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ANSI/TIA-607-C Generic Telecommunications Bonding and BICSI Standards

Grounding (Earthing) for Customer Premises
Mexican Structured Cabling
  TIA-607-C Bonding and Gr ounding
Standards
Grounding and bonding is integral to the reliable performance of both electrical and telecommunications
BICSI-007 Keeps Up with Smart
systems.
Buildings

ANSI/TIA-607-C Generic “Telecommunications Bonding and Grounding (Earthing) for Customer Do I Need an LP-Rated Cable?
Premises” was developed by the TIA TR-42.16 Grounding and Bonding Subcommittee and published in
November, 2015.  This Standard provides basic principles, components, and design of telecommunications Bundling Recommendations for
bonding and grounding that shall be followed to ensure that the telecommunication bonding and gr ounding PoE Applications
systems within a building will have one electrical potential.
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Significant changes from the previous edition include:

Standards Activity Update
Incorporation of the requirements for a structure’s electrical grounding electrode system and the
This PDF lists the latest standards
additional telecommunications grounding electrode system design and testing requirements from TIA-
development activities in TIA, IEEE, ISO/IEC
607-B.1 JTC 1/SC 25/WG 3 (Customer Premises
Addition of the requirements for a telecommunications bonding and gr ounding system for the case when Cabling), IEC SC 48B (Connectors), and
structural metal is used as the telecommunications bonding backbone fr om TIA‑607-B.2 BICSI.
Inclusion of an illustrative example of the generic telecommunications bonding infrastructure in a single »Download PDF

story large building

Addition of recommendations for bonding connections for separately divided systems
New component and design requirements for rack bonding busbars Stay Updated on the Standards

Adoption of a minimum bend radius and angle requirements for bonding conductors Sign up for the Standards Informant E-
Expanded listing of insulated conductors required to be color-coded green Newsletter
New recommendation for a minimum 0.6m (2 ft) grid spacing for mesh bonding networks »Subscribe to RSS

Clarification that patch panels for shielded cabling shall be bonded

Clarification that bonding requirements apply to all metallic telecommunications pathways Sponsored By:
Additional requirement that exothermic two-hole lugs, when used to make connections to the primary
bonding busbar (PBB), be listed

ANSI/TIA-607-C-1 “Addendum 1, Bonding in Multi-tenant Buildings” published in January, 2017 and expands

upon the scope of TIA-607-C to include bonding and grounding requirements in buildings serving more than one
tenant. This Standard describes a common bonding infrastructure for telecommunications equipment providing
shared services and the connection of individual tenant bonding infrastructures to the common bonding
infrastructure when present or to the equipment (power) ground when a common bonding infrastructure is not
present.

ANSI/TIA-607-C Content

Regulatory
Overview of Telecommunication Grounding and Bonding Systems Google Translate
Telecommunications Bonding Componen ts
Design Requirements
External Grounding
Performance and Test Requirements
Annexes addressing Bonding Methods, Grounding Electrodes, Towers and Antennas,
Telecommunications Electrical Protection, Electrical Protection for Operator-Type Equipment Positions,
and Cross Reference of Terms

ANSI/TIA-607-C-1 Content

Overview of the Telecommunications Bonding Infrastructure

 Transmission Requirements
Annexes addressing Reliability Testing of Connecting Hardware, Measurement Requirements, Cabling
and Component Test Procedures, Channel and Permanent Link Configurations with Additional
Connectors and/or Cables, and Length Scaling, and Modeling Configurations

Conductor Bend Radius and Included Angle

The inside bend radius of telecommunications bonding conduct ors terminated at the primary bonding busbar
(PBB) or secondary bonding busbar (SBB) shall have an inside bend radius of 200 mm (8 in).  At other locations,
bends in the bonding conductors should be limited to the greatest practical inside bend radius with a minimum
bend radius of 10 times the bonding conductor diameter recommended. In all cases, the minimum bend r adius
angle shall be 90° or greater.

Grounding Requirements for Shielded versus Unshielded Cabling Systems

The grounding requirements for shielded cabling systems are identical to those specified for unshielded cabling
systems with the exception of the following additional step:

Patch panels for shielded cabling shall be bonded t o the telecommunications bonding system in
accordance with manufacturer instructions

Bonding of the shielded patch panel may be accomplished by connecting a 12 AWG stranded wire from the
ground point (or lug) provided on the patch panel to the rack , cabinet, or enclosure, bonding conductor.

Click here for archive information on ANSI/TIA-607-B.

Posted by Valerie Maguire  

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