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Transistor
(3)
zApplications
0.8
1.6
(2) (1)
Interfacing, switching (30V, 100mA)
0.1Min.
0.2 0.2
0.15
0.5 0.5
1.0
(1)Source
zFeatures (2)Gate
1) Low on-resistance. (3)Drain Abbreviated symbol : KN
Code TL
Type
Basic ordering unit
(pieces) 3000
2SK3019
Gate
zThermal resistance
Parameter Symbol Limits Unit
Channel to ambient Rth(ch-a) ∗ 833 °C / W
∗ With each pin mounted on the recommended lands.
Rev.C 1/3
2SK3019
Transistor
1.5
20m
0.1
10m
5m 1
2.5V
2m
Ta=125°C
0.05
1m 75°C
2V 25°C 0.5
0.5m
−25°C
0.2m
VGS=1.5V
0 0.1m 0
0 1 2 3 4 5 0 1 2 3 4 −50 −25 0 25 50 75 100 125 150
DRAIN-SOURCE VOLTAGE : VDS (V) GATE-SOURCE VOLTAGE : VGS (V) CHANNEL TEMPERATURE : Tch (°C)
Fig.1 Typical output characteristics Fig.2 Typical transfer characteristics Fig.3 Gate threshold voltage vs.
channel temperature
50 50 15
VGS=4V VGS=2.5V Ta=25°C
Pulsed Ta=125°C Pulsed Pulsed
ON-STATE RESISTANCE : RDS(on) (Ω)
Ta=125°C 75°C
20 20 25°C
75°C
−25°C
25°C
10 10 10
−25°C
STATIC DRAIN-SOURCE
STATIC DRAIN-SOURCE
STATIC DRAIN-SOURCE
5 5
2 5
2 ID=0.1A
1 1 ID=0.05A
0.5 0.5 0
0.001 0.002 0.005 0.01 0.02 0.05 0.1 0.2 0.5 0.001 0.002 0.005 0.01 0.02 0.05 0.1 0.2 0.5 0 5 10 15 20
DRAIN CURRENT : ID (A) DRAIN CURRENT : ID (A) GATE-SOURCE VOLTAGE : VGS (V)
Fig.4 Static drain-source on-state Fig.5 Static drain-source on-state Fig.6 Static drain-source
resistance vs. drain current (Ι) resistance vs. drain current (ΙΙ) on-state resistance vs.
gate-source voltage
Rev.C 2/3
2SK3019
Transistor
9 0.5 200m
VGS=4V VDS=3V VGS=0V
FORWARD TRANSFER
ADMITTANCE : |Yfs| (S)
ID=100mA 0.1 25°C
75°C 20m
6
0.05 Ta=125°C
STATIC DRAIN-SOURCE
Fig.7 Static drain-source on-state Fig.8 Forward transfer Fig.9 Reverse drain current vs.
resistance vs. channel admittance vs. drain current source-drain voltage (Ι)
temperature
200m 50 1000
Ta=25°C Ta=25°C Ta=25°C
REVERSE DRAIN CURRENT : IDR (A)
tf
100m Pulsed f=1MHZ 500 VDD=5V
VGS=0V td(off) VGS=5V
50m 20 RG=10Ω
200
20m
10 100
10m VGS=4V 0V
5m 5 50
Coss
tr
2m 20
Crss td(on)
1m 2
10
0.5m
1 5
0.2m
0.1m 0.5 2
0 0.5 1 1.5 0.1 0.2 0.5 1 2 5 10 20 50 0.1 0.2 0.5 1 2 5 10 20 50 100
SOURCE-DRAIN VOLTAGE : VSD (V) DRAIN-SOURCE VOLTAGE : VDS (V) DRAIN CURRENT : ID (mA)
Fig.10 Reverse drain current vs. Fig.11 Typical capacitance vs. Fig.12 Switching characteristics
source-drain voltage (ΙΙ) drain-source voltage (See Figures 13 and 14 for
the measurement circuit
and resultant waveforms)
90%
VGS 50% 50%
ID VGS
VDS 10%
D.U.T. RL
RG VDS 10% 10%
VDD
90%
90%
td (on) tr tf
td (off)
ton toff
Rev.C 3/3
Notice
Notes
1) The information contained herein is subject to change without notice.
2) Before you use our Products, please contact our sales representative and verify the latest specifica-
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ductors can break down and malfunction due to various factors.
Therefore, in order to prevent personal injury or fire arising from failure, please take safety
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4) Examples of application circuits, circuit constants and any other information contained herein are
provided only to illustrate the standard usage and operations of the Products. The peripheral
conditions must be taken into account when designing circuits for mass production.
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R1102A