HUAWEI P8 Lite

N
Huawei P8 Lite (ALE-Lxx,ALE-UL00,ALE-TL00)Service Manual

2 PCBA Working Principle
Figure 2-1 Conceptual block diagram
MT Pro
MT Pro
The ALICE (ALE-L21, ALE-L23, ALE-L02, ALE-UL00, or ALE-TL00) is a 4G bar-type phone developed
by Huawei based on the V8R2 platform and RF IC Hi6361 chip.
The PCBA of the phone includes the processing module Hi6220 SOC, Hi6553 (PM module), Hi6522
Scharger, RF module (including the transceiver, PA, and antenna), man-machine interfaces, and dedicated
functional modules Hi1101 (such as Wi-Fi, GPS, Bluetooth, and FM). The LCD connects to the PCBA
through the FPC; the receiver and speaker box connect to the PCBA through springs; the RF antenna is
integrated into the speaker box and connects to the PCBA through springs; the primary and secondary
silicon microphones are soldered to the PCBA. All the preceding components plus the covers and battery
comprise a mobile phone.
The ALICE incorporates a 5.0-inch TFT LCD with a resolution of 1280 x 720 pixels and provides the
following features:
l micro-USB port for charging
l Polyphonic ringtones and vibration
l FM function
l Built-in RF antenna
l Built-in lithium battery of 2200 mAh
2018-05-24 Huawei confidential. No spreading without permission. Page 6 of 70

ALICE Advanced Maintenance Manual CONFIDENTIAL
3.2 Component List

Figure 3-6 and Figure 3-7 are component lists, which are provided for your reference only. It is subject to
changes without notice. Obtain the latest component information from Huawei. If you have any questions,
contact the local technical support center.
Figure 3-6 PCBA component list

Figure 3-7 Assembly component list
4 Maintenance Tools
To apply for tools for simplified maintenance, see the Simplified Maintenance Manual.
Name: GPIB card

Usage: for RF calibration (CBU test)
Name: GPIB cable

Name: programmable power supply

(Keithley 2303/2306, Agilent66311B)
Usage: to supply power to the PCBA during RF calibration
(CBT test)
Name: CMW500
Usage: RF calibration (CBU test)
Name: PCBA DT test fixture

Usage: PCBA upgrade and loading

Name: GPIB card

Name: Phone PT test fixture

Usage: for phone PT test
Name: Phone MT test fixture

Usage: for phone MT test
Jig for fastening phone screws

Usage: securing all screws on the phone body
Name: physical number modification watchdog

Usage: modifies IMEI numbers and writes SIMLOCK
information(applicable to advanced service centers)
Name: equipment maintenance watchdog

Usage: for equipment CBT test

5 Maintenance Process
Figure 5-1 Device maintenance workflow
Table 5-1 Steps in the equipment maintenance workflow
Name Description
Take the work order A maintenance supplier receives malfunctioning devices from Huawei.
Upgrade and load Same software but different tools are used for upgrade and loading. The loading tool
software does not reserve calibration information or production NV information, whereas the
upgrade tool reserves the preceding information.
Perform the CBU test The test includes RF calibration and the RF function test. RF calibration helps
optimize the phone's RF performance, while the RF function test checks whether the
RF performance meets the requirements.
Write board bar codes The PCB SN must be rewritten for a main board where the loading tool has been used
to download software.
Perform the MMI The MMI test is carried out by the self-check software provided with the phone. The
Test test helps test the phone functions. For details, see the simplified maintenance manual.
Perform the phone The phone MT test is used to test the phone's signal reception and transmission. For
MT details, see the RF test guide.
Perform the PT The electrical signal test includes standby and leakage current tests.
This step is to modify the IMEI, SN, Bluetooth, and MAC address information. Refer
Rewrite the physical to the local service policy to determine whether to modify the IMEI. If IMEI
number modification is not required, skip this step.
Repair the PCBA The method for repairing the PCBA is similar to that for the phone. The only
difference is that renewing repair is not required after faults are rectified in the PCBA.

6 Troubleshooting
Before the maintenance, restore the phone to its factory settings to ensure that the failure is not caused by
environmental factors or incorrect functional settings. It is recommended that you restore the phone to its
factory settings to ensure that the failure is not caused by environmental factors or incorrect functional
settings.
Figure 6-1 Conceptual block diagram and phone introduction
The ALICE is a 4G bar-type phone developed by Huawei based on the V8R2 platform and RF IC Hi6361
chip.
The PCBA of the phone includes the processing module Hi6220 SOC, Hi6553 (PM module), Hi6522
Scharger, RF module (including the transceiver, PA, and antenna), man-machine interfaces, and dedicated
functional modules Hi1101 (such as Wi-Fi, GPS, Bluetooth, and FM). The LCD connects to the PCBA
through the FPC; the receiver and speaker box connect to the PCBA through springs; the RF antenna is
integrated into the speaker box and connects to the PCBA through springs; the primary and secondary
silicon microphones are soldered to the PCBA. All the preceding components plus the covers and battery
comprise a mobile phone.
The ALICE incorporates a 5.0-inch TFT LCD with a resolution of 1280 x 720 pixels and provides the
following features:
l micro-USB port for charging
l Polyphonic ringtones and vibration
l FM function

l Built-in RF antenna
l Built-in lithium battery of 2200 mAh
6.1 Baseband Unit
6.1.1 Power-On Management Circuit
Circuit Diagrams

Circuit Analysis
When a battery is inserted into the phone, PWRON_N is at high level. When you press the power key,
PWRBT is connected to GND, PWRON_N is pulled down, and an interrupt occurs. The power supplies
start to work in sequence, and the system is powered on.
In detail, the buck power supply for AVDD1.8 V starts at the very beginning, and then the BUCK4 and
LDO4 power supplies start in sequence. After all the power supplies that should be started by default are on
and the power-on sequence and power supply requirements are met, the system is powered on and reset.
After the power-on process is completely carried out, the baseband chip sends the RESET_IN signal to the
PM IC to confirm the startup of the system.
To ensure that the phone is properly powered on, the PWRKEY signal should be kept low until the PM IC
receives the PWRBB signal.
When an effective charger is connected to the phone, if the charger is detected by the system, the system
will also start in case that the input voltage is within a range where an OVP event does not occur. However,
if the voltage is lower than the UVLO voltage or the battery is not in position, the system will not start up.
If the voltage is lower than the UVLO voltage but the battery is in position, the system will charge the
battery. When the battery voltage is high enough, the system automatically starts up.
Troubleshooting Process
To troubleshoot the power-on failure, check whether the I/O connector (battery connector) is damaged first.
If the battery connector is not damaged, use a DC regulated power supply to power the phone, and test the
current of the phone.
The power-on failures include the following types:
l No current startup failure

l Weak current startup failure

l Excessive current startup failure
1. Troubleshooting no current startup failures (lower than 10 mA or nearly no current)
2. Troubleshooting weak current startup failures (lower than 100 mA)

3. Troubleshooting excessive current startup failures (higher than 1 A)

6.1.2 Charging Management Circuit
Circuit Diagram

Circuit Analysis
Scharger integrates functions of a charger and can be used to charge a mobile phone battery. The charger
can intelligently adjust the charging stage based on the battery voltage, without any intervention from
software. In the charging disabled stage, charging automatically terminates when the charging current is
smaller than a preset value. When the voltage of a fully charged battery decreases to the threshold for
recharging, the charger automatically starts recharging. In addition, the charger provides various safety
protection functions, including the battery temperature detection, charging safety timer, overvoltage
protection, and thermal regulation.
(1) BATFET Control
After the system is powered on, the default state of BATFET is On. When detecting that the battery is in
position, SoC charges the battery by controlling the register of the battery. If the battery is not in position,
SoC does not charge the battery. When the system detects a battery charge fault, it forcibly turns BATFET
on/off by CHG_REG0<4> of the I2C control register. After BATFET is turned off, the battery charging
and discharging circuit is disconnected.
(2) Charge Control
After power-on, the default state of Charge configuration is Disabled. You can control Charge
Enabled/Disabled of a battery by the I2C control register and hard wire CENB. The register for enabling
charging is ONFF1<4>, and the high level indicates that charging is enabled. Low CENB indicates that
charging is enabled. Charging can start only when the hard wire CENB and register take effect. In Charge
Enabled state, the control mode of BATFET varies according to the battery charging stage.
After all protection mechanisms work, Scharger can also use the hard mechanism to prevent the circuit
from charging. However, the register state is still Charge Enabled. After receiving the suspension signal,
SoC must write 0 to the Charge configuration register to switch to Charge Disabled.
There are two types of common charging failures:
l The phone has no response after a charger is connected to it.
l The phone displays an animated icon indicating that it is charging, but actually the battery is not
charged.
To troubleshoot charging failure, first check whether the battery connector is damaged.
l The charging indicator is not displayed when the phone is connected with the charger.
l The charging indicator is displayed when the phone is connected with the charger but the battery fails
to be charged.

Circuit Signals
Signal Symbol Description Reference Measurement or

Wave Form
VCHG Charger power input 5V

VPH_PWR Scharger output 3.4 V-4.2 V
VBAT Battery voltage 3.4 V-4.2 V

6.1.3 Clock Circuit
Circuit Diagram
Circuit Analysis
l DCXO mode
l TCXO mode

No output from the clock
Is the crystal oscillator Resolder

properly soldered?
Y
Y
Is the crystal Replace the
oscillator damaged? crystal oscillator.
Resolder or replace the

IC of the clock.

Circuit Signals
Signal Symbol Description Reference Measurement or Wave

Form
19.2 MHz crystal Provide the clock source for BB.

oscillator

6.1.4 Flash Memory Circuit
Circuit Diagram
Circuit Analysis
V8R2 can access the external storage eMMC through an MMC bus, and eMMC transmits data through an
8-bit data cable.
You may hardly find a memory is faulty. When a memory is faulty, it may cause other failures.
Troubleshoot the failures according to the corresponding procedures. However, the memory chip may have
few changes to break down.
Circuit Signals

Form
LDO5_1P8 Power Supply for Flash 1.8 V

EMMC_CLK Clock signals for the eMMC 200 MHZ
EMMC_CMD Command signals for the eMMC
EMMC_RST_N Reset signals for the eMMC


Form
EMMC_DATA[0:7] Data line for the eMMC
6.2 RF Unit
The RF subsystem can be divided into RF transceiver (Hi6361), RF PMU (Hi6561), and 4-in-1 chip
Hi1101 that includes the Wi-Fi, Bluetooth, GPS, and FM modules. This chapter will describe these parts in
detail.
The ALICE is a WCDMA smartphone based on the HiSilicon platform V8R2+Hi6361. The V8R2 is 1.2
GHz octa-core, supporting Android 4.4. The Wi-Fi, Bluetooth, FM, and GPS modules are integrated in the
4-in-1 chip Hi1101, which helps improve the integration level of the platform.

6.2.1 Reception Channel
Circuit Diagrams





Circuit Analysis
Signals received by the mobile phone antenna are transmitted to the RF switch by the microstrip line
through the mobile phone test socket. In the RF switch, signals are distributed to the corresponding
receiving channels and then processed in Transceiver.

6.2.2 Transmission Channel
Circuit Diagrams

Circuit Analysis
RF signals are amplified by PA, go through the duplexer, and are radiated by the antenna.


6.2.3 GPS Channel
Circuit Diagram
If no GPS signals can be received by the phone, check whether the antenna and antenna springs are
properly connected. If yes, check whether signals are available at the back of the SAW filter. If no signals
are available, replace the SAW. If signals are available, check whether the LNA back end has signals (the
GPS module has no test base, and therefore use an RF cable for the inspection). If no signals are available,
replace the LNA. If the circuit has no missing component but the problem persists, return the phone to
Huawei for repair.
6.2.4 Wi-Fi Channel
Circuit Diagram
The Wi-Fi module has no test base. Therefore, use an RF cable to check signals in multiple segments.
Wi-Fi channels must match.

If no component is missing on the Wi-Fi circuit, the 4-in-1 chip may be damaged. Return the phone to
Huawei for repair.
6.3 Peripheral Circuits
6.3.1 LCD Circuit
Circuit Diagram
Circuit Analysis
The LCD BTB connector J2001 connects the LCD module to U501. The LCD module uses high-speed
MIPI data lines (one group for clock signals and three groups for data signals) for signal transmission and
supports a refresh rate of 60 Hz. T2001 to T2005 are the common-mode chokes for five groups of the MIPI
data lines and used to prevent the interference from entering the LCD module and radiating to other
components. With the frame synchronization function, the LCD uses LPTE as the data transmission
synchronization signal to avoid screen tearing. The LCD module has two power supplies LDO5_1P8 and
LCD_VSP/VSN. The LCD_ID1 and LCD_ID0 signals are used to identify the LCD manufacturer. The
LCD_PWM_OUT is backlight control signal.
The location number U2001 indicates the backlight control chip. VPH_PWR passes through the boost
circuit and converts into the backlight power supply signals LED_A and LED_K. The 5.0-inch LCD
backlight uses two groups of LEDs (5 LEDs in each group and 10 LEDs in total) that are connected in
serial. The backlight is controlled by the backlight driver chip. The LED brightness (current output by the

driver) is controlled by the PWM signals. When no data is transmitted, LCD_PWM outputs nothing, and
the LCD backlight is turned off.

Circuit Signals

Form
LCD_VSP Power input 5.4 V

LCD_VSP Power input –5.4 V
LCM_D0P MIPI signal line High-speed digital differential signal
LCM_D0N MIPI signal line High-speed digital differential signal
LCM_CLKP MIPI clock High-speed digital differential signal
LCM_CLKN MIPI clock High-speed digital differential signal
LCD_ID1 Manufacturer detection signal
LCD_ID0 Manufacturer detection signal
LED_P Backlight adjusting signal DC voltage: about 15 V
LED_N Backlight adjusting signal
LCD_PWM_OUT Backlight adjusting signal Switch on: high level or PWM signal
Switch off: 0 V
GND Ground cable 0V

6.3.2 Touchscreen
Circuit Diagram
Circuit Analysis
The touchscreen (TP) controller is on the FPC and is connected to the PCBA through J2501.


Circuit Signals

Form
None TP controller power supply 2.85 V

None TP controller power supply 1.8 V
GPIO_1_0_TP_INT_N TP controller interrupt signal Low pulse signal
GPIO_10_4_TP_RST_N TP controller reset signal

6.3.3 Front Camera
Circuit Diagram
Circuit Analysis
The front camera supports 5 megapixels, uses a 24-pin BTB connector and MIPI interface to communicate
with the main board, and is controlled through the I2C data bus.

Circuit Signals

Form
LDO_CAM_2P8 Camera analog power supply 2.8 V

LDO13_1P8 Camera digital power supply 1.8 V
ISP_PWDN2_SCA Camera power supply enabling signal
M_PWDN
ISP_RESETB1 Camera initialization signal Effective when at low level
The operating level is high.
SCAMIF_MCLK Reference clock for the camera; 24 MHz Digital pulse signal
SCAM_CLKN/P Pixel clock for the system MIPI differential clock
ISP_SCL1 Camera I2C signal for transmitting Digital pulse signal


Form
ISP_SDA1 control and configuration data Digital pulse signal

SCAM_D0N/P MIPI differential data signal Differential data signal
6.3.4 Rear Camera
Circuit Diagram
Circuit Analysis
The rear camera supports a resolution of 13 megapixels, uses a 34-pin BTB connector and MIPI interface
to communicate with the PCBA, and is controlled through the I2C data bus.


Circuit Signals
Signal Symbol Description Reference Measurement or Wave Form
LDO_CAM_2P8 Camera analog power supply 2.8 V

LDO14_2P8 Camera focusing motor's power 2.85 V
supply
MCAMIF_MCLK Reference clock for the camera; Digital pulse signal
24 MHz
MCAM_CLKP MIPI clock signal High-speed digital pulse signal
MCAM_CLKN MIPI clock signal High-speed digital pulse signal
MCAM _D0P MIPI data signal High-speed digital pulse signal
MCAM _D0N MIPI data signal High-speed digital pulse signal
MMCAM _D1N MIPI data signal High-speed digital pulse signal
MCAM _D2N MIPI data signal High-speed digital pulse signal
MMCAM _D3N MIPI data signal High-speed digital pulse signal
ISP_SCL0 I2C control signal Digital pulse signal
ISP_SDA0 I2C control signal Digital pulse signal
ISP_RESETB0 Camera initialization signal Effective when at low level
The operating level is high.

6.3.5 Acceleration Sensor
Circuit Diagram
Circuit Analysis
The acceleration sensor U2201 sends the real-time acceleration information to the CPU through the I2C2
data bus. GPIO_0_1_ACC_INT and GPIO_0_2_GYR_INT are interrupt signals.

Circuit Signals
LDO5_1P8 Sensor power supply 1.8 V

LDO2_2P8 Sensor power supply 2.8 V
GPIO_0_1_ACC_INT Interrupt signal Effective when at low level
When no signal is transferring, the level is high.
GPIO_0_2_GYR_INT Interrupt signal Effective when at low level
I2C2_SCL I2C signal, used to read the High and low pulses
light, proximity, and IR sensing
I2C2_SDA information High and low pulses

6.3.6 Ambient/Proximity Sensor Circuit
Circuit Diagram (HL1ALICEFS)
Circuit Analysis
The sensor U200 is a 3-in-1 sensor that has the light sensor, proximity sensor, and IR sensor integrated. It
transmits light, proximity, and IR sensing information to the CPU through the I2C data bus in real time.
ALS_INT is the interrupt signal.

Circuit Signals
VDD Sensor power supply 2.8 V

ALS_INT Interrupt signal Effective when at low level
I2C_SCL I2C signal, used to read the light, High and low pulses
proximity, and IR sensing
I2C_SDA information High and low pulses
6.3.7 Keypad
Circuit Diagram (HL1ALICEFP)
Circuit Analysis
The button circuit is simple because only three buttons (power, volume up, and volume down) are used.
Each button is controlled by a signal. When a button is not pressed, its control signal is at high level; when
it is pressed, the control circuit is short-circuited to the ground, and the control signal changes to low level.
Serving as the bearer of the volume up and volume down keys, the volume key FPC connects the keys to
the main chip U501 through the ZIF connector J2401.

Circuit Signals
KEY_PWRON_N Power-on and power-off signal Default: high level

The level is low when the power key is pressed.
GPIO_3_0_KEY_VO Volume up signal Default: high level
LUME1_N The level is low when the power key is pressed.
GPIO_2_5_KEY_VO Volume down signal Default: high level
LUME2_N The level is low when the power key is pressed.

6.3.8 Vibration Circuit
Circuit Diagram
Circuit Analysis
LDO17_2P8 signals output by the PMU chip supply power to the vibration motor.

Circuit Signals

Form
LDO17_2P8 Motor power supply driving signal 2.8 V
6.3.9 Voice Reception Circuit
Circuit Diagram

Circuit Analysis
The receiver is driven by the EAR_P and EAR_N differential signals output by the platform PMU. C1801
and C1802 filter the RF interference out, and C1816 filters the differential interference out.

Circuit Signals

Form
EAR_N Differential input's negative electrode Analog differential signal

EAR_P Differential input's positive electrode Analog differential signal
6.3.10 Voice Transmission Circuit
Circuit Diagram
Circuit Analysis
The MICBIAS power supply output by the platform PMU provides bias voltage for the microphone. Sound
collected by the microphone are converted into MIC_P and MIC_N differential signals and sent to the CPU
for processing. The ALICE applies dual microphones, and both support noise reduction.

Circuit Signals

Form
MICBIAS Microphone power supply 2.7 V

MIC_P Differential signal input's positive Analog differential signal
electrode
MIC_N Differential signal input's negative Analog differential signal
electrode

6.3.11 Speaker
Circuit Diagram
Circuit Analysis
The speaker is driven by the SPK_L_P and SPK_L_N differential signals output by the power management
chip. The speaker connects to the speaker subboard through springs.

Circuit Signals

Form
SPK_L_P Differential signal input PWM signal

SPK_L_N Differential signal input PWM signal

6.3.12 Headset
Circuit Diagram
Circuit Analysis
When a headset is inserted into the phone, pin 4 of the headset connector is pulled down, and
HS_DETECT_N generates an interrupt. The CODEC (PMU) detects the interrupt, determining that a
headset has been inserted.
Troubleshooting headset earpiece failure

Troubleshooting headset microphone failures

Circuit Signals

Form
LDO5_1P8 Headset insertion detection 1.8 V

HS_MICBIAS Headset microphone power supply 1.9 V
HS_DETECT_N Interrupt detection signal Default: 1.5 V
Effective when at low level
HSL Headset left channel Pulse signal
HSR Headset right channel Pulse signal
HS_MIC_N Negative electrode of the microphone Differential signal
differential signal
HS_MIC_P Negative electrode of the microphone Differential signal


Form
differential signal
6.3.13 SIM Card Circuit
Circuit Diagrams

Circuit Analysis
The ALICE supports two SIM cards. The preceding circuit diagrams show the SIM card holder circuit,
which is a common one that can be seen on basically every platform. CLK is the clock signal, RST is the
reset signal, LDO9_UIM0 is the power supply signal, and DATA is the data signal.
Circuit Signals
UIM_CLK Clock signal /

UIM_RESET Reset signal /
LDO9_UIM0 Voltage signal If the cards can be detected, the voltage should be 3 V.
UIM_DATA Data signal /

6.3.14 microSD Card Circuit
Circuit Diagrams

Circuit Analysis
The microSD card holder is on the main board and communicate with U501 through the EMI
component. Data transmission (read and write) to the microSD card complies with the standard microSD
card protocol.
Circuit Signals
LDO5_1P8 Power supply signal Normal voltage: 3.3 V

SD_CLK Clock signal /
SD_CMD Command signal /
SD_DATA0—SD_DATA 3 Data signal /
GPIO_2_0_SD_DET_N microSD detection GPIO_2_0_SD_DET_N is at high level when the


signal microSD is not in position and the voltage is 1.8 V.
Otherwise, it is at low level and the voltage is 0 V.
6.3.15 USB Port
Circuit Diagram
Circuit Analysis
The preceding circuit diagram shows part of USB port circuit. USB_DM and USB_DP are the data lines.
VCHG is the voltage signal, which is 5 V.

Circuit Signals
VCHG USB power supply The voltage is 5 V.

USB_DM USB data (+) High-speed digital pulse signal

USB_DP USB data (–) High-speed digital pulse signal

7 Solder Points on the PCB and BGA Chip
Figure 7-1 Solder points on the bottom side

Figure 7-2 Solder points on the top side

HUAWEI P8 Lite

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Huawei P8 Lite (ALE-Lxx,ALE-UL00,ALE-TL00)Service Manual

Figure 2-1 Conceptual block diagram

2018-05-24 Huawei confidential. No spreading without permission. Page 6 of 70

3.2 Component List

Figure 3-6 PCBA component list

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Figure 3-7 Assembly component list

Name: GPIB card

Name: GPIB cable

Name: programmable power supply

Name: PCBA DT test fixture

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Name: GPIB card

Name: Phone PT test fixture

Name: Phone MT test fixture

Jig for fastening phone screws

Name: physical number modification watchdog

Name: equipment maintenance watchdog

2018-05-24 Huawei confidential. No spreading without permission. Page 11 of 70

Figure 5-1 Device maintenance workflow

Table 5-1 Steps in the equipment maintenance workflow

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Figure 6-1 Conceptual block diagram and phone introduction

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6.1 Baseband Unit

6.1.1 Power-On Management Circuit

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l Weak current startup failure

2. Troubleshooting weak current startup failures (lower than 100 mA)

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3. Troubleshooting excessive current startup failures (higher than 1 A)

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6.1.2 Charging Management Circuit

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Signal Symbol Description Reference Measurement or

VCHG Charger power input 5V

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6.1.3 Clock Circuit

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No output from the clock

Is the crystal oscillator Resolder

Resolder or replace the

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Signal Symbol Description Reference Measurement or Wave

19.2 MHz crystal Provide the clock source for BB.

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6.1.4 Flash Memory Circuit

Signal Symbol Description Reference Measurement or Wave

LDO5_1P8 Power Supply for Flash 1.8 V

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Signal Symbol Description Reference Measurement or Wave

EMMC_DATA[0:7] Data line for the eMMC

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6.2.1 Reception Channel

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