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Special Issue of the IEEE Transactions on Dielectrics


and Electrical Insulation on Nanodielectrics
We are pleased to announce that the April 2020 issue of the IEEE Transactions on Dielectrics
and Electrical Insulation (TDEI) will be a Special Issue on Nanodielectrics. This issue is open to all
authors. Topics include, but are not restricted to, the following:
A. Fabrication and Characterization of Nanodielectrics
1. New fabrication methods of nanodielectrics
2. New characterization methods of nanodielectrics
3. Surface modification techniques of nanoparticles
4. Large-scale preparation of nanodielectrics
B. Property and Property Enhancement Mechanism of Nanodielectrics
1. Electrical properties of nanodielectrics under high electrical field
2. Long-time performance of nanodielectrics
3. Unusual properties of nanodielectrics and the underlying mechanisms
C. Modeling and Simulation
1. Computer-aided design of nanodielectrics
2. Structure–property relationship of nanodielectrics
D. Applications
1. Applications of nanodielectrics in power equipment and systems
2. Applications of nanodielectrics in extreme environment
3. Applications of nanodielectrics in electronic devices
4. New applications of nanodielectrics
All papers will undergo the standard peer-review process for all IEEE transactions and journals.
The papers will be initially evaluated based on their scientific merit, novelty, and presentation.
Manuscripts that fail to fulfill these requirements will be rejected without peer review. Papers will be
automatically checked using CrossCheck for plagiarism, including self-plagiarism.
Authors are invited to submit their papers to the TDEI website (http://www.cloznet.com/ieeetdei).
To ensure rapid processing, be sure to follow very closely the template and the instructions therein,
which can be downloaded from the TDEI Submissions Page or directly from
http://www.cloznet.com/ieeetdei/TDEI%20Template.doc. On the Submissions Page, be sure to
select from the drop-down list the Guest Editor for the Nanodielectrics Special Issue. Note that the
deadline for submissions is September 30, 2019.
Questions concerning this Special Issue may be directed to the Guest Editors, Xingyi Huang and
Thomas Andritsch, or to the Editor-in-Chief of the IEEE TDEI, Edward Cherney, at
each@sympatico.ca.

Guest Editors:
Xingyi Huang Thomas Andritsch
Department of Electrical Engineering, Electronics and Computer Science
Shanghai Jiao Tong University, China University of Southampton, United Kingdom
Email: xyhuang@sjtu.edu.cn Email: T.Andritsch@soton.ac.uk

72  IEEE Electrical Insulation Magazine

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