Forschungsschwerpunkt Technologien

der Mikroperipherik

Marking of Electronic Components and Board

Assemblies as RoHS Compatible –
Information in the Supply Chain and Logistics
Irina Stobbe, Otmar Deubzer, Hansjörg Griese, Herbert Reichl

3rd International Conference on Lead-Free Electronics Green Electronics

Barcelona, June 8, 2005 - p 1 Irina Stobbe
 Lead-free Labelling / Material Declaration
„ Labelling itself is NOT a requirement from the RoHS legislative

Why ?
„ Request in a common standard for marking scheme across the industry, i.e. in
a worldwide acceptable solution, which supports the trust in declaration
„ Ease communication within supply chain at minimum costs
„ Supporting manufacturing, repair, service (Life Cycle Enhancement)
„ Supporting material recycling: Announcement of valuable and difficult in
handling materials

Challenges:
Source: Fujitsu-Siemens
„ Label as small as possible, BUT should contain large amount of information
„ Higher production and documentation costs, reading effort
„ Missing comprehensibility for users (uncertainty of how to interpret the labels)

3rd International Conference on Lead-Free Electronics Green Electronics

Barcelona, June 8, 2005 - p 2 Irina Stobbe
Requirements to Labelling/Marking?

Supporting decision making on different levels

Legislative Process- and Material-oriented

Requirements Requirements

WEEE RoHS Logistics/ Trace- Remaining Reco-

EcoDesign compliance Quality ability Lifetime vering

Legis- Supply Recyc-

User Market Service Reuse
lation chain ling

3rd International Conference on Lead-Free Electronics Green Electronics

Barcelona, June 8, 2005 - p 3 Irina Stobbe
 European Legislative
ƒ Directive on Waste Electrical and Electronic Equipment (WEEE) -
Æ Producer Responsibility for Take Back of Used Electronics – and Recycling Rates
Æ Scope: consumer products in 10 categories

Def: Old-old-equipment: no declaration, mostly contains lead

Old equipment: before 2006-07-01 - lead-free declaration for a short time

ƒ Directive on the Restriction of the Use of Certain Hazardous Substances in EEE (RoHS)
Æ Ban on e.g. Lead, Cr(VI), Hg, Cd in Electronics after July 1, 2006
Æ for 8 from 10 categories from WEEE (subject of changes )
Æ Exemptions are possible and subject of changes (defined in ANNEX, reviewed by TAC)

ƒ Directive End of Life of Vehicles (ELV)

Æ Bann on Materials and Recycling, (temporarily) exemption for lead

ƒ Draft Directive on establishing a framework for EcoDesign of Energy Using Products (EuP)
Æ Eco-Design under the umbrella of CE-mark

3rd International Conference on Lead-Free Electronics Green Electronics

Barcelona, June 8, 2005 - p 4 Irina Stobbe
 No Marking Requirement from RoHS Directive

„ -Labelling only, if it is explicitly required by directives. That makes necessary that

conformity assessment methods are defined by EU and available.
„ EU Parliament and Commission have to decide about the commitment requirement

Remain:
„ Marking should provide convenience, trust !
„ Rules and definitions like maximum concentration values (MCV) and explanations
should simplify communication and agreements
„ Markings about non-existence have a temporarily character:
The destination is the restriction of hazardous materials without any exemptions.
„ Different marking systems are possible, because marking has a temporarily
character. Harmonisation is handicapped by different interests of market players
and timelines

3rd International Conference on Lead-Free Electronics Green Electronics

Barcelona, June 8, 2005 - p 5 Irina Stobbe
 Information for convenience and benefit
„ Relevant information in the supply chain
• Status of technology change processes in the supply chain
• Assembly process specification
• Component specification (Terminal finish, Maximum processing
temperature, inner materials, MSL)
• Board specification (other hazardous materials, finishes)

„ Material data - Information for life cycle, for eco-design / Product

improvement processes
• Marketing - Functionality
• Use phase
• Service, Repair, Reuse
• Material recycling (WEEE request)
• Disposal

3rd International Conference on Lead-Free Electronics Green Electronics

Barcelona, June 8, 2005 - p 6 Irina Stobbe
 Various marking schemes on market
examples only

Intertronics (EU)
Schurter ANDUS
ZETEX (EU)
Future electronics

Panasonic Harwin
TechSearch International

AEC
Lattice AAT Aston
Ecliptek C&K components

3rd International Conference on Lead-Free Electronics Green Electronics

Barcelona, June 8, 2005 - p 7 Irina Stobbe
 Marking schemes : more brand than standard
examples only
Lead-free marking:

Bourns
Supertex Fairchild

Lattice

Nu visions
Matrix USA
Label IDent

RoHS marking:

Micro semiconductor
Schurter
NIC Components Phoenix Contact

3rd International Conference on Lead-Free Electronics Green Electronics

Barcelona, June 8, 2005 - p 8 Irina Stobbe
Technologies for Labelling on Boards

Bar code
Printed with branding
Printed
Etched in the copper layer

Printed label, glued

2D data
matric code
laser etched

3rd International Conference on Lead-Free Electronics Green Electronics

Barcelona, June 8, 2005 - p 9 Irina Stobbe
 Standards and Technical reports – Inter-regional process

„ JEDEC Standard JESD97, May 2004: Marking, Symbols, and Labels for
Identification of Lead (Pb) Free Assemblies, Components, and Devices
„ IPC-1066, June 2004: Marking, Symbols and Labels for Identification of
Lead-Free and Other Reportable Materials in Lead-Free Assemblies,
Components and Devices
„ JEITA ETR-7021, June 2004; Guidance for the lead-Free Marking of
Materials, Components and Mounted Boards used in Electronic and
Electric Equipment
„ JEITA ET-7001 (Draft 2005) : The marking for presence and non-presence
of the specified chemical substances in materials, components and
NEW mounted boards used in electrical and electronic equipment
„ EIAJ EDR-7605 (JEITA), Technical Report : Marking guideline of packing
for lead-free semiconductor device (only)

„ Soldertec- and EFSOT- Questioners, proposals

„ many enterprise specific rules and roadmaps / request in labelling
if compatibility with RoHS and other legal or if lead in it.
„ IPC-1066 and JEITA ET-7001 now as IEC proposals for world wide
standardisation
3rd International Conference on Lead-Free Electronics Green Electronics
Barcelona, June 8, 2005 - p 16 Irina Stobbe
 JEITA - Approach

„ ETR-7021 (2004): Levels of lead-free are defined as phase timeline for

reach that
(for components and boards)
Phase 1: contains lead, but lead-free processable
Phase 2: Lead-free solder systems and terminations
Phase 3A: No lead in materials at all
(only RoHS exemptions are allowed)
Phase 3: lead-free in all components, solder joints and
finishing materials
„ ET-7001 (2005): Presence and non-presence, all RoHS materials, NEW
no phases !
„ Materials will be described by their chemical symbol (Pb, Hg, CrVI, Cd,...),
alloys by the substances contained or by shortened composition symbols

3rd International Conference on Lead-Free Electronics Green Electronics

Barcelona, June 8, 2005 - p 21 Irina Stobbe
 Comparison of Standards or Guidelines (1)
Category Soldertec/BeCAP JEITA ET-7001 IPC-1066 / JESD97
Lead-free, Mercury-free, … Non-presence means substance < 0,1 (0,01) Pb-free means Pb < 0,1wt% in raw
Tolerance up to maximum concentration wt% in the uniform substance or uniform materials, reference to RoHS,
material process ready,
Limitation value (MCV) < 0,1 (0,01) wt% in
homogeneous material

Exemptions Annex1, Scope Art. 2 (1) Like RoHS without data Without reference
Phase 1 - LF processable No more phases, only -
Lead-free Phases Phase 2 - LF terminals and solder presence or non-presence - 2nd level interconnect
Phase 3 Æ 3A - RoHS compliance of a (RoHS) substance from Annex I -
Phase 4 Æ 3 - LF at all - Totally Pb-free

SnAgCu ÅÆ A40C5 SnAgCu ÅÆ A40C5 Solder symbol (e1, e2,..) for solder classes
SnZnBi ÅÆ Z80B30 SnZnBi ÅÆ Z80B30 e1 - SnAgCu
e2 - other SnX, no Bi, no Zn
Solder Material It displays at the main unit and the wrapping e3 - Sn
(see IEC 61190-1-3 or ISO 9453)
e4 - preplated(Ag, Au, NiPd, NiPdAu)
material under the presence/non-presence sign
e5 - SnZn, SnZnX, no Bi
e6 - Bi
e7 - low temp. Solder (only JESD97)
Lead-free per order presumed Lead free presumed Pb free presumed
Board – IPC : HF =
Substrate Halogen free

3rd International Conference on Lead-Free Electronics Green Electronics

Barcelona, June 8, 2005 - p 27 Irina Stobbe
 Comparison of Standards or Guidelines (2)
Category Soldertec/BeCAP JEITA ET-7001 IPC-1066 / JESD97
Phase 2 no more Solder symbol
required Lead presence: [[Pb]] or Pb
Phase 3A 2nd l. i. label or barcode

Component
Non-presence: [[G]] or G
Plus solder
exemptions to be marked :
characteristic A30C5
Hg: #1 … #4
Pb: #5 … #7
Cd: #8
Cr(VI): #9
#7-2006
>>#7-2006<< or Presence of other materials from Annex 1 Solder symbol
(if year is required) (equivalent to RoHS) 2nd Totally
Assembly
Phase 3 level Pb-free
[[Hg]], [[(PDPE)]], … Hg (PDPE) interc. Label

Recommended: MSL, MST None For components: Maximum safe

Process
temperature (MST)
Parameters

Not required, For solder, terminals and board finishes with For substrates, solder material, conf. finish
Recommended for solder ( z.B. Z80B30) and the chemical formula with categories
Material
Declaration finishes

Changes in exemptions are traceable, Material declaration makes boards easier to Other restrictions like Halogen-free (HF)
support to service recycle, (only IPC) included
Benefits
all RoHS-Materials

3rd International Conference on Lead-Free Electronics Green Electronics

Barcelona, June 8, 2005 - p 28 Irina Stobbe
Requirements to Labelling/Marking?

Supporting decision making on different levels

Legislative Process- and Material-oriented

Requirements Requirements

WEEE RoHS Logistics/ Trace- Remaining Reco-

EcoDesign compliance Quality ability Lifetime vering

Legis- Supply Recyc-

User Market Service Reuse
lation chain ling

3rd International Conference on Lead-Free Electronics Green Electronics

Barcelona, June 8, 2005 - p 30 Irina Stobbe
 High Level Information: Content

„ Product identification, e.g. part and serial number, Supplier code

etc
See: Request in new product identifications numbers for transferred
products in the supply chain logistics
„ Material content information
• refer to IEC DPAS 3/750, 3/2005, Handbook of Material Data
Declaration
• RoHS materials, Halogens (IEC 61249-2-21), conformal coatings (IPC-
CC-830B)
„ Solder process and solder material, Maximum safe temperature,
Moisture sensitivity level (MSL)
„ Thermal stress
„ Reuse – Disassembly – Repair - Recycling information

3rd International Conference on Lead-Free Electronics Green Electronics

Barcelona, June 8, 2005 - p 31 Irina Stobbe
 Material Data Declaration : Requirements
Material data declaration (MDD):
• Negative list e.g. RoHS compliance
• Extended negative list e.g. Joint Industry Guide
• Averaged positive list e.g. Umbrella Specs of ZVEI
• Positive list (Full material data declaration)

Legislation :
no explicit requirement, but the legislations like EuP, RoHS, WEEE, ELV,
etc trigger the implementation of MDD Æ IEC Working group for PAS
Supply Chain :
Customers‘ request for compliance declaration
Design for Environment (DfE):
MDD supports DfE with the existing databases
3rd International Conference on Lead-Free Electronics Green Electronics
Barcelona, June 8, 2005 - p 32 Irina Stobbe
 Environmental Screening Requirements
Material data are required in design phase – for resource consumption,
toxicity assessment and raw material extraction energy calculation
Example screening tool : IZM/EE Toolbox: TPI (Toxic Potential Indicator)
RPI (Recycling Potential Indicator)
ERM (Raw Material extraction energy)

Product tree Environmental screening Product tree

material declaration (PAS) indicators, e.g. environmental screening
„Toxic Potential Indicator“:
Product: Product:
357 g Hazardous Allowable Water 3,160 indicator points
Substances Workplace Pollution
Declarations Concentration Classification
(R-phrases) (MAK) (WGK)
Product Part 1: Product Part 1:
122 g 2,260 indicator points
Projection on Numerical Scale
and
Product Aggregation Product
Sub-Part 1.1: Sub-Part 1.1:
93 g TPI/mass unit 970 indicator points
100
Material A: 12 g Ecological Material Rating
Material A: 820 ind. pts
Material B: 23 g (points per mass unit) Material B: 15 ind. pts
Material D: 3 g 0 Material D: 100 ind. pts
Material E: 49 g Material E: 30 ind. pts
Material F: 1 g Material F: 5 ind. pts
Product Product
Sub-Part 1.2 Sub-Part 1.2
Product Part 2
Environmental Assessment Product Part 2
... ...
3rd International Conference on Lead-Free Electronics Source: Karsten Schischke Green Electronics
Barcelona, June 8, 2005 - p 33 Irina Stobbe
 Traceability
„ Traceability : A process that has the ability to trace the usage and position of a
unit using recorded documents (EN ISO 8402, DIN ISO 9001,2000, 7.5.3)
„ Which component with which charge number is when and in which product for
which job and which costumer is built?

„ Advantages of traceability in the inner supply chain:

• Transparent production process
• Targeted identification of affected assembly
• Reduce cost and time in case of failure

„ Which environmental effect can be reached with traceability:

• Enables material flow management, which can be a part of an
environment management system (EMS) (that means optimization under
environment conditions)
• Waste flow optimisation reduces cost and impact

3rd International Conference on Lead-Free Electronics Green Electronics

Barcelona, June 8, 2005 - p 34 Irina Stobbe
 Labelling levels for more effective knowledge
High Level Labelling:
ƒ labelling, that is not directly visible and understandable
ƒ It needs extra devices and handlings to get the information.
ƒ These kind of labelling provide more than one information.
Place of real information storing is inside or outside of the
product.
Data matrix Life Cycle
Modules
(Memory,
Transponder Transponder)
Reader

Realisation of storing these data:

ƒ Data matrix (outsourcing the data)
ƒ Transponder (RFID) (mostly outsourcing the data)
ƒ LIM (capturing and storing the data)
( Low Level Labelling – single data: yes or no Æ one sign)
3rd International Conference on Lead-Free Electronics Green Electronics
Barcelona, June 8, 2005 - p 35 Irina Stobbe
 Data matrix
„ Data matrix: A very area efficient 2D (two dimensional)
barcode symbology

=
Finder Alternating Data region
pattern pattern

A unique perimeter pattern helps the barcode scanner determine the cell locations.

„ Featuring:
1. Storage of special identification number, non-changeable
2. Access to company (Web-) DATABASE in order to get all
required product information for service or recycling
purposes (outsourced information)
3rd International Conference on Lead-Free Electronics Green Electronics
Barcelona, June 8, 2005 - p 36 Irina Stobbe
 Transponder/RFID
„ RFID: A system meant to provide data that is saved in a transponder
(tag). Generally, RF ID system consists of a tag, an antenna to support
the tag, reader (interrogator) that communicate with the tag through
air interface.

Computer

RFID
Reader Tag

Data
pulse
Energy

„ Featuring:
1. Storage of material contents in transponder memory
2. Data readout by interested party, e.g. service provider, recycler
3. Data modification possible (after service, …)
4. Problem: Too expensive and not sufficient memory to represent all
material-content information Æ information should be outsourced

3rd International Conference on Lead-Free Electronics Green Electronics

Barcelona, June 8, 2005 - p 37 Irina Stobbe
 Using a life cycle information unit (LIU/LIM)
SFB 281- gov. funded project
Life Cycle Units are integrated in (electronic) products :

Design
Reuse
supports &
Recycling

improves
Manufacturing
supports Repair, Refurbishment,
Predictive Maintenance
LIU

recor
&
analy

Test ds
zes

Use
Transportation
3rd International Conference on Lead-Free Electronics Green Electronics
Barcelona, June 8, 2005 - p 38 Irina Stobbe
 Use of provided information (Scenarios I)
„ Recycling processes: Optical recognition of the lead-free
sign and separation of higher graded lead-free PWBs:
Special treatment before the smelting process for higher
recovery rates of precious and other (Sn) metals.
Benefit values not calculated yet.

„ Recycling: calculation of content of goods receipt instead of

measurement (chem. analysis), dismantling rules
Benefit: cost for transponder and memory vs. chem.
Analysis, multiple use for logistics

„ Repair: Knowledge about solder material and finishes Æ

HF / A40C5 / OSP+
working temperature, temperature compatibility of
components
Benefit: quality
3rd International Conference on Lead-Free Electronics Green Electronics
Barcelona, June 8, 2005 - p 39 Irina Stobbe
 Use of provided information (Scenarios II)

„ Service / Reuse: Full material and product

information provide the possibility of reuse and
upgrades including the traceability. Benefit: quality,
time, reuse

DB

3rd International Conference on Lead-Free Electronics Green Electronics

Barcelona, June 8, 2005 - p 40 Irina Stobbe
 EFSOT Material Declaration – outsourcing of information
Project
Example

http://www.efsot-europe.info
International project on new
generation environmental
friendly soldering technologies
3rd International Conference on Lead-Free Electronics Green Electronics
Barcelona, June 8, 2005 - p 41 Irina Stobbe
 EFSOT Material Declaration – outsourced info

„outsourced“
information in
web-based
datasheets

3rd International Conference on Lead-Free Electronics Green Electronics

Barcelona, June 8, 2005 - p 42 Irina Stobbe
 Problem: Data may be not accurate enough to support
eco design on a material basis
Material data variation from different manufacturers vs. USpecs
information spectrum

Tantalum MnO2 Silver TBBA Sb2O3 Fe/Ni Sn

c c
3rd International Conference on Lead-Free Electronics Green Electronics
Barcelona, June 8, 2005 - p 43 Irina Stobbe
 Which data quality suffice …. ?
„ Declaration of RoHS compliance
Æ Negative List of selected materials, traces < 0,1 %
Æ No more information about environmental hotspots

„ Reduction of hazardous material in components

Æ JIG (List A, B, DQ ≅ 2-3 exemplary) ,
Æ Umbrella Specs (Typical values, averaged, DQ ≅ 3-4 exemplary)

„ Application of material based screening tools for EcoDesign

Æ Full material declaration, data quality better than 3 (includes
averaged data)
„ Provide a life cycle analysis
Æ Full Material data, Energy data, utilization data, data quality
better than 4
(Data quality DQ ranges from 1 (bad) to 5 (excellent) in a systematic
SPOLD-alike assessment, can be weighted by mass or by toxicity; work
in process )
3rd International Conference on Lead-Free Electronics Green Electronics
Barcelona, June 8, 2005 - p 44 Irina Stobbe
Summary (1)

„ Lead free labelling depends on

• Definition of „lead-free“ (limit values and unit)
• Lead-free in outer connections or in the inner materials too? (relates
to definition of phase 2 or phase 3)
• RoHS compliance includes exemptions, which could be changed during
the evaluation processes (... and includes five materials more!)
- sign needs explanation
• Suggestion: Mark lead-containing components with lead
and the number and year of RoHS exemption annex Pb
#7-2006
„ Lead-free labelling is only for supply chain logistics
(Floor shops and other), for marketing it is free, what to use;
Declaration of solder system and maximum safe temperature are
useful in service or repair

3rd International Conference on Lead-Free Electronics Green Electronics

Barcelona, June 8, 2005 - p 45 Irina Stobbe
Summary (2)

„ Real challenges in manufacturer management are to organise the

enumeration (P/N) of changed components in all accompanying
documents
• Qualification of processes, layouts, bills of material, customer related
documents, assurance documents….
• Kind of enumeration depends on historic grown old numbers, place
and data technology; Very different on manufacturers
• ISO 9000 and ISO 14000 support the transfer process

„ Environment improvement due to labelling is possible

only if manufacturer organizes traceability and
provides energy or material flow management under
environmental issues

3rd International Conference on Lead-Free Electronics Green Electronics

Barcelona, June 8, 2005 - p 46 Irina Stobbe
 Thanks for your attention ! Questions …?
[[Pb, Hg]]

A30C5

IPC-1066 / JESD97 JEITA ET-7001

#21/2006

Marking of Electronic Components and Board Assemblies as RoHS

Compatible – Information in the Supply Chain and Logistics

Contact:
Irina.Stobbe@TU-Berlin.de
+49 - 30 - 464 03 156
http://www.efsot-europe.info
3rd International Conference on Lead-Free Electronics Green Electronics
Barcelona, June 8, 2005 - p 47 Irina Stobbe