Introduction to Microsystems Packaging

Course PM

Introduction to Microsystems Packaging

MKM105

(7,5p Q1, 2009)

Contact persons

Examiner: Professor Johan Liu, phone: 031-772 3067 or

070-569 3821

Lecturers: Professor Johan Liu

Course assistants: Ph D. student Carl Zandén

Ph.D. student Björn Carlberg
Ph.D. student Teng Wang

Objectives of the course

The objective of the course is to give the students an insight of the conditions and
environment that they are going to work with after their studies if they choose the
electronics/microsystem industry. Basic concepts and knowledge about microelectronics and
microsystems packaging and integration technology as well as production technology will be
given. The students will after the course understand the driving forces for the quick
development and fast changes related to the microelectronics/microsystem industry and
products.

CHALMERS UNIVERSITY OF TECHNOLOGY 1

Department of Microtechnology and Nanoscience,
Bionano Systems Laboratory
Kemivägen 9, Se-412 96, Gothenburg, SWEDEN
 Introduction to Microsystems Packaging

Course content and organization

 Lectures
 Exercises (home work exercises are compulsory)
 Laboratory work (compulsory)
 Industrial visit (compulsory)
 Project work (in groups of two students) (compulsory)
 Review one project (compulsory)
 Oral presentation (compulsory)

A number of lectures will be organized in the course in order to give a background on

microelectronics/microsystems packaging and production.

In addition to this, exercises and laboratory work will enhance the students understanding of
the basic concepts in microelectronics and microsystems packaging and production.
We will also have one visit to a company that develops and manufactures electronic products.
Furthermore, a project work in the form of a literature search in a relevant field will be
performed in groups of two students. The project work will be presented both in written and
oral form. Each group will also review another group’s project work and will function as the
official opponent at the oral presentation (has to put some questions).

Lectures
 Introduction to microelectronics/microsystems packaging and production
 Electronic components and their packaging
 IC assembly
 Passives
 Sealing and encapsulation
 System-level PWB technology
 Board assembly, packaging materials and processes
 Wafer level packaging and other advanced packages
 MEMS
 RF- and optopackaging
 PCB design

Laboratory work
 Lab A: Surface mount technology
 Lab B: Flip-chip technology: Solders and Conductive Adhesives
 Lab C: CAD demonstration

All the labs are compulsory. Labs A-B will take place at MC2 building, floor 5, rooms A511-
515 and lab C will take place at MC2, floor 6.

CHALMERS UNIVERSITY OF TECHNOLOGY 2

Department of Microtechnology and Nanoscience,
Bionano Systems Laboratory
Kemivägen 9, Se-412 96, Gothenburg, SWEDEN
 Introduction to Microsystems Packaging

Project work:
A compulsory project work is included in the course. The aim is to further develop and deep
the student’s knowledge in some field of interest, related to electronics microsystems and
integration. Each student group of two students will choose one topic (either from the topic
list offered by the examiner or something else that the students are interested in and with
relevance for the course) and it will be performed as a literature survey.

The project work shall represent around one week’s work, and be presented in both written
and oral format. The written report shall be no less than 15 pages. Each group has 15 min for
their oral presentation plus 5 min discussion time (a total of 20 min for each group).
Furthermore, each group shall review another project work and function as opponent at the
oral presentation. The students shall critically read a report from another group and give at
least 2 questions during the oral session about the work.

The project work has to be decided as soon as possible or latest by the end of week 2 and
finished and delivered at the latest on Thursday on study week 6. The project work will be
graded with: not passed, 3, 4 and 5 and is worth 20% of the final grade.

Visits
In the course there will one compulsory industrial visit.
 SES at Kallebäck (preliminary)

Compulsory exercises
Before every exercise tutorial the students are supposed to solve one home problem and
deliver the solved problem to CA at the beginning of the class. The exercises will be graded
with: not passed, 3, 4 and 5 and will weigh 10% of the final grade of the course.

Examination
a) Written examination with scales: not passed, 340% (28 points), 4>60% (42 points),
5>80% (56 points).
b) Project work with scales: not passed, 3, 4, and 5.
a. Delivered written report
b. Oral presentation done
c. Review of another project work.
c) Exercises: not passed, passed.
d) The labs passed
e) The visit passed.
f) Written examination (80%), Project work (10%) and Exercises and Labs and all others
(10%) in the counting of the final grade.

Course literature
 Rao Tummala: “Fundamentals of Microsystems Packaging”, McGraw Hill, New
York, USA, 2001, ISBN: 0-07-137169-9

CHALMERS UNIVERSITY OF TECHNOLOGY 3

Department of Microtechnology and Nanoscience,
Bionano Systems Laboratory
Kemivägen 9, Se-412 96, Gothenburg, SWEDEN
 Introduction to Microsystems Packaging

Course schedule 09 for MKM105

Date Time Class- Contents Teacher Form
room
Week 1
08:00- Luftbryggan Introduction to the course. Practical aspects. Lecture1
09:45 Lectures, exercises, labs, project work hand- JL,
Tuesday
out, literature, CZ,TW,
1/9
Introduction to microelectronics production BC
and packaging, Chapters 1-3
Friday 08:00- Luftbryggan Questions 1-6 in Chapter 1 CZ Tutorial
09:45 Questions 1,2 and 5 in Chapter 2 1
4/9
Question 2 in chapter 3
Week 2
Tuesday 10:00- Kollektorn Electronic components and their packaging JL Lecture
8/9 11:45 Chapters 7 and 8 2
Deadline: Final decision for project work
08:00- Luftbryggan Fundamentals of IC Assembly JL Lecture
09:45 Chapter 9 3
Friday
10:00- Luftbryggan Question 8 in Chapter 7 CZ Tutorial
11/9
11:45 Questions 1-4,6 in Chapter 8 2

Week 3
08:00- A520 Group 1 & 2: Lab A, B BC Lab
Tuesday 11:45
15/9
08:00- Luftbryggan Fundamentals of passives, JL Lecture
09:45 Chapter 11 4
Friday
18/9 10:00- Luftbryggan Questions 1-6 in Chapter 9 CZ Tutorial
11:45 Questions 1-7 in Chapter 11 3

Week 4
08.00- A520 Group 3 & 4: Lab A, B TW, BC Lab
11.45
Tuesday
22/9 13:15- A520 Group 4 & 3: Lab A, B TW, BC Lab
17:00

Monday 09:00- RUAG AB Industrial visit RAUG AB in kallebäck CZ Visit

21/9 12:00 (Preliminary date)

CHALMERS UNIVERSITY OF TECHNOLOGY 4

Department of Microtechnology and Nanoscience,
Bionano Systems Laboratory
Kemivägen 9, Se-412 96, Gothenburg, SWEDEN
 Introduction to Microsystems Packaging

Week 5
Tuesday 10:00- Kollektorn Fundamentals of sealing and encapsulation JL Lecture
29/9 11:45 Chapter 15 5

08:00- Luftbryggan Fundamentals of System-level PWB JL Lecture

Friday
09:45 technology 6
2/10
Chapter 16
10:00- Luftbryggan Questions 1,3,7,11,12 and 13 in Chapter 15 CZ Tutorial
Friday
11:45 4
2/10

Week 6
08:00- A520 Group 2 & 1: Lab A, B TW, BC Lab
Tuesday
11:45
6/10

Wednesday 10:00- Luftbryggan Optical packaging, Chapter 12 AA Guest

7/10 11:45 Guest lecturer from Ericsson AB Lecture
08:00- Luftbryggan PCB Design, Chapter 4 JL Lecture
09:45 7

Friday 10:00- Luftbryggan Wafer level packaging, Chapter10 JL Lecture

9/10 11:45 MEMS; Chapter 14 8
17:00 Deadline: The project reports have to be Deadline
delivered both to us and to the opponents
Week 7
Monday 13:15- 6C Lab C Cad-Star, group 1 & 2 YF Lab
12/10 17:00 Landscape
08:00- Kollektorn Questions in Chapter 4 CZ Tutorial
09:45 Questions 1-6 in chapter 10 5

Tuesday 10:00- Kollektorn Fundamentals of board assembly, packaging JL Lecture

13/10 11:45 materials and processes: soldering 9
Chapters 17
13:15- 6C Lab C Cad-Star, group 3 & 4 YF Lab
17:00 Landscape
Thursday 08:00- 6C Lab C, Cad-Star, extra time for other labs YF Lab
15/10 11:45 Landscape
08:00- Luftbryggan Fundamentals of board assembly, packaging JL Lecture
Friday
09:45 materials and processes: conductive adhesive 10
16/10
joining, Chapter 18
09:45- Luftbryggan Questions 3,4,5,7,8,11 in chapter 18 CZ Tutorial
11:45 Questions in chapter 12 6
Friday
16/10 13:15- Luftbryggan Go through old examination between 1 and 2 JL,CZ Deadline
17:00 pm followed by Oral presentation of project
reports between 2 and 5.
CHALMERS UNIVERSITY OF TECHNOLOGY 5
Department of Microtechnology and Nanoscience,
Bionano Systems Laboratory
Kemivägen 9, Se-412 96, Gothenburg, SWEDEN
 Introduction to Microsystems Packaging

Week 8
Thursday 14:00- Johanneberg Written examination JL, CZ Exam
22/10 18:00

Contact persons
Short version Name E-mail address Telephone Office
CZ Carl Zandén carlz@chalmers.se 772 30 68 MC2
JL Johan Liu johan.liu@chalmers.se 772 30 67 MC2
TW Teng Wang teng.wang@chalmers.se 772 30 92 MC2
BC Björn Carlberg bjorn.carlberg@chalmers.se 772 30 75 MC2

Links to important web pages:

To student portal: http://www.student.chalmers.se/. At this page you can download the
material from all the courses given at Chalmers.

Company visit
In the course there is one mandatory visit to RUAG in Kallebäck. To Kallebäck everybody
has to go by his or her own. Suggestions how to get there:
1. You can take the green or the red express bus from Kungportsplatsen and go off at
Delsjömotet. There you go under the viaduct and then uphill. From there you will see
RUAG.
2. Go by a tram from Chalmers station through the tunnel to Korsvägen. Then take a bus
to delsjömotet from there.
3. Follow Carl there. Time and place will be announced later.

How to find the class rooms

Kollektorn lecture hall, room number A423, meaning MC2 building, A house, 4th floor.
Fasrummet, room number A820, meaning MC2 building, A house, 8th floor.
Valensbandet, room number A504, meaning MC2 building, A house, 5th floor.
A520, lab room at MC2, house A, 5th floor.
6C landscape is in the 6th floor
Luftbryggan, A section, 8th floor

CHALMERS UNIVERSITY OF TECHNOLOGY 6

Department of Microtechnology and Nanoscience,
Bionano Systems Laboratory
Kemivägen 9, Se-412 96, Gothenburg, SWEDEN