Академический Документы
Профессиональный Документы
Культура Документы
100
10
Voltage Noise
1
0.1 1 10 100 1k 10k
Frequency (Hz)
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
OPA227, OPA2227, OPA4227
OPA228, OPA2228, OPA4228
SBOS110B – MAY 1998 – REVISED JUNE 2015 www.ti.com
Table of Contents
1 Features .................................................................. 1 7.2 Functional Block Diagram ....................................... 16
2 Applications ........................................................... 1 7.3 Feature Description................................................. 16
3 Description ............................................................. 1 7.4 Device Functional Modes........................................ 23
4 Revision History..................................................... 2 8 Application and Implementation ........................ 24
8.1 Application Information............................................ 24
5 Pin Configuration and Functions ......................... 3
8.2 Typical Application .................................................. 26
6 Specifications......................................................... 5
6.1 Absolute Maximum Ratings ...................................... 5 9 Power Supply Recommendations...................... 29
6.2 ESD Ratings.............................................................. 5 10 Layout................................................................... 29
6.3 Recommended Operating Conditions....................... 5 10.1 Layout Guidelines ................................................. 29
6.4 Thermal Information: OPA227U/UA and 10.2 Layout Example .................................................... 30
OPA228U/UA ............................................................ 5 11 Device and Documentation Support ................. 31
6.5 Thermal Information: OPA227P/PA and 11.1 Device Support .................................................... 31
OPA228P/PA ............................................................. 6 11.2 Documentation Support ........................................ 31
6.6 Electrical Characteristics: OPAx227 Series (VS = ±5 11.3 Related Links ........................................................ 31
V to ±15 V) ................................................................. 7
11.4 Trademarks ........................................................... 31
6.7 Electrical Characteristics: OPAx228 Series (VS = ±5
11.5 Electrostatic Discharge Caution ............................ 32
V to ±15 V) ................................................................. 8
11.6 Glossary ................................................................ 32
6.8 Typical Characteristics ............................................ 10
7 Detailed Description ............................................ 16 12 Mechanical, Packaging, and Orderable
Information ........................................................... 32
7.1 Overview ................................................................. 16
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
• Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section .................................................................................................. 1
Trim 1 8 Trim
Out A 1 8 V+
–In 2 7 V+ A
–In A 2 7 Out B
+In 3 6 Output B
+In A 3 6 –In B
V– 4 5 NC
V– 4 5 +In B
DIP-8, SO-8
DIP-8, SO-8
NC = Not Connected
Out A 1 14 Out D
–In A 2 13 –In D
A D
+In A 3 12 +In D
V+ 4 11 V–
+In B 5 10 +In C
B C
–In B 6 9 –In C
Out B 7 8 Out C
DIP-14, SO-14
6 Specifications
6.1 Absolute Maximum Ratings
(1)
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
Supply voltage, Vs = (V+) - (V-) 36 V
Voltage (V–) – 0.7 (V+) +0.7 V
Signal input terminals
Current 20 mA
Output short-circuit (2) Continuous
Operating temperature –55 125 °C
Junction temperature 150 °C
Tstg Storage temperature –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Short-circuit to ground, one amplifier per package
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
OPEN-LOOP GAIN
AOL Open-Loop Voltage Gain VO = (V–)+2 V to (V+)–2 V, 132 160 132 160 dB
RL = 10 kΩ
TA = –40°C to 85°C 132 132 dB
VO = (V–)+3.5V to (V+)–3.5 V, 132 160 132 160 dB
RL = 600 Ω
TA = –40°C to 85°C 132 132 dB
FREQUENCY RESPONSE
GBW Gain Bandwidth Product 8 8 MHz
SR Slew Rate 2.3 2.3 V/µs
0.1% G = 1, 10 V Step, CL = 100 pF 5 5 µs
Settling Time
0.01% G = 1, 10 V Step, CL = 100 pF 5.6 5.6 µs
Overload Recovery Time VIN × G = VS 1.3 1.3 µs
THD+N Total Harmonic Distortion + Noise f = 1 kHz, G = 1, VO = 3.5 Vrms 0.00005% 0.00005%
OUTPUT
Voltage Output RL = 10 kΩ (V–)+2 (V+)–2 (V–)+2 (V+)–2 V
RL = 10 kΩ (V–)+2 (V+)–2 (V–)+2 (V+)–2 V
TA = –40°C to 85°C
RL = 600 Ω (V–)+3.5 (V+)–3.5 (V–)+3.5 (V+)–3.5 V
RL = 600 Ω (V–)+3.5 (V+)–3.5 (V–)+3.5 (V+)–3.5 V
TA = –40°C to 85°C
ISC Short-Circuit Current ±45 ±45 mA
CLOAD Capacitive Load Drive See Typical Characteristics See Typical Characteristics
ZO Open-loop output impedance f = 1 MHz 27 27 Ω
180 0 180 0
OPA227 OPA228
160 –20 160 –20
140 –40 140 –40
G
120 –60 120 G –60
100 –80 100 –80
Phase (°)
Phase (°)
AOL (dB)
AOL (dB)
80 Φ –100 80 Φ –100
60 –120 60 –120
40 –140 40 –140
20 –160 20 –160
0 –180 0 –180
–20 –200 –20 –200
0.01 0.10 1 10 100 1k 10k 100k 1M 10M 100M 0.01 0.10 1 10 100 1k 10k 100k 1M 10M 100M
Frequency (Hz) Frequency (Hz)
Figure 1. Open-Loop Gain and Phase vs Frequency Figure 2. Open-Loop Gain and Phase vs Frequency
140 INPUT VOLTAGE AND CURRENT NOISE
SPECTRAL DENSITY vs FREQUENCY
120 100k
+CMRR
100
PSRR, CMRR (dB)
10k
Voltage Noise (nV/√Hz)
Current Noise (fA/√Hz)
80 +PSRR
1k Current Noise
60 –PSRR
40 100
-20
10
Voltage Noise
–0
0.1 1 10 100 1k 10k 100k 1M 1
Frequency (Hz) 0.1 1 10 100 1k 10k
Frequency (Hz)
Figure 3. Power Supply and Common-Mode Rejection Ratio Figure 4. Input Voltage and Current Noise Spectral Density
vs Frequency vs Frequency
0.01 0.01
VOUT = 3.5Vrms OPA227 VOUT = 3.5Vrms
OPA228
THD+Noise (%)
THD+Noise (%)
0.001 0.001
0.0001 0.0001
G = 1, RL = 10kΩ G = 1, RL = 10kΩ
0.00001 0.00001
20 100 1k 10k 20k 20 100 1k 10k 50k
Frequency (Hz) Frequency (Hz)
Figure 5. Total Harmonic Distortion + Noise vs Frequency Figure 6. Total Harmonic Distortion + Noise vs Frequency
120
80
Dual and quad devices. G = 1, all channels.
Quad measured Channel A to D, or B to C;
60 other combinations yield similiar or improved
rejection.
40
1s/div 10 100 1k 10k 100k 1M
Frequency (Hz)
10.0
5.5
8
5.0
2.5
0
0
0 3.16 3.25 3.34 3.43 3.51 3.60 3.69 3.78
0
15
30
45
60
75
90
105
120
135
150
150
135
120
105
90
75
60
45
30
15
Noise (nV/√Hz)
–
–
–
–
–
–
–
–
–
–
Offset Voltage ( μ V)
Figure 9. Voltage Noise Distribution (10 Hz) Figure 10. Offset Voltage Production Distribution
12 10
Typical distribution
8
of packaged units.
Offset Voltage Change (μV)
6
Percent of Amplifiers (%)
4
8
2
0
–2
4 –4
–6
–8
–10
0
0 50 100 150 200 250 300
0 0.5 1.0 1.5 Time from Power Supply Turn-On (s)
Offset Voltage Drift (μV)/°C
Figure 11. Offset Voltage Drift Production Distribution Figure 12. Warm-Up Offset Voltage Drift
Figure 13. AOL, CMRR, PSRR vs Temperature Figure 14. AOL, CMRR, PSRR vs Temperature
2.0 60
1.5
50
Short-Circuit Current (mA)
Input Bias Current (nA)
1.0
40
0.5 –ISC
+ISC
0 30
–0.5
20
–1.0
10
–1.5
–2.0 0
–60 –40 –20 0 20 40 60 80 100 120 140 –75 –50 –25 0 25 50 75 100 125
Temperature ( °C) Temperature (°C)
Figure 15. Input Bias Current vs Temperature Figure 16. Short-Circuit Current vs Temperature
5.0 3.8
±18V
4.5 3.6
Quiescent Current (mA)
±15V
±12V
4.0 ±10V
3.4
±5V
3.5 ± 2.5V 3.2
3.0 3.0
2.5 2.8
–60 –40 –20 0 20 40 60 80 100 120 140 0 2 4 6 8 10 12 14 16 18 20
Temperature ( °C) Supply Voltage (±V)
Figure 17. Quiescent Current vs Temperature Figure 18. Quiescent Current vs Supply Voltage
2.0 8
1.5 6
1.0 4
0 0
–75 –50 –25 0 25 50 75 100 125 –75 –50 –25 0 25 50 75 100 125
Temperature ( °C) Temperature ( °C)
Figure 19. Slew Rate vs Temperature Figure 20. Slew Rate vs Temperature
2.0 1.5
Curve shows normalized change in bias current
Curve shows normalized change in bias current
1.5 with respect to VCM = 0V. Typical I B may range
with respect to VS = ±10V. Typical I B may range 1.0
from –2nA to +2nA at V CM = 0V.
1.0 from –2nA to +2nA at V S = ±10V.
0.5
0.5
∆IB (nA)
∆IB (nA)
0 0 VS = ±15V
–0.5
–0.5
–1.0 VS = ±5V
–1.0
–1.5
–2.0 –1.5
0 5 10 15 20 25 30 35 40 –15 –10 –5 0 5 10 15
Supply Voltage (V) Common-Mode Voltage (V)
Figure 21. Change in Input Bias Current vs Power Supply Figure 22. Change in Input Bias Current vs Common-Mode
Voltage Voltage
100 15 V+
VS = ±15V, 10V Step
14 (V+) –1V
CL = 1500pF
RL = 2kΩ 13 (V+) –2V
Output Voltage Swing (V)
–40°C
12 125°C (V+) –3V
Settling Time (μs)
11 85°C –55°C
OPA227 25°C
0.01% 10
10 0.1%
–10
OPA228 –55°C
0.01% –11 85°C
0.1% 125°C
–12 –40°C (V–) +3V
–13 25°C (V–) +2V
–14 (V–) +1V
1 –15 V–
±1 ±10 ±100 0 10 20 30 40 50 60
Gain (V/V) Output Current (mA)
Figure 23. Settling Time vs Closed-Loop Gain Figure 24. Output Voltage Swing vs Output Current
50
20
Overshoot (%)
40
15
30
VS = ±5V
10
20
Gain = –1 Gain = –10
5 Gain = +1
10
0 0
1k 10k 100k 1M 10M 1 10 100 1k 10k 100k
Frequency (Hz) Load Capacitance (pF)
Figure 25. Maximum Output Voltage vs Frequency Figure 26. Small-Signal Overshoot vs Load Capacitance
OPA227 OPA227
25mV/div
2V/div
5μs/div
400ns/div
G = –1, CL = 1500 pF G = 1, C = 1000 pF
Figure 27. Large-Signal Step Response Figure 28. Small-Signal Step Response
30
OPA227 VS = ±15V OPA228
25
Output Voltage (Vp-p)
20
25mV/div
15
10 VS = ±5V
0
1k 10k 100k 1M 10M
400ns/div
G = 1, CL = 5 pF Frequency (Hz)
Figure 29. Small-Signal Step Response Figure 30. Maximum Output Voltage vs Frequency
50
Overshoot (%)
G = –100
40
5V/div
30
G = +100
20
G = ±10
10
0
1 10 100 1k 10k 100k
2μs/div
Load Capacitance (pF) G = –10, CL = 100 pF
Figure 31. Small-Signal Overshoot vs Load Capacitance Figure 32. Large-Signal Step Response
OPA228 OPA228
200mV/div
200mV/div
500ns/div 500ns/div
G = 10, CL = 1000 pF RL = 1.8 kΩ G = 10, CL = 1000 pF RL = 1.8 kΩ
Figure 33. Small-Signal Step Response Figure 34. Small-Signal Step Response
100
80
70
60
50
Impedance (:)
40
30
20
10
1k 10k 100k 1M
Frequency (Hz)
7 Detailed Description
7.1 Overview
The OPAx22x series operational amplifiers combine low noise and wide bandwidth with high precision to make
them the ideal choice for applications requiring both AC and precision DC performance. The OPAx227 is unity-
gain stable and features high slew rate (2.3 V/µs) and wide bandwidth (8 MHz). The OPAx228 is optimized for
closed-loop gains of 5 or greater, and offers higher speed with a slew rate of 10 V/µs and a bandwidth of 33
MHz.
Input Offset
Adjust
(OPA227 and
OPA228 only)
+IN +
Output
-IN ±
Input Offset
Adjust Compensation
(OPA227 and
OPA228 only)
0.1μF
20kΩ
7
2 1
8
OPA227
3 6
OPA227 Output
+
Input
When using the OPA227 as a unity-gain buffer (follower), the input current should be limited to 20 mA. This can
be accomplished by inserting a feedback resistor or a resistor in series with the source. Use Equation 1 to
calculate sufficient resistor size.
RX = VS/20mA – RSOURCE
where
• RX is either in series with the source or inserted in the feedback path. (1)
For example, for a 10-V pulse (VS = 10 V), total loop resistance must be 500 Ω. If the source impedance is large
enough to sufficiently limit the current on its own, no additional resistors are needed. The size of any external
resistors must be carefully chosen because they will increase noise. See the Noise Performance section of this
data sheet for further information on noise calculation. Figure 37 shows an example implementing a current
limiting feedback resistor.
R1
Op Amp
Not recommended
for OPA227
R1
OPA227
No cancellation resistor.
See text.
1.00+03
Typical at 1k (V/√Hz)
RS
1.00E+02
OPA277
OPA277
OPA227 Resistor Noise
1.00E+01
Resistor Noise
R2
Noise at the output:
2 2
R1
EO
( )
EO2 = 1 +
R2
R1
2 2
en2 + e12 + e22 + (i n R 2) + eS2+ (i n RS) 1 +
( )
R2
R1
R2
RS
Where eS = √4kTRS • 1 +
( ) R1
= thermal noise of RS
VS
e1 = √4kTR1 •
( )
R2
R1
= thermal noise of R1
R2
Noise at the output:
R1 2
RS
EO
(
EO 2 = 1 +
R2
R1 + RS ) 2
e n 2 + e12 + e 22 + (in R2) + e S2
R2
VS
Where eS = √4kTRS •
( )
R1 + RS
= thermal noise of RS
e1 = √4kTR1 •
( )R2
R1 + RS
= thermal noise of R1
For the OPA227 and OPA228 series op amps at 1kHz, e n = 3nV/√Hz and in = 0.4pA/√Hz.
R1 R2 R8 R11
2MΩ 2MΩ 402kΩ 178kΩ
R3 R4 C4 C6
1kΩ 9.09kΩ 22nF 10nF
R6 R7 R9 R10
40.2kΩ 97.6kΩ 178kΩ 226kΩ
2 2
C1 C2 6 6
1μF 1 μF U2 U3 VOUT
U1 C3 3 C5 3
0.47μF 0.47μF
(OPA227) (OPA227) (OPA227)
Input from
Device R5
Under 634kΩ
Test
Figure 41. 0.1 Hz to 10 Hz Bandpass Filter Used to Test Wideband Noise of the
OPAx22x Series
22pF
100kΩ
10Ω
2
6
OPA227 VOUT
3
Device
Under
Test
Figure 41 shows the 0.1 Hz 10 Hz bandpass filter used to test the noise of the OPA227 and OPA228. The filter
circuit was designed using Texas Instruments’ FilterPro software (available at www.ti.com). Figure 42 shows the
configuration of the OPA227 and OPA228 for noise testing.
80
EMIRR IN+ (db)
60
40
20
0
10 100 1k 10k
Frequency (MHz)
If available, any dual and quad operational amplifier device versions have nearly similar EMIRR IN+
performance. The OPAx227 unity-gain bandwidth is 8 MHz. EMIRR performance below this frequency denotes
interfering signals that fall within the operational amplifier bandwidth.
Table 1 shows the EMIRR IN+ values for the OPA227 at particular frequencies commonly encountered in real-
world applications. Applications listed in Table 1 may be centered on or operated near the particular frequency
shown. This information may be of special interest to designers working with these types of applications, or
working in other fields likely to encounter RF interference from broad sources, such as the industrial, scientific,
and medical (ISM) radio band.
+VS
±
50
Low-Pass Filter
+
RF source
-VS
DC Bias: 0 V Sample /
Modulation: None (CW) Averaging Digital Multimeter
Frequency Sweep: 201 pt. Log Not shown: 0.1 µF and 10 µF
supply decoupling
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
1.43kΩ
2.2nF dc Gain = 1
330pF
1.1kΩ 1.65kΩ
VIN
1.43kΩ 1.91kΩ
OPA227
33nF 2.21kΩ
OPA227 VOUT
68nF
10nF
100Ω 100kΩ
2
6 Output
OPA227
3
Input 10kΩ
2
6 Output
D1 4.99kΩ OPA227
3
8
S1
D2 S2 1
4.75kΩ 4.75kΩ
1kΩ
TTL DG188
In Offset
Trim
+VCC
0.1μF
1kΩ
1kΩ
Audio
In 1/2
OPA2227
200Ω
To
200Ω Headphone
1/2
OPA2227
0.1μF
–15V
2
R10
100kΩ
R5
R4 R6
50kΩ
2.7kΩ CW 2.7kΩ
3 1
VIN
2 C2
0.0047μF
Figure 49. Three-Band Active Tone Control (Bass, Midrange, and Treble)
RF
RIN
±
Output
+
CLOAD RLOAD
Input
2kΩ
OPA228 OPA228
Figure 51. Compensation of the OPA228 for G = 2 Figure 52. Compensation for OPA228 for G = –2
OPA228 OPA228
400ns/div 400ns/div
Figure 53. Large-Signal Step Response, G = 2, Figure 54. Large-Signal Step Response, G = –2, CLOAD =
CLOAD = 100 pF, Input Signal = 5 Vp-p 100 pF, Input Signal = 5 Vp-p
25mV/div
OPA228 OPA228
200ns/div 200ns/div
Figure 55. Small-Signal Step Response, G = 2, Figure 56. Small-Signal Step Response, G = –2,
CLOAD = 100 pF, Input Signal = 50 mVp-p. CLOAD = 100 pF, Input Signal = 50 mVp-p.
CAUTION
Supply voltages larger than 36 V can permanently damage the device; see the
Absolute Maximum Ratings.
Place 0.1-μF bypass capacitors close to the power-supply pins to reduce errors coupling in from noisy or high-
impedance power supplies. For more detailed information on bypass capacitor placement, refer to the Layout
Guidelines.
10 Layout
VIN +
RG VOUT
RF
(Schematic Representation)
Place components
Run the input traces close to device and to
as far away from each other to reduce
the supply lines parasitic errors VS+
as possible RF
NOTE
These files require that either the TINA software (from DesignSoft™) or TINA-TI software
be installed. Download the free TINA-TI software from the TINA-TI folder.
11.4 Trademarks
TINA-TI is a trademark of Texas Instruments, Inc.
TINA, DesignSoft are trademarks of DesignSoft, Inc.
All other trademarks are the property of their respective owners.
11.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
www.ti.com 7-Dec-2019
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)
OPA2227P ACTIVE PDIP P 8 50 Green (RoHS CU NIPDAU N / A for Pkg Type -40 to 85 OPA2227P
& no Sb/Br)
OPA2227PA ACTIVE PDIP P 8 50 Green (RoHS CU NIPDAU N / A for Pkg Type -40 to 85 OPA2227P
& no Sb/Br) A
OPA2227U ACTIVE SOIC D 8 75 Green (RoHS CU NIPDAU Level-3-260C-168 HR -40 to 85 OPA
& no Sb/Br) 2227U
OPA2227U/2K5 ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-3-260C-168 HR -40 to 85 OPA
& no Sb/Br) 2227U
OPA2227U/2K5G4 ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-3-260C-168 HR -40 to 85 OPA
& no Sb/Br) 2227U
OPA2227UA ACTIVE SOIC D 8 75 Green (RoHS CU NIPDAU Level-3-260C-168 HR -40 to 85 OPA
& no Sb/Br) 2227U
A
OPA2227UA/2K5 ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-3-260C-168 HR -40 to 85 OPA
& no Sb/Br) 2227U
A
OPA2227UA/2K5E4 ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-3-260C-168 HR -40 to 85 OPA
& no Sb/Br) 2227U
A
OPA2227UAE4 ACTIVE SOIC D 8 75 Green (RoHS CU NIPDAU Level-3-260C-168 HR -40 to 85 OPA
& no Sb/Br) 2227U
A
OPA2227UAG4 ACTIVE SOIC D 8 75 Green (RoHS CU NIPDAU Level-3-260C-168 HR -40 to 85 OPA
& no Sb/Br) 2227U
A
OPA2227UE4 ACTIVE SOIC D 8 75 Green (RoHS CU NIPDAU Level-3-260C-168 HR -40 to 85 OPA
& no Sb/Br) 2227U
OPA2227UG4 ACTIVE SOIC D 8 75 Green (RoHS CU NIPDAU Level-3-260C-168 HR -40 to 85 OPA
& no Sb/Br) 2227U
OPA2228P ACTIVE PDIP P 8 50 Green (RoHS CU NIPDAU N / A for Pkg Type -40 to 85 OPA2228P
& no Sb/Br)
OPA2228PA ACTIVE PDIP P 8 50 Green (RoHS CU NIPDAU N / A for Pkg Type -40 to 85 OPA2228P
& no Sb/Br) A
OPA2228PAG4 ACTIVE PDIP P 8 50 Green (RoHS CU NIPDAU N / A for Pkg Type -40 to 85 OPA2228P
& no Sb/Br) A
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 7-Dec-2019
Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)
OPA2228PG4 ACTIVE PDIP P 8 50 Green (RoHS CU NIPDAU N / A for Pkg Type -40 to 85 OPA2228P
& no Sb/Br)
OPA2228U ACTIVE SOIC D 8 75 Green (RoHS CU NIPDAU Level-3-260C-168 HR -40 to 85 OPA
& no Sb/Br) 2228U
OPA2228U/2K5 ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-3-260C-168 HR -40 to 85 OPA
& no Sb/Br) 2228U
OPA2228UA ACTIVE SOIC D 8 75 Green (RoHS CU NIPDAU Level-3-260C-168 HR -40 to 85 OPA
& no Sb/Br) 2228U
A
OPA2228UA/2K5 ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-3-260C-168 HR -40 to 85 OPA
& no Sb/Br) 2228U
A
OPA2228UA/2K5E4 ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-3-260C-168 HR -40 to 85 OPA
& no Sb/Br) 2228U
A
OPA2228UE4 ACTIVE SOIC D 8 75 Green (RoHS CU NIPDAU Level-3-260C-168 HR -40 to 85 OPA
& no Sb/Br) 2228U
OPA227P ACTIVE PDIP P 8 50 Green (RoHS CU NIPDAU N / A for Pkg Type -40 to 85 OPA227P
& no Sb/Br)
OPA227PA ACTIVE PDIP P 8 50 Green (RoHS CU NIPDAU N / A for Pkg Type -40 to 85 OPA227P
& no Sb/Br) A
OPA227PAG4 ACTIVE PDIP P 8 50 Green (RoHS CU NIPDAU N / A for Pkg Type -40 to 85 OPA227P
& no Sb/Br) A
OPA227PG4 ACTIVE PDIP P 8 50 Green (RoHS CU NIPDAU N / A for Pkg Type -40 to 85 OPA227P
& no Sb/Br)
OPA227U ACTIVE SOIC D 8 75 Green (RoHS CU NIPDAU Level-3-260C-168 HR -40 to 85 OPA
& no Sb/Br) 227U
OPA227U/2K5 ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-3-260C-168 HR -40 to 85 OPA
& no Sb/Br) 227U
OPA227U/2K5E4 ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-3-260C-168 HR -40 to 85 OPA
& no Sb/Br) 227U
OPA227UA ACTIVE SOIC D 8 75 Green (RoHS CU NIPDAU Level-3-260C-168 HR -40 to 85 OPA
& no Sb/Br) 227U
A
OPA227UA/2K5 ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-3-260C-168 HR -40 to 85 OPA
& no Sb/Br) 227U
A
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com 7-Dec-2019
Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)
OPA227UA/2K5G4 ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-3-260C-168 HR -40 to 85 OPA
& no Sb/Br) 227U
A
OPA228P ACTIVE PDIP P 8 50 Green (RoHS CU NIPDAU N / A for Pkg Type -55 to 125 OPA228P
& no Sb/Br)
OPA228PA ACTIVE PDIP P 8 50 Green (RoHS CU NIPDAU N / A for Pkg Type -55 to 125 OPA228P
& no Sb/Br) A
OPA228PAG4 ACTIVE PDIP P 8 50 Green (RoHS CU NIPDAU N / A for Pkg Type -55 to 125 OPA228P
& no Sb/Br) A
OPA228U ACTIVE SOIC D 8 75 Green (RoHS CU NIPDAU Level-3-260C-168 HR -55 to 125 OPA
& no Sb/Br) 228U
OPA228UA ACTIVE SOIC D 8 75 Green (RoHS CU NIPDAU Level-3-260C-168 HR -55 to 125 OPA
& no Sb/Br) 228U
A
OPA228UA/2K5 ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-3-260C-168 HR -55 to 125 OPA
& no Sb/Br) 228U
A
OPA228UAG4 ACTIVE SOIC D 8 75 Green (RoHS CU NIPDAU Level-3-260C-168 HR -55 to 125 OPA
& no Sb/Br) 228U
A
OPA228UG4 ACTIVE SOIC D 8 75 Green (RoHS CU NIPDAU Level-3-260C-168 HR -55 to 125 OPA
& no Sb/Br) 228U
OPA4227PA ACTIVE PDIP N 14 25 Green (RoHS CU NIPDAU N / A for Pkg Type -40 to 85 OPA4227PA
& no Sb/Br)
OPA4227PAG4 ACTIVE PDIP N 14 25 Green (RoHS CU NIPDAU N / A for Pkg Type -40 to 85 OPA4227PA
& no Sb/Br)
OPA4227UA ACTIVE SOIC D 14 50 Green (RoHS CU NIPDAU-DCC Level-3-260C-168 HR -40 to 85 OPA4227UA
& no Sb/Br)
OPA4227UA/2K5 ACTIVE SOIC D 14 2500 Green (RoHS CU NIPDAU-DCC Level-3-260C-168 HR -40 to 85 OPA4227UA
& no Sb/Br)
OPA4227UA/2K5G4 ACTIVE SOIC D 14 2500 Green (RoHS CU NIPDAU-DCC Level-3-260C-168 HR -40 to 85 OPA4227UA
& no Sb/Br)
OPA4227UAG4 ACTIVE SOIC D 14 50 Green (RoHS CU NIPDAU-DCC Level-3-260C-168 HR -40 to 85 OPA4227UA
& no Sb/Br)
OPA4228PA ACTIVE PDIP N 14 25 Green (RoHS CU NIPDAU N / A for Pkg Type -55 to 125 OPA4228PA
& no Sb/Br)
Addendum-Page 3
PACKAGE OPTION ADDENDUM
www.ti.com 7-Dec-2019
Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)
OPA4228PAG4 ACTIVE PDIP N 14 25 Green (RoHS CU NIPDAU N / A for Pkg Type -55 to 125 OPA4228PA
& no Sb/Br)
OPA4228UA ACTIVE SOIC D 14 50 Green (RoHS CU NIPDAU-DCC Level-3-260C-168 HR -55 to 125 OPA4228UA
& no Sb/Br)
OPA4228UA/2K5 ACTIVE SOIC D 14 2500 Green (RoHS CU NIPDAU-DCC Level-3-260C-168 HR -55 to 125 OPA4228UA
& no Sb/Br)
OPA4228UA/2K5G4 ACTIVE SOIC D 14 2500 Green (RoHS CU NIPDAU-DCC Level-3-260C-168 HR -55 to 125 OPA4228UA
& no Sb/Br)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 4
PACKAGE OPTION ADDENDUM
www.ti.com 7-Dec-2019
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 5
PACKAGE MATERIALS INFORMATION
www.ti.com 7-Apr-2015
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 7-Apr-2015
Pack Materials-Page 2
PACKAGE OUTLINE
D0008A SCALE 2.800
SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT
SEATING PLANE
.228-.244 TYP
[5.80-6.19]
.004 [0.1] C
A PIN 1 ID AREA
6X .050
[1.27]
8
1
.189-.197 2X
[4.81-5.00] .150
NOTE 3 [3.81]
4X (0 -15 )
4
5
8X .012-.020
B .150-.157 [0.31-0.51]
.069 MAX
[3.81-3.98] .010 [0.25] C A B [1.75]
NOTE 4
.005-.010 TYP
[0.13-0.25]
4X (0 -15 )
SEE DETAIL A
.010
[0.25]
.004-.010
0 -8 [0.11-0.25]
.016-.050
[0.41-1.27] DETAIL A
(.041) TYPICAL
[1.04]
4214825/C 02/2019
NOTES:
1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches.
Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed .006 [0.15] per side.
4. This dimension does not include interlead flash.
5. Reference JEDEC registration MS-012, variation AA.
www.ti.com
EXAMPLE BOARD LAYOUT
D0008A SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT
8X (.061 )
[1.55]
SYMM SEE
DETAILS
1
8
8X (.024)
[0.6] SYMM
(R.002 ) TYP
[0.05]
5
4
6X (.050 )
[1.27]
(.213)
[5.4]
EXPOSED
METAL EXPOSED
METAL
.0028 MAX .0028 MIN
[0.07] [0.07]
ALL AROUND ALL AROUND
4214825/C 02/2019
NOTES: (continued)
www.ti.com
EXAMPLE STENCIL DESIGN
D0008A SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT
8X (.061 )
[1.55] SYMM
1
8
8X (.024)
[0.6] SYMM
(R.002 ) TYP
5 [0.05]
4
6X (.050 )
[1.27]
(.213)
[5.4]
4214825/C 02/2019
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
www.ti.com
IMPORTANT NOTICE AND DISCLAIMER
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you
permission to use these resources only for development of an application that uses the TI products described in the resource. Other
reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third
party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims,
damages, costs, losses, and liabilities arising out of your use of these resources.
TI’s products are provided subject to TI’s Terms of Sale (www.ti.com/legal/termsofsale.html) or other applicable terms available either on
ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable
warranties or warranty disclaimers for TI products.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2019, Texas Instruments Incorporated