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Abstract – A deep neural network (DNN) model is differential via in practical design application. A broadband
developed in this paper for fast prediction of time-domain parametric equivalent model space-mapping neural network
reflectometer (TDR) impedance for differential vias in was applied with transmission line model and via-plate
high-speed printed circuit boards (PCBs). Unlike capacitance [2]. Recently, the deep neural network method and
traditional empirical linear modeling approaches, the DNN machine learning were applied for DDR channel modeling,
model more accurately maps the nonlinearity between via Eye Height/Width Prediction, Serializer/Deserializer (SerDes)
geometrical parameters and differential impedance. How Channel setting tuning and three-dimensional integration for
to select neural network type, training functions and how high-speed interconnect system [3-6]. These applications have
presented the efficient nonlinear modeling ability of neural
to select an efficient set of training data are discussed in
network to overcome the limitation of traditional method to
the paper. Good correlations between the predicted speed up the parameter optimization and variations analysis.
impedances and target values prove the accuracy and
reliability of the DNN model. The calculation time for a D_anti D_via
single data point is reduced to milliseconds, so that the S G
design efficiency of high-speed differential via design is D_sp S S
G S
significantly increased.
P_sg P_ss
Keywords—via model; differential via; TDR impedance; deep D_gp
learning method; Deep Neural Network (DNN); high-speed G G
channel design
P_gg
I. INTRODUCTION
Differential via is a critical part in designing high-speed Fig. 1. Geometrical parameters of the diffrential via in multi-layers PCB
channel in multi-layer printed circuit board (PCB). With the
increasing of clock rate and data rate above tens of Gbps, TABLE I. VIA DESIGN TUABLE PARAMETERS IN LAYOUT STAGE
transition via contributes a critical discontinuity to distort and
# Parameters Description Range(mils)
degrade signal performance. An accurate geometry-dependent 1 D_v Via Drill Hole Diameter 4.9 ~ 14.7
model is needed for geometrical parameters optimization of an
2 D_sp Signal via pad Diameter 9.5 ~ 28.5
example of differential via in the multi-layer board as shown in
3 D_gp GND via pad Diameter 10.5 ~ 31.5
figure 1. In a practical layout stage, the design parameters for
tuning the differential geometry can mainly focus on via drill 4 D_a Anti-pad Diameter 25 ~ 75
hole size, signal and ground pad size, anti-pad size and pitches 5 P_sg Signal-Ground Via Pitch 20 ~ 60
between signal and ground vias. 6 P_ss Signal-Signal Via Pitch 26 ~ 78
7 P_gg Ground-Ground Via Pitch 26 ~ 78
In the past years, many approaches were done on via
modeling and parameter tuning to optimize TDR impedance, In this paper, a deep neural network was proposed for
return loss and insertion loss for improving channel different-via impedance prediction with identified design
performance. There has been some work on simple lumped tunable parameters as inputs and impedance as output. The
element circuit RLC model and transmission line model with input parameters include seven geometrical variables of
some analytical approximation and optimization methods. But differential via, i.e. via drill hole diameter (Dv), signal via pad
via structure for a practical PCB board is excited by vertical diameter (Dsp), ground via pad diameter (Dgp), anti-pad
current with parallel plane waves between two parallel plates. diameter (Da), signal via to ground via pitch (Psg), signal via to
The higher order evanescent modes cannot be taken into signal via pitch (Pss) and ground via to ground via pitch (Pgg).
consideration in the above models. The parallel plate To get a training data set, an input table is generated by design
impedance model was studied with considering plane effects of experiment (DoE) to select the smallest set of designs in
[1]. However, these existing modeling strategies lack of fast each expected range [7]. Then HFSS full-wave simulations
and flexible parametric modeling ability for multi-layers board are performed for these training data points. These parameters
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maximum absolute error(MAX) for cost function to check algorithm function are optimized individually. The LM-BP
network performance. uses single layer with 6 neurons and then the training process
converges at 1000 iterations. The BR selects two layers with 6
1 N
and 4 neurons at first and second layers, then the training
MSE (¦ (Ti F ( xi )) 2 )
N i 1 process converges at 245 iterations. The GDX selected three
layers with 6-6-4 neurons at each layer, then correspondingly
RMSE
1 N
(¦ (Ti F ( xi )) 2 )
training process cannot converges until 50000 iterations.
N i 1
[1] Define Design Variables
Done
RMSE
NRMSE
Ymax Ymin [2]Generate DoE table with LHS [10] Validation of optimized Via
Parameters with HFSS
1 N
MAE (¦ Ti F ( xi ) ) [3] Extract TDR/Spara from HFSS
N i 1 Simulation [12] Building Genetic Via Model
MIN min( Ti F ( xi ) )
[4] Pre-processing on Dataset
Normalization [11] Save Trained Network
MAX max( Ti F ( xi ) ) Yes
[5] DNN Model Hyperparameter No [10] Meet
III. MODEL DEVELOPMENT AND VALIDATION Selection then Train a Network Cost Goal?
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TABLE II. TABULATED SAMPLES OF DATASET (150 DATA POINTS) WITH MAXIMUM AND MINIMUM VARIATION
$D_antipad $D_gnd_pad( $D_trace_pad $D_via $pitch_gg $pitch_sg $pitch_ss TDR11: dB(SDD11): dB(SDD12):
Variation
(mils) mils) (mils) (mils) (mils) (mils) (mils) Time(125ps) Freq(8GHz) Freq(8GHz)
01 59.88 16.98 13.73 4.938 57.48 52.34 77.46 138.1 -9.936 -0.9772
02 74.04 24.86 17.74 6.087 41.23 27.03 61.29 132.2 -10.87 -0.8425
… … … … … … … … … … …
44 37.29 22.23 19.82 6.852 43.67 42.03 59.49 102.1 -30.18 -0.4656
45 61.41 12.88 23.08 10.53 40.42 31.41 39.37 98.23 -43.31 -0.4195
… … … … … … … … … … …
149 26.19 11.57 27.39 10.07 59.92 54.84 38.29 64.93 -7.672 -1.361
150 28.11 21.57 27.54 14.59 66.42 47.34 40.45 57.36 -5.913 -1.895
(Single Layer 6 with 1000 iterations) (Two Layers 6-4 with 245 iterations) (Three Layers 6-6-4 with 50000 iterations)
(a) Levenberg-Marquardt Backpropgation (b) Bayesian regularization (c) Gradient descent w/momentum & adaptive learning rate
Fig. 6. Training Data(105 sets-70%), Development Data(22 sets-15%) and Testing Data(23 sets-15%) Correlation
between expected and predicted data trained with three different training algorithm for neural network
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[4] Q. Huang and J. Fan, "Machine Learning Based Source Reconstruction
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