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935
International Journal of Pure and Applied Mathematics Special Issue
2. PRINCIPLE
Thermoelectric systems are solid-state heat
devices that either convert heat directly into
electricity or transform electric power into
thermal power for heating or cooling, such
devices are based on electric effects
involving interactions between the now of
heat and electricity through solid bodies. A
discussion of thermoelectric effects and
devices should start with the most
fundamental phenomena. the Seebeck effect
A related effect( Peltier ettect) was
or thermo power. In the early 1800s, discovered a few years later by Peltier, who
Seebeck observed that if two dissimilar observed that if an electrical current passed
materials were joined together and the through the junction of two dissimilar
junctions were held at different temperatures materials, heat is either absorbed or rejected
at the junction depending direction of the
a voltage difference was developed that was
current. Two objects are considered to be in
proportional to the temperature difference thermal equilibrium if the exchange of heat
.The ratio of the voltage developed to the does not exist when they both are placed in
temperature gradient is related to an intrinsic contact. This fact, objects in the same
property of the materials called the Seebeck temperature are said to be in thermal. This is
called zeroth law of thermodynamics. Two
coefficient or the thermo power. The
objects at different placed in contact
Seebeck coefficient is very low for metals exchange energy in an attempt to establish
and much larger for Semiconductors. thermal. Any work done during this process
is the difference of heat lost by an object and
won by not object. This is the first law of
thermodynamics, in other words, energy are
always conserved.
3. DESIGN
The basic problem, apart from selection of
components, we were faced during the
design phase was the selection of proper
switching mechanism between the working
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International Journal of Pure and Applied Mathematics Special Issue
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International Journal of Pure and Applied Mathematics Special Issue
6. EXPERIMENTAL SETUP
A bottle of water is taken and placed inside
the aluminium cabin. The cabin is kept open
for some times to pass air to cabin. The
temperature sensor is placed inside the bottle
dip in the water to measure the temperature
of water. Now, using the system the water is
cooled from 31’c to 24’c and the time taken
Fig 7.1 Adhesive bondng or glueing
for it is noted. Next, the system in heating
mode, the water is brought to 31’c from
A thermoelectric module is attached to a
24’c.
header/heat sink or an object to be cool is
mounted on to a module by a
7. FABRICATION
thermoconductive glue. The thermal contact
For getting perfect insulation, a cool box
and mechanical durability strongly depend
having thermocol insulation and gaskets is
on glue used. As a rule these are epoxy glue
selected.
with different fillers which are called to
7.1 TEM MOUNTING provide a good thermal conductivity. The
method of adhesive bonding is referred to
The efficiency of thermoelectric module
methods or rigid fixing. Therefore the
assembly as a whole depends on the quality
thermal expansion agreement of contacting
mounting an object to be cooled onto a
materials (ceramics of the module, heat-
thermoelectric module and a thermoelectric
removing surface and a material of a cooled
module onto heat rejecting elements. There
object) is necessary.
are three widely applied methods that can be
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