INFORMATION NOTE

N° 063/11

Close dambar for PG-DSO-36 and P*-DSO-28

Subject of Change: Change of leadframe design to close dambar leadframe design

Products affected: Salesname Package

BTS50040-2SFA PG-DSO-36
BTS5276SF PG-DSO-36
TLE6208-6G PG-DSO-28
TLE6208-6G P-DSO-28
TLE6262G P-DSO-28
TLE6263G P-DSO-28
TLE6263-3G PG-DSO-28
TLE6266G PG-DSO-28
TLE7262E PG-DSO-36
TLE7263E PG-DSO-36
TLE7368E PG-DSO-36

Reason of Change: Harmonization of leadframes.

Description of change: Old New

Assessment: No impact on electrical parameters.

No impact for pick and place at board assembly expected

Time schedule: Implementation of change: 02-05-2012

Documentation: 2_cip11063 qualification plan

3_cip11063 customer general information

If you have any questions, please do not hesitate to contact your local Sales office.

2012-05-08 Page 1 of 1
Infineon Technologies AG Component Qualification Test Plan for Packaged Integrated Circuits IFAG ATV QM STD
according to AEC Q100

Project Info Note 2011-63 close dambar Date: 2011-11-30

Part for family qualification TLE7368E Department: IFAG ATV QM STD
Chip for family qualification S1172H Provided by: M. Breunig
Device family DC / DC converter Reviewed by: J. Lin

Part Operating Temperature Grade -40°C to 150°C

"GRADE 1"

Family qualification (generic data) with structual similar (representative) types

Assembly
Part Chip Chip size Wafer diameter Wafer fab Wafer technology Package Assessment
line

Part to be Qualified: TLE7368E S1172 4.7 x 3.48 mm² 200 mm Regensburg SPT_5_8 PG-DSO-36-24 BAT pass

Reference Part TLE7263E S1166 3,5 x 4,1 mm² 200 mm Kulim SPT_5_8 PG-DSO-36-24 BAT pass

Reference Part TLE7262E S1166 3,5 x 4,1 mm² 200 mm Kulim SPT_5_8 PG-DSO-36-24 BAT pass

Explanation: Mechanical representative type: Same or bigger chip size, Differences max. 1,5x and 1,5y
Same package
Same die bond method (glue or solder die bond)
Same wire bond method (Au nail head or Al wedge)
Same chip passivation (Nitride, Imide, ...)

Electrical representative type: Same wafer technology / wafer process

Same wafer fab
Same wafer diameter

IFAG ATV QM Page: 1 / 2 File: QTP_TLE7368_PGDSO36_24_InfoNote2011_063_20111130

 Infineon Technologies AG Component Qualification Test Plan for Packaged Integrated Circuits IFAG ATV QM STD
according to AEC Q100 Rev.F

Project Info Note 2011-63 close dambar Date: 2011-11-30

Part for family qualification TLE7368E, TLE7262E, TLE7263E Department: IFAG ATV QM STD
Chip for family qualification S1166 Provided by: M. Breunig
Device family Reviewed by: S.Weisse

TEST STRESS TEST Test

TLE7263E TLE7368E TLE7262E Remarks
# according AEC Q100 Rev.F conditions

# LOTS No. of No. of # LOTS No. of No. of # LOTS No. of No. of

tested failed tested failed tested failed
devices devices devices devices devices devices

MSL: 3
A1 Preconditioning Precon peak temp.: 1 200 0
260°C
T: 121°C
A3 Autoclave or Unbiased HAST AC P: 100 Kpa 1 90 0 on reference product on reference product acc. to Table 2A, AEC Q100 Rev.F
RH: 100 %
T min: -55°C
A4 Temperature Cycling TC T max: 1 100 0 on reference product on reference product acc. to Table 2A, AEC Q100 Rev.F
+150°C

C0 Internal Physical Inspection

1 5 pass 1 5 pass
C1 Wire Bond Shear 1 part of IPI 1 part of IPI after TC for gold nailhead bonds
C2 Wire Bond Pull 1 1 after TC
C3 Solderability 1 1 only throughhole devices
C4 Physical Dimensions 1 1 generic data
C5 Solder Ball Shear 1 1 generic data
C6 Lead Integrity 1 1 generic data

IFAG ATV QM
Markus Breunig 2/2 QTP_TLE7368_PGDSO36_24_InfoNote2011_063_20111130
Close Dambar for products
in DSO-28/-36 package

Production Site: Batam, Indonesia

Close Dambar in DSO-28/-36 package

 Scope of the change:

 Close dambar leadframe design for package DSO-28 & DSO-36

 Affected products:
 TLE6208-6G, TLE6262G, TLE6263G, TLE6263-3G, TLE6266G

 TLE7262E, TLE7263E

 TLE7368E

 BTS5276SF

 BTS50040-2SFA
 Reason for the change:
 Process harmonization

17.03.2011 Copyright © Infineon Technologies 2010. All rights reserved. Page 2

Close dambar in DSO-20/28/36 package is 100%
referenced to DSO-36 close dambar qualification

 P-DSO-28-6/-18, PG-DSO-28-24/-27/-34, PG-DSO-36-44 have the

same material as PG-DSO-36-34

 P-DSO-28-6/-18, PG-DSO-28-24/-27/-34, PG-DSO-36-44 are running

with identical assembly equipment and process as PG-DSO-36-34 which
is already qualified and in mass production

 Shifting the dambar does not affect the assembly processes, the
reliability of P-DSO-28-6/-18, PG-DSO-28-24/-27/-34, PG-DSO-36-44
can be referenced to the close dambar leadframe qualification report of
PG-DSO-36-34 as follows

17.03.2011 Copyright © Infineon Technologies 2010. All rights reserved. Page 3

Comparison
Standard vs. Close Dambar Leadframe
Overview: example from DSO-36

Zoom in area
 see detailed
view below

Side view

Standard Dambar LF Close Dambar LF

Side view of the zoom in area

Dambar
Dambar line
line

17.03.2011 Copyright © Infineon Technologies 2010. All rights reserved. Page 4

Qualification results summary for
PG-DSO-36-34
Test / Inspection Sample Size Result (Rej/samples) Remarks

Far Dambar Close

Dambar

SAT Top/Bottom before Dambar Cut 60 units 0/60 0/60

Pass
SAT Top/Bottom after Dambar Cut 60 units 0/60 0/60

Solderability Test 11 units per temp 0/44 0/44 Pass

(215/245/260/280°C )

Tape Test after Singulation 50 units 0/50 0/50 Pass

SAT Before Precon 90 units 0/90 0/90

SAT After Precon + 500 TC 90 units 0/90 0/90 Pass

El. Test after Precon + 500 TC 90 units 0/90 0/90 Pass

Dye Penetration Test after 1000THB 5 units - 0/5 Pass

Result : Qualification PASS

17.03.2011 Copyright © Infineon Technologies 2010. All rights reserved. Page 5
Infineon Technologies AG Component Qualification Test Report for Packaged Integrated Circuits IFAG ATV QM
according to AEC Q100 Rev.G
Project Close dambar in DSO-28, DSO-36, DSO-52 Date: 2012-02-13
Part for family qualification see table below Department: IFAG ATV QM
Chip for family qualification see table below Provided by: R. Anthony
Device family Reviewed by: R. Benedix

Part Operating Temperature Grade Grade 1

Family qualification (generic data) with structual similar (representative) types

Chip Wafer Wafer Assembly

Part Chip Wafer diameter Package
size fab technology line

1. Mechanical / electrical
representative (generic family BTS5589G L8208L 24.25mm2 200mm Kulim SMART5_8 PG-DSO-36-34 Batam
part A):

2. Mechanical / electrical
S1969K 13.2mm2 200mm Kulim SPT5
representative (generic family TLE7718G PG-DSO-52-6 Malacca
S1970C 17.6mm2 200 mm Villach SPT4
part A):

Part to be Qualified:
TLE6208-6G S0962B 16.3mm2 200 mm Villach SPT4 P-DSO-28-6 Batam

Part to be Qualified:
TLE6208-6G S0962C 16.3mm2 200 mm Villach SPT4 PG-DSO-28-24 Batam

Part to be Qualified:
TLE6208-6G S0962S 16.3mm2 200 mm Regensburg SPT4 PG-DSO-28-24 Batam

Part to be Qualified:
TLE6262G S1065R 20.4mm2 200 mm Regensburg SPT4 P-DSO-28-18 Batam

Part to be Qualified:
TLE6263-3G S0972E 20.0mm2 200 mm Regensburg SPT4 P-DSO-28-18 Batam

Part to be Qualified:
TLE6263-3G S0972F 20.0mm2 200 mm Regensburg SPT4 PG-DSO-28-27 Batam

Part to be Qualified:
TLE6263G S0972D 19.0mm2 200 mm Villach SPT4 P-DSO-28-18 Batam

Part to be Qualified:
TLE6266G S1133B 21.9mm2 200 mm Regensburg SPT4 P-DSO-28-18 Batam

Part to be Qualified:
TLE6266G S1133C 21.9mm2 200 mm Regensburg SPT4 PG-DSO-28-27 Batam

Part to be Qualified:
TLE6266G S1133C 21.9mm2 200 mm Regensburg SPT4 PG-DSO-28-34 Malacca

Part to be Qualified: L8124A 14.1mm2 200 mm Villach SFET3

BTS5276SF PG-DSO-36-44 Batam
S1220C 5.9mm2 200 mm Regensburg SPT6

Part to be Qualified: L8124E 19.1mm2 200 mm Villach SFET3

BTS50040-2SFA PG-DSO-36-44 Batam
S1220G 5.9mm2 200 mm Regensburg SPT6

Page 1 of 2
Infineon Technologies AG Component Qualification Test Report for Packaged Integrated Circuits IFAG ATV QM
according to AEC Q100 Rev.G

Project Close dambar in DSO-28, DSO-36, DSO-52 2012-02-13

Device no. for family qualification see table below IFAG ATV QM
Chip no. for family qualification see table below R. Anthony
Device family R. Benedix

Results
STRESS TEST
# Part to be # Part to be # Part to be # Part to be # Part to be # Part to be # Part to be Part to be # Part to be # Part to be # Part to be # Part to be # Part to be
TEST# according AEC Q100 Test conditions Sample #
Duration LOT Qualified LOT Qualified LOT Qualified LOT Qualified LOT Qualified LOT Qualified LOT Qualified Qualified LOT Qualified LOT Qualified LOT Qualified LOT Qualified LOT Qualified
Rev.G Size LOTS
S Fails/S.S. S Fails/S.S. S Fails/S.S. S Fails/S.S. S Fails/S.S. S Fails/S.S. S Fails/S.S. Fails/S.S. S Fails/S.S. S Fails/S.S. S Fails/S.S. S Fails/S.S. S Fails/S.S.

BTS50040-
BTS5589G TLE7718G TLE6208-6G TLE6208-6G TLE6208-6G TLE6262G TLE6263-3G TLE6263-3G TLE6263G TLE6266G TLE6266G BTS5276SF
2SFA

MSL: 3
A1 Preconditioning performed before TC
peak temp.: 260°C PB free

0 77 0 77 refer to BTS5589G refer to BTS5589G refer to BTS5589G refer to BTS5589G refer to BTS5589G refer to BTS5589G refer to BTS5589G refer to BTS5589G refer to TLE7718G refer to BTS5589G refer to BTS5589G
0c
0 77 0 77
A4 Temperature Cycling -65°C/+150°C 77 PC 3 1
0 77 0 77
500c
0 77 0 77

Supplier: