Product End-of-Life Disassembly Instr uctions

Product Category: Monitors and Displays

Marketing Name / Model

[List multiple models if applicable.]
Compaq R191b 18.5-inch Monitor

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Quantity
of items
Item Description Notes
included
in product
Printed Circuit Boards (PCB) or Printed Circuit With a surface greater than 10 sq cm 3
Assemblies (PCA)
Batteries All types including standard alkaline and lithium coin 0
or button style batteries
Mercury-containing components For example, mercury in lamps, display backlights, 0
scanner lamps, switches, batteries
Liquid Crystal Displays (LCD) with a surface greater Includes background illuminated displays with gas 1
than 100 sq cm discharge lamps
Cathode Ray Tubes (CRT) 0
Capacitors / condensers (Containing PCB/PCT) 28
Electrolytic Capacitors / Condensers measuring 0
greater than 2.5 cm in diameter or height
External electrical cables and cords 2
Gas Discharge Lamps 0
Plastics containing Brominated Flame Retardants 0
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
Components and parts containing toner and ink, Include the cartridges, print heads, tubes, vent 0
including liquids, semi-liquids (gel/paste) and toner chambers, and service stations.
Components and waste containing asbestos 0
Components, parts and materials containing 0
EL-MF877-00 Page 1
Template Revision B

PSG instructions for this template are available at EL-MF877-01

refractory ceramic fibers
Components, parts and materials containing 0
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description Tool Size (if
applicable)
Description #1 SCREW DRIVER #2
Description #2
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Lay the Monitor on the desk.

2. Take out the Base with hand.
3. Take out the Bezel with hand.
4. DTake the back cover and Keypad ware out with hand.
5. Take the kepad board out from back cover with hand
6. Unlock 4 screws which fix the back cover and Hinge .
7. Unlock 3 screws which fix stand arm and Hinge
8. Take the tape and foil with fixs the panel and chassis,ware,LVDS the remove the Panel wares and LVDS ware.
9. Take the Mylar out
10. Unlock 5 screws which fix chassis and board.
11. Unlock 2 screws which fix chassis and power board and 2 screws which fix chassis and IF borad.
12. Take the connect out.
13.

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).

EL-MF877-00 Page 2
Template Revision B

PSG instructions for this template are available at EL-MF877-01

 Disassembly Flowchart for HP R191 Model
Issue Date:May 24th, 2012
Initiator: Cook Lau

Action Tool Photo

Lay the Monitor on the desk. N/A

Take out the Base with hand. N/A

Take out the Bezel with hand. N/A

Take the back cover and Keypad ware

N/A
out with hand.

Take the kepad board out from back

N/A
cover with hand

Unlock 4 screws which fix the back

#2 Crossing Screw Driver
cover and Hinge .

Unlock 3 screws which fix stand arm

#2 Crossing Screw Driver
and Hinge.
Take the tape and foil with fixs the panel
and chassis,ware,LVDS the remove the N/A
Panel wares and LVDS ware.

Take the Mylar out N/A

Unlock 5 screws which fix chassis and

#2 Crossing Screw Driver
board.
 Unlock 2 screws which fix chassis and
#2 Crossing Screw Driver and
power board and 2 screws which fix
#1 Bushing Screw Driver
chassis and IF borad.

Take the connect out. N/A