONE JACK MCCC0043001 COMPLEX, (empty), , , , , Silver
5 MCCG00 CAP,MULTIMEDIA CARD MCCG0007501 COMPLEX, (empty), , , , , Silver
5 MCJK00 COVER,FRONT MCJK0068701 MOLD, PC LUPOY SC-1004A, , , , , Silver
5 MICA00 INSERT,FRONT MICA0019901 M1.4 D2.2 L1.5 Gold
5 MIDZ00 INSULATOR MIDZ0126601 COMPLEX, (empty), , , , , Green
5 MLAB00 LABEL,A/S MLAB0001102 C2000 USASV DIA 4.0 White
5 MLAR00 LABEL,WARNING MLAR0005301 COMPLEX, (empty), , , , , Yellow
5 MLEA00 LOCKER,BATTERY MLEA0037401 MOLD, PC LUPOY SC-1004A, , , , , Silver
5 MSDC00 SPRING,LOCKER MSDC0009201 Black
5 MSIY00 SHAFT MSIY0001101 CUTTING, STS, , , , , Silver
Location
No.
4 ACGN00 COVER ASSY,CAMERA ACGN0006801 Black
5 MBFP00 BRACKET,CAMERA MBFP0006801 MOLD, PC LUPOY HI-1002M, , , , , Black
5 MTAK00 TAPE,CAMERA MTAK0001701 COMPLEX, (empty), , , , , Black
5 MTAK01 TAPE,CAMERA MTAK0003001 COMPLEX, (empty), , , , , Black
5 MCJZ00 COVER MCJZ0039001 MOLD, PC LUPOY SC-1004A, , , , , Black
5 MFBC00 FILTER,SPEAKER MFBC0029301 COMPLEX, (empty), , , , , Black
5 MFBD00 FILTER,MIKE MFBD0022801 COMPLEX, (empty), , , , , Black
5 MICC00 INSERT,FRONT(UPPER) MICC0010001 D2.2 L2.0 KURL 45 Gold
5 MPBH00 PAD,MIKE MPBH0030501 COMPLEX, (empty), , , , , Black
5 MPBN00 PAD,SPEAKER MPBN0043201 COMPLEX, (empty), , , , , Black
5 MTAD00 TAPE,WINDOW MTAD0067601 COMPLEX, (empty), , , , , Black
5 MTAF00 TAPE,MOTOR MTAF0011101 CUTTING, NS, , , , , Black
4 MBJZ00 BUTTON MBJZ0011001 COMPLEX, (empty), , , , , Black
4 MGAD00 GASKET,SHIELD FORM MGAD0137801 COMPLEX, (empty), , , , , Gold
4 MGAD03 GASKET,SHIELD FORM MGAD0141301 COMPLEX, (empty), , , , , Black
4 MIDZ01 INSULATOR MIDZ0141001 COMPLEX, (empty), , , , , Blue
4 MIDZ02 INSULATOR MIDZ0149701 COMPLEX, (empty), , , , , Yellow
4 MKBZ00 KNOB MKBZ0002001 COMPLEX, (empty), , , , , Silver
4 MLAZ00 LABEL MLAZ0038303 PRINTING, (empty), , , , , White
4 MPBU00 PAD,CONNECTOR MPBU0001601 COMPLEX, (empty), , , , , Black
4 MPBU01 PAD,CONNECTOR MPBU0001701 COMPLEX, (empty), , , , , Black
4 MWAC00 WINDOW,LCD MWAC0088503 COMPLEX, (empty), , , , , Black
WLAN Module(IEEE 802.11b/g, 12mm*10mm*1.2mm,

7 M600 MODULE,ETC SMZY0015501
Atheros chip)
11.2 Replacement Parts Note: This Chapter is used for reference, Part order
<Main component>
Location
No.
4 SACY00 PCB ASSY,FLEXIBLE SACY0060901 MAIN FPCB Black
5 SACE00 PCB ASSY,FLEXIBLE,SMT SACE0055401 Black
PCB ASSY,FLEXIBLE,SMT
6 SACC00 SACC0034501 Black
BOTTOM
7 D101 DIODE,TVS EDTY0008606 DFN-2 ,7.82 V,150 mW,R/TP ,PB-FREE
PCB ASSY,FLEXIBLE,SMT
6 SACD00 SACD0045101
TOP
3.0 ,-2 dBd, ,WLAN, SMD, 8.0*3.0*1.5, RDL 8.5, ISCA-

7 ANT100 ANTENNA,GSM,FIXED SNGF0022802
D5 ,; ,SINGLE ,-2.0 ,50 ,3.0
7 CN100 MICROPHONE SUMY0010507 UNIT ,42 dB,4*1.35 ,SMD
7 CN101 CONNECTOR,FFC/FPC ENQY0008602 6 PIN,0.5 mm,ETC ,AU ,H:1.2MM
7 LD100 DIODE,LED,7-SEG EDLS0001102 7 ,3 DIGIT,R/TP ,R,G,B 1.6*1.6*0.4
7 LD101 DIODE,LED,CHIP EDLH0012501 Snow White ,1608 ,R/TP ,color concept
7 R100 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP
Location
No.
7 SW100 SWITCH,TACT ESCY0004201 12 V,0.02 A,HORIZONTAL ,0.2 G,
,SMD , dB, ,; ,0.30MM ,STRAIGHT ,SOCKET ,SMD

7 SW101 CONN,RF SWITCH ENWY0005601
,[empty] ,[empty] , ,
7 SW102 SWITCH,TACT ESCY0004001 15 V,0.02 A,VERTICAL ,1.3 G,
7 VA100 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005
6 SPCY00 PCB,FLEXIBLE SPCY0099601 POLYI ,0.2 mm,DOUBLE , ,; , , , , , , , , ,
4 SAJY00 PCB ASSY,SUB SAJY0023601 Black
5 SAJB00 PCB ASSY,SUB,INSERT SAJB0010601 Black
5 SAJE00 PCB ASSY,SUB,SMT SAJE0018001 Black
PCB ASSY,SUB,SMT
6 SAJC00 SAJC0016401 Black
BOTTOM
2 V,0.5 mAh,CYLINDER ,Reflow type BB, Max T 1.67,

7 BAT700 BATTERY,CELL,LITHIUM SBCL0001701
phi 4.8, Pb-Free
7 C609 CAP,CERAMIC,CHIP ECCH0005604 10 uF,6.3V ,M ,X5R ,TC ,1608 ,R/TP
7 C610 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
7 C618 CAP,CERAMIC,CHIP ECCH0000109 8 pF,50V,D,NP0,TC,1005,R/TP
7 C624 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP
CONNECTOR,BOARD TO
7 CN601 ENBY0015601 34 PIN,0.4 mm,STRAIGHT ,AU ,0.9MM HEIGHT
BOARD
CONNECTOR,BOARD TO
7 CN602 ENBY0035401 90 PIN,0.4 mm,ETC , ,H=3.0, Socket
BOARD
,SMD , dB, ,; ,0.30MM ,STRAIGHT ,SOCKET ,SMD

7 CN603 CONN,RF SWITCH ENWY0005601
,[empty] ,[empty] , ,
7 CN700 CONN,RECEPTACLE ENEY0003801 2 PIN, , ,
27 PIN,0.3 mm,STRAIGHT , , ,; , ,0.30MM ,FFC/FPC

7 CN702 CONNECTOR,FFC/FPC ENQY0014201
,STRAIGHT ,BOTH ,SMD ,R ,LOCKING ,
7 D606 DIODE,TVS EDTY0008501 TFSC ,5 V,50 W,R/TP ,small size
7 FB600 FILTER,BEAD,CHIP SFBH0000903 600 ohm,1005 ,
SMD ,18 V, ,SMD ,4ch. R-Varistor Array(50Ohm,15pF),

7 FL602 FILTER,EMI/POWER SFEY0007103
Pb-free

Pb-free
2.2 uH,M ,2.5x2.0x1.0 ,R/TP ,chip MLCI ,; , ,20% , , , , ,

7 L600 INDUCTOR,SMD,POWER ELCP0010001
,NON SHIELD ,2.5X2X1MM ,[empty] ,R/TP
Location
No.
7 L603 INDUCTOR,CHIP ELCH0004705 8.2 nH,J ,1005 ,R/TP ,
7 L700 INDUCTOR,CHIP ELCH0005019 68 nH,J ,1005 ,R/TP ,
7 Q603 TR,FET,N-CHANNEL EQFN0005601 ESM ,100 mW,30 V,100 mA,R/TP ,
7 R629 RES,CHIP,MAKER ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP
7 R632 RES,CHIP,MAKER ERHZ0000204 100 Kohm,1/16W ,F ,1005 ,R/TP
7 R638 RES,CHIP,MAKER ERHZ0000504 68 ohm,1/16W ,J ,1005 ,R/TP
7 S700 CONN,SOCKET ENSY0018601 16 PIN,ETC , ,2.54 mm,UIM 8P, Micro SD Dupli-Socket
7 U600 IC EUSY0234701 SOT23-5 ,5 PIN,R/TP ,
MICROPAK ,6 PIN,R/TP ,SINGLE BIT UNIT-

7 U602 IC EUSY0240001
DIRECTIONAL TRANSLATOR / PB FREE

7 U603 IC EUSY0240001

7 U604 IC EUSY0240001
6 SAJD00 PCB ASSY,SUB,SMT TOP SAJD0018501 Black
7 C608 CAP,CERAMIC,CHIP ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP
7 C615 CAP,CHIP,MAKER ECZH0003103 0.1 uF,10V ,K ,X7R ,HD ,1005 ,R/TP
Location
No.
7 C701 CAP,CHIP,MAKER ECZH0003504 100 nF,25V ,K ,X7R ,HD ,1608 ,R/TP
7 C702 CAP,CHIP,MAKER ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
7 C705 CAP,CERAMIC,CHIP ECCH0000198 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP
7 C707 CAP,CHIP,MAKER ECZH0003504 100 nF,25V ,K ,X7R ,HD ,1608 ,R/TP
27 PIN,0.3 mm,STRAIGHT , , ,; , ,0.30MM ,FFC/FPC

7 CN600 CONNECTOR,FFC/FPC ENQY0014201
,STRAIGHT ,BOTH ,SMD ,R ,LOCKING ,
7 D700 DIODE,SWITCHING EDSY0009901 ESC ,80 V,300 A,R/TP ,1.6*0.8*0.6(t)
7 D701 DIODE,TVS EDTY0008607 SC70-6L ,6 V,200 W,R/TP ,PB-FREE
Location
No.

Pb-free

Pb-free
SOT-323 ,.29 W,1.8 V,.86 A,R/TP ,P-Chanel MOSFET,

7 Q604 TR,FET,P-CHANNEL EQFP0004501
Pb free
7 R600 RES,CHIP,MAKER ERHZ0000310 680 ohm,1/16W ,F ,1005 ,R/TP
7 R624 RES,CHIP,MAKER ERHZ0000529 1.5 Kohm,1/16W ,J ,1005 ,R/TP
Location
No.
7 R717 RES,CHIP ERHY0000127 13K ohm,1/16W,F,1005,R/TP
HVSOF6 ,6 PIN,R/TP ,300mA CMOS LDO WITH

7 U601 IC EUSY0239302
OUTPUT CONTROL / 3.3V
7 U605 IC EUSY0294901 SON1612-6 ,6 PIN,R/TP ,2.6V 150mA LDO Pb-Free

7 U700 IC EUSY0240001
QFN (4x4) ,28 PIN,R/TP ,1x/1.5x/2x White LED Charger

7 U702 IC EUSY0263101
Pump , 2 LDO and Flash LED
7 VA600 VARISTOR SEVY0003801 18 V, ,SMD ,
7 VA702 VARISTOR SEVY0004101 5.6 V, ,SMD ,360pF, 1005
7 X600 OSCILLATOR EXSY0020701 32.768 KHz, PPM,15 pF,SMD ,3.6*2.8(2.4)*1.1 ,
6 SPJY00 PCB,SUB SPJY0039401 FR-4 ,0.8 mm,BUILD-UP 6 , ,; , , , , , , , , ,
4 SJMY00 VIBRATOR,MOTOR SJMY0008407 3 V,80 mA,10*2.7 ,17mm Elco8000 ,; ,3V , , ,12000 , , , ,
Location
No.
3.0 ,-2 dBd, ,GSM900/1800/1900+WCDMA2100,
4 SNGF00 ANTENNA,GSM,FIXED SNGF0024802
INTERNAL, GOLD ,; ,QUAD ,-2.0 ,50 ,3.0
4 SUSY00 SPEAKER SUSY0026601 PIN ,8 ohm,88 dB, mm, ,; , , , , , ,18*10*3T ,PIN
MAIN ,240*320 (2.8") ,48.3*68*2.5(t) ,262k ,TFT ,TM

4 SVLM00 LCD MODULE SVLM0024501
,S6D0165 (SEC) ,VA, MDDI
74.5 mm, LINE,Height 1.5T including RF switch ,;

4 SWCC00 CABLE,COAXIAL SWCC0004101
,[empty] ,[empty] ,0.075M , ,BLACK , ,N
3 AFBA00 FRAME ASSY,SHIELD AFBA0006601 Black
4 MFEA00 FRAME,SHIELD MFEA0014501 MOLD, PC LUPOY HI-1002M, , , , , Silver
4 MIDZ00 INSULATOR MIDZ0140901 COMPLEX, (empty), , , , , Blue
3 GMEY00 SCREW MACHINE,BIND GMEY0010601 1.4 mm,2.5 mm,MSWR3(BK) ,N ,+ ,NYLOK Black

Aluminum
3 MEBY00 EJECTOR MEBY0000201 PRESS, STS, , , , ,
Silver
3 MLAA00 LABEL,APPROVAL MLAA0050601 COMPLEX, (empty), , , , , White
3 SAFY00 PCB ASSY,MAIN SAFY0188202
4 SAFB00 PCB ASSY,MAIN,INSERT SAFB0069902 Black
4 SAFF00 PCB ASSY,MAIN,SMT SAFF0117502 Black
5 MLAZ00 LABEL MLAZ0038301 PID Label 4 Array Without Color

PCB ASSY,MAIN,SMT
5 SAFC00 SAFC0088301 Black
BOTTOM
3.0 ,-2 dBd, ,BLUETOOTH, SMD, 8.0*3.0*1.5, RDR 7.5,
6 ANT400 ANTENNA,GSM,FIXED SNGF0022801
ISCA-D5 ,; ,SINGLE ,-2.0 ,50 ,3.0
6 C100 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP
6 C105 CAP,CERAMIC,CHIP ECCH0000149 3.3 nF,50V,K,X7R,HD,1005,R/TP
Location
No.
6 C304 CAP,TANTAL,CHIP ECTH0004101 22 uF,6.3V ,M ,STD ,1608 ,R/TP
6 C313 CAP,CHIP,MAKER ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP
Location
No.
6 C341 CAP,CERAMIC,CHIP ECCH0000393 22 uF,6.3V ,M ,X5R ,HD ,2012 ,R/TP
Location
No.
6 C406 CAP,CHIP,MAKER ECZH0001216 220 nF,10V ,K ,X5R ,TC ,1005 ,R/TP
6 C409 CAP,CHIP,MAKER ECZH0001216 220 nF,10V ,K ,X5R ,TC ,1005 ,R/TP
6 C411 CAP,CERAMIC,CHIP ECCH0000901 2.2 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
6 D310 DIODE,SWITCHING EDSY0010501 ESC ,30 V,100 mA,R/TP ,SWITCH DIODE
2450 MHz,2.00*1.25*0.95 ,SMD ,Bluetooth Band Pass

6 FL400 FILTER,CERAMIC SFCY0000901
Filter
4.7 uH,M ,1 ,R/TP , ,; , ,0.3NH , , , , , ,NON SHIELD

,2.5X2X1MM ,11MM ,R/TP



6 L400 INDUCTOR,CHIP ELCH0004709 3.3 nH,S ,1005 ,R/TP ,
6 L405 INDUCTOR,CHIP ELCH0001041 10 nH,S ,1005 ,R/TP ,PBFREE
6 LD400 DIODE,LED,MODULE EDLM0008803 WHITE ,1 LED,3.5*2.8*1.0 ,R/TP ,PB-FREE
6 Q300 TR,BJT,PNP EQBP0006501 VMT3 ,150 mW,R/TP ,
Location
No.
6 R304 RES,CHIP,MAKER ERHZ0003901 .1 ohm,1/4W ,F ,2012 ,R/TP
6 R314 RES,CHIP ERHY0000105 51 ohm,1/16W,F,1005,R/TP
6 U100 IC EUSY0318901 CSP ,543 PIN,R/TP ,HSUPA & Convergence Platform
FBGA ,137 PIN,ETC ,FULLY 1.8V 2G(LB/256Mx8)

6 U201 IC EUSY0316502
NAND+1G(DDR/8Mx4x32) SDRAM , ,IC,MCP
WDFN ,8 PIN,R/TP ,-12V, 6.3A, Single P-MOSFET &

6 U300 IC EUSY0332901
DUAL Transistor
WQFN16 ,16 PIN,R/TP ,Dual DPDT Analog Switch ,;

6 U301 IC EUSY0342401
,IC,Analog Switch
6 U302 IC EUSY0333701 TLLGA ,8 PIN,R/TP ,OVP
6 U303 IC EUSY0308803 TDFN ,10 PIN,R/TP ,Analog S/W
6 U304 IC EUSY0342201 CSP ,137 PIN,R/TP ,PMIC, for MSM7xxx ,; ,IC,PMIC
6 U400 IC EUSY0303501 MicroPak ,10 PIN,R/TP ,1.6*2.1mm
6 U401 IC EUSY0196101 BUMP MICRO SMD ,9 PIN,R/TP ,1W AUDIO AMP
WCSP ,16 PIN,R/TP ,80-mW Capless Stereo Headphone

6 U402 IC EUSY0261501
Driver
32.768 KHz,20 PPM,12.5 pF,70 Kohm,SMD ,3.2*1.5*0.9

6 X300 X-TAL EXXY0018701
,
Location
No.
26 MHz,10 PPM,10 pF,.5 ohm,SMD ,32*25*0.6 ,. ,. ,.
6 X400 X-TAL EXXY0024401
,10PPM ,10 ,. ,. ,SMD ,P/TP
5 SAFD00 PCB ASSY,MAIN,SMT TOP SAFD0087601 Black
6 C308 CAP,CERAMIC,CHIP ECCH0000138 390 pF,50V,K,X7R,HD,1005,R/TP
6 C309 CAP,CERAMIC,CHIP ECCH0000138 390 pF,50V,K,X7R,HD,1005,R/TP
33 uF,10V ,M ,L_ESR ,2012 ,R/TP ,; , ,[empty] ,[empty] ,

6 C315 CAP,TANTAL,CHIP ECTH0005501
,-55TO+125C , ,[empty] ,[empty] ,[empty] ,[empty]
6 C500 CAP,CERAMIC,CHIP ECCH0001002 180 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP
6 C502 CAP,CHIP,MAKER ECZH0000839 4.7 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP
6 C510 CAP,CERAMIC,CHIP ECCH0000105 4 pF,50V,C,NP0,TC,1005,R/TP
Location
No.
6 C534 CAP,TANTAL,CHIP ECTH0004101 22 uF,6.3V ,M ,STD ,1608 ,R/TP
6 C544 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP
6 C545 CAP,CHIP,MAKER ECZH0001002 0.5 pF,50V ,B ,NP0 ,TC ,1005 ,R/TP
6 C546 CAP,CHIP,MAKER ECZH0001002 0.5 pF,50V ,B ,NP0 ,TC ,1005 ,R/TP
Location
No.
6 C554 CAP,CERAMIC,CHIP ECCH0000104 3 pF,50V,C,NP0,TC,1005,R/TP
6 C556 CAP,CERAMIC,CHIP ECCH0000133 220 pF,50V ,K ,X7R ,HD ,1005 ,R/TP
6 CN300 CONNECTOR,I/O ENRY0006001 18 PIN,0.4 mm,ETC , ,H=2.5
6 CN301 CONNECTOR,ETC ENZY0018901 4 PIN,3.0 mm,ETC , ,H=2.0
CONNECTOR,BOARD TO
6 CN400 ENBY0035301 90 PIN,0.4 mm,ETC , ,H=3.0, Header
BOARD
6 D306 DIODE,TVS EDTY0007401 SMD ,12 V,350 W,R/TP ,
6 FL300 FILTER,EMI/POWER SFEY0006501 SMD ,3 TERMINAL EMI FILTER
900.1800 ,1900.2100 ,3.5 dB,3.5 dB,25 dB,25 dB,ETC

6 FL500 FILTER,SEPERATOR SFAY0010001
,GSM Triple,UMTS Single, 5.4X4.0 Size Rx FEM
897.5 MHz,1.4*1.1*0.6 ,SMD ,Pb-

6 FL501 FILTER,SAW SFSY0030201
free_SAW_GSM900_Tx
2140 MHz,1.4*1.1*0.62 ,SMD ,2110M~2170M, IL 2.0,

6 FL502 FILTER,SAW SFSY0031201 5pin, U-B, 50-100_10, WCDMA BAND I Rx ,; ,2140
,1.4*1.1*0.62 ,SMD ,R/TP
Location
No.
1950 MHz,2140 MHz,1.6 dB,2.0 dB,53 dB,44
6 FL503 DUPLEXER,IMT SDMY0001301 dB,3.0*2.5*1.2 ,SMD ,FBAR, WCDMA duplexer ,; ,2140
,44 ,1950 ,53 ,2.0 ,1.6 ,3.0X2.5X1.2 ,DUAL ,SMD ,R/TP
1950 MHz,1.4*1.1*0.62 ,SMD ,RF Filter for WCDMA

6 FL504 FILTER,SAW SFSY0031101
2Ghz ,; ,1950 ,1.4*1.1*0.62 ,SMD ,P/TR
6 L301 INDUCTOR,CHIP ELCH0010402 270 nH,M ,1005 ,R/TP ,CHIP
6 L403 INDUCTOR,CHIP ELCH0012503 56 nH,J ,1005 ,R/TP ,1005,Coil-type,J
6 L500 INDUCTOR,CHIP ELCH0001420 3.9 nH,S ,1005 ,R/TP ,PBFREE
6 L510 INDUCTOR,CHIP ELCH0004725 33 nH,S ,1005 ,R/TP ,
6 L512 INDUCTOR,CHIP ELCH0001427 2.2 nH,S ,1005 ,R/TP ,Pb Free
6 L513 INDUCTOR,CHIP ELCH0004713 6.8 nH,J ,1005 ,R/TP ,
6 L523 INDUCTOR,CHIP ELCH0003824 10 nH,J ,1005 ,R/TP ,chip inductor,PBFREE
6 L524 INDUCTOR,CHIP ELCH0001409 10 nH,J ,1005 ,R/TP ,PBFREE
Location
No.
6 R503 RES,CHIP,MAKER ERHZ0003801 5.1 ohm,1/16W ,J ,1005 ,R/TP
6 SPFY00 PCB,MAIN SPFY0143401 FR-4 ,0.8 mm,STAGGERED-10 , ,; , , , , , , , , ,
6 SW500 CONN,RF SWITCH ENWY0002301 ANGLE ,SMD ,0.8 dB,
6 U403 IC EUSY0319601 SKUFBG ,80 PIN,R/TP ,Bluetooth+FM (5.5*5.5*0.6)
QFN ,56 PIN,R/TP ,GSM, WCDMA Single RF

6 U500 IC EUSY0300501
Transceiver, 8X8X0.9
6 U501 PAM SMPY0016501 dBm, %, A, dBc, dB, ,SMD , ,; , , , , , , , ,R/TP ,R/TP ,
COUPLER,RF -20 dB,-0.25 dB,-35 dB,1.0*0.58*0.35 ,SMD ,1850M ~

6 U502 SCDY0003402
DIRECTIONAL 1910M, 4pin, Pb Free
28 dBm,40 %,90 mA,-40 dBc,26.5 dB,4x4x1.1 ,SMD

6 U503 PAM SMPY0015501 ,MSM6280. Tr Switch Func included ,; , , , , , , , ,R/TP
,R/TP ,10
6 VA302 VARISTOR SEVY0003801 18 V, ,SMD ,
19.2 MHz,1.5 PPM,10 pF,SMD ,3.3*2.5*1.0 , ,; , ,2PPM

6 X500 VCTCXO EXSK0007802
,2.8V , , , , ,SMD ,P/TP
6 ZD300 DIODE,TVS EDTY0008601 SOD-323 ,6 V,400 W,R/TP ,PB-FREE
11.3 Accessory Note: This Chapter is used for reference, Part order
Location
No.
3 ADEY00 DATA KIT ADEY0009710 KS20 CD assy for SFR Without Color
SILVER
4 MCHZ00 COMPACT DISK MCHZ0041101 COMPLEX, (empty), , , , ,
SNOW
4 MEAY00 ENVELOPE MEAY0000401 PRINTING, (empty), , , , , Without Color
3.7 V,1050 mAh,1 CELL,PRISMATIC ,KS20 BATT,

BATTERY PACK,LI- PCM(Fuel guage), Pb-Free ,; ,3.7 ,1050 ,0.2 ,PRISMATIC
3 SBPP00 SBPP0023301
POLYMER ,40x42x57 , ,ALLTEL SILVER ,Innerpack ,Europe Label,
Fuel IC
; ,[empty] ,[empty] ,[empty] ,18 ,BLACK ,6.2mm Plug

3 SGDY00 DATA CABLE SGDY0010904
Datacable ,[empty]
; ,10mW ,16ohm ,111dB ,20HZ ,20HZ ,[empty] ,BLACK

EAR PHONE/EAR MIKE
3 SGEY00 SGEY0005544 ,18P MMI CONNECTOR ,Plug Mold( Abnormal)
SET
,Earphone,Stereo
3 SSAD00 ADAPTOR,AC-DC SSAD0021002 100-240V ,5060 Hz,4.8 V,0.9 A,CB & CE ,18pin plug
ADAPTOR,AC-DC SSAD0021001 100-240V ,5060 Hz,4.8 V,0.9 A,CB & CE ,18pin plug
100-240V ,5060 Hz,4.8 V,0.9 A,CE&CB ,18pin Plug ,; , , ,

ADAPTOR,AC-DC SSAD0021008
, , ,[empty] ,I/O CONNECTOR ,
100-240V ,5060 Hz,4.8 V,0.9 A,CB & CE ,18pin plug ,; , ,

ADAPTOR,AC-DC SSAD0021009
, , , ,[empty] ,I/O CONNECTOR ,
www.s-manuals.com

LGE Internal Use Only Only For Training and Service Purposes

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Table Of Contents

1. INTRODUCTION.................................. 5 4.13 SIM Detect Troubleshooting ..................115

3. TECHNICAL BRIEF............................17 6. BLOCK DIAGRAM ...........................146

1.2 Regulatory Information

E. Notice of Radiated Emissions

G. Interference and Attenuation

H. Electrostatic Sensitive Devices

2.1 System Overview

Shape GSM900/1800/1900 and WCDMA2100 - Bar type Handset

Size 99.8 X 58 X 12.9 mm

Weight Under 92.5g (with 1050mAh Battery)

Power 3.7 V normal, 1050 mAh Li-Polymer

Talk Time Over 100 min (WCDMA, Tx=-23 dBm, Voice)

(with 800mAh) Over 150 min (GSM, Tx=Level 5, Voice)

Standby Time Over 300 Hrs (WCDMA, DRX=1.28)

(with 800mAh) Over 400 Hrs (GSM, Paging period=9)

Antenna Internal type

LCD Main 2.8” 262K 240 X 320 pixel (TFT)

LCD Backlight White LED Back Light

Vibrator Yes (Coin Type)

LED Indicator Yes

Earphone Jack Yes (18 pin)

Connectivity Bluetooth, USB

Volume Key Push Type(+, -)

External Memory Yes

I/O Connect 18 Pin

2.2 Usable environment

Voltage 3.7 V(Typ), 3.2 V(Min), [Shut Down : 3.2 V]

Operation Temp -20 ~ +60°C

Storage Temp -20 ~ +70°C

TA Power Available power 100 220 240 Vac

2.3 Radio Performance

1) Transmitter - GSM Mode

Channel [A]M~[B]MHz -39dBm

1 Spurious 100k~880MHz -60dBm 100k~880MHz -60dBm

Emission 880M~915MHz -62dBm 880M~915MHz -62dBm

915M~1GHz -60dBm 915M~1GHz -60dBm

[A]M~[B]MHz -56dBm [A]M~[B]MHz -56dBm

[B]M~12.5GHz -50dBm [B]M~12.5GHz -50dBm

No Item GSM DCS & PCS

Channel [A]M~[B]MHz -36dBm

2 Spurious 30M ~ 880MHz -57dBm 30M~880MHz -57dBm

Emission 880M ~ 915MHz -59dBm 880M~915MHz -59dBm

915M~1GHz -57dBm 915M~1GHz -57dBm

[B]M~4GHz -47dBm [B]M~4GHz -47dBm

3 Frequency Error ±0.1ppm ±0.1ppm

3dB below reference sensitivity 3dB below reference sensitivity

Frequency Error RA250 : ±200Hz RA250: ±250Hz

5 Under Multipath and HT100 : ±100Hz HT100: ±250Hz

Interference Condition TU50 : ±100Hz TU50: ±150Hz

TU3 : ±150Hz TU1.5: ±200Hz

0 ~ 100kHz +0.5dB 0 ~ 100kHz +0.5dB

200kHz -30dB 200kHz -30dB

Due to 400kHz -60dB 400kHz -60dB

modulation 600 ~ 1800kHz -66dB 600 ~ 1800kHz -60dB

400kHz -19dB 400kHz -22dB

No Item GSM DCS & PCS

Frequency offset 800kHz

Intermodulation product should

level of Wanted signal

Power control Power Tolerance Power control Power Tolerance

Level (dBm) (dB) Level (dBm) (dB)

8 Transmitter Output Power 11 21 ±3 6 18 ±3