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SILIKOPH
HEN® AC R
Resins
s
Ambient tem
mperature curing
one resin
silico ns for high
temp
perature applicattion
Silicone
e Ambient cuuring systemss represent a novel
Prroducts
technollogy for toda
ay’s coatings formulator.
Binders:
SILIKOPHEN® AC 900 ((methylpheny
yl silicone
Ambient temperature cu uring
(no forced curing
c necessary) resin, methoxy-functio
onal)
Application for large ob bjects and ou tside SILIKOPHEN® AC 1000 (methyl silic
cone resin,
application methoxy-functional)
Permanent temperature resistance u up to
600°C
Low-VOC-fformulations Ca
atalysts:
Possibility of
o direct grinnding, becausse of TEGO® Kat 1 (tetra-n- butyl titanate: TnBT),
very low visscosity of res
sins nded for SILIK
recommen KOPHEN® AC
C 1000
Catalyzed crosslinking
c via
v hydrolysi s-
TEGO® Kat 2 (tetrametthylguanidine
e: TMG)
condensatio on-reaction
Tin or heavvy metal-free catalysts Recommendation: Mixtture of 1:1 of
o TEGO®
Early solvennt resistance Kat 1 and TEGO® Kat 2 for SILIKOPHEN® AC
900.
Prroduct Properties
SILIKOPHEN® AC
A 1000
ctive matter content:
Ac c 100
0%,
Viscosity @25°°C: < 10mPass,
Methoxy-content: approx. 35wt%
SILIKOPHEN® AC
A 900
ctive matter content:
Ac c 90%
%,
Viscosity @25°°C: approx. 1 30mPas,
Methoxy-content: approx. 17wt%
EGO® Kat 1
TE
Ac
ctive matter content:
c 100
0%,
Viscosity @25°°C: 80mPas,
Titane-content: approx. 14
4wt%
EGO® Kat 2
TE
Ac
ctive matter content:
c 100
0%
Evonik Industrie
es AG | SILIKOPH
HEN® AC | January 2014 Page 1/5
Guiding Formulation, Handling, Test Results for Properties of the coating
SILIKOPHEN® AC 1000
Based on SILIKOPHEN® AC 1000
*Pot life: The period of time in which the original viscosity is doubled
** rt = room temperature (23 °C, approx. 50 % humidity)
Processing Instructions for SILIKOPHEN® AC 1000
Temperature stress was tested 16h at 200°C/ 300°C/ 400°C/ 500°C/ 600°C
HEUCODUR® Black 9-100 8.0 Drying recorder "dust dry" at rt** 0.5h
Catalysts use and dosage: *Pot life: The period of time in which the original viscosity is doubled. The
Table 1