ANSYS Electronics

What's New in ANSYS Electronics 2019 R1
The What's New documents for ANSYS Electronics provide release information for the following:
l ANSYS Electronics Desktop

o ANSYS HFSS and ANSYS HFSS 3D Layout
o ANSYS EMIT
o ANSYS Maxwell
o ANSYS Q3D Extractor
o ANSYS Icepak
o ANSYS Circuit
o ANSYS Twin Builder
l ANSYS SIwave
1
What's New in ANSYS Electronics Desktop
2019 R1
ANSYS is pleased to provide a great number of new and advanced features in ANSYS Electronics
Desktop (AEDT). The new features have been developed with guidance from our most innovative
customers. These advancements deliver solutions to amplify your engineering effectiveness,
simulate your most complex electronic design challenges, and accelerate your time to market.
The Electronics Desktop provides highly integrated electromagnetic simulators, circuit/system

simulation, ECAD links, and compliance reporting.
The single desktop allows users to insert and co-simulate among the following design types:
l ANSYS HFSS and ANSYS HFSS 3D Layout

l ANSYS Maxwell
l ANSYS Q3D Extractor
l ANSYS EMIT
l ANSYS Icepak
l ANSYS Circuit
l ANSYS Twin Builder
Advanced integration allows users to insert HF/SI and EM analysis into projects that co-exist, with
drag-and-drop dynamic links between electromagnetic simulation, circuit simulation, and system
simulation for simple problem setup and reliable performance.
2
What’s New in Circuit 2019 R1
HFSS 3D Layout
l Enhancements for Layout-based design; PCBs, packages and on-chip RFIC
o New Stackup Wizard allows for easy definition and exploration of stackup layers and
impedances; includes embedded impedance calculator and synthesis
o Improved lump port de-embedding; support for non-rectangular port geometries
o Improved mesh assembly for HFSS 3D Components in Layout
o Via clustering and stackup simplification for RFIC
o PML support for HFSS 3D Layout ABC
SI Circuit
l Added frequency-dependent voltage and current sources
l Bathtub curve extrapolation improved for QuickEye, VerifEye, and AMI analyses
Help
l Documentation PDFs are now available in the Help subfolders after you install 2019 R1 and
are also accessible from the Help menu
Selected Defect Corrections for Circuit 2019 R1
l DE176798 Resolved performance issue with saving ACIS SAB files with large number of
objects
l DE180829 3D Layout excitation information is now pushed to the correct ports
Known Issues and Limitations for Circuit 2019 R1
The following items describe specific issues known at the time of release. Workarounds for these
items, if available, are included in the respective descriptions. Inclusion in this document does not
imply the issues and limitations are applicable to future releases. Go to the ANSYS Customer
Portal (https://support.ansys.com/portal/site/AnsysCustomerPortal) for information about service
packs and any additional items not included in this document.
l DE180157 DC and Transient convergence difficulty in power-electronics circuits which

include many behavioral nonlinear models
3
What’s New in ANSYS EMIT 2019 R1
ANSYS 2019 R1 introduces a new EMIT design type (beta) in ANSYS Electronics Desktop for
simulating radio frequency interference (RFI) problems in complex environments. The new
features have been developed with guidance from our most innovative customers. These
advancements deliver solutions to amplify your engineering effectiveness, simulate your most
complex electronic design challenges, and accelerate your time to market.
EMIT Design (beta) in Electronics Desktop

l New EMIT design type for RFI modeling
l New radio and component library for complex RF system modeling in EMIT
l Dynamic links to HFSS and HFSS 3D Layout designs for wideband coupling
l Integrated analysis and results window for visualizing and troubleshooting RFI problems in
complex environments
4
What’s New in ANSYS HFSS 2019 R1
ANSYS is pleased to provide a great number of new and advanced features in HFSS. The new
HFSS-IE and HFSS SBR+

l Hybrid FEM-IE solver improvements for antenna-radome and automotive radar module-
fascia interaction
o Antenna blockage support for HFSS SBR+
o User defined transmission/reflection boundary for HFSS SBR+
o Faster mesh adapt for FEBI coupled FEM regions
o Improved HFSS-IE solutions with multiple excitations
o Improved HFSS-IE MLFMM solve for geometries with fine geometric detail
HFSS 3D Layout
l Enhancements for Layout-based design; PCBs, packages, and on-chip RFIC
o New Stackup Wizard allows for easy definition and exploration of stackup layers and
impedances; includes embedded impedance calculator and synthesis
o Improved lump port de-embedding; support for non-rectangular port geometries
o Improved mesh assembly for HFSS 3D Components in Layout
o Via clustering and stackup simplification for RFIC
o PML support for HFSS 3D Layout ABC
HPC
l Improved HPC cluster and cloud simulation performance and management
o Non-graphical script execution
o Model validation runtime improvements
o Cached validation settings; auto skip validation for currently validated projects
Meshing and Performance
l Improved dependent mesh solve; run frequency sweep directly from imported mesh
l Improved speed for field recovery in HFSS FEM
l Improved performance for 3D encrypted components; faster loading and rendering with
smaller memory footprint
l Meshing improvements; improved mesh robustness and feedback
5
HFSS 2019 R1
Help
Selected Defect Corrections for HFSS 2019 R1
objects
Known Issues and Limitations for HFSS 2019 R1
l DE182856 Application error on failure to load libHfssSbrPlus.so with "libXext.so.6:

undefined symbol: _XEatDataWords" - Use environment variable ANS_SKIP_MWLIBX11_
PATH=1.
6
What’s New in ANSYS Icepak 2019 R1
ANSYS is pleased to provide a great number of new and advanced features in Icepak. The new
Icepak Design in Electronics Desktop

l Two-way electromagnetic loss coupling for HFSS 3D, Q3D, and Maxwell design types
l Import of Icepak archived projects (.TZR)
l DCIR loss coupling to SIwave solver in 3D Layout design
l Streamlined solution workflow with combined settings in analysis setup
l Modeling of temperature-dependent boundary conditions using design datasets
l Modeling of spatially varying boundary conditions using 3D design datasets
l Support for PCB objects in rotated coordinate systems
l Added capability to enforce 2D cut cell meshing in a specified coordinate direction
l Simplified stair-step meshing
l CAD fan objects can be identified and simplified to Icepak components
Help
Selected Defect Corrections for Icepak 2019 R1
objects
l DE176806 Heat flow reports of 2D source surfaces are now accurate for setups involving
radiation
l DE181466 Surface material properties are now accurately accounted for while modeling
radiation of source BCs
Known Issues and Limitations for Icepak 2019 R1
7
Icepak 2019 R1
l If you are importing .tzr on the CentOS or Redhat platform and a pop up shows that the
project loading failed, install libXScrnSaver as root user by using the following command:
yum install libXScrnSaver
8
What’s New in ANSYS Maxwell 2019 R1
ANSYS is pleased to provide a great number of new and advanced features in Maxwell. The new
Fast Electromagnetically Excited Acoustic Noise and Vibration Modeling for Electrical
Machine Design
l Efficient distributed multiple speed magnetic transient simulation
l Enhanced object-based and element-based multi-load force mapping
l Waterfall diagram generation as a measure of Equivalent Radiated Power for speed versus
frequency characteristics through an improved coupling interface with Harmonic Response
through Workbench
Optimization Workflow Enhancements
l New licensing option to distribute variations of Maxwell 2D design with solver license; added
the option to use either DSO (as legacy) or solver licensing to enable distributed design
points
Enhanced Usability of Electrical Machine Design
l Importing CAD and/or loading an existing Maxwell design into RMxprt workflow to
automatically generate complete 2D/3D transient designs
l Post-processing enhancements:
o Integration of customized Maxwell post-processing capabilities to compute electrical
machine characteristics (e.g., efficiency, power factor, power balance, transient d-q
characteristics)
o Full 2D/3D model field visualization with symmetrical model simulation
o “Save Field Time Step” parametrization
o Implementing “Periodic Time-Decomposition-Method (TDM)” as default option for
electrical machine design toolkit (efficiency/loss map extraction)
HPC Enhancements
l Implementation of DDM (Domain-Decomposition-Method) in 3D eddy-current solver
o Support MPI-based and shared memory parallelization
Mesh Enhancements
l Mesh density control
l 2D Cut edge mesh operation
9
Maxwell 2019 R1
Help
Selected Defect Corrections for Maxwell 2019 R1
objects
l DE177323 Fixed temperature feedback link issue in Maxwell 3D DC conduction Solver
Known Issues and Limitations for Maxwell 2019 R1
l DE182880 Maxwell 3D Electrostatic calculates incorrect capacitance with multiple touching

floating objects in domain. Workaround: A manual calculation in the calculator does provide
the correct result and agrees with the analytical result. Uniting all of the floating parts into a
single piece of metal will then also provide the correct result.
10
What’s New in ANSYS Q3D Extractor 2019 R1
ANSYS is pleased to provide a great number of new and advanced features in Q3D Extractor. The
new features have been developed with guidance from our most innovative customers. These
Q3D Extractor
l Improved HPC capability, allowing distributed frequency points and nets for the CG solver
l Improved messaging for power and ground nets during SI solutions
Q3D Extractor CPA
l Allow CPA Q3D solves to be run with Windows and Linux schedulers
l Enabled CPA Q3D dielectric extent control
l Enabled batch CPA solves through Python scripting and EDB
Help
Selected Defect Corrections for Q3D Extractor 2019 R1
objects
11
What’s New in ANSYS SIwave 2019 R1
ANSYS is pleased to provide a great number of new and advanced features in SIwave. The new
SIwave EMI Workflow

l EMI Scanner can quickly scan entire design for rule violations that could cause EMI
problems
l Electromigration Analysis uses Black's Equation to utilize current and temperature to predict
high-risk MTTF regions
Accuracy Improvements
l Advanced coupling detection algorithm extended to crosstalk scanner
l Improved near and far-field computational accuracy
Workflow Improvements
l HFSS Regions in SIwave improved to allow distributed solver and frequency sweeps, as
well as clipping cleanup
l SIwave DCIR solver now available in 3D Layout
l SIwave PSI solver distribution and workflow improved
Help
l Documentation PDFs are now available in the Help subfolders after you install 2019 R1
Selected Defect Corrections for SIwave 2019 R1
l DE175871 Fixes for Stackup Wizard apply/refresh issues on certain systems
objects
12
What’s New in ANSYS Twin Builder 2019 R1
Twin Builder provides unmatched capabilities for system level design and validation. The new
complex electronic design challenges, and accelerate your time to market. Twin Builder includes all
of the capabilities that were part of ANSYS Simplorer. For details about migrating from Simplorer,
please contact your sales team.
Model Export and Runtime Generation Capabilities for Digital Twins

l Twin Builder can now compile, export and import a cross-platform (Windows and Linux)
binary called a Twin file (*.twin) that is deployable to supported IIoT platforms, such as SAP
Leonardo IoT and PTC ThingWorx. This export capability is currently limited to designs
having the following types of models: Modelica, FMUs, SCADE Links, Dynamic ROM (new
feature), Static and DXROMs, State-space ROMs (Icepak ROM, Mechanical ROM, etc.)
l Additionally, Twin Builder can also export a single co-simulation as slave FMU for the
supported model types and their combinations as defined above
l State-space ROMs can now also be exported as a model exchange or co-simulation FMU
New Dynamic ROM Builder
l Introducing the Dynamic ROM Builder, a machine learning based tool for creating Reduced-
Order Models for non-linear dynamic systems in Twin Builder
l A number of performance and UI improvements for Static ROM viewer
Modelica Standard and Workflow Enhancements
l New add-on Modelica library ANSYS Twin Builder Fluid Power Library, to build hydraulic
and pneumatic applications, is now available for purchase
l Added support for Arrays for Modelica models
l Add-on functionality for generation of cross-platform (Windows and Linux) FMUs for
Modelica models
l Added a number usability enhancements for Modelica Editor including the ability to show
Modelica model text in a new Model Editor tab
l Added the ability to update properties and graphics of legacy Modelica diagrams
l Modelica tutorials are now available in the help system too
Device Characterization
l Added new fast Average IGBT/MOSFET library component
l Updated the existing Basic Dynamic Device models and examples
13
Twin Builder 2019 R1
IEEE VHDL-2008 Encryption

l Added the ability to encrypt/decrypt VHDL models based on IEEE VHDL-2008 Encryption
Usability and Performance Enhancements
l Support for latest version of Matlab/Simulink 2018 a/b for co-simulation and export
l Added support for script commands for placing and rotating page ports
l Improved the page port behavior as Page Port name property stays in the center on rotating
l To prevent errors, the wires are renamed automatically to a different name when Page
Ports are deleted
l Refactored the compiler options for Model Editors
Help
Selected Defect Corrections for Twin Builder 2019 R1
l DE177507 Create SubCircuit from Selection Area now works if wires are crossing the area
14
Selected Defect Corrections 2019 R1
Selected Defect Corrections for 2019 R1

Circuit
objects
HFSS
objects
Icepak
objects
l DE176806 Heat flow reports of 2D source surfaces are now accurate for setups involving
radiation
l DE181466 Surface material properties are now accurately accounted for while modeling
radiation of source BCs
Maxwell
objects
l DE177323 Fixed temperature feedback link issue in Maxwell 3D DC conduction Solver
Q3D Extractor
objects
SIwave
l DE175871 Fixes for Stackup Wizard apply/refresh issues on certain systems
objects
Twin Builder
l DE177507 Create SubCircuit from Selection Area now works if wires are crossing the area
15
Known Issues and Limitations 2019 R1
Known Issues and Limitations 2019 R1

Circuit
l DE180157 DC and Transient convergence difficulty in power-electronics circuits which
include many behavioral nonlinear models
Electronics Desktop
l DE182856 Application error on failure to load libHfssSbrPlus.so with "libXext.so.6:
undefined symbol: _XEatDataWords" - Use environment variable ANS_SKIP_MWLIBX11_
PATH=1.
Icepak
l If you are importing .tzr on the CentOS or Redhat platform and a pop up shows that the
project loading failed, install libXScrnSaver as root user by using the following command:
yum install libXScrnSaver
Maxwell
l DE182880 Maxwell 3D Electrostatic calculates incorrect capacitance with multiple touching
floating objects in domain. Workaround: A manual calculation in the calculator does provide
the correct result and agrees with the analytical result. Uniting all of the floating parts into a
single piece of metal will then also provide the correct result.
16
R19.2


l ANSYS Maxwell
l ANSYS Icepak
l ANSYS Circuit
17
What’s New in Circuit R19.2
Circuit Solving
l HSSL, PAM-4; PAM4 for transient
l IBIS-AMI; Accept legacy PKG files for package modeling (BIRD158)
l Improve LNA for CPMs with large number of nodes and/or ports
l Plot IV Curves for active components
l Variable block on schematic
l DC-IV Characteristics Transistor Example
Selected Defect Corrections for Circuit R19.2
l DE166511 3D Gain plots now show correct max gain values when the plot gain scale is
adjusted
l DE170534 HFSS Dynamic links now supports lumped port de-embedding
l DE171085 Moving an X-marker in a rectangular plot while simulation is running now works
correctly
l DE173067 Gerber Import now supports folder selection and zip file selection
l DE173204 Statistical Setup now works correctly
Known Issues and Limitations for Circuit R19.2
l On Linux systems in some VNC products, ANSYS Electronics Desktop displays black boxes
in the ribbon and has trouble loading *.aedt projects; problem is caused by default frame
buffer pixel depth being 16-bit and solution is to invoke vncserver with option "-depth 24"
l DE172805 When passivity is enforced, a good state-space fit to the S-parameters may still
have poor accuracy in the Z-parameters at low frequencies
18
What’s New in ANSYS HFSS R19.2
HFSS
l Improved lower frequency port solving
l Improved performance for solutions with dielectric IE regions
l N-port circuit element/S-parameter model
l TAU mesh support for IE regions. Improves mesh quality for canonical geometries
l Feedback highlighting of problem areas in 3D modeler reported by mesher
l Animated modeler zoom. Real-time zoom in and out to selected objects and views
l 3D modeler and fields animation from parametric setup
l 3D uniform sphere far field plots with color scaling
HFSS SBR+ Solution Type
l Ability to define ports as Tx/Rx
l Ability to obtain S-parameters from linked HFSS designs
l Lightweight modeling for STL imported geometry
l Ability to simulate directly from geometry facets
HFSS 3D Layout
l Enhanced low frequency sweep interpolation and DC extrapolation
l Consistent HFSS workflows for far/near field post-processing
l Near field and radiated emissions post-processing for HFSS results
l Static Field Lumped Port Solver
l Solve Lumped Ports Without Transfinite Elements
l Interpolation Sweeps; Better Low Frequency
New Skin Depth Seeding Documentation
l New Skin Depth Seeding getting started guide provides information about using the mesh
operation feature of solvers including HFSS and Maxwell 3D
Selected Defect Corrections for HFSS R19.2
l DE170356 Inconsistencies in s-param results for R19.1 and R19.0 are corrected
19
HFSS R19.2
correctly
l DE171838 RCS values are now reported correctly for design with Floquet ports
l DE172859 Auto HPC solving of domain project containing sweep now works correctly
Known Issues and Limitations for HFSS R19.2
l DE176798 ACIS export (.sat, .sab) from the modeler menu may be slow for a large model
with several thousand objects
20
What’s New in ANSYS Icepak R19.2
Icepak Design within ANSYS Electronics Desktop

l Ability to compute thermal impact from multiple linked sources; designs can be any
combination of HFSS, Maxwell, or Q3D
l Direct IDF import into a design with the ability to filter components based upon type, size,
power, etc.
l Addition of Network boundary condition for the modeling of RC-type thermal networks
l Grill and Opening detection and boundary creation available from imported MCAD geometry
l Native components, fans, blowers, and heatsink can be made independent and editable
l Animated modeler zoom; real-time zoom in and out to selected objects and views
Icepak ECAD Workflow
l IPC-2581 layout import improved
New Icepak Coupling Documentation
l Getting Started with Icepak: Waveguide Filter provides a workflow to analyze an HFSS
project, calculate surface losses, and create and solve an Icepak design based on the same
geometry
l Getting Started with Icepak: Coil and Plate provides a workflow to assign an excitation in a
Maxwell design and create and solve an Icepak design based on the same geometry
Selected Defect Corrections for Icepak R19.2
l DE166831 Mesh generation and solution can now be completed after creating BGA from
Icepak library
l DE167486 PCB component objects names are now read only in Icepak design and will be
synchronized with layout
l DE169664 Archiving AEDT project with SpaceClaim link succeeds even when SC file is not
present
l DE170798 "Do not solve inside" block power is now written correctly to the solver input file
21
Icepak R19.2
correctly
l DE171292 Adiabatic wall boundary condition is now working correctly
l DE173295 Solve inside flag for objects copied into Icepak design is now the default
Known Issues and Limitations for Icepak R19.2
l ANSYS Icepak models from imported Cadence geometry through AnsoftLinks and ANSYS
ALinks may be disrupted. Direct import of .mcm, .sip, and .apd files is no longer available
22
What’s New in ANSYS Maxwell R19.2
Maxwell
l Support even number of slices for skew model (2D only)
l Provide with core loss manufacturing effects parameter identification capabilities within
material assignment panel
HPC-TDM (Time Decomposition Method)
l Support two 3D transient designs link (as source-target)
l Support half-periodic TDM in both 2D and 3D transient solvers
Mesh
l 3D Clone Mesh for electrical machine simulation for both moving and stationary parts
New Skin Depth Seeding Documentation
l New Skin Depth Seeding getting started guide provides information about using the mesh
operation feature of solvers including HFSS and Maxwell 3D
Selected Defect Corrections for Maxwell R19.2
adjusted
l DE166888 RMxprt is able to create AC winding arrangement starting at arbitray slot
l DE170150 TDM is applicable to coreloss computation for large projects
l DE171452 For Maxwell 2D transient, core losses add an option to report coreloss for
individual objects using ferrite
l DE171744 Impedance boundary works when anisotropic conductivity and winding are
involved
23
Maxwell R19.2
Known Issues and Limitations for Maxwell R19.2
in the ribbon and has trouble loading *.aedt projects. Problem is caused by default frame
buffer pixel depth being 16-bit. Solution is to invoke vncserver with option "-depth 24".
24
What’s New in ANSYS Q3D Extractor R19.2
Q3D Extractor
l Thermal link to Icepak design type can exist in multiple Q3D Designs
Q3D Extractor CPA
l DC-CG extraction is now supported in SIwave-CPA
Selected Defect Corrections for Q3D Extractor R19.2
adjusted
correctly
Known Issues and Limitations Q3D Extractor R19.2
25
What’s New in ANSYS Twin Builder R19.2
ANSYS is pleased to announce a new product: Twin Builder. Twin Builder provides unmatched
capabilities for system level design and validation. Twin Builder includes all of the capabilities that
were part of ANSYS Simplorer. For details about migrating from Simplorer, please contact your
sales team.
Static Reduced Order Modeling (ROM) Visualization

l Visualize 3D geometry and mesh of Static ROM directly in the Twin Builder
l Visualize simulation results like velocity and flow rate directly on 3D geometry
Modelica Diagram Editor Enhancements
l Support for Modelica’s annotation based parameter tabs in the Property Editor
l Support for display units in the Property Editor for Modelica blocks
l UI support for adding parameter modifiers and selecting replaceable parameters for
Modelica blocks
l UI support to parameterize Modelica sub-models using the Property Editor
l Support for Table block that includes UI based text entry, Modelica code, and data file import
Twin Builder Usability Enhancements
l UI and usability enhancement for multi-column data import
l User can enter exact time in Replay Simulation
Device Characterization Improvements
l Circuit plot for IGBT test circuit can be viewed in Device Characterization UI
l Option to add reverse recovery measurements as goals in the basic dynamic model
extraction
l Add capability of power diode measurement in "SC_Measurement" component
Modelica Tutorial
l New PDF tutorial for getting started with Modelica-based libraries using Twin Builder. The
tutorial can be accessed from the Twin Builder PDFs help page.
Modelica Library for Battery Cell Modeling
l Added new Modelica library for battery cell modeling. The library includes four templates for
Equivalent Circuit Models (ECM) with SOC or SOC-Temperature dependency.
Enhancement for Solving Feedback Loop for AC Analysis
l Enhancements added for AC analysis to effectively solve block diagrams and circuit
components (like state-space component) connected in the same feedback loop.
26
Twin Builder R19.2
Simplorer Design Transitions to Twin Builder Design

l The functionality of Simplorer designs has been transitioned to Twin Builder designs. The
Insert Simplorer Design command has been changed to Insert Twin Builder Design; and the
default design name is now TwinBuilder.
Selected Defect Corrections for Twin Builder R19.2
correctly
27
Selected Defect Corrections R19.2
Selected Defect Corrections for R19.2

Circuit
adjusted
correctly
l DE173067 Gerber Import now supports folder selection and zip file selection
HFSS
l DE170356 Inconsistencies in s-param results for R19.1 and R19.0 are corrected
correctly
l DE171838 RCS values are now reported correctly for design with Floquet ports
l DE172859 Auto HPC solving of domain project containing sweep now works correctly
Icepak
l DE166831 Mesh generation and solution can now be completed after creating BGA from
Icepak library
l DE167486 PCB component objects names are now read only in Icepak design and will be
synchronized with layout
l DE169664 Archiving AEDT project with SpaceClaim link succeeds even when SC file is not
present
l DE170798 "Do not solve inside" block power is now written correctly to the solver input file
correctly
l DE171292 Adiabatic wall boundary condition is now working correctly
l DE173295 Solve inside flag for objects copied into Icepak design is now the default
Maxwell
adjusted
l DE166888 RMxprt is able to create AC winding arrangement starting at arbitray slot
l DE170150 TDM is applicable to coreloss computation for large projects
28
l DE171452 For Maxwell 2D transient, core losses add an option to report coreloss for
individual objects using ferrite
l DE171744 Impedance boundary works when anisotropic conductivity and winding are
involved
Q3D Extractor
adjusted
correctly
SIwave
l DE167089 CPA simulation robustness improvements
l DE169058 Improved S-parameter model placement flexibility in SIwave
l DE170874 Improvements to fidelity of 3D MCAD model export
l DE171688 SIwave-Icepak link component handling improvements
l DE171953 Enhancements to SIwave scripting API
l DE174107 HFSS region simulation robustness and flexibility improvements
l DE174254 Improvements to design sanitization in SIwave
Twin Builder
correctly
29
Known Issues and Limitations R19.2

Circuit
l DE172805 When passivity is enforced, a good state-space fit to the S-parameters may still
have poor accuracy in the Z-parameters at low frequencies
HFSS
Icepak
l ANSYS Icepak models from imported Cadence geometry through AnsoftLinks and ANSYS
ALinks may be disrupted. Direct import of .mcm, .sip, and .apd files is no longer available
Maxwell
Q3D Extractor
30
SIwave
l ANSYS SIwave models imported from Cadence geometry through AnsoftLinks and
ANSYS ALinks will be disrupted; direct import of .mcm, .sip, and .apd files is no longer
available
l Stackup Wizard pulls incorrect license
l When units are set to anything other than mm, Layer Stackup Wizard calculates Zdiff
incorrectly and gives an error calculating trace width; workaround is to leave units in mm
while running the solver and change them afterward
31
What's New in ANSYS Electronics R19.1

o ANSYS Circuit
o ANSYS Icepak
o ANSYS Maxwell
o ANSYS Twin Builder
l ANSYS SIwave
32
R19.1


l ANSYS Circuit
l ANSYS Icepak
l ANSYS Maxwell
Core Technology Enhancements

l Hi-resolution image export
l LS-DSO Monitoring: Graphical Progress, Node/task organization
l Windows HPC 2016 Support, Intel MPI Only
33
Circuit Solving
l SERDES workflow introduced that significantly simplifies setting up and verifying
compliance for PCIe3.0 channel virtual compliance simulation
l New algorithm (FASTFIT) introduced for state-space fitter that speeds fitting by 5X or more
with no or modest loss in accuracy
l EMC tool box introduced, with components for electrostatic discharge (ESD) and electrical
fast transient (EFT) generators, linear internal stabilization networks (LISNs), and voltage
regular models (VRMs)
l Improved convergence of DC analysis for parametric simulations and for circuits containing
PSPICE models
l Miscellaneous improvements to SERDES simulations (QuickEye, VerifEye, and AMI)
HFSS 3D Layout
l Volumetric shell elements for efficient power/gnd plane analysis
l De-embedding for circuit ports
l DE133426 Verilog-A examples now run in Windows 10 in AEDT Circuits
l DE167813 TRL components can now be placed in 3D Layout designs
l DE164417 Binaries compiled using VS2015 required an updated ucrtbase.dll to function

properly
34
HFSS SBR+ Solution Type

l Efficient setup and solve for RCS and ADAS simulations
l Parametric Antennas
l Tolerant Meshing
l Accelerated monostatic RCS analysis via solver post-processing
HFSS 3D Layout
l Volumetric shell elements for efficient power/gnd plane analysis
l De-embedding for circuit ports
3D Components
l 3D Component Licensing: Ability to add third-party licensing to encrypted 3D component
models
l Component image links to company and component help web pages
l DE162251 Gain Plot is now comparable between equivalent transient and frequency
domain solution
l DE166207 Coupling results are now correct n the HFSS-Savant workflow with far-field
sources computed from FEBI antennas
l DE166682 New Tolerant SBR+ Meshing performance is now faster for attached model
l DE167752 Mesh generation now completes successfully
l DE167553 Magnetic field is now correct for Eigenmode Solution Type using curvilinear
elements
35
HFSS R19.1

properly
l DE167573 HFSS SBR+ simulation and visual ray trace (VRT) can produce erroneous
Uniform Theory of Diffraction (UTD) rays inside perfectly electrically conducting (PEC)
wedges for overlapping surfaces
36
What’s New in ANSYS Icepak R19.1
Icepak Design within ANSYS Electronics Desktop

Workflow
l Linux and Windows installation
l One-way dynamic Thermal link with HFSS 3D, HFSS 3D Layout, Q3D Extractor, and
Maxwell
l Single material library including thermal, electrical, and mechanical properties
l Scripting (Journaling) in Iron Python and VBS
Native MCAD Environment
l Live SpaceClaim link
l PCB object using 3D Layout
o Stackup editing
o Trace layer visualization
o Metal fraction analyses
l Mesh region and inclined mesh regions
l 3D component creation for Icepak designs
l Numerous improvements in the area of splitting geometric objects, simplifying geometry,
and color-coding geometry
Simulation
l Slider-based meshing controls with optional manual override
o Includes dynamic mesh visualization
l Icepak solution restart (full)
l 3D cut-cell meshing improvements
l Variation distribution and DOE - Optimetrics
l Surface and volumetric dynamic link loss support
l HPC licensing support for parallel solves and distributed variations
l Supported schedulers: LSF, PBS Pro, UGE, and Windows HPC
37
Icepak R19.1
Model Library
l Migrate Icepak vendor libraries to AEDT
o Heat sinks, fans, and BGA packages
models
l Native 3D components: heat sinks, fans (3D and 2D), and PCBs
Post-Processing
l Field plotting and 3D field visualization
l Fields Summary report
l Inclusion of point and surface monitors

properly
l DE166783 When an Icepak design is solved using the distributed solve mode, EM volume
loss results are inaccurate. To ensure accurate EM volume and surface loss results, run the
simulation in serial solve mode.
38
Integrated Motor Solutions

l Multi-Motion Modeling in 3D Transient
o Allow the combination of different motion types in one design (cylindrical rotational
motion, non-cylindrical rotational motion, periodic translational motion and non-periodic
translational motion)
o Typical applications
n Electrical motors, such as multi-rotor motors for optimal performance under different
speed ranges System simulation – normally involving more than one motion
component
n System simulation – normally involving more than one motion component
n Magnetic gears
l Permanent magnet demagnetization analysis based on vector hysteresis modeling
o Hysteresis modeling with specification of initial magnetization direction
o Modeling magnetization and demagnetization processes at the same time
o Consider magnetization/demagnetization in all directions
o Applicable to all nonlinear permanent magnets to model real physics with reasonable
computational cost
l Layer mesh seeding
39
Maxwell R19.1
o Build layer mesh structure along the inward normal to the selected faces of solid bodies
o Layers are protected through pass refinement
o Elements stretched parallel to faces
o Compressed in the normal direction
o Getting faster to the right answers - convergence on total energy and adaptive
refinement energy
3D Components
models
l DE163496 Harmonic Force Calculation now performs correctly using TDM
l DE163915 Maxwell "DC with insulator field" solution type now supports thermal coupling
l DE164827 Solver completes correctly when both laminated nonlinear material and iterative
matrix solvers are used
l DE166432 2D Extractor RL solver now shows positive loss and right R values when
magnetic loss tangent exists

properly
40
ANSYS Q3D Extractor Improvements

Workflow
l One-way thermal link with Icepak within Electronics Desktop

Q3D 3D Components

models
l Component image links to component help site
Meshing
l Improved advanced mesher options

CPA Improvements
l Ability to visualize partitions in SIwave-CPA when utilizing Q3D

Known Issues and Limitations Q3D Extractor R19.1

properly
41
What’s New in ANSYS SIwave R19.1
SIwave Solver Technologies

l SIwave with HFSS Regions
l Improved DC Solver performance
SIwave Workflow Improvements
l Improved SPICE and S-parameter model handling for non-graphical solves
l Faster ACIS model export
l SIwave-CPA
o Ability to visualize partitions when utilizing Q3D
o Enhancement to Export loop RLGC
SIwave Ease-of-Use
l Enhancements to Time Domain Crosstalk post-processing for near-end and far-end
voltage, providing better and faster experience across platforms
Selected Defect Corrections for SIwave R19.1
l DE161486 HFSS Regions simulation capability now handles a wider variety of geometry
and port configurations
l DE166287 Meshing and defeaturing thresholds are set appropriately when importing third-
party designs or EDBs
l DE166896 HFSS coaxial port generation improved for pins belonging to true cylinder
bondwires
Known Issues and Limitations for SIwave R19.1
l DE164417 Binaries compiled using VS2015 require an updated ucrtbase.dll to function

properly
42
What’s New in ANSYS Twin Builder R19.1
ANSYS is pleased to announce a new product: Twin Builder. Twin Builder provides unmatched
capabilities for system level design and validation. Twin Builder includes all of the capabilities that
were part of ANSYS Simplorer. For details about migrating from Simplorer, please contact your
sales team.

l Easily select parameters and outputs to expose through the model hierarchy
l Significantly improved interactive performance for large compiled Modelica models and
imported FMUs
l Improved editing capabilities for large data sets, etc.
Modelica Libraries and Applications
l Enable use of an external solver for Modelica models
l Additional fluid connectors and improved examples for physical connector library, which
allows energy conserving connections between Modelica models and other Twin Builder
connectors
l New Heating and Cooling library installer available on the ANSYS App Store - purchase
licenses separately
l New EKM Model Import toolkit available on the ANSYS App Store
Several Performance and Usability Enhancements
l Support for RLGC link and better defaults for Maxwell and Q3D links
l Bus connector support for subsheet
Selected Defect Corrections for Twin Builder R19.1
l DE163741 Modelica Model with Acausal2Conservative pin now compiles without
generating additional pins
l DE165209 Resolved errors while importing some FMU models
l DE165640 Spice model internal nets are now available for plotting
Known Issues and Limitations Twin Builder R19.1
43
Twin Builder R19.1
l Creation, Simulation and Export of Functional Mockup Units (FMU) and Modelica models is
available only in the Twin Builder Configuration with the updated Twin Builder Licenses
properly
44

Circuit
l DE133426 Verilog-A examples now run in Windows 10 in AEDT Circuits
l DE167813 TRL components can now be placed in 3D Layout designs
HFSS
l DE162251 Gain Plot is now comparable between equivalent transient and frequency
domain solution
l DE166207 Coupling results are now correct n the HFSS-Savant workflow with far-field
sources computed from FEBI antennas
l DE166682 New Tolerant SBR+ Meshing performance is now faster for attached model
l DE167553 Magnetic field is now correct for Eigenmode Solution Type using curvilinear
elements
Maxwell
l DE163496 Harmonic Force Calculation now performs correctly using TDM
l DE163915 Maxwell "DC with insulator field" solution type now supports thermal coupling
l DE164827 Solver completes correctly when both laminated nonlinear material and iterative
matrix solvers are used
l DE166432 2D Extractor RL solver now shows positive loss and right R values when
magnetic loss tangent exists
SIwave
l DE161486 HFSS Regions simulation capability now handles a wider variety of geometry
and port configurations
l DE166287 Meshing and defeaturing thresholds are set appropriately when importing third-
party designs or EDBs
l DE166896 HFSS coaxial port generation improved for pins belonging to true cylinder
bondwires
Twin Builder
l DE163741 Modelica Model with Acausal2Conservative pin now compiles without
generating additional pins
l DE165209 Resolved errors while importing some FMU models
l DE165640 Spice model internal nets are now available for plotting
45
46


properly
HFSS
l DE167573 HFSS SBR+ simulation and visual ray trace (VRT) can produce erroneous
Uniform Theory of Diffraction (UTD) rays inside perfectly electrically conducting (PEC)
wedges for overlapping surfaces
l DE150117 Linux exception when updating two or more design points (Workaround: setting
environment variable CADINTEG_RESTART_PM2ANSOFT=1 will fix this)
Icepak
l DE166783 When an Icepak design is solved using the distributed solve mode, EM volume
loss results are inaccurate. To ensure accurate EM volume and surface loss results, run the
simulation in serial solve mode.
Twin Builder
l Creation, Simulation and Export of Functional Mockup Units (FMU) and Modelica models is
available only in the Twin Builder Configuration with the updated Twin Builder Licenses
What's New in ANSYS Electronics R19.0


o ANSYS Circuit
o ANSYS Icepak (Beta)
o ANSYS Maxwell
o ANSYS Simplorer
l ANSYS SIwave
47
R19.0
ANSYS is particularly pleased to release the first exposure of RCS analysis in HFSS using the
SBR+ technology in AEDT.
In addition, two very significant changes have been made to our High Performance Computing
(HPC) solution.
l All core solver technologies utilize four (4) cores without HPC License Checkout providing
faster solutions. HPC products add on top of these four cores.
l We have unified the electronics high performance computing (eHPC) with the ANSYS HPC
licenses. AEDT solvers can now optionally use ANSYS HPC or ANSYS eHPC. For
multiphysics applications a single ANSYS HPC license will accelerate all ANSYS products.

simulation, ECAD links, and compliance reporting. (Click here for new features in Simplorer.)

l ANSYS Circuit
l ANSYS Icepak (Beta)
l ANSYS Maxwell
l ANSYS Simplorer
drag and drop dynamic links between electromagnetic simulation, circuit simulation, and system
simulation for simple problem set-up and reliable performance.
Core Technology Enhancements

Desktop
l New Ribbon interface for all Desktop products helps streamline process
o User interface maintains traditional pull-down menus for classic use
48
ANSYS Electronics Desktop R19.0
l Separate Icons for AEDT, SIwave, & Simplorer

l Auto-complete of variable name
l Material enhancements
o Support adding notes
o Add MEGTRON materials
l Optimetrics enhancements
o DesignXplorer sensitivity
o Output units with range functions
l 3D View improvements
o Reliable remote display on Windows
o Reliable Linux rendering without supported GPU
l Reporter enhancements
o Multiple curves per stack in stacked plots
o Improved 3D Polar labels
l ACT upgrade
MCAD
l SpaceClaim link enhancements
o Support “Suppressed for Physics”
o Support new small units supported by SC
o Prefer SCDM over SpaceClaim engineer if both applications are available
l Local editing of 3D component
o Edit component definition without saving file to the disk
o System lib components can now be locally edited
l STL import Using SpaceClaim
o Increased reliability and efficiency
o Options to control geometry processing
l Special selection and show/hide modes
o model/non model, primitive/non-primitive, by material, sheet/solids/lines etc
l Legacy project support for material appearance
l ACIS version updated to R28
SI and RF Circuit Option Enhancements

l ANSYS EMIT Enhancements
o RF Link Budget analysis
l Nexxim simulation of PSPICE netlists
l Improved Transient Circuit Messaging
l Added 128b/130b & 128b/132b encoding schemes
l Added PSPICE Support for Coilcraft power inductors
49
ANSYS Electronics Desktop R19.0
l PAM4 support for IBIS-AMI, QuickEye, and VerifEye

l Nexxim High-Speed Serial Link Solutions
o Support for BIRD 158 in IBIS-AMI simulations
o Added additional RX jitter types for Eye Analyses
n Sinusoidal jitter & DCD jitter
l Improved message display to provide better user experience
l DOE accuracy fitting improvements for Transient Circuit Eye Analyses
l Added Triangular and Sinusoidal Spread Spectrum Clocking components
HPC Enhancements
l Products use four cores with base solver. HPC products adds on to these four.
l Unification of the electronics high performance computing (eHPC) with the ANSYS HPC.
o For multiphysics applications a single ANSYS HPC license will accelerate all ANSYS
products.
o User option to choose legacy Electronics HPC, or ANSYS HPC.
l Remove shared drive requirement for LS-DSO
l Scheduler upgrades
l Job monitoring without direct network connection to compute nodes (R19.x)
50
Enhancements
HFSS 3D Layout
l Added Three-Level Auto HPC
l Improved Phi Meshing Robustness
l Mesh speed improvements through enhancements to mesh pre-processing
l Added the Capacitor Library Browser to 3D Layout
l Added TDR analyses for LNA and Imported solution
l Improved visualization, rendering and performance
l Accuracy of Capacitor Touchstone interpolation improved
l Improved CPM Import into 3D Layout for HFSS & SIwave analysis
l Added Gerber RS274X translation Import
l Top & Bottom surface roughness supported for metal layers in 3D Layout
l DE150990 Exported image from plot now correctly excludes hidden legend
l DE153185 Push excitations to HFSS 3D Layout are now correct
l DE154360 QuickEye no longer shows an unexpected DC shift for single-ended lines (see in
DDR channels)
l DE155400 HFSS 3D Layout design that has HFSS design placed as a component now
successfully solves on Windows HPC and Linux schedulers
l DE157183 Updating VPowerSinusoidal/P_SIN component now netlists correctly
51
Circuit R19.0
l DE157709 Reassigning field plot on new geometry now works correctly

l DE158352 AMI file with properties in a hierarchy now simulates without any errors
l DE160146 Spurious noise (that is, wiggles) in VerifEye Contour plots removed
l DE155896 Nexxim time-domain simulations (for example, Transient and QuickEye

analyses) containing non-causal microwave models (for example, microstrip gap model)
may not work.
l DE159799 Nexxim simulations (usually, the LNA) containing microwave components (e.g.,
elliptic bandpass filter) may not work with glibc versions greater than 2.17.157.
Workarounds: a) set LD_BIND_NOW=1 before launching AEDT command line, or b) use
glibc versions less than or equal to glibc 2.17.157
l DE161330 Recording script for changing Type, Num_Lines or Substrate property in
Component tab can set wrong Component on playback (Workaround: Record changing
Component property to correct value)
l DE161966 Nexxim simulations (usually, the transient analysis) containing Verilog-A
components do not work in Windows 10 (Workaround: Use Windows 7 or Linux)
l DE163498 The links in ACT Developer help in ACT extensions window don't work unless
Workbench is installed on the machine
52
complex electronic design challenges, and accelerate your product’s time to market.
Antenna and Wireless Workflow

l Comprehensive HFSS-IE design in HFSS. HFSS-IE design type no longer required
l Enable Field Links for Finite Array DDM
l Improved Near and Far-Field Links
l Antenna Toolkit
o Extension of model library with improved synthesis
HFSS 3D Layout
l Mesh speed improvements through enhancements to mesh pre-processing
l Added Gerber RS274X translation Import
HFSS Solver improvements and enhanced physical models
l HFSS Transient solver included with HFSS
l Enhanced GPU Acceleration of Direct Solver
l Improve Field File Transfer Speed and Robustness
HFSS SBR+ (formerly Savant)
l SBR+ for RCS
o SBR+ with PTD and UTD
l Enhanced STL Import
l VRT Animation with parametric models
53
HFSS R19.0
l Far-Field Source Option for SBR+

l Scattered Field Option for SBR+ Regions
Slider Bar Settings for Curved Surface Meshing
HFSS R19.0 has updated the slider bar settings for Curved Surface Meshing for surface-mesh
solvers. Because most surface-mesh applications require a highly precise representation of the
surface for accurate results, the default slider bar setting will provide a stricter representation of the
surface for triangle meshes compared with volumetric tetrahedra meshes. The following simulation
methods rely on surface meshes:
l HFSS-IE Designs
l IE Regions in HFSS
l PO Regions in HFSS
l SBR+ Regions in HFSS
l Characteristic Mode Solution Type in HFSS
l DE154464 Correct finite array with PML with plane wave excitations
l DE155270 Near-field link excitation assigned to object in background or inside Dielectric IE
region now works correctly
l DE156484 Savant solver now accepts lossy dielectric/magnetic material defined in terms of
dielectric/magnetic loss tangent
l DE157031 When the infinite sphere setting is defined in a local coordinate system, Savant
solver now gets the correct far field phase reference location
l DE157860 Electromagnetics systems on WorkBench correctly accept geometry coming
from Teamcenter (NX)
l HFSS Transient GPU Solver R9.0 code does not work for NVIDIA Volta GPU Tesla V100
because V100 is not backward compatible with the code built by CUDA 6.5. This issue has
been reported to NVIDIA.
l DE160616 For the applications of FEBI + IE region or standalone IE region with sheet
objects, IE solver using ACA is, in most cases, significantly slower with Platform MPI on
Linux.
54
HFSS R19.0
l DE162274 Radiation and Gain Patterns are Wrong for HFSS Transient with Spherical
Radiation Boundaries
l DE163195 Implicit Transient Crashed for a Laser Simulation
l DE163480 PTD/UTD doesn't work correctly for SBR+ in some situations when both PEC
and non-PEC boundary conditions are present
55
What’s New in ANSYS Icepak R19.0 - Beta
complex electronic design challenges, and accelerate the time to market.
Icepak Project within ANSYS Electronics Desktop (Beta)

l Workflow
o Linux and Window installs
o Scripting (Journaling) in IronPython and VBS
o One-way Dynamic Thermal Link with HFSS 3D, HFSS 3D Layout, Q3D Extractor, and
Maxwell
o Combined, single material library that includes electrical, thermal, and mechanical
properties
l Native MCAD Environment
o Live SpaceClaim link
o PCB Object using 3D Layout
n Stack up editing
n Metal fraction analyses
o Mesh region and Inclined mesh regions
o 3D Component creation for Icepak designs
o Numerous improvements in the area of splitting geometric objects, simplifying geometry,
and color coding geometry
l Simulation
o Icepak Solution Restart (Full)
o 3D CutCell meshing improvements
o Variation distribution and DOE - Optimetrics
o Surface and Volumetric dynamic link loss support
o HPC & Electronics HPC licensing support for parallel solves and distributed variations
l Model Library
o Migrate Icepak vendor libraries to AEDT
n Heatsinks and fans
o Native 3D components -> fans, heatsinks, and PCB
l Post Processing
56
Icepak - Beta R19.0
o Field plotting
o Fields Summary Report
o Dynamic mesh visualization
o Inclusion of point and surface monitors
o Numerous enhancements to 3D field visualizations
Selected Defect Corrections for Icepak R19.0
l DE147570 Mesh qualities are now correct with a cabinet-only model in Icepak AEDT
57
HPC/Performance
l Non-constant time step for general transient TDM (periodic allowed for 2D)
l External circuit PWM source for general transient TDM (periodic allowed for 2D)
l New GPU algorithm support for matrix solver in 3D eddy current solver.
l General transient TDM model for translation motion
Integrated motor solutions
l Machine Design Toolkit integrated into AEDT through ACT
l Machine Design Toolkit performance and robustness improvements
l Machine Design Toolkit - Induction Machine support
l Machine Design Toolkit UX improvements
l Manufacturing effects on core loss
l Irreversible temperature effect on permanent magnet demagnetization
l Nonlinear D-E curve in electrostatic solver
l Nonlinear J-E curve in DC conduction solver
l Multiple end-connection creation in RMxprt-created 2D FE model
l UDP for end fingers and press plate
l Lorentz force method used for conductors in magnetic solvers
Multiphysics
l Element-based harmonic stress coupling from 2D/3D transient solver
l Magnetostrictive vibration to magnetic core
l DE154483 If memory is not enough for periodic TDM, an error message will be provided
l DE156843 Maxwell prefers the classic mesh, so the Phi mesher has been removed from
Maxwell
l DE157912 Endless nonlinear iteration no longer occurs in 3D Magnetostatic solver
58
Maxwell R19.0
l DE160790 Skew is now correctly modeled when Maxwell circuit or Simplorer is involved in
2D transient
59
ANSYS Q3D Extractor improvements

l Q3D New Faceter for CG Solver
l Support sub-micron structures in CPA
l Q3D Auto-HPC enhancements
CPA Solver improvements
l Single net extraction using Q3D solver
l Option to ground PG nets for Q3D solver
l Export solution: Touchstone file, IBIS, etc.
l Added the ability to filter CPA RL plots by net
l Added geometry partitioning for CPA/Q3D solver
l Support for passive RLC components extended to cover Q3D choice
Selected Defect Corrections for Q3D Extractor R19.0
l DE152809 Differential S-parameters can be exported via Network Data Explorer in 2D
Extractor
l DE153943 Q3D-Icepak 2-way volume link functions correctly
l DE155702 Spectre transmission line model can be exported for frequency sweep in 2D
Extractor
Known Issues and Limitations for Q3D Extractor R19.0
60
What’s New in ANSYS Simplorer R19.0
ANSYS is pleased to provide the latest version of Simplorer with a number of improvements
developed with guidance from our most innovative customers. These advancements help to
amplify your engineering effectiveness in simulating complex power electronic and multi-domain
system designs.
New Thyristor Model and Device Characterization Tool

l New device model and characterization tool to extract detailed Thyristor models from data
sheets
l Includes pre-characterized models and examples
l New capabilities in the Simplorer Modelica Diagram Editor including Graphical Symbol
rendering
l Integrated documentation for MSL and other Modelica libraries
l Use a graphical interface to select/use enumerations, apply modifiers and use
replaceables/redeclares
l Save Modelica Modeling work in progress
l Users can now use Visual Studio as the compiler - useful when using compiled libraries
inside Modelica
Improved Modelica Package Browser
l Integrated help is now available for several Modelica libraries
Modelica Libraries and Applications
l Physical connector library allows energy conserving connections between Modelica models
and other Simplorer connectors
l New Heating and Cooling library available on the ANSYS App Store
Prebuilt Power Converters and ADC/DAC Models
l Includes prebuilt converter models and examples
l Added new 8-bit and 12-bit ADC and DAC models
New Multithreaded Transient Analog Solver
l The analog solver can now perform model evaluations in parallel
l Performance improvements are model dependent - schematics with larger independent
models show improved performance
61
Simplorer R19.0
New Data Connector Blocks

l Data can now be sent and received and used during simulation using socket-based
communication
l Client code examples in Python, C++, and Java are included
Several Performance and Usability Enhancements
l New ribbons-based user interface; new shortcut, task bar, and title bar icon
l Curve grouping in stacked plots
l Autocomplete for variables in the equation blocks
l Variable types can now be sorted and marked in calculator dialog
l Support for RLGC link and better defaults for Maxwell and Q3D links
Matlab Support
l Added support for Matlab R2017a and R2017b
Selected Defect Corrections for Simplorer R19.0

l DE154619 Fluent link can now be created with additional '-op' string in Fluent output
parameters
Known Issues and Limitations Simplorer R19.0
l DE158132 Parallel calculation not possible with Simplorer Maxwell cosimulation

l DE162553 For the new RLGC link, the Simplorer-Q3D link gives wrong results if nets in
Q3D do not have a source and sink defined. (Workaround is to either manually remove all
nets that do not have source and sink defined or to always define a source and sink for all
nets.)
l DE162685 Necessary annotations for creating Modelica conservative pins for mechanical or
fluid domains in Simplorer are missing
62
What’s New in ANSYS SIwave R19.0
SIwave Solver Technologies

l SIwave with HFSS Regions (Beta)
l Distributed Parallel Near- and Far-Field Solvers
l Added polygonal via barrel support for DC solver
l Sub-micron structure solver support within SIwave-CPA
l Utilize ANSYS HPC Licenses for parallel solving within SIwave
l Improved EMI Analyses when Pushing Circuit Excitations into SIwave
SIwave Workflow Improvements
l SIwave Thermal Workflow with Icepak
o Added Icepak .HTML Report Generation
l SIwave-CPA
o Single net extraction using Q3D solver
o Option to ground PG nets for Q3D solver
o Export solution: Touchstone file, IBIS, etc.
o Added the ability to filter CPA RL plots by net
o Added geometry partitioning for CPA/Q3D solver
o Support for passive RLC components extended to cover Q3D choice
l Automation Improvements
o PSI
o SIwave DC-Icepak
o Crosstalk/impedance scan
o Added Iron Python IDE command window
l SIwave-PSI
o AC Current Visualization on traces
o Reporting of total Radiated AC Power
o Added Voltage Probes to PSI AC simulations
o Added solver support for rectangular and polygonal vias
63
SIwave R19.0
l SIwave-PI
o Added ability to show RLCs between selected nets
o Compare Optimized, Unoptimized, and Bare Board Impedance Plots within PI Advisor
SIwave Ease-of-Use
l Added ACIS R28 support
l Oblong Solderball support
l Added dimension markers
l Numerous Pin Grouping improvements
l Added Iron Python IDE command window
l Added new “Special Selection” Modes
o Nets Between Nets
o Signal Nets between Components
o DC Connected Nets
l Added “heads-up, floating, and ghosting windows” to GUI
l Added a “Simulation Setup” export/import for all simulation types
o Ensures consistent setups between projects
l Improved the DC Power Tree setup using text import/export that reduce redundant manual
steps
3D Layout Improvements
l Switched to intuitive Ribbons based interface
l Greater than 2x speed up in mesh pre-processing
l Added Gerber RS274X translation Import (i.e. supports EagleCAD now)
Time Domain Circuit Solving
64
SIwave R19.0

Selected Defect Corrections for SIwave R19.0
l DE154766 Geometry processing options added to SIwave UI to benefit IC/interposer scale
layouts
l DE166287 Significant differences no longer occur in results computed by SIwave 19.0 when
simulations are based on EDBs instead of SIwave project files. This correction is available in
Release 19.0.6.
Known Issues and Limitations for SIwave 19.0
l DE163657 Conducting materials are being incorrectly classified as dielectrics when ODB++
v8 files are imported into SIwave
65

Circuit
l DE154360 QuickEye no longer shows an unexpected DC shift for single-ended lines (see in
DDR channels)
l DE154464 Correct finite array with PML with plane wave excitations
l DE157183 Updating VPowerSinusoidal/P_SIN component now netlists correctly
l DE158352 AMI file with properties in a hierarchy now simulates without any errors
l DE160146 Spurious noise (that is, wiggles) in VerifEye Contour plots removed
HFSS
l DE155270 Near-field link excitation assigned to object in background or inside Dielectric IE
region now works correctly
l DE156484 Savant solver now accepts lossy dielectric/magnetic material defined in terms of
dielectric/magnetic loss tangent
l DE157031 When the infinite sphere setting is defined in a local coordinate system, Savant
solver now gets the correct far field phase reference location
l DE157860 Electromagnetics systems on WorkBench correctly accept geometry coming
from Teamcenter (NX)
Icepak
l DE147570 Mesh qualities are now correct with a cabinet-only model in Icepak AEDT
Maxwell
l DE154483 If memory is not enough for periodic TDM, an error message will be provided
l DE156843 Maxwell prefers the classic mesh, so the Phi mesher has been removed from
Maxwell
l DE157912 Endless nonlinear iteration no longer occurs in 3D Magnetostatic solver
l DE160790 Skew is now correctly modeled when Maxwell circuit or Simplorer is involved in
2D transient
66
Q3D Extractor
l DE152809 Differential S-parameters can be exported via Network Data Explorer in 2D
Extractor
l DE153943 Q3D-Icepak 2-way volume link functions correctly
l DE155702 Spectre transmission line model can be exported for frequency sweep in 2D
Extractor
Simplorer
l DE154619 Fluent link can now be created with additional '-op' string in Fluent output
parameters
SIwave
l DE154766 Geometry processing options added to SIwave UI to benefit IC/interposer scale
layouts
l DE166287 Significant differences no longer occur in results computed by SIwave 19.0 when
simulations are based on EDBs instead of SIwave project files. This correction is available in
Release 19.0.6.
67

HFSS
l HFSS Transient GPU Solver R9.0 code does not work for NVIDIA Volta GPU Tesla V100
because V100 is not backward compatible with the code built by CUDA 6.5. This issue has
been reported to NVIDIA.
l DE160616 For the applications of FEBI + IE region or standalone IE region with sheet
objects, IE solver using ACA is, in most cases, significantly slower with Platform MPI on
Linux.
l DE162274 Radiation and Gain Patterns are Wrong for HFSS Transient with Spherical
Radiation Boundaries
l DE163195 Implicit Transient Crashed for a Laser Simulation
l DE163480 PTD/UTD doesn't work correctly for SBR+ in some situations when both PEC
and non-PEC boundary conditions are present
Circuit
l DE155896 Nexxim time-domain simulations (for example, Transient and QuickEye
analyses) containing non-causal microwave models (for example, microstrip gap model)
may not work.
l DE159799 Nexxim simulations (usually, the LNA) containing microwave components (e.g.,
elliptic bandpass filter) may not work with glibc versions greater than 2.17.157.
Workarounds: a) set LD_BIND_NOW=1 before launching AEDT command line, or b) use
glibc versions less than or equal to glibc 2.17.157
l DE161330 Recording script for changing Type, Num_Lines or Substrate property in
Component tab can set wrong Component on playback (Workaround: Record changing
Component property to correct value)
l DE161966 Nexxim simulations (usually, the transient analysis) containing Verilog-A
components do not work in Windows 10 (Workaround: Use Windows 7 or Linux)
EMIT
l DE163412 "Constant Loss" cable model does not include passive noise
68
Icepak
Maxwell
Q3D Extractor
Simplorer
l DE158132 Distributed Solve is currently not supported for the Simplorer Maxwell
cosimulation
l DE162553 For the new RLGC link, the Simplorer-Q3D link gives wrong results if nets in
Q3D do not have a source and sink defined. (Workaround is to either manually remove all
nets that do not have source and sink defined or to always define a source and sink for all
nets.)
l DE162685 Necessary annotations for creating Modelica conservative pins for mechanical or
fluid domains in Simplorer are missing
WB is installed on the machine
SIwave
l DE163657 Conducting materials are being incorrectly classified as dielectrics when ODB++
v8 files are imported into SIwave
69

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What's New in ANSYS Electronics 2019 R1

l ANSYS Electronics Desktop

The Electronics Desktop provides highly integrated electromagnetic simulators, circuit/system

l ANSYS HFSS and ANSYS HFSS 3D Layout

l DE180157 DC and Transient convergence difficulty in power-electronics circuits which

EMIT Design (beta) in Electronics Desktop

HFSS-IE and HFSS SBR+

l DE182856 Application error on failure to load libHfssSbrPlus.so with "libXext.so.6:

Icepak Design in Electronics Desktop

l DE182880 Maxwell 3D Electrostatic calculates incorrect capacitance with multiple touching

SIwave EMI Workflow

Model Export and Runtime Generation Capabilities for Digital Twins

IEEE VHDL-2008 Encryption

Selected Defect Corrections for 2019 R1

Known Issues and Limitations 2019 R1

The Electronics Desktop provides highly integrated electromagnetic simulators, circuit/system

l ANSYS HFSS and ANSYS HFSS 3D Layout

Icepak Design within ANSYS Electronics Desktop

Known Issues and Limitations for Maxwell R19.2

Static Reduced Order Modeling (ROM) Visualization

Simplorer Design Transitions to Twin Builder Design

Selected Defect Corrections for R19.2

Known Issues and Limitations R19.2

l ANSYS Electronics Desktop

The Electronics Desktop provides highly integrated electromagnetic simulators, circuit/system

l ANSYS HFSS and ANSYS HFSS 3D Layout

Core Technology Enhancements

l DE164417 Binaries compiled using VS2015 required an updated ucrtbase.dll to function

HFSS SBR+ Solution Type

l DE164417 Binaries compiled using VS2015 required an updated ucrtbase.dll to function

Icepak Design within ANSYS Electronics Desktop

l DE164417 Binaries compiled using VS2015 required an updated ucrtbase.dll to function

Integrated Motor Solutions

l DE164417 Binaries compiled using VS2015 required an updated ucrtbase.dll to function

ANSYS Q3D Extractor Improvements

l One-way thermal link with Icepak within Electronics Desktop

l 3D Component Licensing: Ability to add third-party licensing to encrypted 3D component

l Improved advanced mesher options

l Ability to visualize partitions in SIwave-CPA when utilizing Q3D

l DE164417 Binaries compiled using VS2015 required an updated ucrtbase.dll to function

SIwave Solver Technologies

l DE164417 Binaries compiled using VS2015 require an updated ucrtbase.dll to function

Modelica Diagram Editor Enhancements

Selected Defect Corrections for R19.1

Known Issues and Limitations R19.1

l DE164417 Binaries compiled using VS2015 required an updated ucrtbase.dll to function

What's New in ANSYS Electronics R19.0

l ANSYS Electronics Desktop

The Electronics Desktop provides highly integrated electromagnetic simulators, circuit/system

l ANSYS HFSS and ANSYS HFSS 3D Layout

Core Technology Enhancements

l Separate Icons for AEDT, SIwave, & Simplorer

SI and RF Circuit Option Enhancements

l PAM4 support for IBIS-AMI, QuickEye, and VerifEye

l DE157709 Reassigning field plot on new geometry now works correctly

l DE155896 Nexxim time-domain simulations (for example, Transient and QuickEye

Antenna and Wireless Workflow

l Far-Field Source Option for SBR+

Icepak Project within ANSYS Electronics Desktop (Beta)

ANSYS Q3D Extractor improvements

New Thyristor Model and Device Characterization Tool

New Data Connector Blocks

l Added support for Matlab R2017a and R2017b

Selected Defect Corrections for Simplorer R19.0