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Electrolytic Capacitors
Technology Intro
High Energy Density Electrolytic
with Industry’s Lowest‐Profile
Lowest‐Profile, High‐Energy Density
Aluminum Electrolytic Capacitors.
ULP Series takes a new approach in aluminum
electrolytic technology for low‐profile circuitry.
• 2 or 3mm thin…comparable in height to
SMT tantalum capacitors
• Can replace arrays of SMT, solid tantalum
or aluminum electrolytic capacitors
• Increases reliability – one device vs.
many; fewer PCB connection points
• 3,000 hr. life @ 85 C (105 C under test)
• ‐55 to 105 C at full‐rated voltage
ULP Ultra‐Low Profile Series includes
16 value/voltage combinations.
• Capacitance from 500µF to 24,000µF, 4 to 63 WVDC
Traditional methods of low‐profile bulk
storage consume valuable PCB space!
• A single ULP can replace
34 to 208 solid tantalum chip
caps, depending on values!
• About 70% less board space
than ULP alternatives!
• Eliminates wasted space between
components in bulk arrays
• Link to ULP Product Cut Sheet
http://www.cde.com/resources/catalogs/ULP.pdf
Smaller, more reliable circuits are possible
with ULP Ultra‐Low Profile Capacitors.
• Lower in height than V‐chip
electrolytics, tantalums or
board‐mounted axials,
with much greater bulk
storage capability
• Provides bulk storage in the
least amount of space
• Overall size and weight of
finished board is reduced
2 or 3mm thin!
Keys to high performance…
• Ultra‐thin package concept
allows much denser
concentration of foil and
electrolyte
• Higher capacitance density
due to high‐gain foils, unique
packaging and seal system
• Up to 0.4J/cc energy density
• Nickel‐Silver Outer Case
• Flex (FPC) lead system
• Very robust construction,
10g vibration rating
Not just lower profile…
ULP is a better capacitor!
• Primary seal is a heat‐
sealed polymer / no rubber
gaskets or grommets!
• Primary seal is near‐
hermetic, for long life
• Outer metal casing is also 1. Top Case Half
2. Capacitor Assembly
sealed and provides a layer 3. Bottom Case Half
of physical protection
Design characteristics.
• Case thickness is only
2 or 3mm with a footprint
of 62x42mm
• Flex (FPC) Lead System
allows on or off‐board
mounting
• Integrated solution to
board ZIF connector
• Sealed, robotically laser‐
welded nickel‐silver case
• REACH/RoHS Compliant
• Very light weight
Designed for maximum capacitance
in the smallest package.
ULP capacitors allows designers to
“think thin,” while achieving higher
end‐product performance...
• Bulk storage in portable devices
• Disk drives
• Portable instruments and
medical monitors
• IoT remote monitoring devices
• Compact power supplies
• Drones and RPVs
• Video monitors, displays
ULP Ultra‐Low Profile Series Summary
• Ultra‐thin package design: 2 or 3mm
• One ULP capacitor can replace up to 160
tantalum chips, depending on values
• Up to 0.4J/cc energy density, saves space
• Values from 500µF to 24,000µF;
4 to 63 WVDC
• Rated at 3,000 hours at 85 C
• Increases reliability – one device vs.
many; fewer PCB connection points