Hyperlynxthermaluserguide PDF

?
HyperLynx Thermal
User Guide
Software Version 9.2

December 2014
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Table of Contents
Chapter 1
Getting Started with HyperLynx Thermal. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Thermal QuickStart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Displaying Saved Simulation Results. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Exporting Thermal Boards from PADS Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
GUI Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
ThermalSim Window Landmarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
ThermalSim Window Viewing Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Data Flow. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Units. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Chapter 2
Importing and Exporting Thermal Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Importing IDF Files. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Back Annotating Thermal Actuals to Constraint Manager . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Power and Thermal Resistance Parameter Files . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25
Mapping PWR File Values to Dialog Box Values. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Power and Thermal Resistance Parameter File Syntax . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Importing Power Parameter Files. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Chapter 3
Critical Parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Air Flow and Temperature at Board Edge. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Power Dissipation Calculation with DEFAULTS.IDF. . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Pin Dimensions and Component Height . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
THETAjc - Junction to Casing Thermal Resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
THETAsa - Sink to Air Thermal Resistance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Chapter 4
Advanced Modeling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Decrease Component and Board Temperature. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Moving Overheated Components. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Conduction Pads. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Adding Heat Sinks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Adding Thermal Screws. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Adding Heat Pipes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Adding Wedge Locks and Other Board Edge Components. . . . . . . . . . . . . . . . . . . . . . . . 45
Model a Chip or MCM on the Board. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
Adjacent Board or Wall Effects. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
Industry Tips for Thermal Modeling. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
Avionic and Outer Space Applications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
HyperLynx Thermal User Guide, v9.2 3

December 2014
Table of Contents
Computer and Instrumentation Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48

Telecom and Industrial Control Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
Power Supplies and Automotive Systems. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
Chapter 5
Thermal Modeling Background . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
Heat Transfer Background. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
Heat Transfer on Boards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
Reliability Background . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
Chapter 6
ThermalSim Menus and Toolbars. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
View Menu. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
Placement Menu. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .59
Simulate Menu. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
Library Menu. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
ThermalSim Toolbar . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
Chapter 7
Dialog Boxes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
Boundary Condition Definition Dialog Box. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
Boundary Conditions Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
Components Dialog Box. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
Component Properties Dialog Box. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
Edit Master Library Dialog Box. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
Edit Material Library Dialog Box. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
Edit Part Dialog Box. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
Edit Working Library Dialog Box . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86
Environment Condition Definition Dialog Box . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
Power Dissipation Editor Dialog Box. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93
Set Defaults Dialog Box. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94
Thermal Via Definition Dialog Box. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
Glossary
Third-Party Information
End-User License Agreement
4 HyperLynx Thermal User Guide, v9.2

December 2014
Chapter 1
Getting Started with HyperLynx Thermal
Use HyperLynx Thermal to identify board-level design changes needed to meet thermal
constraints. Design changes to reduce overheating can include moving heat-creating or airflow-
blocking components and adding heat sinks and other cooling components.
Restriction: Thermal is unavailable on computers running Linux.
This section contains the following topics:
? “Thermal QuickStart” on page 5
? “Exporting Thermal Boards from PADS Layout” on page 11
? “GUI Overview ” on page 12
? “Data Flow” on page 14
? “Units” on page 22
Related Topics
“
Thermal Modeling Background” on page 51
Thermal QuickStart
Figure 1-1 shows the thermal simulation task flow. You can run thermal simulation by itself or
co-simulate with DC voltage drop. Thermal-only simulation takes into account only the heat
from ICs and other components. Thermal/DC drop co-simulation additionally takes into
account the heat produced by current flowing through metal connecting VRM and DC sink
component pin models.

December 2014
Thermal QuickStart
Figure 1-1. Thermal Task Flow
Restrictions:
? The Thermal license is required to run thermal simulation.
? The DC Drop license is required to run thermal/DC drop co-simulation.

December 2014
Thermal QuickStart
? Thermal simulation is unavailable when a MultiBoard project is loaded.
Prerequisites
Export IDF (intermediate data format) library (.EMP) and board (.EMN) files from the PCB
layout system so you can import them into HyperLynx Thermal. You do not have to export IDF
files if you choose to use default component power density and height values or assign
component values within HyperLynx Thermal.
Before exporting IDF files from the PCB layout systems, flood copper pours and plane areas.
Review your understanding about the critical parameters for thermal simulation. These include
Power Dissipation, THETAjc - Junction to Casing Thermal Resistance, and Air Flow and
Temperature at Board Edge. You can then review these parameters for the components in the
Working component library .
Procedure
1. Open the board in HyperLynx Thermal and display it in the ThermalSim window.
? Open the board in BoardSim, selectSimulate Thermal and either of the following:
o Run Thermal Simulation or click . Thermal simulation runs automatically.
o Run PI/Thermal Co-simulation . The Batch DC Drop Simulation dialog box

opens. For information about using this dialog box, see“ Running DC Drop
Batch Simulation . ”
? Open the board in PADS? Layout, select Tools > Analysis > Thermal Analysis .
See “
Exporting Thermal Boards from PADS Layout” on page 11.
2. Assign component properties.
Note: If HyperLynx Thermal and a constraints-enabled Mentor Graphics PCB layout

system (such as xPCB Layout) reside on the same computer, HyperLynx Thermal
automatically imports thermal constraints from the parts tab in Constraint Manager.
a. Import IDF files to assign component heights and placement outline locations.
? From the BoardSim window, select Models > Assign Thermal Models >
Import IDF .
See “
Importing IDF Files ” on page 23.
b. Set default values, especially component power density.
? From the BoardSim window, select Models > Assign Thermal Models > Set
Defaults (Height, Power) . The Set Defaults Dialog Box opens.
If you do not specify a default power density value in theSet Defaults Dialog Box or
Constraint Manger does not provide power values, Thermal calculates component

December 2014
Thermal QuickStart
“
power using the component area and number of pins. SeePower Dissipation
Calculation with DEFAULTS.IDF ” on page 34.
c. Optionally, refine component properties by doing the following:
i. Use a text file to assign unique power dissipation values to many components at
“ and Thermal Resistance Parameter Files
once. See Power ” on page 25.
ii. Edit thermal conductivity, power dissipation, and other thermal parameters for
components.
From the ThermalSim window, select Library > Working , from the Edit
Working Library Dialog Box , select Edit part .
If you have several instances of the same component, and one or more of them
have unique power dissipation, double-click each component to open the
Component Properties Dialog Boxand enter theInput power scaling factor
value.
iii. Specify the location of cooling components attached to a board edge, especially
if the board enclosure is sealed or closed.
From the ThermalSim window, select Placement > Board Edge Connection .
See “
Adding Wedge Locks and Other Board Edge Components ” on page 45.
iv. Enable the display of local simulation results for a component instance by
double-clicking the component and selectingRefined output in the Component
Properties Dialog Box.
3. Verify thermal conductivity values in materials library.

Verify that the materials library specifies correct thermal conductivity values for the
metal and dielectric materials used by the board.
? From BoardSim, select Models > Assign Thermal Models > Library > Material .
4. Assign environment properties.

Edit environment settings such as incoming air temperature/velocity and the
location/power dissipation of neighboring boards in the case.
? From the toolbar in the ThermalSim window, click .

5. If you plan to run thermal/DC drop co-simulation, assign VRM and DC sink models.
“ DC Drop
For information about setting up a design for DC voltage drop simulation, see
QuickStart - BoardSim . ”
6. Run simulation.
? Select Simulate Thermal > Run Thermal Simulation or click . The

ThermalSim window displays thermal simulation results. Go to step7.

December 2014
Thermal QuickStart
? Select Simulate Thermal > Run PI/Thermal Co-simulation . The Batch DC Drop
Simulation dialog box opens. For information about using this dialog box to run
simulation, see “ Running DC Drop Batch Simulation. Go to”step8.
Note: Thermal/DC drop co-simulation takes longer to run than thermal-only

simulation. One way to balance simulation accuracy and run time is to edit the
Thermal/DC-drop co-simulation convergence threshold (deg C)value.
The Components Dialog Box opens when simulation completes.
7. View thermal-only simulation results.

In the Components Dialog Box, view package and junction temperatures, and
dissipation for each component.
The ThermalSim window toolbar provides several ways to graphically display results.
? Click to display component wattage.

? Click to highlight components that you have enabled to display refined/detailed
local simulation results in the Refined component resultsfile.
? Click to display component temperature.
You can also double-click a component to display its temperature in the

Component
Properties Dialog Box.
? Click to display by how much, in degrees C, the measured component
temperature exceeds its maximum temperature. Set thermal limits in the
Edit Part
Dialog Box .
? Click to display the board temperature in degrees C.
? Click to display the board temperature gradient in degrees C per inch (or mm).
Use this view to help locate thermal-expansion stress areas on the board, which can
lead to warped or cracked boards.
“ Viewing
If needed, zoom, pan, and flip the board display. SeeThermalSim Window
Operations” on page 13.
8. Optionally, view thermal/DC drop co-simulation results.
The “ HyperLynx PI PowerScope Dialog Box and “
”Reporter Dialog Box display
” co-
simulation results.
9. Optionally, refine the board and re-simulate.
Perform “ what if ” experiments or edit settings in

2, steps
3, and 4.
? Add cooling components, such as heat sinks, thermal screws or vias, and heat pipes.

December 2014
Thermal QuickStart
? Move components.
See “ ” on page 37.

Decrease Component and Board Temperature
Restriction: Do not add or move components when running thermal/DC drop co-
simulation. When you move the component in the ThermalSim window, you cannot also
move the component in the BoardSim board viewer because this causes a component
placement mismatch.
10. Optionally, export component temperatures.
? Back-annotate component temperatures as Constraint Manager actuals. See

Back “
Annotating Thermal Actuals to Constraint Manager” on page 24.
? Create a power map file to provide power dissipation results that you can import into
the Mentor Graphics FloTHERM ? product for advanced thermal analysis.
Thermal/DC drop co-simulation automatically creates this file. See“ Running DC
Drop Batch Simulation . ”
Related Topics
“ Opening Designs in BoardSim ”

“Critical Parameters” on page 33
“Industry Tips for Thermal Modeling ” on page 47
“Displaying Saved Simulation Results” on page 10
“Getting Started with HyperLynx Thermal” on page 5
Displaying Saved Simulation Results

View results from a saved thermal simulation. This capability enables you to re-open the board
and display results saved from a previous simulation.
Prerequisites
? You have run thermal simulation and saved results by clickingSave ThermalSim Data
on the ThermalSim toolbar.
? You have opened the board with the saved simulation results.
Procedure
1. In BoardSim, select Setup > Thermal View > Load Thermal .
2. On the ThermalSim toolbar, click View board temperature .

December 2014
Exporting Thermal Boards from PADS Layout
Results
The ThermalSim window displays the saved simulation results.
Related Topics
“
Thermal QuickStart” on page 5
Exporting Thermal Boards from PADS Layout

You can export HyperLynx Thermal designs from PADS Layout and automatically load the
exported design into HyperLynx Thermal.
Restriction: To automatically load the exported design into HyperLynx Thermal, you must
have PADS Layout 9.0 or newer.
Prerequisite
Flood copper pours and plane areas before exporting the design.
Procedure
1. From PADS Layout, open the design to export to HyperLynx Thermal.
2. Select Tools > Analysis > Export to HyperLynx Thermal .
If the geometry.height attribute for a component is missing, the translator prompts you
for the height of the component.
Results
HyperLynx Thermal automatically opens and loads the exported design.
The translator writes the following files to a sub-folder in the folder containing the PADS
Layout design.
? <design_name>_PCB\<design_name>.hyp
? <design_name>_PCB\<design_name>.pcb.emn
? <design_name>_PCB\<design_name>.pcb.emp
? <design_name>_PCB\<design_name>.pcb.hlt
? <design_name>_PCB\<design_name>.ref
If HyperLynx SI/PI and PADS Layout are installed on different computers, copy the above set
of files to the computer where HyperLynx SI/PI is installed and open the .HYP file in
BoardSim. Run thermal simulation from BoardSim.

December 2014
GUI Overview
GUI Overview
When you open the design in HyperLynx Thermal, the ThermalSim window displays the
design.
This topic contains the following:
? “ThermalSim Window Landmarks” on page 12
? “ThermalSim Window Viewing Operations” on page 13
ThermalSim Window Landmarks

Figure 1-2 shows the main landmarks in the ThermalSim window.
Figure 1-2. ThermalSim Window Landmarks
Table 1-1. Main ThermalSim Window Landmarks

Landmark Description
Add component list If you add a component to the 2-D editor layout, select the component
to add from this list. This list contains components in the working
library.

December 2014
GUI Overview
Table 1-1. Main ThermalSim Window Landmarks (cont.)

Legend Maps simulation values to colors in the 2-D editor and 3-D viewer.
Note: Temperatures are always displayed in degrees C, even you if

specify English units in the “ Units Dialog Box . ”
Status bar X and Y are the coordinates for the pointer location in the
ThermalSim window.
N is the number of components on the side of the board in the viewer.
P(w) is the total power dissipation for the side of the board in the
viewer.
T(c) is the board (not component) temperature for the pointer

location.
Display component See “ ”　
Display component outlines and metal shapes for a side or layer
outlines and metal on page 65.
shapes for a side or
layer
Display simulation See “
Display simulation results for a layer” on page 65.
results for a layer
ThermalSim Window Viewing Operations

Table 1-2 on page 13 applies to the 2-D Editor.
Table 1-3 on page 14 applies to the 3-D Viewer.
To switch between the 2-D Editor and 3-D Viewer, selectView > Toggle 2D/3D mode .
Table 1-2. Viewing Thermal Boards in 2-D Editor

Operation Procedure
Zoom in 1. Click .
2. Either:
? From the center of the area to zoom in, drag up.
? Click a location on the board to incrementally zoom and then center it
in the display.
PressEsc to cancel the command.
Zoom out 1. Click .
2. From the center of the area to zoom out, drag down.
Fit to window Click .

December 2014
Data Flow
Table 1-2. Viewing Thermal Boards in 2-D Editor (cont.)

Operation Procedure
Pan Click .

Rotate Restriction: Rotate is unavailable in the 2-D Editor.
Layer-specific From the filter at the right end of the toolbar, selectTemperature <layer> or
results Power <layer> .
Table 1-3. Viewing Thermal Boards in 3-D Viewer

Operation Procedure
Zoom in 1. Right-click > Zoom or click .
2. Either:
? From the center of the area to zoom in, drag up.
? Click a location on the board to incrementally zoom and then center it
in the display.
Zoom out 1. Right-click > Zoom or click .
2. From the center of the area to zoom out, drag down.
Fit to window Right-click > Reset or click .
Pan Right-click > Pan or click .

Rotate Right-click > Rotate or click .

Layer-specific Restriction: Layer-specific results are unavailable in the 3-D Viewer.
results
Related Topics
Data Flow
Figure 1-3 shows the main inputs and outputs for thermal simulation. Overlapping color
backgrounds indicate data sources, such as IDF files, that provide more than one type of data.

December 2014
Data Flow
Multiple inputs in Figure 1-3 provide component power and height information. To see how
“ Component
HyperLynx Thermal resolves conflicting assignments, see Priorities Among
Property Sources” on page 20.
Figure 1-3. Thermal Data Flow

December 2014
Data Flow
Table 1-4. Thermal Data Flow

Item Description
Environment Provides case and boundary (board edge) environment
conditions.
? Case— Provides case air flow properties, location and
thermal properties of other boards in the enclosure, and
iterative simulation precision. Use the Environment
Condition Definition Dialog Box to edit case-related
environmental conditions.
? Boundary — Provides the thermal properties of wedge lock
hardware attached to the board edge. Use the Boundary
Condition Definition Dialog Box to edit boundary-related
properties.
The <design>_t.hlt file stores all environment properties and is
located in the same folder as the design. See “ Design Folder
Locations . ”
Thermal simulation engine Runs thermal-only simulation.
Graphical results - Displays graphical results.
ThermalSim window
Materials library Provides thermal conductivity of the materials used in PCB
boards and component packaging.
The betasoft.clb file stores the material library and is located in

the same folder as the HyperLynx SI/PI executable file
(bsw.exe). For example,
\MentorGraphics\<release>\SDD_HOME\hyperlynx64\betasoft.
clb.
Design BoardSim board file (.HYP) that provides the board stackup and
copper data, such as traces, metal areas, and vias.
IDF files Provides component height, component pin geometries,
placement outline location, and so on. The .EMN file contains
board information. The .EMP file contains library information.
Restriction: HyperLynx Thermal can read IDF file version 3.0,

but it ignores power-related component properties such as
POWER_OPR, POWER_MAX, THERM_COND, THETA_JB,
and THETA_JC.

December 2014
Data Flow
Table 1-4. Thermal Data Flow (cont.)

Item Description
<design>_t.hlt Stores a wide variety of design-specific settings, such as the
following:
? Models in the working library
? Environment properties
? Component outline location
a. Assembly outline exported from xPCB Layout and Board
Station XE. HyperLynx Thermal uses the assembly outline
when it is available because it enables slightly more
accurate results.
b. Placement outline contained in IDF files
? Thermal properties provided by the Constraint Manager Parts
tab, such as power dissipation, THETAjc, and junction
temperature
? Thermal simulation results to back-annotate to Constraint
Manager. See Back “ Annotating Thermal Actuals to
Constraint Manager” on page 24.
This file is located in the same folder as the design. See“ Design
Folder Locations . ”
IBIS models Optionally stores component thermal properties that you specify
in the Edit Part Dialog Box , by enabling the Update IBIS file
option.
HyperLynx Thermal saves thermal properties to a series of

comments located after the corresponding [Component]
keyword and before the next [Component] keyword, if another
keyword exists.
Caution: Values stored in IBIS models are copied to the .HLT

file when you open the board in the ThermalSim window and
then close the window. If you update the thermal properties in
the IBIS models after closing the window, the values are ignored
unless you perform theUpdate from IBIS files command from
the Library menu.
Note: Assign IBIS models to components in BoardSim with

.REF or .QPL IC automapping files. See“ Selecting Models and
Values for Entire Components . ”
Note: Although HyperLynx Thermal automatically writes these

comments to the IBIS model, and you do not have to manually
edit them, the following topic provides syntax information:
“Syntax for Thermal Properties in IBIS Models” on page 84

December 2014
Data Flow

Item Description
Power map file for Provides power dissipation results that you can import into the
FloTHERM Mentor Graphics FloTHERM product for advanced thermal
analysis. This file is named Thermal_<net_name>.txt and is
“ Design Folder
located in the same folder as the design. See
Locations . ”
Working component library Contains components currently used in the design loaded in
HyperLynx Thermal. See Working“ Library Components
Identified by .HYP File ” on page 21. Use the Edit Working
Library Dialog Box to manage the working library and use the
Edit Part Dialog Box to set properties for a part.
The <design>_t.hlt file stores the working library and is located

in the same folder as the design. See“ Design Folder Locations. ”
Constraint Manager actuals Optionally provides thermal simulation results that you can back
“
annotate to Constraint Manager. SeeBack Annotating Thermal
Actuals to Constraint Manager” on page 24.
Restriction: HyperLynx SI/PI and the constraints-enabled

Mentor Graphics PCB layout system must be installed on the
same computer.
Master component library Contains components available to assign to the design loaded in
HyperLynx Thermal. Use the Edit Master Library Dialog Box to
manage the master library.
The betasoft.mlb file stores the master library and is located in

the same folder as the HyperLynx SI/PI executable file
(bsw.exe). For example,
\MentorGraphics\<release>\SDD_HOME\hyperlynx64\betasoft.
mlb.
Thermal properties stored in Contains the thermal properties contain in IBIS models assigned
IBIS models to the design. You create this report by selectingLibrary >
Update from IBIS files .
Requirement: You have previously saved thermal properties to

IBIS models by selecting the Update IBIS file option in the Edit
Part Dialog Box.
The report file is written in both HTML and plain text formats.
The files are located in the design folder and named:
? ThermalParametersIbisReport.html
? ThermalParametersIbisReport.txt
See also: “ Design Folder Locations ”

December 2014
Data Flow

Item Description
Refined component results Optionally provides detailed simulation results for individual
components and their environment.
The <design>_t.loc file stores the refined simulation results and

“ Design Folder
is located in the same folder as the design. See
Locations . ”
Constraint Manager Optionally provides thermal properties from the Constraint
constraints - Manager Parts tab, such as power dissipation, THETAjc, and
<design>.pcb.hlt junction temperature.
The <design>.pcb.hlt file is automatically exported when you run

thermal analysis from xPCB Layout, Board Station XE, or
another constraints-enabled Mentor Graphics PCB layout
system.
“ Design
This file is located in the same folder as the design. See
Folder Locations . ”
Power parameter file Optionally provides power information. For boards with many
components, this text file-based process is an alternative to
assigning power dissipation parameters on a one-by-one basis in
“
the Edit Part Dialog Box. See Power and Thermal Resistance
Parameter Files” on page 25.
Default power and height Use the Set Defaults Dialog Box to set a single default power
density and height for all components.
The BSW.INI file stores these settings and is located in the same
folder as the HyperLynx SI/PI executable file (bsw.exe). For
example,
\MentorGraphics\<release>\SDD_HOME\hyperlynx64\BSW.IN
I.
Graphical results - Displays the DC voltage drop results from thermal/DC drop co-
PowerScope window simulation. See “ HyperLynx PI PowerScope Dialog Box. ”
DEFAULTS.IDF Stores a wide variety of default settings. This file is located in the
same folder as the HyperLynx SI/PI executable file (bsw.exe).
For example,
\MentorGraphics\<release>\SDD_HOME\hyperlynx64\DEFAU
LTS.IDF.
See also: “
Power Dissipation Calculation with
DEFAULTS.IDF ” on page 34

December 2014
Data Flow

Item Description
VRM and DC sink models Optionally represents VRM (voltage regulator modules) and DC
sink models used for thermal/DC voltage drop co-simulation.
See “ Assign Power Integrity Models Dialog Box - IC Tab. ”
Thermal/DC drop co- Optionally runs thermal/DC voltage drop co-simulation.
simulation engine Calculates the increased metal temperature and bulk resistance
due to current flowing between VRM and DC sink pins.
Restriction: The DC Drop license is required to run thermal/DC

drop co-simulation.
Numerical co-simulation Optionally displays numerical thermal/DC voltage drop co-
results - Reporter window simulation results in the “ Reporter Dialog Box. ”
Priorities Among Component Property Sources

You can specify component properties or parameters in several places. If the component
property value differs from one place to another, HyperLynx Thermal uses the source with the
highest priority.
Prioritized list of sources for component power:

1. Edit Part Dialog Box
Exception: Values you set in theSet Defaults Dialog Box override Height (DZ) and
Power dissipation values in theEdit Part Dialog Box, for all parts in the working library.
2. Set Defaults Dialog Box

3. Table in power parameter file (.PWR)
4. IBIS models containing thermal properties

Thermal writes thermal properties as comments in the IBIS model if you enable
Update
IBIS file in the Edit Part Dialog Box .
5. Parts tab in Constraint Manager
6. Part property from xPCB Layout or Board Station XE.
7. DEFAULTS.IDF
Prioritized list of sources for component height:
1. Edit Part Dialog Box

Exception: Values you set in theSet Defaults Dialog Box override Height (DZ) and
Power dissipation values in theEdit Part Dialog Box, for all parts in the working library.
2. IDF files

December 2014
Data Flow
Exception: Values you set in theSet Defaults Dialog Box override values in the IDF
files, for all parts in the working library.
3. Set Defaults Dialog Box
Working Library Components Identified by .HYP File

HyperLynx Thermal automatically adds components specified in the BoardSim board (.HYP)
file to the working library. The working library component names are of form
<part_name>_<reference_designator>
where:
<part_name> comes from the NAME field in the DEVICES keyword. The NAME field
is optional and if the .HYP file does not define it, the working library component name
omits <part_name> (for example, _U10).
<reference_designator> comes from the REF field in the DEVICES record
Related Topics
“
Getting Started with HyperLynx Thermal” on page 5

December 2014
Units
Units
HyperLynx Thermal dialog boxes supports mixed and SI units. Watts and degrees C are always
used, even though English units are used elsewhere in the set of parameters with mixed units.
Use the “ Units Dialog Box to specify

” which set of units to use.
Table 1-5. Parameter Units

Parameter Mixed Units SI Units
Length inch mm
Velocity ft/min mm/s
Pressure atm. mmHg.
Comp. Power Watt Watt
THETA degrees C/Watt degrees C/Watt
Table 1-6. Boundary Condition Units

Parameter Mixed Units SI Units
Thermal Resistance at Edge degrees Cin/W degrees Cmm/W
Temp of Sink degrees C degrees C
Conversion of Units
1F = 5.0/9.0 degreesC
NF = (N-32.0)*5.0/9.0 degrees C
1 mm = 0.03937 inch
1 m/s = 1000 mm/s
1 m/s = 196.8 ft/min
1 mHg = 1000 mmHg
1 mHg = 1.32 atm
1 W/m = 0.001 W/mm
1 W/m = 1.0403 BTU/hrft
1 W/mC = 0.001 W/mmοC
1 W/mC = 0.0254 W/in οC

December 2014
Chapter 2
Importing and Exporting Thermal Data
You can import power parameter files that specify component power dissipation and you can
back annotate thermal actuals to Constraint Manager.
This chapter contains the following:
? “Importing IDF Files ” on page 23
? “Back Annotating Thermal Actuals to Constraint Manager” on page 24
? “Power and Thermal Resistance Parameter Files

” on page 25
Importing IDF Files

Many ECAD and MCAD placement applications can export board and library IDF
(intermediate data format) files that HyperLynx Thermal can import. For example, OrCAD,
Allegro, Pro-E, and CR 5000 can export IDF files.
HyperLynx Thermal uses component height and assembly placement locations from IDF files.
Prerequisites
You have exported IDF files from the ECAD and MCAD placement application.
Procedure
1. Select Models > Assign Thermal Models > Import IDF .
The Import dialog box opens.
Restriction: The Defaults and Project fields are read-only.

2. Select the IDF board file (.EMN) and library file (.EMP).
3. Optionally, select a .HYP File.
The .HYP file provides stackup, trace, and plane information.

4. Click OK .
5. Review the power value for each component.

Some parameters needed for thermal analysis are not available from the ECAD
placement file may be still set to default values. Use theEdit Part Dialog Box to review

December 2014
Back Annotating Thermal Actuals to Constraint Manager
and edit power values for each before running thermal analysis. You may edit thermal
resistance and other parameters such as height, pin dimensions, air gaps, and so on, at
the same time.
Related Topics
“
Back Annotating Thermal Actuals to

Constraint Manager
HyperLynx Thermal automatically saves thermal actuals for Constraint Manager to the .HLT
file after every simulation.
Prerequisites
Constraint Manager must be installed and licensed. Constraint Manager is available from
constraints-aware Mentor Graphics PCB design products, such as xPCB Layout.
Run thermal analysis and save the thermal design (.HLT) before back-annotating.
Procedure
1. Open the Constraint Manager project by doing either of the following:
o From the Start menu, selectAll Programs > Mentor Graphics PCB > Constraint
Entry > Constraint Manager . When prompted to open a project, browse to and
select the associated project (.PRJ) file.
o From xPCB Layout or Board Station XE, select Setup > Constraints .
2. Import the thermal actuals to Constraint Manager by doing the following:

o Select Data > Actuals > Import Thermal Actuals .
Results
The Constraint Manager Output window displays the following message:
HL Thermal actuals side file dated [Day Month Date Time Year] have been imported.

December 2014
Power and Thermal Resistance Parameter Files
Related Topics
“ Importing and Exporting Thermal Data

” on page 23
Power and Thermal Resistance Parameter

Files
Use power and thermal resistance parameter files (.PWR) to specify the following design
properties:
? Power dissipation of parts, by part number

? Power dissipation of components, by reference designator
? junction to casing thermal resistance(also known as THETAjc) of parts, by part number
Parameters imported from the .PWR file override parameters already specified in the working
library. To see the prioritized list of component power assignment sources, seePriorities “
Among Component Property Sources ” on page 20.
This topic contains the following:
? “Mapping PWR File Values to Dialog Box Values” on page 25

? “Power and Thermal Resistance Parameter File Syntax
” on page 27
? “Importing Power Parameter Files” on page 30
Mapping PWR File Values to Dialog Box Values

Figure 2-1 maps .PWR file values to the dialog box files they update.

December 2014
Figure 2-1. Mapping PWR File Values to Dialog Box Values

December 2014
Table 2-1. Mapping PWR File Values to Dialog Box Values

Data in the component section of the .PWR file represents the
absolute, not scaled, power value for the 16234825 part.
Green arrows
This data updates the default power dissipation of parts in the
working library and fields in the Component Properties and Edit
Part dialog boxes.
Data in the reference designator section of the .PWR file
represents the absolute, not scaled, power value for the D10
Purple arrow reference designator.
This data updates the updates the

Input power scaling factor field
in the Component properties dialog box using the equation:
Input power scaling factor = reference_designator_power /

part_type_power
substituting values from .PWR file:
0.2592 = 0.5184 watts / 2 watts

Data in the thermal-resist section of the .PWR file for the
16234825 part updates the default thermal resistance of parts in
Orange arrow the working library and the Junction to casing thermal resistance
field in the Edit part dialog box. The junction to casing thermal
resistance sometimes referred to as THETAjc.
Lines in the .PWR file where you might be tempted to insert
blank lines.
Red lines
Caution: Blank lines are not allowed in the .PWR file. Blank
lines effectively indicate the end of the data, and subsequent lines
in the .PWR file are ignored.
Caution: Extra blank lines at the end of the file are also not
allowed because they invalidate the last section of the .PWR file.
Power and Thermal Resistance Parameter File

Syntax
General requirements:
? The file is free of formatting. Use Windows Notepad or another plain text editor to
create the file.

December 2014
? Blank lines are not allowed, not even at the end of the file.
? The file is named with the .PWR file name extension.
? Text is case insensitive. For example, Component is the same as COMPONENT.
The heading of each section is one of the following keywords: Component, Reference, and
Thermal-resist.
Each section is optional, but the Component and Reference sections should be added together.
To solve the equation below, the software reads the Component section to get the value for
part_type_power and the Reference section to get the value for reference_designator_power.
The Component section should define the power dissipation for every part that has instances
specified in the Reference section. If you specify incomplete information, the software
calculates a missing power value using information from the working library and other
components in the .PWR file that use the same part.
Input power scaling factor = reference_designator_power / part_type_power

Table 2-1 and Table 2-2 show example .PWR files.
Note
The total power dissipation specified in the reference section depends on the part default
power in the working library.
If the default power in the working library is set to 0 then every possible scaling factor
solution produces a component total power dissipation of 0 W. In this case, a non-zero
power dissipation parameter must be specified in the component section of the .PWR file
to override the 0 value in the working library.
Component Power Dissipation Section

The section begins with the following line:
Component <optional_space_and_comment>
For example, “ Component power for part names in watts ”．
Lines that follow the component line specify the part name and power dissipation in watts.
Each component has its own line.

You can specify power dissipation for part names in either of the following ways:
? A single power dissipation value of form <part_name> <power_dissipation_in_watts>.

For example, 4077B 100. SeeTable 2-1.

December 2014
? Pairs of temperature and power dissipation values of form <part_name>

((<temperature_in_Celcius_1>,<power_dissipation_in_watts_1)
(<temperature_in_Celcius_2>,<power_dissipation_in_watts_2)).
For example, 4077B ((100, 0.32) (150, 2.32)). SeeTable 2-2.

Restrictions:
? Components of the same part type must have the same power dissipation.
? The Reference and Thermal Resist sections do not support temperature and value pairs.
Reference Designator Power Dissipation Section

Reference <optional_space_and_comment>
For example, “ Reference designator power dissipation in watts ”．
Lines that follow the Reference designator line specify the power dissipation for the component.
Each reference designator has its own line.
For example, B1 100. SeeTable 2-1.
Restriction: Reference designator lines do not support pairs of temperature and power
dissipation values.
Thermal-Resist Section
Thermal-Resist <optional_space_and_comment>
For example, “ Thermal-Resist Thermal resistance for part names in THETAjc ”．
Lines that follow the component line specify the part name and THETAjc in degreesC/watt.
Each component has its own line.
For example, 4077B 3. SeeTable 2-1.

December 2014
Example 2-1. Power Parameter File with Single Power Dissipation Values
Component power for part names in watts

4077B 100
74150DW 5
7476 2
R1/4W 50
Reference designator power dissipation in watts
B1 1
G1 1
K1 1
M1 1
R1 1
RF1 1
Thermal-Resist thermal resistance for part names in THETAjc
4077B 3
74150DW 2.5
7476 0.5
Example 2-2. Power Parameter File with Pairs of Temperature and Power
Dissipation Values
Component Power for part names in Celsius and watts pairs or watts only
4077B ((100, 0.32) (150, 2.32))
74150DW 5
7476 2
R1/4W ((50,0) (60,10) (75,20))
Importing Power Parameter Files

Procedure
1. From the BoardSim window, select Models > Assign Thermal Models > Import
Power & Th-Resist .
2. Locate the power parameter (.PWR) file and clickOpen.

December 2014
Related Topics
“
Priorities Among Component Property Sources” on page 20
“ Importing and Exporting Thermal Data
” on page 23

December 2014

December 2014
Chapter 3
Critical Parameters
Several parameters can drastically affect thermal simulation results. Verify that the parameters
in this chapter are set to the correct value.
? “Air Flow and Temperature at Board Edge” on page 33
? “Power Dissipation” on page 34
? “Pin Dimensions and Component Height” on page 35
? “THETAjc - Junction to Casing Thermal Resistance” on page 35
? “THETAsa - Sink to Air Thermal Resistance” on page 35
Air Flow and Temperature at Board Edge

When air convection is strong, heat leaves a component mainly by direct convection to the air.
The major parameters are the velocity of forced air approaching the board, air direction, and
incoming air temperature specified in theEnvironment Condition Definition Dialog Box .
Note
A typical ratio of heat flow by direct convection to air, conduction to the board, and
radiation to surroundings, is 70 to 25 to 5. When only the natural convection occurs, this
ratio may typically be 40 to 40 to 20.
For conduction to board edges, the major factors are the sink temperature and thermal resistance
between the sink and the board edge specified in the Boundary Condition Definition Dialog
Box. For a closed system, if there is no board edge cooling or thermal screw cooling, radiation
transfers all heat. In this case, the board could be excessively hot. It is important to specify the
cooling path for a closed system.

December 2014
Critical Parameters
Power Dissipation
Power Dissipation
Components with high power or small package size need accurate power dissipation
assignments. Components with high power generate a lot of heat and could be very hot.
Components with a small package have high power per surface area and also can be very hot.
For large boards, it is reasonable to assign accurate power only for components in areas
showing high temperatures during initial simulation.
If the power dissipation for a part varies with temperature, define the relationship with a lookup
“
table by clicking Edit values or using the power import file (see Power and Thermal Resistance
Parameter Files” on page 25). The thermal analysis engine approximates the correct power
based on the operating temperature of the device.
Each instance of a particular part may have a different power dissipation. To modify the power
dissipation for an instance of a part, enter anInput power scaling factor for it. The power
dissipation for an instance of a part is equal to the power dissipation assigned in the part library
multiplied by the power scaling factor that is assigned for a specific instance of that part.
Because there are multiple ways to assign power dissipation properties to components, see
“Priorities Among Component Property Sources” on page 20.
Power Dissipation Calculation with DEFAULTS.IDF

The DEFAULTS.IDF file has a coefficient called:
DEFAULT POWER CONSUMPTION OF COMPONENT PER UNIT AREA, WATT/CM**2
Power dissipation is calculated using the formula below:
if number_of_pins < 3, Power_Dissipation = 0

else
Power_Disipation = component_area *
default_power_consumption_of_component
where:
component_area= component length * component width, where centimeters is the units

for length and width
default_power_consumption_of_componentcomes from the DEFAULT POWER

CONSUMPTION OF COMPONENT PER UNIT AREA variable in the IDF file.

December 2014
Critical Parameters
Pin Dimensions and Component Height
Related Topics
“ ” on page 25
“
Edit Part Dialog Box ” on page 78
“
Power Dissipation Editor Dialog Box” on page 93
Pin Dimensions and Component Height

For those components whose temperatures are high after the initial simulation, review their pin
dimensions and conductivity in the Edit Part Dialog Box. You can also check the air gap under
the component. The less the convective cooling, the more the importance of these parameters
due to the significant conduction to the board.
The component height is important when strong convection occurs because the air from the free
stream will likely hit tall components. In this situation, the heat transfer coefficient is high and
the free stream temperature is low.
THETAjc - Junction to Casing Thermal

Resistance
To get a correct junction temperature, you need accurate power and THETAjc assignments.
THETAjc is the thermal resistance between the component junction and casing. This value can
be obtained from the manufacturer of the component. This is dependent on the particular
package shapes of a component. Also plastic and ceramic packages make a significant
difference. While the accuracy of THETAjc affects the junction temperature, it does not affect
the calculated casing temperature of the component.
Note
The software automatically calculates THETAjb (junction to board thermal resistance)
from data specified in the Pins and Gap areas of the
Edit Part Dialog Box .
Related Topics
“
“ ” on page 27
Power and Thermal Resistance Parameter File Syntax
THETAsa - Sink to Air Thermal Resistance

THETAsa is needed when the component has a heat sink. THETAsa is the thermal resistance
between a heat sink and the air when the heat sink is applied to a component. This value should
be provided by the manufacturer of the heat sink. The THETAsa value is a function of air

December 2014
Critical Parameters
THETAsa - Sink to Air Thermal Resistance
velocity, usually provided by the manufacturer of the heat sink. The values at 3 ft/sec and the
value at 10 ft/sec should be entered in the
Working library. HyperLynx Thermal does
conversions for other air velocities automatically during analysis.
Related Topics
“

December 2014
Chapter 4
Advanced Modeling
? “Decrease Component and Board Temperature

” on page 37
? “Model a Chip or MCM on the Board” on page 47
? “Adjacent Board or Wall Effects” on page 47
? “Industry Tips for Thermal Modeling ” on page 47

You can decrease the temperature of components and the board in the following ways:
? “Moving Overheated Components” on page 37
? “Conduction Pads” on page 38
? “Adding Heat Sinks” on page 38
? “Adding Thermal Screws” on page 41
? “Adding Heat Pipes” on page 44
? “Adding Wedge Locks and Other Board Edge Components

” on page 45
Moving Overheated Components

If you do not intend to add heat sinks or conduction pads, another solution is to relocate very hot
components away from other hot components or to a location with better cooling airflow.
Restriction: Do not move components when running thermal/DC drop co-simulation. When
you move the component in the ThermalSim window, you cannot also move the component in
the BoardSim board viewer, which causes a component placement mismatch.
Procedure
1. Click the component and drag it to the new location.
2. Re-run analysis to find the new temperature distribution.

3. To restore the original locations for all components, in the BoardSim menu, select
Setup
> Thermal View and select one of the following:

December 2014
Advanced Modeling
? Load Thermal, R — Place components based on the outer perimeter of component

pins. For .HYP files, component placement is aways based on this method.
? Load Thermal, PO — Place components based on either the placement outline

(higher priority) or assembly outline (lower priority) from the .CCE file.
? Load Thermal, AO — Place components based on either the assembly outline

(higher priority) or placement outline (lower priority) from the .CCE file.
4. To save the changed component locations so they are available when re-opening the
board in BoardSim, click Save ThermalSim Data on the ThermalSim toolbar.
The <board_name>_t.hlt contains the saved component locations.
5. To load the saved component locations the next time you load the board in BoardSim,
from the BoardSim menu, selectSetup > Thermal View > Load Thermal .
Conduction Pads
You can cool a component by putting conduction pads or glue between the component and the
board. Open theEdit Working Library Dialog Box and enter the conductivity of the material
inserted into the gap.
Adding Heat Sinks

You can cool a component by placing heat sinks near the component. The term heat sink
generally refers to anything from wedgelocks to heat spreaders to finned heat sinks. In
HyperLynx Thermal, the term heat sink refers only to finned heat sinks. For information about
adding wedgelocks to the board edge, seeAdding Wedge“ Locks and Other Board Edge
Components” on page 45.
Restriction: Do not add components when running thermal/DC drop co-simulation. When you
add the component to the board in the ThermalSim window, you cannot also add it to the board
in the BoardSim board viewer because the boards would then no longer match.
Caution
You cannot undo a component add, except by deleting the added component.
Procedure
1. If needed, display components on the other side of the board. SeeDisplay component “
” on page 65.
outlines and metal shapes for a side or layer
2. If needed, add the heat sink to the working library.

December 2014
Advanced Modeling
a. From the ThermalSim window, select Library > Working . The Edit Working
Library Dialog Box opens.
b. To add a heat sink component from the master library to the working library, select
the heat sink component in the Master library list and click>> .
c. To create a new heat sink component, clickAdd by parameters . The Edit Part
Dialog Box opens.
? Enter the component specifications.
See the topics located after this procedure for advice about entering heat sink
specifications.
d. Close the dialog boxes.

3. Select Placement > Heat Sink and select a heat sink from the placement list.
4. Click and place the heat sink over a component on the board.
Requirement: The heat sink must overlap at least one component.
Heat Sinks on Top of Components

The most important parameter is the sink to air thermal resistance at the two specified air
velocities (3ft/s & 10ft/s). These values can be obtained from the heat sink datasheet, which is a
plot of resistance versus air velocity. Set these two resistances and HyperLynx Thermal will
interpolate or extrapolate for the actual condition. Effective height of the heat sink is also very
important because the blockage in the flow stream may affect nearby parts.
Parameter definitions:
1. Class - Must select heat sink

2. Length - Length or dimension in X direction
3. Width - Width or dimension in Y direction

4. Height - The total height of the heat sink alone
5. Number of Pins – Not a relevant number, but use a high number to ensure good contact
6. Pin thermal conductivity, Pin thickness, Pin width, pin Length. Leave as defaults.
7. Air gap- should be set to about zero with a conductive material between the heat sink
and the component.

December 2014
Advanced Modeling
8. Power - should be set to zero
9. Sink to air thermal resistance @ 3ft/s. - Value taken from heat sink data sheet in degrees
C/W
10. Sink to air thermal resistance @ 10ft/s - Taken from data sheet in degrees C/W
11. Radiative Emissivity –Not important, leave as default or use .1 for polished metal
Effective height, fraction of (DZ) – A value between 0.0 & 1.0 based upon what type of heat
sink is used. This value estimates the amount of blockage the heat sink will have on the air
stream. A minimum number of 0.5 should be assigned. For full blockage in the airflow
direction, set this to 1.0. For extruded fins aligned with the air flow, set to 0.5.
Heat Sink Standing Alone or with Components Mounted

on the Sink
When several components are mounted on one large heat sink, the heat sink will usually have a
rather uniform temperature due to its effective heat spreading capability. In this situation, you
will model this with in terms of one heat sink. The description of this modeling is shown below.
If the heat distribution is expected to be very non-uniform on the heat sink, you may model it
with several heat sinks. Each covers an estimated territory of the overall heat sink.
A heat sink with several components mounted on it, will be modeled by placing a thin fictitious
component on the board, and then place this sink on its top. This fictitious component will have
a power dissipation of the sum of the power of all the components on top of the heat sink.
The above example applies to a heat sink where the component power is rather evenly
distributed. However, if the distribution of power and therefore heat is more concentrated in one
or another region and uneven temperature distribution is expected on the heat sink, two or more
fictitious components should be modeled depending on the distribution of heat and the
estimated territory of each temperature zone. The summation of all the powers of the fictitious
components should be equal to the total power. When you model the original heat sink with
several smaller heat sinks, you must increase the THETAsa of each sink by a factor that is the
inverse of the fraction, which is the area ratio of the small heat sink to the original heat sink. For
example, if the original THETAsa is 2 C/Watt and the small sink is 1/3 of the original area, the
THETAsa of the small one will be 6 C/Watt.
The final result of the heat sink temperature will be the casing temperature of all the
components on it. If you want to know the respective junction temperature, manually calculate
the difference of junction to casing temperatures and add it to the casing temperature. The
temperature difference is the component power (in watts) multiplied by the THETAjc.
One Heat Sink on Top of Several Components

The casing temperatures of all the components will be about the same as the heat sink
temperature. Therefore, the modeling is:

December 2014
Advanced Modeling
1. Add the total number of pins for all components that are under the heat sink.
2. Sum the height of the component and heat sink. For example, if the component is 1 inch
tall and the heat sink is 1 inch tall, the height is two inches.
3. Sum the power dissipation from all the components under the heat sink.
4. Eliminate all the original components under the heat sink from the board.
5. Place a fictitious component at the location of the heat sink with the same length and
width as the sink but very little height, and the pin number equal to the total number of
pins from step 1.
Assign the total power from step 3 to this component.
6. Design this heat sink with its height equal to the total height minus the height of the
fictitious component. Then place this heat sink on the fictitious component.
7. Run thermal simulation.
8. You will get an overall temperature of the heat sink. This will be the casing temperature
of each individual component that is touching the heat sink.
The junction temperatures of each original components under the sink, can be evaluated from
junction to casing temperature difference, which is the power multiply the THETAjc.
Chip Fan on Heat Sink

Model the heat sink and fan combination as a single heat sink.
The manufacturer should provide a new THETAsa for the fan/fin combination. Use this value
for the sink to air thermal resistance when defining the heat sink.
Add the height of the fan to the height of the original heat sink and enter that value under the
height of the heat sink.
Adding Thermal Screws

You can add thermal screws to the board, where the screw connects to metal, such as a heat sink
located off the board or a standoff screw connected to the case.
Caution

December 2014
Advanced Modeling
Procedure
” on page 65.
2. If needed, add the thermal screw to the working library.

b. To add a thermal screw component from the master library to the working library,
select the thermal screw component in the Master library list and click>>.
c. To create a new thermal screw component, clickAdd by parameters . The Edit Part
Dialog Box opens.

“
For advice for entering thermal screw specifications, seeThermal Screw Model” on
page 42.
3. Select Placement > Thermal Screw and select a thermal screw from the placement list.
4. Click and place the thermal screw on the board.
Thermal Screw Model

Enter the following thermal screw parameters in theEdit Part Dialog Box:
1. From the Class list, selectScrew.
2. In the Geometry area, do the following:

a. Select Round component .
b. Enter the diameter of the threaded portion of the screw.

c. Enter the height of the screw above the board surface.
3. In the Pins area, do the following:
a. In the Number of Pins field, enter 100.

b. In the Pin length field, enter the value from the following equation:

December 2014
Advanced Modeling
pin length = board hole radius - screw radius
c. In the Pin width field, enter the value from the following equation:
pin width = 2 * π* screw radius

d. In the Pin thickness field, enter the value from the following equation:
pin thickness = board thickness

e. In the Pin thermal conductivity field, enter the value for the screw material.
Simulation uses values from the Pins area to calculate the conductive thermal resistance
from the thermal screw to the board.
4. In the Thermal parameters area, do the following:
a. In the Power dissipation field, enter 0.

b. In the Thermal resistance across the screw field, enter the value calculated from the
following equation:
Thermal resistance across the screw = L / kA
where:
L is length of screw from step 3.b
k is the thermal conductivity of the screw material from step 3.e
A is the cross sectional area, where A =π* (pin width from step 3. c / 2) 2
c. In the Radiative Emissivity field, use the default value or use .1 for polished metal.
d. In the Temperature at end field, enter the temperature of the metal connected to the
screw. For example, the screw could connect to the case or heat sink.

December 2014
Advanced Modeling
Adding Heat Pipes

To place a heat pipe on the board the heat pipe must first be defined in the working library. The
setting of heat pipe properties is shown at the next section.
in the BoardSim board viewer, so the boards no longer match.
Caution
Procedure
” on page 65.
2. If needed, add the heat pipe to the working library.

b. To add a heat pipe component from the master library to the working library, select
the heat pipe component in the Master library list and click>> .
c. To create a new heat pipe component, clickAdd by parameters . The Edit Part
Dialog Box opens.

“on page 44.
For advice for entering heat pipe specifications, seeHeat Pipe Model”

3. Select Placement > Heat Pipe and select a heat pipe from the placement list.
4. Click and place the heat pipe on the board.
Heat Pipe Model

The most important parameters are the physical size of the heat pipe, and the air gap and gap
conductivity. HyperLynx Thermal assumes the heat pipe to be similar to a perfect conductor.

December 2014
Advanced Modeling
Add the part to the working library, then place it in the correct location on the board. The heat
pipe transfers the heat to another location.
Parameter definitions (the bold parameters are most critical, notice that many parameters are not
used and unavailable):
1. Class - Must select heatpipe, which is the part definition
2. Length - Length or dimension in X direction

3. Width - Width or dimension in Y direction
4. Height - The total height of the heatpipe when attached to the board
5. Air gap – The distance between the heatpipe and the board (usually there if a filler
material (thermal epoxy or adhesive) used to attach the heatpipe to the board)
6. Power - Usually set to zero

7. Emissivity - dependent on outer material, use .1 for a polished metal
8. Gap Conductivity - When conduction pads or paste are inserted into the gap beneath
the component, this is the conductivity of the conduction pads or paste.
Adding Wedge Locks and Other Board Edge

Components
You can add wedge locks and other cooling components that attach to the edge of the board.
Caution
Procedure
1. From the ThermalSim window, select Placement > Board Edge Connection .
2. Outside the board outline, click (and release) where you want the boundary condition to
start.
SeeFigure 4-1.
3. Move the mouse to the boundary end.
4. Click to finish. The Boundary Condition Definition Dialog Box opens.

December 2014
Advanced Modeling
5. Enter the wedge lock or other cooling component specifications.
Figure 4-1. Adding a Board Edge Connection

December 2014
Advanced Modeling
Model a Chip or MCM on the Board
Model a Chip or MCM on the Board

HyperLynx Thermal can model such a board without a cover because its structure is similar to a
board. Chips soldered onto the boards are considered a single component, but with conduction
pads underneath. If an MCM is attached to a board, treat the whole MCM as one component
first on the mother board with the total power of MCM assigned to this single representative
component. Then the local thermal environment can be obtained through the Refined output
option.This local environment is then used for the environment of this MCM.
Adjacent Board or Wall Effects

The effects of an adjacent wall or board are set in theEnvironment Condition Definition Dialog
Box. First you should indicate the position of the board in the rack; such as “ in rac
rack, or simply a single board. Then you specify adjacent wall or board parameters. For a board,
the power is needed. For a wall the wall temperature and emissivity are required. If you know
the temperature of an adjacent board and would like to use that value instead of the power
dissipation, choose as end of rack and enter the temperature as if you were using a wall. You
may also set different air velocities at each side of the board and the respective board-to-board
spacing.
Industry Tips for Thermal Modeling

Depending upon what type of industry your company deals in, detailed modeling requirements
may vary slightly.
? “Avionic and Outer Space Applications” on page 47
? “Computer and Instrumentation Applications” on page 48
? “Telecom and Industrial Control Systems” on page 49
? “Power Supplies and Automotive Systems

” on page 49
Avionic and Outer Space Applications

Avionic and outer space applications deal mainly with closed systems at high elevations with
variations in air condition and gravity.
Closed System
If the board is in a closed system, the only method of heat loss is by conduction and radiation.
Use the Boundary Condition Definition Dialog Box to specify heat loss at the edge of the board.
If thermal screws are mounted at the board and attached to heat sinks, specify then in the

December 2014
Advanced Modeling
working library - Class. For closed systems, the iteration limit is recommended to set to high in
the Environment Condition Definition Dialog Box .
Air Conditions
Use the Environment Condition Definition Dialog Box to specify the pressure of air and
gravity. For a board operating in outer space, the air pressure and gravity should both be set to 0.
Air should come from the bottom.
Component Details
The emissivity of components, the air gap, use of conduction pads, and pin dimensions must be
set carefully in the working library. It is very important to set the correct pin geometries and
conductivity when dealing with closed systems.
Board Structure
Use the Environment Condition Definition Dialog Box to specify the emissivity of the board.
Others
Carefully verify the following critical parameters: Power, THETAjc - Junction to Casing
Thermal Resistance, and so on.
Computer and Instrumentation Applications

The computer and instrumentation industries deal mainly with high power and tight packaging.
Heat Sink or Chip Fan

For a few very high power components, a heat sink or chip fan can be installed. The heat sink is
specified in the Working component library with a proper class. The effective height and
THETAsa are needed. The heat sink is placed on top of regular components. The chip fan is
handled the same as the heat sink. The proper equivalent THETAsa, provided by manufacturer,
“ on page 38.
needs to be specified. For procedural information, seeAdding Heat Sinks”
Adjacent Boards and Walls

Use the Environment Condition Definition Dialog Box to specify power for an adjacent board.
Specify temperature and emissivity for an adjacent wall.

December 2014
Advanced Modeling
Power Dissipation Assignments for Large Boards

See “Power and Thermal Resistance Parameter Files ” on page 25. If you do not want to use
power parameter files and the board is large with lots of components, the estimated power
should be given to major components that are either high power or sensitive to temperature. The
result of initial analysis reveals the problem areas on this board with high temperatures. You can
then examine the components in the problem areas by refining power dissipation settings and
re-simulating.
Telecom and Industrial Control Systems

Telecom and industrial control systems deal with large component numbers on boards, and
closed or open systems. You need to consider natural convective cooling.
Natural Convective Cooling

At natural convective cooling, use theEnvironment Condition Definition Dialog Box to set the
incoming air velocity to 0.0. The analysis includes chimney effects when calculate the final
natural convective temperature. For any forced flow with fan, the analysis calculates the
combined forced and natural flow velocity. In this situation, the board orientation of vertical or
horizontal should be specified correctly and the forced flow is zero. The incoming air
temperature is also the ambient air temperature, which induces the natural draft.
Power Supplies and Automotive Systems

Power supply and automotive industries deal with high power and thus, high heat. They also
incorporate high power traces in some designs. You need to consider high current traces on the
board.
High Current Traces on the Board

For high currents on traces, you need to consider the heat generation of the traces. Use
thermal/DC drop co-simulation to take metal heating into account.

December 2014
Advanced Modeling

December 2014
Chapter 5
Thermal Modeling Background
HyperLynx Thermal performs a detailed analysis of the air convection from the pins and the
thermal conduction through component sides, pins and the bottom air gap to the board. Flow
conditions can include forced or natural convection. Natural convective flow is always
calculated. The total flow velocity is the combined result of natural convective flow and the
forced flow.
The board conducts heat among components and to the air. HyperLynx Thermal simulation
takes into account the heat transfer properties of the board by considering all metal and
dielectric layers across the board thickness.
You provide detailed environmental conditions perform an accurate thermal analysis of the
board. The air velocity, air inlet temperature, and board-to-board spacing all significantly
influence the thermal performance of a board significantly.
? “Heat Transfer Background” on page 51
? “Heat Transfer on Boards” on page 55
? “Reliability Background ” on page 55
Heat Transfer Background

Figure 5-1 shows the three main mechanisms that transfer heat energy.

December 2014
Figure 5-1. Heat Transfer Mechanisms
Table 5-1. Heat Transfer Mechanisms

Mechanism Description
Convection Transfers heat through a fluid, such as air. For example, finned heat sinks can
enhance heat transfer by convection.
HyperLynx Thermal simulation takes into account the cooling of a component

or board by air flowing over it. The heat convection from an object to the air
flowing over its surface increases as the difference in temperature between the
solid surface and the mean temperature of the air increases.
The hot air wake of hot objects reduces the local heat convection of downstream
objects. While an upstream object may be sufficiently cooled by the incoming
air flow, the hot wake may not sufficiently cool a downstream object.
Another factor in convection is airflow velocity. High velocities produce a

strong convective wash and the cooling becomes significant.
Convection is unavailable in a vacuum, such as outer space.

December 2014
Table 5-1. Heat Transfer Mechanisms (cont.)

Mechanism Description
Radiation Transfers heat directly, similar to light. Radiation is related to the temperature
difference among objects. For example, components located near relatively cool
case walls can enhance heat transfer by radiation.
Radiating heat transfer increases with the temperature difference between two
objects, but the transfer is directly related to the fourth power of the absolute
value of the temperature. For this reason, high temperature objects usually have
significantly greater radiating heat transfer rates than room temperature objects.
However, if all objects are not very hot and their conductive and convective
heat transfer rates are small, the radiative heat transfer contribution may become
relatively significant, and must be considered.
An important feature of radiative heat transfer in any object is its strong

dependence upon the condition of the surface of the material in question. This is
known as the emissivity of the surface. The emissivity of materials such as
plastics or ceramics is close to 0.9, while that of polished metal can be as low as
0.2. On the other hand, a fully oxidized metal surface has a high emissivity
rating of approximately 0.3 to 0.8.
Conduction Transfers heat through a solid, such as a metal or dielectric material. For
example, component pins, wedge locks (located at the board edge), and thermal
pipes enhance heat transfer by conduction.
The rate of conduction is proportional to the thermal conductivity of the

material and the cross-section of the conduction path, and is inversely
proportional to the length of the path.
Metals, such as copper in a board, can be hundreds of times more conductive

than plastic/epoxy-based dielectric materials.
Current flowing through ICs, VRMs (voltage-regulation modules), and other components
produce heat.Figure 5-2 shows how heat transfers away from a:
? Component into the board and environment
? Board into the environment

December 2014
Figure 5-2. Heat Transfer from Components and Boards
Table 5-2. Heat Transfer from Components and Boards

Convection transfers heat from the package surface and pins to air.
Radiation transfers heat from the package surface and pins to adjacent
structures, if they are colder than the component package.
Conduction transfers heat from the component to the board in the following
ways:
? From the package pins to the board
? From the bottom surface of the package to the board through:
? Surface mount package — Thermal paste, thermal glue, conductive pad
? Non-surface mount package — Air gap
Conduction transfers most of the heat coming from the component to the board
in the X/Y direction.
Convection transfers heat from the board surface to air.
Radiation transfers heat from the board surface to adjacent structures, if they are
colder than the component package.

December 2014
Heat Transfer on Boards
Table 5-2. Heat Transfer from Components and Boards (cont.)

In an open (non-sealed) case, forced convection transfers heat from the board
surface to a stream of fresh air that a fan draws from outside the case.
Conduction transfers heat from the board edge to a cooling component, such as a
wedge lock.
Heat Transfer on Boards

In steady state calculations, all the heat generated in a component per unit of time should leave
that component by the following means:
1. Conduction through component pins and the air gap between the component and board.
2. Convection to the air from the surfaces of component and pins.
3. Radiative transfer to adjacent boards if they are colder than the component.
An equilibrium temperature of the component is eventually reached, such that, the rate of heat
generation equals the overall rate at which heat leaves the component.
Heat is conducted in a board through the mixture of metal wire and material of which the board
is made. When many components are found on a board, the heat transfer interaction between
them becomes very complicated. For example, a component with little power dissipation which
is located near a very hot component may receive conducted heat from the hot component
through the board and may release this heat to the air through convection. In analyzing heat
transfer and interaction in the board, it is important to realize that the board also eventually
releases this heat to the air by convection.
The heat convection of a component on a board is very dependent upon the thermal
characteristics of the components near it and in its location within the overall airflow. If the
upstream components are tall and hot, components located in the hot wake of that component
will be difficult to cool. HyperLynx Thermal fully models these three-dimensional effects.
Reliability Background
Two major objectives of boards are the functionality and reliability of the system. Reliability
depends upon various factors, IC temperature is the most influential one. The component failure
rate increases exponentially with the increase of junction temperatures.
Reliability is a statistical quantity. Its measurements are based upon the failure rate (number of
failures per million hours) for components, or mean time between failure (hours) for a board or

December 2014
Reliability Background
a system analysis indicates where the reliability is a problem; however, thermal analysis
indicates the means to reduce the temperature at the problem locations. You need both to do
good design work. For further details, please review the MIL-HDBK-217E Handbook.
Related Topics
“

December 2014
Chapter 6
ThermalSim Menus and Toolbars
When you open a design in HyperLynx Thermal, the ThermalSim window displays the design
and provides the following menus and toolbar:
? “View Menu ” on page 58
? “Placement Menu” on page 59
? “Simulate Menu” on page 60
? “Library Menu ” on page 61
? “ThermalSim Toolbar” on page 61

December 2014
View Menu
View Menu
Table 6-1. View Menu Contents

Menu Item Description
Components Open the Components Dialog Box to view package and junction
temperatures, and dissipation for each component.
Select a row in the spreadsheet to highlight the component in the
board viewer with a blue outline.
Toggle 2D/3D mode Switch between the 2-D editor and 3-D viewer.
Scale For each graphical simulation result legend, use the Display Scale
Setting dialog box to either use the default value range or a value
range that you enter.
Related Topics
“
ThermalSim Menus and Toolbars” on page 57

December 2014
Placement Menu
Placement Menu
Use this menu to add cooling components to the board.
Table 6-2. Placement Menu Contents

Menu Item Desciption
Heat Sink Select to place a heat sink on the board.
See “
Adding Heat Sinks” on page 38.
Screw Select to place a thermal screw on the board.
See “
Adding Thermal Screws” on page 41.
Heat Pipe Select to place a heat pipe on the board.
See “
Adding Heat Pipes” on page 44.
Thermal Via Select to place a thermal via on the board.
See “
Thermal Via Definition Dialog Box ” on page 95.
Board Edge Connection Select to place a wedge lock or other form of cooling component
located at an edge of the board.
See “ ”　
Adding Wedge Locks and Other Board Edge Components
on page 45.

December 2014
Simulate Menu
Related Topics
“
ThermalSim Menus and Toolbars” on page 57
Simulate Menu
Use the simulate menu to run thermal simulation.
Table 6-3. Simulate Menu Contents

Run Thermal Simulation Starts the thermal-only analysis of the board.
For a closed system or for one which uses natural convection, a

high number of iterations are appropriate. The analysis terminates
automatically when the difference between the results of the
current iteration and a previous iteration is less than the
Thermal
analysis convergence threshold (deg C)value.
Run PI/Thermal Co- Opens the Batch DC Drop Simulation dialog box in BoardSim.
simulation Use on a post-layout design to take into account heating from
current flowing between a voltage regulator module (VRM) and
an IC pin or other current sink.
See “ Running DC Drop Batch Simulation ”
Restriction: The DC Drop license is required to run thermal/DC

drop co-simulation.
Related Topics
“ThermalSim Menus and Toolbars” on page 57

December 2014
Library Menu
Library Menu
The master library stores the information for all available components. The working library
only contains the components of the current board. Components can be updated from the master
to the working library or copied from the working library to the master library. The material
library lists the conductivities of many commonly used materials.
Table 6-4. Library Menu Contents

Master Opens theEdit Master Library Dialog Box .
Working Opens theEdit Working Library Dialog Box . The working
library contains only the components on the loaded board. The
components can be updated from the master to the working
library or copied from the working library to the master library.
Material Opens theEdit Material Library Dialog Box . The material
library lists the conductivities of many commonly used
materials. You can add new materials, edit the conductivity of
existing materials, and delete materials.
Paths Opens thePaths to thermal libraries dialog box. Use this dialog
box to specify the paths to the material and master libraries.
Update from IBIS files Does both of the following:
? Copies thermal property values from IBIS models to
components in the working library.
? Opens a report file containing theThermal properties stored
in IBIS models assigned to the design.
Requirement: You have assigned IBIS models to components
and saved thermal properties to the models by selecting the
Update IBIS file option in the Edit Part Dialog Box.
Related Topics
ThermalSim Toolbar
This topic describes the toolbar items displayed by the ThermalSim window.
Note
Temperatures are always displayed in degrees C, even when you specify English in the
“ Units Dialog Box. ”

December 2014
ThermalSim Toolbar
Table 6-5. ThermalSim Toolbar Contents

Toolbar Item Description
Save the active document Saves HyperLynx Thermal settings to<design>_t.hlt.
Component list Select a component to add to the design.
See also:
“Adding Heat Sinks” on page 38
“Adding Thermal Screws” on page 41
“Adding Heat Pipes” on page 44
“Adding Wedge Locks and Other Board Edge
Components” on page 45
Add component to the board Attach the selected component to the pointer, to add it to
the design.
See also:
“Adding Heat Sinks” on page 38
“Adding Thermal Screws” on page 41
“Adding Heat Pipes” on page 44
“Adding Wedge Locks and Other Board Edge
Components” on page 45
Reset View Reset the display and fit the board to the window. See
“ThermalSim Window Viewing Operations” on page 13.
Zoom “
Begin a zoom in or zoom out operation. See ThermalSim
Window Viewing Operations ” on page 13.
Pan “
Pan the board. See ThermalSim Window Viewing
Rotate “
Rotate the board. See ThermalSim Window Viewing
Restriction: This option is unavailable in the 2-D Editor.

December 2014
ThermalSim Toolbar
Table 6-5. ThermalSim Toolbar Contents (cont.)

View the next side/layer Display temperatures on the next side of the board or the
next stackup layer.
Metal areas, planes, pads, routed traces, and so on, are

displayed as black shapes.
This option provides series access to the top side, bottom

side, and stackup layers. By contrast, the list below
provides direct access to a side or layer.
Restriction: This option is unavailable in the 3-D Viewer.

Show component reference Display reference designators within the component
designator outline. On small components, you may have to zoom in to
see the reference designators.
View computational grid Display the computation/simulation grid, which is formed

by the intersections of the mesh lines on the board. Use this
option to help identify where HyperLynx Thermal takes
into account cutouts and very small components.
The grid size is chosen automatically to optimize the

accuracy and analysis time.
View component power Display component power dissipation in watts.
Show refined component Highlight components that you have enabled to display
refined/detailed local simulation results in theRefined
component resultsfile. Highlighted components have a
blue outline instead of a black outline.
View component temperature Display component temperature in degrees C.
You can also double-click a component to display its

temperature in theComponent Properties Dialog Box.

December 2014
ThermalSim Toolbar

View excess temperature If the component temperature exceeds its thermal limit,
(temperature and temperature display the amount of excessive temperature in degrees C.
limit)
Thermal calculates the excessive component temperature
using the following equation:
Excessive temperature = Measured temperature - thermal

limit
where:
Excessive temperature is a positive value. Negative values

are not displayed.
Use the Edit Part Dialog Box to set the thermal limit.
View board temperature Display a temperature map that shows the board
temperature in degrees C. Note that Thermal does not
display temperatures in F.
View thermal gradient Display a temperature map that shows the board
temperature gradient in degrees C per inch (or mm). This
view can help locate thermal-expansion stress areas on the
board, which can lead to warped or cracked boards.
Run Thermal Simulation Run thermal-only simulation.
For a closed system or for one which uses natural

convection, a high number of iterations are appropriate.
The analysis terminates automatically when the difference
between the results of the current iteration and a previous
iteration is less than theThermal analysis convergence
threshold (deg C) value.
Specify environment properties Display environment settings such as incoming air
temperature/velocity and the location/power dissipation of
neighboring boards in the case. SeeEnvironment“
Condition Definition Dialog Box ” on page 88.

December 2014
ThermalSim Toolbar

Display component outlines and Display component outlines and metal shapes for the
metal shapes for a side or layer selected side or stackup layer.
Black shapes represent metal areas, planes, pads, routed

traces, and so on. For plane layers, most of the display is
filled the colors mapping to simulation results.
This option provides direct access to a side or layer. By

contrast, the icon steps serially through the top side,
bottom side, and stackup layers.
Restriction: This option is unavailable in the 3-D Viewer.

Display simulation results for a Display the power dissipation or temperature simulation
layer results for the selected stackup layer.
For example, “ Power Top ” shows the power dissipation for

the stackup layer named Top and “ Temperature Top ”　
shows the temperature for the stackup layer named Top.
The value No selection displays when the ThermalSim

window initially opens. The display is the same as when
Temperature <top_stackup_layer> is selected.
Related Topics

December 2014
ThermalSim Toolbar

December 2014
Chapter 7
Dialog Boxes
This chapter provides reference information for HyperLynx Thermal dialog boxes.

December 2014
Dialog Boxes
Boundary Condition Definition Dialog Box

To access: From the ThermalSim window, selectPlacement > Board Edge Connection >
outside the board outline, click (and release) where you want the board edge connection to
start, move the mouse to the board edge connection to end, and click to finish
Use this dialog box to specify the location of board edge cooling components, such as a wedge
lock.
Boundary conditions are very important when you simulate a sealed (closed) system, where the
edges of the board usually provide cooling. Without some mechanism for dissipating heat, the
board will usually reach unacceptably high temperatures due to ineffective thermal radiation.
This can happen if you model a closed system and do not specify how the heat transfers away
from the board.
If you are modeling an open system, you may not need to specify boundary conditions.
Figure 7-1. Boundary Condition Definition Dialog Box
Table 7-1. Boundary Condition Definition Dialog Box Contents

Parameter Description
Location Area
From Starting coordinate for the boundary
To Ending coordinate for the boundary
Thermal parameters Area
Thermal resistance of wedge lock For the wedge lock applied to the edge of the board,
at edge specify the thermal resistance between the edge of the
board and the heat sink. The typical unit is C-mm/Watt.

December 2014
Dialog Boxes
Table 7-1. Boundary Condition Definition Dialog Box Contents (cont.)

Temperature of sink at edge The temperature of the heat sink connected by the
wedge lock to the edge of the board.
The wedge lock usually connects the board edge to the

heat sink.
Boundary Conditions Introduction

Boundary conditions may not be important when simulating a board in an open case with strong
air convection, but they are critical when simulating a board in a closed (sealed) case. For a
sealed case, the edges of the board usually provide cooling. Without some mechanism for
dissipating heat, the board typically reaches unacceptably high temperatures due to ineffective
thermal radiation. This frequently happens when you model a board in a closed case without
specifying how the board dissipates heat.
A wedge lock usually connects the board edge to the heat sink, which could be a case wall,
cooling fins, and so on. The wedge lock usually has a thermal resistance. The value of the total
thermal resistance of a wedge lock,Rtotal, could be presented in the form:
DT = Q x Rtotal
where:
DT is the temperature difference between the edge of the board and the sink
Q is the total heat flow rate
Rtotal units are C/Watt
The wedge lock may cover a length along the edge of board, for example S mm. For each unit
length (mm), the thermal resistance is higher than the total thermal resistance. This is because
the longer the wedge lock, the larger the cross section of the heat flow and the less the total
thermal resistance. Resistance is inversely proportional to the cross section but proportional to
the length of heat flow path. Therefore, the thermal resistance per unit length Rlength is related
to the Rtotal as:
Rtotal = Rlength / L
where:
L is the length of the wedge lock along the edge of the board.
Finally, the unit of thermal resistance per unit length along the board is C-mm/Watt, which is
the input in the thermal parameters of this dialog box.
Related Topics
“

December 2014
Dialog Boxes
Components Dialog Box
Components Dialog Box

To access:
? This dialog box automatically opens when thermal simulation completes.
? From the ThermalSim window, select View > Component
Description
Use this dialog box to view component temperatures and power dissipation.
Figure 7-2. Components Dialog Box
Options
Table 7-2. Component Properties Dialog Box Contents

Option Description
Refdes A unique identifier for the component instance.
Package temperature Displays the temperature at the top of the component.
Junction temperature Displays the temperature at the junction between the component
and the board.
Dissipation Displays the power dissipation of the component.
Related Topics
“
Thermal QuickStart” on page 5

December 2014
Dialog Boxes
Component Properties Dialog Box

To access: Double-click component in ThermalSim window
Use this dialog box to view and modify component properties.
Note
Components placed outside the board outline may be ignored by simulation. See
“ ” on page 73.
Analysis of Components Placed Outside the Board Outline
Figure 7-3. Component Properties Dialog Box
Table 7-3. Component Properties Dialog Box Contents

General information Area
Reference designator A unique identifier for the component instance.
Part name Name of the part.
Edit this part Select to edit the part in theEdit Part Dialog Box .

December 2014
Dialog Boxes
Table 7-3. Component Properties Dialog Box Contents (cont.)

Placement and Visualization Area
X= Left point of component. X = 0 at the left edge of the
board.
Y= Bottom point of component. Y = 0 at the bottom of the
board.
On Front Side Select which side of the board the component is
On Back Side located.
Refined output Select to write detailed component and local
environment simulation results for this component to
“
the <design>_t.loc file. See Refined component
results” on page 19.
Angle Specify a rotation angle in degrees. 0 is equivalent to
no rotation.
Thermal characteristics Area
Component temperature Displays the temperature of the component.
Junction temperature Displays the temperature at the junction.
Default power in working Displays the default power.
library is
See also: “
Mapping PWR File Values to Dialog Box
Values” on page 25

December 2014
Dialog Boxes
Table 7-3. Component Properties Dialog Box Contents (cont.)

Input power scaling factor You cannot assign different power dissipation values
for the same type of part, even though each instance of
the same part may have a different power dissipation.
To assign a unique power dissipation to a specific

component instance, use this field to assign a scaling
factor to the component instance. Simulation multiplies
the nominal power dissipation value in the working
library by this component-specific scaling factor.
Power_dissipation_for_a_component_instance =
Default power in working library is X Input power
scaling factor.
For example, if Default power in working library is = 2

watts andInput power scaling factor is 0.2592, then the
component instance dissipates 0.5184 watts.
The scaling value range is 0.01 to 99.
SeePower dissipation.
See also: “
Mapping PWR File Values to Dialog Box
Values” on page 25
Analysis of Components Placed Outside the Board

Outline
If the component is placed outside, or partially outside, of the board outline, it may be ignored
during analysis.
The amount of heat source distribution contributed by the component, if any, is proportional to
the percentage of the component area that resides inside the board outline. Therefore, the power
dissipation for the component placed outside the board outline is ignored.
The junction-to-case and sink-to-air thermal resistances for the component is ignored.
The component temperature is set equal to the temperature of the air in the computational grid
cell nearest to the location of the analyzed component.
Related Topics

December 2014
Dialog Boxes
Edit Master Library Dialog Box

To access:
? From the ThermalSim window, select Library > Master
? From the BoardSim window, select Models > Assign Thermal Models > Library >
Master
Use this dialog box to manage the contents of the master library.
The master library has thousands of components, along with all of their pertinent parameters,
saved within it. This library contains the standard names from the Motorola handbook. Since
every company uses different names for their components, we chose to use Motorola as the
standard. This library can be expanded by adding your own components in to it.
Figure 7-4. Edit Master Library Dialog Box
Table 7-4. Edit Master Library Dialog Box Contents

Add by parameters Opens theEdit Part Dialog Box to add a new
component to the master library.

December 2014
Dialog Boxes
Table 7-4. Edit Master Library Dialog Box Contents (cont.)

Copy part Copy an existing component to a new one.
Edit part Opens theEdit Part Dialog Box for the selected
component.
Caution: Component edits are saved only in memory

until you save the betasoft.mlb file by clicking Save to
disk.
The betasoft.mlb file stores the master library and is

located in the same folder as the HyperLynx SI/PI
executable file (bsw.exe). For example,
\MentorGraphics\<release>\SDD_HOME\hyperlynx64
\betasoft.mlb.
Delete part Click to delete a selected part from the library.
Save to disk Save changes to disk.
The betasoft.mlb file stores the master library and is

\betasoft.mlb.
Related Topics

December 2014
Dialog Boxes
Edit Material Library Dialog Box

To access:
? From the ThermalSim window, select Library > Material
Material
This dialog box displays the names and conductivities of commonly-used materials.
Figure 7-5. Edit Material Library Dialog Box
Table 7-5. Edit Material Library Contents

Add Select to add a material to the material library.
Caution: New materials are discarded if you click

Close. Click Save to Disk to save added materials.

December 2014
Dialog Boxes
Table 7-5. Edit Material Library Contents (cont.)

Edit Edit the material by selecting the material and clicking
Edit .
Caution: Edits are discarded if you click Close. Click

Save to Disk to save material edits.
Remove Delete a material from the library by selecting the
material and clicking Remove.
Caution: Materials are restored if you click Close.

Click Save to Disk to permanently delete a material.
Save to Disk Save changes to disk.
The betasoft.clb file stores the material library and is

\betasoft.clb.
Related Topics
“

December 2014
Dialog Boxes
Edit Part Dialog Box

To access:
? From the Edit Master Library Dialog Box , click Add by parametersor Edit part
? Double-click component > from the Component Properties Dialog Box, click Edit this
part
Use this dialog box to create a new library component or edit an existing one.
Figure 7-6. Edit Part Dialog Box

December 2014
Dialog Boxes
Table 7-6. Edit Part Dialog Box Contents

General Area
Name of part Displays the part name in a read-only field.
Class Select one of the following package configurations:
? DIP-Through hole — components with pins located
at two opposite sides of the package and that
completely penetrate the board. Components with
pins on all four sides or on the bottom of the
component. Belongs to the SMD class.
? SMD Long Leads — components with pins located
on four sides of the package that attach to the board
surface and are long enough to be exposed to air
convection. For a rectangular package, the longer
sides are normally set as the North/South sides.
? SMD Medium leads — components similar to SMD
Long Leads, but whose pin surfaces are only partially
exposed to air convection. This includes surface-
mount components with short leads.
? SMD Leadless — components with pins located on
four sides that attach to the board surface and are not
exposed (or only slightly exposed) to air convection.
This includes leadless surface-mount components,
and metal-capped vertically-oriented components
whose pins are located on the package bottom.
This class includes surface mount resistors and

capacitors.
? SMD Small Outline — surface-mount components
whose pins are located on two opposite sides of the
package.
? BGA — ball grid array or pin grid array components
that have pins on the bottom surface of the package.
? Screw — thermal screws, which attach the board to
metal, such as a heat sink or case standoff screw.
? Heat sink — heat sinks mounted on a component
with convective air cooling.
? Heat pipe — all heat pipes.
? Daughter Board — parallel or perpendicular
daughter boards.
Geometry Area
Round Component Select to enter the dimensions for a round component.

December 2014
Dialog Boxes
Table 7-6. Edit Part Dialog Box Contents (cont.)

Left For a rectangular component, enter the coordinate for the
Bottom side.
Right
Top
Diameter For a round component, enter the component diameter.
Height (DZ) Dimension of the package in the Z direction.
This is the final height of the package after mounted on

the board. If a socket is used under this component, add
the height of the socket to this parameter for the
component in the working library.
If a heat sink is added on top of this component, specify

the extra height of the sink inEffective height (0-1) . The
effective height of heat sink is only used to evaluate its
influence on the airflow.
Effective height (0-1) For a heat sink, specify the effective height of the heat
sink to the airflow. The value will be a percent in decimal
form with 1 being total blockage and 0 being no
blockage.
For extruded fins oriented perpendicular to the airflow so

that all of the air is blocked, the value is 100% because it
is the total height.
If the extruded fins are parallel to airflow, this value is

usually about 50% if wide spacing of fins occurs. For
example, in a pin fin with a staggered array, the value is
close to 100%. For an inline array and parallel to flow,
80% is a good approximation.
Pin Area
Number of pins The number of component pins.
“
In the case of a thermal screw, seeThermal Screw
Model” on page 42.
Pin length The average length of the pins on the package or
component that are exposed to air.
“

December 2014
Dialog Boxes

Pin width The width of a package pin.
“
Pin thickness The thickness of package pin.
“
Pin thermal conductivity The thermal conductivity of a package pin. You can enter
the value directly or click Specify conductivity by select
material and select a material.
Thermal parameters Area
Power dissipation Power, in watts, that is converted into heat and conducted
or radiated away from the package.
P = I2 *R or P = E*I
Tip: If the power dissipation for a part varies with

temperature, define the relationship with a lookup table
by clicking Edit values or using the power import file.
See “ Power and Thermal Resistance Parameter Files ” on
page 25. Simulation approximates the correct power,
based on the device operating temperature.
Restrictions:
? This field becomes unavailable when you specify
power dissipation values for multiple temperatures.
? You cannot specify different power dissipation
values for the same type of part, even though
instances of the same part may dissipate different
amounts of power. Use theInput power scaling factor
field to account for this behavior.
Edit values Opens thePower Dissipation Editor Dialog Box to
specify the temperature-to-power relationship for a part,
using a lookup table.

December 2014
Dialog Boxes

Junction to casing thermal Also known as THETAjc, this is the thermal resistance
resistance (degC/watt) between the IC junction and the component casing in
degC/Watt. This is not the junction-to-ambient
resistance.
This value is dependent upon the testing method used.

THETAjc values in the library were derived from the
“ Semi-Therm Proceedings ” , TI and Signetics
DataBooks, and so on.
If THETAjc is unknown, set it to 0.0.
Note: The software automatically calculates THETAjb

(junction to board thermal resistance) from data specified
in the Pins and Gap areas of this dialog box.
Sink to air thermal resistance The heat-sink-to-air thermal resistance in C/Watt.
@3ft/s (degC/watt)
This value is a function of the heat sink design and of air
speed. Enter the value at 3 ft/s air velocity. Simulation
automatically finds the local air velocity.
Sink to air thermal resistance The heat-sink-to-air thermal resistance in C/Watt.
@10ft/s (degC/watt)
This value is a function of heat sink design and of air
speed. Enter the value at 10 ft/sec air velocity.
Simulation automatically finds the local air velocity.
Radiative Emissivity The averaged emissivity of the component, where the
value is between 0 and 1.
Casing temperature limit The temperature constraint for the component casing.
Click to display by how much the measured

component temperature exceeds its maximum
temperature.
Junction temperature limit The temperature constraint for the component junction.
Click to display by how much the measured

component temperature exceeds its maximum
temperature.
Temperature at end The temperature of the thermal screw where it connects
to the heat sink.
Gap Area

December 2014
Dialog Boxes

Air gap The gap between the bottom surface of the package and
the board.
Gap conductivity Conductivity of the material between the component and
board. The material may be a paste or a conduction pad.
Use the Specify conductivity by select material button to

select the gap-filling material and assign its conductivity
value to this field.
Specify conductivity by select Opens the Select material dialog box. Select a material to
material update theGap conductivity value.
IBIS model Area
You can store thermal-related data in IBIS models assigned to components. See IBIS
models.
File path Location of the IBIS file assigned by a .REF or .QPL file
in HyperLynx SI/PI. See “ Selecting Models and Values
for Entire Components . ”
Component model name Name of the component model, as identified by the IBIS
[Component] keyword.

December 2014
Dialog Boxes

Update IBIS file Select to add comments to the IBIS model to specify the
values of the following fields in this dialog box:
? Power dissipation-Single value only. If you click Edit
values to specify a lookup table containing the
temperature-power relationship for a part, only the
first dissipation value is used.
? Radiative Emissivity
? Pin thermal conductivity
? Junction to casing thermal resistance (degC/watt)
? Air gap
? Gap conductivity
? Junction temperature limit
? Casing temperature limit
The benefit of storing this data in IBIS models is that you
do not have to edit components in the working library to
contain this updated information.
Caution: Values stored in IBIS models are copied to the

.HLT file when you open the board in the ThermalSim
window and then close the window. If you update the
thermal properties in the IBIS models after closing the
window, the values are ignored unless you perform the
Update from IBIS files command from the Library menu.
Although HyperLynx Thermal automatically writes these

comments to the IBIS model, and you do not have to
manually edit them, the following topic provides syntax
“ for Thermal Properties in IBIS
information: Syntax
Models” on page 84
Syntax for Thermal Properties in IBIS Models

HyperLynx Thermal can optionally store component thermal properties in an IBIS model as a
series of comments located after the corresponding [Component] keyword and before the next
[Component] keyword, if the IBIS model contains another component model.
Figure 7-7 illustrates thermal property comments.
Figure 7-7. IBIS Model Containing Thermal Property Comments

December 2014
Dialog Boxes
Example Thermal Property Comments

| Thermal: Dissipation=0.019 emissivity=0.65 pinconductivity=223.031
| Thermal: junctiontocase=0 gap=0.019685 gapconductivity=0
| Thermal: jtl=105 ctl=100
Syntax Details
| Thermal: keyword = value
where
| is the comment character

Thermal: is the required text and colon
keyword is one of the following:
? —
dissipation Power dissipation
? emissivity —
Radiative Emissivity
? pinconductivity — thermal conductivity

Pin
? —
junctiontocase Junction to casing thermal resistance (degC/watt)
? gap—Air gap
? gapconductivity — conductivity
Gap
? jtl —
Junction temperature limit
? ctl —Casing temperature limit

value is the numeric property value. Do not include units. The following units are
automatically assigned:
? dissipation — Watt
? emissivity — N/A because this property has no units.
? pinconductivity — Btu/hrftF
? junctiontocase — degrees
C/Watt
? gap— inch
? gapconductivity — Btu/hrftF
? jtl — degrees C
? ctl — degrees
C
Text is case-insensitive. For example,Thermal means the same as
tHERMAL .

December 2014
Dialog Boxes
Edit Working Library Dialog Box
You can define each property on a separate line, or define multiple properties on a single line by
using white space to separate each property definition.
Related Topics
“

To access:
? From the ThermalSim window, select Library > Working
Working
Use this dialog box to display and manage components. The working library contains all of the
components on the board.
Figure 7-8. Edit Working Library Dialog Box

December 2014
Dialog Boxes
Table 7-7. Edit Working Library Dialog Box Contents

Update from Master Copies values from the component in the master library
to the component in the working library with the same
name.
Add by parameters Opens theEdit Part Dialog Box to add a new
component to the master library.
Copy part Copy the selected component to a new one.
Edit part Opens theEdit Part Dialog Box to modify parameters
for the selected component.
Caution: Component edits are saved temporarily in

memory until you save the<design>_t.hlt file by
clicking on the ThermalSim toolbar.
Delete part Delete the selected part.
Save Master Save the master library to betasoft.mlb.
The betasoft.mlb file is located in the same folder as

the HyperLynx SI/PI executable file (bsw.exe). For
example,
\betasoft.mlb.
Related Topics

December 2014
Dialog Boxes
Environment Condition Definition Dialog Box

To access:
? From the ThermalSim toolbar, click .
? From the BoardSim window, select Setup > Thermal Environment

Use this dialog box to define the environment surrounding the board.
The Environment conditions Area describes the properties of air flowing into the case.
The Analysis Area affects simulation iteration and the precision of the final simulation results.
The Casing Area describes:
? Board placement relative to adjacent boards, airflow, gravity vector, and so on.
? Thermal parameters of the board environment, such as power dissipation of adjacent

boards, temperature of the walls, and so on.
Figure 7-9. Environment Condition Definition Dialog Box

December 2014
Dialog Boxes
Table 7-8. Environment Condition Definition Dialog Box Contents

Environment conditions Area
Incoming Air Temperature The temperature, in degrees Celsius (degrees C), of the
(open) airflow before arriving at the board surface. The
minimum recommended value is -20 degreesC.
Initial Temp. of Iteration ? For an open case, this is the incoming air
(closed) temperature.
? For a closed (sealed) case, this is the initial
temperature when simulation begins.
Air pressure The air pressure at the elevation the board operates.
At the surface of the earth, use the default air pressure

of 1 atmosphere.
For satellite use, the pressure is 0.0.
A small value can be assigned at high elevations for

avionic electronics.
Gravity The gravity for the elevation you will use the board.
Gravity is assumed to be in the vertical downward
direction.
You can enter a value between 0 and 20.
For space, use 0. For rocket launching, it could be as

high as 20.
Humidity ratio The percent humidity for the elevation you will use the
board. It affects air density and many aspects of airflow
modeling.
You can enter a value between 0 and 1.
1.0 means fully saturated air (100% humidity).

December 2014
Dialog Boxes
Table 7-8. Environment Condition Definition Dialog Box Contents (cont.)

Incoming air velocity Velocity of air before reaching the board surface. This
parameter is very important in a commercial
application for open cases cooled with airflow.
If the case is sealed or closed, there is no airflow and

the value is 0.0. Similarly, if there is no induced airflow
(that is, only natural convection exists), the value is 0.
For reliable results, the value of 900 ft/min. or slightly

more is recommended.
Air flow direction The direction the air flow is heading (not where it
comes from).
Analysis Area
Thermal analysis convergence The maximum temperature deviation between
threshold (deg C) iterations of thermal analysis. Analysis repeats until the
temperature deviation from the current analysis to the
previous analysis falls below this value.
This value applies to when running HyperLynx

Thermal by itself (that is, not running thermal/DC-drop
co-simulation).
Larger values can force a faster, but more approximate,

result.
The default value is 0.0001.

Thermal/DC-drop co- The maximum temperature deviation between
simulation convergence iterations of thermal analysis. Analysis repeats until the
threshold (deg C) temperature deviation from the current analysis to the
previous analysis falls below this value.
This value applies to running HyperLynx Thermal

together with DC drop in HyperLynx SI/PI.
Larger values can force a faster, but more approximate,

result.
The default value is 0.001.

Casing Area

December 2014
Dialog Boxes

Board location Identifies if a board is:
? In rack - inside a rack with boards on both sides
? Single board - casing walls on both sides
? Right (left) of rack - board on one side and case
wall on the other
Card guide width The width of the card guide (if any) attached to the
bottom and top edges of the board. If no such crossbar
exists, set this value to the thickness of the board.
Comp. at front channel Specifies how many adjacent boards have components
placed on the side facing the board.
Gravity vector direction The placement orientation of the board with respect to
gravity. Gravity is vertically down.
? +X,-X,+Y,-Y are vertical
? +Z, -Z are horizontal
The default is Z (horizontal).
Emissivity of this board This parameter is related to the radiative heat flux.
According to the Stefan-Boltzmann law, a body at
temperature T radiates following amount of power per
unit of its area:
J = ε ? σ 4? Τ
where:
εis this emissivity coefficient between 0 and 1. For an

ideal black body εis 1; for any real body it is less than
1. εis a dimensionless parameter.
System The board is located in a case that is either open (air
flow) or closed (no air flow).
Board spacing The distance between this board and adjacent boards or
case walls on either side of the board. This is measured
from the surface of this board to the surface of the
adjacent board/wall.
Adjacent board emissivity The emissivity of the adjacent boards or walls are
important for radiation heat transfer.
Low values (0.1-0.3) for polished metals.
Higher values (0.6-0.9) for organic surfaces.
The value for an oxidized metal surface is close to

organic materials.

December 2014
Dialog Boxes

Adjacent board power Enter adjacent board power dissipation in watts.
dissipation
Restriction: This option is unavailable when Board
location is Single board.
Temperature of casing wall The adjacent wall temperatures. This parameter can be
used instead ofAdjacent board power dissipationif the
temperature of the adjacent board(s) is known.
Related Topics
“

December 2014
Dialog Boxes
Power Dissipation Editor Dialog Box
Power Dissipation Editor Dialog Box

To access: Next to the Power dissipation field of theEdit Part Dialog Box, click Edit values
Use this dialog box to edit the lookup table that maps component temperatures to power values.
Figure 7-10. Power Dissipation Editor Dialog Box
Related Topics
“
“ ” on page 25
“

December 2014
Dialog Boxes
Set Defaults Dialog Box
Set Defaults Dialog Box
To access: From the BoardSim windows, selectModels > Assign Thermal Models > Set
Defaults (Height, Power)
Use this dialog box to specify the default settings that HyperLynx Thermal assigns to a new
component when you add it to your board. Simulation uses these values unless a higher-priority
“ Among Component Property Sources
setting exists. See Priorities ” on page 20.
Figure 7-11. Set Defaults Dialog Box
Table 7-9. Set Defaults Dialog Box Contents

Option Description
Set default height Select to enter the default component height.
Set default power density Select to enter the default power density.
Set default component casing limit Select to enter the default component casing limit.
Set default component junction limit Select to enter the component junction limit.
Related Topics
“

December 2014
Dialog Boxes
Thermal Via Definition Dialog Box

To access: From the ThermalSim window, selectPlacement > Thermal Via > double-click the
board to place thermal via
Use this dialog box to specify thermal via properties. Thermal vias are similar to conventional
vias, except that they are placed to enhance thermal conduction in a local board area. The inside
of the via is usually filled with solder.
Figure 7-12. Thermal Via Definition Dialog Box
Table 7-10. Thermal Via Definition Dialog Box Contents

Location X Left point of selected area. X = 0 at the left edge of the board.
Y Bottom point of selected area. Y = 0 at the bottom of the
board.
Local property is round Select to specify a circular region and enter its diameter.

December 2014
Dialog Boxes
Table 7-10. Thermal Via Definition Dialog Box Contents (cont.)

Length (DX), Width (DY) If you did not select Local property is round, enter the length
and width of the region. The dimension does not include the
leads.
If the shape of SMD packages is rectangular, use the longer

side length.
For DIP or SMD Leadless packages, use the length of the

package edge where the pins are located. This is usually the
longer side of a DIP package.
Diameter If you selected Local property is round, enter the diameter of
the region.
From layer Starting layer for the vias.
To layer Ending layer for the vias.
Total number of thermal vias in The number of thermal vias within this local area.
this area
Outside diameter of the via
The total diameter including the outer rim and filler.

Thickness of the plating near The thickness of the plating on only one side.
the outside diameter of via
The total outside diameter of the thermal via is:
filler diameter + (2 x plating thickness)

Thermal conductivity of the The thermal conductivity of the via plating.
plating material
Enter a value or click Specify by select material to enter a
value based on the material name.
Thermal conductivity of the The thermal conductivity of the via filler.
material filling the via holes
Enter a value or click Specify by select material to enter a
value based on the material name.
Related Topics

December 2014
Glossary of Terms
adjacent board emissivity

The average radiative emissivity, a value between 0.0 and 1.0 for the adjacent board. Low values
(0.1-0.3) for polished metal surface, higher values (0.6-0.9) for organic surfaces, and the
oxidized metal surface is close to the organic materials. Conformal coating is an organic surface.
adjacent board power dissipation

If the adjacent item is a board, provide the power dissipation of that board in watts.
air comes from

The convective air coming from a side of the board.
air gap
The gap between the bottom of the package and the board.
air pressure
The air pressure, based on a pressure of 1 atmosphere at sea level. This value is expressed in
terms of atmospheres (atm). For satellite use, p is 0.0. A small value can be assigned at high
elevations for avionic electronics.
board location
To identify if a board is inside of a rack in which both sides face other boards, or at the left of the
rack where the left side faces a wall and the right side faces a board, or at the right of a rack, or a
single board which faces walls at both sides.
board placed
The board is placed horizontally or vertically with respect to the gravity. The gravity is vertically
down.
board spacing
The distance between this board and the adjacent boards or walls. This is measured from the
surface of this board to the surface of the adjacent board/wall.
card guide width

The width of the card guide (if any) attached to the bottom and top edges of the board. If no such
crossbar exists, set this value to the thickness of the board.
casing temperature limit

The limiting temperature of the component casing, beyond which the Temperature Excess
Display will show the warning colors.
class
The class refers to the specific configuration of a type of package.

December 2014
Glossary of Terms
DIP-Through hole is made up of components whose pins are located at two opposite sides
and go through the thickness of the board. Any component with pins which appear on all
four sides, or on the bottom of the component, belongs to one of the next several SMD
classes.
SMD Long Leads is for components with pins on four sides, with these long pins stop on
the surface of the board and these pins are exposed to air convection. For SMD classes if
the component is rectangular in shape, the longer sides are normally set as the
North/South sides.
SMD Medium leads is for components similar to SMD Long Leads, but whose pin surfaces
are only partially exposed to the air convection. This includes surface-mount
components with short leads.
SMD Leadless is made up of components whose pins are along the four side but not
exposed, or are only slightly exposed, to air convection. This includes leadless surface-
mount components, and metal-capped, vertically oriented components whose pins are
located on the bottom of the component. This class also includes all surface mount
resistors and capacitors.
SMD Small Outline is made up of surface-mount components whose leads are located on
two opposite sides only.
BGA is for all ball grid array or pin grid array components, whose pins are in the area under
the components.
Screw is for thermal screws, which are attached to the board and a heat sink.
Heat sink is for heatsinks mounted on a component with convective air cooling.
Heat pipe is for all heat pipes.
Daughter Board is for all parallel or perpendicular daughter boards.
components at front channel

This parameter indicates if the airflow channel at the front side has packages on only one wall or
both walls. If it is One Side, the front side of the board faces the backside of the adjacent board,
which has no components. Otherwise, this parameter is Both Sides, which means that
components are also present on the backside of the left adjacent board.
conductivity of metal at a layer

This is the thermal conductivity of the metals in the wires or ground/power planes on the board at
this layer. When there are 3 layers, this value is either for layer 1 and 3, or for layer 2. For
copper, a good value for this parameter is 227 Btu/hrftF, or 393 W/mC. For Aluminum, it is 125
Btu/hrftF or 216 W/mC.
conductivity of non-metals at a layer

This parameter sets the thermal conductivity of the base organic material of the board. When
there are three layers, this value is used either for layers 1 and 3 or layer 2. The conductivity of
epoxy is about 0.115 Btu/hrftF or 0.2 W/mC. The conductivity of non-metal material is usually
two orders of magnitude smaller than metal.

December 2014
Glossary of Terms
conductivity of traces or non-traces

They are defined similarly to the conductivities at a layer. The trace is considered as on the
outside of a board (on top of the skin), which does not belong to any of the 3 layers.
daughter board
A classification for all parallel or perpendicular daughter boards. In the library, the class of
daughter board is for a parallel daughter board. A perpendicular daughter board should be
modeled as a component of the total dimension, with power equal to the sum of the powers of the
components on this daughter board. The analysis gives the board temperature under this
component, which is the edge boundary temperature of this perpendicular daughter board. Then,
if needed, a separate analysis can be made to this daughter board with the edge temperature
specified.
default component casing or junction limits

You may set a uniform default limiting temperature for all the component casings and another
one for junctions. If an individual component has its own limits, those limits will apply to that
component only and can be entered in the working library.
effective height
This is the effective height of heat sink to the airflow. The value will be a percent in decimal
form with 1 being total blockage and 0 being no blockage. For extruded fins set perpendicular to
the airflow that all the air is blocked, this is the total height. The value will be 100%. If the
extruded fins are parallel to airflow, this value is usually about 50% if wide spacing of fins
occurs. For example, in a pin fin with a staggered array, this is close to 100%. For an in-line
array and parallel to flow, 80% is a good approximation.
em
This is the surface emissivity of this component, a value between 0.0 and 1.0
emissivity of this board

The emissivity of the board surface, not considering the components. For organic boards, it is
usually between 0.5 and 0.9
gap
See air gap.
gap conductivity
When conduction pads or paste are inserted into the gap beneath the component, this is the
conductivity of the conduction pads or paste.
gravity
Gravity at this location, a value between 0 and 20 can be considered. For space, it is 0. For rocket
launching, it could be as high as 20. Gravity is assumed in vertical downward direction.
humidity ratio
The relative humidity, a value between 0.0 and 1.0. Note that 1.0 represents total saturation of
water vapor or steam.

December 2014
Glossary of Terms
incoming air temperature (or initial temperature of iteration)

The temperature of the approaching air for an open system. For a closed system, this is the
temperature that the board temperature iteration will start from. It is desirable to have this initial
value close to the averaged temperature of the board after analysis that high accuracy is ensured.
This could be set through a couple of iteration of analysis. This value is expressed in degrees
Celsius. The minimum recommended value is -20 C.
incoming air velocity

Velocity of the incoming forced air, generally expressed in ft/min. If there is no induced airflow
(i.e., natural convection), the value for this parameter is zero. For reliable results, conventional
values not far beyond 900 ft/min. are recommended.
initial temperature of iteration (or incoming air temperature)

See incoming air temperature (or initial temperature of iteration)
isotropic
Thermal conductivity is the same in any direction.
junction to casing thermal resistance

Also known as the THETAjc value, this is the junction-to-casing thermal resistance for the
component or package, measured in C/Watt. This is not the junction to ambient resistance. See
THETAjc - Junction to Casing Thermal Resistance.
radiative emissivity
The averaged emissivity of the component, a value between 0 and 1.
rotation
The nominal orientation of a package in the working library has the long side in the X direction
and the shorter one in Y direction.
scaling factor for power

This parameter is the scaling factor for the power dissipation of this component with respect to
the nominal value of power for this type of component in the working library. You cannot
specify different power dissipation values for the same type of part. Each instance of a particular
part may have a different power dissipation. To modify the power dissipation for an instance of a
part, enter the appropriate scaling factor in theComponent Properties Dialog Box. The actual
power dissipation for an instance of a part is equal to the power dissipation assigned in the part
library multiplied by the input power scaling factor that is assigned for a specific instance of that
part.
0.5 assigns to the component 50% of the nominal power value in the working library. A value
between 0.01 and 99 can be assigned.
screw
Thermal screws attached to the board and connected to an external heat sink.
SI
Standard International Units, similar to Metric Units.

December 2014
Glossary of Terms
sink to air thermal resistance

The heat-sink-to-air thermal resistance measured in C/Watt. This value is a function of heat sink
design and of air speed. Usually users enter the values at 3 ft/s and 10 ft/sec air velocities. In the
analysis, the adequate values at local air velocity will be evaluated automatically.
SMD long leads

Classification for components with pins on four sides, with the surfaces of these pins exposed to
air convection. For SMD classes if the component is rectangular in shape, the longer sides are
normally set as the North/South sides.
SMD medium leads

Classification for components similar to SMD Long Leads, but whose pin surfaces are only
partially exposed to the air convection. This includes surface-mount components with short
leads.
SMD leadless
Classification for components whose pins are not exposed, or are only slightly exposed, to air
convection. This includes BGA, PGA, leadless surface-mount components, and metal-capped,
vertically oriented components whose pins are located on the bottom of the component. This
class also includes all SMD resistors and capacitors which have their longer sides set to two sides
of the component.
SMD small outline

Classification for surface-mount components whose leads are only located on two opposite sides.
temperature coefficient
On the traces, the electric conductivity varies with the temperature. Therefore, the power is also
changed when the temperature is changed. The temperature coefficient is the one for the electric
resistance or power at constant current as temperature changes.
thickness of layer
This is the thickness of this physical layer of the board. Notice that a physical layer can be
several layers of a board.
THETAcb
The thermal resistance between a component and the board. This value appears in the numerical
output from HyperLynx Thermal when you have a system that is closed on the front and back
sides.
THETAcb consists of a) the thermal resistance of the air gap between the package and board
surface and b) the thermal resistance of the package pins.
HyperLynx Thermal calculates THETAcb with the following equation:
THETAcb = (Pin_group_thermal_resistance * Gap_thermal_resistance) /

(Pin_group_thermal_resistance + Gap_thermal_resistance)
Where:
Pin_group_thermal_resistance is the thermal resistance of the group of package pins.

December 2014
Glossary of Terms
The formula for the thermal resistance of a group of pins:

Pin_group_thermal_resistance = Pin_thermal_resistance / Number_of_package_pins
The formula for the thermal resistance of a single pin:
Pin_thermal_resistance= (1 / Pin_thermal_conductivity) * Pin_length / (Pin_thickness *
Pin_width)
Gap_thermal_resistanceis the thermal resistance of the air gap between the package and surface
of the board.
The formula for Gap_thermal_resistance is:
Gap_thermal_resistance = (Gap_conductive_resistance * Gap_radiative_resistance) /
(Gap_conductive_resistance + Gap_radiative_resistance)
Where:
Gap_radiative_resistance = (Component_temperature - Board_local_temperature) * (1 /
Board_radiative_emissitivity + 1 / Package_radiative_emissivity - 1) / (sigma *
(Component_temperature**4 - Board_local_temperature**4))
sigma = Stefan-Boltzmann constant = (5.6704e-08 W /(m**2 * K**4))
HyperLynx Thermal uses component parameters entered in the
Edit Part Dialog Box to calculate
Gap_thermal_resistance, Pin_thermal_resistance,and Gap_conductive_resistance.
THETAjc
The thermal resistance between the IC junction and the component casing in degC/Watt. This
value is very dependent upon the testing method used. The present THETAjc values in the
library are derived from the “ Semi-Therm Proceedings ” , TI and Signetics DataBooks, and so o
If unknown, set to 0.0. SeeTHETAjc - Junction to Casing Thermal Resistancefor more details.
THETAsa
Thermal resistance between sink to air. See
THETAsa - Sink to Air Thermal Resistancefor more
details.

December 2014
Third-Party Information
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?

Software Version 9.2

?1999-2014 Mentor Graphics Corporation

Mentor Graphics Corporation

Send Feedback on Documentation: supportnet.mentor.com/doc_feedback_form

HyperLynx Thermal User Guide, v9.2 3

Computer and Instrumentation Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48

End-User License Agreement

4 HyperLynx Thermal User Guide, v9.2

Restriction: Thermal is unavailable on computers running Linux.

This section contains the following topics:

? “Thermal QuickStart” on page 5

? “Exporting Thermal Boards from PADS Layout” on page 11

? “GUI Overview ” on page 12

? “Data Flow” on page 14

HyperLynx Thermal User Guide, v9.2 5

Figure 1-1. Thermal Task Flow

? The Thermal license is required to run thermal simulation.

? The DC Drop license is required to run thermal/DC drop co-simulation.

6 HyperLynx Thermal User Guide, v9.2

? Thermal simulation is unavailable when a MultiBoard project is loaded.

o Run PI/Thermal Co-simulation . The Batch DC Drop Simulation dialog box

Note: If HyperLynx Thermal and a constraints-enabled Mentor Graphics PCB layout

b. Set default values, especially component power density.

HyperLynx Thermal User Guide, v9.2 7

3. Verify thermal conductivity values in materials library.

4. Assign environment properties.

? From the toolbar in the ThermalSim window, click .

? Select Simulate Thermal > Run Thermal Simulation or click . The

8 HyperLynx Thermal User Guide, v9.2

Note: Thermal/DC drop co-simulation takes longer to run than thermal-only

7. View thermal-only simulation results.

? Click to display component wattage.

You can also double-click a component to display its temperature in the

Perform “ what if ” experiments or edit settings in

HyperLynx Thermal User Guide, v9.2 9

See “ ” on page 37.

? Back-annotate component temperatures as Constraint Manager actuals. See

“ Opening Designs in BoardSim ”

Displaying Saved Simulation Results

10 HyperLynx Thermal User Guide, v9.2

Exporting Thermal Boards from PADS Layout

HyperLynx Thermal User Guide, v9.2 11

This topic contains the following:

? “ThermalSim Window Landmarks” on page 12

? “ThermalSim Window Viewing Operations” on page 13

ThermalSim Window Landmarks

Figure 1-2. ThermalSim Window Landmarks

Table 1-1. Main ThermalSim Window Landmarks

12 HyperLynx Thermal User Guide, v9.2

Table 1-1. Main ThermalSim Window Landmarks (cont.)

Note: Temperatures are always displayed in degrees C, even you if

N is the number of components on the side of the board in the viewer.

T(c) is the board (not component) temperature for the pointer

ThermalSim Window Viewing Operations

Table 1-3 on page 14 applies to the 3-D Viewer.

Table 1-2. Viewing Thermal Boards in 2-D Editor

HyperLynx Thermal User Guide, v9.2 13

Table 1-2. Viewing Thermal Boards in 2-D Editor (cont.)

PressEsc to cancel the command.

Table 1-3. Viewing Thermal Boards in 3-D Viewer

PressEsc to cancel the command.

PressEsc to cancel the command.