Shivananda (Shivoo) R Koteshwar
LINKEDIN: https://in.linkedin.com/in/shivoozlife
Facebook: shivoo.koteshwar
BIT, Bangalore
March 2017
Faculty Development Program on “ADVANCES IN VLSI DESIGN ”Kids use Arduino
Men/Women use STM32
Legends use 8051Need for Low Power (1/2)
Cost
= Core power consumption must be dissipated through the
packaging only. This is putting a pressure on packaging
cost and cooling strategies- Plastic vs. Ceramic package,
Heat sink, Fan
Reliability
» High power systems tend to run hot and high temperature
tends to exacerbate several silicon failure mechanism
= Every aodegree rise in operating temperature roughly
doubles a component failure rate. Less reliable due to
increased rate of electro migration
= Circuits are slower at higher temperature