Datasheets and Packaging Information for Electronic Parts

Debapratim Ghosh

School of Electrical Sciences

Indian Institute of Technology Bhubaneswar
Autumn Semester–2019

e-mail: debapratim@iitbbs.ac.in

Debapratim Ghosh School of Electrical Sciences, IIT Bhubaneswar

 Overview

I A product datasheet is a document released by the company that manufactures the

product.

I It contains device features, characteristics, internal architecture, application

information, and more.

I A good datasheet tells the user how to use/how not to use the product, without
divulging design secrets!

I Reading datasheets thoroughly before working with the part saves time, efforts, and
in some cases, money!

I Many datasheets are highly detailed. You must develop the skill of knowing what to
look for, quickly!

I Many datasheets are too brief. In such cases, look for other parts, extrapolate, or
become intuitive– read between the lines!

Debapratim Ghosh School of Electrical Sciences, IIT Bhubaneswar

 Organization– Key Sections of a Datasheet

I Overview– it is like an ‘abstract’. Read it to confirm whether this part could be of

your use.

I Key features– indicates some of the important electrical parameters of the part.

I Functional diagram

I Characteristics
* Absolute maximum ratings
* Electrical (AC/DC) characteristics
* Characteristic plots

I Functional information

I Application information– explains how this part can be used for applications.

I Package outline drawings– shows dimensions that help in making a PCB layout.

Debapratim Ghosh School of Electrical Sciences, IIT Bhubaneswar

 Commonly Used Packages for Passive Components
Resistors Capacitors Inductors
Through-hole Through-hole Through-hole

Pitch- defined as the

distance between two pins
Pitch for R/L :∼ 7.5 mm
Pitch for C: 2.54 mm

Debapratim Ghosh School of Electrical Sciences, IIT Bhubaneswar

 Surface Mount Packages for Passive Components
I Through-hole packages need two PCB layers– the top side for component
mounting, and the bottom side for mechanical stability and soldering.
I Such components can be used if PCB size is not a concern, or if the maximum
signal frequency on-board does not exceed 20 MHz.
I If any of the above criteria are not met, it is a good choice to use Surface Mount
Devices (SMD). These are much smaller in size, and use only a single layer for
mounting and soldering.
I As an example, two sample SMD resistor sizes 1206 and 0603, are shown below

I 1206 stands for dimensions 0.01200 × 0.00600 i.e. 120 mils×60 mils (100 = 1000 mils).
I It is better to go for through-hole as far as possible, as SMD procurement is
time-consuming in Bhubaneswar.
Debapratim Ghosh School of Electrical Sciences, IIT Bhubaneswar
 Input Devices– Switches
4-terminal pushbutton
2-terminal pushbutton Slide-switch (SPDT)

Thumbwheel switch DIL-switch (DPDT)

4-terminal dome switch

Debapratim Ghosh School of Electrical Sciences, IIT Bhubaneswar

 Output Devices– LEDs

1206 SMD LED

5 mm LED
3 mm LED

5 × 7 LED matrix 7-segment LED

14-segment LED

Debapratim Ghosh School of Electrical Sciences, IIT Bhubaneswar

 Commonly Used Chip Packages
Dual in-Line (DIL)
I Through-hole
I Pitch 2.54 mm
I Hand-solderable
I Needs a chip base
I Most general purpose
analog and digital chips
Thin-Shrink Small Outline Package (TSSOP)
Small Outline IC (SOIC)
I Surface-mount I Surface-mount
I Pitch 1.27 mm I Pitch 0.65 mm
I Hand-solderable I Hand-solderable
I No chip base needed I No chip base needed
I General purpose chips, I Detectors, memory
data converters chips
Debapratim Ghosh School of Electrical Sciences, IIT Bhubaneswar
 Commonly Used Chip Packages (cont’d..)
Thin Quad Flat Package (TQFP) Quad Flat No-leads (QFN)
Plastic Lead Chip Carrier (PLCC)
I Surface-mount I Surface-mount
I Through-hole
I Pitch 0.4–0.8 mm I Pitch 0.5 mm
I Pitch 1.27 mm
I Hand-solderable I Hand-solderable with
I Hand-solderable
hot air gun
I No chip base needed
I Needs a chip base
I No chip base needed
I Microcontrollers,
I Digital logic blocks
FPGAs I RF circuits

Debapratim Ghosh School of Electrical Sciences, IIT Bhubaneswar