 Memory Packaging

 Unit-4

Types of Memory Packaging:

 SIPP or single in-line pin package

 Dual Inline Packages (DIPs)

 SIMM

 DIMM

 RIMM

 SIPP or single in-line pin package

 A SIPP was a type of random access memory.

 It consisted of a small printed circuit board upon which were mounted a number of memory
chips.

 It had 30 pins along one edge which mated with matching holes in the motherboard of the
computer.

 This type of memory was used in 80286 and some 80386 systems. It was later replaced by
SIMMs, which proved to be easier to install.

 SIPP or single in-line pin package

 Dual Inline Packages (DIPs)

 Most memory chips are packaged into small plastic or ceramic packages called dual inline
packages or DIPs.

 A DIP is a rectangular package with rows of pins running along its two longer edges. These are
the small black boxes you see on SIMMs, DIMMs or other larger packaging styles.

 The DIP has been the standard for packaging integrated circuits since the invention of the PC,
and in fact the earliest processors were also packaged as (large) DIPs.

 Dual Inline Packages (DIPs)

 Dual Inline Packages (DIPs)

 Older computer systems used DIP memory directly, either soldering it to the motherboard or
placing it in sockets that had been soldered to the motherboard.
  At that time most systems had a small amount of memory (less than one megabyte) and this
was the simplest way to do things.

 However, this arrangement caused many problems. Chips directly soldered onto the
motherboard would mean the entire motherboard had to be trashed if any of the memory chips
ever went bad.

 Dual Inline Packages (DIPs)

Disadvantages

 Chips inserted into sockets suffered reliability problems as the chips would (over time) tend to
work their way out of the sockets. Due to thermal contraction and expansion as the machine
was turned on and off, the chips would actually slowly come loose.

 However, this arrangement caused many problems. Chips directly soldered onto the
motherboard would mean the entire motherboard had to be trashed if any of the memory chips
ever went bad.

 Dual Inline Packages (DIPs)

 Newer systems do not use DIP memory packaging directly.

 The DIPs are soldered onto small circuit boards called memory modules.

 The two most common being the single inline memory module or SIMM and the dual inline
memory module or DIMM.

 The circuit boards are inserted into special sockets on the motherboard that are designed to
eliminate the chip creep problem. This arrangement makes for better reliability and easier
installation. Also, since SIMMs and DIMMs are (for most PCs) industry standard, it makes
upgrades much simpler as well.

 SIMM (single in-line memory module)

 A SIMM, or single in-line memory module, is a type of memory module containing RAM used in
computers from the early 1980s to the late 1990s.

 Most early PC motherboards (8088-based PCs, XTs, and early ATs) used socketed DIP chips
for DRAM.

 As computer memory capacities grew, memory modules were used to save motherboard space
and ease memory expansion

 SIMM (single in-line memory module)

 SIMMs were invented in 1982 by James J. Parker at Zenith Microcircuits.

 The first variant of SIMMs has 30 pins and provides 8 bits of data used with 286, 386 & 486
computers.

 The second variant of SIMMs has 72 pins and provides 32 bits of data used with 486 & Pentium
computers.

 SIMM (single in-line memory module)

 SIMM (single in-line memory module)

 Single Sided  30 Pins  8 Bits  4MB

 Double Sided  72 Pins  32 Bits  upto 32MB

 The SIMM was inserted at an angle, then tilted into an upright position.

 To remove one, the two metal or plastic clips at each end must be pulled to the side, then the
SIMM must be tilted back and pulled out

 DIMM or dual in-line memory module

 A DIMM or dual in-line memory module comprises a series of DRAM integrated circuits.

 These modules are mounted on a printed circuit board and designed for use in personal
computers, workstations and servers.

 DIMMs began to replace SIMMs (single in-line memory modules) as the predominant type of
memory module as Intel P5-based Pentium processors began to gain market share.

 DIMM or dual in-line memory module

 While the contacts on SIMMs on both sides are redundant, DIMMs have separate electrical
contacts on each side of the module.

 Another difference is that standard SIMMs have a 32-bit data path, while standard DIMMs have
a 64-bit data path.

 Since Intel's Pentium, many processors have a 64-bit bus width, requiring SIMMs installed in
matched pairs in order to populate the data bus. The processor would then access the two
SIMMs in parallel. DIMMs were introduced to eliminate this disadvantage.

 DIMM or dual in-line memory module

 DIMM or dual in-line memory module

 DIMM 168 Pins  64 bits  64/128/256 MB

 RIMM or Rambus in-line memory module

 Identical to RIMM, but slightly bigger.

 Also called Direct Rambus Memory Module (RDMM).

 RIMM is a memory module developed by Kingston Technology Corp.

 A RIMM has a 184-pin connectors with 800 MHz.

 RIMM or Rambus in-line memory module

 RIMM modules are commonly used on Pentium –IV .

 RIMM include a long heat sink or heat separator used to manage the temperature.

 RIMM or Rambus in-line memory module

 RIMM modules are commonly used on Pentium –IV .

 RIMM include a long heat sink or heat separator used to manage the temperature.

 RIMM or Rambus in-line memory module

 Thanks