ZXONE 9700 Product Description

ZXONE 9700 Product
Description
ZXONE 9700 Product Description
© 2016 ZTE Corporation. All rights reserved.

ZTE CONFIDENTIAL: This document contains proprietary information of ZTE and is not to be disclosed or used
without the prior written permission of ZTE.
Due to update and improvement of ZTE products and technologies, information in this document is subjected to
change without notice.
ZTE Confidential Proprietary 1

TABLE OF CONTENTS
ZXONE 9700 Product Description ....................................................................................... 1
FIGURES 8
TABLES 10
1 Overview .......................................................................................................... 15
2 Highlights......................................................................................................... 17
2.1 Large Transmission Capacity ............................................................................. 17
2.2 400Gbit/s system ............................................................................................... 17
2.3 100Gbit/s system ............................................................................................... 17
2.4 40Gbit/s system ................................................................................................. 18
2.5 Advanced Technologies for Super Long Distance Transmission ........................ 19
2.6 ROADM Optical Scheduling ............................................................................... 19
2.7 Large-capacity Universal Switching ................................................................... 19
2.8 Powerful Service Access Capability ................................................................... 20
2.9 Complete Reliability Mechanism ........................................................................ 21
2.10 GMPLS-based Intelligence ................................................................................ 22
2.11 Energy-saving Green Network ........................................................................... 22
3 System Architecture ........................................................................................ 23

3.1 Overall System Architecture ............................................................................... 23
3.2 Network Element Configuration.......................................................................... 25
3.2.1 Optical Termination Multiplexer (OTM) ............................................................... 25
3.2.2 Fixed Optical Add/Drop Multiplexer (FOADM) .................................................... 25
3.2.3 Reconfigurable Optical Add/Drop Multiplexer (ROADM) .................................... 26
3.2.4 Optical Line Amplifier (OLA) ............................................................................... 27
4 Hardware Architecture .................................................................................... 28

4.1 Rack .................................................................................................................. 28
4.2 Sub-rack ............................................................................................................ 29
4.2.1 Transmission Sub-rack ...................................................................................... 29
4.2.2 Distributed cross-connect Sub-rack ................................................................... 31
4.2.3 Switching Sub-rack ............................................................................................ 33
4.3 Boards ............................................................................................................... 42
4.3.1 Optical Transponder and Muxponder ................................................................. 42
4.3.2 Client-side Board ............................................................................................... 46
4.3.3 Line-side Board .................................................................................................. 50
4.3.4 Switching Board ................................................................................................. 52
4.3.5 Optical Multiplexing and Demultiplexing Board .................................................. 53
2 ZTE Confidential Proprietary

4.3.6 Fixed OADM Board ............................................................................................ 54

4.3.7 Dynamic OADM Board ....................................................................................... 54
4.3.8 OA (Optical Amplifier) Board .............................................................................. 55
4.3.9 System control, supervision and communication board ...................................... 58
4.3.10 OSC board ......................................................................................................... 58
4.3.11 Clock board........................................................................................................ 58
4.3.12 Protection board ................................................................................................ 59
4.3.13 Performance supervision board ......................................................................... 60
5 Software structure ........................................................................................... 61

5.1 Board software ................................................................................................... 62
5.2 SNP/NCPK/CCPK software ............................................................................... 62
5.3 NM software....................................................................................................... 64
5.4 Communication protocol and interface ............................................................... 65
6 Product characteristics................................................................................... 66
6.1 Transmission function ........................................................................................ 66
6.1.1 Transport capacity ............................................................................................. 66
6.1.2 Transport distance ............................................................................................. 66
6.1.3 Working wavelength........................................................................................... 72
6.2 Optical-layer Dispatching ................................................................................... 75
6.2.1 Two-degree (in the ring) wavelength dispatching ............................................... 76
6.2.2 Multi-degree dispatching .................................................................................... 78
6.3 Electrical-layer dispatching ................................................................................ 81
6.4 L2 switching ....................................................................................................... 82
6.5 MPLS-TP Function list ....................................................................................... 84
6.6 Optical Power Amplification ............................................................................... 90
6.6.1 Erbium-Doped Fiber Amplifier ............................................................................ 90
6.6.2 Raman Amplification Technology ....................................................................... 90
6.7 Forward Error Correction ................................................................................... 90
6.8 Tunable Wavelength .......................................................................................... 91
6.9 Optical Layer Protection Service ........................................................................ 91
6.9.1 OCH 1+1 Protection ........................................................................................... 91
6.9.2 OMS 1+1 Protection........................................................................................... 92
6.10 Electrical Layer Protection ................................................................................. 93
6.10.1 ODUk Channel 1+1 Protection (ODUk-SNCP) ................................................... 93
6.11 Dispersion Management .................................................................................... 94
6.12 Automatic Power Shutdown/Reduction .............................................................. 95
6.13 Optical Power Management ............................................................................... 96
6.13.1 LAC/VOA SFP Service....................................................................................... 96
6.13.2 AGC Service ...................................................................................................... 96
6.14 Automatic Performance Optimization (APO) ...................................................... 96

6.14.1 OMS Layer APO Management........................................................................... 97

6.14.2 OCH Layer APO Management ........................................................................... 97
6.15 Performance Inspection ..................................................................................... 98
6.16 Integrated Wavelength Monitoring ..................................................................... 99
6.17 Communication and Monitoring........................................................................ 100
6.17.1 Optical Monitoring Channel .............................................................................. 100
6.17.2 Electrical Supervisory Channel ........................................................................ 101
6.18 Time/Clock Synchronization Service ................................................................ 101
6.18.1 Clock Synchronization ..................................................................................... 103
6.18.2 Time Synchronization ...................................................................................... 103
6.19 Alarm Inspection Service ................................................................................. 104
6.19.1 Input and Output External Alarm ...................................................................... 104
6.19.2 Internal Alarm Inspection Service ..................................................................... 105
6.19.3 PRBS Function ................................................................................................ 105
6.20 VC Switching ................................................................................................... 106
7 WASON........................................................................................................... 108
7.1 Overview .......................................................................................................... 108
7.2 WASON Functionality ...................................................................................... 109
7.2.1 Automatic Discovery ........................................................................................ 109
7.2.2 Route Wavelength Assignment ........................................................................ 110
7.2.3 Control Plane Signaling and Routing................................................................ 112
7.2.4 Protection & Restoration on Control Plane ....................................................... 114
7.2.5 Fast End to End Service Configuration ............................................................ 116
7.2.6 SRLG Management ......................................................................................... 117
7.2.7 Multi-layer LSP Control ............................................................................................. 118
7.2.8 UNI interface .................................................................................................... 118
7.2.9 E-NNI interface ................................................................................................ 119
7.2.10 Inter-domain Routing ....................................................................................... 119
7.2.11 PCE ................................................................................................................. 120
7.2.12 OTN Control..................................................................................................... 120
7.2.13 CP Graceful Restart Service ............................................................................ 121
7.2.14 CP 1+1 Backup ................................................................................................ 121
7.2.15 Maintenance .................................................................................................... 121
8 Software Defined Optical Network (SDON) .................................................. 122

8.1 Overview .......................................................................................................... 122
8.2 Architecture of ZTE SDON ............................................................................... 123
8.3 Smooth Evolution Path .................................................................................... 124
8.4 Multiple Application Scenarios for Operators.................................................... 125
8.4.1 Providing enterprise private line services as required ...................................... 125
8.4.2 Virtual subnet multiple lessee service .............................................................. 125

8.4.3 Multi-layer multi-domain network interworking and coordination....................... 126

8.4.4 Network management and operation automation ............................................. 126
9 Technical Specifications ............................................................................... 126

9.1 Optical Transponder Specifications .................................................................. 126
9.1.1 EOTU10GB Specifications ............................................................................... 126
9.1.2 MOM2 Specifications ....................................................................................... 129
9.1.3 MOM2B Specifications ..................................................................................... 131
9.1.4 ASMB/SOG2 Specifications ............................................................................. 132
9.1.5 TST3 specifications.......................................................................................... 133
9.1.6 MQT3 Specifications ........................................................................................ 136
9.1.7 TS4 Specification ............................................................................................. 138
9.1.8 MX2 Specifications .......................................................................................... 141
9.1.9 TD4 Specifications ........................................................................................... 143
9.1.10 MQ4/S and MQ4/D Specifications .................................................................... 145
9.1.11 TD2C/TS2C/TS2CP Specifications .................................................................. 147
9.1.12 MQA1 Specifications........................................................................................ 149
9.1.13 MQA2 Specifications........................................................................................ 150
9.1.14 MJA Specifications........................................................................................... 152
9.1.15 MHE1 Specifications ........................................................................................ 153
9.2 Client-side Board Specifications....................................................................... 154
9.2.1 C1K×4/ C1K×8/C1K×16 Specifications ............................................................ 154
9.2.2 C2K×4/C2K×8/ C2K×10/C2K×12/ C2K×20 Specifications................................ 156
9.2.3 C3K×1/C3K×2 Specifications ........................................................................... 157
9.2.4 C4L×4/C4K×2/ C4K×1 Specifications .............................................................. 161
9.2.5 PGEKx12 Specification .................................................................................... 162
9.2.6 PXGKx12 Specification .................................................................................... 162
9.2.7 PXLGK Specification........................................................................................ 163
9.2.8 PCGK Specification ......................................................................................... 164
9.2.9 E2Kx20 Specification ....................................................................................... 165
9.2.10 E4Kx2 Specification ......................................................................................... 166
9.3 Line-side Board Specifications ......................................................................... 167
9.3.1 L2K×4/ L2K×8/ L2K×10/ L2K×12 Specifications............................................... 167
9.3.2 L4L×1 Specifications ........................................................................................ 168
9.3.3 L4K×1/ L4K×2 and L4K×4 Specifications ......................................................... 169
9.3.4 L4L×2 Specifications ........................................................................................ 171
9.3.5 LB4Kx1/2 and LB4Kx1/1 Specifications ........................................................... 172
9.3.6 LB2L x1 Specifications ..................................................................................... 173
9.3.7 H4K Specifications ........................................................................................... 174
9.4 Mux/DeMux Board Specifications .................................................................... 175
9.4.1 OMU Specifications ......................................................................................... 175
9.4.2 VMUX Specifications ....................................................................................... 176

9.4.3 VMUXB Specifications ..................................................................................... 177

9.4.4 ODU Specifications .......................................................................................... 178
9.4.5 ODUB Specifications ....................................................................................... 179
9.4.6 OCI Specifications ........................................................................................... 180
9.4.7 OBM Specifications.......................................................................................... 181
9.5 Optical Add/Drop Multiplexing Board Specifications ......................................... 181
9.5.1 SOGMD Specifications .................................................................................... 181
9.5.2 SOGMDB Specifications .................................................................................. 182
9.5.3 SOGMDC Specifications .................................................................................. 183
9.5.4 SOADC Specifications ..................................................................................... 183
9.5.5 SOAD Specifications........................................................................................ 184
9.6 ROADM Board Specifications .......................................................................... 185
9.6.1 PDU Specifications .......................................................................................... 185
9.6.2 WSU Specifications ......................................................................................... 186
9.6.3 WSUB Specification ......................................................................................... 188
9.6.4 MSU Specification............................................................................................ 189
9.7 Optical Power Amplification Board Specifications ............................................ 190
9.7.1 SEOBA Specifications ..................................................................................... 190
9.7.2 SEOPA Specifications ..................................................................................... 192
9.7.3 SOBA Specifications ........................................................................................ 194
9.7.4 SOPA Specifications ........................................................................................ 195
9.7.5 EOBAH (Enhanced Optical Booster Amplifier) Specifications .......................... 198
9.7.6 EONA (Enhanced Optical Node Amplifier) and M2EONA Specifications .......... 199
9.7.7 HNA Specifications .......................................................................................... 204
9.7.8 RAMAN Specifications ..................................................................................... 207
9.7.9 RPOA Specifications........................................................................................ 210
9.7.10 LAC Specifications ........................................................................................... 211
9.7.11 SFP VOA Specifications .................................................................................. 211
9.8 Protection Board Specifications ....................................................................... 213
9.8.1 SOP Specifications .......................................................................................... 213
9.9 Optical Supervisory Channel Board Specifications........................................... 214
9.10 Optical Layer Management Subsystem Specifications ..................................... 214
9.10.1 EOPM Board (type B) Specifications................................................................ 214
9.10.2 EOPM Board (type CS) Specifications ............................................................. 215
9.10.3 EOPM Board (type MS) Specifications ............................................................. 216
9.10.4 EOPM Board (type B1S) Specifications ........................................................... 216
9.10.5 EOWM Board Specifications ............................................................................ 217
9.10.6 OFM Board Specifications ............................................................................... 217
9.10.7 EOFM Board Specifications ............................................................................. 218
9.10.8 SOFM Board Specifications ............................................................................. 218
9.10.9 OFMF Board Specifications ............................................................................. 219
9.10.10 EOFMF Board Specifications ........................................................................... 220

9.10.11 SOFMF Board Specifications ........................................................................... 220

9.11 DCM Specifications.......................................................................................... 221
9.12 Physical Specification and Environmental Requirements ................................. 222
9.12.1 Structure Indices .............................................................................................. 222
9.12.2 Power Supply Indices ...................................................................................... 231
9.12.3 Heat Dissipation ............................................................................................... 239
9.13 Grounding Requirements ................................................................................. 239
9.13.1 Internal grounding requirements of the equipment ........................................... 239
9.13.2 Grounding requirements of equipment room .................................................... 240
9.14 Temperature and Humidity Requirements ........................................................ 240
9.15 Requirements for Cleanness ............................................................................ 241
9.16 Dust-Proof and Corrosion-Proof Requirements ................................................ 242
10 Compliant Standards .................................................................................... 243
11 Abbreviations ................................................................................................ 251

FIGURES
Figure 1-1 Architecture of ZXONE 9700 equipment ...........................................................15

Figure 3-1 Functional diagram of ZXONE 9700 .................................................................23
Figure 3-2 Functional diagram of OTM...............................................................................25
Figure 3-3 Functional diagram of FOADM..........................................................................26
Figure 3-4 Functional diagram of ROADM .........................................................................27
Figure 3-5 Functional diagram of OLA ...............................................................................27
Figure 4-1 Appearance of ZXONE 9700 rack (300mm) ......................................................28
Figure 4-2 Appearance of ZXONE 9700 rack (600mm) ......................................................29
Figure 4-3 Structure of transmission sub-rack (NX41-21 inch) ...........................................30
Figure 4-4 Structure of transmission sub-rack (NX41-19 inch) ...........................................30
Figure 4-5 Structure of distributed cross-connect sub-rack (DX41-21 inch)........................32
Figure 4-6 Structure of distributed cross-connect sub-rack (DX41-19 inch)........................32
Figure 4-7 Structure of S1 switching sub-rack ....................................................................34
Figure 4-10 Structure of S6 switching sub-rack ..................................................................40
Figure 4-11 EOFM4/8, OFM4/8 internal structure ..............................................................61
Figure 4-12 OFMF/EOFM internal structure .......................................................................61
Figure 5-1 ZXONE 9700 software structure .......................................................................62
Figure 5-2 NM software structure .......................................................................................64
Figure 6-1 WSUD-based two-degree ROADM sites ...........................................................77
Figure 6-2 Multi-degree ROADM structure (colored and directional) ..................................78
Figure 6-3 Multi-degree ROAD structure (colorless and directionless) ...............................79
Figure 6-4 Multi-degree ROADM structure (colorless and directionless and gridless) ........80
Figure 6-5 Multi-degree ROAD structure (CDC-F Structure) ..............................................81
Figure 6-6 Working principle of ZXONE 9700 L2 switching ................................................82
Figure 6-7 Channel 1+1 Protection ....................................................................................92

Figure 6-8 OMS 1+1 Protection (EDFA in redundant mode) ..............................................92

Figure 6-9 OMS 1+1 Protection (EDFA in shared mode) ...................................................93
Figure 6-10 ODUk Channel 1+1 Protection ........................................................................94
Figure 6-11 Configuration of Dispersion Compensation .....................................................95
Figure 6-12 Wavelength Monitoring Subsystem ...............................................................100
Figure 6-13 PRBS Test Principle .....................................................................................106
Figure 6-14 VC cross-connect solution ............................................................................106
Figure 7-1 Positioning of the Control Platform in Optical Transmission Network ..............108
Figure 7-2 Route selection ...............................................................................................111
Figure 7-3 Wavelength assignment..................................................................................111
Figure 7-4 SPC Creation ..................................................................................................117
Figure 7-5 Shared Link Group Service .............................................................................118
Figure 8-1 Architecture of ZTE SDON ..............................................................................123
Figure 8-2 Optical network control plane evolution .............................................................124

TABLES
Table 2-1 ZXONE 9700 switching capability ......................................................................20

Table 2-2 Service access capability of ZXONE 9700 equipment ........................................20
Table 2-3 Protection mechanism of ZXONE 9700 equipment ............................................21
Table 4-1 Slots description of S1 switching sub-rack .........................................................34
Table 4-5 Main functions of optical transponder board .......................................................43
Table 4-6 Functions of client boards ..................................................................................47
Table 4-7 Functions of line board .......................................................................................50
Table 4-8 ZXONE 9700 multiplexing OMU board ...............................................................53
Table 4-9 ZXONE 9700 multiplexing ODU board ...............................................................54
Table 4-10 OA types ..........................................................................................................56
Table 5-1 ZXONE 9700 software system interface ............................................................65
Table 6-1 Transmission Codes Supported by 40 2.5Gbit/s System (G.652&G.655) .........66
Table 6-2 Transmission Codes Supported by 16/40 2.5Gbit/s System (G.653) ................67
Table 6-3 Transmission Codes Supported by 40  10Gbit/s System (G.652&G.655) .........67
Table 6-5 Transmission Codes Supported by 16/40 10Gbit/s System (G.653) .................68
Table 6-6 Transmission Codes Supported by 40 40Gbit/s System (G.652&G.655) ..........68
Table 6-8 Transmission Codes Supported by 16/40 40Gbit/s System (G.653) .................69
Table 6-9 Transmission Codes Supported by 80  100Gbit/s System (G.652 with DCM) ..69
Table 6-10 Transmission Codes Supported by 80  100Gbit/s System (G.652 without DCM)
.............................................................................................................................................70
Table 6-11 Transmission Codes Supported by 80  100Gbit/s System (G.655 with DCM).70

.............................................................................................................................................70
Table 6-13 Transmission Codes Supported by 16/40 100Gbit/s System (G.653) .............71
.............................................................................................................................................71
.............................................................................................................................................71
Table 6-16 Wavelength distribution of 80-wavelength system (50GHz spacing) at band C ...72
Table 6-17 Wavelength distribution of 106-wavelength system (53×400G, 37.5GHz spacing)
at band C..............................................................................................................................73
Table 6-18 ZXONE 9700 L2 function .................................................................................83
Table 6-19 ZXONE 9700 MPLS-TP function list.................................................................84
Table 6-20 Clock Transmission Manner ...........................................................................103
Table 6-21 List of Alarm Inspected by ZXONE 9700 ........................................................105
Table 7-1 Service Level Agreement .................................................................................114
Table 9-1 Technical specifications of 10Gbit/s board at Client-side..................................127
Table 9-2 Technical specifications of 10Gbit/s board at Line-side ....................................128
Table 9-3 Technical specifications of MOM2 board ..........................................................129
Table 9-4 Technical specifications of MOM2B board .......................................................131
Table 9-5 Technical specifications of ASMB/SOG2 board ...............................................132
Table 9-6 Technical specifications of TST3 board at Client-side ......................................133
Table 9-7 Technical specifications of TST3 board at Line-side ........................................134
Table 9-8 Technical specifications of MQT3 board at Client-Side ....................................136
Table 9-9 Technical specifications of MQT3 board at Line-side .......................................137
Table 9-10 Technical specifications of TS4 board at Client-side ......................................139
Table 9-11 Technical specifications of TS4 board at Line-side.........................................140
Table 9-12 Technical specifications of MX2 board at Client-Side .....................................141
Table 9-13 Technical specifications of MX2 board at Line-side ........................................142
Table 9-14 Technical specifications of TD4 board at Client-Side .....................................143
Table 9-15 Technical specifications of TD4 board at Line-side ........................................144
Table 9-16 Technical specifications of MQ4 board at Client-Side.....................................145

Table 9-17 Technical specifications of MQ4/S and MQ4/D board at Line-side .................146
Table 9-18 Technical specifications of TD2C/TS2C/TS2CP board ...................................147
Table 9-19 Technical specifications of MQA1 board ........................................................149
Table 9-20 Technical specifications of MQA2 board ........................................................150
Table 9-21 Technical specifications of MJA board ...........................................................152
Table 9-22 Technical Specifications of MHE1 Board ......................................................153
Table 9-23 Technical specifications of C1K× 16 board ....................................................154
Table 9-24 Technical specifications of C2K×4/C2K×8/C2K×12/ C2K×20 board ...............156
Table 9-25 Technical specifications of C3K×2 board for 40GBASE-LR4 ............................157
Table 9-26 Technical specifications of C3K×2 board for 40G POS ..................................160
Table 9-27 Technical specifications of C4L×4/C4K×2/ C4K×1 board ...............................161
Table 9-28 Technical specifications of PGEKx12 board ...................................................162
Table 9-29 Technical specifications of PXGK x12 board ..................................................162
Table 9-30 Technical specifications of PXLGK board.......................................................163
Table 9-31 Technical specifications of PCGK board ........................................................164
Table 9-32 Technical specifications of E2Kx20 board ......................................................165
Table 9-33 Technical specifications of E4Kx2 board ........................................................166
Table 9-34 Technical specifications of L2K×4/ L2K×8/ L2K×12 board..............................167
Table 9-35 Technical specifications of L4L×1 board ........................................................168
Table 9-36 Technical specifications of L4K×1/ L4K×2 board ............................................169
Table 9-37 Technical specifications of L4K×4 board ........................................................170
Table 9-38 Technical specifications of L4L×2 board ........................................................171
Table 9-39 Technical specifications of LB4Kx1/2 and LB4Kx1/1 board ............................172
Table 9-40 Technical specifications of LB2Lx1 board ......................................................173
Table 9-41 Technical specifications of H4K board ...........................................................174
Table 9-42 Technical specifications of OMU board ..........................................................175
Table 9-43 Technical specifications of VMUX board ........................................................176
Table 9-44 Technical specifications of VMUXB board ......................................................177
Table 9-45 Technical specifications of ODU board ..........................................................178
Table 9-46 Technical specifications of the ODUB board ..................................................179

Table 9-47 Technical specifications of the OCI board (100GHz-50GHz) ..........................180

Table 9-48 Technical specifications of the OCI board (50GHz-25GHz) ............................180
Table 9-49 Technical specifications of the OBM board ....................................................181
Table 9-50 Technical specifications of SOGMD board........................................................182
Table 9-51 Technical specifications of SOGMDB board ...................................................182
Table 9-52 Technical specifications of SOGMDC board .....................................................183
Table 9-53 Technical specifications of SOADC board ........................................................183
Table 9-54 Technical specifications of SOAD board ........................................................184
Table 9-55 Technical specifications of PDU-5-4 board.....................................................185
Table 9-56 Technical specifications of PDU-9-2 board.....................................................185
Table 9-57 Technical specifications of PDUB-16 board ...................................................186
Table 9-58 Technical specifications of WSUD board........................................................186
Table 9-59 Technical specifications of WSUA board ........................................................187
Table 9-60 Technical specifications of WSUBD9D board and WSUBA9D board .............188
Table 9-61 Technical specifications of WSUBA9P9D board.............................................188
Table 9-62 Technical specifications of WSUBT20D board ...............................................189
Table 9-63 Technical specifications of MSU board ..........................................................189
Table 9-64 Technical specifications of 40/80-channel SEOBA Board (C- Band) ..............190
Table 9-65 Technical specifications of 40/80-channel SEOPA Board (C-band)................192
Table 9-66 Technical specifications of 40/80-channel SEOPA Board (C-band)................193
Table 9-67 Technical specifications of 40/80-channel SOBA Board (C- Band).................194
Table 9-68 Technical specifications of 40/80-channels SOPA Board (C-band) ...................195
Table 9-69 Technical specifications of 40/80-channels SEOPA Board (C-band) ................196
Table 9-70 Technical specifications of 40/80-channel EOBAH Board (C- Band) ..............198
Table 9-71 Technical specifications of 40/80-channel EONA with DCM ...........................199
Table 9-72 Technical specifications of 40/80-channel M2EONA without DCM .................201
Table 9-73 Technical specifications of 40/80-channel M2EONA with DCM ......................202
Table 9-74 Technical Specifications of the HNA2020-WO Board .......................................204
Table 9-75 Technical Specifications of the HNA2620-W Board ..........................................205
Table 9-76 Technical Specifications of the HNA2620-WO Board .......................................206

Table 9-77 Technical specifications of RAMAN_P amplifier .............................................207

Table 9-78 Technical specifications of RAMAN_B amplifier .............................................208
Table 9-79 Technical specifications of high power pump RAMAN_P amplifier .................209
Table 9-80 Technical specifications of high power pump RAMAN_B amplifier .................209
Table 9-81 Technical specifications of RPOA amplifier.......................................................210
Table 9-82 Technical specifications of LAC board ...........................................................211
Table 9-83 Technical specifications of SFP VOA modules ...............................................211
Table 9-84 Technical specifications of SOP board ...........................................................213
Table 9-85 Technical specifications of OSC board ...........................................................214
Table 9-86 Technical Specifications of the EOPM Board (type B) (50 GHz) .......................214
Table 9-87 Technical Specifications of the EOPM Board (type B) (100 GHz) .....................215
Table 9-88 Technical Specifications of the EOPM (type CS) Board ....................................215
Table 9-89 Technical Specifications of the EOPM (type MS) Board ...................................216
Table 9-90 Technical Specifications of the EOPM (type B1S) Board ..................................216
Table 9-91 Technical Specifications of the EOWM Board ................................................217
Table 9-92 Technical Specifications of the OFM Board ....................................................217
Table 9-93 Technical Specifications of the EOFM Board .................................................218
Table 9-94 Technical Specifications of the SOFM Board .................................................218
Table 9-95 Technical Specifications of the OFMF Board .................................................219
Table 9-96 Technical Specifications of the EOFMF Board ...............................................220
Table 9-97 Technical Specifications of the SOFMF Board ...............................................220
Table 9-98 Technical specifications of DCM module (G.652 fiber) ...................................221
Table 9-99 Technical specifications of DCM module (G.655 LEAF fiber) .........................222
Table 9-100 Dimensions and Weight of ZXONE 9700 .....................................................222
Table 9-101 ZXONE 9700 Board Weight .........................................................................224
Table 9-102 The power supply of ZXONE 9700 .................................................................231
Table 9-103 board power consumption of ZXONE 9700 equipment .................................232
Table 9-104 Temperature and humidity requirements of ZXONE 9700 Equipment ..........240
Table 9-105 Requirements for concentrations of mechanical active substances ..............241
Table 9-106 Requirements for concentrations of chemical active substances ..................241

1 Overview
ZXONE 9700 equipment is large-capacity WDM/OTN/PACKET/TDM switching
equipment, orienting to future and responding IP service bearing needs. It can realize
dynamic optical layer connection and flexible electrical layer switching with the features
of high integration, high reliability and integrated GMPLS control plane.
ZXONE 9700 equipment is mainly applied in backbone core layer and metro area
backbone network. It can also be applied in metro area aggregation layer to meet
operators’ transmission of large-granularity data service, flexible scheduling and service
management monitoring needs.
The architecture of ZXONE 9700 equipment is shown as Figure 1-1
Figure 1-1 Architecture of ZXONE 9700 equipment
OCH Switch
Optical layer
Drop Unit ADD Unit

WASON/NMS
Line-side Unit
OTU and Muxponder
Universal Switch
Electrical layer L2 Switch
Client-side Unit
ZXONE 9700 equipment has service grooming function in both optical and electrical
layers:
 Optical layer provides FOADM (Fixed Optical Add/Drop Multiplexer) and ROADM

(Reconfigurable Optical Add/Drop Multiplexer) based on the support for ROADM

optical layer wavelength service grooming.
 Electrical layer covers ODUk electrical switching, Packet switching and TDM
switching.

2 Highlights
2.1 Large Transmission Capacity
Based on iOTN platform, ZTE launches 100G and beyond 100G oriented brand-new
universal switching equipment – the ZXONE 9700 series product, which supports
10G/40G/100G/400G transmission rate. ZXONE 9700 system supports
8010G/40G/100G and 53400G large capacity transmission. 80-wavelength system
adopts C band of 50GHz channel spacing, supporting smooth upgrade from 40 to 80
wavelengths. Modular upgrade can effectively reduce the initial network building cost
and protect customers’ investment.
2.2 400Gbit/s system
By the advanced design, the ZXONE 9700 provides up to 400G bandwidth of a single
slot, which can be configured with 400G line card directly, providing larger bearing
capacity.
When the system is adopted 400G/300G/200G for line side, which can be configured
with two sub-carriers PM-16QAM, two sub-carriers PM-8QAM and two sub-carriers
PM-QPSK programmable. Two sub-carriers PM-16QAM for 400G can reach over
1200KM without REG with 75GHZ spacing, and the maximum capacity is 21.2T with 53
400G channels.
2.3 100Gbit/s system
ZXONE 9700 can support single 100Gbit/s system, and has following features:
 Support 80 wavelengths
Support 80100GE transmission and the capacity of at most 8T.
 PM-QPSK Coherent Rx modulation for ULH transmission

PM-QPSK Coherent Rx coding with SD-FEC has good OSNR tolerance. It can
rd
reach over 5000KM without REG using 3 generation SD-FEC technology, which
adopts 25% overhead.
PM-QPSK Coherent Rx coding with SD-FEC can reach over 3000KM without REG
with 50GHZ spacing.
PM-QPSK Coherent Rx coding with HD-FEC can reach over 2500KM without REG
with 50GHZ spacing.
 Embedded high-speed DSP technology realizes the compensation of dispersion

and PMD, so that the additional boards of PMD and CD compensation are reduced.
PM-QPSK coding can restrain the non-linear effect well. With DSP technology, the
PMD tolerance can support 30ps/60ps(with 2dB OSNR penalty) and CD tolerance
can support +/-70000ps/nm.
2.4 40Gbit/s system
ZXONE 9700 can support single 40Gbit/s system, and has following features:
 Support 80 wavelengths
Support 8040G transmission and the capacity of at most 3.2T.
 P-DPSK, RZ-DQPSK and PM-QPSK modulation for ULH transmission
Improved DPSK has good OSNR tolerance and can restrain the non-linear effect
well. It can reach 1500KM without the REG with 50GHZ spacing.
RZ-DQPSK has good PMD tolerance and can restrain the non-linear effect well. It
can reach 2000KM without the REG with 50GHZ spacing.
PM-QPSK with coherent detection has 60ps PMD tolerance and +/- 50000 ps/nm
CD tolerance. It can reach 2000KM without the REG with 50GHZ spacing.
 Embedded TODC and EDFA and the same dispersion tolerance & power budget as
10G system.

OTU board is embedded with TODC and EDFA, the system allows the biggest
dispersion tolerance of -1000ps/nm ~+1000ps/nm, and the dispersion tolerance &
power budget are the same as 10G system.
2.5 Advanced Technologies for Super Long Distance

Transmission
ZXONE 9700 equipment adopts Forward Error Correction (FEC), Advanced Forward
Error Correction (AFEC), Soft Decision FEC (SD-FEC), Electrical Return-to-Zero (ERZ)
and adaptive receiver etc, which improves the OSNR tolerance. It extends transmission
distance of linear system by RAMAN amplifier/high-power EDFA, high-power EDFA, and
remote pump RPOA.
2.6 ROADM Optical Scheduling
ZXONE 9700 adopts flexible wave filter design to realize flexible add/drop of 1 to 80
wavelength with 50GHz channel spacing, and support adjustable channel
spacing(Gridless, n × 12.5GHz). It provides complete ROADM solution based on
Wavelength Selective Switch (WSS). It has wavelength add/drop, pass-through and
broadcast, and optical channel power balancing functions, and support remotely
reconfigurable add/drop with 100% wavelength. WSS-based ROADM node supports up
to 20 directions. It can be flexibly configured as different combination of colored,
directional, colorless, and directionless based on customers’ needs, and can be
configured contentionless or gridless/flexible according to the requirement as well. At the
same time modular design of ROADM supports smooth upgrade of wavelength and
dimension, which reduces initial network building cost and protects customers’
investment.
2.7 Large-capacity Universal Switching
ZXONE 9700 equipment can provides 4 types of electrical switching sub-racks(S1, S2,
S3 and S6), which can implements ODU0/1/2/2e/3/4/flex/packet/VC based centralized

non-blocking cell switching and realize flexible service scheduling in electrical layer. At
the same time, client-side and line-side are separated. They share the line bandwidth
and effectively improve network bandwidth utilization.
 Client-side board or line-side board can be flexibly added or deleted based on

practical needs to protect operators’ investment.
 Client-side and line-side boards can be combined flexibly. Network spare parts
types can be reduced from M×N to M+N (M is client-side board and N is line-side
board, M, N>2) to reduce CapEx.
 Client-side and line-side boards are separated, which can improve flexible
scheduling and reduce OAM pressure.
Table 2-1 ZXONE 9700 switching capability
Model Switching Switching Granularity

Capacity
S1 Switching 4.4T ODU0/1/2/2e/3/4/flex/pac

Sub-rack ket/VC
S2 Switching 9.2T ODU0/1/2/2e/3/4/flex/pac

Sub-rack ket/VC
S3 Switching 7.2T/14.4T ODU0/1/2/2e/3/4/flex/pac

Sub-rack ket/VC
S6 Switching 14.4T/28.8T ODU0/1/2/2e/3/4/flex/pac

Sub-rack ket/VC
2.8 Powerful Service Access Capability
ZXONE 9700 equipment adopts an open design to access service signals with different
rates and formats.
Table 2-2 Service access capability of ZXONE 9700 equipment
Service Service type
SDH/POS/ATM STM-1, STM-4, STM-16, STM-64, STM-256

Service Service type
SONET OC-3, OC-12, OC-48, OC-192, OC-768
Ethernet FE, GE, 10GE WAN, 10GE LAN,40GE,100GE
SAN storage FC100, FC200, FC400, FC800, FC1200
ESCON
FICON, FICON Express
OTN OTU1, OTU2, OTU2e, OTU3, OTU4
Video and other services DVB-ASI, SDI, FDDI
CPRI CPRI 2/3/4/5/6/7
ZXONE 9700 system can implement multiplexing/demultiplexing between low rate

customer signals and high rate system signals so as to realize highly-efficient
transmission of sub-rate services.
2.9 Complete Reliability Mechanism
ZXONE 9700 equipment provides complete network-level protection and

equipment-level protection.
Table 2-3 Protection mechanism of ZXONE 9700 equipment
Optical layer protection Optical channel 1+1 protection

(switching time <50ms),
multiplexing 1+1 protection
(Switching time <50ms)
Electrical layer Sub-wavelength channel 1+1 protection

Network-level
protection or 1+1+1 protection
protection
(Switching time <50ms)
L2 protection Ethernet Smart Ring (ESR)
GMPLS control
plane-based protection
and restoration
control board 1+1 protection, power

Equipment-level
supply 1+1 protection, clock 1+1
protection
protection, and sub-rack connection 1+1

protection
switching board cubic (M+N) protection

(Switching time <50ms): Any two of
hardware fault, fabric offline or bus fault
etc.
Insertion, replacement and removal of

modules while the equipment is powered
up without affecting traffic and damaging
any module.
2.10 GMPLS-based Intelligence
ZXONE 9700 supports loading of WASON based on GMPLS. It realizes optical and
electrical dual intelligent plane. It implements automatic discovery of network resource
and topology, service grooming, and traffic control etc. to cut service deployment time.
It provides various protection/restoration solutions based on SLA (Service Level

Agreement) to defend against multi-point failure and enhance network reliability and
improve network resource utilization.
2.11 Energy-saving Green Network
ZXONE 9700 equipment adopts many measures to reduce equipment power

consumption and space, so as to help the operators to build a green network.
 Average power consumption for 10Gbit/s bandwidth is about 10W
 High integration: up to 4*100Gbit/s, 20×10Gbit/s and 16×2.5Gbit/s for a single slot
 System core chips are 45nm/40nm/28nm which reduces consumption to the best.
 Low consumption optical XFP/CFP/CFP2/CFP4 model is adopted.

3 System Architecture
3.1 Overall System Architecture
The functional diagram of ZXONE 9700 is shown in Figure 3-1
Figure 3-1 Functional diagram of ZXONE 9700
ZXONE 9700 has hardware system and network management software system, which
cooperate with each other but work independently. ZXONE 9700 hardware system
includes optical forwarding platform, service aggregation platform, add/drop wavelength
division multiplexing platform, optical amplifying platform, protection platform and
monitoring platform.
 Optical transfer platform
It adopts optical/electrical/optical conversion to implement conversion between service

signal and line signal wavelength. Line-side signals meet G.692 and G.709 requirements
after signal wavelength conversion.
 Service aggregation platform
It aggregates multiple low-rate signals to one wavelength, or disaggregates a high-rate

signal on a wavelength into multiple low-rate signals.
 Add/drop multiplexing/demultiplexing platform
Add/drop multiplexing platform implements add/drop and multiplexing of line optical

signal wavelength. The equipment can be divided into Fixed Optical Add/Drop
Multiplexer (FOADM) and Reconfigurable Optical Add/Drop Multiplexer (ROADM) based
on the fact whether the add/drop wavelength is fixed.
Multiplexing/demultiplexing platform completes multiplexing and demultiplexing of line

optical signals.
 Multiplexing: coupling multiple optical signals with different wavelength from

optical forwarding platform and service aggregation platform into one fiber
for output.
 Demultiplexing: separate line optical signals from optical amplifying platform

based on different wavelength channels and send them into different optical
forwarding platforms and service aggregation platforms respectively.
 Optical Amplifying Platform
It takes attenuation compensation for long-distance transmitted optical signal by optical

amplifying. It usually locates behind multiplexing platform, before demultiplexing platform,
and at the intermediate position of line transmission.
 Protection Platform
It provides system with network-level and equipment-level protection.
 Monitoring Platform
 Collect process and report the configuration, alarm and performance

information of each platform to the network management system.
 Receive the commands issued by network management system and

forward them to the destination board.
 Transmit network management message via designated monitoring optical

channel, which supports a rate of 100Mbit/s with a wavelength of 1510 nm.
3.2 Network Element Configuration
Based on the location, ZXONE 9700 can be configured as OTM (Optical Termination
Multiplexer), FOADM (Fixed Optical Add/Drop Multiplexer), ROADM (Reconfigurable
Optical Add/Drop Multiplexer), and OLA (Optical Line Amplifier).
3.2.1 Optical Termination Multiplexer (OTM)
OTM implements the function of line terminal nodes with all services. When ZXONE
9700 works as Figure 3-2
Figure 3-2 Functional diagram of OTM
3.2.2 Fixed Optical Add/Drop Multiplexer (FOADM)
Fixed Optical Add/Drop Multiplexer (FOADM) can add/drop services with designated
wavelength and has direct connection to other services. When local add/drop services
exceed 16 wavelengths, OTM back-to-back is adopted. When it works as FOADM, the
relationship between the platforms is shown in Figure 3-3.

Figure 3-3 Functional diagram of FOADM
Optical Add/drop Optical

amplifying platform amplifying
Pass-through
platform platform
Optical Optical
line line (East)
(West）
Service aggregation
platform Service aggregation
Monitoring platform
Monitoring
platform platform
Optical transfer
platform
Client signal
Client signal
3.2.3 Reconfigurable Optical Add/Drop Multiplexer (ROADM)
Reconfigurable Optical Add/Drop Multiplexer (ROADM) has dynamic and flexible

wavelength add/drop path. It can take dynamic control of wavelength add/drop and direct
connection at local and from remote. It supports wavelength reconfiguration in many
directions (that is to say, wavelength in any direction can be switched to any other
direction). It also supports power adjustment of direct connection wavelength and local
add/drop. When it works as FOADM, the relationship between the platforms is shown in
Figure 3-4

Figure 3-4 Functional diagram of ROADM
3.2.4 Optical Line Amplifier (OLA)
Optical Line Amplifier (OLA) works to make power compensation for long-distance
transmitted optical signal. When it works as OLA, the relationship between the platforms
is shown in Figure 3-5.
Figure 3-5 Functional diagram of OLA
Optical amplifying
platform
In Out
Monitoring
Optical line platform Optical line
(West） (East）
Out In
Optical amplifying
platform

4 Hardware Architecture
ZXONE 9700 equipment hardware architecture includes rack, sub-rack, DCM chassis
and boards.
4.1 Rack
ZXONE 9700 equipment adopts ZTE transmission equipment rack which conforms to
ETSI standards. The rack uses front and back pillar with single and double swinging
doors.
The typical configurations of ZXONE 9700 equipment are 2.2-meter high ETSI 300mm
and 600mm rack. The appearances of ZXONE 9700 racks are shown below.
Figure 4-1 Appearance of ZXONE 9700 rack (300mm)
Note: 1. Power cable outlet 2. Top outlet 3. Alarm indicator 4. Rear shaft 5. Cabling area 6. Installation bracket

7. Bottom outlet 8. Grounding terminal in the front door 9. Front door 10. Door lock 11. Hinge strap
Figure 4-2 Appearance of ZXONE 9700 rack (600mm)
 Note: 1. Top outlet 2. Cabling clamp 3. Cabling area 4. Bottom outlet 5. Door lock 6. Front door 7. Grounding terminal
4.2 Sub-rack
ZXONE 9700 equipment can provides 2 types of transmission sub-racks (Transmission

sub-rack NX41 and Distributed cross-connect sub-rack DX41) and 4 types of universal
switching sub-racks (S1, S2, S3 and S6).
4.2.1 Transmission Sub-rack
The transmission sub-racks is NX41. It is a 10U sub-rack, which meets the installation
requirements of ETSI rack as shown below.

Figure 4-3 Structure of transmission sub-rack (NX41-21 inch)
FCC
CCP
CCP
1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31
PWE
PWE
2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32
Fiber Cable Area
Figure 4-4 Structure of transmission sub-rack (NX41-19 inch)
10 12 14 16 18 20 22
FCC24 26 28 30 32
SNP/SCC
SOSC
SOSC
CCP
CCP
1 3 5 7 9 11 13 15 17 19 21 23 25 27
SNP/SCC
PWE
PWE
2 4 6 8 10 12 14 16 18 20 22 24 26 28
Fiber Cable Area
For 21 inch NX41 sub-rack, this has totally 28 semi-height slots (14 full-height slots), 2
power supply slots, and 2 interface boards. The description of sub-rack board slot is as
follows:
 Slot 1 and 2: fixed on main sub-rack for SNP.

 Slot 3 for SOSCB board (main/standby) for main sub-rack. If SOSCB is not
configured, slot 3 can be plugged with service board.
 Slot 30 and 32: fixed for PWE board.
 Slot 29 and 31: fixed for CCP board.
For 19 inch NX41 sub-rack, this has totally 24 semi-height slots (14 full-height slots), 2
power supply slots, and 2 interface boards. The description of sub-rack board slot is as
follows:
4.2.2 Distributed cross-connect Sub-rack
The distributed sub-rack of ZXONE 9700 equipment is a 10U sub-rack, which meets the
installation requirements of ETSI rack as shown in Figure 4-5 and Figure 4-6.

Figure 4-5 Structure of distributed cross-connect sub-rack (DX41-21 inch)
FCC
CCP
CCP
1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31
PWE
PWE
2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32
Fiber Cable Area
Figure 4-6 Structure of distributed cross-connect sub-rack (DX41-19 inch)
10 12 14 16 18 20 22
FCC24 26 28 30 32
SNP/SCC
SOSC
SOSC
CCP
CCP
1 3 5 7 9 11 13 15 17 19 21 23 25 27
SNP/SCC
PWE
PWE
2 4 6 8 10 12 14 16 18 20 22 24 26 28
Fiber Cable Area
The distributed cross-connect sub-rack(21 inch) of ZXONE 9700 equipment has totally
28 semi-height slots (14 full-height slots), 2 power supply slots, and 2 interface boards.
The description of sub-rack board slot is as follows:

The distributed cross-connect sub-rack(19 inch) of ZXONE 9700 equipment has totally
24 semi-height slots (14 full-height slots), 2 power supply slots, and 2 interface boards.
The description of sub-rack board slot is as follows:
4.2.3 Switching Sub-rack
The switching sub-racks of ZXONE 9700 are divided into single-layer, double-layer and
tripe-layer with single-side and tripe-layer with double-side switching rack based on their
different switching capacity.
4.2.3.1 S1 Switching Sub-rack
S1 switching sub-rack of ZXONE 9700 equipment need one 2.2m rack with 300mm
depth meeting ETSI rack installation requirements. The cross connection capacity is 4.4T,
and the optical layer boards such as SOA, SOGMDC and SOADC boards can be
inserted in some slots as shown in the following table.
The sub-rack structure is shown in Figure 4-7.

Figure 4-7 Structure of S1 switching sub-rack
FCPN
3 4 15 16 18
PWRL
NCPK/CCPK
NCPK/CCPK
400G
400G
400G
400G
400G
400G
400G
400G
400G
400G
400G
PSK
PSK
PSK
PWRL
1 2 19 20 5 6 7 8 9 10 11 12 13 14 21 22 17
Fiber Cable Area
Table 4-1 Slots description of S1 switching sub-rack
Designated
Board Description
slot
FCPN (fan unit) Sub-rack top There are 1 piece of board
There are 2 pieces of boards, one board is

PWRL (power
17,18 working and another board is provided as
supply unit)
protection
CCPK 1,2 For OTN services
NCPK 1,2 For OTN/PACKET services
Universal switching board , 3 pieces of

Sub-rack centre
PSK boards can be configured and which can
area
provide 2+1 protection

Designated
Board Description
slot
The VC cross-connect board PSV can be

configured in those slots. It can provide
PSV 3-7;12-21
240G VC4 or 200G VC4 + 40G VC12 VC
switch capacity.
Service boards can be configured in these

service slots 3-8;12-22 slots. The backplane bandwidth of each
slot is 200G/400G.
Optical layer 3,4,15,16,19,20, SOA and SOGMDC/SOADC boards can

slots 21,22 be configured in these slots.
depth meeting ETSI rack installation requirements. The cross connection capacity is 9.2T,
and the optical layer boards such as SOAC, SOGMD and SOADC boards can be
inserted in some slots as shown in the following table.
The sub-rack structure is shown in Figure 4-7.

FCPN
Fiber Cable Area
19 36
PWRL
PWRL
400G
400G
400G
400G
400G
400G
400G
400G
400G
PSK
PSK
PSK
PSK
PSK
PSK
PWRL
20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 37 PWRL
3 4 5 14 15 16 17
PWRL
CCPK/NCPK
CCPK/NCPK
400G
400G
400G
400G
400G
400G
400G
400G
400G
400G
400G
400G
400G
400G
PWRL
1 2 38 39 40 6 7 8 9 10 11 12 13 41 42 43 18
Fiber Cable Area
FCPN
Board Designated slot Description

Sub-rack top
FCPN (fan unit) There are 2 pieces of boards
and bottom
There are 6 pieces of boards, three

PWRL (power 17,18,19,20,36,
boards is working and another boards is
supply unit) 37
provided as protection
Universal switching board , 6 pieces of

Sub-rack centre
area


3-15,21-24,32-3 configured in those slots. It can provide
PSV
4,38-42 240G VC4 or 200G VC4 + 40G VC12 VC
switch capacity.
Service board can be configured in these

3-16,21-25,32-3
service slots slots. The backplane bandwidth of each
5,38-43
slot is 200/400G.
Optical layer 3-5,14-16,38-40, SOA and SOGMDC/SOADC boards can

slots 41-43 be configured in these slots.
depth meeting ETSI rack installation requirements. The cross connection capacity is
7.2/14.4T. The sub-rack structure is shown in Figure 4-9

M1S3 M4S3
Power Power Power Power Power Power Power Power Power Power Power Power
unit unit unit unit unit unit unit unit unit unit unit unit
Fan unit Fan unit Fan unit Fan unit Fan unit Fan unit
Fiber Cable Area Fiber Cable Area
200G
200G
200G
200G
200G
200G
200G
200G
200G
200G
200G
200G
200G
200G
200G
200G
200G
200G
200G
400G
400G
400G
400G
400G
400G
400G
400G
400G
400G
400G
400G
400G
400G
400G
400G
400G
400G
400G
20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38
Intake port Intake port
PSK PSK
PSK PSK
PSK PSK
PSK
FCPM
PSK
PSK PSK
PSK PSK
PSK PSK
PSK PSK
NCPK/CCPK
NCPK/CCPK
NCPK/CCPK
NCPK/CCPK
200G
200G
200G
200G
200G
200G
200G
200G
200G
200G
200G
200G
200G
200G
200G
200G
200G
400G
400G
400G
400G
400G
400G
400G
400G
400G
400G
400G
400G
400G
400G
400G
400G
400G
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19
Fan unit Fan unit Fan unit Fan unit Fan unit Fan unit
Power Power Power Power Power Power Power Power
Interface Interface Interface Interface
unit unit unit unit unit unit unit unit
Designated
Board Description
slot
Sub-rack top
FCPL (fan unit) There are 6 pieces of boards
and bottom
Sub-rack centre There is 1 piece of board on M4S3

FCPM(fan unit)
area sub-rack.

Designated
Board Description
slot
There are 10 pieces of boards, 5 boards

PWRK (power Sub-rack top
are working and 5 boards are provided as
supply unit) and bottom
protection
Universal switching board, 8 pieces of

Sub-rack centre
area

configured in those slots. It can provide
PSV 1-8;12-18;20-37
240G VC4 or 200G VC4 + 40G VC12 VC
switch capacity.

service slots 1-9;12-19;20-38 slots. The backplane bandwidth of each
slot is 200/400G.
depth meeting ETSI rack installation requirements. The cross connection capacity is
14.4/28.8T.The sub-rack structure is shown in Figure 4-10:

M1S6
Front Back
PWRK PWRK PWRK PWRK PWRK PWRK PWRK PWRK PWRK PWRK
FCPL FCPL FCPL FCPL FCPL FCPL

200G
200G
200G
200G
200G
200G
200G
200G
200G
200G
200G
200G
200G
200G
200G
200G
200G
200G
200G
200G
200G
200G
200G
200G
200G
200G
200G
200G
200G
200G
200G
200G
200G
200G
200G
200G
200G
200G
20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76

PSK
PSK PSK
PSK PSK
PSK PSK
PSK PSK
PSK PSK
PSK PSK
PSK
NCPK/CCPK
NCPK/CCPK
200G
200G
200G
200G
200G
200G
200G
200G
200G
200G
200G
200G
200G
200G
200G
200G
200G
200G
200G
200G
200G
200G
200G
200G
200G
200G
200G
200G
200G
200G
200G
200G
200G
200G
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57
PWRK PWRK PWRK PWRK PWRK PWRK PWRK PWRK

M4S6
Front Back
PWRK PWRK PWRK PWRK PWRK PWRK PWRK PWRK PWRK PWRK

400G
400G
400G
400G
400G
400G
400G
400G
400G
400G
400G
400G
400G
400G
400G
400G
400G
400G
400G
400G
400G
400G
400G
400G
400G
400G
400G
400G
400G
400G
400G
400G
400G
400G
400G
400G
400G
400G
20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76
PSK PSK
PSK PSK
PSK PSK
FCPM
FCPM
PSK PSK
PSK PSK
PSK PSK
PSK PSK
NCPK/CCPK
NCPK/CCPK
400G
400G
400G
400G
400G
400G
400G
400G
400G
400G
400G
400G
400G
400G
400G
400G
400G
400G
400G
400G
400G
400G
400G
400G
400G
400G
400G
400G
400G
400G
400G
400G
400G
400G
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57
PWRK PWRK PWRK PWRK PWRK PWRK PWRK PWRK
Sub-rack top and

FCPL (fan unit) There are 12 pieces of boards
bottom
Sub-rack centre There is 2 pieces of boards on M4S6

FCPM(fan unit)
area sub-rack.
PWRK (power Sub-rack top and There are 18 pieces of boards, 9 boards
supply unit) bottom are working and 9 boards are provided


as protection
CCPK 10,11,47,48 For OTN services
NCPK 10,11,47,48 For OTN/PACKET services
Universal switching board, 14 pieces of

Sub-rack centre
area
The VC cross-connect board PSV can

1-8,12-18,20-37,3 be configured in those slots. It can
PSV
9-45,49-56,58-75 provide 240G VC4 or 200G VC4 + 40G
VC12 VC switch capacity.

1-9,12-19,20-38,3
service slots slots. The backplane bandwidth of each
9-46,49-57,58-76
slot is 200G/400G.
4.3 Boards
ZXONE 9700 equipment provide multi-functional boards including transponder,

muxponder, client board, line board, optical multiplexing and demulitiplexing board,
optical add/drop multiplexing board (fixed and reconfigurable), optical power amplifying
board, optical protection board, system control, monitoring, cross connection board and
communication board etc.
4.3.1 Optical Transponder and Muxponder
The main function of optical transponder is to aggregation or converts the accessed one
or multiple client-side signals and put out DWDM standard wavelength as ITU-T G.694.1
suggested, so that the multiplexing unit can take wavelength multiplexing of optical
signals of different wavelengths. All wavelength transponder units are transceivers which
can implement the reverse process of the above.
Main functions of optical transponder board are shown in Table 4-5:

Table 4-5 Main functions of optical transponder board
Line side
Maximum
Client-side optical signal optical
Board client-side Description
type signal
interface
type
Access four channels of

any rate service ranging
from 100Mbps to
2.67Gbps.
Typic types of service: Muxponder of 4
M1QA1 4 such as OTU1 ports any rate to
STM-1/4/16(OC-3/12/48), OTU1
FE/GE, 1G FC/2G FC,
ESCON,FICON,
DVB_ASI/SD-SDI/HD-SDI
, OTU1 etc.

from 100Mbps to
2.67Gbps.
Typic types of service:
such as Muxponder of 4
M2MQA1 4 STM-1/4/16(OC-3/12/48), OTU1 ports any rate to
FE/GE, 1G FC/2G FC, OTU1
ESCON,FICON,
, OTU1 etc.
Support 1588V2 and Sync
E.

from 1.0625Gbps to
4.25Gbps. Muxponder of 4
M1MQA2 4 Typic types of service: OTU2 ports any rate to
such as STM16(OC-48), OTU2
GE, 1G FC/2G FC/4G
FC, ESCON, HD-SDI,
OTU1 etc.
M2MQA2 4 Access 4 channels of any OTU2 Muxponder of 4

Line side
Maximum
type signal
interface
type
rate service ranging from ports any rate to

100Mbps to 9.83Gbps. OTU2
Typic types of service:
such as
STM-1/4/16(OC-3/12/48),
FE/GE, 1G FC/2G FC/4G
FC, ESCON,FICON,
, OTU1, CPRI 2/3/4/5/6/7
etc.
Support 1588V2 and Sync
E.
Access six channels of Muxponder of 6

M1MJA 6 any rate service from - ports any rate to
100Mbps to 2.5Gbps. main board
Access six channels of

any rate service from Muxponder of 6
M2MJA 6 100Mbps to 2.5Gbps. - ports any rate to
Support 1588V2 and Sync main board
E.
STM-64,
10GE, 10Gbit/s service
OTU2
TD2C 2 OTU2/OTU2e/OTU1f, wavelength
OTU2e
FC 800, transponder
FC1200
STM-64,
10GE, 10Gbit/s service
OTU2
TS2C 1 OTU2/OTU2e/OTU1f, wavelength
OTU2e
FC 800, transponder
FC1200
STM-64, 10 Gbit/s service

10GE, OTU2 wavelength
TS2CP 1
OTU2/OTU2e/OTU1f, OTU2e transponder with
FC 800, OCH 1+1 protection

Line side
Maximum
type signal
interface
type
FC1200
STM-64
10GE-LAN 10Gbit/s service
OTU2
EOTU10GB 1 10GE-WAN wavelength
OTU2e
10G POS transponder
OTU2
GE
Muxponder of 8
FC100
MOM2 8 OTU2 ports services to
FC200
1*OTU2
2.5G
Muxponder of 8
FE/GE
MOM2B 8 OTU2 ports services to
STM-1/4/16
1*OTU2 or 2*OTU2
Muxponder of 16
2×OTU E1/T1 and 1
MHE1 16 16×E1/T1+1×STM-1/4
1 STM-1/4 to
2×OTU1
Multiplexes/demulti
plexes 8 channels
of GE signals or two
GE OTU2/2
ASMB 10 channels of 10 GE
10GE e
signal into/from two
channels of OTU2
signals
Aggregation
Switch Muxponder
GE OTU2/O
SOG2 8 of 8 channels GE
10GE TU2e
/10GE to OTU2
Board
STM-256 40Gbit/s service
TST3 1 40G POS OTU3 wavelength
OTU3 transponder
Realizes 4* STM64,
MQT3 4 STM-64 OTU3
10GE LAN, OTU2,

Line side
Maximum
type signal
interface
type
10GE-LAN complaint with

10GE-WAN G.709
10G POS recommendation,
and conducts
OTU2/OTU2e
FEC/AFEC
coding/decoding on
the signal
100Gbit/s service
100GE
TS4 1 OTU4 wavelength
OTU4
transponder
100Gbit/s service
100GE
TD4 2 OTU4 wavelength
OTU4
transponder
STM-64
10GE-LAN
10-port 10Gbit/s
10GE-WAN
service aggregation
MX2 10 10G POS OTU4
wavelength
OTU2/OTU2e
transponder
FC800
FC1200
Muxponder of
100GE OTUC4 4-port 100G or
MQ4/S 4
OTU4 OTUC2 OTU4 to
OTUC4/OTUC2
Muxponder of
100GE OTUC4 4-port 100G or
MQ4/D 4
OTU4 OTUC2 OTU4 to
OTUC4/OTUC2
4.3.2 Client-side Board
Functions of client-side board are shown in Table 4-6:

Table 4-6 Functions of client boards
Board Maximum Client-side optical Description

client-side signal type
interface
C1K×4 4 FE, GE, OTU1 To implement conversion

STM-1/STM-4/STM-16, between 4-port optical
OC3/OC12/OC48, signal at any rate and
4-port ODU0 or 4-port
FC 100/FC 200/FC 400,
ODU1 electrical signals.
CPRI(614.4M/1228.8M),
CPRI(2457.6M ),CPRI(4
915.2M)
infiniband
2.5G,infiniband 5G
ESCON,
DVB-ASI,SDI,CPRI,
HD-SDI, 3G-SDI,

FC 100/FC 200/FC 400,
CPRI(614.4M/1228.8M),
915.2M)
infiniband
2.5G,infiniband 5G
ESCON,
DVB-ASI,SDI,CPRI,
HD-SDI, 3G-SDI,

FC 100/FC 200/FC 400,
CPRI(614.4M/1228.8M),
915.2M)
infiniband


interface
2.5G,infiniband 5G
ESCON,
DVB-ASI,SDI,CPRI,
HD-SDI, 3G-SDI,
C2K×4 4 STM-64 To implement conversion

10GE-LAN between 4-port 10Gbit/s
10GE-WAN optical signal and 4-port
ODU2 electrical signal.
10G POS
OTU2/2e
FC800
FC1200

10G POS
OTU2/2e
FC800
FC1200

10G POS
OTU2/2e
FC800
FC1200

10G POS
OTU2/2e
FC800
FC1200


interface
10G POS ODU2 electrical signal.
OTU2/2e
FC800
FC1200

40G POS between 1-port 40Gbit/s
40GE optical signal and 1-port
OTU3

40G POS between 2-port 40Gbit/s
40GE optical signal and 2-port
OTU3
C4K×1 1 100GE To implement conversion

OTU4 between 1-port 100Gbit/s
optical signal and 1-port
C4K×2 2 100GE To implement conversion

optical signal and 2-port
C4L×4 4 100GE To implement conversion

optical signal and
4-port ODU4 electrical
signal.
PGEKx12 12 GE Multiplexes/demultiplexes
12 channels of GE signals
into/from the backboard.
PXGKx12 12 10GE Multiplexes/demultiplexes

12 channels of 10GE
signals into/from the
backboard.


interface
PXLGK 1 40GE Multiplexes/demultiplexes 1

channel of 40GE signals
PCGK 1 100GE Multiplexes/demultiplexes 1

channels of 100GE signals
4.3.3 Line-side Board
Functions of line-side board are shown in Table 4-7:
Table 4-7 Functions of line board
Board Maximum line-side Description

of line-side optical
interface signal type
L2K×4 4 OTU2 It has mapping of 32-port ODU0 or 16-port

ODU1, 4-port ODU2, signal sent by
switching board to OTU2, and converts it to
DWDM standard wavelength conforming to
ITU-T G.694.1. At the same time the
reverse process of the above can be
implemented. It supports hybrid
transmission of ODU0/1/ODUflex.

ODU1, 8-port ODU2 signal sent by
implemented. it supports hybrid
transmission of ODU0/1/ODUflex.



transmission of ODU0/1/ODUflex

transmission of ODU0/1/ ODUflex.
L4L×1/L4 1 OTU4 It has mapping of 80-port ODU0 or 40-port

K×1 ODU1, 10-port ODU2, or 2-port
ODU3+2-port ODU2 signal sent by
transmission of ODU0/1/2/3/ ODUflex.

ODU1, 10-port ODU2, or 2-port
4 OTU4 It has mapping of 80-port ODU0 or 40-port

ODU1, 10-port ODU2, or 2-port
L4K×4 switching board to OTU4, and converts it to


2 OTU4 Line side board with 2 ports:OTU4 level,

L4Lx2
Type L
2 OTUC2 Line side board with 2 ports:OTUC2/OTUC4

LB4Kx1/2
OTUC4 level, Type K
1 OTUC2 Line side board with single

LB4Kx1/1
OTUC4 port:OTUC4/OTUC2 level, Type K
1 OTUC2 Line side board with single

LB2Lx1
OTU4 port:OTUC2/OTU4 level, Type L
H4K 1/10 OTU4 1) It has mapping of 80-port ODU0 or

40-port ODU1, 10-port ODU2, or 2-port
transmission of ODU0/1/2/3.
2) It has mapping of LSP tunnel service to
ODUk(flex), then mapping to the high level
ODUk. At the same time the reverse
process of the above can be implemented.
4.3.4 Switching Board
The universal switching board for ZXONE 9700 equipment is implemented by PSK board;
the system supports maximum 28.8Tbit/s switching scheduling.
The VC-12/VC-4 switching for the ZXONE 9700 is implemented by PSV board.
 The maximum VC-4 cross-connect capacity of PSV board is 240 Gbit/s, and the
maximum VC-12 cross-connect capacity is 40 Gbit/s.

4.3.5 Optical Multiplexing and Demultiplexing Board
The main function of optical multiplexing and demultiplexing units is to multiplex or

demultiplex the optical signals of different wavelengths, and to provide online monitoring
of multiplexed wavelength. The multiplexing/demultiplexing units of ZXONE 9700
equipment cover the following boards:
 OMU: multiplexing board
 ODU: demultiplexing board
 VMUX: pre-equalization multiplexing board with multiplexed wave number as 40 for

C wave band, and 40 for L wave band. With AWG/+VOA (adjustable optical
attenuator) it can adjust attenuation of each channel before multiplexing.
 OCI: optical channel interleaving board. It implements channel interleaving of C

band by Interleaver.
 It implements interleaving multiplexing and demultiplexing of C100_1 and

C100_2 sub-wave band channel with a 100GHz interval, and C50_1
sub-wave band channel with a 50 GHz interval.
 C100_1 sub-wave band: 192.1 THz~196.0 THz (totally 40 waves)
 C100_2 sub-wave band: 192.15 THz~196.05 THz (totally 40 waves)
Table 4-8 ZXONE 9700 multiplexing OMU board
OMU
Board type OMU8 OMU16 OMU40 OMU80
32
Multiplexing
8 16 32 40 80
number
Multiplexer couple coupl cou AW coupl AW

coupler
type r er pler G er G
C/C C/C
C
Working C C + C +
C band ban
wavelength band band ban band ban
d
d d

Note: The coupler OMU is only for ROADM configuration.
Table 4-9 ZXONE 9700 multiplexing ODU board
Board type ODU40 ODU80
Multiplexing
40 80
number
Multiplexer
AWG AWG
type
Working
C/C+ band C/C+ band
wavelength
4.3.6 Fixed OADM Board
It drops fixed-wavelength signals out of multiple-wavelength signals (as required by the

user), while adding local signals into multiple-wavelength signals.
It includes:
 SOADC: Add/drop 4 channel of wavelength signals, or at most 8/10 channels

through concatenation, which is inserted at S1 or S2 sub rack.
 SOGMDC: Add/drop 4 or 5 groups of wavelength signals; can access 40

wavelengths with one card, and can access 80 wavelengths with two cards. This is
inserted at S1 or S2 sub rack.
 SOGMD: Add/drop 4 groups of wavelength signals; can access 32 wavelengths as

maximum.
 SOGMDB: Add/drop 4 or 5 groups of wavelength signals; can access 40

wavelengths with one card, and can access 80 wavelengths with two cards.
4.3.7 Dynamic OADM Board
It drops any single-wavelength signals out of multiple-wavelength signals and sends

them into wavelength conversion unit, while adding single-wavelength signals of the unit

into multiple-wavelength signals.
It includes:
 WSUA: 4/9-port wavelength selection switching-type multiplexing unit
 WSUD (MD8A1): Wavelength selection switching-type demultiplexing unit
 WSUD (E9): Wavelength selection switching-type multiplexing unit
 WSUBD9D: Wavelength Selective Switch Unit (Type B) with 9 drop port
 WSUBA9D: Wavelength Selective Switch Unit (Type B) with 9 add port
 WSUBA9P9D: Wavelength Selective Switch Unit (Type B) with 9 add port & 9
power splitter port
 WSUBT20D: Wavelength Selective Switch Unit (Type B) with twin port 20 &
loopback port
 MSU: Multicast Switching Unit
 PDU: 5/9-port power distribution unit
 PDUB: 16-port power distribution unit
4.3.8 OA (Optical Amplifier) Board
It amplifies optical signals to extend their transport distance.
It includes:
 SEOBA: Enhanced OBA board
 SEOPA: Enhanced OPA board
 SOBA: Smart Optical Booster Amplifier board
 SOPA: Smart Optical Pre-Amplifier board
 EONA: Enhanced ONA board

 EOBAH: High-power OBA
 EONAH: High-power ONA
 DRA: Distributed Raman Amplifier and High power Distributed Raman Amplifier
 HNA: Hybrid Node Amplifier
 VOA SFP: Variable optical Attenuation SFP
 VOA SFP working wavelength is at band C or L; fixed insertion loss is

<1.5dB; the is adjusted between 0dB~20dB; adjustment step is 0.1dB.
 LACT/LACG: Line Attenuation Compensation board
 Adjust EVOA of LAC through NM according to line optical power to make

sure the power points of the spans and receiving power and OSNR of the
receiver remain normal in the operation.
 LAC working wavelength is at band C or L; fixed insertion loss is <1dB;

EVOA is adjusted between 0dB~20dB; adjustment step is 0.1dB.
 LAC consists of LACG and LACT.
 LACG: Configured with 2×EVOA and applied to OLA, OADM and

back-to-back OTM sites.
 LACT: Configured with 1×EVOA and applied to single-end OTM sites.
 Check input/output optical power.
 Configured with GFF, LAC is able to compensate DWDM optical spectrum

slope caused by SRS to improve transport performance.
Table 4-10 OA types
Board Location Functionality
Behind optical transmitting

Improve transmitting power and extend
SEOBA source of OTM/ROADM or
transport distance.
REG equipment

Board Location Functionality
Behind optical transmitting

Improve transmitting power and extend
SOBA source of OTM/ROADM or
transport distance.
REG equipment
Pre-amplify weak signals after line

attenuation to improve the input optical
At the end of OMS or in front
SEOPA signal power of the receiver, meeting the
of optical receiving equipment
requirements for the receiving sensitivity
of the receiver.
Pre-amplify weak signals after line

attenuation to improve the input optical
At the end of OMS or in front
SOPA signal power of the receiver, meeting the
of optical receiving equipment
requirements for the receiving sensitivity
of the receiver.
Insert EDFA directly into transport link to

amplify signals. The gain can be
In the middle of or at the end
adjusted in a large range to suit different
EONA of OMS, or in front of optical
relay distances. DCM can be inserted in
receiving equipment
the middle to compensate the
dispersion.
Behind optical transmitting Improve transmitting power, extend

EOBAH source of OTM or relay transport distance, and provide higher
equipment output power.

EONAH In the middle of OMS relay distances. DCM can be inserted in
the middle to compensate the
dispersion.
Provide higher output power.
Work along with EDFA to amplify

At the start, in the middle of or
DRA long-distance, wide-bandwidth,
at the end of OMS
low-noise and distributed online signals.

In the middle of or at the end
HNA of OMS, or in front of optical
relay distances. DCM can be inserted in
receiving equipment
the middle to compensate the dispersion
for HNA-W type.

4.3.9 System control, supervision and communication board
It coordinates with NMS to manage device boards and facilitate the communications
between the devices. System control and communication unit is the control center.
System control and communication unit includes:
 SNP: The compact main control board is in charge of control, communication and
protocol processing, and makes possible the communications among all boards in
local NE.
 SCC: The compact communication control board manages NE sub-rack boards,

and routes and forwards control messages.
 CCP: The sub-rack control board is located in switching sub-rack to forward the
information between SNP boards.
 CCPK/NCPK The sub-rack control board is located in switching sub-rack, which is

in charge of control, communication and protocol processing, and makes possible
the communications among all boards in local NE. It performs the clock
management for switching sub-rack as required simultaneously.
4.3.10 OSC board
It monitors the transferring and switching of ECC data, orderwire and transparent user
channel data, and APS information between NEs in the system.
SOSCB board can provide time synchronization function following 1588V2 protocol.
4.3.11 Clock board
It provides system clock to transfer clock information and synchronize NE clock.
It includes:
 CCPK/NCPK: System clock function of S1/S2/S3/S6 is provided by CCPK/NCPK

boards.
It has the following functions:

 Process different clocks, offer all-network synchronous clock for SDH

services, and import/export external BITS clock.
 The clock exported from clock processing unit meet G.813 requirements for
clock performance, including clock accuracy, jitter, noise, MTIE and TDEV.
 TIS: Time interface supply board for NX41/DX41 subrack
 Work with SOSCB board to provide time synchronization function following

1588V2 protocol
 Provide input/output of 2M Hz/bit clock.
 SAIK: Time/Clock/Management/Alarm interface board
 Work with CCPK/NCPK/SOSCB board to provide time synchronization

function following 1588V2 protocol
 Provide input/output of 2M Hz/bit clock
 Provide input/output of management interface
 Provide input/output of FE interface
 Provide input/output of alarm interface
4.3.12 Protection board
It provides optical-layer network protection.
It includes:
 SOP: Compact optical channel protection board
 SOP: It consists of single-channel and multi-channel channel protection boards

respectively for OMS line 1+1 protection and OCH 1+1 protection.
It carries out protection switching or restoration in light of receiving power and manual

switching/restoration command or external APS command (following G.841) from NM.
4.3.13 Performance supervision board
It includes:
 EOPM: It monitors the performance of optical channels, measures their parameters

such as optical power, central wavelength and OSNR, reports relative data to NMS,
and displays optical spectrum diagrams in NM.
Each EOPM checks the performance of 4 channels or 8 channels of optical signals.
 EOWM: It monitors the central frequency drift of optical channel after multiplexing,
and sends frequency adjustment information to SNP.
Each EOWM controls the wavelengths of bidirectional 80-wavelength system.
 OFM/EOFM and OFMF/EOFMF
OFM/EOFM and OFMF/EOFMF work together to provide OTDR function in WDM

system.
OFM/EOFM integrates OTDR functional module and n×1 optical switch. It has two
types: OFM4/EOFM4 and OFM8/EOFM8. OFM4/EOFM4 monitors the fiber in 4
directions and OFM8/EOFM8 monitors the fiber in 8 directions. OFM/EOFM
principle diagram is as below:

Figure 4-11 EOFM4/8, OFM4/8 internal structure
PORT1
OTDR
……
……
module
1×n optical
PORTn switch
Backplane
communication
interface
Control and communication module
-48V
Power module
OFMF/EOFMF integrates four 3-port filters to connect OFM/EOFM, tested

fiber/OSCB chancel and WDM node equipment/OA. Its internal structure is as
below:
Figure 4-12 OFMF/EOFM internal structure
MUX/DEMUX
Signal(S1) Fiber Line (LINE1)
Monitor (MON1)
Monitor (MON2)

Monitor (MON3)
Monitor (MON4)
Backplane
communication
Control and communication interface
module
Power -48V
module
5 Software structure
ZXONE 9700 software consists of board software, Agent and NetNumen U31 which run
respectively in boards, SNP and NM computer to manage and control boards, NE and

the entire network. ZXONE 9700 software adopts the layered design principle, and each
layer has special functionality and serves the upper layer. Its structure is shown in Figure
5-1:
Figure 5-1 ZXONE 9700 software structure
NM Server
SNP (control
software)
Card Software Card Software Card Software
5.1 Board software
Board software runs in boards to manage, monitor and control their working status. It
receives the NM command from SNP/NCPK/CCPK Agent, processes and makes
response to the command, and reports alarm and performance event to NM. Board
software has such functions as alarm performance event processing, configuration
management, communication management, board software online download and
functional circuit drive.
5.2 SNP/NCPK/CCPK software
SNP software runs in SNP/NCPK/CCPK boards to manage, monitor and control the
operation status of NE boards, and works as the communication service unit between
NMS and boards to help NMS to control and manage NE.
 Configure the boards in NE power-on initialization.
 Monitor NE alarm and performance in normal operation, receive NM monitoring and

configuration command from gateway NE via ECC interface, and report command
processing result, NE alarm and performance. Gateway NE is connected to NM via
Qx interface.
 Control APS, APR and WASON.
It consists of the following modules based function module:
1. Embedded OS platform
Manage public resources and provide hardware-independent application

environment.
2. Communication & control module
The interface module between SNP software and board software exchanges
information between SNP software and other board software to maintain the
equipment. It sends board maintenance and operation command of SNP software
to the boards, collects board status, alarm and performance event, and reports
them to SNP software.
3. Equipment management module
It is the core for SNP software to manage NE equipment. SNP software sends
network management and operation command and receives an event via the
module.
4. Communication module
Exchange management information between NMS and NE device and between NE

devices.
5. Database management module
Manage and access alarm, performance, equipment and network status information
collected by SNP software.
6. Active/standby switching module
Synchronize and switch data between active and standby SNP boards for 1+1 hot

backup.
7. APS module
Control the boards to carry out the protection switching in light of protection mode
and equipment status.
8. APSD/APR module
Carry out APSD and APR functions according to equipment status.
9. WASON module
Control the boards to carry out WASON functions in light of network and equipment
status.
5.3 NM software
ZXONE 9700 uses NM software to manage and monitor different NEs. The software has
such functions as fault management, performance management, safety management,
configuration management, maintenance management and system management.
NM software structure is shown in Figure 5-2:
Figure 5-2 NM software structure
GUI
Card
Manager
Software
Control
Software
NM software, board software, SNP software
 Manager

It is also known as Server. Manager is equivalent to Server for GUI. Manager sends
management command to SNP software via Qx interface, receives the notifications
from SNP software, save all network management data into the database, including
such basic data as system management, configuration management and alarm
maintenance. Manage saves only network management data of local domain.
 GUI
It is also known as Client. The user carries out such operations as configuration
management, fault management, performance management, safety management,
maintenance management and system management via GUI. GUI basically does not
save dynamic NM data which is extracted from the database by the user via Manager.
 Database
It is in charge of information query and configuration of GUI and management functional

modules, the storage of such information as alarm and the processing of data
consistency.
5.4 Communication protocol and interface
ZXONE 9700 software system interfaces and relative communication protocols and
interfaces are shown as Table 5-1:
Table 5-1 ZXONE 9700 software system interface
Name Description
S interface It is the interface between SNP software and MCU, in other words, the
communication interface between SNP software and other boards. It
follows private protocol.
Qx interface It is the interface between SNP software and Manager, in other words,
the communication interface connecting SNP to NM server computer. It
is located in the interface board of ZXONE 9700, and follows TCP/IP,
ITU-TQ.811 and ITU-T Q.812 recommendations.
ECC It is the communication interface between NEs, and supports OSC

interface communication and TCP/IP.

CTI interface It is the control interface in NE, and implements APS, APR and WASON
functions.
6 Product characteristics
6.1 Transmission function
6.1.1 Transport capacity
ZXONE 9700 consists of 32/40/80-wavelegnth system.
The working wavelength number of 10Gbit/s system can be 32/40/80. 40 wavelengths

system can be upgraded smoothly to 80 wavelengths system.
The working wavelength number of 40Gbit/s system can be 40/80. 40 wavelengths

The working wavelength number of 100Gbit/s system can be 40/80. 40 wavelengths

The working wavelength number of 400Gbit/s system can be 53 as maximum.
6.1.2 Transport distance
By adopting the ultra-long-haul distance optical source and optical amplifying

technologies, the transmission codes supported by ZXONE 9700 are listed in the
following tables.
Table 6-1 Transmission Codes Supported by 40 2.5Gbit/s System (G.652&G.655)
Category Specifications Target Distance (km)
1  36 dB 1  144 km
Without FEC 2  33 dB 2  132 km

(OSNR > 20 dB) 3 31dB 3  124 km
10 23 dB 10 92 km

Category Specifications Target Distance (km)
1  41 dB 1×164km
FEC without RAMAN 2  38 dB 2×152km

(OSNR>15dB) 3 36dB 3×144km
20  25dB 20×100km
1  45dB 1×180km
FEC+ RAMAN 2 42dB 2×168km

(OSNR >15 dB) 3 40dB 3×160km
20  28 dB 20×112km
Table 6-2 Transmission Codes Supported by 16/40 2.5Gbit/s System (G.653)
Category Specifications Target Distance (km) remark
1×48 dB 1×192 km 16*2.5Gbit/s
3×34 dB 3×136 km (408 km) 16*2.5Gbit/s

FEC
6×26 dB 6×104 km (624 km) 16*2.5Gbit/s
8×22 dB 8×88 km (704 km) 16*2.5Gbit/s
1×35dB 1×140 km 40*2.5Gbit/s

FEC+DRA
3×26 dB 3×104 km (312 km) 40*2.5Gbit/s
Table 6-3 Transmission Codes Supported by 40  10Gbit/s System (G.652&G.655)
1  61 dB 1  244km RPOA,40 10Gbit/s

High Power RAMAN,
1  58 dB 1 232km
40 10Gbit/s
AFEC NRZ
1  49 dB 1 196km DRA, 40 10Gbit/s
30  22 dB 30  88 km -
12  30 dB 12  120 km -
1  64 dB 1  256km RPOA,40 10Gbit/s

High Power RAMAN,
AFEC RZ 1  59 dB 1 236km
40 10Gbit/s
1  52 dB 1 208km DRA, 40 10Gbit/s

50  22 dB 50  88 km -
18 30 dB 18  120 km -
1  45 dB 1 180km DRA, 80 10Gbit/s
20  22 dB 20  88 km -
AFEC NRZ
8  30 dB 8  120 km -
1  48 dB 1 192km DRA, 80 10Gbit/s
30  22 dB 30  88 km -
AFEC RZ 12 30 dB 12  120 km -
Table 6-5 Transmission Codes Supported by 16/40 10Gbit/s System (G.653)
1×48 dB 1×192 km 16*10Gbit/s
FEC+ 3×34 dB 3×136 km (408 km) 16*10Gbit/s

RZ+DRA 6×26 dB 6×104 km (624 km) 16*10Gbit/s
8×22 dB 8×88 km (704 km) 16*10Gbit/s
1×35dB 1×140 km 40*10Gbit/s
FEC+RZ+DRA 3×26 dB 3×104 km (312 km) 40*10Gbit/s
6×26 dB 6×104 km (624 km) 40*10Gbit/s
Table 6-6 Transmission Codes Supported by 40 40Gbit/s System (G.652&G.655)
1  47 dB 1 188km DRA, 40 40Gbit/s
22 22 dB 22  88 km -
AFEC+DPSK
5  30 dB 5  120 km -
12  30 dB 12  120 km DRA
AFEC+DQPSK 1  48 dB 1 192km DRA, 40 40Gbit/s

25 22dB 25 88 km
6  30dB 6  120 km
13 30 dB 13 120 km DRA
1  44 dB 1 176km DRA, 80 40Gbit/s
16 22 dB 16  88 km -
AFEC+DPSK
3 30 dB 3  120 km -
6 30 dB 6  120 km DRA
1  45dB 1 180km DRA, 80 40Gbit/s
18 22 dB 18  88 km
AFEC+DQPSK
4 30 dB 4 120km
7 30 dB 7  120 km DRA
1×46 dB 1×192 km DRA 16*40Gbit/s
8×30 dB 8×120 km (960 km) DRA 16*40Gbit/s
DPSK or 8×22 dB 8×88 km (704 km) 16*40Gbit/s

DQPSK 1×41dB 1×164 km DRA 40*40Gbit/s
4×30 dB 4×120 km (360 km) DRA 40*40Gbit/s
6×22 dB 6×88 km (352 km) 40*40Gbit/s
Table 6-9 Transmission Codes Supported by 80  100Gbit/s System (G.652 with DCM)
Target Distance
Category Specifications remark
(km)
High Power
1x52dB 1x208km
RAMAN,

Target Distance
(km)
80x100Gbit/s
1x45dB 1x180km DRA, 80x100Gbit/s
16x22 dB 16x88 km
28 x22dB 28 x88km DRA
4x30 dB 4x120km
7x30 dB 7x120 km DRA
Table 6-10 Transmission Codes Supported by 80  100Gbit/s System (G.652 without

DCM)
Target Distance
(km)
High Power
1x52dB 1x208km RAMAN,
80x100Gbit/s
SD+FEC+PM-QPSK
20x22 dB 20x88 km
4x30 dB 4x120km
Table 6-11 Transmission Codes Supported by 80  100Gbit/s System (G.655 with

DCM)
Target Distance
(km)
10x22 dB 10x88 km
SD-FEC+PM-QPSK 24 x22dB 24 x88km DRA
3x30 dB 3x120km

DCM)
Target Distance
(km)
SD-FEC+PM-QPSK 1x45dB 1x180km DRA, 80x100Gbit/s

Target Distance
(km)
12x22 dB 12x88 km
3x30 dB 3x120km
1×46 dB 1×192 km DRA 16*100Gbit/s
6×30 dB 6×120 km (720 km) DRA 16*2.5Gbit/s

SD-FEC+PM-
8×22 dB 8×88 km (704 km) 16*100Gbit/s
QPSK
1×33dB 1×132 km DRA 40*100Gbit/s
3×29 dB 3×104 km (312 km) DRA 40*100Gbit/s

DCM)
Target Distance
(km)
High Power
1x46dB 1x184km RAMAN,
3rd SD-FEC +
53x400Gbit/s
PM-16QAM
12x22 dB 12x88 km

DCM)
Target Distance
Category Specifications Remark
(km)
3rd SD-FEC + 1x39dB 1x156km DRA, 53x400Gbit/s

PM-16QAM 8x22 dB 8x88 km

Note: SD-FEC is soft decision FEC coding and decoding, and  means that the channel difference should be
included. Target Distance is calculated at 0.25dB/km.
6.1.3 Working wavelength
ZXONE 9700 working wavelength is in strict compliance with ITU-T G.692 to use specific
central wavelength and central frequency value for multi-channel system. G.652/G.655
fiber supports 40/80-wavelength transport at band C, and G.653 fiber supports
40-wavelength transport in 196.05-192.1THz wavelength range.
Table 6-16 Wavelength distribution of 80-wavelength system (50GHz spacing) at band C
Nominal Nominal Nominal Nominal

Wavelength central central Wavelength central central
S/N frequency wavelength S/N frequency wavelength
(THz) (nm) (THz) (nm)
1 196.05 1529.16 41 194.05 1544.92
2 196.00 1529.55 42 194.00 1545.32
3 195.95 1529.94 43 193.95 1545.72
4 195.90 1530.33 44 193.90 1546.12
5 195.85 1530.72 45 193.85 1546.52
6 195.80 1531.12 46 193.80 1546.92
7 195.75 1531.51 47 193.75 1547.32
8 195.70 1531.90 48 193.70 1547.72
9 195.65 1532.29 49 193.65 1548.11
10 195.60 1532.68 50 193.60 1548.51
11 195.55 1533.07 51 193.55 1548.91
12 195.50 1533.47 52 193.50 1549.32
13 195.45 1533.86 53 193.45 1549.72
14 195.40 1534.25 54 193.40 1550.12
15 195.35 1534.64 55 193.35 1550.52
16 195.30 1535.04 56 193.30 1550.92
17 195.25 1535.43 57 193.25 1551.32
18 195.20 1535.82 58 193.20 1551.72
19 195.15 1536.22 59 193.15 1552.12


20 195.10 1536.61 60 193.10 1552.52
21 195.05 1537.00 61 193.05 1552.93
22 195.00 1537.40 62 193.00 1553.33
23 194.95 1537.79 63 192.95 1553.73
24 194.90 1538.19 64 192.90 1554.13
25 194.85 1538.58 65 192.85 1554.54
26 194.80 1538.98 66 192.80 1554.94
27 194.75 1539.37 67 192.75 1555.34
28 194.70 1539.77 68 192.70 1555.75
29 194.65 1540.16 69 192.65 1556.15
30 194.60 1540.56 70 192.60 1556.55
31 194.55 1540.95 71 192.55 1556.96
32 194.50 1541.35 72 192.50 1557.36
33 194.45 1541.75 73 192.45 1557.77
34 194.40 1542.14 74 192.40 1558.17
35 194.35 1542.54 75 192.35 1558.58
36 194.30 1542.94 76 192.30 1558.98
37 194.25 1543.33 77 192.25 1559.39
38 194.20 1543.73 78 192.20 1559.79
39 194.15 1544.13 79 192.15 1560.20
40 194.10 1544.53 80 192.10 1560.61
Table 6-17 Wavelength distribution of 106-wavelength system (53×400G, 37.5GHz

spacing) at band C

1 196.05625 1529.11 54 194.06875 1544.77


2 196.01875 1529.41 55 194.03125 1545.07

3 195.98125 1529.70 56 193.99375 1545.37
4 195.94375 1529.99 57 193.95625 1545.67
5 195.90625 1530.29 58 193.91875 1545.97
6 195.86875 1530.58 59 193.88125 1546.27
7 195.83125 1530.87 60 193.84375 1546.57
8 195.79375 1531.16 61 193.80625 1546.87
9 195.75625 1531.46 62 193.76875 1547.17
10 195.71875 1531.75 63 193.73125 1547.47
11 195.68125 1532.04 64 193.69375 1547.77
12 195.64375 1532.34 65 193.65625 1548.06
13 195.60625 1532.63 66 193.61875 1548.36
14 195.56875 1532.93 67 193.58125 1548.66
15 195.53125 1533.22 68 193.54375 1548.96
16 195.49375 1533.51 69 193.50625 1549.26
17 195.45625 1533.81 70 193.46875 1549.57
18 195.41875 1534.10 71 193.43125 1549.87
19 195.38125 1534.40 72 193.39375 1550.17
20 195.34375 1534.69 73 193.35625 1550.47
21 195.30625 1534.99 74 193.31875 1550.77
22 195.26875 1535.28 75 193.28125 1551.07
23 195.23125 1535.58 76 193.24375 1551.37
24 195.19375 1535.87 77 193.20625 1551.67
25 195.15625 1536.17 78 193.16875 1551.97
26 195.11875 1536.46 79 193.13125 1552.27
27 195.08125 1536.76 80 193.09375 1552.57
28 195.04375 1537.05 81 193.05625 1552.88
29 195.00625 1537.35 82 193.01875 1553.18
30 194.96875 1537.64 83 192.98125 1553.48


31 194.93125 1537.94 84 192.94375 1553.78

32 194.89375 1538.24 85 192.90625 1554.08
33 194.85625 1538.53 86 192.86875 1554.39
34 194.81875 1538.83 87 192.83125 1554.69
35 194.78125 1539.12 88 192.79375 1554.99
36 194.74375 1539.42 89 192.75625 1555.29
37 194.70625 1539.72 90 192.71875 1555.60
38 194.66875 1540.01 91 192.68125 1555.90
39 194.63125 1540.31 92 192.64375 1556.20
40 194.59375 1540.61 93 192.60625 1556.50
41 194.55625 1540.90 94 192.56875 1556.81
42 194.51875 1541.20 95 192.53125 1557.11
43 194.48125 1541.50 96 192.49375 1557.41
44 194.44375 1541.80 97 192.45625 1557.72
45 194.40625 1542.09 98 192.41875 1558.02
46 194.36875 1542.39 99 192.38125 1558.32
47 194.33125 1542.69 100 192.34375 1558.63
48 194.29375 1542.99 101 192.30625 1558.93
49 194.25625 1543.28 102 192.26875 1559.24
50 194.21875 1543.58 103 192.23125 1559.54
51 194.18125 1543.88 104 192.19375 1559.84
52 194.14375 1544.18 105 192.15625 1560.15
53 194.10625 1544.48 106 192.11875 1560.45
6.2 Optical-layer Dispatching
ZXONE 9700 uses ROADM for dynamic optical-layer dispatching.
ROADM is divided into two-degree ROADM (also called linear ROADM) and

multi-degree ROADM (also called HUB ROADM) according to network direction number.
Two-degree ROADM supports two network directions and is mainly applied to chain and
ring networks. Multi-degree ROADM supports more than two network directions and is
mainly applied to such complex topologies as tangent ring, intersectant ring and MESH
network.
ZXONE 9700 offers linear ROADM solution, which is WSS-based ROADM subsystem
taking WSU as the core.
WSS-based ROADM solution has two types: One is WSUD (MD8A1)-based two-degree
ROADM system which can be configured with OMU (Coupler) + tunable OTU for
colorless port, and the other is PDU + WSUA/E-based 2~9-degree or WSUB (2~20
degree) ROADM system which can be configured with different local dropping units for
colored/directional and colorless/directionless ports. The latter is applied to ring and
mesh networks. It has powerful flexibility and wavelength dispatching function to support
core network.
 Directionless: It means that any local port can add/drop the service of any direction.
 Colorless: It means that any local port can add/drop any wavelength.
 Gridless/Flexible: It means that the spectrum can be adjustment by step.
6.2.1 Two-degree (in the ring) wavelength dispatching
Two-degree dispatching is to dispatch wavelengths in two directions. ZXONE 9700 uses

WSUD for two-degree (in the ring) dynamic wavelength dispatching, in other words,
dynamically add/drop, pass through and block services wavelengths, and equalize and
inspect channel optical power. The diagram of WSUD-based two-degree wavelength
dispatching is shown below:

Figure 6-1 WSUD-based two-degree ROADM sites
OTU
OTU
OTU
OTU
OTU
OTU
OTU
OTU
OTU
OTU
OTU
OTU
OTU
OTU
OTU
OTU
OTU
OTU
………
WSUD/E WSUD/E
OTU
OTU
OTU
OTU
:
OTU
OTU
OTU
OTU
………
1
0
4
:
Add port1
OBA
WSS
Coupler1
OPA
OPA WSUD WSUD Coupler1
WSS
OBA
Add port1
OTU
OTU
OTU
OTU
………
0
4
:
OTU
OTU
OTU
OTU
:
WSUD/E ……… WSUD/E
OTU
OTU
OTU
OTU
OTU
OTU
OTU
OTU
OTU
OTU
OTU
OTU
OTU
OTU
OTU
OTU
OTU
OTU
Eastward and westward service wavelengths directly use NM software to make dynamic
adding/dropping, pass-through, blocking, channel optical power equalization and
inspection, dynamically adjusting wavelength status in a remote way.
Adding unit employs coupler multiplexer and tunable-wavelength service board for
colorless and directionless port, and dropping unit employs WSUD/E or cascade
WSUDE for such a function.

6.2.2 Multi-degree dispatching
6.2.2.1 WSUA/AWG-based multi-degree wavelength dispatching
Figure 6-2 Multi-degree ROADM structure (colored and directional)
A drop B drop C drop D drop A add B add C add D add

O O O O O O O O O O O O O O O O
T T T T T T T T T T T T T T T T
U U U U U U U U U U U U U U U U
1 4 1 4 1 4 1 4 1 4 1 4 1 4 1 4
0 0 0 0 0 0 0 0
ODU40 ODU40 ODU40 ODU40 OMU40 OMU40 OMU40 OMU40
A
A
W
1×5 Coupler
E
O
S E
O
P
A
U B
A
A
B B
1×5 Coupler
E
W
E
O
P
S O
B
A U A
C
1×5 Coupler
C
W
E S E
O O
P U B
A A
A
D D
1×5 Coupler
W
E E
O S O
P B
A U A
A/B/C/D-direction service wavelengths directly use NM software to make dynamic

Adding/dropping units employ wavelength-sensitive AWG and fixed-wavelength OTU.

The multi-degree ROADM solution provides colored/directional-relevant port.

6.2.2.2 PDU/WSUA/WSUD-based multi-degree wavelength dispatching
Figure 6-3 Multi-degree ROAD structure (colorless and directionless)
EAST E E WEST
O
PDU WSU O
P A/E B
A A
EAST E E WEST
O WSU O
PDU P
B A/E A
A
NORTH E E SOUTH
O WSU O
P PDU B
A A/E A
NORTH E E SOUTH
O WSU O
B PDU P
A/E A
A
Group1
WSUA/E PDU
EOBA EOBA
WSUD/E OMU
(coupler
)
, ...
O
T
U
,
WSUD/E
OTU OTU
CLIENT SERVICE
4-direction service wavelengths directly use NM software to make dynamic

Line side employs PDU and WSUA/E to dynamically dispatch the wavelengths in
different directions, and adding/dropping units employ WSUD/E and tunable service
board for colorless and directionless port.
6.2.2.3 PDU/WSUB/OMU-based multi-degree wavelength dispatching


Line side employs WSUB to dynamically dispatch the wavelengths in different directions,
and adding/dropping units employ WSUB/PDUB/OMU (coupler) and tunable service
board for colorless, directionless and gridless port. The diagram is shown below:
Figure 6-4 Multi-degree ROADM structure (colorless and directionless and gridless)
WSUBA9P9D WSUBA9P9D
1x9 9x1
OA
OA
splitter WSS
… …
9x1 1x9
OA
OA
WSS splitter
… …
WSUBA9P9D WSUBA9P9D
1x9 9x1
OA
OA
splitter WSS
… …
9x1 1x9
OA
OA
WSS splitter
… …
… …
WSUBA9P9D 9X1 WSS 1X9 splitter …
OA
OA
WUSBD9D WUSBA9D
… …
OA OMU16 OMU16
(coupler) (coupler)
… …
O O O O
PDUB16 T T T T
U U U U
…
O O
T T
U U
6.2.2.4 WSUB/MSU-based multi-degree CDC-F dispatching

Line side employs WSUB to dynamically dispatch the wavelengths in different directions,
and adding/dropping units employ MSU with contentionless function and tunable service

board, so that realizes the colorless, directionless, contentionless and gridless. The
diagram is shown below:
Figure 6-5 Multi-degree ROAD structure (CDC-F Structure)
6.3 Electrical-layer dispatching
ZXONE 9700 can dispatch ODU0/1/2/2e/3/4/flex signals via switching board.

Electrical-layer dispatching supports three typical application scenarios:
 Pass through client-side service at local site: Input the service via a client-side port
of electrical switching matrix and output it via another client-side port at local site, in
other words, the service is not transported via the fiber.
 Add/drop client-side service: Transmit the service of other sites to line side of
electrical switching matrix of local site via the fiber, and then output it via electrical
switching matrix at client side; or input client service at client side of electrical
switching matrix of local site, and then send it to other sites via the fiber.
 Pass through line-side service at local site: Wavelength service from other sites is

not added or dropped at local site, but is dispatched to other directions via electrical
switching matrix, or is relayed or switched to other wavelengths.
6.4 L2 switching
ZXONE 9700 provides the board-level L2 switching to multiplex and demultiplex the
Ethernet service. There are two type boards, the interfaces are shown below:
1) ASMB: 8-channel GE signals and 2-channel 10GE to 2-channel OTU2 signals
2) SOG2: 8-channel GE signals or 4-channel GE signals and 4-channel 10GE to

2-channel OTU2 signals
The working principle is shown as Figure 6-6
Figure 6-6 Working principle of ZXONE 9700 L2 switching
 Tributary side
 Access 8-channel GE signals and 2-channel 10GE signals for ASMB in

compliance with IEEE802.3.
 Access 8-channel GE signals or 4-channel GE signals 4-channel 10GE

optical signals for SOG2 in compliance with IEEE802.3.
 10GE optical interface can also work as inter-board cascade interface.

 Support GFP-related performance inspection.
 Line side
 Support 2-channel OTU2 optical signals in compliance with G.694.1 and

G.709.
 Support G.709-defined OTU2 interface and relative performance inspection.

FEC can be set to standard FEC or ultra-strong FEC (AFEC).
 Support GFP-T packet encapsulation and comply with G.7041.
In addition, relative L2 functions are shown as Table 6-18:
Table 6-18 ZXONE 9700 L2 function
Function Description
VLAN & Stacking VLAN Support Stacking VLAN.
(QinQ) Support flexible Q-in-Q.
Support VLAN conversion.
QoS Support 8 hardware-based classes of service

according to port.
QoS mapping based on IEEE 802.1p priority IP
TOS/DSCP
Color-sensitive traffic monitoring, traffic shaping and
WRED congestion management
Advanced queue dispatching: WRR and strict priority
Traffic monitoring and shaping based on VLAN.
Class of service (CoS):
CAC-based guaranteed bandwidth
DiffServ-based Ethernet CoS (CIR,PIR)
Ethernet OAM Support Ethernet OAM in compliance with IEEE

802.3ah
Support service-layer OAM in compliance with IEEE
802.1ag (connection fault management)
Support ITU-T Y.1731.
LAG Support manual and static link aggregation

Support load balancing and non-load balancing

Function Description
Support IEEE802.3ad
L2 function Support IEEE802.1D, IEEE802.1Q and IEEE 802.1ad.

Support MAC address learning and aging
Support 32K MAC address
Support IGMP Snooping
Traffic control Support Ethernet traffic control protocol and traffic

control termination in compliance with IEEE802.3X.
MTU Support at most 16000 bytes.
EPL Provide point-to-point EPL.
EVPL Provide point-to-point EVPL and support VLAN-based

switching.
6.5 MPLS-TP Function list
The MPLS-TP function list of ZXONE 9700 is shown below:
Table 6-19 ZXONE 9700 MPLS-TP function list
Function types Sub-types Functions

FE
GE
Physical interface
Physical interface 10GE
functions
40GE
100GE
Internal/external ring loopback
Automatic rate negotiation
Jumbo:9600byte
Port functions Ethernet interface
Port rate
Port traffic control
Link layer topology automatic discovery (LLDP)
PWE3 functions
Simulation
Simulation services Ethernet simulation services
services
Local crossing functions
MAC address learning
L2 functions MAC functions MAC address aging
MAC address filtering


Static MAC address setting
MAC address data limit
Port-based VLAN
Common QinQ
Selective QinQ based on inner layer label /outer layer label for flows
VLAN functions TPID modification
EVC QinQ functions
Super VLAN
VLAN Range
VPWS/E-Line service (EP-Line，EVP-Line)
Ethernet EVC
VPLS/E-LAN service (EP-LAN,EVP-LAN)
functions
E-Tress service (EP-Tree, EVP-Tree)
Ethernet service mirroring (ingress, egress)
Manual aggregation
Static LACP aggregation
LAG (LACP) Load sharing (based on MAC, VLAN, or IP address)
Cross-line card binding on one equipment or one subrack
MC-LAG (cross-NE link aggregation)
Port-based broadcast storm suppression
Port-based multicast storm suppression
Storm suppression Port-based unknown unicast storm suppression
Unknown unicast and multicast dropping
Unknown unicast and multicast broadcast
L2 multicast functions IGMP snooping V1、V2
E-LAN MAC address learning
E-LAN IGMP Snooping multicast
E-TREE MAC address learning
MS-PW (static mode)
L2 multicast inside VPLS
H-VPLS (LSP access)
L2 VPN
VPLS VSI MAC functions:
MAC address learning
MAC address aging time setting
MAC address table capacity setting
Unicast, broadcast, multicast packet forwarding
IGMP snooping
Standard ACL
QOS ACL Expanded ACL
L2 ACL


Hybrid ACL
Time-based ACL
Ingress ACL
Egress ACL
IEEE 802.1p
IP Precedence
Packet re-marking IP DSCP
IP TOS
MPLS EXP
RED/WRED
Congestion
Tail-drop
avoidance
CAC
Queue scheduling SP+WFQ，WFQ
Hierarchical QoS HQoS
Integrated
Channel
QoS channel modes
Color awareness for color blindness
E-LSP model
Port-based shaping on egress
Traffic shaping
Queue-based shaping based on egress
Connection Admission Control (CAC)
PW layer bandwidth reservation
Service transport LSP layer bandwidth reservation
functions Physical port/sub-port layer bandwidth reservation
Physical port convergence ratio and bandwidth utilization
Bandwidth reservation sharing with protection
User access DHCP DHCP relay
Port-based clock recovery
Synchronous
Clock source priority configuration
Ethernet
SSM processing
IEEE 1588V2 protocol
Clock time Clock synchronization protection switching (BMC/SSM)
synchronization PTP node type: OC,BC,TC(P2P,E2E),and hybrid clock
1588V2 PTP node type: master, slave, and passive
Delay compensation
Time format convertion
Switching between PTP and 1pps+TOD
Close and enable based on port and NE
OAM Link OAM
Remote Defect Indication (RDI)


Local and peer-end link status display
Ethernet OAM object management
Ethernet OAM discovery
Ethernet OAM packet transmission and receiving
Ethernet OAM link monitoring
EFM
Ethernet OAM remote loopback
(IEEE 802.3ah)
Ethernet OAM event notification mechanism of diagnosis
information
Ethernet OAM SNMP NM
Ethernet OAM alarm and log
ETH-CC
ETH-LB
ETH-LT
ETH-AIS
CFM
ETH-RDI
(ITU-T Y.1731)
ETH-LM
ETH-DM
ETH-LCK
ETH-TST
TMC CC
TMC AIS
TMC RDI
TMC LB
TMC TST
TMC LCK
TMC LT
TMC CSF
TMC LM
MPLS-TP OAM TMC DM
(GACH+Y.1731) TMP CC
TMP AIS
TMP RDI
TMP LB
TMP TST
TMP LCK
TMP LM
TMP DM
TMS CC
TMS LCK


TMS RDI
TMS LB
TMS LM
TMS DM
Maintenance UNI ping
commands NNI ping
AC and PW failure association
LSP and PW failure association
OAM Mapping
Section and LSP failure association
OAM Mapping in VSI scenario
Crossing card M+N protection
Equipment level Clock main control card 1+1 protection
protection Power supply card 1+1
Equipment power down recovery
DOS attack
Network ingress filtering
Port broadcast filtering
Attack defense
Anti-ARP attack
CPU protection
Operation system enhancement
MPLS-TP TMP layer
LSP1+1/1:1 protection
Reliability linear protection
PW/Pw list 1+1/1:1 protection
MPLS-TP TMC linear
SD triggers PW protection switching
protection
Inter-layer delay: support TMP, and TMC inter-layer delay
Wrapping
MPLS-TP TMS layer Wrapping signal degradation
ring protection Shared ring protection
Cross-ring shared ring protection
Network access side
Eth LAG/MC-LAG
protection
Dual-homing Ethernet interface: 1+1/1:1, return, non-return, and
protection E-Line/E-LAN/E-Tree
Realtime data statistics
History data statistics
Performance Section/LSP/PW
Average rate
statistics traffic statistics
Network throughput
Packet drop percentage
Operation and Alarm management Alarm management


maintenance Performance query
Performance monitoring setting
Performance threshold setting
Performance Performance counter clearing
management Realtime performance statistics and bandwidth utilization statistics
Realtime consumption check and statistics
Peak rate report
Traffic statistics based on priority
CLI
Equipment SNMP
management Telnet
interface Qx (EMS/SNMS)
SSH/SSL
Management
User authority level control
authority level
Telnet/SSH
Remote access
SNMP V2/V3
FTP Client/Server
File access
TFTP Client
Configuration saving Regular disk writing
Operation log Operation log record
Alarm log record Log server function
Telnet
FTP Client/Server
Operation protocol
TFTP Client
NTP client
User authentication
Source address limit, maximal connection data limit
User access control User authority level control
Password periodic aging
Confirming mechanism for dangerous command such as Reload.
Configure storage recovery
Configure data lossless download
NE management
Configure data integrity
Gateway NE functions (GNE)
OSC, GCC, manage VLAN, multiple channels with external circuits
DCN functions Management IP address generated and launched automatically by
default
Authentication Authentication CE authentication


FCC authentication
6.6 Optical Power Amplification
6.6.1 Erbium-Doped Fiber Amplifier
ZXONE 9700 system uses mature EDFA (Erbium-Doped Fiber Amplifier) technology to
realize long/medium-distance transmission. EDFA makes the signal gain per channel
independent from the total count of the channels in the fiber by using gain locking
technology and transient control technology. At the same time, when some channels are
added or lost suddenly, it can avoid the interferences to the existing channel.
At the same time, the coupling between EDFA and fiber is very good. The characteristic
of EDFA is good for its high gain, less noise, large bandwidth, high output power, high
power efficiency, low insertion loss and resistance to polarization.
ZXONE 9700 system provides multiple sorts of EDFA and EDFA with high output power.
It supports the amplification of 100GHz/50GHz spacing signals on C band which are
proposed in ITU-T G.694.1.
6.6.2 Raman Amplification Technology
In long-distance DWDM system, radiation caused by EDFA will restricts entire system
performance. By using distributed RAMAN amplifier (DRA) and hybrid Node Amplifier
(HNA), ZXONE 9700 effectively reduces system noise and nonlinear effect (i.e. use EOA
board and DRA board together or HNA). This method effectively improves optical
amplifying performance of the long-distance DWDM system.
6.7 Forward Error Correction
ZXONE 9700 provides optical wavelength transponder unit and branch unit with FEC
(Forward Error Correction), AFEC (Advanced Forward Error Correction) and SD-FEC
(Soft Decision FEC) services. This configuration on one hand reduces the requirements

for optical signal to noise ratio (OSNR) of receiver; on the other hand it extends the
transport distance between all optical amplification section and regeneration. At the
same time, it decreases the error rate caused b transmission and enhances the transport
quality of DWDM transport network.
By using AFEC algorithm, it effectively improves OSNR 7 dB~9 dB.
By using SD-FEC algorithm, it effectively improves OSNR more than 11db.
rd
By using 3 generation SD-FEC algorithm, it effectively improves OSNR more than
11.8db.
6.8 Tunable Wavelength
ZXONE 9700 equipment is designed with 400Gbit/s, 100Gbit/s, 40Gbit/s and 10Gbit/s
wavelength conversion units to change wavelength. The maximum value of 400Gbit/s
optical wavelength conversion unit is C waveband 75GHz/125GHz/150GHz. The
maximum value of 100Gbit/s optical wavelength conversion unit is C waveband 50GHz
interval 80 wave. The maximum value of 40Gbit/s or 10Gbit/s optical wavelength
conversion unit is C waveband 50GHz interval 80 wave. The maximum value of 2.5Gbit/s
optical wavelength conversion unit is C waveband 100GHz interval 16 wave. The optical
wavelength conversion unit with variable wavelength can either be service module
directly or spare components used to replace the optical wavelength conversion unit of
different wavelengths to reduce the number of optical wavelength conversion unit and
decrease the component costs.
6.9 Optical Layer Protection Service
ZXONE 9700 is capable of the following manners of optical layer protection: OCH 1+1
protection (O-SNCP) and OMS 1+1 protection (optical multiplex section 1+1 protection).
6.9.1 OCH 1+1 Protection
Optical channel 1+1 protection is implemented by SOP board on the basis of concurrent
delivery and primary reception theory. At the sending end, the protected services are split

into two parts via the coupler on SOP board and goes into two OTUs (OTU redundant
mode) for different sending path. At the receiving end, signals with better quality will be
received by using primary circuit on SOP board. Take the protection of a group of service
as an example. As Figure 6-7 shows:
Figure 6-7 Channel 1+1 Protection
O O
B P
O A A O
M M
OTU D O O
D OTU
P B
S A A S
Client
Client
O O
P O O P
B P
OTU O A A O OTU
M M
O O
D P B
D
A A
Channel 1+1 protection not only realizes routing protection but also implements
equipment protection (OTU is in redundant mode)
6.9.2 OMS 1+1 Protection
Optical MS 1+1 protection keeps section-by-section 1+1 protection mode. According to

different locations of EOA board, MS 1+1 protection consists of EDFA shared
configuration mode and EDFA redundant configuration mode. As Figure 6-8 and Figure
6-9 show (take the protection of a group of service as an example):
Figure 6-8 OMS 1+1 Protection (EDFA in redundant mode)
O O
O DCM B Working route P DCM O O
M A A B D
A
U U
O O
DCM B Protection route P DCM
S A A S
O O
P P
O O
DCM P Working route B DCM
A A O
O O
D B M
U A O O U
DCM P Protection route B DCM
A A

Figure 6-9 OMS 1+1 Protection (EDFA in shared mode)
Active Line
O O
O O P DCM D
M DCM B A
U
A
U
Standby Line
S S
O O
P P
Active Line
O O O O
D DCM P B DCM M
U A A U
Standby Line
It is only suitable for the same dispersion compensation of active and standby fibers. SOP loss counts
into line loss which influences system SNR
6.10 Electrical Layer Protection
6.10.1 ODUk Channel 1+1 Protection (ODUk-SNCP)
ODUK-channel 1+1 protection uses double-emission and double receiving service to

protect line board and fiber. It protects signals whose granularities are ODU0, ODU1,
ODU2, ODU3 and ODU4. The working philosophy of ODUk channel 1+1 protection is as
shown in Figure 6-10:

Figure 6-10 ODUk Channel 1+1 Protection
Demultiplexer
1
Line-side
card 1
Multiplexer
1
ODUk switching Client-side

unit card
Demultiplexer
2
Line-side
card 1
Multiplexer
2
6.11 Dispersion Management
For ZXONE 9700, the maximum dispersion tolerance of 2.5Gbit/s, 10Gbit/s, 40Gbit/s,
100Gbit/s and 400Gbit/s systems is 12800ps (around 640km), 800ps/1600ps
(about40/80km), +/-1000ps/+/-800ps, +/-70000ps and +/-70000ps respectively. When
system transmission is longer, restriction to dispersion must be considered for 10Gbit/s
system, 40Gbit/s system specially.
According to specific requirements, ZXONE 9700 configures related dispersion

compensation module to make up bandwidth dispersion.
For 40Gbit/s system, the adjustable dispersion compensation module inbuilt in the
receiving unit can automatically control dispersion compensation. So the 40Gbit/s
system can be compatible with 10Gbit/s system.
For 100Gbit/s system and 400Gbit/s, using the high speed DSP technology, the

dispersion compensation capability can support +/-70000ps, so which doesn’t need the
additional compensation usually.
The dispersion compensation module in the 10G/40G system can be configured in the
way shown in Figure 6-11.
Figure 6-11 Configuration of Dispersion Compensation
6.12 Automatic Power Shutdown/Reduction
Configured by network management software, ZXONE 9700 supports Automatic Power

Shutdown (APSD) and Automatic Power Reduction (APR). When the OA board with
optical performance inspection service finds lightless line, the OA will make the executive
board (EOA board) to reduce power or shut down power. This mechanism prevents
people’s eyes from being hurt by laser. When the failure is recovered, the system can
come to normal operation automatically (or manually).
APR is used on one optical transmission section (OTS). When any OTS breaks down,
other OTS and downstream alarm won’t be affected. In the course of APR processing,
Clamp output of EOA amplifier of each receiving end is guaranteed. The EOA amplifier
of the sending end is shut down.
OTU module and branch module of ZXONE 9700 can also provide APSD service. When
one client optical interface of the peer-end OTU module receives does not have input
signal, the corresponding client sending optical port of local OTU module will shut down
the laser automatically.
When WDM optical receiving port of OTU module does not have signals, all client

sending optical ports will shut down the laser automatically.
6.13 Optical Power Management
Optical power management service consists of line attenuation control service (LAC)
VOA SFP and automatic gain control service (AGC).
6.13.1 LAC/VOA SFP Service
As per line optical power inspection situation, the network management adjusts EVOA to
guarantee all cross-section power points, receiving power of the receiving end and
OSNR to keep normal values.
6.13.2 AGC Service
EDFA of ZXONE 9700 uses gain lock amplifying mode. The value of the gain lock can
changed flexibly to satisfy the requirements of relays with different distances. Within all
input and all working temperature, the resolution of the gain adjustment is 0.1dB.
Despite the wavelength of fiber, AGC can implement gain lock of single channel. Any
wave increase or drop, or fluctuation of optical signal of one or multiple wavelength will
not influence signal gain of other channels.
6.14 Automatic Performance Optimization (APO)
If transmission distance is long and many amplifier sites in the middle, the problems of
optical power become more apparent. For example, the fiber attenuation is increased
with fiber aging or some environment influence; optical power difference of every
channel becomes larger. In this case, the Automatic Power Optimization (APO) is
necessary to WDM system.
ZXONE 9700 provides OMS and OCH APO service.
 OMS APO: build and keep the optimized status of MS group line power.

 OCH APO: build and keep the power balance in the channels.
6.14.1 OMS Layer APO Management
OMS layer power management is implemented based upon power management domain.
The power management domain refers to one MS, i.e. OMS between two OTMs or
FOADMs (ROADM). It requires independent performance in each power management
domain, e.g. power consumption and SNR.
The MS power management service guarantees a constant difference between all gains
and line loss of every channel.
In real optical line, when the difference of gain loss satisfies the condition of initiating MS
power management, power optimization will start. When the difference of gain loss
meets the requirement of MS power management, the optimization is over.
MS power management can be implemented by using module and network management

software together.
 Module
Module implements power monitoring and adjustment, including LAC, VOA SFP, EOA
and HNA.
 Network Management Software
Set all parameters of power management; query existing power status; send power
management command to module; support automatic and manual adjustment.
6.14.2 OCH Layer APO Management
OCH layer power management focuses on the power in OCh. OCh is the section
between line ports of optical transponder unit which implementing end-to-end connection
of all signals (PDH, SDH and ATM)
Channel layer power management consists of fixed power compensation and dynamic
channel power management. Fixed power compensation uses intelligent optical amplifier
to ensure the gain flatness of the amplifier. Dynamic channel power management uses

power pre-optimization technology and dynamic gain optimization technology to adjust

the optical power of all signal channels. In this way, the optical power of all signal
channels at the system optical receiving end can be balanced.
 Fixed power compensation
Fixed equalization filter in EDFA guarantee even gain spectrum.
 Dynamic channel power management
By using VMUX, WBU, WSU, gain spectrum slope efficiency adjustment technology,
dynamic gain optimization technology and optical performance monitoring technology,
these methods optimize power of all channels caused by nonlinear effect and multi-stage
amplifier gain un-flatness in large-capacity or long-distance system.
This mechanism can realize channel layer power management of OTM, FOADM and
ROADM. The network composed by these devices can be in end-to-end mode, link
mode and ring mode.
6.15 Performance Inspection
ZXONE 9700 has optical performance inspection unit. It is responsible for measuring
parameters of each optical path, e.g. optical power, central wavelength and OSNR. Also
relative data can be sent to the network management system. The network management
system supports two view manners, i.e. spectrum and data.
An optical forwarding part is capable of complete performance monitoring and consume

processing service. By inspecting different access signals hierarchically, it can
accurately locate the failure and determine fault type.
 OTN signal: LOF, BIP-8, consume TTI, correctable error, uncorrectable frame,
OTUk-AIS, ODUk-AIS, ODUk-OCI, ODUk-LCK, PM-BIP8 and ODUk-PT
performance and alarm.
 SDH signal: Monitor B1, B2 and J0 bytes.
 GE signal: Monitor error packet number and error packet ratio, GFP performance

test.
All modules of active channel for ZXONE 9700 use large-scale and highly precise power
collection and monitoring technology. With less than 1dB error, it truly shows the system
performance.
6.16 Integrated Wavelength Monitoring
ZXONE 9700 provides two ways to keep stable wavelength. They are suitable for
different channel space systems.
 100 GHz channel space
Automatic power control, temperature and inbuilt wavelength feedback mode are used.
This function is implied in OTU board.
 50 GHz channel space
Inbuilt and additional wavelength feedback mode is used to enhance the stability and
precise of the wavelength.
 Inbuilt wavelength feedback
Implemented by OTU, this service is same as 100GHz channel space service.
 Additional wavelength feedback
The additional wavelength feedback of ZXONE 9700, i.e. wavelength monitoring

subsystem, uses integrated inspection and order adjustment mode to realize the control
of wavelength feedback.
This system is implemented by EOWM, Multiplexer, OTU, SNP and network software
together. The service is as shown in Figure 6-12.

Figure 6-12 Wavelength Monitoring Subsystem
EOWM board receives multiplexed optical signals from MON interface of amplifier.
Inspect wavelength deviation of all path wavelengths in multiplexed signals. If the
deviation exceeds restriction, SNP will be informed to send wavelength adjustment
command to related OTU board until the deviation disappears.
NM software implements parameter setting, initiation/forbidden services in the course of

wavelength adjustment. The command is sent to EOWM board.
6.17 Communication and Monitoring
6.17.1 Optical Monitoring Channel
The monitoring and management information of ZXONE 9700 system can be delivered
and communicated via OSC. The wavelength of OSC is 1510nm, and the transmission
speed is 100Mbit/s.
The delivery and communication of ECC data between NEs, business and transparent
user channel data and APS information are implemented via SOSCB module and borne
on OSC. One piece of SOSCB module can monitor four optical directions of information.
The major services are:

 Encapsulate ECC data, APS data, transparent user channel data and public voice
data among network elements in 100M monitoring subsystem, then delivery them in
Ethernet data frame. Compared with fixed overhead byte, IP encapsulation gives
convenience to the extension of signaling message.
 With 10/100BASE-T Ethernet electrical interfaces (actually physical interface is

provided by EIC/SAIK board), it is capable of automatic switching service.
SNP/NCPK board and NM accessed to100M monitoring subsystem delivers
monitoring information in NE via SOSCB board and standby route.
 On the front panel, there are 4*100BASE-FX Ethernet optical interfaces accessing
1510nm monitoring path to implement monitoring information delivery between NEs.
100BASE-FX is 100 Mbit/s optical interface.
 Hardware-based L3 forwarding monitoring information capability is provided. L3

routing protocol is used to make network DCN-based interconnection easier. This
mechanism makes the signaling more adaptive to complicated networking
scenarios.
 OSPF protocol and dynamic routing are used. With plug-and-play fiber, there’s no
need for manual configuration. Automatic route switchover can be implemented in
the course of network capacity extension, fiber and node breakdown.
SNP/NCPK board reports NE and its subnet alarm and performance to NM. At the same
time, it receives the commands and configuration from NM to local NE and its subnet.
6.17.2 Electrical Supervisory Channel
The supervisory and management information of all ZXONE 9700 sites can be delivered
and communicated via ESC. ESC uses GCC overhead of G.709 to supervise path and
implement multiplexing and demultiplexing services. It is competent to sending NM,
public, protection and APR information.
6.18 Time/Clock Synchronization Service
ZXONE 9700 supports clock and time synchronization. It meets the requirements of the

3G base station for precise time synchronization.
 Clock synchronization: It refers to the frequency synchronization. The frequencies

or phases of signals are closely related. Normally, the frequencies are the same
and the phase difference is constant for stable equipment operation.
 Time synchronization: The frequencies and the phases of signals are the same.
Normally the time synchronization includes clock synchronization. The IEEE
1588V2 protocol is a widely-used time synchronization protocol.
The ZXONE 9700 clock synchronization function supports transmitting clock

synchronization signals among subracks and networks. It has the following features:
 Supports the clock synchronization and the time synchronization to meet the
requirements for time synchronization accuracy.
 The physical-layer synchronization mechanism extracts clock from the serial bit
stream in physical channel of transmission link to implement the frequency
synchronization.
 The time synchronization complies with the IEEE 1588 V2 protocol. The ZXONE
9700 system provides an out-of-band time synchronization interface between
1pps+TOD and FE to implement the out-of-band time transmission.
 Uses the Best Master Clock (BMC) algorithm to select a clock. The BMC algorithm
compares the descriptions of two or more clocks, and selects the better one. The
Ordinary Clock (OC), Boundary Clock (BC), and Transparent Clock (TC) are
supported.
 Supports processing the Synchronization Status Message (SSM) and the delay
compensation.
 Supports the protection switch of active/standby clock sources.

6.18.1 Clock Synchronization
Three clocks that are transmitted in the OTN network are as follows: 2M BITS clock, SDH
service clock, and synchronous Ethernet clock. The OTN equipment supports two clock
transmission manners.
 In-band clock transmission: The clock signals are transmitted through the service
channels.
 Out-band clock transmission: The clock signals are transmitted through the OSC
optical supervision channel.
For a description of two clock transmission manners, refer to the following table.
Table 6-20 Clock Transmission Manner
Clock Implementation Solution

Transmission
Manner
In-band clock SDH service and synchronous Ethernet clock transparent

transmission transmission.
OTN network transparent transmit the STM-1/4/16/64
service and GE/10GE/40GE/100GE synchronous
Ethernet, does not change the clock.
Out-band clock Solution 1: SDH service (STM-1/4/16/64) and

transmission synchronous Ethernet (GE/10GE/40GE/100GE) clock
extraction/recovery, and out-band transmission.
OTN equipment extract the service clock by using the
CCPK/NCPK board, and then transmit the clock signal
through SAIK board and OSC optical supervision channel.
Solution 2: 2M clock out-band transmission

The out-band clock transmission is implemented through
the SOSCB or SAIK board + TIS board configured on the
OTN equipment.
6.18.2 Time Synchronization
The OTN equipment supports transmitting IEEE 1588V2 time information through the
OSC optical supervision channel, the out-band time transmission.

The out-band time transmission is implemented through the SOSCB board and the time
access in different manners
Clock Implementation Solution
Transmission
Manner
Out-band clock Solution 1:1PPS+TOD

transmission Implementation through the SOSCB board and the TIS
board with 1PPS + TOD interface is configured on the
OTN equipment.
Solution 2: FE
Implementation through the SOSCB board with FE
electrical interface.
Solution 3: GE
Implementation through the SOSCB board and the SAIK
board with GE interface is configured on the OTN
equipment.
Solution 4: GE/10GE in service

OTN equipment extracts the service 1588V2 time signal
by using the CCPK/NCPK board, and then transmits the
clock signal through SAIK board and OSC optical
supervision channel.
6.19 Alarm Inspection Service
6.19.1 Input and Output External Alarm
ZXONE 9700 supports to input and output external alarms.
 Input external alarm
Via the external alarm input/ external alarm output/alarm specification interface and ring
stream input interface on EIC/SAIK board, the device uses optical coupler to isolate
signals to access the alarm input by external monitoring device. And the alarm s can be
directly displayed on NM. The alarm type can be set by network management system,
and used for inspect alarm of fan, door and temperature.
 Output external alarm

The device send alarm signals to heads rack, alarm specification board or other
monitoring units except the rack via the external alarm input/ external alarm output/alarm
specification interface and ring stream input interface on EIC/SAIK board. Equipment
alarm output, alarm specification board drive and ring stream input signal use optical
coupler to isolate signals or level drive signals.
6.19.2 Internal Alarm Inspection Service
ZXONE 9700 module supports alarm inspection based upon communication, device and
outside environment. The inspected alarms are as shown in Table 6-21:
Table 6-21 List of Alarm Inspected by ZXONE 9700
Alarm Type Inspected Alarm
Exceeding optical power warming, SDH service alarm, OTN

Communication service alarm, unlock alarm, service error alarm, trace
alarm mismatch alarm, exceeding reflection optical power alarm,
exceeding reflection efficiency alarm
Temperature alarm
Laser and module temperature alarm
Current alarm
Overflow of laser/cooler alarm, offset current of laser alarm,
pump laser offset current/cooling current overflow alarm
Device alarm Module alarm

Laser/pump lifetime alarm, laser invalid alarm, M-Z modem
offset exceeding voltage alarm, invalid module or module fault
alarm, DSP operation alarm, pump reflection exceeding
optical power alarm, exceeding pump reflection efficiency
alarm, invalid laser alarm, board not in place alarm,
flashboard alarm, fan fault alarm
External
environment Fire, temperature and equipment room alarm
alarm
6.19.3 PRBS Function
Boards on client sides have Pseudo Random Bit Sequence (PRBS) functions. The board
supporting the PRBS function works as a simple self-sending-and -self-receiving test

meter. Tests without meters can be implements, which is easy for fault location and
maintenance.
During commissioning debugs or fault location processes, you can replace service
signals of the clients with PRBS signals and determine whether the equipment or
transmission lines are normal by analyzing the PRBS signals looped back from the
remote end.
The principle of the PRBS test function is shown in Figure 6-13
Figure 6-13 PRBS Test Principle
The Tx port of the service board sends PRBS signals, which are transmitted to the
remote end through the DWDM network. The signals are looped at the client side and
tested through the Rx port.
6.20 VC Switching
ZXONE 9700 provides VC switching for the TDM services. The VC cross-connect car is
PSV, which can supports 240G VC4 cross-connection or 200G VC4+40G VC12
cross-connection. The VC solution is shown below:
Figure 6-14 VC cross-connect solution

There is some advantages for the VC cross-connect solution:
 The VC cross-connect card adopts modular design. You can add VC cross-connect
cards in the NE that needs VC cross-connection to reduce customers’ early-stage
investment. VC cross-connect cards support plug and play. The current network
upgrade is flexible without changing cross-connect cards, and does not affect
existing network services. It can borrow empty service ports without the need for
special customer-side and line-side cards to save customer investment.
 Less service card types can facilitate OAM.
 The comprehensive cost is low. It uses existing service cards instead of

high-power-consumption hybrid line cards to achieve high level of integration and
low power consumption to reduce customer OPEX.
 The granularities of dedicated line services will increase in the future. It can save
investment on service cards when dedicated line service shifts from VC level to
ODUk.

7 WASON
7.1 Overview
ZTE unified control platform (ZXUCP) a self-researched intelligent optical network

control platform can be implemented on ZXONE 9700 intelligent WDM series products
providing intelligent features based on GMPLS control platform. ZXUCP A200 is a
control platform software system based upon WASON (Wavelength Automatically
Switched Optical Network) of WDM platform. Based upon WDM/OTN technology, this
platform can realize automatic routing, resource and network topology automatic
discovery, service grooming, traffic engineering and multi-level service level agreement.
It can fully satisfy user’s networking, network control and management. It can be used in
building edge layer of large MAN (aggregation and access), metro backbone layer,
national and local backbone network.
Figure 7-1 Positioning of the Control Platform in Optical Transmission Network
W WASON Control Plane OCC

A
S
NMI OCC OCC OCC
O NNI
E_NN I
N
M User
Signaling
a
Switch
n UNI CCI
器
a NMI
g
e Client Switch Switch Switch Client
me.g. IP,
IrDI e.g. IP,
e ATM, ATM,
n TDM WASON Transmission Plane
TDM
t
P OCC: Optical Connection Controller N NI: WASON Control Node-Node Interface
l
UNI: User Network Interface IrDI:Interdomain Interface
a
CCI: Connection Control Interface N MI: Network Management Interface
n
e

7.2 WASON Functionality
This chapter gives specific introduction to all features of ZXUCP A200, including
automatic discovery service, route constrain, multi-level service protection and
restoration, end-to-end service configuration, SRLG management , multi-level
management of LSP, OTN control, graceful restart of control plane, control plane 1+1
backup, maintenance and log management.
7.2.1 Automatic Discovery
DA, LRM and DCL protocol stack work together for automatic discovery. The system
provides adjacency discovery of control channel and CP as well as DT and LAD
functions.
7.2.1.1 Automatic Discovery of Layer Adjacency
Control plane carries out automatic discovery of OCH adjacency layer and ODUk
adjacency layer. Automatic discovery of layer adjacency includes valid links
connected to each node in the network, adjacency node of data plane, CP adjacency
point. The CP supports link attribute association and link bundle to integrate several
data links into one TE link and synchronize TE link attributes at both ends.
7.2.1.2 Automatic Discovery of Network Element
Control plane will find new added NE by the function of adjacency discovery if fiber
configuration is right after the installation of circuit pack. Link resource automatic
discovery will flood the resource information of new NE. The network element
continuously monitors the state and attributes of its local facilities. The control plane
instance in the NE updates its local NE topology database. Upon start up of a Control
Plane-equipped network, all NEs will discover each other, identify resources, and create
a high quality network database containing the complete topological view of the network
and a highly accurate resource map.

Adjacency discovery is a process in which an individual network element automatically

detects logical and physical connectivity to its neighbouring network elements on a port
basis by exchanging interface information. Adjacent discovery is mainly implemented by
Link Management Protocol. LMP runs on the transport plane between adjacent nodes
to provide links and manage bidirectional control channels between them. It includes
functions of control channel management, link property correlation, link verification and
link fault management. LMP creates control channel, and discovers neighbor peers by
data package detecting.
7.2.1.3 Automatic Discovery of Network Topology
CP discovers new adjacency nodes through LMP and broadcasts services in control
domain through OSPF-TE so that each control node automatically creates and
synchronizes network topology database. The control plane auto-discovers neighbour
and link, and then flood link information to each neighbour node by OSPF-TE, that
makes all instances in control plane have a complete network topology.Control plane
instantly floods and updates database to reflect any change of such network resource as
fiber, tag, optical electrical processor (OEP) , link state.
7.2.2 Route Wavelength Assignment
RWA model fefines the way of route and wavelenth assignmient while creating a
connection:
Step 1: Routing (select the route for each request)
There are two types of routing scheme: fixed routing and alternate routing. Fixed routing
means that one fixed route is selected for each channel. It usually employs the shortest
path algorithm as known. Alternate routing means that several routes are selected for
each channel.

Figure 7-2 Route selection
The simplest way is to select k shortest paths. When the wavelengths are assigned to a
group of routes of several channels, if there is no sufficient wavelengths, alternate routing
will be replaced to select new alternate routing and then the wavelengths will be
assigned.
Step 2: Wavelength assignment
If there is no wavelength conversion for optical network nodes, the restriction for
wavelength assignment is that each connection path would be in the same wavelength
and different channels in one fiber would be assigned to different wavelengths. If a node
can implement electrical cross-connected, the wavelength can be delivered from optical
layer to electrical layer for wavelength conversion and physical-layer signal regeneration.
Figure 7-3 Wavelength assignment
Step 3: Optical damage limit

RWA also needs to consider physical factors, such as OSNR/CD/PMD, then connection
can be successfully established..
7.2.3 Control Plane Signaling and Routing
Control plane signaling supports management actions of call and connection which
comply with the ITU-T’s G.8080 and G.7713 recommendations. ZXUCP A200 designed
CC (call connection) managements for individual connections such as setup, release,
modification and query of connection. Each NE can have more than 10 adjacent
neighbors in one OSPF stack instance. The maximum number of adjacent neighbors is
based on capacity of NE hardware.
ZXUCP A200 routing is designed following OSPF-TE and comply with ITU-T G.7715
ASON routing architecture and IETF RFC2328, RFC3630, RFC4655, and so on. There
can be 250 NEs(including OLA) and dozens of thousands of connections in an optical
routing area. The addition of NEs/links/domains will affect the topology of the network,
however, will not affect the exsiting services if related resource allocated for them not be
changed/occupied.
ZXUCP A200 designed constrained route calculation including the following constrained
conditions and combinations of them:
1. Minimum link cost. The distance of link can also be transformed into link cost
according to the requirements of operators.
2. Minimum route hops.
The alternative is selected in the calculation and the default is the minimum link
cost.
3. Minimum delay. ZXUCP A200 support to select the best route according to the
transmision delay.
4. Included network resources in the connection, e.g., channel, timeslot, wavelength,
node and link.

The route is strictly restrained. It is required to specify each node in the route
sequence. If the node is specified but the link is not, specific link would be given in
the route calculation. If the link is specified, it would be verified in the route
calculation.
5. Exclude network resources in the connection, e.g., node, link.
Un-necessary nodes and links excluded in the route calculation. If SRLG

irrelevance is started at the same time, the route calculation would exclude the link
which has the same SRLG as the specified link.
6. Strict explicit route constraint.
7. Connection diversity constraints, including node irrelevance, link irrelevance and

SRLG irrelevance.
Node irrelevance: If the routes of two connections have no overlay node except
source and destination nodes, they have the node irrelevance function.
Link irrelevance: If the routes of two connections have no overlay link, they have the
link irrelevance function.
SRLG irrelevance: If the routes of two connections have the links of different SRLG,
they have the SRLG irrelevance function.
8. Load balance.
Generally, the data traffic on network links are unbalanced and if the links with much
traffic are invalid, the network and services will be affected seriously. .
In order to reduce the network interruption risk, WASON can monitor the resources
utilization rate of links in real time and select the routes for services according to the
links utilization rate. Then the whole network traffic will be allocated on the links
averagely.

7.2.4 Protection & Restoration on Control Plane
ZXUCP A200 designed different levels of protection and restoration to against

multi-failures. Service Level Agreement (SLA) classified services into different levels in
the view of service protection. The specific information is as shown in the following table:
Table 7-1 Service Level Agreement
Protection and
Serve
Restoration Implementation Mode Switching/Restoration
Level
Policy
Diamond Layer 0: OP builds 1+1 Multiple 1+1 protection
Permanent 1+1 protection and ROADM switches.
protection if performs restoration. It starts rerouting to
resource is Layer 1: 1+1 protection and create a new
available restoration based on ODUk restoration route while
electrical cross-connection. protection switching.
Gold Layer 0: OP builds 1+1
One protection The first time is 1+1
protection and ROADM
and permanent protection switch; and
performs restoration.
restoration if then it will reroute to
Layer 1: 1+1 protection and
resource is create a restoration
restoration based on ODUk
available route after it breaks
electrical cross-connection.
Silver One 1+1
Support once 1+1 protection, Once 1+1 protection
protection, no
no rerouting process switching.
restoration
Copper No protection, MESH restoration; against
permanent multi-point failures.
restoration (if Layer 0: ROADM rerouting; Multiple restorations
resource is Layer 1: electrical
available) cross-connect rerouting
Iron No protection
N/A N/A
or restoration
Diamond level: Multiple 1+1 protections. Diamond LSP (LSP is related to intelligent path)
includes OCh (10G, 40G, 100、B100G) on layer 0 and ODUk (k=0, 1, 2, 2e, 3, 4) on layer
1. The restoration path can share the same resource with its original path, when working

and protection link fails, working restoration and protection restoration can share some
resource, such as wavelength, ODUk, line port, REG.
1. Initialized working path and protection path with 1+1 path.
2. Working path failure triggers protection switching (within 50ms), and at the same
time, the control plane starts computing a new route to create a connection for new
protection path. In case of protection path fails while working path is well, the control
plane starts computing a new route to create a connection for new protection path,
that keeps the traffic in 1+1 protection state.
3. Working path failure triggers 1＋1 protection switching again, and the control plane
restores traffic to a new protection path at the same time.
4. The same action of switching and restoration will be executed refered to the path
failure as described above if the resource are always available.
Gold level: Once 1+1 protection, and multiple mesh restoration. Gold LSP includes OCh
(10G, 40G, 100、B100G) on layer 0 and ODUk (k=0, 1, 2, 2e, 3, 4) on layer 1. The
restoration path can share the same resource with its original path, when working and
protection link fails, working restoration and protection restoration can share some
resource, such as wavelength, ODUk, line port, REG.
1. Initiated working path and protection path with 1+1 protection
2. If working path fails, control plane switches traffic to protection path within 50ms,
without any rerouting action. If protection path fails again, the control plane starts
computing a new route to create a connection for restoration path.
Silver level: once 1+1 protection without mesh restoration. Silver LSP includes OCh (10G,
40G, 100、B100G) on layer 0 and ODUk (k=0, 1, 2, 2e, 3, 4) on layer 1.
1. Initiated working path and protection path with 1+1 protection.
2. If working path fails, the control plane switched traffic to protection path within 50ms.
If protection path fails again, the traffic is broken.

Copper level: Multiple mesh restoration. Copper LSP includes OCh (10G, 40G, 100、
B100G) on layer 0 and ODUk (k=0, 1, 2, 2e, 3, 4) on layer 1. The restoration path can
share the same resource, such as wavelength, ODUk, line port in board, REG.
1. Initiated working path.
2. When working path fails, the control plane starts computing a new route to create a
connection for restoration. If fails again, the restoration executes to create a new
connection if resource available.
Iron level: No protection, no mesh restoration.
If the user want to modify the SLA of the service, the service level transfer function, which
used to change SLA level, will help to make it without interrupting the running service.
7.2.5 Fast End to End Service Configuration
Besides PC(permanent connection) way of service configuration, SPC (soft permanent

connection) and SC (Switch Connection) are implemented on control plane.
Taking SPC as an example, its specific operations are as below:
1. SPC creation: After receiving MP request, CP creates SPC which would meet user
service attribute requirements and support some policies, e.g., shortest path,
protection & restoration scheme. The result will be reported to MP.
i. Select source and destination nodes.
ii. Input constraint conditions to specify needed route.
iii. Input service type information.
iv. Create End to End electrical (optical) channel.

Figure 7-4 SPC Creation
A B C
E F G
2. SPC modification: The user can modify SPC attributes on MP, e.g., protection type
and service parameters. The modification neither breaks service nor affects MP
performance. The result will be reported to MP.
3. SPC query: Originate the request querying connection attributes or status from MP
CP can queryservice statuses, e.g., service normal, service unusual, several

transient state (such as building up, recovering, migrating).
CP can query connection attributes and route information (one item or multiple
items), e.g., bandwidth, direction, A/Z endpoint, protection & restoration attributes
and statuses, service creation time, connection type (SPC) and route details.
4. SPC deletion: CP can delete the connection as required by MP. After deletion, all
resources related to the connection will be released. The result is success will be
reported to MP NM will clear residual connection.
5. SPC conversion to PC: SPC controlled by CP can be converted into PC controlled

by MP. Service would not be damaged during this transform process.
7.2.6 SRLG Management
CP supports SRLG (Shared Risk Link Group) management. The links with same risk are
set to SRLG. SRLG will help to avoid the LSP which has the sme risk as the faulty link
while rerouting. And link SRLG attributes can be configured.

As shown in the following figure, working route is green line and the links L1 and L2 are
in the same SRLG. If a fault occurs in L1, there will be the same fault risk to L2. SRLG
can be set for L1 and L2 to improve the ratio of successful rerouting and shorten the
service restoration time.
Figure 7-5 Shared Link Group Service
L1 and L2 share a
Bundle ID 1 common structure.
L1
L2 End
End System 2
System 1
L3
Working
Protect
7.2.7 Multi-layer LSP Control
In traditional WDM/OTN network, wavelength is usually used as granularity in route

selection. ZXUCP A200 system can aolso provide ODUK granularity switching capability.
The control plane supports such granularities as: ODUk(k=0,1,2,2e,3,4) and Och(10G,
40G, 100、B100G), sub-wavelength level and wavelength level of OTN on the unified
control layer.
7.2.8 UNI interface
UNI (User Network Interface) is a logic interface between the client device layer and the
Network layer. There are two types of UNI interface which are defined by different
standard organizations, OIF UNI and GMPLS UNI.
Via UNI, UNI-Client device can launch SC connection requirement to OTN network
automatically, which implements unified schedule of IP and OTN network. The main
functions of UNI are as followings.

1. Creation of SC connection, which will be able to establish one SC connection

between two access points according to connection attribute which is required by
client. The establishment should satisfy the strategy defined by network and the flow
of safe management.
2. Deletion of SC connection, which will be able to delete one exist SC connection.
3. Status querying of SC connection, which will be able to inquire the status of one SC
connection.
7.2.9 E-NNI interface
E-NNI is a bidirectional signaling interface between control entities which are in different
control domains or operation networks. E-NNI interface supports such functions as call
control, detect source, control connection, selection connection and select connection
path. Exchange information through interface includes resource route information, call
connection control information, etc.
E-NNI supports SC service, that makes SC service can across over different domains via
E-NNI, and SPC service.
7.2.10 Inter-domain Routing
Inter-domain routing is a routing function used in that network consisting of

multi-domains divided based on several autonomy systems. Inter-domain routing
supports end-to-end path establish/restoration, end-to-end establishment/restoration of
1+1 working and protection path.
Basic strategies of inter-domain routing described as below.
1. Minimum cost/hop of end-to-end link.
2. Minimum sum of edge site
3. Minimum domain crossed
4. Include/exclude edge site, inter-domain path

5. Appoint domain sequence
Appoint such domain sequence route get through via NMS.
6. Multi-domain Independence
Implement the independence of domain, site, link, SRLG in multi-domain.
7.2.11 PCE
PCE (Path Computation Element) means the entity based on network topology using the
constraint terms to calculate the network paths or routes. Currently PCE is in an external
server form. PCE can calculate the TE LSP path by accessing to TED (Traffic
Engineering Database), and adopting bandwidth and other constraint terms. With the
application of PCE can eliminate the overload of the control plane node which brought by
the execution of RWA algorithm, and transfer the processing of RWA from RWA to PCE,
which can greatly improve the service control processing capability of control plane node.
Comparing to the distributed path calculation mode of RC in WASON, the centralized

path calculation mode PCE supports the requirements of more complicated path
calculation strategies, so that the accuracy of calculated path and customer satisfaction
can be significantly improved.
7.2.12 OTN Control
The system can create and rapidly restore a connection. OTN needs to create and
restore ODUk layer connection and restoration at granularity of ODUk and OCh layer.
Their functions are as below:
 E2E ODUk/OCh service configuration;
 E2E ODUk/OCh service restoration;
 Network topology discovery;
 Optical route calculation;
 Electrical route calculation;

 SLA-related parameters.
7.2.13 CP Graceful Restart Service
The system supports resetting CP through NMS, whichdoes not affect the existing
services.
After restarting, original control information including synchronization of transport plane

resource, synchronization of call and connection and the synchronization of the neighbor
node connection information can be recovered automatically
7.2.14 CP 1+1 Backup
CP adopts 1+1 backup. In case one CP goes wrong, the other will replace it.
In normal operation, active/standby CPs work at the same time and carry out data
synchronization to make their data consistent. Synchronizated data includes
configuration data, maintenance data and service data .
When active CP goes wrong, standby CP can ensure that created or restored connection
is not affected.
When active CP goes wrong, the connection being created needs a new request from
MP.
When active CP goes wrong, the connection in restoring needs new active CP to start a
new restoration.
When active/standby CPs fail, the created or restored connection is not affected.
7.2.15 Maintenance
1. CP supports real-time alarm reporting and the alarm shielding can be set. The user
can query current alarm in NM.
2. CP supports real-time event report, without affecting service restoration. The user
can query current and history event in NM.

3. CP supports remote online upgrade. The software has compatibility to identify the
engineering files, configuration files and database that backuped on old version. After
new version loaded, CP restarts and runs normally. Services go on without reporting of
abnormal alarm and event.
4. When equipment software fault shows up, the user can query each fuction status of
system through command line system, which is convenient for removing troubles.
5. Log system can record history of software operation and unusual information on
solid store equipment. It is convenient for trouble removal when software fault happens.
8 Software Defined Optical Network (SDON)
8.1 Overview
Driven by new service types and modes such as mobile Internet, the Internet of things,
high-definition video and cloud computing, optical transport networks need not only meet
the requirements of super bandwidth growth but also face the challenges of dynamic
service change, reduced utilization cost and value-added network functions. ZTE
software defined optical network (SDON) solution helps the operators to build intelligent,
elastic, efficient and innovative optical networks, converting them from traditional closed
infrastructure to open IT-based and software-based networks.

8.2 Architecture of ZTE SDON
Figure 8-1 Architecture of ZTE SDON
The SDON structure include three layers: The optical transport plane, The Control plane
and the application plane.
The optical transport plane adopts programmable optical network devices that have large
cross-connect capacity, good transmission performance, multi-service accessing and
oriented towards 100G and beyond 100G. The programmable features of the optical
transport plane include three layers: component programmable, node programmable and
network programmable.
 “Component programmable” is embodied in optical interfaces and components that
can be defined by software;
 “Node programmable” is embodied in the switch granularity, optical resource and
node scale;
 “Network programmable” is embodied in service connection and protection
restoration capability.
The control plane performs centralized management and control to optical network
devices on the switching capability and programmable capability. The interface between
the control and the APP or upper-layer controller is northbound interface CVNI, for which
OpenFlow or Restful protocol can be used. The interface between the controller and the

equipment is southbound interface CDPI, for which OpenFlow extended protocol can be
used. The main functions of the control plan are shown below:
 Service route computation, resource allocation and connection control functions.
 Global network views, forwarding states, network resource information and
utilization rate information and opens transmission resources to upper-level
applications after virtualization.
 With layered controller design (single-domain controller + orchestrator), it can be
easily integrated with an operator’s networks and can be extended flexibly according
to the network scale.
The application plane provides service application cloud for operators, leasing customers
and partners to meet the requirements of maintenance, operation and value-added
services. ZTE SDON solution is dedicated to building an open platform to promote
service innovation. The customers can choose ZTE to provide various application
services for them, or develop the desired applications conveniently and deploy them
quickly based on the open API provided by SDON controller, to increase the profit.
8.3 Smooth Evolution Path
Figure 8-2 Optical network control plane evolution
ZTE’s optical network WASON based on intelligent control plane has been widely
deployed all over the world. It can implement network resource auto discovery and
management, fast E2E service configuration, CoS and anti multi-point failure service

protection functions to simplify maintenance and improve network survivability. Moreover,

in large-scale network, it centralizes the complicated path computation function from
distributed NEs to the independent high-performance PCE server to achieve fast global
path optimization. It performs unified management on the whole network resource to
effectively improve the overall network efficiency.
The introduction of SDON further expands the function and scope of intelligent
management and control of optical networks with open and rich application layers.
SDON will further upgrade the management and control functions and open interfaces
based on the existing intelligent control plane and PCE technology, to guarantee smooth
network upgrade and protect the benefit of the telecom industrial chain.
8.4 Multiple Application Scenarios for Operators
8.4.1 Providing enterprise private line services as required
Enterprise private line with large-bandwidth and high-value is one of the major operator
revenue. Bandwidth on Demand (BOD) can provide services conveniently and rapidly in
complicated network environment. The service types, bandwidth granularity, service time,
SLA, service performance and connection route can be configured and adjusted as
required. This function highly improves user experience and wins competitive edge for
operators by solving such problems of traditional private line service as unitary service
type, long commissioning period and difficult maintenance.
8.4.2 Virtual subnet multiple lessee service
The SDON controller shields the details of physical network, virtualizes the network
resource and provides the virtual subnet control rights to the lessee. The lessee can
achieve self-service. It can establish connections and view logical topologies,
transmission resource, alarms and performance. The operator can transfer some
maintenance work to the customers, so it need not frequently respond to the customer’s
service change requirements. The operator’s network for self use can also be virtualized
to multiple logical bearer networks such as mobile backhaul, group customer and family
customer networks.

8.4.3 Multi-layer multi-domain network interworking and coordination
To bear cross-metro private line service, the optical transport network usually adopts
multi-manufacturer equipments and networks. SDON-based orchestrator can perform
unified management on multi-manufacturer equipments and implement service-oriented
E2E connection configuration, overcoming the difficulty of traditional OSS integration and
solving the problem of constructing a large network. SDON can help implement resource
optimization and coordinative control in IP+Optical network to reduce the load of
backbone routers and expansion pressure, lower the whole network cost and reduce the
transmission latency. When data centers are interconnected through optical network, the
policies of content synchronization, virtual machine migration and remote backup are
introduced to the SDN control plane to schedule optical network bandwidth resource and
increase bandwidth utilization.
8.4.4 Network management and operation automation
Using SDON for unified control, both network data and service information are
centralized and can be shared by all APPs on the application layer; network planning tool,
maintenance tool, preventative maintenance tool, evaluation and optimization tool are
effectively coordinated, which can reduce the network construction, service provision and
troubleshooting time, facilitate network operation automation and improve operation and
maintenance efficiency.
9 Technical Specifications
9.1 Optical Transponder Specifications
9.1.1 EOTU10GB Specifications
Technical specifications of 10Gbit/s Board at Client-side and Line-side are listed in Table
9-1 and Table 9-2

Table 9-1 Technical specifications of 10Gbit/s board at Client-side
Item Unit Parameter
Parameters of optical receive port at client side (S point)
Type of Receiver --- PIN/APD
-11 (I-64.1)
-11.1
(10GBASE-SR/10GBASE-SW)
-12.6
(10GBASE-LX/10GBASE-LR/1
-12 dBm
Receiving sensitivity (BER10 ) 0GBASE-LW)
-14 (S-64.2b)
-14.1
(10GBASE-ER/10GBASE-EW)
-26 (10GBASE-ZR/ L-64.2)
Max. reflection of Receiver dB <-27
0.5
0GBASE-LW)
-1
Overload power dBm (I-64.1/S-64.2b/10GBASE-SR/
10GBASE-SW/10GBASE-ER/
10GBASE-EW)
-7 (10GBASE-ZR)
-9 (L-64.2)
Input signals wavelength range nm 1280 ~ 1625
Parameters of optical transmit port at client side (R point)
Type of nominal light source --- MQW-DFB
Mean launched Maximum dBm -1

power (I64.1) Minimum dBm -6
Mean launched Maximum dBm +2

power (S64.2b) Minimum dBm -1

power (L64.2) Minimum dBm +2
Mean launched Maximum dBm -7.3

Item Unit Parameter

power
(10GBASE-SR/ Minimum dBm -1
10GBASE-SW)
Mean launched
Maximum dBm +0.5
power
(10GBASE-LX/
10GBASE-LR/1
Minimum dBm -8.2
0GBASE-LW)
Mean launched
Maximum dBm +4
power
(10GBASE-ER/
Minimum dBm -4.5
10GBASE-EW)

power
(10GBASE-ZR) Minimum dBm +1
Min. extinction ratio dB 10/8.2
In compliance with ITU-T

Eye pattern mask ---
Recommendation G.691
Table 9-2 Technical specifications of 10Gbit/s board at Line-side
Item Unit Parameter
Parameters of optical transmit port at line side (Sn point)
Max. -20dB 0.3(NRZ)

nm
spectral width 0.4( RZ)
Spectral
characteristics Min. side mode
suppression dB 30
ratio
Nominal
central THz
G.694.1
frequency
Central
Central
frequency ≤ 12.5 (spacing: 100 GHz)
frequency GHz
≤ 5 (spacing: 50 GHz)
deviation(EOL)
Central GHz ≤ 10 (spacing: 100 GHz)

Item Unit Parameter

frequency ≤ 3 (spacing: 50 GHz)
deviation(BOL)
Mean Max. dBm -2(RZ)/+1(NRZ)

transmission
Min. dBm -5(RZ)/-3(NRZ)
power
Chirp modulus --- 0.3 ~ 0.7
Min. extinction ratio dB 8.2

-300～+800 (NRZ)/
Dispersion holding value ps/nm
-400～+400 (RZ)

G.959.1
Parameters of optical receive port at line side (Rn point)
-14 (EOL)
Receiving sensitivity PIN
-17 (BOL)
dBm
-12 -21(EOL)
(BER10 )
APD
-24(BOL)
Max. reflection of Receiver dB <–27
0 (PIN)
Overload power dBm
-9 (APD)
9.1.2 MOM2 Specifications
Table 9-3 Technical specifications of MOM2 board
Item Unit Specification
-14(EOL),-17(BOL) (PIN)
Receiving sensitivity dBm
-21 (EOL),-24(BOL) (APD)
Receiver reflection dB <-27
0 (PIN)
Overload power dBm
-9 (APD)
Wavelength area of input signals nm 1280-1565

Maximum –20 dB 0.3(NRZ)

nm
bandwidth 0.4( RZ)
Spectral
characteristic Minimum side mode
suppression ratio dB 30
(SMSR)
Nominal central In compliance with ITU-T

THz
frequency G.694.1
≤ 12.5 (spacing: 100

Central Central frequency
GHz GHz)
frequency deviation(EOL)
Central frequency ≤ 10 (spacing: 100 GHz)

GHz
deviation(BOL) ≤ 3 (spacing: 50 GHz)
Mean launched power dBm -5~-2(RZ)/-3~+1(NRZ)
Minimum extinction ratio dB 8.2

-300～+800 (NRZ)/
Dispersion tolerance ps/nm
-400～+400 (RZ)

Eye diagram -
G.959.1
FC -18
2GFC -18
Receiving 1000BASE-SX dBm -17

sensitivity 1000BASE-LX -19
1000BASE-LH1 -20
1000BASE-ZX -22
FC 0
2GFC 0
1000BASE-SX dBm 0
Overload power
1000BASE-LX -3
1000BASE-LH1 -3
1000BASE-ZX -3

FC -4.5
2GFC -4.5
1000BASE-SX dBm -9.5 to -3 (1000BASE-SX)

Output power
1000BASE-LX -11 to -3 (1000BASE-LX)
1000BASE-LH1 -4 to 0 (1000BASE-LH1)
1000BASE-ZX -2 to +3 (1000BASE-ZX)
9.1.3 MOM2B Specifications
Table 9-4 Technical specifications of MOM2B board
Parameters of input port (S point)
Receiving sensitivity GE dBm -19
Overload power GE dBm -3
Parameters of output port (Sn point)
Maximum bandwidth @ -20 dB nm 0.3
Minimum side mode compression ratio

dB 30
(SMCR)
Compliant with ITU-T

Nominal central frequency THz
G.694.1
Central frequency offset GHz ≤±12.5 (spacing: 100 GHz)
Mean launched power dBm -3 to +3
ps/n
Dispersion tolerance -300~+800
m
Compliance with ITU-T

Eye diagram -
G.691
Parameters of input port (Rn point)
-14 (PIN)
-21 (APD)
Overload power dBm 0 (PIN)

-9 (APD)
Wavelength of input signals nm 1280 to 1565
Parameters of output port (R point)
Mean launched power GE dBm -11~0
9.1.4 ASMB/SOG2 Specifications
Table 9-5 Technical specifications of ASMB/SOG2 board
Parameters of WDM-side optical receive port (Rn point)
<-14(EOL),-17(BOL) (PIN)
Receiver sensitivity dBm
<-21(EOL),-24(BOL) (APD)
Receiver reflection dB <–27
>0 (PIN)
Overload power dBm
>-9 (APD)
Wavelength range of input signal nm 1280~1625
Parameters of WDM-side optical transmit port (Sn point)
Maximum -20 dB bandwidth nm 0.3(NRZ)
Minimum side mode suppression

dB 30
ratio
Nominal central frequency THz In compliance with ITU-T G.694.1
≤ 12.5 (spacing: 100 GHz)

Central frequency deviation(EOL) GHz

Central frequency deviation(BOL) GHz
Mean launched power dBm -3~+3(NRZ)
Dispersion tolerance ps/nm -300～+800 (NRZ)
Eye diagram - In compliance with ITU-T G.959.1
Parameters of client-side optical receive port (S point)

<-17 (1000BASE-SX)
<-19 (1000BASE-LX)
<-14 (10GBASE-LR)
<-15 (10GBASE-ER
>0 (1000BASE-SX)
>-3 (1000BASE-LX)
Overload power dBm
>0.5 (10GBASE-LR)
>-1 (10GBASE-ER)
Parameters of client-side optical transmit port (R point)
-9.5 to -3 (1000BASE-SX)
-11 to -3 (1000BASE-LX)
Mean launched power dBm
-8.2 to 0.5 (10GBASE-LR)
-4.7 to 4.0 (10GBASE-ER)
9.1.5 TST3 specifications
Client-side: Transmitting part of receiving end and receiving part of transmitting end.
Line-side: Receiving part of receiving end, transmitting part of transmitting end and
transmitting/receiving part of regenerator.
Technical specifications of 40Gbit/s Board at Client-side and Line-side are listed in Table
9-6 and Table 9-7
Table 9-6 Technical specifications of TST3 board at Client-side
39.813 39.813
Bit rate (optical 39.813 (NRZ),
Gbps (NRZ), (NRZ),
modulation mode) 43.018
43.018 43.018
VSR2000-3 P1I13D1 and 40GBASE-LR4

Optical interface category ---
R2 1I13D1F
Goal distance km 2 10 10

1264.5 to 1277.5
1284.5 to 1297.5
Frequency range nm 1280-1625 1280-1625
1304.5 to 1317.5
1324.5 to 1337.5
–12
Sensitivity (BER=10 ) dBm -5 -7 -13.7(each lane)
Overload
–12 dBm +3 +4 +2.3
power(BER=10 )
Receiver reflectance dB <-27 <-27 <-27
Frequency range --- 1280-1625 1307–1317 1264.5 – 1337.5
Maxim
+3 +4 +2.3
Mean launched um
dBm
power Minimu
0 0 -7
m
Minimum side mode

dB 35 35 35
compression ratio(SMCR)
Minimum extinction ratio dB 8.2 8.2 8.2
Complies
Complies
Jitter transfer with Complies with
--- with GR-253,
characteristics GR-253, GR-253, Issue 4
Issue 4
Issue 4
Complies
Complies
with Complies with
Eye diagram --- with G.959.1
G.959.1 G.959.1 NRZ 40G
NRZ 40G
NRZ 40G
Table 9-7 Technical specifications of TST3 board at Line-side
Optical signal modulation

- P-DPSK RZ-DQPSK PM-QPSK
mode
Bit rate Gbps 43.018 43.018 43.018
192.10~196.05(C 192.10~196.05(C 192.10~196.05(C

Frequency range THz
band) band) band)
–12
Sensitivity (BER=1×10 ) dBm -18(BOL),-15(EOL) 18(BOL),-15(EOL) -20

Minimum overload power

–12 dBm 1 1 1
(BER=1×10 )
Dispersion tolerance
ps/nm -1000~+1000 -1000~+1000 +/- 50000
(including TDC)
PMD tolerance ps 2.5 7 60
Jitter transfer Complies with Complies with Complies with

-
characteristics G.8251 G.8251 G.8251
FEC gain dB >8(AFEC) >8(AFEC) >8(AFEC)
Complies with ITU-T Complies with ITU-T Complies with

G.694.1 G.694.1 ITU-T G.694.1
≤ 5 (spacing: 100 ≤ 5 (spacing: 100 ≤ 5 (spacing:

Central frequency GHz) GHz) 100 GHz)
GHz
deviation(EOL) ≤ 2.5 (spacing: 50 ≤ 2.5 (spacing: 50 ≤ 2.5 (spacing:
GHz) GHz) 50 GHz)
≤ 3 (spacing: 100 ≤ 3 (spacing: 100 ≤ 3 (spacing:

Central frequency GHz) GHz) 100 GHz)
GHz
deviation(BOL) ≤ 1.5 (spacing: 50 ≤ 1.5 (spacing: 50 ≤ 1.5 (spacing:
GHz) GHz) 50 GHz)
Maxi
+5 +3 +5
Mean launched mum
dBm
power Mini
-5 -9 -5
mum
Launched power offset dB ±1 ±1 ±1
Maximu
Spectral m –20 dB
GHz 0.7 0.6 0.5
characteristics bandwidt
h
Minimum side mode

dB 35 35 35
suppression ratio (SMCR)

9.1.6 MQT3 Specifications
Table 9-8 Technical specifications of MQT3 board at Client-Side
Item Unit Parameter
-11 (I-64.1)
-11.1
-12.6
-12 dBm
-14 (S-64.2b)
-14.1
-26 (10GBASE-ZR/ L-64.2)
0.5
0GBASE-LW)
-1
10GBASE-EW)
-7 (10GBASE-ZR)
-9 (L-64.2)



Item Unit Parameter

power (L64.2) Minimum dBm -1

power
(10GBASE-SR/ Minimum dBm -7.3
10GBASE-SW)
Mean launched
Maximum dBm +0.5
power
(10GBASE-LX/
10GBASE-LR/1
Minimum dBm -8.2
0GBASE-LW)
Mean launched
Maximum dBm +4
power
(10GBASE-ER/
Minimum dBm -4.5
10GBASE-EW)

power

Table 9-9 Technical specifications of MQT3 board at Line-side
Optical signal modulation

- P-DPSK RZ-DQPSK PM-QPSK
mode
Bit rate Gbps 43.018 43.018 43.018
Parameters of line-side optical transmit port (Sn point)
192.10–196.05 (C 92.10–196.05 (C 192.10~196.05(C

Frequency range THz
band) band) band)
–12 18(BOL),-15(EO -20

Sensitivity (BER=1×10 ) dBm -18(BOL),-15(EOL)
L)
Minimum overload 1
–12 dBm 1 1
(BER=1×10 )
Max. reflectance dB <-27 <-27 <-27

Dispersion tolerance
ps/nm -1000~+1000 -1000~+1000 +/- 50000
(including TDC)
PMD tolerance ps 2.5 7 60
Jitter Transfer Complies with Complies with Complies with

-
Characteristics ITU-T G.8251 ITU-T G.8251 G.8251
FEC code gain dB >8 (AFEC) >8 (AFEC) >8(AFEC)
Parameters of line-side optical receive port (Rn point)
Complies with Complies with Complies with ITU-T

ITU-T G.694.1 ITU-T G.694.1 G.694.1
≤ 5 (spacing:
≤ 5 (spacing: 100 ≤ 5 (spacing: 100
100 GHz)
Central frequency GHz) GHz)
GHz ≤ 2.5
deviation(EOL) ≤ 2.5 (spacing: ≤ 2.5 (spacing: 50
(spacing: 50
50 GHz) GHz)
GHz)
≤ 3 (spacing:
≤ 3 (spacing: 100 ≤ 3 (spacing: 100
100 GHz)
Central frequency GHz) GHz)
GHz ≤ 1.5
deviation(BOL) ≤ 1.5 (spacing: ≤ 1.5 (spacing: 50
(spacing: 50
50 GHz) GHz)
GHz)
Maxim
+5 +3 +5
Mean launched um
dBm
power Minimu
-5 -9 -5
m
Maxim
um –20
Spectral
dB GHz 0.7 0.6 0.5
characteristics
bandwi
dth
Minimum side mode

dB 35 35 35
suppression ratio (SMSR)
9.1.7 TS4 Specification
Client-side: Transmitting part of receiving end and receiving part of transmitting end.

Line-side: Receiving part of receiving end, transmitting part of transmitting end and
transmitting/receiving part of regenerator.
Technical specifications of 100Gbit/s Board at Client-side and Line-side are listed in

Table 9-10 and Table 9-11
Table 9-10 Technical specifications of TS4 board at Client-side

100GE 4x25.78
Bit rate (optical modulation mode) Gbps
OTU4 4x27.95
100GBASE_LR4
4I1-9D1F
Target distance km 10

1294.53–1296.59
1299.02–1301.09
Frequency range nm
1303.54–1305.63
1308.09–1310.19
-8.6(100GE PIN)
–15
Sensitivity (BER=10 ) dBm -10.3(OTU4 PIN)
(single channel)
+4.5
–15
Overload power(BER=10 ) dBm +2.9
(single channel)
Receiver reflectance dB <-27
single channel +4.5

+2.9
Maximum Total:
+10.5
Mean output power dBm
+8.9
single channel
Minimum -4.3
-2.5

Minimum extinction ratio dB 4
Table 9-11 Technical specifications of TS4 board at Line-side

Optical signal modulation format - PM-QPSK
Bit rate Gbps 125.7
Frequency range THz 192.10~196.05(C band)
Channel spacing GHz 50

–15
Power sensitivity (BER=1×10 ) dBm -18

–15 dBm 0
(BER=1×10 )
FEC Gain dB 11.1
Dispersion tolerance ps/nm +--40000
PMD tolerance ps 20
Jitter transfer characteristics - G.825.1
Maximum central frequency

GHz ±2.5
offset(EOL)
Minimum central frequency

GHz ±1.5
offset(BOL)
Transmitter output Maximum +3

dBm
power Minimum -5
Launched power offset dB ±1
Maximum optical –3 dB 35
GHz
spectral Bandwidth
-15dB 60

dB 30
ratio (SMSR)
Transmitter reflectance dB <-27

9.1.8 MX2 Specifications
Table 9-12 Technical specifications of MX2 board at Client-Side
Item Unit Parameter
-11 (I-64.1)
-11.1
-12.6
-12 dBm
-14 (S-64.2b)
-14.1
-26 (10GBASE-ZR/ L-64.2)
0.5
0GBASE-LW)
-1
10GBASE-EW)
-7 (10GBASE-ZR)
-9 (L-64.2)



Item Unit Parameter


power
10GBASE-SW)
Mean launched
Maximum dBm +0.5
power
(10GBASE-LX/
10GBASE-LR/1
Minimum dBm -8.2
0GBASE-LW)
Mean launched
Maximum dBm +4
power
(10GBASE-ER/
Minimum dBm -4.5
10GBASE-EW)

power

Table 9-13 Technical specifications of MX2 board at Line-side
Bit rate Gbps 125.7

–15

–15 dBm 0
(BER=1×10 )
FEC Gain dB 11.1
Dispersion tolerance ps/nm +/-40000

PMD tolerance ps 20

GHz ±2.5
offset(EOL)

GHz ±1.5
offset(BOL)

dBm
power Minimum -5
GHz
spectral Bandwidth
-15dB 60

dB 30
ratio (SMSR)
9.1.9 TD4 Specifications
Table 9-14 Technical specifications of TD4 board at Client-Side
100GE 4x25.78
OTU4 4x27.95
100GBASE_LR4
4I1-9D1F

1294.53–1296.59
1299.02–1301.09
Frequency range nm
1303.54–1305.63
1308.09–1310.19
–15
-8.6(100GE PIN)
Sensitivity (BER=10 ) dBm
-10.3(OTU4 PIN)


(single channel)
+4.5
–15
(single channel)
single channel +4.5

+2.9
Maximum Total:
+10.5
+8.9
single channel
Minimum -4.3
-2.5
Table 9-15 Technical specifications of TD4 board at Line-side

rd
136 (25% SD-FEC, 3 Generation
Bit rate Gbps
SD-FEC)

–15

–15 dBm 0
(BER=1×10 )
rd
FEC Gain( 3 Generation
dB 11.8
SD-FEC)
PMD tolerance ps 50


GHz ≤±2.5
offset(EOL)

GHz ≤±1.5
offset(BOL)
Transmitter output Maximum 2

dBm
power Minimum -3
Maximum optical -3 dB 35
GHz
spectral Bandwidth
-20dB 60

dB 40
ratio (SMSR)
9.1.10 MQ4/S and MQ4/D Specifications
Table 9-16 Technical specifications of MQ4 board at Client-Side
100GE 4x25.78
OTU4 4x27.95
100GBASE_LR4
4I1-9D1F

1294.53–1296.59
1299.02–1301.09
Frequency range nm
1303.54–1305.63
1308.09–1310.19
-8.6(100GE PIN)
–15
(single channel)
–15
+4.5
Overload power(BER=10 ) dBm
+2.9


(single channel)
single channel +4.5

+2.9
Maximum Total:
+10.5
+8.9
single channel
Minimum -4.3
-2.5
Table 9-17 Technical specifications of MQ4/S and MQ4/D board at Line-side
Optical signal
- 16QAM 8QAM PM-QPSK
modulation format
546.655 409.997 273..32

Bit rate Gbps
(25% SD-FEC) (25% SD-FEC) (25% SD-FEC)
Frequency range THz 191.15-196.10
Channel spacing GHz 75/100 75/100 62.5/75
Power sensitivity
–15 dBm -18 -18 -18
(BER=1×10 )
Minimum overload
–12 dBm 0 0 0
power (BER=1×10 )
FEC Gain dB 11.8 11.8 11.8
ps/n
Dispersion tolerance +/-30000 +/-30000 +/-70000
m
PMD tolerance ps 20 20 30
Maximum central GHz 1.8 1.8 1.8


frequency offset(EOL)
Minimum central
GHz 0.5 0.5 0.5
frequency offset(BOL)
Transmitter Maximu
2 2 2
output m
dBm
power(single
Minimum -3 -3 -3
channel )
Maximum
-3 dB 35 35 35
optical
spectral
GHz
Bandwidth(
single -20dB 60 60 60
carrier)
Minimum side mode

suppression ratio dB 35 35 35
(SMSR)
Transmitter reflectance dB <-27 <-27 <-27
9.1.11 TD2C/TS2C/TS2CP Specifications
Table 9-18 Technical specifications of TD2C/TS2C/TS2CP board
-14 (I64.1)
-16 (S64.2b)
-12
Receiving sensitivity (BER10 ) dBm -12.6 (10GBASE-LR/LW)
-14.1 (10GBASE-ER/EW)
-14 (1200-SM-LL-L)
0 (I64.1)
-1 (S64.2b)
Overload power dBm
0 (10GBASE-LR/LW)
-1 (10GBASE-ER/EW)

0 (1200-SM-LL-L)
Maximum bandwidth @ -20 dB nm 0.3(NRZ)
Minimum side mode suppression ratio

dB 30
(SMSR)

G.694.1
≤ 12.5 (spacing: 100

GHz)
Central frequency deviation(EOL) GHz
≤ 5 (spacing: 50
GHz)
≤ 10 (spacing: 100

GHz)
≤ 3 (spacing: 50
GHz)
Mean launched power dBm -3 to +3(NRZ)

Eye diagram -
G.959.1
-14(EOL), -17(BOL) (PIN)

-12
Receiving sensitivity (BER10 ) dBm
-21 (EOL),-24(BOL) (APD)
0 (PIN)
Overload power dBm
-9 (APD)
Wavelength area of input signals nm 1280 to 1565
-6 ~ -1 (I64.1)
-1 ~ 2 (S64.2b)
-8.2 ~ 0.5
(10GBASE-LR/LW)

-4.7 ~ 4
(10GBASE-ER/EW)
-6 ~ -1 (1200-SM-LL-L)
6 (I64.1)
8.2 (S64.2b)
Minimum extinction ratio dB 6 (10GBASE-LR/LW)
8.2 (10GBASE-ER/EW)
6 (1200-SM-LL-L)

Eye diagram -
G.691
9.1.12 MQA1 Specifications
Table 9-19 Technical specifications of MQA1 board
-17 (1000BASE-SX)
-19 (1000BASE-LX)
-20 (1000BASE-LH1)
-22 (1000BASE-ZX)
-19 (100-SM-LL-I)
-20 (200-SM-LL-I)
0 (1000BASE-SX)
-3 (1000BASE-LX)
-3 (1000BASE-LH1)
Overload power dBm
-3 (1000BASE-ZX)
-3 (100-SM-LL-I)
0 (200-SM-LL-I)
Minimum side mode suppression ratio dB 30


(SMSR)
192.1 to 196.0
(spacing: 100 GHz)
Mean launched power dBm 0~5
Dispersion tolerance ps/nm 3600

Eye diagram -
G.957
-18 (PIN)
-12
-25 (APD)
0 (PIN)
Overload power dBm
-9 (APD)
-9.5 to -3 (1000BASE-SX)
-11 to -3 (1000BASE-LX)
-4 to 0 (1000BASE-LH1)
-2 to +3 (1000BASE-ZX)
-11 to -3 (100-SM-LL-I)
-12 to -3 (200-SM-LL-I)
9.1.13 MQA2 Specifications
Table 9-20 Technical specifications of MQA2 board

FC -18
2G FC -18

4G FC -18
GE -19
I-16 -18
S-16 -18
L-16.1 -27
L-16.2 -28
1G FC 0
2G FC 0
4G FC 0
GE -3
Overload power dBm
I-16 -3
S-16 0
L-16.1 -9
L-16.2 -9
Maximum bandwidth @ -20 dB nm 0.3(NRZ)
Minimum side mode suppression ratio

dB 30
(SMSR)

G.694.1
≤
Central frequency deviation(EOL) GHz GHz)
≤
≤ 0 (spacing: 100 GHz)

≤ 3 (spacing: 50 GHz)
Mean launched power dBm -3 to +3 (NRZ)
ps/n
Dispersion tolerance -300～+800 (NRZ)
m

Eye diagram -
G.959.1

-14(EOL), -17(BOL) (PIN)

-21(EOL), -24(BOL) (APD)
0 (PIN)
Overload power dBm
-9 (APD)
1G FC -4.5
2G FC -4.5
4G FC -4.5
GE -11~0
9.1.14 MJA Specifications
Table 9-21 Technical specifications of MJA board
-17 (1000BASE-SX)
-19 (1000BASE-LX)
-20 (1000BASE-LH1)
-22 (1000BASE-ZX)
-19 (100-SM-LL-I)
-20 (200-SM-LL-I)
0 (1000BASE-SX)
-3 (1000BASE-LX)
-3 (1000BASE-LH1)
Overload power dBm
-3 (1000BASE-ZX)
-3 (100-SM-LL-I)
0 (200-SM-LL-I)
Mean launched power dBm -9.5 to -3 (1000BASE-SX)

-11 to -3 (1000BASE-LX)
-4 to 0 (1000BASE-LH1)
-2 to +3 (1000BASE-ZX)
-11 to -3 (100-SM-LL-I)
-12 to -3 (200-SM-LL-I)
9.1.15 MHE1 Specifications
Table 9-22 Technical Specifications of MHE1 Board
-23 (I-4.1)
-18 (S-4.1)
-28 (L-4.1)
-23 (I-1.1)
-28 (S-1.1)
-34 (L-1.1)
-8 (I-4.1)
-8 (S-4.1)
-8 (L-4.1)
Overload power dBm
-8 (I-1.1)
-8 (S-1.1)
-10 (L-1.1)
Impedance Ohm 75 (E1)
Minimum side mode Suppression ratio

dB 35
(SMSR)
192.1 to 196.0
(spacing: 100 GHz)

Mean launched power dBm 0~5
Dispersion tolerance ps/nm 3600

Eye diagram -
G.957
-21 (PIN)
-12
-28 (APD)
0 (PIN)
Overload power dBm
-9 (APD)
-15 to -8 (I-4.1)
-15 to -8 (S-4.1)
-3 to +2 (L-4.1)
-15 to -8 (I-1.1)
-15 to -8 (S-1.1)
-5 to 0 (L-1.1)
9.2 Client-side Board Specifications
9.2.1 C1K×4/ C1K×8/C1K×16 Specifications
Table 9-23 Technical specifications of C1K× 16 board
Parameters of optical receiving port (S point) at client side
-17 (1000BASE-SX)
-12 dBm -19 (1000BASE-LX)
Receiving sensitivity (BER10 )
-20 (1000BASE-LH1)

-22 (1000BASE-ZX)
-25 (100-SM-LL-L)
-20 (100-SM-LL-I)
-13 (100-M5-SL-I)
-18 (I-16)
-18 (S-16.1)
-18 (S-16.2)
-27 (L-16.1/L-16.2/L-16.3)
-27 (L-16.1/L-16.2/L-16.3)
0 (1000BASE-SX)
-3 (1000BASE-LX)
-3 (1000BASE-LH1)
-3 (1000BASE-ZX)
-3 (100-SM-LL-L)
-3 (100-SM-LL-I)
Overload power dBm
-1.3 (100-M5-SL-I)
-3 (I-16)
0 (S-16.1)
0 (S-16.2)
-9 (L-16.1/L-16.2/L-16.3)
-9 (L-16.1/L-16.2/L-16.3)
Parameters of optical transmit port (R point) at client side
-9.5 ~ -3 (1000BASE-SX)
-11 ~ -3 (1000BASE-LX)
-4 ~ 0 (1000BASE-LH1)
-2 ~ 3 (1000BASE-ZX)
Average optical transmit power dBm -9 ~ -3 (100-SM-LL-L)
-12 ~ -3 (100-SM-LL-I)
-7.3 ~ 1.3 (100-M5-SL-I)
-10 ~ -3 (I-16)
-5 ~ 0 (S-16.1)

-5 ~ 0 (S-16.2)
-2 ~ 3
(L-16.1/L-16.2/L-16.3)
-2 ~ 3
(L-16.1/L-16.2/L-16.3)
9.2.2 C2K×4/C2K×8/ C2K×10/C2K×12/ C2K×20 Specifications
Table 9-24 Technical specifications of C2K×4/C2K×8/C2K×12/ C2K×20 board
Item Unit Parameter
-11 (I-64.1)
-11.1
-12.6
-12 dBm
-14 (S-64.2b)
-14.1
-26 (10GBASE-ZR/ L-64.2)
0.5
0GBASE-LW)
-1
10GBASE-EW)
-7 (10GBASE-ZR)
-9 (L-64.2)

Item Unit Parameter




power
10GBASE-SW)
Mean launched
Maximum dBm +0.5
power
(10GBASE-LX/
10GBASE-LR/1
Minimum dBm -8.2
0GBASE-LW)
Mean launched
Maximum dBm +4
power
(10GBASE-ER/
Minimum dBm -4.5
10GBASE-EW)

power

9.2.3 C3K×1/C3K×2 Specifications
Table 9-25 Technical specifications of C3K×2 board for 40GBASE-LR4

Signaling rate, each lane (range) GBd 10.3125 ± 100 ppm
1264.5 to 1277.5
1284.5 to 1297.5
Lane wavelengths (range) nm
1304.5 to 1317.5
1324.5 to 1337.5
a
Damage threshold (min) dBm 3.3
Average receive power, each lane (max)

dBm 2.3
b
Average receive power, each lane (min) dBm -13.7
Receive power, each lane (OMA) (max) dBm 3.5
Difference in receive power between any

dB 7.5
two lanes (OMA) (max)
Receiver reflectance (max) dB -26

c
Receiver sensitivity (OMA), each lane
dBm -11.5
(max)
Receiver 3 dB electrical upper cutoff

GHz 12.3
frequency, each lane (max)
Stressed receiver sensitivity (OMA),

d dBm -9.6
each lane (max)
Conditions of stressed receiver sensitivity test:

e
Vertical eye closure penalty, each lane dB 1.9
e
Stressed eye J2 Jitter, each lane UI 0.3
e
Signaling rate, each lane (range) dB 10.3125 ± 100 ppm
1264.5 to 1277.5
1284.5 to 1297.5
Lane wavelengths (range) dBm
1304.5 to 1317.5
1324.5 to 1337.5
Side-mode suppression ratio (SMSR),

dBm 30
(min)
Total average launch power (max) dBm 8.3
Average launch power, each lane (max) dBm 2.3


a
Average launch power, each lane (min) dBm -7
Optical Modulation Amplitude (OMA),

dBm 3.5
each lane (max)

b dBm -4
each lane (min)
Difference in launch power between any

dB 6.5
Launch power in OMA minus TDP, each

dBm -4.8
lane (min)
Transmitter and dispersion penalty

dB 2.6
(TDP), each lane (max)
Average launch power of OFF

dBm -30
transmitter, each lane (max)
Extinction ratio (min) dB 3.5
RIN20OMA (max) dB/Hz -128
Optical return loss tolerance (max) dB 20

c
Transmitter reflectance (max) dB -12
Transmitter eye mask definition {X1, X2, {0.25, 0.4, 0.45, 0.25, 0.28,
X3, Y1, Y2, Y3} 0.4}

Receiver side note:

a
The receiver shall be able to tolerate, without damage, continuous exposure to an optical input
signal having this average power level
b
Average receive power, each lane (min) is informative and not the principal indicator of signal
strength. A received power below this value cannot be compliant; however, a value above this does
not ensure compliance.
c
Receiver sensitivity (OMA), each lane (max) is informative.
d
Measured with conformance test signal at TP3 (see 87.8.11) for BER = 10 –12.
e
Vertical eye closure penalty, stressed eye J2 Jitter, and stressed eye J9 Jitter are test conditions
for measuring stressed receiver sensitivity. They are not characteristics of the receiver.
Transmit side note:
a
Average launch power, each lane (min) is informative and not the principal indicator of signal
strength. A transmitter with launch power below this value cannot be compliant; however, a value
above this does not ensure compliance.
b
Even if the TDP < 0.8dB, the OMA (min) must exceed this value.
c
Transmitter reflectance is defined looking into the transmitter.
Table 9-26 Technical specifications of C3K×2 board for 40G POS
Frequency range nm 1280 ~1625
Sensitivity (BER  1×10–12) dBm -6
Overload power dBm 3
Maximum reflectance dB -27
Ps/n
Chromatic Dispersion tolerance -10 ~ 60
m
Mean DGD tolerance ps 2.5
Mean output power dBm 0~3
ITU-T G.693
VSR2000-3R2/3/5 compliant
Frequency range (STM-256)
G.959.1 P1S1 3C2/3/5
compliant (OTU3)
Minimum SMSR dB 35
jitter performance Conform to G.8251

Conform to G.959.1 NRZ

Eye Mask
40G
9.2.4 C4L×4/C4K×2/ C4K×1 Specifications
Table 9-27 Technical specifications of C4L×4/C4K×2/ C4K×1 board
100GE 4x25.78
OTU4 4x27.95
100GBASE_LR4
4I1-9D1F
1294.53–1296.59
1299.02–1301.09
Frequency range nm
1303.54–1305.63
1308.09–1310.19
-8.6(100GE PIN)
–115
(single channel)
+4.5
–15
(single channel)
single channel +4.5

+2.9
Maximum Total:
+10.5
+8.9
single channel
Minimum -4.3
-2.5

9.2.5 PGEKx12 Specification
Table 9-28 Technical specifications of PGEKx12 board

<-17 (1000BASE-SX)
<-19 (1000BASE-LX)
>0 (1000BASE-SX)
Overload power dBm
>-3 (1000BASE-LX)
-9.5 to -3 (1000BASE-SX)
-11 to -3 (1000BASE-LX)
9.2.6 PXGKx12 Specification
Table 9-29 Technical specifications of PXGK x12 board
<-14 (10GBASE-LR)
Receiver sensitivity db
<-15 (10GBASE-ER
>0.5 (10GBASE-LR)
Overload power db
>-1 (10GBASE-ER)
-8.2 to 0.5 (10GBASE-LR)

Mean launched power db
-4.7 to 4.0 (10GBASE-ER)

9.2.7 PXLGK Specification
Table 9-30 Technical specifications of PXLGK board
Signaling rate, each lane (range) GBd 10.3125 ± 100 ppm
1264.5 to 1277.5
1284.5 to 1297.5
Lane wavelengths (range) nm
1304.5 to 1317.5
1324.5 to 1337.5
a
Damage threshold (min) dBm 3.3
Average receive power, each lane (max)

dBm 2.3
b
Average receive power, each lane (min) dBm -13.7
Receive power, each lane (OMA) (max) dBm 3.5
Difference in receive power between any

dB 7.5
Receiver reflectance (max) dB -26

c
Receiver sensitivity (OMA), each lane
dBm -11.5
(max)
Receiver 3 dB electrical upper cutoff

GHz 12.3
frequency, each lane (max)
Stressed receiver sensitivity (OMA),

d dBm -9.6
each lane (max)
Conditions of stressed receiver sensitivity test:

e
Vertical eye closure penalty, each lane dB 1.9
e
e
Signaling rate, each lane (range) dB 10.3125 ± 100 ppm
1264.5 to 1277.5
1284.5 to 1297.5
Lane wavelengths (range) dBm
1304.5 to 1317.5
1324.5 to 1337.5

Side-mode suppression ratio (SMSR),

dBm 30
(min)
Total average launch power (max) dBm 8.3
Average launch power, each lane (max) dBm 2.3

a
Average launch power, each lane (min) dBm -7

dBm 3.5
each lane (max)

b dBm -4
each lane (min)
Difference in launch power between any

dB 6.5
Launch power in OMA minus TDP, each

dBm -4.8
lane (min)
Transmitter and dispersion penalty

dB 2.6
(TDP), each lane (max)
Average launch power of OFF

dBm -30
transmitter, each lane (max)
Extinction ratio (min) dB 3.5
RIN20OMA (max) dB/Hz -128
Optical return loss tolerance (max) dB 20

c
Transmitter reflectance (max) dB -12
Transmitter eye mask definition {X1, X2, {0.25, 0.4, 0.45, 0.25, 0.28,
X3, Y1, Y2, Y3} 0.4}
9.2.8 PCGK Specification
Table 9-31 Technical specifications of PCGK board

Bit rate (optical modulation
Gbps 100GE 4x25.78
mode)
Optical interface category --- LR4

1294.53–1296.59
1299.02–1301.09
Frequency range nm
1303.54–1305.63
1308.09–1310.19
–15
-8.6(100GE PIN)
-(single channel)
–15
+4.5
(single channel)
+4.5
Maximum
Mean output (single channel)
dBm
power -4.3
Minimum
(single channel)
9.2.9 E2Kx20 Specification
Table 9-32 Technical specifications of E2Kx20 board
<-17 (1000BASE-SX)
<-19 (1000BASE-LX)
<-14 (10GBASE-LR)
<-15 (10GBASE-ER)
>0 (1000BASE-SX)
>-3 (1000BASE-LX)
Overload power dBm
>0.5 (10GBASE-LR)
>-1 (10GBASE-ER)
-9.5 to -3 (1000BASE-SX)
-11 to -3 (1000BASE-LX)

-8.2 to 0.5 (10GBASE-LR)
-4.7 to 4.0 (10GBASE-ER)
9.2.10 E4Kx2 Specification
Table 9-33 Technical specifications of E4Kx2 board
Bit rate (optical modulation

Gbps 100GE 4x25.78
mode)
Optical interface category --- LR4

1294.53–1296.59
1299.02–1301.09
Frequency range nm
1303.54–1305.63
1308.09–1310.19
–12
-8.6(100GE PIN)
-(single channel)
–12
+4.5
(single channel)
+4.5
Maximum
Mean output (single channel)
dBm
power -4.3
Minimum
(single channel)

9.3 Line-side Board Specifications
9.3.1 L2K×4/ L2K×8/ L2K×10/ L2K×12 Specifications
Table 9-34 Technical specifications of L2K×4/ L2K×8/ L2K×12 board
Parameters of optical receiving port (Rn point) at line side
-14(EOL),-17(BOL) (PIN)
-12 dBm
Receiving sensitivity (BER10 )
-21(EOL),-24(BOL) (APD)
Maximum reflectance dB -27
0 (PIN)
Overload power dBm
-9 (APD)
Wavelength range of input signals nm 1280 ~ 1565
Parameter of transmitter at line side Sn point
Maximum -20 dB
nm 0.3(NRZ)
spectrum width
Spectrum
Minimum side mode
characteristics
compression ratio dB 30
(SMCR)

Central frequency THz
G.694.1
≤ 12.5 (spacing: 100

Central frequency
Central GHz GHz)
deviation(EOL)
frequency ≤ 5 (spacing: 50 GHz)
Central frequency ≤ 0 (spacing: 100 GHz)

GHz
deviation(BOL) ≤ 3 (spacing: 50 GHz)
Average optical transmit power dBm -3 ~ +3(NRZ)

Eye diagram template -
G.959.1

Eye diagram template -
G.959.1

9.3.2 L4L×1 Specifications
Table 9-35 Technical specifications of L4L×1 board
Bit rate Gbps 125.7

–15
Power sensitivity (BER=1×10 ) dBm --18

–15 dBm 0
(BER=1×10 )
FEC Gain dB 11.1
PMD tolerance ps 20

GHz ±2.5
offset(EOL)

GHz ±1.5
offset(BOL)

dBm
power Minimum -5
GHz
spectral Bandwidth
-15dB 60

dB 30
ratio (SMSR)

9.3.3 L4K×1/ L4K×2 and L4K×4 Specifications
Table 9-36 Technical specifications of L4K×1/ L4K×2 board
Bit rate Gbps 125.7

–15

–15 dBm 0
(BER=1×10 )
FEC Gain dB 11.1
PMD tolerance ps 15

GHz ±2.5
offset(EOL)

GHz ±1.5
offset(BOL)

dBm
power Minimum -5
GHz
spectral Bandwidth
-15dB 60

dB 30
ratio (SMSR)

Table 9-37 Technical specifications of L4K×4 board
Bit rate Gbps 125.7
Frequency range THz 191.25~196.10

–12

–12 dBm 0
(BER=1×10 )
FEC Gain dB 10.1
PMD tolerance ps 30

GHz ±2.5
offset(EOL)

GHz ±1.8
offset(BOL)

dBm
power Minimum -15
Launched power offset dB ±0.3
GHz
spectral Bandwidth
-15dB 60

dB 40
ratio (SMSR)

9.3.4 L4L×2 Specifications
Table 9-38 Technical specifications of L4L×2 board

rd
136 (25% SD-FEC, 3 Generation
Bit rate Gbps
SD-FEC)

–15

–15 dBm 0
(BER=1×10 )
rd
FEC Gain( 3 Generation
dB 11.8
SD-FEC)
PMD tolerance ps 50

GHz ≤±2.5
offset(EOL)

GHz ≤±1.5
offset(BOL)
Transmitter output Maximum 2

dBm
power Minimum -3
GHz
spectral Bandwidth
-20dB 60

dB 35
ratio (SMSR)

9.3.5 LB4Kx1/2 and LB4Kx1/1 Specifications
Table 9-39 Technical specifications of LB4Kx1/2 and LB4Kx1/1 board
Optical signal
modulation format
546.655 409.997 273..32

Bit rate Gbps
Channel spacing GHz 75/100 75/100 62.5/75
Power sensitivity
–15 dBm -18 -18 -18
(BER=1×10 )
Minimum overload
–15 dBm 0 0 0
power (BER=1×10 )
FEC Gain dB 11.8 11.8 11.8
ps/n
m
Jitter transfer
- G.825.1 G.825.1 G.825.1
characteristics
Maximum central
GHz 1.8 1.8 1.8
Minimum central
GHz 0.5 0.5 0.5
Transmitter Maximu
2 2 2
output m
dBm
power(single
Minimum -3 -3 -3
channel )
Maximum
-3 dB GHz 35 35 35
optical


spectral
Bandwidth(
-20dB 60 60 60
single
carrier)
Minimum side mode

(SMSR)
9.3.6 LB2L x1 Specifications
Table 9-40 Technical specifications of LB2Lx1 board
Optical signal
modulation format
273.3275 204.9985 136.66

Bit rate Gbps
Channel spacing GHz 37.5/50 37.5/50 31.25/37.5/50
Power sensitivity
–15 dBm -18 -18 -18
(BER=1×10 )
Minimum overload
–15 dBm 0 0 0
power (BER=1×10 )
FEC Gain dB 11.8 11.3 11.3
ps/n
m
Jitter transfer
- G.825.1 G.825.1 G.825.1
characteristics
Maximum central GHz 1.8 1.8 1.8


Minimum central
GHz 0.5 0.5 0.5
Transmitter Maximu
2 2 2
output m
dBm
power(single
Minimum -3 -3 -3
channel )
Maximum
-3 dB 35 335 35
optical
spectral
GHz
Bandwidth(
single -20dB 60 60 60
carrier)
Minimum side mode

(SMSR)
9.3.7 H4K Specifications
Table 9-41 Technical specifications of H4K board
Bit rate Gbps 125.7

–15

–15 dBm 0
(BER=1×10 )
FEC Gain dB 11.3
PMD tolerance ps 15


GHz ±2.5
offset(EOL)

GHz ±1.5
offset(BOL)

dBm
power Minimum -5
GHz
spectral Bandwidth
-15dB 60

dB 35
ratio (SMSR)
9.4 Mux/DeMux Board Specifications
9.4.1 OMU Specifications
Table 9-42 Technical specifications of OMU board
Specifications (32 Specifications (40 Specifications

Channels) Channels) (80 Channels)
Item Unit
Coupl
Coupler AWG TFF AWG TFF Coupler AWG
er
Insertio
dB <17 <10 <10 <19 <10 <10 <23 <10
n loss
Max.
differen
ce of
dB <3 <3 <3 <3 <3 <3 <3.5 <3
insertio
n losses
of

Specifications (32 Specifications (40 Specifications

Channels) Channels) (80 Channels)
Item Unit
Coupl
Coupler AWG TFF AWG TFF Coupler AWG
er
channel
s
Channe
l GHz - 100 100 - 100 100 - 50
spacing
Optical
return dB >40 >40 >40 >40 >40 >40 >40 >40
loss
1529
Working 1529- 1529- 1529- - 1529-
wavelen 1529-15 1561 1561 1529-1 1561 1561 1529-15 1561
nm
gth 61 /1570- /1570- 561 /1570- /157 61 /1570
range 1605 1605 1605 0-16 -1605
05
Polariza
tion-rela dB <0.5 <0.5 <0.5 <0.6 <0.5 <0.5 <0.7 <0.5
ted loss
Polariza
tion-mo
de ps <0.5 <0.5 <0.5 <0.5 <0.5 <0.5 <0.5 <0.5
dispersi
on
Temper
ature
nm/C --- <0.005 --- --- <0.005 --- --- ---
charact
eristics
Note: 1529 nm ~ 1561 nm corresponds to the C band OMU, while 1570nm ~ 1605 nm corresponds to the L band
OMU.
9.4.2 VMUX Specifications
Table 9-43 Technical specifications of VMUX board

Working wavelength
nm 1529 ~1561/1529-1568
range
Bandwidth@-1dB nm > 0.2
Number of channels --- 40
Insertion loss (VOA =

dB <8
0dB)
Reflectance dB >40
Channel adjustment
dB 0~10
range
VOA adjustment precision dB < 0.5
Polarization-related loss dB 0.8
Polarization-mode
ps <0.5
dispersion
9.4.3 VMUXB Specifications
Configured at OTM site, VMUX can independently adjust optical power of each channel
to pre-weight channel power. Technical specifications are listed in Table 9-44.
Table 9-44 Technical specifications of VMUXB board
Number of channels --- 40
Working wavelength range nm 40-channel: 1529-1561/1570-1605
-1dB bandwidth nm > 0.2
Insertion loss (@0dB VOA) dB <8
Polarization-mode dispersion ps 0.5
Polarization-related loss dB 0.8
Optical return loss dB > 40
Channel adjustment range dB 0~10
VOA adjustment accuracy dB < 0.5

9.4.4 ODU Specifications
Table 9-45 Technical specifications of ODU board
Specif
ication
Specifications (32 Specifications (40
Uni s (80
Item Channels) Channels)
t Chann
els)
AWG TFF AWG TFF AWG
Insertion
dB < 10 < 10 < 10 < 10 < 10
loss
Max.
difference
of
dB <3 <3 <3 <3 <3
insertion
losses of
channels
Channel GH
100 100 100 100 50
spacing z
Optical
return dB > 40 > 40 > 40 > 40 > 40
loss
1529-1 1529-156 1529-156 1529-1

1529-15
Working 561 1 1 561
61
wavelengt nm / / / /
/1570-16
h range 1570-1 1570-160 1570-160 1570-1
05
605 5 5 605
Separatio
n of
dB > 25 > 25 > 25 > 25 > 25
adjacent
channels
Separatio
n of
non-adjac dB > 30 > 30 > 30 > 30 > 30
ent
channels
Polarizati
dB < 0.5 < 0.5 < 0.5 < 0.5 < 0.5
on-related

Specif
ication
Specifications (32 Specifications (40
Uni s (80
Item Channels) Channels)
t Chann
els)
AWG TFF AWG TFF AWG

loss
Polarizati
on-mode ps < 0.5 < 0.5 < 0.5 < 0.5 < 0.5
dispersion
Temperat
ure nm/ <
< 0.005 --- < 0.005 ---
characteri C 0.005
stics
-1dB
nm > 0.3 > 0.3 > 0.3 > 0.3 > 0.3
bandwidth
Note: 1529 nm ~ 1561 nm corresponds to the C band ODU, while 1570 nm ~ 1605 nm corresponds to the L band
ODU.
9.4.5 ODUB Specifications
Technical specifications of the ODUB board are listed in Table 9-46
Table 9-46 Technical specifications of the ODUB board
Item Unit Specification(40-Channel)
Insertion loss dB <10
Maximum insertion loss difference between

dB <2
channels
Operating wavelength range nm 1529 - 1561 / 1570 - 1605
Isolation of adjacent channel dB >25
Isolation of non-adjacent channel dB >30
Polarization dependent loss (PDL) dB <0.5
Polarization mode dispersion (PMD) Ps <0.5

Item Unit Specification(40-Channel)
Temperature characteristics nm/℃ -
-1 dB bandwidth nm >0.2
9.4.6 OCI Specifications
Technical specifications of the OCI board are illustrated in Table 9-47 and Table 9-48.
Table 9-47 Technical specifications of the OCI board (100GHz-50GHz)
C band wavelength range nm 1529 -1568
CE band wavelength range nm 1529-1568
L band wavelength range nm 1570 - 1605
Input optical power range dBm < +23
Input wavelength spacing GHz 100
Output wavelength spacing GHz 50
Max. difference of insertion losses of channels dB <1
Separation of adjacent channels dB > 25
Separation of non-adjacent channels dB > 25
Polarization-related loss dB < 0.5
Polarization-mode dispersion ps < 0.5
-1dB bandwidth nm > 0.1
Table 9-48 Technical specifications of the OCI board (50GHz-25GHz)
CE band wavelength range THz 1529-1568
Input optical power range dBm < +23
Input wavelength spacing GHz 50
Output wavelength spacing GHz 25

Max. difference of insertion losses of channels dB <2
Isolation of de-multiplexing procedure dB > 21
Isolation of multiplexing procedure dB > 16
Polarization dependent loss (PDL) dB < 0.5
Polarization mode dispersion (PMD) ps < 0.2
-1dB bandwidth nm > 20
9.4.7 OBM Specifications
Technical Specifications of the OBM Board are listed in Table 9-49.
Table 9-49 Technical specifications of the OBM board
C band wavelength range nm 1529 -1561
CE band wavelength range nm 1529-1568
L band wavelength range nm 1570 -1605
C band insertion loss dB < 1.5
CE band insertion loss dB < 1.5
L band insertion loss dB < 1.5
Isolation dB 15
Polarization-related loss dB < 0.5
Polarization-mode dispersion ps < 0.5
9.5 Optical Add/Drop Multiplexing Board Specifications
9.5.1 SOGMD Specifications
Technical specifications of SOGMD board are illustrated in Table 9-50.

Table 9-50 Technical specifications of SOGMD board

Operating wavelength range nm 1529～1561(C band)
IN→RRO dB <2.5
IN→RBO dB <2.5
IN→BRO dB <2.5
IN→BBO dB <2.5
Insertion loss
RRI→OUT dB <2.5
RBI→OUT dB <2.5
BRI→OUT dB <2.5
BBI→OUT dB <2.5
Isolation dB >12
Reflectance dB <–40
PDL dB <0.4
PMD ps <0.15
Maximum optical power mW <500
9.5.2 SOGMDB Specifications
Table 9-51 Technical specifications of SOGMDB board

IN→RRO dB <6
IN→RBO dB <6
IN→BRO dB <6
IN→BBO dB <6
Insertion loss
RRI→OUT dB <6
RBI→OUT dB <6
BRI→OUT dB <6
BBI→OUT dB <6
Isolation dB >15
Reflectance dB <-40

PDL dB <0.4
PMD ps <0.15
9.5.3 SOGMDC Specifications
Technical specifications of SOGMDC board are illustrated in Table 9-52.
Table 9-52 Technical specifications of SOGMDC board

Insertion loss dB <5.8
IN→OUT1@OUT3 dB <30
Isolation
IN1→OUT@IN3 dB <15
Reflectance dB >40
PDL dB <0.4
PMD ps <0.15
9.5.4 SOADC Specifications
Technical specifications of SOADC board are illustrated in Table 9-53.
Table 9-53 Technical specifications of SOADC board

Channel bandwidth Ghz 100

Bandwidth@0.5dB nm > 0.2
Bandwidth@20dB nm <1.2
IN – D1/D2/D3/D4 dB <4.0
Insertion
A1/A2/A3/A4 – OUT dB <4.0
loss
IN – OUT dB <5
IN – D1/D2/D3/D4
dB
@adjacent channel >25
IN – D1/D2/D3/D4
Isolation dB
@non-adjacent channel >35
IN-MID1@ drop channel dB >14
IN-OUT@ drop channel Db >28
Reflectance dB >40
PDL dB <0.2
PMD ps <0.1
9.5.5 SOAD Specifications
Table 9-54 Technical specifications of SOAD board
Working wavelength range nm 1529 ~ 1560
Bandwidth@0.5dB nm > 0.2
Bandwidth@20dB nm <1.2
Number of add/drop 4
-
channels 8
Between drop
channel and
> 25
adjacent
Isolation channel dB
Between drop
channel and >35
non-adjacent


channel
Between drop
channel and
>14
pass-through
channel
Between
input/output
> 28
channel and
drop channel
Reflectance dB >45
In-drop 2.5 ~ 4.0

Insertion
Add-out dB 2.5 ~ 4.0
loss
In-out <6.0
Relative working humidity %RH 5~ 95
Max. working power mW 500
9.6 ROADM Board Specifications
9.6.1 PDU Specifications
Table 9-55 Technical specifications of PDU-5-4 board
Working wavelength range nm 1529~1568
Insertion INx→Ox-1/2/3/4 dB <12.0

loss INx→Dx <4.0
Polarization-related loss dB <0.4
Return loss dB >40
Table 9-56 Technical specifications of PDU-9-2 board

Insertion INx→Ox-1/2/3/4/5/6/7/8 dB <15.0

loss
INx→Dx dB <4.0
Return loss dB >40
Table 9-57 Technical specifications of PDUB-16 board
Insertion INx→ dB <14.0

loss Ox-1/2/3/4/5/6/7/8/9/10/11/12/
13/14/15/16
INx→Dx dB <4.0
Return loss dB >40
9.6.2 WSU Specifications
There are two types of WSU boards: WSUD board and WSUA board, For the technical
specifications of the WSUD board, refer to Table 9-58.
Table 9-58 Technical specifications of WSUD board

1529 to 1561 (C band)
Working wavelength range nm
1529 to 1568 (CE band)
100
Channel spacing GHz
50
40 (channel spacing: 100 GHz)

Channel quantity GHz
WSUD/MA1 A1-OUT <2

Insertion loss dB
IN-D1-D8 <8

EXIN-OUT <9
IN-EXOUT <8
WSUD/E <8
Attenuation adjustment range dB 0 ~ 15
Attenuation adjustment step dB 0.1
Extinction ratio dB >35
Reflection loss dB >45
Max. input power dBm ≤25
Max. input power of single channel dBm ≤16
For the technical specifications of the WSUA board, refer to Table 9-59
Table 9-59 Technical specifications of WSUA board

1529 to 1561 (C band)
Working wavelength range nm
1529 to 1568 (CE band)
100
Channel spacing GHz
50

Channel quantity GHz
WSUA/MD1 IN-D1 <2
A1-A8-OUT <8
Insertion loss EXIN-OUT dB <8
IN-EXOUT <9
WSUA/E <8
Attenuation adjustment range dB 0 ~ 15
Max. input power dBm ≤25
Max. input power of single channel dBm ≤16

9.6.3 WSUB Specification
There are four types of WSUB boards: WSUBD9D board, WSUBA9D board,
WSUBA9P9D board and WSUBT20D board. The technical specifications of the WSUB
board refer to the following tables.
Table 9-60 Technical specifications of WSUBD9D board and WSUBA9D board

Channel spacing GHz 37.5~400
Bandwidth step GHz 12.5
Attenuation adjustment range dB 0~15
Isolation dB >25
Max. input power dBm <25
Table 9-61 Technical specifications of WSUBA9P9D board
Channel spacing GHz 37.5-400
IN-D dB <4
IN-O1/O2/O3/O4/O5/O6/O7/O
dB <15
Insertion loss 8
A1/A2/A3/A4/A5/A6/A7/A8/A9
dB <8
-OUT
Attenuation adjustment range
dB 0~15
(A1/A2/A3/A4/A5/A6/A7/A8/A9-OUT)
Extinction
dB >35
ratio(A1/A2/A3/A4/A5/A6/A7/A8/A9-OUT)

Isolation(A1/A2/A3/A4/A5/A6/A7/A8/A9-OUT) dB >25
Table 9-62 Technical specifications of WSUBT20D board

Channel spacing GHz 37.5-400

IN-D1/D2/D3/D4/D5/D6/D7/D
8/D9/D10/D11/D12/D13/D14/ dB <9.5
D15/D16/D17/D18/D19/D20
A1/A2/A3/A4/A5/A6/A7/A8/A9
/A10/A11/A12/A13/A14/A15/ dB <9.5
A16/A17/A18/A19/A20-OUT
Insertion loss
INL-D1/D2/D3/D4/D5/D6/D7/
D8/D9/D10/D11/D12/D13/D1 dB <11.5
4/D15/D16/D17/D18/D19/D20
A1/A2/A3/A4/A5/A6/A7/A8/A9
/A10/A11/A12/A13/A14/A15/ dB <11.5
A16/A17/A18/A19/A20-OUTL
Attenuation adjustment range dB 0~15
Isolation dB >22
9.6.4 MSU Specification
Table 9-63 Technical specifications of MSU board

Working wavelength range THz 191.25~196.10


Ax to Ox dB <-5.5(‘-‘ means the Gain)
Insertion loss
Ix to Dx dB <-3.5(‘-‘means the Gain)
Isolation dB >35
Switch time ms <50
Extinction ratio Reflection loss dB >40
PMD ps <0.8
9.7 Optical Power Amplification Board Specifications
9.7.1 SEOBA Specifications
Table 9-64 Technical specifications of 40/80-channel SEOBA Board (C- Band)
Indices (40-channel Indices (80-channel

Item Unit system) system)
SEOBA17/17 SEOBA22/20 SEOBA17/17 SEOBA22/20
Working
1529~1561 1529~1561 1529~1561 1529~1561
wavelength nm
(C band) (C band) (C band) (C band)
range
Total input
dBm -19 ~ 0 -21 ~-2 -19 ~ 0 -21 ~ -2
power range
Input power
range of the dBm -32 ~-16 -32~ -18 -32 ~ -19 -32 ~ -21
channel
Output
power range
dBm -15~1 -10~4 -15~-2 -10~1
of the
channel
Total output
dBm -2~17 1~20 -5~17 -2~20
power range
Max. total
dBm 17 20 17 20
output power
Noise figure dB <6 <6 <6 <6


SEOBA17/17 SEOBA22/20 SEOBA17/17 SEOBA22/20
Polarization-r
dB <0.5 <0.5 <0.5 <0.5
elated loss
Pump leak at
dBm <-30 <-30 <-30 <-30
input
Pump leak at
dBm <-30 <-30 <-30 <-30
output
Input return
dB >40 >40 >40 >40
loss
Output return
dB >40 >40 >40 >40
loss
Channel gain dB 17 22 17 22
Max.
bearable
dB <-30 <-30 <-30 <-30
reflectance
at input
Max.
bearable
dB <-30 <-30 <-30 <-30
reflectance
at output
Gain flatness dB 2 2 2 2
Gain
response
time when
channels are ms <10 <10 <10 <10
added or
reduced
(stable state)
Polarization-
mode ps <0.5 <0.5 <0.5 <0.5
dispersion

9.7.2 SEOPA Specifications
Table 9-65 Technical specifications of 40/80-channel SEOPA Board (C-band)
Indices (40/80-channel system)

Item Unit
SEOPA17/17 SEOPA22/17 SEOPA27/17
Channels allocation nm 1529~1561 1529~1561 1529~1561
Total input power

dBm -19~0 -23~-4 -29~-10
range
-35 ~ -16 -35 ~ -20 -35 ~ -26
Input power range of (40 channel) (40 channel) (40 channel)

dBm
the channel -35 ~ -19 -35 ~ -23 -35 ~ -29
(80 channel) (80 channel) (80 channel)
-18~ 1(40 channel) -13~1(40 channel)

Output power range of -8~1(40 channel)
dBm -18~ -2 (80 -13~ -2 (80
the channel -8~-2(80 channel)
channel) channel)
Total output power -2~17(40 channel) -2~17(40 channel) -2~17(40 channel)

dBm
range -5~17(80 channel) -5~17(80 channel) -5~17(80 channel)
Max. total output

dBm 17 17 17
power
Noise coefficient dB <5.5 <5.5 <5.5
Polarization-related
dB <0.5 <0.5 <0.5
loss
Pump leak at input dBm <-30 <-30 <-30
Pump leak at output dBm <-30 <-30 <-30
Input return loss dB >40 >40 >40
Output return loss dB >40 >40 >40
Channel gain dB 17 22 27
Max. bearable
dB <-30 <-30 <-30
reflectance at input
Max. bearable
dB <-30 <-30 <-30
reflectance at output
Gain flatness dB 2 2 2
Gain response time

when channels are ms <10 <10 <10
added or reduced


Item Unit
SEOPA17/17 SEOPA22/17 SEOPA27/17
(stable state)
Polarization-mode
ps <0.5 <0.5 <0.5
dispersion
Table 9-66 Technical specifications of 40/80-channel SEOPA Board (C-band)
Indices (40/80-channels system)

Item Unit
SEOPA17/20 SEOPA22/20 SEOPA27/20 SEOPA34/20
Channelss allocation nm 1529~1561 1529~1561 1529~1561 1529~1561
Total input power

dBm -16~3 -23~-4 -29~-10 -29~-10
range
-35 ~ -13 -35 ~ -17 -35 ~ -23 -35 ~ -30
Input power range of (40 channels) (40 channels) (40 channels) (40 channels)
dBm
the channels -35 ~ -16 -35 ~ -20 -35 ~ -26 -35 ~ -33
(80 channels) (80 channels) (80 channels) (80 channels)
-18~ 4(40 -13~4(40

Output power range of channels) channels) -8~4(40 channels) -1~4(40 channels)
dBm
the channels -18~ 1 (80 -13~ 1 (80 -8~1(80 channels) -1~1(80 channels)
channels) channels)
1~20(40 1~20(40 1~20(40

Total output power 1~20(40 channels) channels) channels) channels)
dBm
range -2~20(80 channels) -2~20(80 -2~20(80 -2~20(80
channels) channels) channels)
Max. total output

dBm 20 20 20 20
power
Noise coefficient dB <5.5 <5.5 <5.5 <5.5
dB <0.5 <0.5 <0.5 <0.5
loss
Pump leak at input dBm <-30 <-30 <-30 <-30
Pump leak at output dBm <-30 <-30 <-30 <-30
Input return loss dB >40 >40 >40 >40
Output return loss dB >40 >40 >40 >40


Item Unit
Channels gain dB 17 22 27 34
Max. bearable
dB <-30 <-30 <-30 <-30
Max. bearable
dB <-30 <-30 <-30 <-30
Gain flatness dB 2 2 2 2
Gain response time

when channelss are
ms <10 <10 <10 <10
added or reduced
(stable state)
Polarization-mode
ps <0.5 <0.5 <0.5 <0.5
dispersion
9.7.3 SOBA Specifications
Table 9-67 Technical specifications of 40/80-channel SOBA Board (C- Band)

SOBA22/20 SOBA22/20
Working 1529~1561
nm 1529~1561 (C band)
wavelength range (C band)
Total input power

dBm -21 ~-2 -21 ~ -2
range
Input power range

dBm -32~ -18 -32 ~ -21
of the channel
Output power
range of the dBm -10~4 -10~1
channel
Total output power

dBm 1~20 -2~20
range
Max. total output

dBm 20 20
power


SOBA22/20 SOBA22/20
Noise figure dB <6 <6
Polarization-relate
dB <0.5 <0.5
d loss
Pump leak at
dBm <-30 <-30
input
Pump leak at
dBm <-30 <-30
output
Input return loss dB >40 >40
Output return loss dB >40 >40
Channel gain dB 22 22
Max. bearable
reflectance at dB <-30 <-30
input
Max. bearable
reflectance at dB <-30 <-30
output
Gain flatness dB 2 2
Gain response
time when
channels are ms <10 <10
added or reduced
(stable state)
Polarization-mode
ps <0.5 <0.5
dispersion
9.7.4 SOPA Specifications
Table 9-68 Technical specifications of 40/80-channels SOPA Board (C-band)

Item Unit
SOPA17/17 SOPA22/17 SOPA27/17
Channelss allocation nm 1529~1561 1529~1561 1529~1561
Total input power range dBm -19~0 -23~-4 -29~-10


Item Unit
SOPA17/17 SOPA22/17 SOPA27/17
-35 ~ -16 -35 ~ -20 -35 ~ -26
Input power range of the (40 channels) (40 channels) (40 channels)
dBm
channels -35 ~ -19 -35 ~ -23 -35 ~ -29
(80 channels) (80 channels) (80 channels)
-18~ 1(40 -13~1(40

-8~1(40 channels)
Output power range of the channels) channels)
dBm -8~-2(80
channels -18~ -2 (80 -13~ -2 (80
channels)
channels) channels)
-2~17(40 -2~17(40
-2~17(40 channels) channels) channels)
Total output power range dBm
-5~17(80 channels) -5~17(80 -5~17(80
channels) channels)
Max. total output power dBm 17 17 17
Noise coefficient dB <5.5 <5.5 <5.5
Polarization-related loss dB <0.5 <0.5 <0.5
Channels gain dB 17 22 27
Max. bearable reflectance at

dB <-30 <-30 <-30
input
Max. bearable reflectance at

dB <-30 <-30 <-30
output
Gain response time when

channelss are added or reduced ms <10 <10 <10
(stable state)
Polarization-mode dispersion ps <0.5 <0.5 <0.5
Table 9-69 Technical specifications of 40/80-channels SEOPA Board (C-band)


Item Unit
Channelss
nm 1529~1561 1529~1561 1529~1561 1529~1561
allocation
Total input
dBm -16~3 -23~-4 -29~-10 -29~-10
power range
-35 ~ -13 -35 ~ -17 -35 ~ -23 -35 ~ -30
Input power
range of the dBm
-35 ~ -16 -35 ~ -20 -35 ~ -26 -35 ~ -33
channels
Output -18~ 4(40 -13~4(40

power range channels) channels) -8~4(40 channels) -1~4(40 channels)
dBm
of the -18~ 1 (80 -13~ 1 (80 -8~1(80 channels) -1~1(80 channels)
channels channels) channels)
1~20(40 1~20(40 1~20(40

Total output 1~20(40 channels) channels) channels) channels)
dBm
power range -2~20(80 channels) -2~20(80 -2~20(80 -2~20(80
channels) channels) channels)
Max. total
dBm 20 20 20 20
output power
Noise
dB <5.5 <5.5 <5.5 <5.5
coefficient
Polarization-
dB <0.5 <0.5 <0.5 <0.5
related loss
Pump leak at
dBm <-30 <-30 <-30 <-30
input
Pump leak at
dBm <-30 <-30 <-30 <-30
output
Input return
dB >40 >40 >40 >40
loss
Output
dB >40 >40 >40 >40
return loss
Channels
dB 17 22 27 34
gain
Max.
dB <-30 <-30 <-30 <-30
bearable


Item Unit
reflectance
at input
Max.
bearable
dB <-30 <-30 <-30 <-30
reflectance
at output
Gain
dB 2 2 2 2
flatness
Gain
response
time when
channelss ms <10 <10 <10 <10
are added or
reduced
(stable state)
Polarization-
mode ps <0.5 <0.5 <0.5 <0.5
dispersion
9.7.5 EOBAH (Enhanced Optical Booster Amplifier) Specifications
Table 9-70 Technical specifications of 40/80-channel EOBAH Board (C- Band)

Item Unit
EOBAH27/26 EOBAH24/24 EOBAH24/23
Working
nm 1529~1561(C band) 1529~1561(C band) 1529~1561 (C band)
wavelength range
Total input power

dBm -20 ~-1 -19~0 -20 ~-1
range
Input power range -32~-17 (40 channel) -32~-16(40 channel) -32~-17(40 channel)
dBm
of the channel -32~-20 (80 channel) -32~-19(80 channel) -32~-20(80 channel)
Output power range -5~10(40 channel) -8~8(40 channel) -8~7(40 channel)

dBm
of the channel -5~7(80 channel) -8~5(80 channel) -8~4(80 channel)


Item Unit
EOBAH27/26 EOBAH24/24 EOBAH24/23
Total output power 7~26(40 channel) 5~24(40 channel) 4~23(40 channel)

dBm
range 4~26(80 channel) 2~24(80 channel) 1~23(80 channel)
Max. total output

dBm 26 24 23
power
Noise figure dB <6 <6 <6
dB <0.5 <0.5 <0.5
loss
Channel gain dB 27 24 24
Max. bearable
dB <-30 <-30 <-30
Max. bearable
reflectance at dB <-30 <-30 <-30
output
Gain response time

when channels are
ms <10 <10 <10
added or reduced
(stable state)
Polarization-mode
ps <0.5 <0.5 <0.5
dispersion
9.7.6 EONA (Enhanced Optical Node Amplifier) and M2EONA Specifications
Table 9-71 Technical specifications of 40/80-channel EONA with DCM

Item Unit
EONA25/20 EONA33/20 EONAH27/24
Working wavelength 1529~1561 1529~1561 1529~1561

nm
range (C-band) (C-band) (C-band)


Item Unit
EONA25/20 EONA33/20 EONAH27/24
Total input power

dBm -29 ~ 0 -37 ~ -8 -27 ~ 2
range
Input power range of -35 ~ -16(40 channel) -37 ~ -24(40 channel) -35 ~ -14(40 channel)
dBm
the channel -35 ~ -19(80 channel) -37 ~ -27(80 channel) -35 ~ -17(80 channel)
Output power range -15 ~ 4(40 channel) -13 ~ 4(40 channel) -13 ~ 8(40 channel)
dBm
of the channel -15 ~1(80 channel) -13 ~ 1(80 channel) -13 ~ 5(80 channel)
Total output power 1 ~ 20(40 channel) 1 ~ 20(40 channel) 5 ~ 24(40 channel)

dBm
range -2 ~ 20(80 channel) -2 ~ 20(80 channel) 2 ~ 24(80 channel)
Max. total output

dBm 20 20 24
power
Gain=20: ≤8.0 Gain=28: ≤6.5 Gain=22: ≤8.5

Noise coefficient dB Gain=25: ≤6.5 Gain=33: ≤6.0 Gain=27: ≤7.5
Gain=30: ≤6.0 Gain=38: ≤6.0 Gain=32: ≤6.5
dB <0.5 <0.5 <0.5
loss
Channel gain dB 20~30 24~38 22~32
Max. bearable
dB <-30 <-30 <-30
Max. bearable
dB <-30 <-30 <-30
Gain response time

when channels are
ms <10 <10 <10
added or reduced
(stable state)
Polarization-mode
ps <0.5 <0.5 <0.5
dispersion

Table 9-72 Technical specifications of 40/80-channel M2EONA without DCM

Item Unit M2EONA18 M2EONA25 M2EONA31 M2EONAH27 M2EONAH27
/20 /20 /20 /24 /23
Working
1529~1561 1529~1561 1529~1561 1529~1561 1529~1561
wavelength nm
(C-band) (C-band) (C-band) (C-band) (C-band)
range
Total input
dBm -22~7 -29 ~ 0 -37 ~ -4 -27 ~ 2 -28~1
power range
-35 ~ -9(40 -35 ~ -16(40 -37 ~ -20(40 -35 ~ -14(40 -35~-15
Input power channel) channel) channel) channel) (40 channel)
range of the dBm
-35 ~ -12(80 -35 ~ -19(80 -37 ~ -23(80 -35 ~ -17(80 -35~-18
channel
channel) channel) channel) channel) (80 channel)
Output -22 ~ 4(40 -15 ~ 4(40 -13 ~ 4(40 -13 ~ 8(40 -13 ~ 7(40
power range channel) channel) channel) channel) channel)
dBm
of the -22 ~1(80 -15 ~1(80 -13 ~ 1(80 -13 ~ 5(80 -13 ~ 4(80
channel channel) channel) channel) channel) channel)
1 ~ 20 1 ~ 20 1 ~ 20 5 ~ 24 4 ~ 23
Total output (40 channel) (40 channel) (40 channel) (40 channel) (40 channel)
dBm
power range -2 ~ 20 -2 ~ 20 -2 ~ 20 2 ~ 24 1 ~ 23
(80 channel) (80 channel) (80 channel) (80 channel) (80 channel)
Max. total
dBm 20 20 20 24 23
output power
Gain=13: ≤8.5 Gain=20: ≤6.0 Gain=24: ≤6.5 Gain=22: ≤7.0 Gain=22: ≤7.0
Noise Gain=27: ≤6.0
dB Gain=18: ≤6.5 Gain=25: ≤5.5 Gain=31: ≤5.5 Gain=27: ≤6.0
coefficient
Gain=23: ≤ 6.0 Gain=30: ≤5.5 Gain=38: ≤5.5 Gain=32: ≤5.5 Gain=32: ≤5.5
Polarization-
dB <0.5 <0.5 <0.5 <0.5 <0.5
related loss
Pump leak at
dBm <-30 <-30 <-30 <-30 <-30
input
Pump leak at
dBm <-30 <-30 <-30 <-30 <-30
output
Input return
dB >40 >40 >40 >40 >40
loss
Output dB >40 >40 >40 >40 >40


Item Unit M2EONA18 M2EONA25 M2EONA31 M2EONAH27 M2EONAH27
/20 /20 /20 /24 /23
return loss
Channel
dB 13~23 20~30 24~38 22~32 22~32
gain
Max.
bearable
dB <-30 <-30 <-30 <-30 <-30
reflectance
at input
Max.
bearable
dB <-30 <-30 <-30 <-30 <-30
reflectance
at output
Gain flatness dB 2 2 2 2 2
Gain
response
time when
channels are ms <10 <10 <10 <10 <10
added or
reduced
(stable state)
Polarization-
mode ps <0.5 <0.5 <0.5 <0.5 <0.5
dispersion
Table 9-73 Technical specifications of 40/80-channel M2EONA with DCM

Item Unit M2EONA1820 M2EONA25/ M2EONA31/ M2EONAH2 M2EONAH2
20 20 7/24 7/23
Working
1529~1561 1529~1561 1529~1561 1529~1561 1529~1561
wavelength nm
(C-band) (C-band) (C-band) (C-band) (C-band)
range
Total input power -22~7

dBm -29 ~ 0 -37 ~ -4 -27 ~ 2 -28~1
range
Input power -35 ~ -9(40 -35 ~ -16(40 -37 ~ -20(40 -35 ~ -14(40
dBm -35~-15
range of the channel) channel) channel) channel)


20 20 7/24 7/23
channel -35 ~ -12(80 -35 ~ -19(80 -37 ~ -23(80 -35 ~ -17(80 (40 channel)
channel) channel) channel) channel) -35~-18
(80 channel)
-22 ~ 4(40 -15 ~ 4(40 -13 ~ 4(40 -13 ~ 8(40 -13 ~ 7(40
Output power
channel) channel) channel) channel) channel)
range of the dBm
-22 ~1(80 -15 ~1(80 -13 ~ 1(80 -13 ~ 5(80 -13 ~ 4(80
channel
channel) channel) channel) channel) channel)
1 ~ 20(40 1 ~ 20(40 1 ~ 20(40 5 ~ 24(40 4 ~ 23

Total output channel) channel) channel) channel) (40 channel)
dBm
power range -2 ~ 20(80 -2 ~ 20(80 -2 ~ 20(80 2 ~ 24(80 1 ~ 23
channel) channel) channel) channel) (80 channel)
Max. total output

dBm 20 20 20 24 23
power
Noise coefficient dB Gain=18: ≤8.0 Gain=25: ≤6.5 Gain=31: ≤6.0 Gain=27: ≤7.5 Gain=27: ≤7.5
Polarization-relat
dB <0.5 <0.5 <0.5 <0.5 <0.5
ed loss
Pump leak at
dBm <-30 <-30 <-30 <-30 <-30
input
Pump leak at
dBm <-30 <-30 <-30 <-30 <-30
output
Input return loss dB >40 >40 >40 >40 >40
Output return
dB >40 >40 >40 >40 >40
loss
Channel gain dB 13~23 20~30 24~38 22~32 22~32
Max. bearable
reflectance at dB <-30 <-30 <-30 <-30 <-30
input
Max. bearable
reflectance at dB <-30 <-30 <-30 <-30 <-30
output
Gain flatness dB 2 2 2 2 2


20 20 7/24 7/23
Gain response
time when
channels are
ms <10 <10 <10 <10 <10
added or
reduced (stable
state)
Polarization-mod
ps <0.5 <0.5 <0.5 <0.5 <0.5
e dispersion
9.7.7 HNA Specifications
Table 9-74 Technical Specifications of the HNA2020-WO Board

Operating wavelength
nm 1529~1561
range
Typical gain range dB 15 to 25
Equivalent noise factor ≤6 (15 dB Gain)

dB ≤4.5 (17 dB Gain)
≤3.5 (20 dB Gain)
Gain flatness dB 2
Input power range of

dBm –24 to 5
the LINE port
Hybrid amplifier
Maximum output power
specifications dBm 20
of the OUT port
Pump wavelength of
nm 1420 to 1460
the LINE port
Pump optical power of

mW ≤500
the LINE port
Polarization dependent
dB ≤0.5
gain
Polarization mode
ps ≤0.5
dispersion

nm 1529 to 1561
range
Gain range G.652: 5 to 6

RAMAN dB
LEAF: 5 to 8
LINE reflection factor dBm <-45
Pump wavelength nm 1420 to 1460
Maximum pump power mW ≤500
nm 1529 to 1561
range
Output power range of 1~20(40 channel)

EDFA dBm
the OUT port -2~20(80 channel)
Channel gain dB 9 to 19
Output reflection factor dB <-45
Table 9-75 Technical Specifications of the HNA2620-W Board
nm 1529~1561
range
Equivalent noise factor ≤6 (19 dB gain)
dB
≤2 (26 dB gain)
≤1 (33 dB gain)
Hybrid amplifier Gain flatness dB 2
specifications Input power range of
dBm –32 to 1
the LINE port

dBm 20
of the OUT port
Pump wavelength of
nm 1420 to 1460
the LINE port

mW ≤750
the LINE port

dB ≤0.5
gain
Polarization mode
ps ≤0.5
dispersion
nm 1529 to 1561
range

RAMAN dB
LEAF: 8 to 13
nm 1529 to 1561
range

EDFA dBm
Table 9-76 Technical Specifications of the HNA2620-WO Board

nm 1529~1561
range
Equivalent noise factor ≤5 (19 dB gain)

dB ≤3 (22 dB gain)
≤1 (33 dB gain)
Hybrid amplifier
Gain flatness dB 2
specifications
Input power range of
dBm –32 to 1
the LINE port

dBm 20
of the OUT port
Pump wavelength of
nm 1420 to 1460
the LINE port


mW ≤750
the LINE port
dB ≤0.5
gain
Polarization mode
ps ≤0.5
dispersion
nm 1529 to 1561
range

RAMAN dB
LEAF: 8 to 13
nm 1529 to 1561
range

EDFA dBm
9.7.8 RAMAN Specifications
The RAMAN boards include two types: normal power pump and high power pump. And
each of them has the DRA_P board and DRA_B board. The specifications are listed
below:
The DRA_P board applies RAMAN amplifier to amplify the optical signals, and its
specifications are listed in Table 9-77.
Table 9-77 Technical specifications of RAMAN_P amplifier
Item Unit Parameters
counter propagating distributed

Type
pump

Pump wavelength nm 1420~1470
Pump power mW ≤750
Type of output connector LC/UPC, E2000/APC
gain (G652) dB 10
gain (LEAF) dB 12
gain (TW RS) dB 13
equivalent noise figure (G652) dB 0
equivalent noise figure (LEAF) dB -1
equivalent noise figure (TW RS) dB -1.5
Polarization dependent gain(PDG) dB <0.2
Polarization mode dispersion(PMD) ps <0.5
Input return loss dB >45
Output return loss dB >45
Gain flatness dB <4
The DRA_B board applies RAMAN amplifier to amplify the optical signals, and its
specifications are listed inn Table 9-78.
Table 9-78 Technical specifications of RAMAN_B amplifier

Type Co-propagating distributed pump
Band gain(G.652) dB 1-6
Noise figure dB <1

Gain flatness dB <4
The high power pump DRA_P board applies RAMAN amplifier to amplify the optical
signals, and its specifications are listed in Table 9-79.
Table 9-79 Technical specifications of high power pump RAMAN_P amplifier
counter propagating distributed

Type
pump
gain (G652) dB 30
equivalent noise figure (G652) dB <-3
Gain flatness dB <4
The high power pump DRA_B board applies RAMAN amplifier to amplify the optical
signals, and its specifications are listed in Table 9-80.
Table 9-80 Technical specifications of high power pump RAMAN_B amplifier
Type Co-propagating distributed pump
Band gain(G.652) dB 18

Noise figure dB <-1
Gain flatness dB <4
9.7.9 RPOA Specifications
RPOA amplifier technical specifications are listed in Table 9-81.
Table 9-81 Technical specifications of RPOA amplifier
Item RPOA with GFF sub-system RPOA without GFF sub-system
Working
wavelength 1529~1561nm 1546~1561nm
range
Noise
<7dB <6dB
coefficient
Gain >17dB >19.5dB
Gain
<4dB <4dB
flatness
Total input
power -44～-18dBm -44～-18dBm
range
Working
-40～65°C （RGU）， -40～65°C (RGU)
temperature
-10～60°C（RPU） -10～60°C(RPU)
range
Storage
temperature -40～85°C -40～85°C
range

Notes: RPOA subsystems without Gain Flatness Filter (GFF) meet the requirements of systems with capacity below 16
wavelengths, while RPOA subsystems with GFF meet the requirements of systems with capacity of 40 wavelengths.
9.7.10 LAC Specifications
Technical specifications of LAC board are listed in Table 9-82
Table 9-82 Technical specifications of LAC board
1529~1561(C band)
Application wavelength range nm 1529~1568(CE band)
1570~1605(L band)
Input power detection range dBm -39 to +20
Output power detection range dBm -40 to +18
Optical power detection Precision dB ≤±0.5
Attenuation adjustment precision dB ≤±0.5
Attenuation adjustment step length dB ≤±0.2
Attenuation adjustment range dB ≥20
Attenuation adjustment rate dB ≤10
9.7.11 SFP VOA Specifications
Table 9-83 Technical specifications of SFP VOA modules
Parameter Min Max Unit
Operating Optical Input without PD -35 +26 dBm

Power
with input PD -35 5 dBm
with output PD -10 26 dBm
Insertion Loss(without tap monitor) 1.5 dB

Insertion Loss(with tap monitor) 2.5 dB
Wavelength range （Note1） 1528 1562 nm

Wavelength dB
@ IL dB attenuation 0.4
Dependence Loss Pk-Pk
over 1528-1562 nm @ 5dB attenuation 0.4
wavelength range)
@ 10dB attenuation 0.7
Guaranteed Attenuation Dynamic Range 20 dB
Attenuation Step Resolution 0.1 dB
Attenuation Accuracy Without PD @ 0 dB≤ Att. ≤10dB -0.7 0.7 dB

@1528-1562 nm
wavelength range Without PD @ 10 dB< Att. ≦20dB -1.5 1.5
With PD @ 0 dB≤ Att. ≤10dB -0.8 0.8
With PD @ 10 dB< Att. ≦20dB -1.6 1.6
Input Power Monitor -35dBm≤ P ≤-15dBm -1 1 dB

Accuracy
-15dBm＜ P ≤5dBm -0.5 0.5
Output Power Monitor -10dBm≤ P ≤ 10dBm -1 1

Accuracy
10dBm＜ P ≤26dBm -0.5 0.5
Polarization 0 dB≤ Att. ≤10dB 0.5 dB

Dependence Loss
10 dB＜ Att. ≦20dB 0.8 dB
Chromatic Dispersion -0.05 0.05 ps/nm
Polarization Mode Dispersion 0.1 ps
Return Loss 40 dB
Block Attenuation Loss 35 dB
Note: There are three types VOA-SFP modules, they are SFP-VOA-B-N(Power off state: Bright No Power Detector ),

SFP-VOA-B-IPD(Power off state: Bright With Input Power Detector Tap coupling：5%) and SFP-VOA-B-OPD(Power off
state: Bright With Output Power Detector Tap coupling：1%.)
9.8 Protection Board Specifications
9.8.1 SOP Specifications
Table 9-84 Technical specifications of SOP board
Working wavelength nm 1280 ~ 1625
Insertion T1_I→T1_O1 dB <4.4 (1510 nm ~1625 nm)

loss <5.0 (1280 nm ~1510 nm)
T2_I→T2_O1 <4.4 (1510 nm ~1625 nm)

<5.0 (1280 nm ~1510 nm)
T1_I→T1_O2 <4.4 (1510 nm ~1625 nm)

<5.0 (1280 nm ~1510 nm)
T2_I→T2_O2 <4.4 (1510 nm ~1625 nm)

<5.0 (1280 nm ~1510 nm)
R1_I1→ R1_O <2.1 (1510 nm ~1625 nm)

<2.7 (1280 nm ~1510 nm)
R2_I1→ R2_O <2.1 (1510 nm ~1625 nm)

<2.7 (1280 nm ~1510 nm)
R1_I2→ R1_O <2.1 (1510 nm ~1625 nm)

<2.7 (1280 nm ~1510 nm)
R2_I2→ R2_O <2.1 (1510 nm ~1625 nm)

<2.7 (1280 nm ~1510 nm)
Reflectance dB >40
Input optical power mW <200
Switching time ms <50

9.9 Optical Supervisory Channel Board Specifications
Table 9-85 Technical specifications of OSC board
Optical signal format 100BASE-FX
Working wavelength nm 1510±10
Signal coding 4B/5B
Supervision rate 100
Signal transmission power dBm -3 to +2 +2 to +7 +3 to +10
Minimum receiving sensitivity dBm -37 -37 -43

Note: The specification of the table is the EOL data
9.10 Optical Layer Management Subsystem

Specifications
9.10.1 EOPM Board (type B) Specifications
For the technical specifications of the EOPM board with channel spacing of 50 GHz, refer
to Table 9-86. For the technical specifications of the EOPM board with channel spacing
of 100 GHz, refer to Table 9-87.
Table 9-86 Technical Specifications of the EOPM Board (type B) (50 GHz)
Item Specification
Wavelength range (nm) 1529 to 1561 (C band)
1570 to 1605 (L band)
1529 to 1568 (CE band)
Wavelength detection precision (nm) ±0.05
Input power range (dBm) –45 to –15
Power detection precision (dBm) ±1.5
OSNR range (dB) ≤ 25
OSNR detection precision (dB) ±1.5

Item Specification
Input return loss (dB) 30
Signal detection time (s) ≤ 1
Table 9-87 Technical Specifications of the EOPM Board (type B) (100 GHz)
Item Specification
1570 to 1605 (L band)
1529 to 1568 (CE band)
OSNR detection precision (dB) ±1.5
9.10.2 EOPM Board (type CS) Specifications
The technical specification of the EOPM (type CS) board refers to Table 9-88.
Table 9-88 Technical Specifications of the EOPM (type CS) Board
Item Specification
OSNR detection precision (dB) ±1.5 @ OSNR ＜ 20dB

±2 @ 20dB ≤OSNR ＜ 25dB

9.10.3 EOPM Board (type MS) Specifications
The technical specification of the EOPM (type MS) board refers to Table 9-89.
Table 9-89 Technical Specifications of the EOPM (type MS) Board
Item Specification

±2 @ 20dB ≤OSNR ＜ 25dB
9.10.4 EOPM Board (type B1S) Specifications
The technical specification of the EOPM (type B1S) board refers to Table 9-88.
Table 9-90 Technical Specifications of the EOPM (type B1S) Board
Item Specification

±2 @ 20dB ≤OSNR ＜ 25dB

9.10.5 EOWM Board Specifications
For the technical specifications of the EOWM board, refer to Table 9-91.
Table 9-91 Technical Specifications of the EOWM Board
Item Specification
1570 to 1605 (L band)
1529 to 1568 (CE band)
Wavelength offset capture range –5 to +5

(GHz)
Wavelength offset alarm range (GHz) > ±5
9.10.6 OFM Board Specifications
Table 9-92 Technical Specifications of the OFM Board
Working band nm 1625

@25℃ dB 37
Dynamic range
@-10~55℃ dB 35
Event dead zone m 5(maximum)
Attenuation dead zone m 20(maximum)

-5
± (1+ 10 × measurement distance +
Distance measurement accuracy m
sampling resolution)
Linearity dB/dB ±0.05
Sampling resolution m 0.05
Loss threshold dB 0.01
Loss accuracy dB 0.01

9.10.7 EOFM Board Specifications
Table 9-93 Technical Specifications of the EOFM Board
Working band nm 1502.5

@25℃ dB 37
Dynamic range
@-10~55℃ dB 35

-5
9.10.8 SOFM Board Specifications
Table 9-94 Technical Specifications of the SOFM Board
Working band nm 1625

@25℃ dB 18
Dynamic range
@-10~55℃ dB 16

-5

9.10.9 OFMF Board Specifications
Table 9-95 Technical Specifications of the OFMF Board
Transmission band nm 1480–1563
Reflection band nm 1600–1650
Insertion Loss of reflection dB ≤1.2
Insertion Loss of transmission dB ≤1.0
Isolation of transmission to
dB ≥40
reflection
Isolation of reflection to
dB ≥40
transmission
Optical Return Loss dB ≥45
Directivity dB ≥60
IL ripple dB ≤0.3
PMD ps ≤0.1
PDL dB ≤0.1
Optical power mW ≤500
Operation Temperature ℃ -15~+75
Relative Humidity %RH 5~95
Storage Temperature ℃ -40~+85

9.10.10 EOFMF Board Specifications
Table 9-96 Technical Specifications of the EOFMF Board
Transmission band nm 1485.5~1500 and 1504.5~1517.5
Reflection band nm 1502.5±0.5
Insertion Loss of transmission dB 2.0
dB ≥40
reflection
dB ≥40
transmission
IL ripple dB ≤0.3
PMD ps ≤0.1
PDL dB ≤0.1
9.10.11 SOFMF Board Specifications
Table 9-97 Technical Specifications of the SOFMF Board
Transmission band nm 1480–1563
Reflection band nm 1600–1650
Insertion Loss of transmission dB ≤1.0

dB ≥40
reflection
dB ≥40
transmission
IL ripple dB ≤0.3
PMD ps ≤0.1
PDL dB ≤0.1
9.11 DCM Specifications
Table 9-98 Technical specifications of DCM module (G.652 fiber)
Dispersion
Compens Max. total Working
Max. Slope
ation DGD DGD input wavelengt
Item insertion Compensatio
distance (ps) Loss power h range
loss (dB) n Ratio
(km) (dB) (dBm) (nm)
(DSCR)
DCM20 20 4 90%~110% 0.3 0.5 20 1525~1565
DCM40 40 5 90%~110% 0.4 0.5 20 1525~1565
DCM60 60 6 90%~110% 0.6 0.5 20 1525~1565
DCM80 80 7 90%~110% 0.7 0.5 20 1525~1565
DCM100 100 8 90%~110% 0.8 0.5 20 1525~1565
DCM120 120 9 90%~110% 0.9 0.5 20 1525~1565

Table 9-99 Technical specifications of DCM module (G.655 LEAF fiber)
Dispersion
Compens Max. total Working
Max. Slope
ation DGD DGD input wavelengt
Item insertion Compensatio
distance (ps) Loss power h range
loss (dB) n Ratio
(km) (dB) (dBm) (nm)
(DSCR)
DCM20 20 4 80%~120% 0.45 0.3 20 1525~1565
DCM40 40 5 80%~120% 0.6 0.3 20 1525~1565
DCM60 60 6 80%~120% 0.75 0.3 20 1525~1565
DCM80 80 7 80%~120% 0.8 0.3 20 1525~1565
DCM100 100 8 80%~120% 0.9 0.3 20 1525~1565
DCM120 120 9 80%~120% 1.0 0.3 20 1525~1565
DCM240 240 4 80%~120% 1.5 0.25 23 1525~1565
9.12 Physical Specification and Environmental

Requirements
9.12.1 Structure Indices
The dimensions and weight of ZXONE 9700 system are shown in Table 9-100.
Table 9-100 Dimensions and Weight of ZXONE 9700
Weig
Components Dimensions ht
(kg)
Unified cabinets of ZTE 2,200 mm (H) × 600 mm (W) × 300 mm (D) 58.50
transmission equipment 2,600 mm (H) × 600 mm (W) × 300 mm (D) 76.00
2,200 mm (H) × 600 mm (W) × 600 mm (D) 100

Cabinets for S6
2,600 mm (H) × 600 mm (W) × 600 mm (D) 110
Universal Switch
530.6mm(H)×482.6mm(W)×286.8mm(D) 15
Sub-rack(S1)
Universal Switch
1108.4mm(H)×482.6mm(W)×286.8mm(D) 35
Sub-rack(S2)

Weig
(kg)
Universal Switch
1772mm(H)×533mm(W)×286.8mm(D) 40
Sub-rack(S3)
Universal Switch
1772 mm(H)×533 mm(W)×549.6 mm(D) 80
Sub-rack(S6)
Transmission Sub-rack
447 mm (H) × 535mm (W) × 275 mm (D) 19
(NX41–21)
Distributed Sub-rack
447 mm (H) × 535mm (W) × 275 mm (D) 19
(DX41–21)
Transmission Sub-rack
441.7 mm (H) x 482.6 mm (W) x 275 mm (D) 16.8
(NX41–19)
Distributed Sub-rack
441.7 mm (H) x 482.6 mm (W) x 275 mm (D) 16.8
(DX41–19)
Power supply distribution

88.1mm (H) × 535mm (W) × 258 mm(D) 3.8
box(NX41/DX41)
Power supply distribution

132mm(H) × 535mm(W) × 161mm(D) 5
box(S3/S6)
Power supply distribution 131mm(H) ×482.6mm(W)(442mm with

4
box(S1/S2) lug×100mm(D)
ODF sub-rack 88 mm (H) × 482.6 mm (W) × 269.5 mm (D) 6.50
DCM chassis 47 mm (H) × 533 mm (W) × 286.5 mm (D) 5.60
RGU chassis for fiber 6.7~8

583mm(H)×334mm(W)×205mm(D)
connection (GJS-9007B) .5
Conversion bracket 29.6mm (H) × 345.6mm (W) 0.30
42 mm (H) × 410 mm(W) × 250mm(D)

3.3
(NX41/DX41-19 inch)
42 mm (H) × 492 mm(W) × 250mm(D)

3.5
(NX41/DX41-21 inch)
Fan unit
44mm(H) × 233mm(W) × 266mm(D)
2
(M4S3/M4S6)
107.5(H) ×158mm(W) ×280.2mm(D) (S3/S6) 2
43.6mm(H) ×437mm(W) ×226mm(D) (S1/S2) 3.2
Single-slot board for For

366.7mm(H)×25.4(W)×212.2mm(D)
Universal Switch Platform the

Weig
(kg)
Full-height board for PCB:320 mm (W) × 210 mm (D) weig

transmission sub-rack Front panel: 345.6 mm (H) × 29.8 mm (W) ht of
each
Semi-height board for PCB:152 mm (W) × 210 mm (D)
boar
transmission sub-rack Front panel: 155.6 mm (H) × 25.1 mm (W)
d,
refer
to
CCP/PWE Front panel: 173.15mm(H)×25mm(W) follo
wing
table.
Note: The cabinet weight refers to the empty cabinet.
The board weight of ZXONE 9700 is shown in Table 9-101
Table 9-101 ZXONE 9700 Board Weight
Slot
Weight
Board ID Board Description occupat
(kg)
ion
SNP Net control processor 0.60 1
NCPK Node Control Processor(type K) 2.8 1
CCPK Cabinet Control Processor(type K) 2.8 1
Semi-height Communication Control

SCC 0.47 1
Board
CCP Subrack Management Board 0.7 1
TIS Time interface supply board 0.45 1
ETI Extended Timing Interface Board 0.66 1
SAIK System Auxiliary Interface,(type K) 2.8 1
EIC EIC Extended Interface (type C) 0.5 1
FCC(19 inch
Fan Board (type C) 3.3 -
sub rack)
FCC(21 inch
Fan Board (type C) 3.5 -
sub rack
FCPL Fan Control Processor(type L) 2 -

Slot
Weight
(kg)
ion
FCPM Fan Control Processor(type M) 2 -
FCPN Fan Control Processor(type N) 3.2 -
M1PSK Packet Switch Board,(type K) 2.15 1
PSV Packet Switch (type V) 2.0 2
PWE Power Supply Board (type E) 0.858 1
PWRK Power Supply Board (type K) 0.78 -
PWRL Power Supply Board (type L) 0.88 0.5
Optical supervision channel board for Fast

SOSCB 0.5 1
Ethernet
Semi-height Optical Protection

SOP 0.60 1
Board
Type B Enhanced Optical Trans-

EOTU10GB 1.65 2
ponder Unit for 10 Gbit/s
M1TD2C Transponder of 2 ports 10Gb/s 0.7 1
M3TD2C Transponder of 2 ports 10Gb/s 0.5 1
TS2C Transponder of 1 ports 10Gb/s 0.7 1
Transponder of 1 port at 10 Gbit/s with OCH

TS2CP 0.7 1
1+1
TS2CGA Regenerator of 2 ports at 10 Gbit/s 0.7 1
M1MQA2 Muxponder of 4 ports any rate to OTU2 0.46 1
Muxponder of 6 ports any rate to main

M1MJA 0.4 1
board
Muxponder of 6 ports any rate to main

M2MJA 0.55 1
board
Muxponder of 16 ports E1 （N Port）to
MHE1 0.5 1
2*OTU1

Slot
Weight
(kg)
ion
MOM2 Eight GE/FC Muxponder 1.5 2
2(2
Muxponder of 8 ports any rate to 2*OTU2
MOM2B 0.55 horizont
(type B)
al slot)
TST3 (using
Optical Transponder Unit for 40Gb/s 3.5 4
DPSK module)
TST3 (using
DQPSK Optical Transponder Unit for 40Gb/s 3.3 4
module)
TST3 (using
PM-QPSK Optical Transponder Unit for 40Gb/s 3.3 4
module)
MQT3 (using
Four 10G Sub Rate Mux Board 3.25 4
DPSK module)
MQT3 (using
DQPSK Four 10G Sub Rate Mux Board 3.05 4
module)
MQT3 (using
PM-QPSK Four 10G Sub Rate Mux Board 3.05 4
module)
TST3
Optical transponder unit for 40 Gbit/s 3.0 4
(regenerator)
Single-channel 100Gb/s Optical Channel

TS4(M3) 5.5 4
Transport Unit
TS4(M3)(REG Single-channel 100Gb/s Optical Channel

5 4
) Transport Unit

TS4(M4) 3.2 4
Transport Board

2.65 4
) Transport Board(REG)

TS4(M5) 2.85 2
Transport Board

2.65 2
) Transport Board(REG)

Slot
Weight
(kg)
ion
TD4 Optical Transponder Unit for 2*100Gb/s 5.8 4
MQ4/S Four 100G SubRate Mux Board 6.3 4
MQ4/D Four 100G SubRate Mux Board 6.25 4
M2MX2(6
Ten 10G Sub Rate Mux Board 3.5 6
slots)
M4MX2(4
Ten 10G SubRate Mux Board 3 4
slots)
M4MX2(4
slots)(No Ten 10G SubRate Mux Board 2.8 4
SFP++)
ASMB Aggregation Switch Muxponder (Type B) 0.6 2
Muxponder of 8 ports of GE/10GE with L2

SOG2 0.9 2
Switch to OTU2
Client side board with 4 ports:OTU1 and

C1Kx4 2.23 1
below OTU1 level, Type K

C1Kx8 2.43 1

C1Kx16 2.83 1
Client side board with 4 ports:OTU2 level,

C2Kx4 2.48 1
Type K

C2Kx8 2.56 1
Type K

C2Kx10 2.60
Type K

C2Kx12 2.64 1
Type K
C2Kx20(with Client side board with 20 ports:OTU2 level,

2.80 1
SFP+) Type K
Client side board with single port:OTU3

C3Kx1 2.3 1
level, Type K
Client side board with double ports:OTU3

C3Kx2 2.8 1
level, Type K

Slot
Weight
(kg)
ion
Client side board with single port:OTU4

C4Kx1 2.5 1
level, Type K
Client side board with double ports:OTU4

C4Kx2 3 1
level, Type K

C4Lx4 2.61 1
Type L
PGEKx12(N-S
12 ports GE Line Card, type K 3 1
FP)
PXGKx12(N-S
12 ports XGE Line Card, type K 3 1
FP++)
PXLGK 1 port 40GE Line Card, type K 3.1 1
PCGK(N-CFP) 1 port 100GE Line Card, type K 3.1 1
20 ports GE/10GE client side L2 switch

E2Kx20 2 1
board, type K
2 ports 100GE client side L2 switch

E4Kx2 board,type K 2.5 1
Line side board with 4 ports:OTU2 level,

L2Kx4 2.48 1
Type K

L2Kx8 2.56 1
Type K

L2Kx10 2.60 1
Type K

L2Kx12 2.64 1
Type K
Line side board with single port:OTU4 level,

M2L4Lx1 3.10/3.88 1/2
Type L

M3L4Lx1 2.80 1
Type L

L4Kx1 2.6 1
Type K

L4Kx2 3.1 1
Type K

Slot
Weight
(kg)
ion

L4Kx4 3.5 1
Type K

L4Lx2 3.28 1
Type L
Line side board with 2 ports:

LB4Kx1/2 3.425 2
OTUC4/OTUC2 level, Type K
Line side board with single

LB4Kx1/1 3.425 2
port:OTUC4/OTUC2 level, Type K
Line side board with single

LB2Lx1 3.325 1
port:OTUC2/OTU4 level, Type L
Line side board with 1 hybrid port:1*OTU4

H4K(N-CFP) 3 1
level, Type K
Semi-height Supervisory Division

SSDM 0.60 1
Multiplexing Board
EONA(M1) Enhanced Optical Node Amplifier(M1) 2.00 4
EONA(M2) Enhanced Optical Node Amplifier(M2) 1.30 2
HNA Hybrid node Amplifier 2.00 4
SEOBA Enhanced Optical Booster Amplifier 0.60 1
SOBA Smart Optical Booster Amplifier 0.62 1
SEOPA Enhanced Optical Pre-Amplifier 0.60 1
SOPA Smart Optical Pre-Amplifier 0.62 1
EOBAH Enhanced Optical Booster Amplifier 2.20 4
EONAH Enhanced Optical Node Amplifier 2.20 4
M1DRA_P Distributed Raman Amplifier-Pre 2.00 4
M1DRA_B Distributed Raman Amplifier Booster 2.00 4
M1DRA_P(H1 High Power Distributed Raman

2.5 4
4) Amplifier-Pre
M1DRA_B(H1 High Power Distributed Raman Amplifier

2.5 4
4) Booster
M2DRA_P Distributed Raman Amplifier-Pre 2.2 4
M2DRA_B Distributed Raman Amplifier Booster 2.2 4
M2DRA_P(H1 High Power Distributed Raman 2.4 4

Slot
Weight
(kg)
ion
4) Amplifier-Pre
M2DRA_B(H1 High Power Distributed Raman Amplifier

2.4 4
4) Booster
M1RPU Remote Pump Unit 2.00 4
M2RPU Remote Pump Unit 3.00 4
RGU Remote Gain Unit 0.50 -
LAC Line Attenuation Compensator 1.10 2
Semi-height Optical Group Mux/DeMux

SOGMD 0.60 1
Board
Semi-height Optical Group Mux/DeMux

SOGMDB 0.50 1
Board(Type B)
Smart Optical Group Mux/DeMUX Board

SOGMDC 0.60 1
(Type C)
Semi-height Optical Adding/Dropping

SOAD4 0.60 1
Board of 4 Wavelength
Smart Optical Adding/Dropping Board of 4

SOADC4 0.60 1
Wavelength (Type C)
OMU Optical Multiplexing Unit 1.60 2/4/8
ODU Optical De-Multiplexing Unit 1.60 4/8
ODUB Optical De-Multiplexing Unit(B Type) 1.60 4/8
OCI Optical Channel Interleaver(M1) 1.95 4
OCI Optical Channel Interleaver(M2) 1.95 1
VMUX Variable Insertion Loss Multiplexer 2.10 4
VMUXB Variable Insertion Loss Multiplexer(B Type) 2.10 4
PDU/PDUB Power Distribution Unit 1.40 2
WBU Wavelength Blocking Unit 2.60 4
WSU Wavelength Selective Unit 2.60 4
WSUB Wavelength Selective Switch Unit (Type B) 3.00 4
Wavelength Selective Switch Unit (Type B)

WSUBT20D 4.00 4
with twin port 20 & loopback port
MSU Multicast Switching Unit 3.3 6

Slot
Weight
(kg)
ion
Enhanced Optical Channel

EOPM1 0.96 2
Performance Monitor(one channel)

EOPM4 1.3 2
Performance Monitor(four channel)

EOPM8 1.35 2
Performance Monitor(8 channel)
Optical performance monitoring board(type

EOPM4 (C) 1.3 2
C)(4 channel)

EOPM4 (MS) 1.3 2
MS)(4 channel)
OFM Optical Fiber Monitor 1.48 4
OFMF Optical Fiber Monitor Filter 0.96 2
EOFM Enhance Optical Fiber Monitor 1.5 4
EOFMF Enhance Optical Fiber Monitor Filter 0.96 2
SOFM Smart Optical Fiber Monitor 0.7 1
SOFMF Smart Optical Fiber Monitor Filter 0.7 1
Enhanced Optical Wavelength Monitor

EOWM 0.9 2
Board
DCU Dispersion Compensation Board 0.55 -
9.12.2 Power Supply Indices
The Power supply of ZXONE 9700 system is shown in Table 9-102.
Table 9-102 The power supply of ZXONE 9700
Standard working
-48V DC /-60V DC
voltage
Working voltage range -60V DC~-38V DC/-72V DC~-50V DC
2459W (S1)
Power consumption for full
4962W (S2)
configuration
7518W (S3)

Standard working
-48V DC /-60V DC
voltage
14708W (S6)
1071W (DX41)
1071W (NX41)
50A (transmission sub-rack)

50A (distributed cross-connect sub-rack)
63A (Universal Switch Sub-rack(S1)
Rated current
63A×3 (Universal Switch Sub-rack(S2)
The board power consumption of ZXONE 9700 is shown in Table 9-103
Table 9-103 board power consumption of ZXONE 9700 equipment
Unit Name Max. power

consumption
Board in normal
temperature
(25C) (W)
Enhanced optical Transponder Unit 10G B
EOTU10GB 28
Type
EOTU10GB(regene Enhanced optical Transponder Unit 10G B

21
rator) Type
M1TD2C Transponder of 2 ports 10Gb/s 25
M3TD2C Transponder of 2 ports 10Gb/s 32
TS2C Transponder of 1 ports 10Gb/s 18

Transponder of 1 port at 10 Gbit/s with
TS2CP 26
OCH 1+1
TS2CGA Regenerator of 2 ports at 10 Gbit/s 18
M1MQA2 Muxponder of 4 ports any rate to OTU2 38
M1MJA Muxponder of 6 ports any rate to main board 34


consumption
Board in normal
temperature
(25C) (W)
M2MJA Muxponder of 6 ports any rate to main board 37
MHE1 Muxponder of 16 ports E1 （N Port）to 2*OTU1 28
MOM2 Eight GE/FC Muxponder 52
Muxponder of 8 ports any rate to 2*OTU2

MOM2B 41
(type B)
TST3(DPSK/DQPS
40G optical transfer unit with FEC/AFEC 90
K)
TST3(PM-QPSK) 40G optical transfer unit 110
TST3 (regenerator) 40G optical transfer unit with FEC/AFEC 79
MQT3(DPSK/DQP
Four 10G SubRate Mux Board 120
SK)
MQT3(PM-QPSK) Four 10G SubRate Mux Board 140

TS4(M3) 110
Transport Board

TS4(M3)(REG) 95
Transport Board

TS4(M4) 110
Transport Board

TS4(M4)(REG) 93
Transport Board(REG)

TS4(M5) 96
Transport Board

TS4(M5)(REG) 90
Transport Board(REG)
TD4 Optical Transponder Unit for 2*100Gb/s 195
MQ4/S Four 100G SubRate Mux Board 270
MQ4/D Four 100G SubRate Mux Board 270
MX2(6 slots) Ten 10G SubRate Mux Board 175
MX2(4 slots) Ten 10G SubRate Mux Board 96
MX2(4 slots)(No Ten 10G SubRate Mux Board 86


consumption
Board in normal
temperature
(25C) (W)
SFP++)
ASMB Aggregation Switch Muxponder (Type B) 80
Muxponder of 8 ports of GE/10GE with L2

SOG2 56.4
Switch to OTU2
Client side board with 4 ports:OTU1 and below

C1Kx4 76
OTU1 level, Type K
Client side board with 8 ports:OTU1 and below

C1Kx8 79
OTU1 level, Type K

C1Kx16 80
Client side board with 4 ports:OTU2 level, Type

C2Kx4 80
K

C2Kx8 85
K

C2Kx10 87
Type K

C2Kx12 90
Type K

C2Kx20(with SFP+) 140
Type K
Client side board with single port:OTU3 level,

C3Kx1 91
Type K
Client side board with double ports:OTU3 level,

C3Kx2 99
Type K
Client side board with single port:OTU4 level,

C4Kx1 104
Type K
Client side board with double ports:OTU4 level,

C4Kx2 138
Type K

C4Lx4 198
L
PGEKx12(N-SFP) 12 ports GE Line Card, type K 190


consumption
Board in normal
temperature
(25C) (W)
PXGKx12(N-SFP+
12 ports XGE Line Card, type K 202
+)
PXLGK 1 port 40GE Line Card, type K 202
PCGK(N-CFP) 1 port 100GE Line Card, type K 190
20 ports GE/10GE client side L2 switch board,

E2Kx20 150
type K
2 ports 100GE client side L2 switch board, type

E4Kx2 240
K
Line side board with 4 ports:OTU2 level, Type

L2Kx4 85
K

L2Kx8 95
K

L2Kx10 101
K

L2Kx12 108
K

L4Kx1 127
Type K

L4Kx2 180
K

L4Kx4 210
K

M2L4Lx1 118
Type L

M3L4Lx1 90
Type L

L4Lx2 200
L
Line side board with 2 ports:OTUC2/OTUC4

LB4Kx1/2 216
level, Type K
LB4Kx1/1 Line side board with single 216


consumption
Board in normal
temperature
(25C) (W)
port:OTUC4/OTUC2 level, Type K
Line side board with single port:OTUC2/OTU4

LB2L x1 186
level, Type L
Line side board with 1 hybrid port:1*OTU4

H4K(N-CFP) 200
level, Type K
3(TFF)/13.2(A
OMU OM board TFF/AWG
WG)
3(TFF)/13.2(A
ODU OD board TFF/AWG
WG)
Optical De-Multiplexing Unit

ODUB 38
(B Type)
VMUX Variable insertion loss Multiplexer 30
VMUXB Variable Insertion Loss Multiplexer (B Type) 30
OCI Optical Channel Interleaver(M1) 3
OCI Optical Channel Interleaver(M2) 3
OBM Optical broadband multiplexer 3
Semi-height Optical Add/ Drop Board of 4

SOAD4 5
Wavelength
Smart Optical Adding/Dropping Board of 4

SOADC4 7.26
Wavelength (Type C)
Semi-height Optical Group Mux/DeMux Board

SOGMDB 5
(Type B)
Smart Optical Group Mux/DeMux Board (Type
SOGMDC 7.26
C)
WBU Wavelength Blocking Unit 15
WSU Wavelength Blocking Unit 15
WSUB Wavelength Selective Switch Unit (Type B) 28
Wavelength Selective Switch Unit (Type B) with

WSUBT20D 28
twin port 20 & loopback port
MSU Multicast Switching Unit 48.5


consumption
Board in normal
temperature
(25C) (W)
PDU/PDUB Power Distribution Unit 3
SSDM supervisory add/drop multiplexer board 4
SEOBA Enhanced Optical Booster Amplifier 14
SOBA Smart Optical Booster Amplifier 11.52
Enhanced Optical power amplifier 30

(EOBAH24/24)
EOBAH
Enhanced Optical power amplifier 40
(EOBAH27/26)
SEOPA Smart Optical Pre-Amplifier 11
SOPA Enhanced Optical Pre-Amplifier 11.52
EONA(M1) Enhanced Optical Node Amplifier(M1) 25
EONA(M2) Enhanced Optical Node Amplifier(M2) 19.2
HNA Hybrid node Amplifier 50
EONAH Enhanced Optical node amplifier 40
M1RPU Remote Pump Unit 45
M2RPU Remote Pump Unit 29
RGU Remote Gain Unit -
M1DRA_P Distributed Raman Amplifier-Pre 35
M1DRA_B Distributed Raman Amplifier Booster 35
M1DRA_P(H14) High Power Distributed Raman Amplifier-Pre 40
High Power Distributed Raman Amplifier

M1DRA_B(H14) 40
Booster
M2DRA_P Distributed Raman Amplifier-Pre 27
M2DRA_B Distributed Raman Amplifier Booster 27
M2DRA_P(H14) High Power Distributed Raman Amplifier-Pre 35
High Power Distributed Raman Amplifier

M2DRA_B(H14) 35
Booster
LACT Line attenuation control board (terminal) 3
LACG Line attenuation control board (generator) 3


consumption
Board in normal
temperature
(25C) (W)
SOP Optical protection board 5

EOPM1 10
Performance Monitor(one channel)

EOPM4 6
Performance Monitor(four channel)

EOPM8 5.2
Performance Monitor(8 channel)

EOPM4 (C) 15
C)(4 channel)

EOPM4 (MS) 15
MS)(4 channel)
OFM Optical Fiber Monitor 12
OFMF Optical Fiber Monitor Filter 6
EOFM Enhance Optical Fiber Monitor 18
EOFMF Enhance Optical Fiber Monitor Filter 6.3
SOFM Smart Optical Fiber Monitor 23.2
SOFMF Smart Optical Fiber Monitor Filter 7
EOWM Enhanced Optical Wavelength Monitor Board 10
Optical supervision channel board for Fast

SOSCB 18
Ethernet
SNP Net control processor 10
NCPK Node Control Processor(type K) 65
CCPK Cabinet Control Processor(type K) 65
SCC Communication Control Board 10
CCP Subrack Management Board 18
TIS Time interface supply board 15
EIC EIC Extended Interface (type C) 15
SAIK System Auxiliary Interface，(type K) 65
PWE Power Supply Board (type E) 10


consumption
Board in normal
temperature
(25C) (W)
PWRK Power Supply Board (type K) 10
PWRL Power Supply Board (type L) 11
FCC(With Service) Fan Board(type C) 243
FCC (Without Fan Board(type C)

28.8
Service)
FCPL Fan Control Processor(type L) 46
FCPM Fan Control Processor(type M) 35
FCPN Fan Control Processor(type N) 52
M1PSK Packet Switch Board，(type K) 89
PSV Packet Switch (type V) 350
9.12.3 Heat Dissipation
P=UI
Heat dissipation (W)= power consumption(W)*0.82
Heat dissipation (BTU/hour) =Power consumption (W)*0.82*3.413
9.13 Grounding Requirements
9.13.1 Internal grounding requirements of the equipment
 The boards and shielding boards are reliably contacted with the equipment shell via
the panel; there is no electrical connection inside the boards.
 The rack and sub-rack shell are connected with the protective ground.

9.13.2 Grounding requirements of equipment room
 AC working ground resistance ≤4Ω
 DC working ground resistance ≤4Ω
 Safe protective ground resistance ≤4Ω
 Lightening protection ground resistance ≤4Ω
 Joint ground resistance ≤1Ω
 If the equipment room provides working ground and protective ground separately,
the working ground and protective ground should be connected to corresponding
grounding copper bars; if the equipment only provides one grounding copper bar,
the working ground and protective ground can be grounded jointly. The ground
resistance should meet the above requirements.
9.14 Temperature and Humidity Requirements
Table 9-104 Temperature and humidity requirements of ZXONE 9700 Equipment
Item Specification
Long-term working
0℃~+45℃
specification
Ambient temperature
Short-term working
-5℃~+55℃
specification
Long-term working
5%~90%
specification
Relative humidity (35℃)
Short-term working
5%~95%
specification

Note: In a normal operating environment, the temperature and humidity should be measured on the point 1.5m above
the floor and 0.4m before the equipment. The short-term operating condition refers to the case in which non-stop
operations are no more than 96 hours, or 15 days in total annually.
9.15 Requirements for Cleanness
The equipment room should be free of explosive, conductive, magnetic conductive and
corrosive dusts.
The concentrations of mechanical active substances should comply with the

requirements in Table 9-105
Table 9-105 Requirements for concentrations of mechanical active substances
Mechanical active
Content
substance
5
Dust particles ≤3×10 particles/m3
3
Floating dust ≤0.2 mg/m
2
Settling dust ≤15mg/m ·h
3
Sand ≤100mg/m
The concentrations of chemical active substances should comply with the requirements
in Table 9-106:
Table 9-106 Requirements for concentrations of chemical active substances
Chemical active
Content
substance
3
SO2 ≤0.30 mg/m
3
H2S ≤0.10 mg/m
3
NO2 ≤0.50 mg/m
3
NH3 ≤3.00 mg/m
3
Cl2 ≤0.10 mg/m
3
HCl ≤0.10 mg/m
3
HF ≤0.01 mg/m

Chemical active
Content
substance
3
O3 ≤0.05 mg/m
3
NOX ≤0.5 mg/m
9.16 Dust-Proof and Corrosion-Proof Requirements
According to GB4798 and application scope of ZXONE 9700 products, the dust-proof
and corrosion-proof requirements are as follows:
 Storage condition: 1K5/1Z1/1B2/1C2/1S3/1M3, the storage duration is 180 days.
 Transportation condition: 2K4P/2B2/2C2/2S3/2M3, the transportation duration is 30

days.
 Usage condition: 3K5/3Z2/3Z7/3B2/3C2/3S2/3M3, the usage duration is 20 years.

10 Compliant Standards
Recommendation
Description
and standard
ITU-T G.652 Characteristics of a single-mode optical fiber and optical cable
ITU-T G.653 Characteristics of Dispersion-Shifted Single-Mode Fiber
Characteristics of Non-Zero Dispersion-Shifted Single-Mode

ITU-T G.655
Fibers
Definition and test methods for the relevant generic

ITU-T G.661
parameters of optical fibre amplifiers
Generic characteristics of optical fiber amplifier devices and

ITU-T G.662
sub-systems
Application related aspects of optical fibre amplifier devices

ITU-T G.663
and sub-systems
Optical safety procedures and requirements for optical

ITU-T G.664
transport systems
Definitions and Test Methods for Generic Characteristics of

ITU-T G.665
Raman Amplifiers and Raman Amplified Subsystems
Transmission characteristics of optical components and subs

ITU-T G.671
ystems
Functional characteristics of interoffice and long-haul line

ITU-T G.681
systems using optical amplifiers, including optical multiplexing
Amplified multichannel DWDM applications with single

ITU-T G.698.2
channel optical interfaces
Optical interfaces for single channel STM-64 and other SDH

ITU-T G.691
systems with optical amplifiers
Optical interfaces for multichannel systems with optical

ITU-T G.692
amplifiers
ITU-T G.693 Optical interfaces for intra-office systems
ITU-T G.694.1 Spectral grids for WDM applications: DWDM frequency grid
ITU-T G.696.1 Intra-Domain DWDM applications
ITU-T G.697 Optical monitoring for DWDM systems
ITU-T G.702 Digital hierarchy bit rates
Physical/electrical characteristic of hierarchical digital

ITU-T G.703
interfaces

Recommendation
Description
and standard
Synchronous frame structures used at 1544,6312,2048,8448

ITU-T G.704
and 44736 kbit/s hierarchical levels
Network node interface for the synchronous digital hierarchy

ITU-T G.707
(SDH)
ITU-T G.709 Interfaces for the Optical Transport Network
ITU-T G.709-2003 Optical Transport Network (OTN) Interfaces
ITU G.781 Synchronization Layer Functions
Characteristics of synchronous digital hierarchy (SDH)

ITU-T G.783
equipment functional blocks
Characteristics of optical transport network hierarchy

ITU-T G.798
equipment functional blocks
Architecture of transport networks based on the synchronous

ITU-T G.803
digital hierarchy
Generic protection switching - linear trail and subnetwork

ITU-T G.808.1
protection
ITU-T G.811 Timing characteristics of primary reference clocks
Error performance parameters and objectives for

ITU-T G.8201 multi-operator international paths within the Optical Transport
Network (OTN)
The control of jitter and wander within digital networks which

ITU-T G.823
are based on the 2048 kbit/s hierarchy
The control of jitter and wander within digital networks which

ITU-T G.825
are based on the synchronous digital hierarchy (SDH)
The control of jitter and wander within the optical transport

ITU-T G.8251
network (OTN)
Error performance parameters and indexes for international,

ITU-T G.826
constant bit rate digital paths at or above the primary group
Optical input jitter and wander control based on the

ITU-T G.828
synchronous digital hierarchy (SDH)
Types and characteristics of SDH network protection

ITU-T G.841
architectures
ITU-T G.842 Interworking of SDH network protection architectures
ITU-T G.871 Framework for optical transport network Recommendations

Recommendation
Description
and standard
ITU-T G.872 Architecture of optical transport networks
The APS protocol and protection switching operation for the

ITU-T G.873.1 linear protection schemes for the Optical Transport Network at
the Optical Channel Data Unit (ODUk) level
Management aspects of the Optical Transport Network

ITU-T G.874 Element containing transport functions of one or more of the
layer networks of the optical transport network.
Optical interfaces of equipments and systems relating to the

ITU-T G.957
synchronous digital hierarchy
Digital line systems based on the synchronous digital

ITU-T G.958 hierarchy for use on optical fibre cables (study group xv) 28
pp
Physical layer inter-domain interface (IrDI) specifications for

ITU-T G.959.1 optical networks which may employ wavelength division
multiplexing (WDM)
ITU-T G.975 Forward error correction for submarine systems
Forward error correction for high bit rate DWDM submarine

ITU-T G.975.1
systems
ITU-T Q.812 Upper layer protocol profiles for the Q and X interfaces
International multi-operator paths,sections and transmission

ITU-T M2120
systems fault detection and localization procedures
T-REC-G.8262 Timing and synchronization aspects in packet networks
Technical requirements of WDM terminal

T-REC-G.8261
equipment ――16×10Gb/s, 32×10Gb/s part
Technical requirements of WDM terminal

YD/T 1273-2003
equipment ――16×10Gb/s, 32×10Gb/s part
Technical requirements of WDM system ――160×10Gb/s,

YD/T 1274-2003
80×10Gb/s part
YD/T 1159-2001 WDM system test methods
Synchronous Optical Network (SONET) - Basic Description

ANSI T1.105
including Multiplex Structure, Rates, and Formats
ANSI X3.296 SBCON (ESCON): FICON
ANSI X3.230 Fiber channel - physical and signaling interface (FC-PH)
ANSI X3.303 Fiber Channel 3rd Generation Physical Interface (FC-PH3)

Recommendation
Description
and standard
Carrier sense multiple access with collision detection

IEEE Std 802.3
(CSMA/CD) access method and physical layer specification
RFC RFC 2328 OSPF V2.0
RFC RFC 1661 Point-to-Point Protocol
RFC RFC 1990 PPP Multilink Protocol
RFC RFC 2686 Multi-Class Extension to Multi-Link PPP
RFC RFC 3916 PWE3 requirements
RFC RFC 3965 PWE3 structure
RFC 4026 Provider Provisioned Virtual Private Network

RFC
(VPN) Terminology
RFC RFC 4446 IANA Allocations for PWE3
RFC RFC 4553 Structure-Agnostic TDM over Packet
RFC RFC 4664 L2VPN structure
RFC RFC 4665 L2VPN requirements
RFC RFC 4717 Encapsulation for ATM over MPLS
RFC RFC 4816 ATM Transparent Cell Transport Service
RFC 5086 Structure-aware TDM Circuit Emulation Service

RFC
over Packet Switched Network (CESoPSN)
RFC 5654 MPLS-TP needs
RFC 5860 MPLS-TP OAM needs
RFC 5921 MPLS-TP framework
RFC 5960 MPLS-TP data plane framework
Definition of the Differentiated Services Field (DS Field) in the

RFC 2474
IPv4 and IPv6 Headers
RFC 2475 An Architecture for Differentiated Services
RFC 2597 Assured Forwarding PHB group
Definition of Differentiated Services Per Domain Behaviors

RFC 3086
and Rules for their Specification
RFC 3246 An Expedited Forwarding PHB (Per-Hop Behavior)
Supplemental Information for the New Definition of the EF

RFC 3247
PHB (Expedited Forwarding Per-Hop Behavior)
RFC 3260 New Terminology and Clarifications for Diffserv

Recommendation
Description
and standard
Draft Draft-bhh-mpls-tp-oam-y1731-04
EMC Standard
Electromagnetic compatibility (EMC)- Part 4-2:Testing and

EN 61000-4-2 measurement techniques - Electrostatic discharge immunity
test
Electromagnetic compatibility (EMC) - Part 4-3: Testing and

EN 61000-4-3 measurement techniques. Radiated, radio-frequency,
electromagnetic field immunity test
Electromagnetic compatibility (EMC) - Part 4-4: Testing and

EN 61000-4-4 measurement techniques. Electrical fast transient/burst
immunity test.
Electromagnetic compatibility (EMC) -Part 4-5: Testing and

EN 61000-4-5
measurement techniques. Surge immunity test
Electromagnetic compatibility (EMC)-Part 4-6: Testing and

EN 61000-4-6 measurement techniques. Immunity to conducted
disturbances, induced by radio-frequency fields
Electromagnetic compatibility (EMC) -Part 4-11. Testing and

EN 61000-4-11 measurement techniques. Voltage dips, short interruptions
and voltage variations immunity tests
Electromagnetic compatibility (EMC)- Part4-29: Testing and

EN 61000-4-29 measurement techniques-Voltage dips, shot interruptions and
voltage variations on d.c. input power port immunity tests
Electromagnetic compatibility and Radio spectrum Matters

EN 300 386 (ERM) Telecommunication network equipment;
Electromagnetic Compatibility (EMC) requirements
Environmental Engineering (EE) Earthling and bonding

EN 300 253
configuration inside telecommunications centers
FCC PART 15 FCC PART 15
Electromagnetic Compatibility and Electrical Safety - Generic

GR-1089-CORE
Criteria for Network Telecommunications Equipment
Information technology equipment-Radio disturbance

EN 55022
characteristics-Limits and methods of measurement
Electromagnetic compatibility. Generic immunity

EN 50082-2
standard——Part 2:Industrial environment
EN 55024 Information technology equipment. Immunity characteristics.

Recommendation
Description
and standard
Limits and methods of measurement
Resistibility of telecommunication equipment installed in a

ITU-T K.20
telecommunications centre to over voltages and overcorrects
Resistibility tests for telecommunication equipment exposed

ITU-T K.44
to overvoltage and over currents – Basic Recommendation
Safety Standard
IEC 60950-1(EN Information technology equipment - Safety - Part 1: General

60950) requirements
Safety of laser products-Part 1: Equipment classification,

IEC 60825-1
requirements and user’s guide
Safety of laser products-Part2: Safety of optical fiber

IEC 60825-2
communication systems(OFCS)
FDA 21CFR
FDA 21CFR PART1040.10-laser products
PART1040.10
Directive 2002/95/EC of the European Parliament and of the

RoHS Council on the restriction of the use of hazardous substances
in electrical and electronic equipment
Directive 2002/96/EC of the European Parliament and of the

WEEE
Council on waste of electrical and electronic equipment
Information technology equipment-Safety-Part1:General

GB 4943
requirements
2014/35/EU Low Voltage Directive
CSA C22.2.60950 Safety Of Information Technology Equipment
Environmental standard
Environmental Engineering (EE) Environmental conditions

EN 300 019-1 and environmental tests for telecommunications equipment
Classification of environmental conditions
Environmental Engineering (EE) Environmental conditions

EN 300 019-2 and environmental tests for telecommunications equipment
Specification of environmental tests
Equipment Engineering (EE) Acoustic noise emitted by

EN 300 753
telecommunications equipment
GR-63-CORE NEBS™ Requirements: Physical Protection

Recommendation
Description
and standard
IEC 60529 Degrees of protection provided by enclosures (IP Code)
IEC 60068-1 Environmental testing Part 1: General and guidance
IEC 60068-2 Basic environmental testing procedures Part 2: Tests
Classification of environmental conditions. Part 1:

IEC 60721-1
Environmental parameters and their severities
Classification of environmental conditions. Part 2:

IEC 60721-2
Environmental conditions appearing in nature
Electrical and electronic product environmental test, Part 2:

GB/T 2423.2
test methods, Test B: high temperature

GB/T 2423.22
test methods, Test N: temperature change

GB/T 2423.9 test methods, Test Cb: constant humidity and temperature
used by equipment

GB/T 2423.10
test methods, Test Fc and principle: vibration (sine)

GB/T 2423.11 test methods, Test Fd: broad frequency band random
vibration —— general requirement
Environmental engineering ee: European telecommunication

ETS 300 119
standard for equipment practice
Power Supply Standard

Equipment Engineering (EE);Power supply interface at the
input to telecommunications equipment; Part 1: Operated by
EN 300 132-1
alternating current (ac) derived from direct current (dc)
sources
Equipment Engineering (EE): Power supply interface at the

EN 300 132-2 input to telecommunications equipment Part 2: Operated by
direct current (dc)
Telecommunication Building Standard
Bonding Configurations and Earthling Inside a

ITU-T K.27
Telecommunication Building
Information technology -Cabling installation - Part 1

EN 50174-1
Installation specification and quality assurance

Recommendation
Description
and standard
Information technology — Cabling installation — Part 2

EN 50174-2
Installation planning and practices inside buildings
Application of equipotential bonding and earthing in buildings

EN 50310
with information technology equipment
Enviromental engineering ee ; earthing and bonding

ETS 300 253
configuration inside telecommunications centres v2.1.1
Others

GB/T 2423.1-2001
test methods, Test A: low temperature
GB/T 17618-1998 IT equipment immunity limit and test method
GB 9254-1998 IT equipment radio interference limit and test method
Safety of laser products, Part 1: Equipment classification,

GB 7247.1-2001
requirement and user guide
Safety of laser products, check list of producer about laser

GB/Z 18461-2001
radiation safety

11 Abbreviations
Abbreviation Full name
ADM Add/Drop Multiplexer
AFEC Advanced FEC
AIS Alarm Indication Signal
APO Auto Power Optimization
APR Automatic Power Reduction
APS Automatic Protection Switching
APSD Automatic Power Shutdown
ASE Amplified Spontaneous Emission
ATM Asynchronous Transfer Mode
AWG Array Waveguide Grating
BEI Backward Error Indication
BER Bit Error Ratio
BIAE Backward Incoming Alignment Error
BDI Backward Defect Indication
BIP-X Bit Interleaved Parity of depth X
CMI Code Mark Inversion
CWDM Coarse Wavelength Division Multiplexing
DRA Distributed Raman Amplifier
DCM Dispersion Compensation Module
DFB-LD Distributed Feedback Laser Diode
DWDM Dense Wavelength Division Multiplexing
DVB Digital Video Broadcasting
EA Electrical Absorption
EDFA Erbium Doped Fiber Amplifier
EFEC Enhanced FEC
ESCON Enterprise System Connection
EXP Experimental
FAS Frame Alignment Signal
FC Fiber Channel
FEC Forward Error Correction

FICON Fiber Connection
FOADM Fixed Optical Add/Drop Multiplexer
FTFL Fault Type and Fault Location
FWM Four Wave Mixing
GCC General Communication Channel
GE Gigabit Ethernet
GUI Graphical User Interfaces
IAE Incoming Alignment Error
IP Internet Protocol
IWF Integrated Wavelength Feedback
LA Line Amplifier
LCK Locked
LD Laser Diode
LOF Loss of Frame
LOS Loss of Signal
MCU Micro Control Unit
MFAS MultiFrame Alignment Signal
MQW Multiple Quantum Well
MSP Multiplex Section Protection
M-Z Mach-Zehnder
NE Network Element
NRZ Non Return to Zero
OAC Optical Access
OADM Optical Add/Drop Multiplexer
OBA Optical Booster Amplifier
OCH Optical Channel
OCI Open Connection Indication
ODF Optical Distribution Frame
OD Optical Demultiplexer
ODU Optical Channel Data Unit
OLA Optical Line Amplifier

OM Optical Multiplexer
OMS Optical Multiplex Section
OPA Optical PreAmplifier
OPU Optical Channel Payload Unit
ORL Optical Return Loss
OSC Optical Supervision Channel
OSCF Optical Supervision Channel for Fast Ethernet
OSNR Optical Signal-Noise Ratio
OTM Optical Terminal Multiplexer
OTN Optical Transport Network
OTS Optical Transmission Section
OTU Optical Transponder Unit
OTU Optical Channel Transport Unit
PA PreAmplifier
PCC Protection Communication Channel
PDFA Praseodymium Doped Fiber Amplifier
PDL Polarization Dependent Loss
PM Path Monitoring
PMD Polarization Mode Dispersion
POS Packet Over SDH
PSI Payload Structure Identifier
PT Payload Type
RES Reserved for Future International Standardization
ROADM Reconfigurable Optical Add/Drop Multiplexer
RPOA Remotely Pumped Optical Amplifier
RZ Return to Zero
SBA Stimulated Brillouin Amplifier
SDH Synchronous Digital Hierarchy
SDM Supervisory Division Multiplexing Board
SFP Small Form Factor Pluggable
SM Section Monitoring

SONET Synchronous Optical Network
SRS Stimulated Raman Scattering
STM-N Synchronous Transport Module, level N (N=1, 4, 16, 64)
TCM Tandem Connection Monitoring
TCP Transmission Control Protocol
TFF Thin Film Filter
TM Terminal Multiplexer
TMN Telecommunications Management Network
TTI Trail Trace Identifier
VOA Variable Optical Attenuator
VoIP Voice over IP
WDM Wavelength Division Multiplexing

ZXONE 9700 Product Description - 20170821

Загружено:

Сведения о документе

Оригинальное название

Авторское право

Доступные форматы

Поделиться этим документом

Поделиться или встроить документ

Параметры публикации

Этот документ был вам полезен?

Это неприемлемый материал?

Авторское право:

Доступные форматы

ZXONE 9700 Product Description - 20170821

Загружено:

Авторское право:

Доступные форматы

ZXONE 9700 Product

© 2016 ZTE Corporation. All rights reserved.

ZTE Confidential Proprietary 1

ZXONE 9700 Product Description ....................................................................................... 1

3 System Architecture ........................................................................................ 23

4 Hardware Architecture .................................................................................... 28

2 ZTE Confidential Proprietary

4.3.6 Fixed OADM Board ............................................................................................ 54

5 Software structure ........................................................................................... 61

ZTE Confidential Proprietary 3

6.14.1 OMS Layer APO Management........................................................................... 97

8 Software Defined Optical Network (SDON) .................................................. 122

4 ZTE Confidential Proprietary

8.4.3 Multi-layer multi-domain network interworking and coordination....................... 126

9 Technical Specifications ............................................................................... 126

ZTE Confidential Proprietary 5

9.4.3 VMUXB Specifications ..................................................................................... 177

6 ZTE Confidential Proprietary

9.10.11 SOFMF Board Specifications ........................................................................... 220

10 Compliant Standards .................................................................................... 243

11 Abbreviations ................................................................................................ 251

ZTE Confidential Proprietary 7

Figure 1-1 Architecture of ZXONE 9700 equipment ...........................................................15

8 ZTE Confidential Proprietary

Figure 6-8 OMS 1+1 Protection (EDFA in redundant mode) ..............................................92

ZTE Confidential Proprietary 9

Table 2-1 ZXONE 9700 switching capability ......................................................................20

10 ZTE Confidential Proprietary

ZTE Confidential Proprietary 11

12 ZTE Confidential Proprietary

Table 9-47 Technical specifications of the OCI board (100GHz-50GHz) ..........................180

ZTE Confidential Proprietary 13

Table 9-77 Technical specifications of RAMAN_P amplifier .............................................207

14 ZTE Confidential Proprietary

The architecture of ZXONE 9700 equipment is shown as Figure 1-1

Figure 1-1 Architecture of ZXONE 9700 equipment

Drop Unit ADD Unit

Electrical layer L2 Switch

ZTE Confidential Proprietary 15

(Reconfigurable Optical Add/Drop Multiplexer) based on the support for ROADM

16 ZTE Confidential Proprietary

2.1 Large Transmission Capacity

2.2 400Gbit/s system

2.3 100Gbit/s system

Support 80100GE transmission and the capacity of at most 8T.

 PM-QPSK Coherent Rx modulation for ULH transmission

ZTE Confidential Proprietary 17

 Embedded high-speed DSP technology realizes the compensation of dispersion

2.4 40Gbit/s system

Support 8040G transmission and the capacity of at most 3.2T.

 P-DPSK, RZ-DQPSK and PM-QPSK modulation for ULH transmission

18 ZTE Confidential Proprietary

2.5 Advanced Technologies for Super Long Distance

2.6 ROADM Optical Scheduling

2.7 Large-capacity Universal Switching

ZTE Confidential Proprietary 19

 Client-side board or line-side board can be flexibly added or deleted based on

Table 2-1 ZXONE 9700 switching capability

Model Switching Switching Granularity

S1 Switching 4.4T ODU0/1/2/2e/3/4/flex/pac

S2 Switching 9.2T ODU0/1/2/2e/3/4/flex/pac

S3 Switching 7.2T/14.4T ODU0/1/2/2e/3/4/flex/pac