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LCD MONITOR TV
SERVICE MANUAL
CHASSIS : LD93A
CAUTION
BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
CONTENTS .............................................................................................. 2
PRECAUTIONS .........................................................................................3
SPECIFICATION ........................................................................................6
BLOCK DIAGRAM...................................................................................25
Copyright ©2009 LG Electronics. Inc. All right reserved. -2- LGE Internal Use Only
Only for training and service purposes
SAFETY PRECAUTIONS
Copyright ©2009 LG Electronics. Inc. All right reserved. -3- LGE Internal Use Only
Only for training and service purposes
SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service unit under test.
manual and its supplements and addenda, read and follow the 2. After removing an electrical assembly equipped with ES
SAFETY PRECAUTIONS on page 3 of this publication. devices, place the assembly on a conductive surface such as
NOTE: If unforeseen circumstances create conflict between the aluminum foil, to prevent electrostatic charge buildup or
following servicing precautions and any of the safety precautions on exposure of the assembly.
page 3 of this publication, always follow the safety precautions. 3. Use only a grounded-tip soldering iron to solder or unsolder ES
Remember: Safety First. devices.
4. Use only an anti-static type solder removal device. Some solder
General Servicing Precautions removal devices not classified as "anti-static" can generate
1. Always unplug the receiver AC power cord from the AC power electrical charges sufficient to damage ES devices.
source before; 5. Do not use freon-propelled chemicals. These can generate
a. Removing or reinstalling any component, circuit board electrical charges sufficient to damage ES devices.
module or any other receiver assembly. 6. Do not remove a replacement ES device from its protective
b. Disconnecting or reconnecting any receiver electrical plug or package until immediately before you are ready to install it.
other electrical connection. (Most replacement ES devices are packaged with leads
c. Connecting a test substitute in parallel with an electrolytic electrically shorted together by conductive foam, aluminum foil
capacitor in the receiver. or comparable conductive material).
CAUTION: A wrong part substitution or incorrect polarity 7. Immediately before removing the protective material from the
installation of electrolytic capacitors may result in an leads of a replacement ES device, touch the protective material
explosion hazard. to the chassis or circuit assembly into which the device will be
installed.
2. Test high voltage only by measuring it with an appropriate high CAUTION: Be sure no power is applied to the chassis or circuit,
voltage meter or other voltage measuring device (DVM, and observe all other safety precautions.
FETVOM, etc) equipped with a suitable high voltage probe. 8. Minimize bodily motions when handling unpackaged
Do not test high voltage by "drawing an arc". replacement ES devices. (Otherwise harmless motion such as
3. Do not spray chemicals on or near this receiver or any of its the brushing together of your clothes fabric or the lifting of your
assemblies. foot from a carpeted floor can generate static electricity
4. Unless specified otherwise in this service manual, clean sufficient to damage an ES device.)
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable General Soldering Guidelines
non-abrasive applicator; 10% (by volume) Acetone and 90% (by 1. Use a grounded-tip, low-wattage soldering iron and appropriate
volume) isopropyl alcohol (90%-99% strength) tip size and shape that will maintain tip temperature within the
CAUTION: This is a flammable mixture. range or 500ºF to 600ºF.
Unless specified otherwise in this service manual, lubrication of 2. Use an appropriate gauge of RMA resin-core solder composed
contacts in not required. of 60 parts tin/40 parts lead.
5. Do not defeat any plug/socket B+ voltage interlocks with which 3. Keep the soldering iron tip clean and well tinned.
receivers covered by this service manual might be equipped. 4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
6. Do not apply AC power to this instrument and/or any of its bristle (0.5 inch, or 1.25cm) brush with a metal handle.
electrical assemblies unless all solid-state device heat sinks are Do not use freon-propelled spray-on cleaners.
correctly installed. 5. Use the following unsoldering technique
7. Always connect the test receiver ground lead to the receiver a. Allow the soldering iron tip to reach normal temperature.
chassis ground before connecting the test receiver positive (500ºF to 600ºF)
lead. b. Heat the component lead until the solder melts.
Always remove the test receiver ground lead last. c. Quickly draw the melted solder with an anti-static, suction-
8. Use with this receiver only the test fixtures specified in this type solder removal device or with solder braid.
service manual. CAUTION: Work quickly to avoid overheating the circuit
CAUTION: Do not connect the test fixture ground strap to any board printed foil.
heat sink in this receiver. 6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
Electrostatically Sensitive (ES) Devices (500ºF to 600ºF)
Some semiconductor (solid-state) devices can be damaged easily b. First, hold the soldering iron tip and solder the strand against
by static electricity. Such components commonly are called the component lead until the solder melts.
Electrostatically Sensitive (ES) Devices. Examples of typical ES c. Quickly move the soldering iron tip to the junction of the
devices are integrated circuits and some field-effect transistors and component lead and the printed circuit foil, and hold it there
semiconductor "chip" components. The following techniques only until the solder flows onto and around both the
should be used to help reduce the incidence of component component lead and the foil.
damage caused by static by static electricity. CAUTION: Work quickly to avoid overheating the circuit
1. Immediately before handling any semiconductor component or board printed foil.
semiconductor-equipped assembly, drain off any electrostatic d. Closely inspect the solder area and remove any excess or
charge on your body by touching a known earth ground. splashed solder with a small wire-bristle brush.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
Copyright ©2009 LG Electronics. Inc. All right reserved. -4- LGE Internal Use Only
Only for training and service purposes
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through Circuit Board Foil Repair
which the IC leads are inserted and then bent flat against the Excessive heat applied to the copper foil of any printed circuit
circuit foil. When holes are the slotted type, the following technique board will weaken the adhesive that bonds the foil to the circuit
should be used to remove and replace the IC. When working with board causing the foil to separate from or "lift-off" the board. The
boards using the familiar round hole, use the standard technique following guidelines and procedures should be followed whenever
as outlined in paragraphs 5 and 6 above. this condition is encountered.
Removal At IC Connections
1. Desolder and straighten each IC lead in one operation by gently To repair a defective copper pattern at IC connections use the
prying up on the lead with the soldering iron tip as the solder following procedure to install a jumper wire on the copper pattern
melts. side of the circuit board. (Use this technique only on IC
2. Draw away the melted solder with an anti-static suction-type connections).
solder removal device (or with solder braid) before removing the
IC. 1. Carefully remove the damaged copper pattern with a sharp
Replacement knife. (Remove only as much copper as absolutely necessary).
1. Carefully insert the replacement IC in the circuit board. 2. carefully scratch away the solder resist and acrylic coating (if
2. Carefully bend each IC lead against the circuit foil pad and used) from the end of the remaining copper pattern.
solder it. 3. Bend a small "U" in one end of a small gauge jumper wire and
3. Clean the soldered areas with a small wire-bristle brush. carefully crimp it around the IC pin. Solder the IC connection.
(It is not necessary to reapply acrylic coating to the areas). 4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
"Small-Signal" Discrete Transistor copper pattern. Solder the overlapped area and clip off any
Removal/Replacement excess jumper wire.
1. Remove the defective transistor by clipping its leads as close as
possible to the component body. At Other Connections
2. Bend into a "U" shape the end of each of three leads remaining Use the following technique to repair the defective copper pattern
on the circuit board. at connections other than IC Pins. This technique involves the
3. Bend into a "U" shape the replacement transistor leads. installation of a jumper wire on the component side of the circuit
4. Connect the replacement transistor leads to the corresponding board.
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder 1. Remove the defective copper pattern with a sharp knife.
each connection. Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
Power Output, Transistor Device 2. Trace along the copper pattern from both sides of the pattern
Removal/Replacement break and locate the nearest component that is directly
1. Heat and remove all solder from around the transistor leads. connected to the affected copper pattern.
2. Remove the heat sink mounting screw (if so equipped). 3. Connect insulated 20-gauge jumper wire from the lead of the
3. Carefully remove the transistor from the heat sink of the circuit nearest component on one side of the pattern break to the lead
board. of the nearest component on the other side.
4. Insert new transistor in the circuit board. Carefully crimp and solder the connections.
5. Solder each transistor lead, and clip off excess lead. CAUTION: Be sure the insulated jumper wire is dressed so the
6. Replace heat sink. it does not touch components or sharp edges.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Copyright ©2009 LG Electronics. Inc. All right reserved. -5- LGE Internal Use Only
Only for training and service purposes
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement.
4. Electrical Specification
4.1 Module Specification
- M2362D- PZL : LGD / LM230WF1- TLA3( P/ N : EAJ60682701)
Copyright ©2009 LG Electronics. Inc. All right reserved. -6- LGE Internal Use Only
Only for training and service purposes
5. General specification
5.1 TV
No Item Specification Remarks
DTV &Analog- UK,France,Germany,Spain,Sweden,Finland,
Italy,Netherland,Belgium,Czech Luxemburg,Greece,
1 Market EU(PAL Market-26Countries) Denmark,Austria,Hungary,Switzerland,Croatia,Turkey
Analog Only -Poland,Portugal,Norway,Bulgaria,Serbia,
Slovenia,Russia,Romania
1) PAL-BG
2) PAL-DK
2 Broadcasting system 3) PAL-I/I’
4) SECAM L/L’
5) DVB-T
Analog : Upper Heterodyne
3 Receiving system
Digital : COFDM
Scart 1 Jack is Full scart and support RF-OUT(ATV)
4 Scart Jack (2EA) PAL,SECAM
Scart 2 jack is Half scart and support MNT/DTV-OUT.
5 Component Input (1EA) Y/Cb/CrY/Pb/Pr
6 CVBS Input (1EA) PAL,SECAM,NTSC 4 System(Rear):PAL50,SECAM,NTSC,PAL60
7 RGB Input RGB-PC Analog(D-SUB 15Pin)
8 DVI Input DVI-D Digital
HDMI1-DTV 1ea(Rear),1ea(Side)
9 HDMI Input (2EA)
HDMI2-DTV HDMI version 1.3 Support HDCP /Not support PC
10 Audio Input (3EA) RGB/DVI Audio, Component, CVBS L/R Input
11 SPDIF out (1EA) SPDIF out
Antenna,AV1,AV2,AV3,Component,
12 Earphone out (1EA)
RGB,DVI,HDMI1,HDMI2
13 USB (1EA) Picture,Music Software Update +Picture +Music
14 RS-232C (1EA) Commercial Mode
Copyright ©2009 LG Electronics. Inc. All right reserved. -7- LGE Internal Use Only
Only for training and service purposes
5.2 RGB
No Item Specification Remark
1 Supported Sync.Type Separate Sync.,Digital
Horizontal 30~83kHz
Analog
Vertical 56~75 Hz
2 Operating Frequency
Horizontal 30~83kHz
Digital
Vertical 56~75 Hz
Max. 1366 x 768 @60Hz
Analog
Recommend 1360 x 768 @60Hz
M1962D
Max. 1366 x 768 @60Hz
Digital
Recommend 1360 x 768 @60Hz
Max. 1600 x 900 @60Hz
Analog
3 Resolution Recommend 1600 x 900 @60Hz
M2062D
Max. 1600 x 900 @60Hz
Digital
Recommend 1600 x 900 @60Hz
Max. 1920 x 1080 @60Hz
Analog
Recommend 1920 x 1080 @60Hz
M2262D/M2362D/M2762D
Max. 1920 x 1080 @60Hz
Digital
Recommend 1920 x 1080 @60Hz
4 Input Voltage Voltage :100 ~240 Vac,50 or 60Hz
5 Inrush Current Cold Start :50 A /Hot :120 A
Operating Condition Sync (H/V) Video LED Wattage
On/On Active Blue 50 Max.
M1962D
On/On Active Blue 40 Typ.
On/On Active Blue 60 Max.
M2062D
On/On Active Blue 50 Typ.
6 Power On On/On Active Blue 60 Max.
M2262D
S/W Mode On/On Active Blue 53 Typ.
On/On Active Blue 60 Max.
M2362D
On/On Active Blue 55 Typ.
On/On Active Blue 120 Max.
M2762D
On/On Active Blue 100 Typ.
Off/On
Sleep mode Off Amber 1W RGB
On/Off
Off mode - Off Off 0.5W
19”LGD :50,000 Hours(min)
20”CMO :40,000 Hours(min)
Lamp 20”LGD :50,000 Hours(min)
7 MTBF 50,000 HRS with 90%Confidence level Life 22”AUO :40,000 Hours(min)
22”LGD :50,000 Hours(min)
23”LGD :50,000 Hours(min)
27”LGD :50,000 Hours(min)
8 Using Altitude 5,000 m (for Reliability) 3,000m(for FOS)
Temp :10°C ~35°C
9 Operating Environment
Humidity :20 %~80 %
Temp :-10°C ~60°C non condensing
10 Storage Environment
Humidity :5 %~90 %non condensing
Copyright ©2009 LG Electronics. Inc. All right reserved. -8- LGE Internal Use Only
Only for training and service purposes
6. Chroma & Brightness
Specification
No. Item Remark
Min typ Max
Right/ Left 70/ 70 85/ 85 -
1. Viewing Angle<CR>10>
Up/ Down 60/ 70 75/ 85 -
Luminance (cd/m2) 250 300 -
2. Luminance
Variance(%) 75 - -
3. Contrast Ratio CR 700 1000 - Full White/ Full black
White Wx 0.313
Wy 0.329
RED Rx Typ 0.644 Typ DVI or RGB
4. Color Coordinates Ry -0.03 0.336 +0.03 - Vivid, 6500K
[CIE 1931] Green Gx 0.301 - Full White (100IRE)
Gy 0.611 - Backlight 100
Blue Bx 0.146
By 0.070
Rise Time TrR 1.3 2.6 Condition : DVI or RGB
5. Response Time
Decay Time TrD 3.7 7.4 Standard, Backlight100
6.1 Optical Test Condition
- Surrounding Brightness Level : dark
- Surrounding Temperature : 25±5°C
- warm-up Time :30 Min
- Contrast,Brightness : Outgoing condition
-.*Incase of Vivid Mode, high level saturation may be occurred. Check gray linearity at standard mode.
Active Area
A B
D Bezel
Copyright ©2009 LG Electronics. Inc. All right reserved. -9- LGE Internal Use Only
Only for training and service purposes
7. Chroma (PSM : PC Mode-Standard, AV Mode-Vivid)
No Item Min Typ Max Remark
White Balance,X axis 0.268 0.283 0.298 DQA :±0.015
1. Cool
White Balance,Y axis 0.283 0.298 0.313 DQA :±0.015
White Balance,X axis 0.280 0.295 0.310 DQA :±0.015
2. Medium
White Balance,Y axis 0.290 0.305 0.320 DQA :±0.015 Measurement Condition
White Balance,X axis 0.298 0.329 0.313 DQA :±0.015 PSM :Outgoing condition
3. Warm
White Balance,Y axis 0.314 0.328 0.344 DQA :±0.015 Input signal :White pattern(85IRE)
White Balance,X axis 0.298 0.313 0.328 DQA :±0.015 Pattern number :78 (MSPG series)
4. 6500k
White Balance,Y axis 0.314 0.329 0.344 DQA :±0.015
White Balance,X axis 0.268 0.283 0.298 DQA :±0.015
5. 9300k
White Balance,Y axis 0.283 0.298 0.313 DQA :±0.015
Luminance(cd/m2) C/R
No Item Remark
Min Typ Max Min Typ
1 M1962D 150 180 500 700 RGB &DVI
2 M2062D 200 230 500 700 DFC 30000:1(Typ)
3 M2262D 200 230 500 700 -Mode :Outgoing condition
4 M2362D 200 230 500 700 Input signal :100IRE White pattern
5 M2762D 200 230 500 700 (Pattern #4 :MSPG series)
- AV Mode
Luminance(cd/m2) C/R(min)
No Item Remark
Typ Max RF,AV,COMPONENT,HDMI
1 M1962D 120 150 500 RF, AV, COMPONENT, HDMI
2 M2062D 170 200 500 Test Condition
3 M2262D 170 200 500 Mode :Outgoing condition
4 M2362D 170 200 500 Input signal : 100IRE White pattern
5 M2762D 170 200 500 (Pattern #4 : MSPG series)
Copyright ©2009 LG Electronics. Inc. All right reserved. - 10 - LGE Internal Use Only
Only for training and service purposes
9. Component Video Input (Y, PB , PR)
Specification
No. Remark
Resolution H-freq(kHz) V-freq(Hz) Pixel clock( MHz)
1. 720* 480 15.73 59.94 13.500 SDTV, DVD 480I( 525I)
2. 720* 480 15.75 60.00 13.514 SDTV, DVD 480I( 525I)
3. 720* 576 15.625 50.00 13.500 SDTV, DVD 576I( 625I) 50Hz
4. 720* 480 31.47 59.94 27.000 SDTV 480P
5. 720* 480 31.50 60.00 27.027 SDTV 480P
6. 720* 576 31.25 50.00 27.000 SDTV 576P 50Hz
7. 1280* 720 44.96 59.94 74.176 HDTV 720P
8. 1280* 720 45.00 60.00 74.250 HDTV 720P
9. 1280* 720 37.50 50.00 74.25 HDTV 720P 50Hz
10. 1920* 1080 33.72 59.94 74.176 HDTV 1080I
11. 1920* 1080 33.75 60.00 74.250 HDTV 1080I
12. 1920* 1080 28.125 50.00 74.250 HDTV 1080I 50Hz,
13. 1920* 1080 56.25 50 148.5 HDTV 1080P
14. 1920* 1080 67.432 59.94 148.350 HDTV 1080P
15. 1920* 1080 67.5 60.00 148.5 HDTV 1080P
Copyright ©2009 LG Electronics. Inc. All right reserved. - 11 - LGE Internal Use Only
Only for training and service purposes
11. HDMI INPUT(DTV)
No. Resolution H-freq(kHz) V-freq(Hz) Pixel clock(MHz) Remark
1 720* 480 31.469 / 31.5 59.94 / 60 23.00/ 23.03 SDTV 480P
2 720* 576 31.25 50 54 SDTV 576P
3 1280* 720 37.500 50 74.25 HDTV 720P
4 1280* 720 44.96 / 45 59.94 / 60 74.17/ 74.25 HDTV 720P
5 1920* 1080 33.72 / 33.75 59.94 / 60 74.17/ 74.25 HDTV 1080I
6 1920* 1080 28.125 50.00 74.25 HDTV 1080I
7 1920* 1080 26.97 / 23 23.97 / 24 74.17/ 74.25 HDTV 1080P
8 1920* 1080 33.716 / 33.75 29.976 / 30.00 74.25 HDTV 1080P
9 1920* 1080 56.250 50 148.5 HDTV 1080P
10 1920* 1080 67.43 / 67.5 59.94 / 60 148.35/ 148.50 HDTV 1080P
Copyright ©2009 LG Electronics. Inc. All right reserved. - 12 - LGE Internal Use Only
Only for training and service purposes
ADJUSTMENT INSTRUCTION
1. Application
This document is applied to LD93A chassis LCD Monitor TV
which is manufactured in TV (or Monitor) Factory or is (1) (3)
produced on the basis of this data.
2. Designation
2.1 The adjustment is according to the order which is (2) OK
designated and which must be followed, according to the
plan which can be changed only on agreeing.
2.2. Power Adjustment: Free Voltage
2.3. Magnetic Field Condition: Nil.
2.4. Input signal Unit: Product Specification Standard Please Check the Speed :
2.5. Reserve after operation: Above 5 Minutes (Heat Run) To use speed between
Temperature : at 25°C ± 5°C from 200KHz to 400KHz
Relative humidity : 65 ±10%
Input voltage : 220V, 60Hz
2.6. Adjustment equipment: Color Analyzer (CA-210 or CA- 4. Click "Read" tab, and then load download file(XXXX.bin)
110), Pattern Generator (MSPG-925L or Equivalent), by clicking "Read"
DDC Adjustment Jig equipment, SVC remote controller
(4)
2.7. Don’t push The “IN STOP KEY” after completing the
function inspection.
filexxx.bin
3. Tool Option
Model Module Tool option
LGD 4301
M1962D-PZL
CMO 20941
LGD 4557
M2062D-PZL 5. Click "Auto" tab and set as below
LGD 4813 6. Click "Run".
M2262D-PZL AUO 37581 7. After downloading, check "OK" message.
M2362D-PZL LGD 5069 (5)
M2062D-PZL CMO 5325
filexxx.bin
(6)
4.1 Download
1. Execute ISP program "Mstar ISP Utility" and then click
"Config" tab.
2. Set as below, and then click "Auto Detect" and check "OK"
message.
If display "Error", Check connect computer, jig, and set.
3. Click "Connect" tab.
If display "Can’t ", Check connect computer, jig, and set.
Copyright ©2009 LG Electronics. Inc. All right reserved. - 13 - LGE Internal Use Only
Only for training and service purposes
4.2 DOWNLOAD USB 4.3 ADC Process
1. Put the USB Stick to the USB socket
2. Automatically detecting update file in USB Stick EZ ADJUST Tool Optionaa :a 1229
Model Nameaa :a M2794DP-PZ
- If your downloaded program version in USB Stick is Low, it 1. Tool Optiona :a 1229 Inchaaa :a 27
didn’t work. 2. ADC CALIBRATION External : DTV Toolaaa :a Mx94DP
But your downloaded version is High, USB data is 3. ADC CALIBRATION Internal DSUB Portaa :a RGB 0 (NEW)
automatically detecting 4. ADC ADJUST Media Playeraa :a EMF-PM
5. W/B ADJUST HDMI Typeaa :a 3-HDMI
3. Show the message “Copying files from memory”
6. WHITE PATTERNa : OFF
OK to Download
7. EDID D.L aaaa DOWNLOAD:
Copyright ©2009 LG Electronics. Inc. All right reserved. - 14 - LGE Internal Use Only
Only for training and service purposes
1-1) Confirmation 4.4 Function Check
· We confirm whether “0xAA (RGB)” address of EEPROM 1) Check display and sound
“0xA2” is “0xAA” or not. · Check Input and Signal items. (cf. work instructions)
· If “0xAA (RGB)” address of EEPROM “0xA2” isn’t “0xAA”, we 1. TV
adjust once more 2. AV (SCART1/SCART2/CVBS)
· We can confirm the ADC values from “0xA4~0XA9 (RGB)” 3. COMPONENT (1080i)
addresses in a page “0xA2” 4. RGB (PC : 1360 x 768 @ 60Hz –M1962D)
(PC : 1600 x 900 @ 60Hz –M2062D) (PC : 1920 x 1080 @
*Manual ADC process using Service Remocon. After enter 60hz –M2262D&M2362D/M2762D)
Service Mode by pushing “ADJ” key, execute “4.ADC Adjust” by 5. DVI (PC : 1360 x 768 @ 60Hz –M1962D)
pushing “ ” key at “ADC CALIBRATION: RGB”. (PC : 1600 x 900 @ 60Hz –M2062D) (PC : 1920 x 1080 @
60hz –M2262D&M2362D/M2762D)
EZ ADJUST 4. ADC ADJUST 6. HDMI
7. PC Audio In
1. Tool Optiona :a 1261 MODEaaa : RGB
* Display and Sound check is executed by Remote controller.
2. ADC CALIBRATION External : Component
R-GAINaa : 115
3. ADC CALIBRATION Internal G-GAINaa : 114
4. ADC ADJUST B-GAINaa : 114
5. W/B ADJUST
6. WHITE PATTERNa : OFF R-OFFSETaa : 137 5. Total Assembly line process
G-OFFSETaa : 131
7. EDID D.L B-OFFSETaa : 137
5.1 Adjustment Preparation
· W/B Equipment condition
2) Component Gain/Offset Adjustment CA210: CH 9, Test signal: Inner pattern (85IRE)
· Convert to Component in Input-source · Above 5 minutes H/run in the inner pattern. (“power on” key of
· Signal equipment displays adjust remote control)
Impress Resolution 1080i · 15 Pin D-Sub Jack is connected to the AUTO W/B
MODEL: 223 in Pattern Generator(1080i Mode) EQUIPMENT.
PATTERN: 65 in Pattern Generator(MSPG-925 SERISE)*
X=0.285 (±0.003)
Cool 9,300k oK M1962D <Test Signal>
Y=0.293 (±0.003)
M2062D Inner pattern
Color X=0.295 (±0.003)
Medium 8,000k oK M2262D
Temperature Y=0.305 (±0.003)
M2362D (216gray,85IRE)
X=0.313 (±0.003)
Warm 6,500k oK M2762D
Y=0.329 (±0.003)
Cool Min : 120 Typ : 170
<Test Signal>
Medium Min : 120 Typ : 170 M1962D
Inner pattern
Luminance Warm Min : 120 Typ : 170
(cd/m2) Cool Min : 170 Typ : 220 M2062D
M2262D (216gray,85IRE)
Adjustment pattern (COMPONENT ) Medium Min : 170 Typ : 220 M2362D
Warm Min : 170 Typ : 220 M2762D
Copyright ©2009 LG Electronics. Inc. All right reserved. - 15 - LGE Internal Use Only
Only for training and service purposes
5.2 W/B condition 5.6 DDC EDID Write (HDMI 256Byte)
- Surrounding Temperature : 20 % ~ 80 % · Connect HDMI Signal Cable to HDMI Jack.
- Surrounding Temperature : 25±5 °C · Write EDID DATA to EEPROM(24C02) by using DDC2B
- warm-up Time : Under 5 Min protocol.
· Check whether written EDID data is correct or not.
* Manual W/B process using adjusts Remote control.
· After enter Service Mode by pushing “ADJ” key, 5.7 Serial number (RS-232C)
· Enter White Pattern off of service mode, and change off -> on. · press “Power on” key of service remocon.(Baud rate : 115200
· Enter “W/B ADJUST” by pushing " " key at “5. W/B ADJUST”. bps)
· Connect RS232 Signal Cable to RS-232 Jack.
EZ ADJUST MODEaaa : DTV · Write Serial number by use RS-232.
TEMPERATUREa : Cool
· Must check the serial number at the Diagnostics of SET UP
. ADC CALIBRATIONa : DTV
R-GAINaa : 192 menu. (Refer to below).
. ADC ADJUST G-GAINaa : 192
. SUB B/C ADJUST B-GAINaa : 192
. W/B ADJUST
R-OFFSETaa : 128
. WHITE PATTERNaa : Off G-OFFSETaa : 128
. 2HOUR OFFaa : Off B-OFFSETaa : 128
COPY ALL
Copyright ©2009 LG Electronics. Inc. All right reserved. - 16 - LGE Internal Use Only
Only for training and service purposes
N N
Check Power connector
Check P1101 All Replace Power board
Voltage Level (15V, 5V) OK ?
Y
N Replace IC1104 &
Check IC1104 output
- 17 -
Y
N Replace IC1107 &
Check IC1107 output
Voltage Level (5V) Recheck
TROUBLESHOOTING
Y
N
Check X101 Clock
1. Power- Up Boot Fail Trouble Shooting
Replace X101
12MHz
Y
Check P1103 N
IC100 has problem
- 18 -
#13, #14, #25, #26
Y
2. No OSD Trouble Shooting
- 19 -
Check Demodulator Input Clock N Replace X500
X500 (31.875MHz), X501(20.48MHz) Replace X501
Check P1103 N
Replace IC100 has problems
3. Digital TV Video Trouble Shooting
- 20 -
Check signal N Check R164,R144,R145
C121,C122,C123 C121,C122,C123
- 21 -
Check signal, Hsync, Vsync N
Replace R729, R730
(R729, R730)
(R158,R160,R162 C115,C117,C119
C115,C117,C119)
Y
- 22 -
Y
Check signal
N
6. AV Video Trouble Shooting
- 23 -
Check EDID NVRAM N
(IC902,IC903) Redownload EDID data or Replace IC901/IC902
Power & I2C Signal (#5, #6)
Y
N
7.HDMI Video Trouble Shooting
Replace Mstar(IC100)
- 24 -
And Check Audio Amp Power 12V L1002/ L1003
(IC1000)
Y
DTV/MNT_V_OUT
DTV/MNT_L/R_OPOUT RESET SYSTEM_I2C
LM324D
DTV/MNT_L/R_OUT
(IC600)
TV_L/R_OPOUT TV_L/R_OUT HDCP Key
SCART
SC1_CVBS_IN
Component
COMP_L/R_IN MSD237HFG
(Saturn4) KEY1/2
(IC100) LED_RED/Light SENSE
P401
XC5000 DRX3913K-XK
Tuner (IC500) IR / H.P JACK
I2C_D_TU (IC501) TU_TS_DATA/TU_ERROR P402
DTV_IF_P/N
- 25 -
H/phone_L/R_OUT TPA6132
(IC1002)
DDC_I2C/UART
24C02
DSUB
DSUB_R/G/B/H/V SP (L)
SPK_L/R_OUT TAS5709
(IC1000)
USB_DM/DP SP (R)
USB
BLOCK DIAGRAM
MAX3232
RS232 J1000
(IC700)
RS232C_TX/RX SPDIF_OUT
PC Audio OPTIC
TS_Serial
TS_Parallel
PCM_ADD
PCM_DATA
IN PC_L/R_IN
PCM_CD_ON
DVI_TMDS
I/O Expander (for Input Detection) I2C_EXPANDER
DVI-
DVI-D 24C02 HEADPHONE_DET
CVBS_V/L/R_IN S-VIDEO_DET
HDMI_TMDS
COMP_DET
HDMI_I2C CI Slot MSG1040
Composite
HDMI1_Rear 24C02 (P800) CVBS_DET (IC103)
USB_OCD
HDMI_TMDS
CI_CD_1/2 74LVC541A SCART1_DET
HDMI_I2C
(IC800)
HDMI2_Side 24C02 SCART2_DET
910
520
900
550
800
LV1
540
A2
810
530
200
122
120
302
500 501
511
300
510
301
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Only for training and service purposes