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Features: Description:
• Max. Clock 10 MHz The Microchip Technology Inc. 25AA640A/25LC640A
• Low-Power CMOS Technology: (25XX640A*) are 64 kbit Serial Electrically Erasable
- Max. Write Current: 5 mA at 5.5V, 10 MHz PROMs. The memory is accessed via a simple Serial
Peripheral Interface (SPI) compatible serial bus. The
- Read Current: 5 mA at 5.5V, 10 MHz
bus signals required are a clock input (SCK) plus
- Standby Current: 1 A at 5.5V separate data in (SI) and data out (SO) lines. Access to
• 8192 x 8-bit Organization the device is controlled through a Chip Select (CS)
• 32 Byte Page input.
• Self-Timed Erase and Write Cycles (5 ms max.) Communication to the device can be paused via the
• Block Write Protection: hold pin (HOLD). While the device is paused, transi-
- Protect none, 1/4, 1/2 or all of array tions on its inputs will be ignored, with the exception of
Chip Select, allowing the host to service higher priority
• Built-In Write Protection:
interrupts.
- Power-on/off data protection circuitry
The 25XX640A is available in standard packages
- Write enable latch
including 8-lead PDIP and SOIC, and advanced
- Write-protect pin packaging including 8-lead MSOP, 8-lead TSSOP, DFN
• Sequential Read and TDFN.
• High Reliability:
- Endurance: 1,000,000 erase/write cycles Package Types (not to scale)
- Data retention: > 200 years
TSSOP/MSOP PDIP/SOIC
- ESD protection: > 4000V (ST, MS) (P, SN)
• Temperature Ranges Supported:
CS 1 8 VCC CS 1 8 VCC
- Industrial (I): -40C to +85C SO 2 7 HOLD
SO 2 7 HOLD
- Automotive (E): -40°C to +125°C WP 3 6
5
SCK
VSS 4 SI WP 3 6 SCK
VSS 4 5 SI
HOLD 1 8 SCK
CS 1 8 VCC
VCC 2 7 SI SO 2 7 HOLD
CS 3 6 VSS
4 5 WP 3 6 SCK
SO WP
VSS 4 5 SI
Param.
Sym. Characteristic Min. Max. Units Test Conditions
No.
Param.
Sym. Characteristic Min. Max. Units Test Conditions
No.
SCK
18 19
High-Impedance
SO n+2 n+1 n n n-1
Don’t Care 5
SI n+2 n+1 n n n-1
HOLD
CS 12
2 11
7
Mode 1,1 8 3
SI MSB in LSB in
High-Impedance
SO
CS
9 10 3
Mode 1,1
SCK Mode 0,0
13
14 15
Don’t Care
SI
Memory EEPROM
I/O Control X
Control Array
Logic
Logic Dec
Page Latches
SI
SO Y Decoder
CS
SCK
HOLD Sense Amp.
R/W Control
WP
VCC
VSS
0 1 2 3 4 5 6 7 8 9 10 11 21 22 23 24 25 26 27 28 29 30 31
SCK
Data Out
High-Impedance
SO 7 6 5 4 3 2 1 0
CS
Twc
0 1 2 3 4 5 6 7 8 9 10 11 21 22 23 24 25 26 27 28 29 30 31
SCK
Instruction 16-bit Address Data Byte
SI 0 0 0 0 0 0 1 0 15 14 13 12 2 1 0 7 6 5 4 3 2 1 0
High-Impedance
SO
CS
0 1 2 3 4 5 6 7 8 9 10 11 21 22 23 24 25 26 27 28 29 30 31
SCK
Instruction 16-bit Address Data Byte 1
SI 0 0 0 0 0 0 1 0 15 14 13 12 2 1 0 7 6 5 4 3 2 1 0
CS
32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47
SCK
Data Byte 2 Data Byte 3 Data Byte n (32 max.)
SI 7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0
CS
0 1 2 3 4 5 6 7
SCK
SI 0 0 0 0 0 1 1 0
High-Impedance
SO
CS
0 1 2 3 4 5 6 7
SCK
SI 0 0 0 0 0 1 0 0
High-Impedance
SO
CS
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
SCK
Instruction
SI 0 0 0 0 0 1 0 1
CS
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
SCK
SI 0 0 0 0 0 0 0 1 7 6 5 4 3 2 1 0
High-Impedance
SO
Note: An internal write cycle (TWC) is initiated on the rising edge of CS after a valid write STATUS register
sequence.
WEL WPEN WP
Protected Blocks Unprotected Blocks STATUS Register
(SR bit 1) (SR bit 7) (pin 3)
0 x x Protected Protected Protected
1 0 x Protected Writable Writable
1 1 0 (low) Protected Writable Protected
1 1 1 (high) Protected Writable Writable
x = don’t care
XXXXXXX 5LC640A
XXXXXXX E/MF e3
XXYYWW 0728
NNN IL7
XXXXXT 5LCAI
YWWNNN 7281L7
XXXXXXXX 25LC640A
T/XXXNNN I/P e3 1L7
YYWW 0728
XXXXXXXT 25L640AI
XX/XXYYWW SN e3 0728
NNN 1L7
XXXX 5LCA
TYWW I728
NNN 1L7
XXX C81
YWW 828
NN 17
Note: For very small packages with no room for the Pb-free JEDEC designator
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Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
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Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
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Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
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Revision A (9/2003)
Initial Release.
Revision B (12/2003)
Corrections to Section 1.0, Electrical Characteristics.
Revision C (9/2007)
Features and Description, removed reference to Pb-
free packages; Revise Table 1-2: AC Characteristics,
parameters 7 and 8; Updated Packing Information/
Package Drawings; Add DFN Package; Removed
trademark from SPI.
Revision D (10/2008)
Added TDFN Package; Updated Package Drawings.
Revision E (02/2012)
Add text to Section 2.5.
Revision F (01/2013)
Revise Automotive E-temp; Revise Table 1-2, Param.
No. 21; Update Package Info.
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Telephone: (_______) _________ - _________ FAX: (______) _________ - _________
Application (optional):
Would you like a reply? Y N
Questions:
2. How does this document meet your hardware and software development needs?
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• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
• Microchip is willing to work with the customer who is concerned about the integrity of their code.
• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
QUALITY MANAGEMENT SYSTEM Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
CERTIFIED BY DNV Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
== ISO/TS 16949 == devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.