SK6812 3535 RGBW P6 Addressable LED Chip

NEW STAR LED CO.
, LIMITED
Address : 7/ F, Bl l ock A YuShan Industrial Park ,Songb ai Road,ShiYan Town,B ao'An | CN-5 1810 8 Shenz hen
Tel: 0755-29405686 www.newstar-ledstrip.com info@ newstarleds.com
SK6812-3535RGBX-XX-P6
3.5x3.7x1.9mm Top SMD Type 0.25Watt Power

targeted light source Intelligent control LED
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Change History
Date
ELECTROSTATIC
SENSITIVE DEVICES
Rev. No.
S T
Changes/Reason of changes Signature
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2019-05-15 01 Initial Document KAEN ZHU
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* Before using our products, please search our official website to check the
version of specifications. The version of product specifications is updated.
We are sorry to fail to inform you in time. Please refer to the latest
information on the official website.
* The copyright and final interpretation of the product belong to
Newstar LED Co., Ltd. If you have special specifications, please contact
our engineering staff;
*Official website: https://www.newstar-ledstrip.com
1 / 22 Document No.: SPC / SK6812-3535RGBX-XX-P6 Rev. No.: 01
NEW STAR LED CO., LIMITED
CONTENTS
1、 Product overview........................................................................3
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2、 Main Application Field..............................................................3
3、 Description...................................................................................3
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4、 Mechanical Dimensions............................................................... 4
5、 PIN configuration......................................................................... 4
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6、 Recommended dimensions for PCB products............................ 4
7、General description of product naming........................................ 5
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8、 Electrical parameters.................................................................... 5
9、 Electrical/Optical Characteristics................................................. 6
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10、 The IC electrical parameters...................................................... 6
11、 Switching characteristics............................................................ 6
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12、 The data transmission time ........................................................ 7
13 、 Timing waveform..................................................................... 7
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14、 The method of data transmission............................................... 7
15、 The data structure of 24bit.......................................................... 8
16、 The typica l application circuit....................................................8~9
17、Hue Bin Specification for Yellow/Red/Green/Blue....................9
18、 White Color Temperature Ranks................................... ..........10~13
19、 Standard LED Performance Graph.............................................. 14
20、 Packaging Standard....................................................................... 15
21、 Reliability Test..............................................................................16
Appendix 1、 TOP SMD LED Application Notes...............................17-22

1. Product Overview :
SK6812-3535RGBX-XX-P6 is a smart LED control circuit and light emitting circuit in one controlled
LED source, which has the shape of a 3535 LED chip. Each lighting element is a pixel, and the
intensities of the pixels are contained within the intelligent digital interface input. The output is driven
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by patented PWM technology, which effectively guarantees high consistency of the color of the pixels.
The control circuit consists of a signal shaping amplification circuit, a built-in constant current circuit,
and a high precision RC oscillator.
The data protocol being used is unipolar RZ communication mode. The 24-bit data is transmitted
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from the controller to DIN of the first element, and if it is accepted it is extracted pixel to pixel. After an
internal data latch, the remaining data is passed through the internal amplification circuit and sent out
on the DO port to the remaining pixels. The pixel is reset after the end of DIN. Using automatic
shaping forwarding technology makes the number of cascaded pixels without signal transmission only
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limited by signal transmission speed.
The LED has a low driving voltage (which allows for environmental protection and energy saving),
high brightness, scattering angle, good consistency, low power, and long life. The control circuit is
integrated in the LED above.
2. Main Application Field:
equipment etc..
3. Description:
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● Full color LED string light, LED full color module, LED super hard and soft lights, LED guardrail tube,
LED appearance / scene lighting
● LED point light, LED pixel screen, LED shaped screen, a variety of electronic products, electrical
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● Top SMD internal integrated high quality external control line serial cascade constant current IC;
● control circuit and the RGB chip in SMD 3535 components, to form a complete control of pixel, color
mixing uniformity and consistency;
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●built-in data shaping circuit, a pixel signal is received after wave shaping and output waveform
distortion will not guarantee a line;
●The built-in power on reset and reset circuit, the power does not work;
●gray level adjusting circuit (256 level gray scale adjustable);
● red drive special treatment, color balance;
● line data transmission;
● plastic forward strengthening technology, the transmission distance between two points over 10M;
●Using a typical data transmission frequency of 800 Kbps, when the refresh rate of 30 frames per sec

4. Mechanical Dimensions:
S
A R
K
S T Notes:
1. All dimensions are in millimeters.
2. Tolerance is ±0.1mm unless otherwise noted
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5. PIN configuration
Item Symbol Pin Name Function description
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1 NC NC NC
2 GND Ground The signal and power supply and grounding
3 DIN Data Input control signal input data
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4/6 VDD Power power supply pin
5 DOUT Data Output control signal output data
6. Recommended dimensions for PCB
1.40 2.00
0.65
0.45
4 /22 Document No.: SPC / SK6812-3535RGBX-XX-P6 Rev. No.: 01

7. General description of product naming.
SK 6812 3535-RGBX-XX-P6
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① ② ③ ④ ⑤ ⑥
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① ② ③ ④ ⑤ ⑥
Number
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IC series and Photochro
Package of
Series current mic White light code
size support
code Integration feet
Code
The default is to
integrate the
RGB chip with the
IC in the
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Refers to the
68 series IC
6812:12MA
current
version
MINI:
3.5x3.7x1.9m
m contour
S RGBX
(W/A):
Indicates
red, green,
blue, white
(yellow)
XX:
BW Blue White
5500-10000K
NW Natural White
3800-4500K
WS Warm Sunlight
P6: Six
Foot
Products
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5.4x5.0x1.6mm 6805:5MA package
four-color 2700-3200K
package outline current
package GW GOLD White
version
together 2400-2700K
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8. Electrical Parameter（Ta=25℃,VSS=0V） :
Parameter
Power supply voltage
Symbol
VDD
Range
+3.7～+5.5
Unit
V
Logic input voltage VIN -0.5～VDD+0.5 V
Working temperature Topt -40~+80 ℃
Storage temperature Tstg -40~+80 ℃
ESD pressure(HBM) VESD 4K V
ESD pressure(DM) VESD 200 V

9. Electrical/Optical Characteristics:
SK6812MINIRGBX-XX-P6
Color
Dominate avelength(nm)/ Luminance(mc
luminous flux(lm)
Color temperature（k） d)
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Red 620-630 300-500 1.0-2.0
Green 515-530 1000-1500 3.0-4.0
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Blue 460-475 200-400 0.5-1.0
Yellew 580-590 300-500 0.5-1.5
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WHITE 2400-10000K 1500-2200 4.5-6.5
10. The IC electrical parameters (unless otherwise specified, TA=-20 ~ +70 ℃, VDD=4.5 ~
5.5V, VSS=0V):
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Parmeter Symbol Min Typical Max Unit Test conditions
The chip
VDD --- 5.2 --- V ---
supply voltage
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0.7*+
The signal VIH VDD
--- --- V
input flip VDD=5.0V
0.3*+V
threshold VIL --- --- V
DD
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The frequency
FPWM --- 1.2 --- KHZ ---
of PWM
Static power
IDD --- 1 --- mA ---
consumption
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11. Switching characteristics (Ta=25 ℃):
Parameter Symbol Min Typical Max Unit Test conditions
The speed of data The duty ratio of 67%

fDIN --- 800 --- KHZ
transmission (data 1)
DOUT transmission TPLH --- --- 500 ns

DIN→DOUT
delay TPHL --- --- 500 ns
Tr --- 100 --- ns VDS=1.5

IOUT Rise/Drop
Iout R/G/B=9mA
Time
Tf --- 100 --- ns Iout W=18mA

12. The data transmission time (TH+TL=1.25µs±600ns):

Standard
Name Min. Max. Unit
value
T Code period 1.20 -- -- µs
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T0H 0 code, high level time 0.2 0.32 0.4 µs
T0L 0 code, low level time 0.8 -- -- µs
0.58 0.64 1.0
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T1H 1 code, high level time µs
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T1L 1 code, low level time 0.2 -- -- µs
Reset code，low level
Trst
time
>80 -- -- µs
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13. Timing waveform:
Input code: Symbol period T
0 code T0L
T0H
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Connection mode:
1 code
Reset code
D1 D2
T1H
T1L
D3
Trst
D4
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DIN DO DIN DO DIN DO
PIX1 PIX2 PIX3

14. The method of data transmission:
Note: the D1 sends data for MCU, D2, D3, D4 for data forwarding automatic shaping cascade circuit.
7 /22 Document No.: SPC / SK6812-3535RGBX-XX-P6 Rev. No.: 01
15. The data structure of 24bit:

G7 G6 G5 G4 G3 G2 G1 G0 R7 R6 R5 R4
R3 R2 R1 R0 B7 B6 B5 B4 B3 B2 B1 B0
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W7 W6 W5 W4 W3 W2 W1 W0
Note: high starting, in order to send data (G7 - G6 - ...... ..B0)
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16. The typical application circuit:
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In the practical application circuit, the signal input and output pins of the IC signal input and output pins should be connected
to the signal input and output terminals. In addition, in order to make the IC chip is more stable, even the capacitance between
beads is essential back;
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Application: used for soft lamp strip or hard light, lamp beads transmission distance is short, suggested in signal in time the
clock line input and output end of each connected in series protection resistors, R1 of about 500 ohms.
Application: for module or general special-shaped products, lamp beads transmission distance is long, because of different
wire and transmission distance, in the signal in time clock at both ends of the line on grounding protection resistance will be
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slightly different; to the actual use of fixed;
17. Hue Bin Specification for Yellow、Red、Green、Blue
Name
YELLOW
RED
Code
YL1
YL2
HR1
HR2
S Tλd MIN (nm)
585
590
620
625
λd MAX (nm)
590
595
625
630
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BL5 460 465
BLUE
BL6 465 470
PG2 515 520
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GREEN PG3 520 525
PG4 525 530
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18. White Color Temperature Ranks & CIE Color Rank (Refer to CIE 1931 chromaticity diagram)
CIE chromaticity coordinates (ANSI Cool White)
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Name X1 Y1 X2 Y2 X3 Y3 X4 Y4
BW-A 0.2928 0.2822 0.2802 0.2895 0.2885 0.3007 0.3011 0.2934
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BW-B 0.3011 0.2934 0.2885 0.3007 0.302 0.3189 0.3147 0.3116
BW-C 0.3147 0.3116 0.302 0.3189 0.3186 0.3412 0.3313 0.3339
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BW-D 0.3313 0.3339 0.3186 0.3412 0.3326 0.36 0.3449 0.3522
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ANSI Blue White Color bin structures
Newstar Blue White Graph

5500K
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0.36
0.35
6000K
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0.34 BW-D
0.33
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7000K BW-C
0.32
Y
0.31
8300K
0.30 BW-B
10000K
0.29
BW-A
0.28
0.27 0.29 X
0.31 0.33 0.35

CIE chromaticity coordinates (ANSI Natural white)
名称 X1 Y1 X2 Y2 X3 Y3 X4 Y4
N0-A 0.358 0.3445 0.3461 0.3521 0.3531 0.36 0.3651 0.3524
NA-A 0.3651 0.3524 0.3531 0.36 0.3602 0.3679 0.3722 0.3603
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NB-A 0.3722 0.3603 0.3602 0.3679 0.3659 0.3743 0.3779 0.3667
NC-A 0.3779 0.3667 0.3659 0.3743 0.3716 0.3807 0.3836 0.373
ND-A 0.3836 0.373 0.3716 0.3807 0.3773 0.3871 0.3893 0.3794
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NE-A 0.3893 0.3794 0.3773 0.3871 0.3844 0.3949 0.3963 0.3873
ANSI Natural White Color bin structures
0.40
Newstar Natural White Graph
S T 3900-4150K
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0.39
4000-4200K
4050-4200K NE-A
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0.38
4100-4400K ND-A
N
Y
0.37
4200-4500K NC-A
0.36 4400-4750K NB-A
NA-A
0.35
N0-A
0.34
0.34 0.35 0.36 X
0.37 0.38 0.39 0.40

CIE chromaticity coordinates (ANSI Warm White)
名称 X1 Y1 X2 Y2 X3 Y3 X4 Y4
K1-A 0.4344 0.4032 0.4221 0.3984 0.4147 0.3814 0.426 0.3853
K2-A 0.443 0.4212 0.4299 0.4165 0.4221 0.3984 0.4344 0.4032
K3-A 0.4562 0.426 0.443 0.4212 0.4344 0.4032 0.4465 0.4071
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K4-A 0.4465 0.4071 0.4344 0.4032 0.426 0.3853 0.4373 0.3893
L1-A 0.4586 0.4103 0.4465 0.4071 0.4373 0.3893 0.4483 0.3918
L2-A 0.4687 0.4289 0.4562 0.426 0.4465 0.4071 0.4586 0.4103
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ANSI Warm White Color bin structures
0.44
0.43
Newstar Warm White Graph
3200K
2700K
S T
3000K
2800K
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L2-A
0.42 K3-A
K2-A
0.41
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Y
L1-A
K4-A
N
0.40
K1-A
0.39
0.38
0.41 0.42 0.43 0.44 0.45 0.46 0.47
X

CIE chromaticity coordinates (ANSI Warm Lighting)
CA X1 Y1 X2 Y2 X3 Y3 X4 Y4
GA 0.459741 0.3982 0.4548 0.4045 0.4613 0.4096 0.4662 0.4033
GB 0.466212 0.4033 0.4613 0.4096 0.4677 0.4147 0.4727 0.4084
GC 0.472682 0.4084 0.4677 0.4147 0.4742 0.4198 0.4792 0.4135
GD 0.479152 0.4135 0.4742 0.4198 0.4807 0.4248 0.4856 0.4185
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GE 0.485622 0.4185 0.4807 0.4248 0.4872 0.4299 0.4921 0.4236
GA1 0.462676 0.3945 0.4597 0.3982 0.4662 0.4033 0.4693 0.3994
GB1 0.469255 0.3994 0.4662 0.4033 0.4727 0.4084 0.4758 0.4044
GC1 0.475835 0.4044 0.4727 0.4084 0.4792 0.4135 0.4824 0.4093
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GD1 0.482415 0.4093 0.4792 0.4135 0.4856 0.4185 0.489 0.4142
GE1 0.488995 0.4142 0.4856 0.4185 0.4921 0.4236 0.4956 0.4192
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ANSI Warm Lighting Color bin structures
Newstar Golden White Graph
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2500K 2400K
0.43 2600K
GE 2300K
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0.42 2700K GD GE1
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GC GD1
Y
0.41
GB GC1
N
GA GB1
0.40
GA1
0.39
0.45 0.46 0.47 0.48 X 0.49 0.50 0.51
• Color coordinates measurement allowance is ± 0.005

• To order specify color temperature ranks, please contact OPSCO Lighting Holdings LTD. for further information.
• Thermal Pad Temperature @25℃ @ 20mA

19. Standard LED Performance Graph:
T h e r m a l P a d T e m p e r a t u r e v s . R e la t iv e L ig h t O u t p u t
R
120%
B L U E \G R E E N
Normalized Luminous Flux
100%
A
80%
60%
R E D /Y E L L O W
T
40%
20%
0 .0 0
S
0 20 40 60 80 100 120
T h e r m a l P a d T e m p e r a tu r e ( T = 2 5 ° C )
W a v e l e n g t h C h a r a c t e r is t ic s
YELLO W
W
100%
GREEN RED
Relative Emission Distribution
BLUE GW
80%
WS
NW
E
60%
BW
40%
N
20%
0 .0 0
400 450 500 550 600 650 700 750 800
W a v e le n g t h ( n m )
T y p i c a l R a d ia t io n P a t t e r n 120°
0
30°
60°
90°
90 75 60 45 30 15 0 0 .2 0 .4 0 .6 0 .8 1 .0
R a d ia t io n A n g le

20. Packaging Standard:
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SK6812-3535RGBX-XX-P6
C A T H O D E ID E N T IF IC A T IO N
T A P E F E E D D IR E C T IO N
T
COVER TAPE
C A R R IE R T A P E
A
S
R E E L (1 7 8 x 1 2 m m )
(IN N E R 1 0 0 0 p c s L E D M A X )
S M D
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PRODUCT NO.: SK6812-3535RGBX-XX-P6
ESD POLYETHYLENE BAG
Q U A N T IT Y .: 1 0 0 0 P C S
Lot No.: LW2019030902-10
DATE:2019-03-09
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L A B E L S K E T C H IN G
N C A R D B O A R D (IN N E R 4 0 B A G M A X .)
The reel pack is applied in SMD LED. The LEDs are packed in cardboard boxes after packaging in normal or anti-
electrostatic bags. cardboard boxes will be used to protect the LEDs from mechanical shocks during transportation. The
boxes are not water resistant and therefore must be kept away from water and moisture.

21. Reliability Test :
NO. Test item Test Conditions Reference Criterion
R
100 ± 5°C ~ -40°C ±
1 Thermal Shock 5°C MIL-STD-202G 0/22
30min~30min 300 cycles
2
High Temperature
Storage
Low Temperature
Ta= +100ºC
T
1000hrs
JEITA ED-4701
200 201
JEITA ED-4701 A 0/22
S
3 Ta= -40ºC 1000hrs 0/22
Storage 200 202
High Temperature
JEITA ED-4701
4 High Humidity Ta=60ºC RH=90% 1000hrs 0/22
Storage
100 103
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-55ºC~25ºC~100ºC~25ºC
Temperature 30min~5min~30min~5mi JEITA ED-4701
5 0/22
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Cycle n 100 105
100 cycles
Resistance to Tsld = 260°C, 10sec. 3 JEITA ED-4701

6 0/22
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Soldering Heat times 300 301
Room temp Life 25°C, IF: Typical JESD22-A

7 0/22
Test current , 1000hrs 108D
Criteria for Judging the Damage:
Limit
Item Symbol Test Condition
Min Max
Luminous DC=5V, Typical
IV Init. Value*0.7 ---
Intensity current
Resistance to DC=5V, Typical No dead lights or obvious

---
Soldering Heat current damage

APEENDIX 1.TOP SMD LED Application Notes

1. Features
The Purposes of making Newstar’s customers and users to have a clear understanding on the ways how to
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use the LED.
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2. Description
Generally. The LED can be used the same way as other general purposed semiconductors. When using
Newstar’s TOP SMD LED, the following precautions must be taken to protect the LED.
3. Cautions
3.1. Dust & Cleaning
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This emitter has a silicone surface, There are many benefits to the silicone surface in terms of optical
properties and improved reliability. However, silicone is a softer material and prone to attract dust. While a
minimal amount of dust and debris on the LED will not cause significant reduction in illumination, steps
should be taken to keep the emitter free of dust.
These include keeping the LEDs in the manufacturer’s package prior to assembly and storing assemblies in
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an enclosed area after installing the emitters.
Surface condition of this device may change when organic solvents such as trichloroethylene or acetone
were applied.
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Avoid using organic solvent, it is recommended that isopropyl be used as a solvent for cleaning the LEDs.
When using other solvents, it should be confirmed beforehand whether the solvents will dissolve the
package and the resin of not.
Do not clean the LEDs by the ultrasonic. When it is absolutely necessary, the influence as ultrasonic
cleaning on the LEDs depends on factors such as ultrasonic power. Baking time and assembled condition.
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Before cleaning, a pre-test should be done to confirm whether any damage to the LEDs will occur.
3.2. Shipment and storage

TOP SMD LED is a humidity sensor, the LED packaging in the aluminum bag is to avoid the LED in the
transport and storage of moisture absorption, in the bag with a desiccant to absorb the moisture inside
the bag. If the LED absorbs water vapor, then in the LED over reflow, in the high temperature state, into
which the rapid expansion of gas vaporization and produce a greater internal stress, so that the material
crack, layered or damaged bonding wire , Resulting in product failure.
TOP SMD LED with a moisture-proof anti-static aluminum foil bag packaging, handling should avoid the
process of squeezing, piercing the case of bags, and do the necessary anti-static protective measures;
promise products on the line before the leak or broken, Please stop the use of direct use of the product; ,
Resulting in product failure;
Such as before the material has been found to prevent moisture-proof aluminum foil bags have been
opened, damaged, perforated can be returned to the original re-dehumidification, must not be on-line use;
The humidity level of this product is LEVEL5a.

Chart 1:Definition of material’s MSL prescribed by IPC/JEDECJ-STD-020E

Workshop lifespan after open the packaging
Moisture proof
Time condition
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LEVEL1 unlimited ≦30℃/85 % RH
LEVEL2 1 year ≦30℃/60 % RH
LEVEL2a 4 Weeks ≦30℃/60 % RH
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LEVEL3 168 Hours ≦30℃/60 % RH
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LEVEL5a 24 Hours ≦30℃/60 % RH
LEVEL6 Take off and use immediately ≦30℃/60 % RH
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3.3. Storage before unsealing
In order to avoid the reliability failure caused by moisture absorption and dampness, it is necessary to do a
good job of pre-SMT storage and moisture-proof measures for LED products.
3.3.1 If the moistureproof bag is not opened, the storage time of TOP SMD components is less than 2 months
under 30 C/60% RH; (Note: the date of the label is taken as the standard, and the packaging is used without air
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leakage and moisture indicator card moisture-proof beads are not discolored; for different moisture-proof
grade materials or packaging, there are certain differences in the storage time, the specific storage time is
based on specifications or packaging bag tips; It is suggested that the moisture-proof bag should not be
opened at will before assembly.3.3.2 The lamp beads exceeded the effective storage time, but did not exceed
the packaging date for 6 months. Before use, the lamp beads need to be re-dehumidified. Bag removal and
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baking at 70 C/48H or above can be used. After dehumidification, the oven can not be powered off. Take one
roll and stick one roll in the process of using. The unused ones are kept in the oven at 70 C. Not all the
materials can be taken out and put in the workshop. Absolutely not to dehumidify during the day, power off the
oven at night, and then patch the next day (the maximum dehumidification time should not be greater than 96H,
specific dehumidification baking parameters refer to 3.6.2 items.)
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3.3.3 The beads exceed the packing date for 6 months. Please return them to OSCO for processing.
3.3.4 Moisture-proof packaging bags are leaky, perforated or damaged. They can not be used after baking.
Please return them to OSCO for treatment.
3.4. Control after the packing bag is opened
After opening the moisture-proof bag, please read the moisture-proof bag inside the humidity indicator card in
the moisture-proof beads into pink to confirm moisture in the moisture bag is too much, according to the
color of the ball to determine whether the bag material on-line operation; And the material after opening the
package should be strictly controlled in the table 1 as specified by the maximum temperature and humidity
and operating time allowed, as long as the material exposed in the environment described in Table 1, the need
to accumulate its use in the workshop time. Open the bag and paste the material on the PCB board, should be
completed within 0.5H welding work, do not recommend the material attached to the PCB, a long time stay in
the workshop does not carry out SMT work; Caused by adverse water within the lead;
3.5. Definition of humidity card
Open the package after the TOP SMD LED bag inside the humidity card color instructions are as follows:
A. If the moisture card 10% of the moisture-proof beads into pink, other files for the blue, this situation, LED can
be used directly;
B. If the humidity card moisture-proof beads 10%, 20% at all become pink, in fact, the file is blue, this situation,
the need for low-temperature components dehumidification;
C. If the humidity card moisture-proof beads 10%, 20%, 30% more than three are turned pink, in this case, the
customer needs to return the material to our company for high humidity dehumidification, re-packaging
before use;
Humidity indicator DO not change color
A R
S
Humidity indicator tums pink in 10% 20%
T
E W Humidity indicator tums pink in 10% 20% 30%
3.6. Unwanted material moisture-proof storage and moisture-proof control of finished material
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If a roll of SMDs is not used at once and the plant temperature and humidity are within the defined conditions (<30 ° C /
60% RH), the exposure time of the element in the air does not exceed 2H, the remaining material should be carried
out together with the desiccant Vacuum sealed, otherwise, the material must be low-wet baking dehumidification;
dehumidified material can be re-packaged to re-start the calculation time;
Perform moisture control on SMDs components that have been assembled
A. After the components have been assembled to the PCB board no longer need to go through the high temperature
process or reflow process, it will not be special treatment;
B. Do not need to do the necessary dehumidification work before making the appropriate protection process, bake in 70
℃ ± 5 ℃ oven baking for less than 48 hours, To remove the product in the detection and aging process exposed to
moisture in the air to avoid the product in the protective treatment, the package in the material surface of the moisture
will slowly invade the product, will cause product failure (Specific desiccant baking parameters refer to 3.6.2 items);
C. For products that require secondary SMT process or high temperature, they should be subjected to the necessary
moisture treatment before secondary welding, after exposure to (<30 ° C / 60% RH) , The maximum length of not more
than 4H, Connaught second high temperature process separated by a long time, then a welding material must be
necessary dehumidification work (70 ℃ ± 5 ℃ oven baking no less than 48 hours), and then pumping Vacuum storage;
or the first product stored in the oven or with a desiccant container, the second high-temperature process before doing
dehumidification work (70 ℃ ± 5 ℃ in the oven baking no less than 48 hours) , To ensure that products in the high
temperature before the process is not damp (Specific desiccant baking parameters refer to 3.6.2 items);
Low-temperature baking conditions: 70 ° C ± 5 ° C baking not less than 48 hours high temperature baking conditions:
130 ° C ± 5 ° C baking not less than 6 hours (lamp beads must be split into particles)

3.6.2 The relationship between ambient humidity and dehumidification time for low temperature/high temperature dehumidification:
Ambient Oven
baking time Baking method
humidity temperature
40% 70℃ 24H Remove from the static bag

and bake with the reel to
50% 70℃ 48H dehumidify.
R
>60% 70℃ Ineffective dehumidification baking
40% 130℃ 6H Lamp beads must be

dismantled into granules to
A
50% 130℃ 12H bake and dehumidify
3.7. Reflow Soldering Characteristics
In testing, Newstar has found SMD LEDs to be compatible with JEDEC J-STD-020E,using the parameters listed below. As
T
a general guideline Newstar recommends that users follow the recommended soldering profile provided by the
manufacturer of solder paste used.
Note that this general guideline is offered as a starting point and may require adjustment for certain PCB designs and
S
Configurations of reflow soldering equipment.
Critical Zone T L to TP
amp-up
W
L L
Temperature (°C)
s max
MIN
E
Ramp down
ts
(Preheat)
N
T 25°C to Peak
Times
Profile Feature Lead-Based Solder Lead-Free Solder
Average Ramp-Up Rate (Ts max to Tp ) 3℃/second max. 3℃/second max.
Preheat: Temperature Min (Ts min) 100℃ 150℃
Preheat: Temperature Min (Ts max) 150℃ 200℃
Preheat: Time ( ts min to ts max ) 60-120 seconds 60-180 seconds
Time Maintained Above: Temperature (TL) 183 ℃ 217 ℃
Time Maintained Above: Time (t L) 60-150 seconds 60-150 seconds
Peak/Classification Temperature (T P) 215 ℃ 240 ℃
Time Within 5℃ of Actual Peak Temperature ( tp) <10 seconds <10 seconds
Ramp-Down Rate 6℃/second max. 6℃/second max.
Time 25 ℃ to Peak Temperature <6 minutes max. <6 minutes max.
Note: All temperatures refer to topside of the package, measured on the package body surface.

3.8 General design requirements :

. SMT nozzle requirements: (red circle refers to the nozzle diameter)
OK (nozzle diameter is greater than the
A R
NG (nozzle diameter is less than the light
T
light bulb area beads light area)
. Material to take way: with tweezers folder material, can not press the colloid or sharp objects to touch the colloid,
the material can not be stacked;
W S
E
. Products in the PCB layout design, for the soft sheet, and 0.5T below the plate, the pad direction should be
perpendicular to the direction of PCB extension to reduce the PCB board bending stress generated in the LED pin,
N
resulting in LED products Due to stress acting tensile failure;
3.9 Heat Generation:

Thermal design of the end product is of paramount importance. Please consider the heat generation of the
LED when making the system design. The coefficient of temperature increase per input electric power is
affected by the thermal resistance of the circuit board and density of LED placement on the board, as well as
components. It is necessary to avoid in tense heat generation and operate within the maximum rating given in
this specification. The operating current should be decided after considering the ambient maximum
temperature of LEDs
The maximum working temperature of the product is not easy to exceed 60 ° C ( ≤ 60 ° C, refers to the product
pin at the operating temperature)

4.0 Electrostatic Discharge & Surge Current :

Electrostatic discharge (ESD) or surge current (EOS) may damage LED.
Precautions such as ESD wrist strap, ESD shoe strap or antistatic gloves must be worn whenever handling of
LED.
R
IC device signal input and output ports must be connected in series protection resistor to prevent surge or
static shock port caused by product failure;
All devices, equipment and machinery must be properly grounded.
A
It is recommended to perform electrical test to screen out ESD failures at final inspection.
It is important to eliminate the possibility of surge current during circuitry design.
T
4.1 Moisture Proof Package
Cannot take any responsibility for any trouble that are caused by using the LEDs at conditions exceeding
S
our specifications.
The LED light output is strong enough to injure human eyes. Precautions must be taken to prevent looking
directly at the LEDs with unaided eyes for more than a few seconds.
The formal specification must be exchanged and signed by both parties before large volume purchase begins.
W
The appearance and specifications of the product may be modified for improvement without notice.
N E

SK6812 3535 RGBW P6 Addressable LED Chip

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SK6812 3535 RGBW P6 Addressable LED Chip

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NEW STAR LED CO.

3.5x3.7x1.9mm Top SMD Type 0.25Watt Power

2 / 22 Document No.: SPC / SK6812-3535RGBX-XX-P6 Rev. No.: 01

2. Main Application Field:

3 / 22 Document No.: SPC / SK6812-3535RGBX-XX-P6 Rev. No.: 01

Item Symbol Pin Name Function description

6. Recommended dimensions for PCB

4 /22 Document No.: SPC / SK6812-3535RGBX-XX-P6 Rev. No.: 01

7. General description of product naming.

5 / 22 Document No.: SPC / SK6812-3535RGBX-XX-P6 Rev. No.: 01

Green 515-530 1000-1500 3.0-4.0

Yellew 580-590 300-500 0.5-1.5

The speed of data The duty ratio of 67%

DOUT transmission TPLH --- --- 500 ns

Tr --- 100 --- ns VDS=1.5

6 / 22 Document No.: SPC / SK6812-3535RGBX-XX-P6 Rev. No.: 01

12. The data transmission time (TH+TL=1.25µs±600ns):

T0L 0 code, low level time 0.8 -- -- µs

0.58 0.64 1.0

PIX1 PIX2 PIX3

15. The data structure of 24bit:

17. Hue Bin Specification for Yellow、Red、Green、Blue

S Tλd MIN (nm)

PG2 515 520

PG4 525 530

CIE chromaticity coordinates (ANSI Cool White)

BW-C 0.3147 0.3116 0.302 0.3189 0.3186 0.3412 0.3313 0.3339

Newstar Blue White Graph

10 / 22 Document No.: SPC / SK6812-3535RGBX-XX-P6 Rev. No.: 01

CIE chromaticity coordinates (ANSI Natural white)

ANSI Natural White Color bin structures

11 / 22 Document No.: SPC / SK6812-3535RGBX-XX-P6 Rev. No.: 01

CIE chromaticity coordinates (ANSI Warm White)

12 / 22 Document No.: SPC / SK6812-3535RGBX-XX-P6 Rev. No.: 01

CIE chromaticity coordinates (ANSI Warm Lighting)

Newstar Golden White Graph

• Color coordinates measurement allowance is ± 0.005

13 / 22 Document No.: SPC / SK6812-3535RGBX-XX-P6 Rev. No.: 01

19. Standard LED Performance Graph:

14 / 22 Document No.: SPC / SK6812-3535RGBX-XX-P6 Rev. No.: 01

20. Packaging Standard:

15 / 22 Document No.: SPC / SK6812-3535RGBX-XX-P6 Rev. No.: 01

21. Reliability Test :

NO. Test item Test Conditions Reference Criterion

JEITA ED-4701 A 0/22

Resistance to Tsld = 260°C, 10sec. 3 JEITA ED-4701

Room temp Life 25°C, IF: Typical JESD22-A

Criteria for Judging the Damage:

Resistance to DC=5V, Typical No dead lights or obvious

16 / 22 Document No.: SPC / SK6812-3535RGBX-XX-P6 Rev. No.: 01

APEENDIX 1.TOP SMD LED Application Notes

3.2. Shipment and storage

17 / 22 Document No.: SPC / SK6812-3535RGBX-XX-P6 Rev. No.: 01

Chart 1:Definition of material’s MSL prescribed by IPC/JEDECJ-STD-020E

Humidity indicator DO not change color

19 / 22 Document No.: SPC / SK6812-3535RGBX-XX-P6 Rev. No.: 01

40% 70℃ 24H Remove from the static bag

40% 130℃ 6H Lamp beads must be

Average Ramp-Up Rate (Ts max to Tp ) 3℃/second max. 3℃/second max.

Preheat: Temperature Min (Ts min) 100℃ 150℃

Preheat: Temperature Min (Ts max) 150℃ 200℃

Preheat: Time ( ts min to ts max ) 60-120 seconds 60-180 seconds

Time Maintained Above: Temperature (TL) 183 ℃ 217 ℃