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AP72T02GH/J

RoHS-compliant Product
Advanced Power N-CHANNEL ENHANCEMENT MODE
Electronics Corp. POWER MOSFET

▼ Simple Drive Requirement D BVDSS 25V


▼ Low On-resistance RDS(ON) 9mΩ
▼ Fast Switching Characteristic ID 62A
G
S

Description
Advanced Power MOSFETs from APEC provide the designer with
the best combination of fast switching, ruggedized device design,
low on-resistance and cost-effectiveness. GD
TO-252(H)
S

The TO-252 package is widely preferred for commercial-industrial


surface mount applications and suited for low voltage applications
such as DC/DC converters. The through-hole version (AP72T02GJ)
are available for low-profile applications.
G
D
S TO-251(J)

Absolute Maximum Ratings


Symbol Parameter Rating Units
VDS Drain-Source Voltage 25 V
VGS Gate-Source Voltage ± 20 V
ID@TC=25℃ Continuous Drain Current, VGS @ 10V 62 A
ID@TC=100℃ Continuous Drain Current, VGS @ 10V 44 A
1
IDM Pulsed Drain Current 190 A
PD@TC=25℃ Total Power Dissipation 60 W
Linear Derating Factor 0.4 W/℃
3
EAS Single Pulse Avalanche Energy 29 mJ
IAR Avalanche Current 24 A
TSTG Storage Temperature Range -55 to 175 ℃
TJ Operating Junction Temperature Range -55 to 175 ℃

Thermal Data
Symbol . Value Units
Rthj-c Maximum Thermal Resistance, Junction-case 2.5 ℃/W
4
Rthj-a Maximum Thermal Resistance, Junction-ambient (PCB mount) 62.5 ℃/W
Rthj-a Maximum Thermal Resistance, Junction-ambient 110 ℃/W

Data and specifications subject to change without notice 1


200807177
AP72T02GH/J

Electrical Characteristics@Tj=25oC(unless otherwise specified)


Symbol Parameter Test Conditions Min. Typ. Max. Units
BVDSS Drain-Source Breakdown Voltage VGS=0V, ID=250uA 25 - - V
ΔBVDSS/ΔTj Breakdown Voltage Temperature Coefficient Reference to 25℃, ID=1mA - 0.02 - V/℃
RDS(ON) Static Drain-Source On-Resistance2 VGS=10V, ID=30A - 8 9 mΩ
VGS=4.5V, ID=15A - 11 15 mΩ
VGS(th) Gate Threshold Voltage VDS=VGS, ID=250uA 1 - 3 V
gfs Forward Transconductance VDS=10V, ID=30A - 42 - S
IDSS Drain-Source Leakage Current VDS=25V, VGS=0V - - 1 uA
o
Drain-Source Leakage Current (T j=175 C) VDS=20V ,VGS=0V - - 25 uA
IGSS Gate-Source Leakage VGS= ±20V - - ±100 nA
2
Qg Total Gate Charge ID=30A - 13 21 nC
Qgs Gate-Source Charge VDS=20V - 2.7 - nC
Qgd Gate-Drain ("Miller") Charge VGS=4.5V - 9 - nC
2
td(on) Turn-on Delay Time VDS=15V - 8 - ns
tr Rise Time ID=30A - 80 - ns
td(off) Turn-off Delay Time RG=3.3Ω,VGS=10V - 22 - ns
tf Fall Time RD=0.5Ω - 6 - ns
Ciss Input Capacitance VGS=0V - 930 1490 pF
Coss Output Capacitance VDS=25V - 250 - pF
Crss Reverse Transfer Capacitance f=1.0MHz - 180 - pF
Rg Gate Resistance f=1.0MHz - 1.1 1.7 Ω

Source-Drain Diode
Symbol Parameter Test Conditions Min. Typ. Max. Units
2
VSD Forward On Voltage IS=30A, VGS=0V - - 1.3 V
2
trr Reverse Recovery Time IS=15A, VGS=0V, - 26 - ns
Qrr Reverse Recovery Charge dI/dt=100A/µs - 15 - nC

Notes:
1.Pulse width limited by max. junction temperature.
2.Pulse test
3.Starting Tj=25oC , VDD=25V , L=0.1mH , RG=25Ω , IAS=24A.
4.Surface mounted on 1 in2 copper pad of FR4 board

THIS PRODUCT IS SENSITIVE TO ELECTROSTATIC DISCHARGE, PLEASE HANDLE WITH CAUTION.


USE OF THIS PRODUCT AS A CRITICAL COMPONENT IN LIFE SUPPORT OR OTHER SIMILAR SYSTEMS IS NOT AUTHORIZED.
APEC DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED
HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
APEC RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN.

2
AP72T02GH/J

180 120

10V o
10V
o 7.0V T C =175 C 7.0V
T C =25 C

5.0V

ID , Drain Current (A)


ID , Drain Current (A)

120 80

5.0V 4.5V
4.5V

60 40

V G =3.0V V G =3.0V

0 0
0 2 4 6 8 0 2 4 6 8

V DS , Drain-to-Source Voltage (V) V DS , Drain-to-Source Voltage (V)

Fig 1. Typical Output Characteristics Fig 2. Typical Output Characteristics

35 1.8

I D =30A
I D =15A
V G =10V
T C =25 ℃
Normalized RDS(ON)

25 1.4
RDS(ON) (mΩ)

15 1

5 0.6
2 4 6 8 10 -50 0 50 100 150 200

VGS , Gate-to-Source Voltage (V) T j , Junction Temperature ( o C)

Fig 3. On-Resistance v.s. Gate Voltage Fig 4. Normalized On-Resistance


v.s. Junction Temperature
30 1.8
Normalized VGS(th) (V)

20 1.2

T j =175 o C T j =25 o C
IS(A)

10 0.6

0 0.0
0 0.2 0.4 0.6 0.8 1 1.2 1.4 -50 0 50 100 150 200

V SD , Source-to-Drain Voltage (V) T j , Junction Temperature ( o C )

Fig 5. Forward Characteristic of Fig 6. Gate Threshold Voltage v.s.


Reverse Diode Junction Temperature

3
AP72T02GH/J
f=1.0MHz
12 10000

I D = 30 A
VGS , Gate to Source Voltage (V)

9
V DS = 10 V
V DS = 15 V
V DS = 20 V

C (pF)
6 1000
C iss

C oss
C rss

0 100
0 10 20 30 1 5 9 13 17 21 25 29

Q G , Total Gate Charge (nC) V DS , Drain-to-Source Voltage (V)

Fig7. Gate Charge Characteristics Fig 8. Typical Capacitance Characteristics

1000 1
Normalized Thermal Response (R thjc)

Duty factor=0.5

0.2
100
ID (A)

100us 0.1

0.1
0.05

PDM
0.02
10 t
1ms 0.01
T

T c =25 o C 10ms
Duty factor = t/T

Single Pulse 100ms Single Pulse Peak Tj = PDM x Rthjc + T C

1s
DC
1 0.01
0.1 1 10 100 0.00001 0.0001 0.001 0.01 0.1 1 10

V DS , Drain-to-Source Voltage (V)


t , Pulse Width (s)

Fig 9. Maximum Safe Operating Area Fig10. Effective Transient Thermal Impedance

120 40

V DS =5V

2.8V 3V 3.2V 3.5V 3.8V 4.2V


30
T j =25 o C T j =175 o C
ID , Drain Current (A)

80
RDS(ON) (mΩ )

20

4.5V
40

10 10V

0 0
0 2 4 6 8 0 20 40 60 80 100

V GS , Gate-to-Source Voltage (V) I D (A)

Fig 11. Transfer Characteristics Fig 12. Drain-Source On Resistance

4
ADVANCED POWER ELECTRONICS CORP.
Package Outline : TO-252

D Millimeters
SYMBOLS
MIN NOM MAX
D1
A2 1.80 2.30 2.80
A3 0.40 0.50 0.60
B1 0.40 0.70 1.00
E2
D 6.00 6.50 7.00
D1 4.80 5.35 5.90
E3 3.50 4.00 4.50
E3 F 2.20 2.63 3.05
F1 0.5 0.85 1.20
E1
E1 5.10 5.70 6.30
E2 0.50 1.10 1.80
e -- 2.30 --
C 0.35 0.50 0.65

B1 F1 F

e e 1.All Dimensions Are in Millimeters.


2.Dimension Does Not Include Mold Protrusions.

A2 R : 0.127~0.381

A3 (0.1mm C

Part Marking Information & Packing : TO-252

Part Number
Package Code
meet Rohs requirement
72T02GH
LOGO
YWWSSS Date Code (YWWSSS)
Y:Last Digit Of The Year
WW:Week
SSS:Sequence

5
ADVANCED POWER ELECTRONICS CORP.

Package Outline : TO-251

D Millimeters
A SYMBOLS
c1 MIN NOM MAX
D1 A 2.20 2.30 2.40
A1 0.90 1.20 1.50
B1 0.50 0.69 0.88
B2 0.60 0.87 1.14
E1 E
c 0.40 0.50 0.60
c1 0.40 0.50 0.60
D 6.40 6.60 6.80
D1 5.20 5.35 5.50
A1
E 6.70 7.00 7.30
B2
E1 5.40 5.80 6.20
F e ---- 2.30 ----
B1
F 5.88 6.84 7.80

1.All Dimensions Are in Millimeters.


c 2.Dimension Does Not Include Mold Protrusions.

e e

Part Marking Information & Packing : TO-251

Part Number meet Rohs requirement


for low voltage MOSFET only
72T02GJ Package Code
LOGO
YWWSSS Date Code (YWWSSS)
Y :Last Digit Of The Year
WW :Week
SSS :Sequence