FLOTHERM V8 Introductory Training Course Tutorial 8

TUTORIAL 8 : FLOPACK - COMPACT VERSUS DETAILED COMPONENT MODELS

This tutorial guides the user through the following tasks while refining the compact representation of the package with
detailed FLOPACK model:
1. Create a detailed package model in FLOPACK and import it to FLOTHERM.
2. Refine the grid around the detailed model.
3. Compare the results of the detailed and compact models to understand when compact models can be used.

Tutorial 8 – FLOPACK: Compact versus detailed component models

Load “Tutorial 7 Best” and save it as “Tutorial 8” with the title

“Detailed Package”.

Go to the Project Manager and launch FLOPACK by clicking the

FLOPACK icon on the left hand side of the Project Manager.

FLOPACK
Icon

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Tutorial 8 – FLOPACK: Compact versus detailed component models

On the FLOPACK Home Page, click the link ‘Login’.

At this stage, you will see a password prompt on your screen.

Enter the username and password as directed by your instructor.

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Tutorial 8 – FLOPACK: Compact versus detailed component models

Your workbench is your working area where you can store the
designs you will create in FLOPACK, and you can create several
folders to organize your FLOPACK models.

The first time you access FLOPACK, you will find your
workbench has been pre-populated with some FLOPACK designs.

Click on the link ‘New Library’.

Under ‘Class of the Library’, click to change from ‘Choose Class

type’ to ‘Ball Grid Arrays (BGA)’.
Under ‘Package Family’, click to select a Flip Chip CBGA
package.
Click on ‘Go Next’ to access the Flip Chip Ceramic Ball Grid
Array wizard, which is defined based on JEDEC standard package
outlines. Using this wizard will help us draw the package outline
quickly even if a minimum amount of information is available.

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Tutorial 8 – FLOPACK: Compact versus detailed component models

The first step of the wizard will ask you to name your design.
Name the new design “cbga1_AAA” (Replace the AAA with your
initials.) Click on the arrow on the lower right side to proceed to
the next step.

In Step 2 of the wizard, choose the outline

‘CBGAFC_480_23mmX23mm’, and enter a power of 7 Watts.
Keep the package top cover to be a bare die.
Click the right side arrow to go to step 3.

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Tutorial 8 – FLOPACK: Compact versus detailed component models

In Step 3 of the wizard you will be asked whether you know most
of the internal construction details of the package. Since we
usually do not know the details of the package we are modeling,
choose the default, ‘No’, and advance to the next step.

In Step 4 the wizard will ask you if you know the die size. Enter a
‘Die Length’ and ‘Die Width’ of 7mm each.

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Tutorial 8 – FLOPACK: Compact versus detailed component models

In the last step, after all of the design inputs have been entered, you
can review the design sheet. Click on the ‘Take me to the design
sheet’ link.

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Tutorial 8 – FLOPACK: Compact versus detailed component models

The window opens up on a package summary. Click on ‘Edit

Design’ to access the design sheet. It summarizes all of the inputs
from the wizard, along with the default values chosen by
FLOPACK to characterize the package (based on the JEDEC
outline).

In this sheet, change the size of the substrate to:

Length = 25mm
Width = 25mm
Thickness A2 = 5.79mm.

At the bottom of the design sheet, leave the Modeling Options as

they are. Note that the amount of grid on the package can be
controlled from that window. This will allow having a predefined
localized grid attached to the package.
Click on ‘Save’ and then on the ‘Detailed Model’ button to
generate a *.pdml file of the detailed model of your package and
save it as cbga1_AAA.pdml to your computer.

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Tutorial 8 – FLOPACK: Compact versus detailed component models

The FLOPACK detailed package model is a *.pdml file that needs

to be imported into FLOTHERM.
Go to the Project Manager. Locate and highlight the “Detail
Component” assembly inside “Electronics” assembly. Right click
to display the ‘Assembly Menu’. Then select ‘Import/ PDML’.
Browse to the location of the “cbga1_AAA” detailed model pdml
file, and open it when prompted. The following window will
display.

Click ‘No’ to close this window.

Once the pdml file has been successfully imported, you can see that
the loaded detailed package is a sub-assembly within the “Detail
Component” assembly. It consists of several sub-assemblies for the
“cbga1_AAA” geometry, including the Substrate, Die and
Solder_ball.

Open the “cbga1_AAA” assembly to examine the material

properties of the parts in the detailed model. Then minimize the
“cbga1_AAA” assembly.

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Tutorial 8 – FLOPACK: Compact versus detailed component models

Open the DB window. Turn off the grid by press “g” on your
keyboard. Select ‘View 3 (+X)’ and make it ‘Picture mode’.

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Tutorial 8 – FLOPACK: Compact versus detailed component models

Press ‘F6’ and zoom-in the area around the “cbga1_AAA”

assembly and highlight this assembly in the Project Manager, be
sure the assembly is minimized and not expanded.

Click to rotate “cbga1” 90° so that the local z-coordinate of

the “cbga1” is in ‘+Y’ direction of the global coordinate system.

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Tutorial 8 – FLOPACK: Compact versus detailed component models

In Project Manager, Select the “Comp1” in “PCB1”, then hold the

<Ctrl> key on the keyboard and select the “cbga1” assembly
(multi-selections).
Switch back to DB ‘View 3 (+X)’ without losing the selections by
clicking on the DB top bar, and perform ‘Align’ to align the
bottom edge of the “cbga1” with the bottom edge of the “Comp1”
(in the Low- Y direction) and to center.

Use the <tab> button to switch to ‘View 0 (+Y)’ without losing the
selections.
Perform ‘Align’ to align the center of the “cbga1” with the
center of the “Comp1” .

The detailed package, “cbga1_AAA”, is correctly placed

underneath the heat sink.

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Tutorial 8 – FLOPACK: Compact versus detailed component models

Switch to Project Manager and de-select the “cbga1_AAA” by

holding the <Ctrl > key at the keyboard and clicking the
highlighted “cbga1” assembly.

With only “Comp1” highlighted, de-activate “Comp1” by clicking

on the left-hand side of the Project Manager.

The detailed package, “cbga1_AAA”, has now replaced the

compact representation.

In DB ‘View 2 (+Z)’, zoom-in to the area around the

“cbga1_AAA”. Highlight “cbga1_AAA”, then type “g” on the
keyboard to show the solver grid.
Note that the localized grid is more refined in part of the Heat Sink.
This is due to the localized grid created in FLOPACK and attached
to the detailed component. It is set by default to inflate around the
component so that convection is accurately solved for if no heat
sink is sitting on the top of the component.
Since there is a heat sink with localized grid already defined in our
model, we will remove the inflation applied to the detailed
component.

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Tutorial 8 – FLOPACK: Compact versus detailed component models

Hightlight the “cbga1_AAA” assembly. In the Project Manager or

in the Drawing Board, click on the ‘Deflate” Icon in order to
remove the inflation applied to each side of the detailed
component.
In the Drawing Board, check how the grid changed.

In the Project Manager, click ‘Go’ to solve the model with the
detailed component.
Notice the results from the new Monitor Points displayed tracking
the Junction and Case Temperature of the “cbga1_AAA”
component. The Temperatures are:
Case = ________C
Junction = ________C

In this model, Junction and Case Monitor Point Temperatures are

expected to be equal since the Flip Chip BGA has a bare die and
since there is only one grid cell in the die thickness.

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Tutorial 8 – FLOPACK: Compact versus detailed component models

Open the Visual Editor from the Project Manager when the
solution has converged.
Create a Plane Plot in Z direction that cuts through the center of
the detailed component by:
- Selecting the cbga1_AAA assembly in the PM.

- Clicking on , then selecting the ‘Z’ plane.

- Change to wireframe by clicking in the background to

deselect the plot and clicking the Wireframe icon

Create a 2D view by clicking on .

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Tutorial 8 – FLOPACK: Compact versus detailed component models

Expand the ‘Scalar Fields’ and select ‘Temperature’.

Set the ‘Range’ as follows:

- ‘Range’ = ‘User Range’
- ‘Current Min. Value’ = 35°C
- ‘Current Max. Value’ = 80°C

After making the changes zoom into the detailed component.

Click on to obtain the temperatures inside the detailed

component “cbga1_AAA” and at the base of the heat sink.

Left click to leave an annotation brand at a particular point.

To delete an annotation, select it in the tree and press the icon.

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Tutorial 8 – FLOPACK: Compact versus detailed component models

In Project Manager window, save “Tutorial 8” and load in

“Tutorial 7 Best”.
Open the Visual Editor and create a Temperature Plot at the center
of ‘Heat Sink’ in the Z-direction, the same cutting plane as we did
in Tutorial 8.
In order to compare the results, make the temperature settings in
Legend Editor the same as those in Tutorial 8.

After displaying the Temperature Plot, use to examine the

temperatures of “Comp1” on “PCB 1” and at the base of the heat
sink.

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