CST Studio

3DS.COM © Dassault Systèmes | Confidential Information | 11/22/2017 | ref.
: 3DS_Document_2015
CST STUDIO SUITE® 2018

Feature Highlights
Outline
3DS.COM/SIMULIA © Dassault Systèmes | Confidential Information | 11/22/2017 | ref.: 3DS_Document_2015
Usability and Performance
Components
Antennas
Circuits, Cables, PCBs
Chip Interface
Design and Analysis Tools
2
3
•
•
•
•
Updated look-and-feel
IdeM
Direct access to new tools
FEST3D
SPARK3D
System Simulator
CST STUDIO SUITE example files

Revisions
now – download
easily searchable and older
versions from the component
downloadable
library
Documentation – attach e.g.

PDF, PowerPoint, Word
documents to the component
4
HPC System Integration and Usability
► The HPC environments are

typically complex
► Often no graphical user

interface
► Special hardware and network

technologies, e.g., Infiniband.
5
HPC Setup – System Check Tool
Extensible framework of system tests
Automatic system tests in advance of MPI start.
6
New CPU Generation Improves Performance
Speedup for different solvers and models thanks to the new CPU generation
2,5
1,5
Speedup
0,5
0
Head and Phone PCB-Board RJ45 si_bga Traveling Wave Magnetron Reflector
Tube
E5-2697 v4 (Broadwell) vs Gold 6148 (Skylake)
7
New GPU Generation Improves Performance
8 Tesla K40
Tesla K80
7 Tesla P100
Quadro GP100
6
5
Solver Speedup
0
Head and RJ45 si_bga PCB-Board MRI Magnetron TWT Fighter
Phone
Reference system for speedup calculation: dual Xeon Gold 6148 (2x20 cores, 2.4 GHz).
8
Outline
Components
Antennas
Chip Interface
9
10
High Frequency
Filter Designer 3D
Tuningworkflow
Tuning workflowinin2017-version
2018-version
Changes in
coupling
Matrix Filter Designer 3D
matrixEigenmode
Extraction Results
Import S- Changes
parameters of Automated required in
3D simulation 3D model
Complete 3D
Optimize your cavity filter with an easy-to-use interface Structure
 New: Automated filter tuning 3D Model


New: Transmission zeros
New: Singly-Terminated Filter Synthesis
Optimization
 New: Error Bars for Extracted Coefficients
11
12
Automated Filter Tuning in 2018 Version
S11
Filter Tuning and Moving Mesh Key Feature: Moving mesh
reduces mesh noise
Built-in Trust Region Framework

based optimiser
S11
13
Tetrahedral Meshing
Moving mesh
Automatic mesh adaptation strategy
Curved mesh elements
Snap-to-geometry during mesh refinement

(tetrahedral meshing)
Mixed triangular and quadrilateral mesh elements
(surface meshing)
New: Surface mesh import for I-solver
14
Frequency Domain Solver Overview
Push button solution
High order elements
Curved mesh
Model order reduction techniques
Moving mesh
New: Fast resonant solver plane wave excitation, iterative solver

performance, robuster discrete ports, broadband sweep options…
15
16
More accurate results
Better mesh adaptation
Shorter simulation time

Lumped Element SPICE-Circuits
Iterative Solver Performance Improvements
Speed-up for simulation with multiple excitations
8 discrete ports, 0 – 1GHz, 9 frequency points  The broader the frequency, the higher
Ca. 1 million mesh elements
the speed-up
 The higher the number of ports, the
higher the speed up
 Speed-up is model dependent, from a
minor speed-up to 5-6 times compared
to previous version
2017 2018 Speedup
1 hour, 33 minutes 46 minutes 2x
17
18
Static and Low Frequency
Application Areas
Sensors Electromechanical Transformers
High voltage / heavy EMC / Shielding Power electronics

current
19
Broadband impedance calculation - MQS
 Broadband impedance calculated by reduced order model (ROM) extraction.
 Complex impedance matrix can be exported to the new System Simulator
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21
System Simulator
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Charged Particle Dynamics
Charged Particle Dynamics
Graphical and parametric user interface
TRK PIC WAK

• Particle tracking in DC fields • Self consistent particle • Accelerator specific
• Tetrahedral & hexahedral mesh movement in RF fields excitation
support • PBA® conformal boundaries • PBA® conformal boun-daries
• Modern look and feel • Single and multi-GPU acceleration • Cluster computing
• Plasma
Electron gun E-beam lithography Magnetron Traveling Wave Tube Accelerator Components
23
True transient 3D-EM/Circuit Co-Simulation
 Matching and feeding of vacuum electronic devices as magnetrons, vircators
 Coupling of accelerator structures to circuit elements
Magnetron efficiency
depending on load
Load
24
Outline
Components
Antennas
Chip Interface
25
26
Antennas
Arrays
What are they? Why are they used?
Many radiators in close proximity Beam control with fixed geometry
27
28
Array Wizard with Parametric Am/Ph-Combination
Specify array elements manually or import tsv-file

29
Array Wizard with Parametric Am/Ph-Combination
30
Visualize Array Farfield
Time Domain Solver Overview
Perfect Boundary Approximation - PBA®
Robust meshing of complex CAD-models
Fast and efficient – possible to run large simulations

with very limited hardware…
…and possible to use GPUs to run massive

simulations without massive hardware
Hybrid solutions available for even larger simulations
New: Space map Drude material, corner correction

improvements, waveguide port without absorber…
31
32
Multilayer Farfield - Preview
Farfield of a vertical dipole above a layered dielectric background
Near Field Sources
 NFS import/export compatibility with

other solvers
 NFS imprinting off-axis rotation
 Support of NFS broadband time

domain monitors
33
Power Loss export to Thermal Solver
 Supports for complex materials (e.g

thin panel)
 Supports for time average and
frequency power loss field monitors
34
Integral Equation Solver
State of the art solver technologies
Higher order elements, curved mesh, triangular and

quadrilateteral elements
Near- and far field sources with antenna-to-antenna

coupling
New: Surface mesh import, surface mesh gradation,

CMA dielectrics support and mode tracking
improvements…
35
Surface Mesh Import
Supports for Nastran format solid or sheets
Intersections of solids and imported mesh are not supported yet.
36
Characteristic Mode Analysis
 Significant
improvement of accuracy and
performance for mode tracking

 Support of dielectrics in Integral Equation
Solver for CMA
 Quick mode analysis of large models at
discrete samples without mode tracking
Smaller resonance frequency

with increasing permittivity
Mode 1 Mode 2
37
Asymptotic Solver
Ray path visualization, hotspot detection,
range profiles and sinograms
Coated materials, complex surface

impedance materials, thin panel
GPU computing
New: Ray visualization improvements
New: Nearfield source -monitors
38
Ray Visualization
Ray Amplitudes Transmitted and Reflected Rays from Thin Panel
Ray amplitude along propagation path for a reflector Antenna field source in a box with absorbers on all walls and
antenna assembly under a radome front open
39
Nearfield source monitor support
Plane wave incident on cell tower Human body exposure
Near field @ 1 GHz
E-field inside the human body

@ 1 GHz
40
Hybrid Solver Task (Bi-directional)
 Fully automated SAM based workflow
 Bi-directional coupling of solver/s
321 - 0.005
0.9
0.05
 Included at no extra cost
41
Hybrid Solver Task (Bi-directional)
Automatic and robust bi-directional coupling between different solvers
and simulation regions.
42
Hybrid Solver Task (Bi-directional) – Results
 Primary Results available in DES navigation tree:
 1D Results (S-Parameters, efficiencies, etc)

 Farfield Results
43
SAM Workflows can be initiated from 3D Window
Increases visibility and accessibility of

all SAM based workflows:
• EM-Thermal coupling workflows

• Array task
• …
44
Outline
Components
Antennas
Chip Interface
45
46
Circuits
47
Available for AC-Task
Circuit Simulation: Power Loss per Component
Cables - Overview
Fast and accurate simulation of real-world cables and harnesses inside electrical system
Harness Tools Simulations

Harness import
Impedance calculator 3D EM coupling for HIRF,
Complex cross section • Mode impedances EMC, E3 applications
description • Effective dielectric constant
• Per unit RLCG-values 2DTL and PEEC methods
Shielding (e.g. braided,
wrapped)
Circuit simulation (NEXT,
Drain wire FEXT, RLCG, SPICE)
Cable library (accessible on
the network) Parameterization and
Transfer impedance (Kley or
measurements) Optimization
48
Parameterization and Optimization
Topology, Cross Section, Material Properties
 Two parallel twisted cables over

metallic plate
 Parametric study of the parameter
LAY reveals that NEXT can be
significantly reduced when LAY of
two cables are different
Identical Lay Different Lay
49
PCBs and Packages - Overview
Rule Signal Power EDA
Checker Integrity Integrity Import

Powered By CST
Channel Simulation Voltage Drop EMC/EMI
Tx/Rx IBIS Decaps Optimizer Multiphysics
SI and EMC
Rules Eye Diagram Spatial Impedance Chip Interface
50
High Frequency EDA Import
Spice model for lumped elements and support of CST PCB STUDIO® Part Library
Part Library supports SPICE subcircuits
51
52
Heat Source Settings
Thermal EDA Import
Thermal EDA Import – IR-Drop Losses Import
IR-Drop (voltage drop) losses are calculated using CST PCB STUDIO®
53
Outline
Components
Antennas
Chip Interface
54
Chip Interface
Modern interface to IC
design tools (e.g. Cadence
Virtuoso)
Open Access Database

and GDSII support
Mask (pattern) Information CST is part of the Silicon Integration Initiative www.si2.org
Mimics the fabrication Process Design Kit (PDK) is a set of data to model
process (PDK) a specific process technology at a specific foundry.
55
Chip Interface
Open Access, Automatic 3D
Technology File
GDSII Design
Mask – Pattern Cadence and Synopsys
Mimics the fabrication
information Interconnect Technology
process
File (ICT, ITF)
Tech. files available in PDK
56
Cadence Virtuoso Plugin
Recommended Workflow – Export to CST
All necessary files for the Chip Interface are exported
57
Outline
Components
Antennas
Chip Interface
58
59
•
•
•
•
IdeM
FEST3D
SPARK3D
Direct access to new tools
System Simulator
New Tools
 IdEM - From S-parameters to SPICE
 FEST3D - Design and analysis of filters

and other waveguide conmponents
 SPARK3D - Multipactor and gas

discharge breakdown analysis
 System Simulator – System level

simulation of coupled systems
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61
IdEM – Generation of Broadband Macromodels

EM simulation
S-parameters
Measurement
IdEM • Data certification
• Rational approximation
• Passivity enforcement
• Synthesis
Eye diagram Passive Causal

Circuit solver Macromodel
Time domain simulation
61 Company confidential
62
Interference Task
Workflow for RF Interference Simulation

63
glance
system
license
definition
Included in
Results at a
Easy to use
the standard
Interference Task
Interference Task
Library of Radio Frequency Devices
 Drag & drop radios from and into the library
 Pre-defined radios and user-defined radios
 Library can also exported and imported for other users
 Search functionality for names and tags
64
Summary
Usability and Performance: New look-and-feel, component library
Components: Automated filter tuning with Filter Designer 3D
Antennas: Hybrid solver task
Circuits, cables, PCBS: Thermal EDA import
Chip interface: Technology file
Design and Analysis tools: IdeM, FEST3D, SPARK3D, System Simulator
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3DS.COM © Dassault Systèmes | Confidential Information | 11/22/2017 | ref.

CST STUDIO SUITE® 2018

Usability and Performance

Circuits, Cables, PCBs

Design and Analysis Tools

CST STUDIO SUITE example files

Documentation – attach e.g.

► The HPC environments are

► Often no graphical user

► Special hardware and network

Automatic system tests in advance of MPI start.

Usability and Performance

Circuits, Cables, PCBs

Design and Analysis Tools

Built-in Trust Region Framework

Automatic mesh adaptation strategy

Curved mesh elements

Snap-to-geometry during mesh refinement

New: Surface mesh import for I-solver

Push button solution

High order elements

Model order reduction techniques

New: Fast resonant solver plane wave excitation, iterative solver

Better mesh adaptation

Shorter simulation time

1 hour, 33 minutes 46 minutes 2x

High voltage / heavy EMC / Shielding Power electronics

 Complex impedance matrix can be exported to the new System Simulator

TRK PIC WAK

 Coupling of accelerator structures to circuit elements

Usability and Performance

Circuits, Cables, PCBs

Design and Analysis Tools

Many radiators in close proximity Beam control with fixed geometry

Specify array elements manually or import tsv-file

Robust meshing of complex CAD-models

Fast and efficient – possible to run large simulations

…and possible to use GPUs to run massive

Hybrid solutions available for even larger simulations

New: Space map Drude material, corner correction

 NFS import/export compatibility with

 Support of NFS broadband time

 Supports for complex materials (e.g

State of the art solver technologies

Higher order elements, curved mesh, triangular and

Near- and far field sources with antenna-to-antenna

New: Surface mesh import, surface mesh gradation,

Intersections of solids and imported mesh are not supported yet.

performance for mode tracking

Smaller resonance frequency

range profiles and sinograms

Coated materials, complex surface

New: Ray visualization improvements

New: Nearfield source -monitors

Near field @ 1 GHz

E-field inside the human body

 Bi-directional coupling of solver/s

 Included at no extra cost

and simulation regions.

 1D Results (S-Parameters, efficiencies, etc)

Increases visibility and accessibility of

• EM-Thermal coupling workflows

Usability and Performance