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PADS AND ESD PROTECTION

ELC601 Presentation

Ahmed Essa

Cairo University Faculty of Engineering

December 21th ,2019

Ahmed Essa (Cairo University Faculty of Engineering)


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Table of Contents

1 Pads

2 Introduction to ESD

3 Human-Body-Model (HBM)

4 Power-Rail ESD Clamp

Ahmed Essa (Cairo University Faculty of Engineering)


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Table of Contents

1 Pads

2 Introduction to ESD

3 Human-Body-Model (HBM)

4 Power-Rail ESD Clamp

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Pads

Used to connect the circuit core


to bond wires
Placed on the perimeter of the
chip
Size dictated by the
manufacturing process, usually
between 75µm × 75µm and
100µm × 100µm
The two topmost metal layers
are used to avoid lift-off
An octagon can be used to
reduce the area by 20%

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Table of Contents

1 Pads

2 Introduction to ESD

3 Human-Body-Model (HBM)

4 Power-Rail ESD Clamp

Ahmed Essa (Cairo University Faculty of Engineering)


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Introduction to ESD

Electrostatic Discharge (ESD) is caused by high potential external


objects touching a connection.
ESD produces a large voltage which may damage the transistors or
the connections.
Several testing standards are used to rate devices/systems.
Device level tests include HBM, MM, and CDM
System level tests include ESD immunity, EFT immunity, and surge
immunity.

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Table of Contents

1 Pads

2 Introduction to ESD

3 Human-Body-Model (HBM)

4 Power-Rail ESD Clamp

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HBM
Test Specifications

A device level test that simulates an electrical discharge of a human


onto an electronic component.
Diodes can be used as ESD protection devices.
The voltage range is from 0.5KV up to 15KV .
The typical peak current is around 1.5A

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HBM
Test Specifications

Ahmed Essa (Cairo University Faculty of Engineering)


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HBM
Test Connections

Positive/Negative-to-VSS /VDD Connections

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HBM
Test Connections

Pin-to-pin and VDD -to-VSS connections

Ahmed Essa (Cairo University Faculty of Engineering)


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Table of Contents

1 Pads

2 Introduction to ESD

3 Human-Body-Model (HBM)

4 Power-Rail ESD Clamp

Ahmed Essa (Cairo University Faculty of Engineering)


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Power-Rail ESD Clamp
Introduction

R1 is used to limit the ESD current


flowing through the diodes.
ESD devices may impact the
performance of the chip.

Ahmed Essa (Cairo University Faculty of Engineering)


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Power-Rail ESD Clamp
Introduction

A large NMOS transistor(BigFET) connects VDD to VSS .


Provides a low-impedance path from VDD to VSS during ESD events.
Needs an ESD-Transient Detection Circuit to turn on.

Ahmed Essa (Cairo University Faculty of Engineering)


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Power-Rail ESD Clamp
RC-Clamp

Assume the ESD-transient voltage is


applied on VDD .
Vx increases at a much slower rate due
to the RC time constant.
VG turns the clamp on for ton then goes
to zero.
For a large ton large values of R and C
must be used.
The circuit is prone to miss-trigger
under fast-power-on application.

Ahmed Essa (Cairo University Faculty of Engineering)


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Power-Rail ESD Clamp
Feedback

A positive feedback loop is used to


sustain the latch-on of the clamp until
the end of the ESD event.
The feedback loop is triggered using the
parasitic capacitance of the clamp.
Diodes are added to control the holding
voltage

Vh ' nVON (Diode) + |VT HP | > VDD

Area saving can reach up to 54%

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Power-Rail ESD Clamp
Voltage Wave-forms

ESD-Like Voltage Pulse

Ahmed Essa (Cairo University Faculty of Engineering)


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Power-Rail ESD Clamp
Voltage Wave-forms

Fast-Power-On Voltage Pulse

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