AMERICAN NATIONAL

STANDARD

ANSI/J–STD-003
APRIL 1992

JOINT
INDUSTRY
STANDARD

Solderability Tests
for
Printed Boards

1st WORKING DRAFT

C IND
NI U
O
ST
E L E CT R

R I ES

EST. 1924
A

SO
S

O
C I ATI
Notice EIA and IPC Standards and Publications are designed to serve the public interest
through eliminating misunderstandings between manufacturers and purchasers,
facilitating interchangeability and improvement of products, and assisting the pur-
chaser in selecting and obtaining with minimum delay the proper product for his
particular need. Existence of such Standards and Publications shall not in any
respect preclude any member or nonmember of EIA or IPC from manufacturing or
selling products not conforming to such Standards and Publications, nor shall the
existence of such Standards and Publications preclude their voluntary use by those
other than EIA or IPC members, whether the standard is to be used either domesti-
cally or internationally.
Recommended Standards and Publications are adopted by EIA and IPC without
regard to whether their adoption may involve patents on articles, materials, or pro-
cesses. By such action, EIA and IPC do not assume any liability to any patent
owner, nor do they assume any obligation whatever to parties adopting the Recom-
mended Standard or Publication. Users are also wholly responsible for protecting
themselves against all claims of liabilities for patent infringement.
The material in this joint standard was developed by the EIA Soldering Technology
Committee (STC) and the IPC Soldering/Solderability Specifications Task Group
(5-23a).

APPROVED JUNE 2, 1992 AS AN

AMERICAN NATIONAL
STANDARD
AMERICAN NATIONAL STANDARDS INSTITUTE

For Technical Information Contact:

Electronic Industries Association The Institute for Interconnecting

Engineering Department and Packaging Electronic Circuits
2500 Wilson Boulevard 2215 Sanders Road
Arlington, VA 22201 Northbrook, IL 60646
Phone (703) 907-7500 Phone (847) 509-9700
Fax (703) 907-7501 Fax (847) 509-9798

Please use the Standard Improvement Form shown at the end of this
document.

Copyright © 1996 by the Electronics Industries Association and the Institute for Interconnecting and Packaging Electronic Circuits. All rights
reserved. Published 1996. Printed in the United States of America.
No part of this publication may be reproduced in any form, in an electronic retrieval system or otherwise, without the prior written permission
of the publisher.
JOINT J-STD-003
INDUSTRY
STANDARD
Solderability Tests
for Printed Boards

A joint standard developed by the Joint Soldering/Solderability

Specifications Task Group

Users of this standard are encouraged to participate in the

development of future revisions.

Contact:

EIA IPC
Engineering Department 2215 Sanders Road
2500 Wilson Boulevard Northbrook, IL 60062-6135
Arlington, VA 22201 Phone (847) 509-9700
Phone (703) 907-7500 Fax (847) 509-9798
Fax (703) 907-7501
J-STD-003
Any Standard involving a complex
technology draws material from a
vast number of sources. While the
principle members of the Soldering/
Joining Processes Committee
Chairman
David Schoenthaler
AT&T
Joint Soldering/Solderability Specifications Task Group
L. Abbagnaro, Pace Inc.
F.C. Albers, Unisys Corp.
P.J. Amick, Mc Donnell Douglas
Elec. Sys Co.
J.E. Andrews, Hadco Corp.
F. Anglade, Metronelec
H.R. Armfield, Litton Data Systems
J. Baker, Repco Inc.
G. Bates, Sherwood Medical
A. Beikmohamadi, E I DuPont De
Nemours & Co.
J.G. Bernauer, Unisys Corp.
D.F. Bernier, Kester Solder Division
S.T. Bora, Smiths Industries
C. Bradshaw, Memorex Telex Corp.
C. Brill, AMP Inc.
Dr. J. Brous, Alpha Metals Inc.
S.F. Caci, Raytheon Co.
L.W. Canarr, Rockwell International
T.A. Carroll, Hughes Aircraft Co.
A. Cash, Northrop Corp.
K.C. Chao, Lockheed Missiles &
Space Co.
W.A. Clark, AT&T Bell Laboratories
D. Cotosky, Kester Solder Division
L.A. Crouch,
D. Currie, Teledyne Systems Co.
G. Cushman, Eptac Corporation
G.J. Davy, Westinghouse Electric
Corp.
J.A. DeVore, General Electric Co.
M.D. Dillie, Magnavox
R.J. Edgington, National Standard
Co.
D.A. Elliott, Electrovert Ltd.
G.P. Evans, Indium Corp. of America
J.W. Evans, NASA HQ
H.S. Feldmesser, Johns Hopkins
University
ii
Acknowledgment
Solerability Specifications Task
Group of the IPC Joining Processes
Committee are shown below, it is not
possible to include all of those who
Soldering/Solderability
Specifications Task Group
Chairman
John DeVore
G.E.
J.R. Felty, Texas Instruments Inc.
R. Fields, E I DuPont De Nemours &
Co.
A.D. Flaten, AT&T Information
Systems
J. Gamalski, Siemens AG
J. Gechter, Delco Systems Operations
P. Gildehaus, Allied Signal Aerospace
C. Gonzalez, SCI Manufacturing Inc.
B. Gulati, Parker/Gull Electronic Sys
Div
V. Gundotra, Motorola Inc.
W.B. Hampshire, Tin Information Ctr
of N Amer
S. Herrberg, Magnavox Electronic
Systems Co.
D.D. Hillman, Rockwell International
P.E. Hinton, Hinton ‘‘PWB’’
Engineering
R.R. Holmes, AT&T Microelectronics
J.B. Hoppke, Alliant Techsystems
Inc.
L. Hymes, Plexus Corp.
R.C. Ihling, Lockheed Missiles &
Space Co.
B. Inpyn, Pitney Bowes Inc.
M.W. Jawitz, Litton Guidance &
Control Sys.
L.G. Johnson, General Electric Co.
S.A. Jones, Wilcox Electric Inc.
M. Kasilag, Aerojet Electrosystems
Co.
C. Kemp, General Electric Co.
G.W. Kenealey, Control Data Corp.
W.G. Kenyon, E I DuPont De
Nemours & Co.
K.Kirby, CAE-Link Corp.
L.P. Knowles, Librascope Corp.
T. Kokocinski, Northrop Corp.
April 1992
assisted in the evolution of this
Standard. To each of them, the
members of the IPC extend their
gratitude.
Technical Liaison of the
IPC Board of Directors
Bonnie Fena
Hibbing Printed Circuits
R. Kraszewski, Kester Solder
Division
V. Kumar, Martin-Marietta
Electronics
E.J. Kuntz, Alcatel Network Systems
Inc.
V. Kuo, EMPF
M.A. Kwoka, Harris Corp.
L.P. Lambert, Digital Equipment
Corp.
J. P. Langan, Enthone-Omi Inc.
R.B. Lomerson, General Dynamics
L. Lynch, AT&T Microelectronics
S.C. Mackzum, Ericsson GE
J.E. Madison, CTS Corp.
J.F. Maguire, Boeing Aerospace &
Electronics
J.R. Maki, Harris Corp.
S. Mansilla, Robisan Laboratory Inc.
R. Martinez, Magnavox West Coast
Operations
R.E. Mc Lean, Storage Technology
Corp.
S. Meeks Jr., Lexmark International/
IBM Corp.
J.H. Moffitt, U.S. Navy
G.C. Munie, AT&T Bell Laboratories
R.D. Nicholas, London Chemical Co
Inc.
R.L. Nielsen, Fastman Kodak Co Kad
R.B. Officer, Lockheed Sanders Inc.
R. Parker, Hewlett Packard
Laboratories
H.E. Parkinson, Digital Equipment
Corp.
R. Payne, Sundstrand Data Control
Inc.
R.J. Phillips, Lorain Products
P.J. Plonski, Photocircuits Corp.
R. Pond, Texas Instruments Inc.
April 1992
P.J. Quinn, General Electric Co.
M. Qurashi, U.S. Navy
R. Ramos, Trace Laboratories—East
J.R. Reed, Texas Instruments Inc.
P.M. Rehm, Intel Corp.
M. Reithinger, Siemens AG
D.E. Robertson, Pace Inc.
J.G. Rosser, Hughes Aircraft Co.
A.B. Rotman, DCMR Boston (Dept
of Defense)
Dr. W. Rubin, Multicore Solders
D. Rudy, AT&T Bell Laboratories
D.W. Rumps, AT&T Technology
Systems
N. Rusignuolo, Hexacon Electric Co.
H.J. Russell, Defense General Supply
Center
W.R. Russell, Texas Instruments Inc.
D. Scheiner, Kester Solder Division
A. Schneider, Alpha Metals Inc.
D. Schoenthaler, AT&T Bell
Laboratories
J.T. Slanina, Allied Signal Aerospace
E. Small, Multicore Solders
W.A. Smith, General Dynamics
N. Socolowski, Alpha Metals Inc.
J.R. Sovinsky, Indium Corp. of
America
A. Starosta, Eldec Corp.
C.J. Sworin, Kester Solder Division
G. Theroux, Honeywell Inc.
P.A. Thibodeau, Digital Equipment
Dr. L.J. Turbini, Georgia Institute/
Technology
H. Underwood, U.S. Air Force
J-STD-003
D. Varnell, Hercules Inc.
D.A. Vaughan, E I DuPont De
Nemours & Co.
E. Vollmar, Methode Electronics Inc.
B. Waller, Texas Instruments Inc.
C.E.T. White, Indium Corp. of
America
R.N. Wild, IBM Corp.
D. Wolf, Hadco Corp.
M. Wolverton, Texas Instruments Inc.
Dr. T. S. Won, Allied Signal
Aerospace
R. Woodgate, Woodcorp Inc.
J.R. Wooldridge, Rockwell
International
R.O. Young, Rockwell International
W. Younger, PC World—Orange
County
iii
April 1992 IPC-STD-003

Table of Contents
1.0 SCOPE ...................................................................... 1 4.2.4 Test D—Wave Solder Test................................... 10
1.1 Scope ...................................................................... 1 4.3 Test(s) without Established Accept/
1.2 Purpose ................................................................... 1 Reject Criterion .................................................... 11
1.3 Objective................................................................. 1 4.3.1 Test E—Wetting Balance Test ............................. 11
1.4 Performance Classes .............................................. 1 5.0 EVALUATION AIDS .............................................. 12
1.5 Method Classification............................................. 1 5.1 Evaluation Aids—Surface .................................... 12
1.5.1 Tests with Established Accept/Reject 5.2 Evaluation Aids—For Class 3 Plated
Criterion.................................................................. 1 Through-holes....................................................... 12
1.5.2 Test(s) without Established Accept/
Reject Criterion ...................................................... 1 6.0 NOTES .................................................................... 12
1.6 Test Method Selection............................................ 1 6.1 Test Equipment Sources....................................... 14
1.7 Test Specimen Requirements ................................. 2 6.1.1 Edge Dip Solderability Test Apparatus ............... 14
1.8 Coating Durability.................................................. 2 6.1.2 Rotary Dip Test Apparatus................................... 14
1.9 Limitation ............................................................... 2 6.1.3 Wetting Balance Test Apparatus .......................... 14
6.1.4 Steam Aging Equipment ...................................... 14
2.0 APPLICABLE DOCUMENTS .................................. 2
6.2 Wetting Times ...................................................... 15
2.1 Industry................................................................... 3
6.3 Correction for Buoyancy...................................... 15
2.1.1 IPC .......................................................................... 3
6.4 Preheat .................................................................. 15
2.2 Government ............................................................ 3
6.5 Baking/Testing Time Delay ................................. 15
2.2.1 Federal .................................................................... 3
6.6 Prebaking .............................................................. 15
3.0 REQUIREMENTS ..................................................... 3 6.7 Safety Note........................................................... 16
3.1 Terms and Definitions ............................................ 3 6.8 Use of Non-Activated Flux.................................. 16
3.2 Materials ................................................................. 3 6.9 Other Fluxes ......................................................... 16
3.2.1 Solder...................................................................... 3 6.10 Solder Contact ...................................................... 16
3.2.2 Flux......................................................................... 3 6.11 Steam Aging ......................................................... 16
3.2.3 Flux Removal Material .......................................... 3
3.3 Equipment............................................................... 3
Figures
3.3.1 Steam Aging Apparatus.......................................... 3
Figure 1 Contact angle ....................................................... 3
3.3.2 Solder Pot/Bath ...................................................... 4
Figure 2 Edge dip solderability test .................................... 6
3.3.3 Optical Inspection Equipment................................ 4
Figure 3a Suggested test specimen—for plated
3.3.4 Dipping Equipment ................................................ 4
through-holes........................................................ 7
3.3.5 Timing Equipment.................................................. 4
Figure 3b Suggested test specimen—for surface mount
3.4 Preparation for Testing........................................... 4 features................................................................. 8
3.4.1 Specimen Preparation and Conditioning Figure 4 Rotary dip test ...................................................... 8
For Test................................................................... 4 Figure 5 Effectiveness of solder wetting of plated-
3.4.2 Steam Aging ........................................................... 4 through holes–Class 3 ......................................... 9
3.4.3 Baking..................................................................... 4 Figure 6 Wetting balance apparatus ................................ 12
3.5 Solder Bath Requirements ..................................... 4 Figure 7a Wetting time acceptance criteria........................ 13
3.5.1 Solder Temperatures............................................... 4 Figure 7b Wetting force acceptance criteria....................... 13
3.5.2 Solder Contamination Control ............................... 4 Figure 8 Wetting balance curve........................................ 14
Figure 9 Aid to evaluation................................................. 15
4.0 TEST PROCEDURES .............................................. 4
4.1 Test Procedure Limitations .................................... 4
4.1.1 Application of Flux ................................................ 5 Tables
4.2 Tests with Established Accept/Reject Criterion .... 5 Table 1 Test Method Selection.......................................... 2
4.2.1 Test A—Edge Dip Test .......................................... 5 Table 2 Accelerated Aging and Test Requirements .......... 2
4.2.2 Test B—Rotary Dip Test ....................................... 5 Table 3 Maximum Limits of Solder Bath Contaminant ..... 3
4.2.3 Test C—Solder Float Test...................................... 8 Table 4 Steam Temperature Requirements ...................... 4

iv
April 1992
Solderability Tests for Printed Boards
1.0 SCOPE
1.1 Scope This standard prescribes the recommended
test methods, defect definitions and illustrations for assess-
ing the solderability of printed board surface conductors,
attachment lands, and plated through-holes. This standard
is intended for use by both vendor and user.
1.2 Purpose The solderability determination is made to
verify that the printed board fabrication processes and sub-
sequent storage have had no adverse effect on the solder-
ability of those portions of the printed wiring board
intended to be soldered. This is determined by evaluation
of the solderability specimen portion of a board or repre-
sentative coupon which has been processed as part of the
panel of boards and subsequently removed for testing per
the method selected.
1.3 Objective The objective of the solderability test
methods described in this standard is to determine the abil-
ity of printed board surface conductors, attachment lands,
and plated through-holes to wet easily with solder and to
withstand the rigors of the printed board assembly pro-
cesses.
1.4 Performance Classes Three general classes have
been established to reflect progressive increases in sophis-
tication, functional performance requirements and testing/
inspection frequency. It should be recognized that there
may be an overlap of equipment categories in different
classes. The user has the responsibility to specify in the
contract or purchase order the performance class required
for each product and shall indicate any exceptions to spe-
cific parameters, where appropriate.
Class 1 General Electronic Products
Includes consumer products, some computer and computer
peripherals, as well as general military hardware suitable
for applications where cosmetic imperfections are not
important and the major requirement is function of the
completed printed board.
Class 2 Dedicated Service Electronic Products
Includes communications equipment, sophisticated busi-
ness machines, instruments and military equipment where
high performance and extended life is required and for
which uninterrupted service is desired but not critical. Cer-
tain cosmetic imperfections are allowed.
Class 3 High Reliability Electronic Products
Includes the equipment for commercial and military prod-
ucts where continued performance or performance on
J-STD-003
demand is critical. Equipment downtime cannot be toler-
ated and must function when required such as in life sup-
port items or missile systems. Printed boards in this class
are suitable for applications where high levels of assurance
are required and service is essential.
1.5 Method Classification This standard describes test
methods by which both the surface conductors (and attach-
ment lands) and plated through-holes may be evaluated for
solderability.
Provisions are made for this determination to be performed
at the time of manufacture, at the receipt of the boards by
the user, or just prior to assembly and soldering. User and
vendor shall agree to the appropriate method to be used
and their correlation.
Standard dwell times are defined in some of the methods
called out in this standard. Variations in board heat capac-
ity may necessitate the use of longer solder dwell times
(see paragraph 6.2). Any change in solder dwell shall be
agreed upon by user and vendor.
1.5.1 Tests with Established Accept/Reject Criterion
Test A — Edge Dip Test (For surface conductors and
attachment lands only)
Test B — Rotary Dip Test (For plated through-holes, sur-
face conductors and attachment lands, solder
source side)
Test C — Solder Float Test (For plated through-holes, sur-
face conductors and attachment lands, solder
source side)
Test D— Wave Solder Test (For plated through-holes, sur-
face conductors and attachment lands, solder
source side)
1.5.2 Test(s) without Established Accept/Reject
Criterion
Test E — Wetting Balance Test (For surface conductors and
attachment lands only)
Please forward all test data generated using this test
method, including type of board tested (such as Type 2 or
12 layer, Type 3), dimensions of coupon tested, and any
pretreatment, to:
IPC
Wetting Balance Task Group (PWB)
2215 Sanders Road
Northbrook, IL 60062-6135
1.6 Test Method Selection For appropriate test selection
refer to paragraph 1.5 and Tables 1 & 2. The test selection
1
J-STD-003 April 1992

Table 1 Test Method Selection

Test Method Applies to Surface Features Plated Through-holes
Tests with Established Accept/Reject
Criteria
A—Edge Dip Test X NA
B—Rotary Dip Test X (Solder Source Side Only) X
C—Solder Float Test X (Solder Source Side Only) X
D—Wave Solder Test X (Solder Source Side Only) X
Test without Established Accept/Reject
Criteria
E—Wetting Balance Test X NA

Table 2 Accelerated Aging and Test Requirements

Durability of Coating Rating*
1 2** 3
Pretest Conditioning Flux Surface Holes Surface Holes Surface Holes
*8 Hours Steam R, see 3.2.2 X
No Aging R, see 3.2.2 X X X X
No Aging Prod. Type X
Applicable Tests A B A B A B
B C B C B C
D D D D D D
E E E
*See Paragraph 1.8
**Default Coating Rating

should consider the final soldering process so that the
results of the test will best represent that process.
1.7 Test Specimen Requirements The test specimen
shall be a representative coupon, a portion of the printed
wiring board being tested, or a whole board if within size
limits, such that an immersion depth defined in the indi-
vidual method is possible. The test specimen shall be rep-
resentative of the lot being tested. When this test specimen
is to be used as a criterion for material acceptance, the
number of test specimens shall be defined by agreement
between the user and vendor. Test coupons that may be
used for rigid board surface solderability and plated
through-hole solderability are detailed in the paragraph sec-
tions under the individual test methods. Similar coupons
may be used provided they reflect the board circuitry, hole,
and construction, and have been processed in conjunction
with the printed board being evaluated.
Unless otherwise specified, the land associated with a
plated through-hole shall be considered part of the plated
through-hole if it is used for through-hole attachment. In
this case, only tests for hole solderability apply. If the land
is used for surface attachment of parts, then such lands
shall be tested for both hole and surface solderability.
1.8 Coating Durability The user shall specify to the ven-
dor, as part of the purchase or ordering agreement, the
required coating durability. The following are guidelines
for determining the needed level of coating durability; not
product performance classes. Accelerated aging and solder-
ability testing shall be performed per Table 2.
Category 1—Minimum Coating Durability
Intended for boards which will be soldered within 30 days
from the time of manufacture and are likely to experience
minimum thermal exposures.
Category 2—Average Coating Durability
Intended for boards likely to experience storage up to 6
months from the time of manufacture and moderate ther-
mal or solder exposures.
Category 3—Maximum Coating Durability
Intended for boards likely to experience long storage (over
6 months) from the time of manufacture, severe thermal or
solder processing steps, etc. It should be recognized that
there may be a cost premium or delivery delay associated
with boards ordered to this durability level.
1.9 Limitation This standard shall not be construed as a
production soldering or tinning procedure for preparing or
soldering of printed wiring boards or assemblies.
2.0 APPLICABLE DOCUMENTS
The following documents of the issue currently in effect
form a part of this standard to the extent specified herein.

2
April 1992 J-STD-003

2.1 Industry Table 3 Maximum Limits of Solder Bath Contaminant

Maximum Contaminant
2.1.1 IPC1 Contaminant1 Weight Percentage Limit2
Copper 0.300
IPC-T-50 Terms and Definitions
Gold 0.200
IPC-CS-70 Guidelines for Chemical Handling Safety in Cadmium 0.005
Printed Board Manufacturing Zinc 0 .005
Aluminum 0.006
IPC-SF-818 General Requirements for Electronic Solder- Antimony 0.500
ing Fluxes
Iron 0.020
Arsenic 0. 030
2.2 Government2
Bismuth 0.250
2.2.1 Federal Silver 0.100
Nickel 0.010
QQ-S-571 Solder, Tin Alloy, Lead Tin Alloy, and Lead
Notes:
Alloy 1. The tin content of the solder shall be maintained within ±1%
of the nominal alloy being used. Tin content shall be tested
3.0 REQUIREMENTS at the same frequency as testing for copper/gold
contamination. The balance of the bath shall be lead and/or
the items listed above.
3.1 Terms and Definitions The definition of terms shall 2. The total of copper, gold, cadmium, zinc, and aluminum
be in accordance with IPC-T-50. Terms that have been contaminants shall not exceed 0.4%.
repeated from IPC-T-50 for convenience are indicated by
an asterisk (*). derability testing only upon agreement between user and
vendor on flux selection (see paragraphs 6.8 & 6.9).
Contact Angle, Soldering* The angle of a solder fillet that
is enclosed between a plane that is tangent to the solder/ 3.2.2.1 Flux Storage Caution should be taken in the stor-
basis-metal surface and a plane that is tangent to the solder/ age of fluxes used for solderability testing in order to main-
air interface (see Figure 1). tain the solids content per paragraph 3.2.2 and to avoid
contamination.

3.2.3 Flux Removal Material Material used for cleaning

printed boards prior to solderability evaluations shall be
capable of removing visible flux residues.

3.3 Equipment The following equipment applies to all

IPC-003-1
Figure 1 Contact angle
3.2 Materials
3.2.1 Solder The solder shall be composition Sn60 or
Sn63 of QQ-S-571. Other alloys may be used upon agree-
ment between user and vendor. The composition of the sol-
der, including contamination levels during testing, shall be
maintained per Table 3 (see section 3.5.2).
3.2.2 Flux A non-activated rosin flux having a nominal
composition of 25% by weight water white gum rosin, type
LR3CN per IPC-SF-818, in a solvent of 99% isopropyl
alcohol shall be used. The specific gravity shall be 0.843
±0.005 at 25°C [77°F]. Other fluxes may be used for sol-
methods. Equipment that is specific to any of the five sol-
derability test methods is described in the Section 4 para-
graphs detailing the method.
3.3.1 Steam Aging Apparatus Specimens to be steam
aged shall be exposed to the saturated steam in a container
constructed from borosilicate glass or stainless steel. The
specimen holder shall be non-metallic and non-reactive
with moisture to prevent galvanic corrosion or holder deg-
radation. The container may be insulated but it should have
a heat loss sufficient to allow continuous boiling of the
water. The steam temperature at the aging level shall be
maintained per the requirements of Table 4.
A safe means to prevent excessive pressure and a means of
maintaining adequate water level shall be provided. Neither
shall cause the vapor to cool below the specified tempera-
ture. Condensate shall drip freely back to the water. Care

1. Institute for Interconnecting and Packaging Electronic Circuits, 2215 Sanders Road, Northbrook, IL 60062-6135
2. Standardization Documents Order Desk, Building 4D, 700 Robbins Avenue, Philadelphia, PA 19111-5094, (215) 697-2667 or 2179

3
J-STD-003 April 1992

Table 4 Steam Temperature Requirements The prescribed pretreatments should reproduce actual pro-
Steam cessing of the printed wiring boards up to the time of
Average Local BP Temperature assembly soldering. (See paragraph 6.6). If steam aging is
Altitude °C [F] Limits °C [F]
performed, prebaking is not recommended.
0–305 m 100 [212] 93 ±3 [200±5]
[0–1000 ft]
3.4.2 Steam Aging The aging is intended for tin and tin/
305–610 m 99 [210] 92 ±3 [198 ±5]
[1000–2000 ft] lead coatings only. All specimens identified as requiring
610–914 m 98 [208] 91 ±3 [196 ±5] steam aging shall be subjected to accelerated aging prior to
[2000–3000 ft] solderability testing, by exposure of the surfaces to be
914–1219 m 97 [207] 90 ±3 [194 ±5] tested to steam in the equipment specified in paragraph
[3000–4000 ft] 3.3.1, immediately followed by a bake per paragraph 3.4.3.
1219–1524 m 96 [205] 89 ±3 [192 ±5] The specimens shall be suspended so that no portion of the
[4000–5000 ft] specimen is less than 38.0 mm [1.5 in] above the boiling
1524–1829 m 95 [203] 88 ±3 [190 ±5] distilled or deionized water. The specimens shall be
[5000–6000 ft] exposed to steam per Table 4 for 8 hours ±15 minutes. The
non-metallic holders shall support the specimens between
should be taken to minimize contact between the conden- vertical to 45° angle during exposure. If water must be
sate and the specimens. added to maintain the level required, add hot water gradu-
ally, in small quantities, such that boiling does not cease
3.3.2 Solder Pot/Bath A thermostatically controlled and temperature remains essentially constant. Care shall be
static solder bath shall be used of adequate dimensions to taken to not exceed the capacity of the aging equipment.
accommodate the specimens and containing enough solder Excessive or improper loading will cause condensation of
to maintain the temperature during testing within the speci- vapor on the surface of the specimens.
fied temperature limits (paragraph 3.5.1) and to prevent
exceeding the contamination levels (paragraph 3.5.2). The 3.4.3 Baking Immediately after steam aging and prior to
exception to this is test method D which uses a wave sol- solderability testing, all boards shall be baked at 105 ±5°C
der system. [221 ±9°F] for 1 +1/–0 hours to remove surface moisture
and other volatiles. Test specimens shall be cooled to room
3.3.3 Optical Inspection Equipment Inspection is gener-
temperature prior to fluxing and testing.
ally by the unaided eye (corrected vision glasses permitted)
but on occasion either a direct or projection lens system 3.5 Solder Bath Requirements
with a maximum of 10X magnification may be used.
3.5.1 Solder Temperatures The bulk temperature of the
3.3.4 Dipping Equipment Solder dipping devices shall
solder bath shall be maintained at 245 ±5°C [473 ±9°F]
be mechanical/electromechanical and capable of control-
unless another temperature is agreed to by vendor and user.
ling the immersion/emersion rates, dwell time and immer-
sion depth as specified in Sections 4.2 to 4.3.
3.5.2 Solder Contamination Control The solder in sol-
3.3.5 Timing Equipment Timing equipment shall be der baths used for solderability testing shall be chemically
automated, where applicable, and accurate to the limits of or spectrographically analyzed or replaced each 30 operat-
the test method. ing days as a minimum. An operating day consists of any
8 hour period, or any portion thereof, during which the sol-
3.4 Preparation for Testing der is liquefied and used. The levels of contamination and
Sn content must be within those shown in Table 3. The
3.4.1 Specimen Preparation and Conditioning For
interval between analysis may be lengthened if the test
Test The printed boards in the ‘‘as-received’’ condition
results, documented to the user’s satisfaction, indicate that
shall be prepared for testing in accordance with the user
the contamination limits are not being approached.
specified conditioning of paragraph 3.4.2. Care shall be
exercised to prevent contamination (by grease, perspira- If contamination exceeds the limits specified in Table 3,
tion, etc.) of the surface to be tested. When other pretreat- then the solder shall be changed and the intervals between
ment is agreed upon between user and vendor, the pretreat- analysis shall be shortened.
ments in paragraph 3.4.1.1 may be used.
4.0 TEST PROCEDURES
3.4.1.1 Pretreatments When agreed upon between user
and vendor, the specimen to be tested may undergo other 4.1 Test Procedure Limitations The test procedures of
types of pretreatments such as degreasing, aqueous clean- this specification are applicable to most printed board con-
ing, copper and solder brightening, or baking. structions typical of the industry. It is recognized that thick

4
April 1992
printed wiring boards will not act the same as thin printed
wiring boards due to their increased thermal mass, aspect
ratio, number of ground planes and weight of the solder
column within the hole. These factors greatly reduce the
likelihood that all holes will display completely wetted
knees with top side caps.
The test procedures of this specification shall be followed.
If it is demonstrated to the user’s satisfaction that changes
are necessary due to the physical characteristics of a speci-
men and not the solderability of the specimen surface, a
new procedure shall be documented and used only for the
applicable specimen. Changes in test procedures and flux
(see paragraph 3.2.2) shall take into account the wetting
time and flux issues of paragraphs 6.2, 6.8, and 6.9.
4.1.1 Application of Flux The test specimens are to be
dipped in the flux to the full depth to be soldered for 5–10
seconds. The flux shall be maintained at the prescribed
composition defined in paragraph 3.2.2. After withdrawal
from the flux, the specimen shall be allowed to drain ver-
tically for a maximum of 60 seconds. For rotary dip and
solder float tests excess flux may be removed by blotting
the surface to be tested. The solderability test shall then be
performed not less than one minute, and not more than five
minutes, after blotting.
4.2 Tests with Established Accept/Reject Criterion
4.2.1 Test A—Edge Dip Test This test is for edge dip
testing of surface conductors and attachment lands.
4.2.1.1 Apparatus
4.2.1.1.1 Solder Pot/Bath A solder vessel that meets the
requirements of 3.3.2 shall be used. The solder shall meet
the requirements of 3.2.1. Solder bath temperatures and
solder contamination control shall be in accordance with
3.5.1 and 3.5.2.
4.2.1.1.2 Dipping Device A dipping device as shown in
Figure 2 shall be used. A similar device may be used pro-
viding: the rate of immersion, dwell time, and rate of with-
drawal are within the test limits; perpendicularity of board
and solder surface are maintained; wobble, vibration, and
other extraneous movements are eliminated.
4.2.1.2 Test Specimen The test specimen shall be a rep-
resentative portion of the board, or a full board, whichever
is smaller, not to exceed 50.8 x 50.8 mm [2.0 x 2.0 in] or
a coupon that is representative of the common board fea-
tures. Figures 3a and 3b are suggested coupon styles.
4.2.1.3 Preparation Specimen preparation shall be in
accordance with 3.4.
J-STD-003
4.2.1.4 Procedure
4.2.1.4.1 Dross and burned/residual flux shall be com-
pletely removed from the surface of the molten solder
immediately prior to dipping.
4.2.1.4.2 After fluxing and draining per paragraph 4.1,
the specimen shall be immersed into the molten solder
edgewise to a depth of 25.0 ±2.0 mm [1.0 ±0.08 in]. The
dwell time in the molten solder shall be 3.0 ±0.3 seconds,
minimum. Immersion and emersion rates shall be 25.0 ±2.0
mm [1.0 ±0.08 in] per second.
4.2.1.4.3 After withdrawal, the solder shall be allowed to
solidify by air cooling while the board is maintained in a
vertical position.
4.2.1.4.4 Prior to examination, all specimens shall have
the flux removed using a cleaning agent in accordance with
paragraph 3.2.3.
4.2.1.5 Evaluation
4.2.1.5.1 Magnification Visual inspection shall be with
the unaided eye, corrected to 20/20. Lighting shall be suit-
able for proper inspection. To aid the evaluation of border-
line cases, or when vendor and user agree that more criti-
cal viewing conditions are appropriate, the set up described
in paragraph 3.3.3 is recommended.
4.2.1.5.2 Surface Evaluation
4.2.1.5.2.1 Accept/Reject Criterion A minimum of
95% of each of the surfaces being tested shall exhibit good
wetting. The balance of the surface may contain only small
pin holes, dewetted areas, and rough spots provided such
defects are not concentrated in one area. For less critical
applications, a smaller percent coverage may be deter-
mined between vendor and user. There shall be no non-
wetting or exposed base metal within the evaluated area
(see paragraph 6.10). An area of 3.2 mm [0.125 in] width
from the bottom edge of each test specimen shall not be
evaluated. Areas contacted by fixtures shall not be evalu-
ated.
4.2.2 Test B—Rotary Dip Test This test is for rotary dip
testing of plated through-holes, surface conductors and
attachment lands.
4.2.2.1 Apparatus A device shall be used to move the
test specimen in a circular path so that the flat surface of
the specimen will contact the solder at a constant speed
without stopping. The distance between the center of rota-
tion and the center of the test specimen shall be 100.0 ±5.0
5
J-STD-003
▼
▼
▼ ▼
▼
Solder
Station
245°C [473°F]
± 5°
Figure 2 Edge dip solderability test
mm [4.0 ±0.2 in]. An example of a specimen holder is
shown in Figure 4.
4.2.2.1.1 Those parts of the holder including the retaining
spring (if fitted) which come into contact with the speci-
men and/or the solder should have low thermal capacity
and conductivity.
4.2.2.1.2 The time of contact between any point of the
test face of the specimen and the molten solder shall be
determined by a timer activated by the electrical contact of
the sensor with the molten solder. The tip of the sensor
shall be located adjacent to the specimen and it shall be on
the same axis and radius of rotation as the center of the test
face of the specimen. The sensor shall be kept clean. It
shall be electrically insulated from the specimen holder
which carries it.
4.2.2.1.3 A strip of 50.0 mm [2.0 in] wide polytetrafluo-
roethylene (PTFE) or equivalent shall precede the test
specimen in the test cycle in order to remove oxide or flux
residue from the solder surface immediately before the
specimen is introduced.
4.2.2.2 Test Specimen The specimen shall be in accor-
dance with paragraph 1.7. The test specimen shall either be
a full board, a section of a board, or a suggested coupon
6
April 1992
Stop
▼
Start
Component Carrier
▼
Flux
Station
IPC-003-2
(see Figures 3a and 3b). The specimen shall be of such a
width as to allow 13.0 mm [0.5 in] clearance from the sol-
der pot sides. If plated through-holes are to be tested, then
the minimum number of holes to be tested is 30 per test lot.
The minimum number of terminations (plated through-
holes or attachment lands) per test specimen shall be six.
The test specimen shall be representative of the product.
The exposed length of specimen test face in the direction
of travel shall be 25.0 ±5.0 mm [1.0 ±0.2 in].
4.2.2.3 Preparation Specimen preparation shall be in
accordance with 3.4.
4.2.2.4 Procedure
4.2.2.4.1 Dross and burned/residual flux shall be com-
pletely removed from the surface of the molten solder
immediately prior to dipping.
4.2.2.4.2 After fluxing and draining, per paragraph 4.1,
mount the specimen to be tested in the test equipment
specimen holder.
4.2.2.4.3 Adjust the test equipment to immerse the speci-
men 0.75–1.0 mm [0.03–0.04 in] into the solder unless
otherwise specified. Activate the test equipment to expose
the specimen to solder. After the specimen has cleared the
April 1992 J-STD-003

27.5

▼
▼
[1.10]
22.5 2.5

▼
9 Spaces @
{0.90] [0.10]

3.13

▼
[0.125]

▼
7.5
[0.30]

▼ ▼
2.5 [0.10]
▼

40 Plated-through Holes
0.8 ±0.013 [0.032 ± 0.005]

Land Size 1.5 [0.060]

IPC-003-3a

Figure 3a Suggested test specimen—for plated through-holes

solder bath, allow all the solder to solidify in the position
in which the machine stops before removing from the
specimen holder. Care must be taken so that solder does
not flow over the upper face of the specimen. This may be
impacted by the width of the specimen.
4.2.2.4.4 Dwell time at the maximum depth shall be 3.0
±0.5 seconds, minimum.
4.2.2.4.5 Prior to examination, all specimens shall have
the flux removed using a cleaning agent in accordance with
paragraph 3.2.3.
4.2.2.5 Evaluation
4.2.2.5.1 Magnification Visual inspection shall be with
the unaided eye, corrected to 20/20. Lighting shall be suit-
able for proper inspection. To aid the evaluation of border-
line cases, or when vendor and user agree that more criti-
cal viewing conditions are appropriate, the set up described
in paragraph 3.3.3 is recommended.
4.2.2.5.2 Surface Evaluation
4.2.2.5.2.1 Incoming Acceptance An area of 3.2 mm
[0.125 in] width from the trailing edge of each test speci-
men shall not be evaluated. Areas contacted by fixtures
shall not be evaluated.
4.2.2.5.2.2 Accept/Reject Criterion A minimum of
95% of each of the surfaces being tested shall exhibit good
wetting. The balance of the surface may contain only small
pin holes, dewetted areas, and rough spots provided such
defects are not concentrated in one area. For less critical
applications, a smaller percent coverage may be deter-
mined between vendor and user. There shall be no non-
wetting or exposed base metal within the evaluated area
(see paragraph 6.10).
4.2.2.5.3 Plated Through-hole Evaluation
4.2.2.5.3.1 Incoming Acceptance Only plated holes that
are at least 5.0 mm [0.2 in] from any surface or fixturing
structure supporting the specimen during the test will be
evaluated. An area of 3.2 mm [0.125 in] width from the
trailing edge of each test specimen shall not be evaluated.
Areas contacted by fixtures shall not be evaluated.
4.2.2.5.3.2 Accept/Reject Criterion—Class 1 and 2
Product Solder shall fully wet the wall area of the plated
through-holes, and plug holes less than 1.5 mm [0.06 in]
diameter (complete filling is not necessary).
4.2.2.5.3.3 Accept/Reject Criterion—Class 3 Product
The specimen has soldered successfully if solder has risen
in all plated holes. The solder shall have fully wetted the
walls of the hole. There shall be no non-wetting or exposed
base metal on any plated through-hole.
Accept/reject criterion for boards <3.0 mm [0.125 in] shall
be in accordance with paragraph 5.2 and Figure 5. The sol-
der must have wet over the knee of the hole and out onto
the land around the top of the hole, except for boards
whose thickness exceeds 3.0 mm [0.125 in].
On thick boards, i.e., greater than 3.0 mm [0.125 in] the
capillary action forces may not be large enough to over-
come forces exerted on the solder by the weight of the sol-
der. This may prevent solder from filling the plated

7
J-STD-003 April 1992

32.0mm [1.275"]

25.4mm [1.00"] 7.0mm

[0.275"]

2.5mm [0.10"]

1.9mm
[0.075"]
2 PL

2.5mm [0.10"]
6.0mm 12.5mm
[0.350"] [0.50"]
2 Pl.

IPC-003-3b

Figure 3b Suggested test specimen—for surface mount features

area of the pot shall be great enough to float the test speci-
Coupon men without it touching the sides of the pot.

▼ 4.2.3.1.2 Specimen Handling Tool Stainless steel for-

Dross ceps, or other specially designed tools of stainless steel,
Wiper shall be used to handle the specimen only by the edges.
▼

4.2.3.2 Test Specimen The test specimen shall be in

Solder accordance with paragraph 1.7. The test specimen shall be
245°C [473°F] a portion of the printed board not greater than 50.0 x 50.0
± 5° mm [2.0 x 2.0 in], the suggested coupon, or the complete
board if it is smaller than this size. The minimum number
of holes to be tested is 30 per test lot. If there are not at
least 30 holes in the test specimen, additional specimens
1) Dwell timer set at 3.0 ± .5 seconds shall be tested until at least 30 holes have been tested. (See
2) Adjustable speed control on 100.0mm [4.0"] R Figure 3a—Through-hole coupon).
on solder station
3) Dwell at end of 100.0mm [4.0"] radius swing to
allow solder to solidify 4.2.3.3 Preparation Specimen preparation shall be in
IPC-003-4 accordance with 3.4.
Figure 4 Rotary dip test
4.2.3.4 Procedure
through-hole and wetting over the knee of the hole and out
onto the land area around the top of the hole. 4.2.3.4.1 Dross and burned/residual flux shall be com-
pletely removed from the surface of the molten solder
4.2.3 Test C—Solder Float Test This test is for solder immediately prior to floating.
float testing of plated through-holes, surface conductors
and attachment lands. 4.2.3.4.2 After fluxing and draining per paragraph 4.1,
slide the coupon gently on molten solder. Allow coupon to
4.2.3.1 Apparatus float on solder for 5 seconds maximum. The coupon may
be depressed into the solder bath to a maximum of 50% of
4.2.3.1.1 Solder Pot The solder pot shall meet the the coupon thickness after it has been initially floated on
requirements of paragraph 3.3.2. In addition, the surface the solder bath (extreme care must be taken with boards

8
April 1992 J-STD-003

IPC-003-5-a IPC-003-5-c

Figure 5 Effectiveness of solder wetting of plated-through holes–Class 3

9
J-STD-003
that are less than 0.8 mm [0.032 in] thick). After the
elapsed time, slide the coupon off molten solder. Hold cou-
pon still and horizontal until solder solidifies.
4.2.3.4.3 Prior to examination, all specimens shall have
the flux removed using a cleaning agent in accordance with
paragraph 3.2.3.
4.2.3.5 Evaluation
4.2.3.5.1 Magnification Visual inspection shall be with
the unaided eye, corrected to 20/20. Lighting shall be suit-
able for proper inspection. To aid the evaluation of border-
line cases, or when vendor and user agree that more criti-
cal viewing conditions are appropriate, the set up described
in paragraph 3.3.3 is recommended.
4.2.3.5.2 Surface Evaluation
4.2.3.5.2.1 Incoming Acceptance An area of 3.2 mm
[0.125 in] width from the trailing edge of each test speci-
men shall not be evaluated. Areas contacted by fixtures
shall not be evaluated.
4.2.3.5.2.2 Accept/Reject Criterion A minimum of
95% of each of the surfaces being tested shall exhibit good
wetting. The balance of the surface may contain only small
pin holes, dewetted areas, and rough spots provided such
defects are not concentrated in one area. For less critical
applications, a smaller percent coverage may be deter-
mined between vendor and user. There shall be no non-
wetting or exposed base metal within the evaluated area
(see paragraph 6.10). An area of 3.2 mm [0.125 in] width
from the trailing edge of each test specimen shall not be
evaluated. Areas contacted by fixtures shall not be evalu-
ated.
4.2.3.5.2.3 Plated Through-hole Evaluation
4.2.3.5.2.3.1 Incoming Acceptance Only plated holes
that are at least 5.0 mm [0.2 in] from any surface or fixtur-
ing structure supporting the specimen during the test will
be evaluated.
4.2.3.5.2.3.2 Accept/Reject Criterion—Class 1 and 2
Product Solder shall fully wet the wall area of the plated
through-holes, and plug holes less than 1.5 mm [0.06 in]
diameter (complete filling is not necessary).
4.2.3.5.2.3.3 Accept/Reject Criterion—Class 3 Prod-
uct The specimen has soldered successfully if solder has
risen in all plated holes. The solder shall have fully wetted
the walls of the hole. There shall be no non-wetting or
exposed base metal on any plated through-hole.
10
April 1992
Accept/reject criterion for boards <3.0 mm [0.125 in] shall
be in accordance with paragraph 5.2 and Figure 5. The sol-
der must have wet over the knee of the hole and out onto
the land around the top of the hole, except for boards
whose thickness exceeds 3.0 mm [0.125 in].
On thick boards, i.e., greater than 3.0 mm [0.125 in] the
capillary action forces may not be large enough to over-
come forces exerted on the solder by the weight of the sol-
der. This may prevent solder from filling the plated
through-hole and wetting over the knee of the hole and out
onto the land area around the top of the hole.
4.2.4 Test D—Wave Solder Test This test is for wave
solder testing of plated through-holes, surface conductors,
and attachment lands.
4.2.4.1 Apparatus A wave soldering system adjusted to
provide the parameters of 4.2.4.4 shall be used.
4.2.4.2 Test Specimen The suggested test specimen
shall be in accordance with Figures 3a and 3b and para-
graph 1.7.
4.2.4.3 Preparation Specimen preparation shall be in
accordance with 3.4.
4.2.4.4 Procedure
4.2.4.4.1 Specimens shall be fixtured so as to be repre-
sentative of the production setup without components
inserted.
4.2.4.4.2 The fluxing unit should be filled with the spe-
cific (paragraph 3.2.2) or agreed upon flux. If the unit con-
tains other than the specified or agreed upon flux then the
fluxing unit shall be turned off and the board specimens
fluxed separately prior to placement on the conveyor per
paragraph 4.1. The following parameters must be estab-
lished and noted: board fixturing (if required), conveyor
speed, preheater, solder unit with or without oil intermix,
machine process controls, incline, board preheat tempera-
ture and solder temperature.
4.2.4.4.3 The application of solder shall meet the require-
ments of the applicable wave solder equipment, specifi-
cally for depth of contact, angle of contact, and duration of
contact. Solder temperature shall be 245 ±5°C [473 ±9°F]
unless another temperature is agreed to by vendor and user.
4.2.4.4.4 Prior to examination, all specimens shall have
the flux removed using a cleaning agent in accordance with
paragraph 3.2.3.
4.2.4.5 Evaluation
4.2.4.5.1 Magnification Visual inspection shall be with
the unaided eye, corrected to 20/20. Lighting shall be suit-
able for proper inspection. To aid the evaluation of border-
line cases, or when vendor and user agree that more criti-
cal viewing conditions are appropriate, the set up described
in paragraph 3.3.3 is recommended.
April 1992
4.2.4.5.2 Surface Evaluation
4.2.4.5.2.1 Incoming Acceptance An area of 3.2 mm
[0.125 in] width from the trailing edge of each test speci-
men shall not be evaluated. Areas contacted by fixtures
shall not be evaluated.
4.2.4.5.2.2 Accept/Reject Criterion A minimum of
95% of each of the surfaces being tested shall exhibit good
wetting. The balance of the surface may contain only small
pin holes, dewetted areas, and rough spots provided such
defects are not concentrated in one area. For less critical
applications, a smaller percent coverage may be deter-
mined between vendor and user. There shall be no non-
wetting or exposed base metal within the evaluated area
(see paragraph 6.10). An area of 3.2 mm [0.125 in] width
from the trailing edge of each test specimen shall not be
evaluated. Areas contacted by fixtures shall not be evalu-
ated.
4.2.4.5.3 Plated Through-hole Evaluation
4.2.4.5.3.1 Incoming Acceptance Only plated holes that
are at least 5.0 mm [0.2 in] from any surface or fixturing
structure supporting the specimen during the test will be
evaluated.
4.2.4.5.3.2 Accept/Reject Criterion—Class 1 and 2
Product Solder shall fully wet the wall area of the plated
through-holes, and plug holes less than 1.5 mm [0.06 in]
diameter (complete filling is not necessary).
4.2.4.5.3.3 Accept/Reject Criterion—Class 3 Product
The specimen has soldered successfully if solder has risen
in all plated holes. The solder shall have fully wetted the
walls of the hole. There shall be no non-wetting or exposed
base metal on any plated through-hole.
Accept/reject criterion for boards <3.0 mm [0.125 in] shall
be in accordance with paragraph 5.2 and Figure 5. The sol-
der must have wet over the knee of the hole and out onto
the land around the top of the hole, except for boards
whose thickness exceeds 3.0 mm [0.125 in].
On thick boards, i.e., greater than 3.0 mm [0.125 in] the
capillary action forces may not be large enough to over-
come forces exerted on the solder by the weight of the sol-
der. This may prevent solder from filling the plated
through-hole and wetting over the knee of the hole and out
onto the land area around the top of the hole.
4.3 Test(s) without Established Accept/Reject Criterion
4.3.1 Test E—Wetting Balance Test This test is for wet-
ting balance testing of surface conductors and attachment
lands.
J-STD-003
4.3.1.1 Apparatus A solder meniscus force measuring
device (wetting balance) which includes a temperature-
controlled solder pot containing solder maintained per
paragraph 3.3.2. This method also requires a means of
recording force as a function of time, such as a chart
recorder, data logger, or computer.
4.3.1.1.1 Dipping Device A mechanical or electrome-
chanical dipping device as shown in Figure 6 shall be used.
The device is preset to produce an immersion and emersion
rate as specified in paragraph 4.3.1.4.2. The dwell time is
operator controlled to the time specified in paragraph
4.3.1.4.2.
4.3.1.2 Test Specimen The test specimen shall be fully
metallized on both sides (double-sided) and must meet the
requirements of 1.7 and Figure 3b. The thickness of the
specimen shall be the same as the boards which it repre-
sents. The specimen shall remain attached to the board
within the overall coupon during all stages of board manu-
facture. The specimen shall be removed from the larger
coupon prior to testing. That portion which is to be
removed is the section that is nominally 25.0 mm [1.0 in]
long and 6.0 mm [0.24 in] wide (exact dimensions are
given in Figure 3b). The specimen may be removed from
the larger coupon either by routing or shearing. The fin-
ished specimen shall have the metallized surfaces extend to
the edges and bottom of the specimen. (Caution: Other
specimen sizes may be used but interpretation of the results
will require different correlation factors than those shown
in Figures 7a and 7b.)
4.3.1.3 Preparation Specimen preparation shall be in
accordance with 3.4.
4.3.1.4 Procedure
4.3.1.4.1 After removal of the test specimen from the
main test coupon, the width shall be measured and
recorded. The accuracy of this measurement shall be ±0.1
mm [±0.004 in]. During this measurement, care must be
taken not to touch or otherwise disturb the surfaces to be
tested. From this measurement, the perimeter (2 x width +
2 x thickness) shall be calculated for use in the curve
evaluation.
4.3.1.4.2 After application of the flux and partial drying,
per paragraph 4.1, the fixture holding the specimen shall be
mounted on the test equipment. The surface of the molten
solder shall be skimmed just prior to immersing the speci-
men in the solder. The test shall be started and the speci-
men immersed only once. The immersion depth shall be
5.0 mm [0.2 in] as set on the instrument. The immersion
and emersion rates shall be 20.0–25.0 mm [0.8–1.0 in] per
second and the dwell time in the bath shall be 10 ±1 sec-
onds. During the test, the wetting curve shall be recorded
on a suitable device for use in the evaluation.
11
J-STD-003 April 1992

▼ LVDT
Signal Chart
Conditioner Recorder
(Transducer)

Relative Clamp
Motion
Copper
Coupon

▼
Solder
▼ Bath
Heater

Controls

IPC-003-6

Figure 6 Wetting balance apparatus

4.3.1.4.3 Prior to examination, all specimens shall have
the flux removed using a cleaning agent in accordance with
paragraph 3.2.3.
4.3.1.5 Evaluation
4.3.1.5.1 Magnification Visual inspection shall be with
the unaided eye, corrected to 20/20. Lighting shall be suit-
able for proper inspection. To aid the evaluation of border-
line cases, or when vendor and user agree that more criti-
cal viewing con-ditions are appropriate, the set up
described in paragraph 3.3.3 is recommended.
4.3.1.5.2 Acceptance Using the coupon specified in
paragraph 4.3.1.2, the acceptable solderability shall be
defined as those specimens which exhibit the following:
• A wetting time for the wetting curve to cross the cor-
rected zero axis after the start of the test (see Figure 8)
less than the maximum wetting time as described in Fig-
ure 7a (see paragraph 6.2).
• A maximum wetting force taken after correction for
buoyancy (see Figure 8 and paragraph 6.3) greater than
the minimum acceptable force shown in Figure 7b.
• Dewetting less than 5% of the wettable surface area
which had been immersed in solder during test.
5.1 Evaluation Aids—Surface As an aid to evaluation of
the test results, see Figure 9. This aid is to be used prima-
rily to illustrate types of defects rather than percentage of
area covered.
5.2 Evaluation Aids—For Class 3 Plated Through-
holes Profile views of acceptable conditions are presented
in Figure 5 for aid in visualizing all the common condi-
tions. The following are also acceptable conditions for spe-
cific cases.
5.2.1 Solderability acceptance for plated through-holes
with aspect ratios greater than 5:1 (board thickness:hole
diameter) shall be agreed to between user and vendor.
5.2.2 Depressed fillets in holes are acceptable under the
following condition: the solder in partially filled holes must
exhibit a contact angle less than 90° relative to the hole
wall (see Figure 5).
5.2.3 All holes less than 1.5 mm [0.06 in] diameter shall
retain a solder plug after solidification. Holes greater than
1.5 mm [0.06 in] shall not be rejected for failure to retain
a full solder plug provided that the entire barrel of the hole
and the surface of the top land have been wetted with sol-
der (see Figure 5).

5.0 EVALUATION AIDS 6.0 NOTES

12
April 1992 J-STD-003

Wetting Time Acceptance Criteria

PWB Wetting Balance Coupons

Wetting Time (sec) 4.50

4.00

3.50

3.00

2.50

2.00

1.50

1.00
30 40 60 80 100 120

Total Coupon Thickness (mils) IPC-003-7a

Figure 7a Wetting time acceptance criteria

Wetting Force Acceptance Criteria

PWB Wetting Balance Coupons

400
Wetting Force ( µN/mm)

300

200

100

-100

-200
-250
30 40 60 80 100 120

Total Coupon Thickness (mils)

IPC-003-7b

Figure 7b Wetting force acceptance criteria

13
J-STD-003 April 1992

Instrument Zero
▼

▼
FORCE ( µ N)

Fmax

Corrected Zero
0 ▼ ▼

Tw TIME
▼

IPC-003-8

Figure 8 Wetting balance curve

6.1 Test Equipment Sources The equipment sources
described below represent those currently known to the
industry. Users of this document are urged to submit addi-
tional source names as they become available, so that this
list can be kept as current as possible.
6.1.1 Edge Dip Solderability Test Apparatus HMP/
Soldermatics, P.O. Box 948, Canon City, CO 81215, (719)
275-1531.
Multicore Solders, Cantiague Rock Road, Westbury, NY
11590, (516) 334-7997.
Robotic Process Systems, 4420 Shopping Lane, Simi Val-
ley, CA 93063, (805) 583-5805.
Williams Machine, 2092 W. Main St., Norristown, PA
19403, (215) 539-1123.
6.1.2 Rotary Dip Test Apparatus Robotic Process Sys-
tems, 4420 Shopping Lane, Simi Valley, CA 93063, (805)
583-5805.
6.1.3 Wetting Balance Test Apparatus Convey AT3,
Harpsundsv 113, 12440 Baudhalen, Sweden
G.E.C., Hirst Research Centre, U.K.
Hollis Automation Inc., 15 Charron Avenue, Nashua, NH
03063, (603) 889-1121.
Kester Solder, 515 E. Touhy Ave., Des Plaines, IL 60018,
(708) 286-1600.
Metronelec, 67 Boulevard National 92500 Rueil Malmai-
son, France (USA Distributor-Paradigm Electronics, 4
Crown Ridge Rd., Westborough, MA 01581, (508) 870-
0091.)
Multicore Solders, Cantiague Rock Road, Westbury, NY
11590, (516) 334-7997.
6.1.4 Steam Aging Equipment
Express Test Corporation, 977 Benecia Avenue, Sunnyvale,
CA 94086, (805) 583-5805.
Mark X Systems, 30872 Huntwood Ave., Unit 2, Hayward,
CA 94544, (415) 487-1345.
MountainGate Engineering, 540 Division Street, Campbell,
CA 95008, (408) 866-5100.
Robotic Process Systems, 4420 Shopping Lane, Simi Val-
ley, CA 93063, (805) 583-5805.

14
April 1992
Preferred Small Amount
Wetting of Dewetting
Figure 9 Aid to evaluation
Zentek Scientific Systems, 3520 Yale Way, Fremont, CA
94538, (415) 651-1581.
Additional drawings are available from IPC.
6.2 Wetting Times (See paragraph 4.3.1.5.2) Figure 7
shows that as the board thickness and/or thermal mass
increases, the maximum acceptable wetting time also
increases as demonstrated for the wetting balance test. As
the board heat capacity increases, the time to bring the
sample up to soldering temperature increases. This effect is
due to the low thermal conductivity of PWB laminate
materials. Acceptance criteria for boards with high heat
capacity shall be agreed upon by user and vendor.
6.3 Correction for Buoyancy For the wetting balance to
obtain wetting force values that are relatable to one
another, it is necessary to correct for the variability in
specimen sizes, in particular width and thickness. This is
done by correcting for the volume of the sample immersed
in the solder. The following formula may be used to calcu-
late the buoyant force correction:
Fb = ρ gV
Where:
ρ= Density of solder @245°C (8.15g/cm3)*
g= Acceleration of gravity (9810 mm/s2)
V= Immersed volume of coupon (cm3)
= width x thickness x immersion depth
*For Sn60/Pb40 Alloy
J-STD-003
Complete
Dewetting Nonwetting
IPC-003-9
When the buoyancy force is calculated, it should be used
to correct the zero axis. This correction is required to
obtain both the proper measurement of wetting times, as
well as wetting forces. All measurements of wetting times
and wetting forces must be made from the corrected zero
axis. In the case of an upright curve, the new corrected zero
axis will be below the instrument zero.
6.4 Preheat If the board specimen or coupon does not
pass the standard solderability test then a uniform preheat
of a second specimen may be used to determine if design/
construction has impacted the solderability test (i.e., a thick
board with heavy internal ground planes). If this referee
specimen passes, then testing with preheat shall be the
method of choice for future testing of specimens having
that design/construction.
6.5 Baking/Testing Time Delay The time between bak-
ing and solderability testing should be kept to a minimum
in order to prevent re-absorption of water vapor into the
laminate structure. The actual time is dependent upon
ambient temperature and humidity levels.
6.6 Prebaking The occurrence of outgassing, which may
result in blowholes, measling, blisters or delamination, may
be reduced by baking the printed board prior to soldering
to eliminate moisture or solvents. Other factors, such as
conveyor speed (for wave solder testing), solder tempera-
ture, contamination content, etc., may also be involved in
15
J-STD-003 April 1992

producing defects and, therefore, should be analyzed if facturers. Therefore, they do not provide as stable a base
problems occur. Specimens should be baked in a suitable material as do the non-activated rosin materials for testing
oven to remove any absorbed moisture. Time between bake purposes.
and testing should not exceed 24 hours. Temperature and
time of baking is to be determined on an individual basis. 6.9 Other Fluxes In certain cases it may be necessary to
use other than a Type R flux. It must be remembered that
Printed boards should be prebaked only if prebaking is
within other generic types, different formulations may give
normally used as a production procedure. Baking should be
different results. Therefore, it is important that if testing is
kept to a minimum, but at least be equal to the production
being done at both vendor and user locations, the same for-
procedure, to prevent excessive oxidation and intermetallic
mulation be used by both.
growth.
6.10 Solder Contact The solder applied during the sol-
6.7 Safety Note Isopropyl alcohol used in paragraph
derability test must contact a feature in order for that fea-
3.2.2 is flammable. Care must be taken in both usage and
ture to be considered for evaluation. Small features sur-
storage to keep the isopropyl alcohol from sparks or
rounded by a thick solder mask are one type which can
flames. See the Material Safety Data Sheets (MSDS) for all
prevent solder contact.
solvents. All chemicals shall be handled per appropriate
data sheets, and disposed of per local regulations. Also see
6.11 Steam Aging Steam aging of the test specimen
IPC-CS-70.
prior to solderability testing provides an indication of the
durability of the solderable coating. This durability may be
6.8 Use of Non-Activated Flux Non-activated, pure rosin
needed to withstand inventory storage and/or several
fluxes are specified for solderability testing for two main
sequential soldering operations. All PWB fabrication pro-
reasons. These are to provide maximum sensitivity during
cesses may not be capable of providing a high durability
the test and to provide a consistent base flux for testing.
solderable finish, in which case a minimum requirement
Activated rosin materials have different performance char-
must be specified.
acteristics both within a manufacturer and between manu-

16
Standard Improvement Form
The purpose of this form is to provide the
Technical Committee of IPC with input
from the industry regarding usage of
the subject standard.
J-STD-003
Individuals or companies are invited to If you can provide input, please complete
submit comments to IPC. All comments this form and return to:
will be collected and dispersed to the IPC
appropriate committee(s). 2215 Sanders Road
Northbrook, IL 60062-6135
Fax 847 509.9798

1. I recommend changes to the following:

Requirement, paragraph number
Test Method number , paragraph number

The referenced paragraph number has proven to be:

Unclear Too Rigid In Error
Other

2. Recommendations for correction:

3. Other suggestions for document improvement:

Submitted by:

Name Telephone

Company

Address

City/State/Zip Date
Technical Questions
The IPC staff will research your technical question and attempt to find an appropriate specification interpretation or
technical response. Please send your technical query to the technical department via:
tel 847/509-9700 fax 847/509-9798
http://www.ipc.org e-mail: answers@ipc.org

IPC Technical Forums

IPC technical forums are opportunities to network on the Internet. It’s the best way to get the help you need today!
Over 2,500 people are already taking advantage of the excellent peer networking available through e-mail forums
provided by IPC. Members use them to get timely, relevant answers to their technical questions.
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TechNet forum is for discussion of technical help, comments or questions on IPC specifications, or other technical
inquiries. IPC also uses TechNet to announce meetings, important technical issues, surveys, etc.
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ChipNet forum is for discussion of flip chip and related chip scale semiconductor packaging technologies. It is
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Designers Council forum covers information on upcoming IPC Designers Council activities as well as information,
comment, and feedback on current design issues,local chapter meetings, new chapters forming, and other design
topics.
Roadmap@ipc.org
The IPC Roadmap forum is the communication vehicle used by members of the Technical Working Groups (TWGs)
who develop the IPC National Technology Roadmap for Electronic Interconnections.
IPCsm840@ipc.org
This peer networking forum is specific to solder mask qualification and use.
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The associated e-mail message text will be distributed to everyone on the list, including the sender. Further
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For more information, contact Dmitriy Sklyar
tel 847/509-9700 x311 fax 847/509-9798
e-mail: sklydm@ipc.org http://www.ipc.org/html/forum.htm
IPC World Wide Web Page http://www.ipc.org
Our home page provides access to information about upcoming events, publications and videos, membership, and
industry activities and services. Visit soon and often.

Education and Training

IPC conducts local educational workshops and national conferences to help you better understand emerging
technologies. National conferences have covered Ball Grid Array and Flip Chip/Chip Scale Packaging. Some workshop
topics include:
Printed Wiring Board Fundamentals High Speed Design
Troubleshooting the PWB Manufacturing Process Design for Manufacturability
Choosing the Right Base Material Laminate Design for Assembly
Acceptability of Printed Boards Designers Certification Preparation
New Design Standards
IPC video tapes and CD-ROMs can increase your industry know-how and on the job eff ectiveness.
For more information on programs, contact John Riley
tel 847/509-9700 ext. 308 fax 847/509-9798
e-mail: rilejo@ipc.org http://www.ipc.org
For more information on IPC Video/CD Training, contact Mark Pritchard
tel 505/758-7937 ext. 202 fax 505/758-7938
e-mail: markp@taos.newmex.com
http://www.ipc.org

Training and Certification

IPC-A-610 Training and Certification Program
“The Acceptability of Electronic Assemblies” (ANSI/IPC-A-610) is the most widely used specification for the PWB
assembly industry. An industry consensus Training and Certification program based on the IPC-A-610 is available to
your company.
For more information, contact John Riley
tel 847/509-9700 ext. 308 fax 847/509-9798
e-mail: rilejo@ipc.org http://www.ipc.org/html/610.htm

IPC Printed Circuits Expo

IPC Printed Circuits Expo is the largest trade exhibition in North America devoted to the PWB industry. Over 90
technical presentations make up this superior technical conference.

April 28-30, 1998 March 16-18, 1999

Long Beach, California Long Beach, California

For more information, contact Kim Behr

tel 847/509-9700 ext. 319 fax 847/509-9798
e-mail: behrki@ipc.org http://www.ipc.org

How to Get Involved

The first step is to join IPC. An application for membership can be found on page 74.
Once you become a member, the opportunities to enhance your competitiveness are vast. Join a technical committee
and
learn from our industry’s best while you help develop the standards for our industry. Participate in market research
programs which forecast the future of our industry. Participate in Capitol Hill Day and lobby your Congressmen and
Senators for better industry support. Pick from a wide variety of educational opportunities: workshops, tutorials, and
conferences. More up-to-date details on IPC opportunities can be found on our web page: http:/www.ipc.org.
For information on how to get involved, contact:
Jeanette Ferdman, Membership Manager
tel 847/509-9700 ext. 309 fax 847/509-9798
e-mail: JeanetteFerdman@ipc.org http://www.ipc.org
 A P P L I C AT I O N FOR SITE MEMBERSHIP

Thank you for your decision to join IPC members on the “Intelligent Path to Competitiveness”! IPC Membership is
site specific, which means that IPC member benefits are available to all individuals employed at the site designat-
ed on the other side of this application.
PLEASE CHECK
APPROPRIATE To help IPC serve your member site in the most efficient manner possible, please tell us what your facility does by
CATEGORY choosing the most appropriate member category.

■ Our facility manufactures and sells to other companies, printed wiring boards or other electronic interconnection products on
INDEPENDENT the merchant market.
PRINTED BOARD
MANUFACTURERS WHAT PRODUCTS DO YOU
MAKE FOR SALE?

n One-sided and two-sided rigid printed n Flexible printed boards n Discrete wiring devices
boards n Flat cable n Other interconnections
n Multilayer printed boards n Hybrid circuits

Name of Chief Executive Officer/President___________________________________________________________________

■
Our facility assembles printed wiring boards on a contract basis and/or offers other electronic interconnection products for sale.
INDEPENDENT
PRINTED BOARD
ASSEMBLERS n Turnkey n Through-hole n Consignment
EMSI COMPANIES n SMT n Mixed Technology n BGA
n Chip Scale Technology

Name of Chief Executive Officer/President ________________________ _

■ Our facility purchases, uses and/or manufactures printed wiring boards or other electronic interconnection products for our own
OEM – use in a final product. Also known as original equipment manufacturers (OEM).
MANUFACTURERS
OF ANY END IS YOUR INTEREST IN:
PRODUCT n purchasing/manufacture of printed circuit boards
USING
PCB/PCAS n purchasing/manufacturing printed circuit assemblies
OR CAPTIVE
MANUFACTURERS What is your company’s main product line? __________________________________________________________________
OF PCBS/PCAS

■ Our facility supplies raw materials, machinery, equipment or services used in the manufacture or assembly of electronic inter-
INDUSTRY connection products.
SUPPLIERS What products do you supply?_____________________________________________________________________________

■ We are representatives of a government agency, university, college, technical institute who are directly concerned with design,
GOVERNMENT research, and utilization of electronic interconnection devices. (Must be a non-profit or not-for-profit organization.)
AGENCIES/
ACADEMIC
TECHNICAL
LIAISONS

Please be sure both sides of this application are correctly completed

 A P P L I C AT I O N FOR SITE MEMBERSHIP

Site Information:

Company Name

Street Address

City State Zip Country

Main Phone No. Fax

Primary Contact Name

Title Mail Stop

Phone Fax e-mail

Alternate Contact Name

Title Mail Stop

Phone Fax e-mail

Please check one:

❏ $1,000.00 Annual dues for Primary Site Membership (Twelve months of IPC membership begins from the time the application
and payment are received)

❏ $800.00 Annual dues for Additional Facility Membership: Additional membership for a site within an organization where
another site is considered to be the primary IPC member.

❏ $600.00** Annual dues for an independent PCB/PWA fabricator or independent EMSI provider with annual sales of less than
$1,000,000.00. **Please provide proof of annual sales.

❏ $250.00 Annual dues for Government Agency/University/not-for-profit organization

TMRC Membership ❏ Please send me information on Membership in the Technology Marketing Research Council (TMRC)
AMRC Membership ❏ Please send me information for Membership in the Assembly Marketing Research Council (AMRC)

Payment Information

Enclosed is our check for $

Please bill my credit card: (circle one) MC AMEX VISA DINERS

Card No. Exp date ____________________

Authorized Signature

@@@@@@@@e?
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IPC IPC @@
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Dept. 77-3491 2215 Sanders Road

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Chicago, IL 60678-3491 Northbrook, IL 60062-6135

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PLEASE ATTACH BUSINESS CARD

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Tel: 847 509.9700

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2215 Sanders Road Tel 847 509.9700
Northbrook, Illinois Fax 847 509.9798
60062-6135 URL: http://www.ipc.org