Advanced Power

Electronics Corp. AP60T03GH/J-HF-3

N-channel Enhancement-mode Power MOSFET

Simple Drive Requirement

D
Low Gate Charge BV DSS 30V
Fast Switching Characteristics R DS(ON) 12mΩ
G
RoHS-compliant, halogen-free ID 45A
S

Description D (tab)

G
Advanced Power MOSFETs from APEC provide the designer with the best D
S TO-252 (H)
combination of fast switching, low on-resistance and cost-effectiveness.
The AP60T03GH-HF-3 is in the TO-252 package which is widely preferred for
commercial and industrial surface mount applications such as medium-power
DC/DC converters. The through-hole TO-251 version (AP60T03GJ-HF-3) is D (tab)
available where a small PCB footprint is required.
G
D
S TO-251 (J)

Absolute Maximum Ratings

Symbol Parameter Rating Units

VDS Drain-Source Voltage 30 V
VGS Gate-Source Voltage ±20 V
ID at TC=25°C Continuous Drain Current 45 A
ID at TC=100°C Continuous Drain Current 32 A
1
IDM Pulsed Drain Current 120 A
PD at TC=25°C Total Power Dissipation 44 W
Linear Derating Factor 0.3 W/°C
PD at TA =25°C Total Power Dissipation 2.4 W
TSTG Storage Temperature Range -55 to 175 °C
TJ Operating Junction Temperature Range -55 to 175 °C

Thermal Data
Symbol Parameter Value Units
Rthj-c Maximum Thermal Resistance, Junction-case 3.4 °C/W
3
Rthj-a Maximum Thermal Resistance, Junction-ambient (PCB mount) 62.5 °C/W
Rthj-a Maximum Thermal Resistance, Junction-ambient 110 °C/W

Ordering Information
AP60T03GH-HF-3TR : in RoHS-compliant halogen-free TO-252 shipped on tape and reel (3000 pcs/reel)

AP60T03GJ-HF-3TB : in RoHS-compliant halogen-free TO-251 shipped in tubes (80pcs/tube)

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 Advanced Power
Electronics Corp. AP60T03GH/J-HF-3
Electrical Specifications at Tj=25°C (unless otherwise specified)
Symbol Parameter Test Conditions Min. Typ. Max. Units
BVDSS Drain-Source Breakdown Voltage VGS=0V, ID=250uA 30 - - V
∆BVDSS/∆Tj Breakdown Voltage Temperature Coefficient Reference to 25°C, ID=1mA - 0.03 - V/°C
2
RDS(ON) Static Drain-Source On-Resistance VGS=10V, ID=20A - - 12 mΩ
VGS=4.5V, ID=15A - - 25 mΩ
VGS(th) Gate Threshold Voltage VDS=VGS, ID=250uA 1 - 3 V
2
gfs Forward Transconductance VDS=10V, ID=10A - 25 - S
IDSS Drain-Source Leakage Current VDS=30V, VGS=0V - - 1 uA
o
Drain-Source Leakage Current (T j=125 C) VDS=24V ,VGS=0V - - 250 uA
IGSS Gate-Source Leakage VGS= ±20V, VDS=0V - - ±100 nA
2
Qg Total Gate Charge ID=20A - 12 20 nC
Qgs Gate-Source Charge VDS=20V - 4 - nC
Qgd Gate-Drain ("Miller") Charge VGS=4.5V - 7 - nC
Qoss Output Charge VDD=15V,VGS=0V - 10 16 nC
2
td(on) Turn-on Delay Time VDS=15V - 9 - ns
tr Rise Time ID=20A - 58 - ns
td(off) Turn-off Delay Time RG=3.3Ω ,VGS=10V - 18 - ns
tf Fall Time RD=0.75Ω - 6 - ns
Ciss Input Capacitance VGS=0V - 1135 1820 pF
Coss Output Capacitance VDS=25V - 200 - pF
Crss Reverse Transfer Capacitance f=1.0MHz - 135 - pF
Rg Gate Resistance f=1.0MHz - 1.4 2.1 Ω

Source-Drain Diode
Symbol Parameter Test Conditions Min. Typ. Max. Units
2
VSD Forward On Voltage IS=45A, VGS=0V - - 1.3 V
2
trr Reverse Recovery Time IS=20A, VGS=0V, - 24 - ns
Qrr Reverse Recovery Charge dI/dt=100A/µs - 16 - nC

Notes:
1.Pulse width limited by maximum junction temperature.
2.Pulse test
3.Surface mounted on 1 in2 copper pad of FR4 board

THIS PRODUCT IS SENSITIVE TO ELECTROSTATIC DISCHARGE, PLEASE HANDLE WITH CAUTION.

USE OF THIS PRODUCT AS A CRITICAL COMPONENT IN LIFE SUPPORT OR OTHER SIMILAR SYSTEMS IS NOT AUTHORIZED.
APEC DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED
HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
APEC RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN.

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 Advanced Power
Electronics Corp. AP60T03GH/J-HF-3
Typical Electrical Characteristics
125 90

o
T C =25 C T C =175 o C 10V
10V 8.0V
100
8.0V

ID , Drain Current (A)

ID , Drain Current (A)

6.0V
60
6.0V
75

5.0V
50 5.0V
30

V G =4.0V
25 V G =4.0V

0 0
0 1 2 3 4 0 1 2 3 4 5

V DS , Drain-to-Source Voltage (V) V DS , Drain-to-Source Voltage (V)

Fig 1. Typical Output Characteristics Fig 2. Typical Output Characteristics

80 2

I D =15A I D =20A
T C =25 ° C V G =10V

60 1.6
Normalized RDS(ON)
RDS(ON) (mΩ )

40 1.2

20 0.8

0 0.4
2 4 6 8 10 -50 25 100 175

V GS , Gate-to-Source Voltage (V) o

T j , Junction Temperature ( C)

Fig 3. On-Resistance vs. Gate Voltage Fig 4. Normalized On-Resistance

vs. Junction Temperature
100 2.8

2.3

10

1.8
VGS(th) (V)
IS(A)

T j =175 o C T j =25 o C

1.3

0.8

0.1 0.3
0 0.5 1 1.5 -50 25 100 175

o
V SD , Source-to-Drain Voltage (V) T j , Junction Temperature ( C )

Fig 5. Forward Characteristic of Fig 6. Gate Threshold Voltage vs.

Reverse Diode Junction Temperature

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 Advanced Power
Electronics Corp. AP60T03GH/J-HF-3
Typical Electrical Characteristics (cont.)
10
f=1.0MHz
10000

I D =20A
8
VGS , Gate to Source Voltage (V)

V DS =10V
V DS =15V
6 V DS =20V

C (pF)
1000 C iss
4

2
C oss
C rss

0 100
0 6 12 18 24 1 5 9 13 17 21 25 29

Q G , Total Gate Charge (nC) V DS , Drain-to-Source Voltage (V)

Fig 7. Gate Charge Characteristics Fig 8. Typical Capacitance Characteristics

1000 1
Normalized Thermal Response (Rthjc)

Duty factor = 0.5

100 0.2
Operation in this
area limited by
ID (A)

RDS(ON)
100us 0.1

0.1

0.05
PDM

10 1ms t
0.02 T
o
T C =25 C 10ms 0.01 Duty Factor = t/T

Single Pulse 100ms Peak Tj = PDM x Rthjc + T C

DC Single Pulse

1 0.01
0.1 1 10 100 0.00001 0.0001 0.001 0.01 0.1 1

V DS , Drain-to-Source Voltage (V) t , Pulse Width (s)

Fig 9. Maximum Safe Operating Area Fig 10. Effective Transient Thermal Impedance

VDS VG
90%
QG
4.5V

QGS QGD
10%
VGS

td(on) tr td(off) tf Charge Q

Fig 11. Switching Time Waveform Fig 12. Gate Charge Waveform

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 Advanced Power
Electronics Corp. AP60T03GH/J-HF-3
Package Dimensions: TO-252

D Millimeters
SYMBOLS
MIN NOM MAX
D1 A2 1.80 2.30 2.80
A3 0.40 0.50 0.60
B1 0.40 0.70 1.00
E2 D 6.00 6.50 7.00
D1 4.80 5.35 5.90
E3 3.50 4.00 4.50
E3 F 2.20 2.63 3.05
E1 F1 0.50 0.85 1.20
E1 5.10 5.70 6.30
E2 0.50 1.10 1.80
e -- 2.30 --
C 0.35 0.50 0.65

B1 F1 F

e e 1. All dimensions are in millimeters.

2. Dimensions do not include mold protrusions.

A2 R : 0.127~0.381

A3 (0.1mm C

Marking Information:
Laser Marking
Product: AP60T03

Package code
GH = RoHS-compliant halogen-free TO-252
60T03GH

YWWSSS Date/lot code (YWWSSS)

Y: Last digit of the year
WW: Work week
SSS: Lot code sequence

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 Advanced Power
Electronics Corp. AP60T03GH/J-HF-3
Package Dimensions: TO-251

D Millimeters
A SYMBOLS
c1 MIN NOM MAX
D1 A 2.20 2.30 2.40
E2 A1 0.90 1.20 1.50
B1 0.40 0.60 0.80
B2 0.60 0.85 1.05
E1 E
c 0.40 0.50 0.60
c1 0.40 0.50 0.60
D 6.40 6.60 6.80
D1 4.80 5.20 5.50
A1
E 6.70 7.00 7.30
B2
E1 5.40 5.60 5.80
F E2 1.30 1.50 1.70
B1
e ---- 2.30 ----
F 7.00 8.30 9.60

c 1. All dimensions are in millimeters.

2. Dimensions do not include mold protrusions.
e e

Marking Information:

Product: AP60T03
Package Code
60T03GJ
GJ = RoHS-compliant halogen-free TO-251
YWWSSS Date Code (YWWSSS)
Y : Last digit of the year
WW : Work week
SSS : Lot code sequence

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