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Introduction lel plate fins and cross-cut pin fins in low air flow environments
and compared these fins with elliptical pin fin heat sinks. They
While heat sinks are routinely used in most electronics applica-
used equal volume heat sinks in their experiments. They found
tions, the rationale for selecting a particular design of heat sink or
that the overall thermal resistance of the parallel plate fin was
more specifically a particular fin cross sectional profile, remains
lower than the other two designs, whereas the heat transfer coef-
somewhat uncertain. Most often these types of selection proce-
dures are based exclusively on performance evaluations consisting ficient was highest for elliptical pin fins. Ota et al. 关4,5兴 studied
of formulations for extended surface heat transfer found in most experimentally heat transfer and flow around an elliptical cylinder
fundamental heat transfer text books. Unfortunately, these formu- of axes ratios 1:2 and 1:3. Their experimental results show that
lations do not consider the role of pressure drop in determining heat transfer coefficient of the elliptical cylinder is higher than
the local fin velocity or heat transfer coefficient and, therefore, the that of a circular one with equal circumference and the pressure
resulting heat transfer calculations rarely pertain to actual flow drag coefficients of the former are much lower than that of the
conditions. The effects of viscous dissipation associated with flow later. Poulikakos and Bejan 关6兴 established a theoretical frame-
past fins of arbitrary cross section can be conveniently coupled work to determine the optimum fin dimensions for minimum en-
with the thermal resistance to heat flow in forced convection by tropy generation in forced convection. They first developed an
using entropy generation minimization 共EGM兲. Entropy genera- expression for the entropy generation rate for a general fin and
tion minimization combines the fundamental principles of thermo- then applied it to select the optimum dimensions of pin fins, rect-
dynamics, heat transfer, and fluid mechanics and applies these angular plate fins, plate fins with trapezoidal cross section, and
principles to the modeling and optimization of real systems and triangular plate fins with rectangular cross section. Their study
processes that are characterized by finite size and finite time con- seems to be inconclusive as to which geometry offers advantages
straints, and are limited by heat and mass transfer and fluid flow over others. Jonsson and Bjorn 关7兴 performed experiments to com-
irreversibilities. pare the thermal performance of the heat sinks with different fin
A careful review of the literature reveals that no theoretical designs including straight fins and pin fins with circular, quadratic,
study exists which compares the overall performance of the dif- and elliptical cross sections. They evaluated the thermal perfor-
ferent fin geometries 共selected in this study兲 based on the thermal mance by comparing the thermal resistance of the heat sinks at
as well as the hydraulic resistance. Behnia et al. 关1兴 compared equal average velocity and equal pressure drop. They recom-
numerically the heat transfer performance of various commonly mended elliptical pin-fins at high velocities and circular pin-fins at
used fin geometries 共circular, square, rectangular, and elliptical兲. mid-range velocities. Wirtz et al. 关8兴 reported experimental results
They fixed the fin cross-sectional area per unit base area, the on the thermal performance of model pin-fin fan-sink assemblies.
wetted surface area per unit base area, and the flow passage area They used cylindrical, square, and diamond shape cross section
for all geometries. They found that circular pin fins outperform pin-fins and found that cylindrical pin-fins give the best overall
square pin fins and elliptical fins outperform plate fins. They also fan-sink performance. Furthermore, the overall heat sink thermal
found that elliptical fins work best at lower values of pressure resistance decreases with an increase in either applied pressure
drop and pumping work whereas round pin fins offer highest per- rise or fan power and fin height. Laor and Kalman 关9兴 investigated
formance at higher values. Li et al. 关2兴 showed experimentally that the performance of longitudinal fins, spines, and annular fins hav-
the heat transfer rate with elliptical pin fins is higher than that with ing rectangular, triangular, and parabolic shapes with uniform and
circular pin fins while the resistance of the former is much lower nonuniform heat generation and temperature distributions,
than that of the latter in the Reynolds number range from 1000 to whereas Mokheimer and Esmail 关10兴 investigated the perfor-
10,000. Chapman et al. 关3兴 investigated experimentally the paral- mance of annular fins of different profiles subject to locally vari-
able heat transfer coefficient.
Culham and Muzychka 关11兴 presented a method to optimize
Contributed by the Electronic and Photonic Packaging Division of ASME for
publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received July 13,
plate fin heat sink based on the minimization of entropy genera-
2004; final manuscript received February 24, 2006. Review conducted by Koneru tion resulting from viscous fluid effects and heat transfer. They
Ramakrishna. used a novel approach for incorporating forced convection
324 / Vol. 128, DECEMBER 2006 Copyright © 2006 by ASME Transactions of the ASME
Fig. 1 Cross sections of selected geometries
Geometry
L l d s 2a
Ac tl d2 / 4 s2 ab
Ap LH dH sH 2aH
P 2共l + t兲 d 4s 4aE共e兲
C1 1.357 5.781 0 −4.1关0.67− exp共0.733⑀兲兴 关17兴
C2 0 1.152 2 1.1526⑀0.951 关17兴
C3 0 1.26 0 1.26⑀0.95 关17兴
C4 0.75 0.593 0.102 0.75− 0.16 exp共−0.018⑀−3.1兲 关17兴
C5 2⑀1共1 + ⑀1兲 2 / 4 4 4⑀ / 16E2共e兲 关17兴
C6 2共1 + ⑀1兲 / ⑀1 4 4 16E2共e兲 / 2⑀ 关17兴
n 1/2 1/2 0.675 1/2 关18兴
Combining Eqs. 共2兲–共10兲, the entropy generation rate can be writ- NuLk f
ten as hb = 共21兲
冋 册
L
1 1 FDUapp
Ṡgen = Q − + 共11兲 where the dimensionless average heat transfer coefficients NuL for
Ta Tb Ta the selected geometries and Nub for the base plate are developed
Rearranging the terms and writing b = Tb − Ta, we have by Khan 关17兴 and can be written as
Qb FDUapp NuL = C4 ReLn Pr1/3 共22兲
Ṡgen = + 共12兲
T aT b Ta
NuL = 0.75 Re1/2
b Pr
1/3
共23兲
As b = QRtot, the entropy generation rate can be written as
with
Q2Rtot FDUapp
Ṡgen = + 共13兲 LUapp LUapp
T aT b Ta ReL = and ReL = 共24兲
This expression describes the entropy generation rate model com-
pletely and it shows that the entropy generation rate depends on The constant C4 and the index n for all geometries are given in
the total thermal resistance Rtot and the drag force, provided that Table 1. In dimensionless form, entropy generation rate, Eq. 共13兲,
the heat load and ambient conditions are specified. for any arbitrary cross section is written as
Quantity Dimension
Fig. 7 Contribution of heat transfer and friction irreversibili- Fig. 10 Effect of aspect ratio on dimensionless entropy gen-
ties in dimensionless entropy generation rate eration rate