STTH102

Datasheet

200 V - 1 A high efficiency ultrafast diode

K A Features
• Very low conduction losses
A • Negligible switching losses
• Low forward voltage drop
A
• High junction temperature

K • ECOPACK®2 compliant
K

Applications
SMA DO-41
• Switching diode
• LED Lighting
• Auxiliary power supply
• Flyback diode

Description
The STTH102 uses ST's new 200 V planar Pt doping technology, and it is specially
suited for switching mode base drive and transistor circuits.
Packaged in SMA and DO-41, the STTH102 is ideal for use as a free wheeling diode
in power supplies and other power switching applications.

Product status

STTH102

Product summary

Symbol Value

IF(AV) 1A

VRRM 200 V

T j(max.) 175 °C

VF(typ.) 0.68 V

trr(typ.) 12 ns

DS2448 - Rev 6 - December 2018 www.st.com

For further information contact your local STMicroelectronics sales office.
 STTH102
Characteristics

1 Characteristics

Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified)

Symbol Parameter Value Unit

VRRM Repetitive peak reverse voltage 200 V

SMA TL = 145 °C
IF(AV) Average forward current δ = 0.5, square wave 1 A
DO-41 TL = 130 °C

SMA 40
IFSM Surge non repetitive forward current tp = 10 ms sinusoidal A
DO-41 50
Tstg Storage temperature range -65 to +175 °C

Tj Operating junction temperature +175 °C

Table 2. Thermal resistance parameter

Symbol Parameter Max. value Unit

Junction to lead SMA 30

Rth(j-l) °C/W
Junction to lead Lead length = 10 mm DO-41 50

For more information, please refer to the following application note :

• AN5088 : Rectifiers thermal management, handling and mounting recommendations

Table 3. Static electrical characteristics

Symbol Parameter Test conditions Min. Typ. Max. Unit

Tj = 25 °C - 1
IR(1) Reverse leakage current VR = VRRM µA
Tj = 125 °C - 1 25

Tj = 25 °C - 0.97
VF(2) Forward voltage drop IF = 1 A V
Tj = 125 °C - 0.68 0.78

1. Pulse test: tp = 5 ms, δ < 2%

2. Pulse test: tp = 380 µs, δ < 2%

To evaluate the conduction losses, use the following equation:

P = 0.65 x IF(AV) + 0.130 x IF2(RMS)
For more information, please refer to the following application notes related to the power losses :
• AN604: Calculation of conduction losses in a power rectifier
• AN4021: Calculation of reverse losses on a power diode

DS2448 - Rev 6 page 2/12

 STTH102
Characteristics

Table 4. Dynamic characteristics (Tj = 25 °C unless otherwise stated)

Symbol Parameters Test conditions Min. Typ. Max. Unit

trr Reverse recovery time IF = 0.5 A, Irr = 0.25 A, IR = 1 A - 12 20 ns

tfr Forward recovery time IF = 1 A, dIF/dt = 50 A/ms, VFR = 1.1 VF(max.) - 50 ns

VFP Forward recovery voltage IF = 1 A, dIF/dt = 50 A/µs - 1.8 V

DS2448 - Rev 6 page 3/12

 STTH102
Characteristics (curves)

1.1 Characteristics (curves)

Figure 1. Average forward power dissipation versus Figure 2. Average forward power dissipation versus
average forward current (SMA) average forward current (DO-41)

PF(AV) (W) PF(AV) (W)

1.0 1.0
δ = 0.1 δ = 0.2 δ = 0.5 δ = 0.1 δ = 0.2 δ = 0.5
0.9 δ = 0.05 0.9 δ = 0.05

0.8 0.8

0.7
δ=1 0.7 δ=1

0.6 0.6

0.5 0.5

0.4 0.4

0.3 0.3
T T
0.2 0.2

0.1 0.1
IF(AV)(A) δ =tp/T tp
IF(AV)(A) δ =tp/T tp
0.0 0.0
0.0 0.2 0.4 0.6 0.8 1.0 1.2 0.00 0.25 0.50 0.75 1.00 1.25

Figure 4. (DO-41)Average forward current versus ambient

Figure 3. Average forward current versus ambient temperature (δ = 0.5) (DO-41)
temperature (δ = 0.5) (SMA)

IF(AV)(A)
1.2 IF(AV)(A)
Rth(j-a) =Rt h(j-I) 1.2
Rth(j-a) =Rt h(j-I)
1.0
1.0

0.8
0.8

0.6 Rth(j-a) =120°C/W

0.6 Rth(j-a) =110°C/W

0.4
T 0.4

0.2 T
Tamb (°C) 0.2
d=tp/T tp
0.0 Tamb (°C)
d=tp/T tp
0 25 50 75 100 125 150 175 0.0
0 25 50 75 100 125 150 175

DS2448 - Rev 6 page 4/12

 STTH102
Characteristics (curves)

Figure 5. Relative variation of thermal impedance junction

Figure 6. Relative variation of thermal impedance junction
to ambient versus pulse duration (epoxy printed circuit
to ambient versus pulse duration (DO-41)
board, e(Cu) = 35 μm,recommended pad layout) (SMA)
Zth (j-c)/Rt h(j-c)
Zth(j-a)/ Rth(j-a) 1.0
1.0
0.9
0.9
0.8
0.8
0.7
0.7
0.6
0.6
0.5
0.5
0.4
0.4
0.3
0.3
0.2
0.2
0.1 Single pulse t p( s )
0.1
Single pulse t p (s) 0.0
0.0
1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
1.E-01 1.E+00 1.E+01 1.E+02 1.E+03

Figure 8. Junction capacitance versus reverse voltage

Figure 7. Forward voltage drop versus forward current
applied (typical values)
IF (A)
100.0 C (pF)
100
F=1MHz
Tj =125°C VOSC=30mV RMS
(maximum values) Tj =25°C

10.0 Tj =125°C
(typical values)

Tj =25°C
(maximum values) 10

1.0

VF ( V)
0.1
VR (V)
1
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4
1 10 100 1000

Figure 10. Thermal resistance junction to ambient versus

Figure 9. Relative variations of dynamic parameters copper surface under each lead (typical values)
versus junction temperature
Rth(j-a)(°C/W)
IR M; t rr ; Qrr [Tj ] / IR M; t rr ; Qrr [Tj =25°C ] 200
3.5 SMA
IF=I F(AV)
dIF/dt=200A/µs
VR=100V
3.0 150

QRR
2.5
100

2.0
Epoxy printed board FR4, eCu = 35 µm
trr
50
1.5
IRM
SCu (cm²)
Tj (°C) 0
1.0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
25 50 75 100 125 150 175

DS2448 - Rev 6 page 5/12

 STTH102
Characteristics (curves)

Figure 11. Thermal resistance versus lead length (DO-41)

Rth(°C/W)
120

Rth(j-a)
100

80

60
Rth(j-I)
40

20

Lleads(mm)
0
5 10 15 20 25

DS2448 - Rev 6 page 6/12

 STTH102
Package information

2 Package information

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK®
packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions
and product status are available at: www.st.com. ECOPACK® is an ST trademark.

2.1 DO-41 package information

• Epoxy meets UL 94, V0

Figure 12. DO-41 package outline

C A C

ØD
ØB

Table 5. DO-41 package mechanical data

Dimensions

Ref. Millimeters Inches (for reference only)

Min. Typ. Max. Min. Typ. Max.

A 4.07 - 5.20 0.160 - 0.205

B 2.04 - 2.71 0.080 - 0.107
C 25.40 - 1.000 -
D 0.71 - 0.86 0.028 - 0.0034

DS2448 - Rev 6 page 7/12

 STTH102
SMA package information

2.2 SMA package information

• Epoxy meets UL94, V0
• Cooling method : by conduction (C)

Figure 13. SMA package outline

E1

A1

C A2

L b

Table 6. SMA package mechanical data

Dimensions

Ref. Millimeters Inches (for reference only)

Min. Max. Min. Max.

A1 1.90 2.45 0.074 0.097

A2 0.05 0.20 0.001 0.008
b 1.25 1.65 0.049 0.065
c 0.15 0.40 0.005 0.016
D 2.25 2.90 0.088 0.115
E 4.80 5.35 0.188 0.211
E1 3.95 4.60 0.155 0.182
L 0.75 1.50 0.029 0.060

DS2448 - Rev 6 page 8/12

 STTH102
SMA package information

Figure 14. SMA recommended footprint in mm (inches)

1.4 2.63 1.4

(0.055) (0.104) (0.055)

1.64
(0.065)

5.43
(0.214)

DS2448 - Rev 6 page 9/12

 STTH102
Ordering information

3 Ordering information

Table 7. Ordering information

Order code Marking Package Weight Base qty. Delivery mode

STTH102A U12 SMA 0.068 g 5000 Tape and reel

STTH102 STTH102 DO-41 0.34 g 2000 Ammopack
STTH102RL STTH102 DO-41 0.34 g 5000 Tape and reel

DS2448 - Rev 6 page 10/12

 STTH102

Revision history

Table 8. Document revision history

Date Revision Changes

Jul-2003 2A Last update.

SMA package dimensions update. Reference A1 max. changed from 2.70mm (0.106inc.) to 2.03mm
Aug-2004 3
(0.080). SMA and DO-41 datasheets merged.
27-Jun-2005 4 Corrected error in title.
Reformatted to current standards. Added Table 4. Dynamic electrical characteristics. Updated
21-Nov-2006 5
dimensions table for DO-41 plastic package. Added cathode bands to package illustrations.

05-Dec-2018 6 Add electrical schematics of single diode and ECOPACK®2 compliant.

DS2448 - Rev 6 page 11/12

 STTH102

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DS2448 - Rev 6 page 12/12