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S5295B,S5295G,S5295J

TOSHIBA Fast Recovery Diode Silicon Diffused Type

S5295B, S5295G, S5295J


High Speed Rectifier Applications (fast recovery) Unit: mm

· Average Forward Current: IF (AV) = 0.5 A (Ta = 50°C)


· Repetitive Peak Reverse Voltage: VRRM = 100, 400, 600 V
· Reverse Recovery Time: 1.5 µs
· Plastic Mold Type.

Maximum Ratings

Characteristics Symbol Rating Unit

S5295B 100
Repetitive peak
S5295G VRRM 400 V
reverse voltage
S5295J 600
S5295B 75
Reverse voltage
S5295G VR 300 V
(DC)
S5295J 500
JEDEC DO-15
Average forward current (Ta = 50°C) IF (AV) 0.5 A
JEITA SC-39
Peak one cycle surge forward current 30 (50 Hz)
IFSM A TOSHIBA 3-3B1A
(non repetitive) 33 (60 Hz)
Junction temparature Tj -40 to 125 °C
Weight: 0.42 g (typ.)

Storage temparature range Tstg -40 to 125 °C

Electrical Characteristics (Ta = 25°C)

Characteristics Symbol Test Condition Min Typ. Max Unit

Peak forward voltage VFM IFM = 1.0 A ¾ ¾ 1.5 V


Repetitive peak reverse current IRRM VRRM = Rated ¾ ¾ 10 mA
Reverse recovery time trr IF = 20 mA, IR = 1 mA ¾ ¾ 1.5 ms
Forward recovery voltage Vfr IF = 100 mA, tr = 100 ns, tw = 5 ms ¾ ¾ 10 V

Note1: Soldering: 5 mm is the minimum to be kept between case and soldering part.

Note2: Lead bending: 5 mm is the minimum to be kept from the case when bend the lead wire.

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S5295B,S5295G,S5295J

Marking

Type Code Lot No.

Code Type

95J Month (starting from alphabet A) 95B S5295B


95G S5295G
Year (last number of the christian era)
95J S5295J
Cathode Mark
Color: Silver

iF – vF Ta max – IF (AV)
20 200
(A)

10

Maximum allowable temperature


iF

160
5
Instantaneous forward current

Ta max (°C)
3 125
120
Tj = 25°C
Resistive and inductive load
1
80

0.5 Capacitive load

0.3 40

0.1 0
0.4 0.8 1.2 1.6 2.0 2.4 2.8 0 0.1 0.2 0.3 0.4 0.5 0.6
Instantaneous forward voltage vF (V) Average forward current IF (AV) (A)

Surge forward current (non-repetitive)


50
(A)

Tj = 25°C
Peak surge forward current IFSM

40

30

20

60 Hz
10
50 Hz

0
1 3 5 10 30 50 100
Number of cycles

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S5295B,S5295G,S5295J

RESTRICTIONS ON PRODUCT USE 000707EAA

· TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc..

· The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this
document shall be made at the customer’s own risk.

· The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other
rights of the third parties which may result from its use. No license is granted by implication or otherwise under
any intellectual property or other rights of TOSHIBA CORPORATION or others.

· The information contained herein is subject to change without notice.

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This datasheet has been download from:

www.datasheetcatalog.com

Datasheets for electronics components.

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