INDUSTRON

NANOTECHNOLOGY
PVT LTD
 ABOUT INDUSTRON

Industron Nanotechnology (Erstwhile known as

Hysitron Nanotechnology India)
Founded in 2011 as the R&D centre for Hysitron in
India.
Behind the Brand

MR. THOMAS J WYROBECK-

FOUNDER & CEO

DR. SYED ASIF-FOUNDER

AND MD
PhD Oxford University, Materials Science,
Scientist, Naval Research Laboratory, Washington DC, USA, 1997-
2000A
Director of R&D, Hysitron, USA, 2001-2017,
Director of R&D and Engineering, Bruker, USA, 2017-present
Patents 22. Publications >120.
2 times Tibbetts Awards and SBIR Hall of Fame. 4 times R&D 100
Awards.
2 times Tekne Awards and Microscopy today innovation awards
OUR NANOMECHANICAL RESEARCH LAB
We are a DSIR approved laboratory, our facility incorporates latest

OFFERINGS technology and is capable of performing several experiments using

nanoindentation technique. We provide paid sample testing services to
our valuable customers.

DESIGN AND MANUFACTURING OF

NG50
NG50- Nanoindenter with in-situ SPM Imaging, it was designed along
with the collaboration of Hysitron, USA.

CUSTOMIZED INSTRUMENTATION
From concept to a turn key project , our technical team is capable of
understanding your requirements and deliver the project on time.
SERVICE PORTFOLIO
nanoDMA  III -Dynamic Mechanical Analysis
Reference Creep
Frequency Sweep
CMX Test
Quasistatic Nanoindentation
XPM
Nanoscratch
Scanning Wear™
Scanning Probe Microscopy
Modulus Mapping
Why
NANOINDENTATION
Quantitative approach to identify
how a material responds
elastically, plastically or visco-
elastically, to stress
Identify mechanical properties of
smaller volumes:-
Elastic modulus
Hardness
Fracture Toughness
Creep
Storage and Loss Moduli
nanoDMA  III -Dynamic
Mechanical Analysis

Investigate the frequency dependent properties of viscoelastic materials using a dynamic testing technique
During nanoDMA experiment quasi-static force is applied to the indenter probe while simultaneously superimposing a small oscillatory force.
DMA technique helps to measure the mechanical properties continuously as a function of contact depth, frequency and time

Electrostatic force actuation

Dynamic force

Displacement and Phase shift is measured

using a lock-in amplifier
Reference Creep
Creep is time-dependent permanent deformation that occurs when materials are subjected to stress for long time, particularly at high temperatures
The reference creep testing technique allows measurement of the material’s response under load over long time periods.
Traditional quasi-static tests are usually limited to test times of a few minutes because after long times, error in displacement measurement due to
thermal drift becomes significant.
The reference creep test uses the relationship between contact area and contact stiffness to calculate the material’s properties over time periods as long
as several hours. In a creep test, the quasi-static load is quickly ramped to peak force and then held constant at peak force while a small dynamic load is
applied.
At the beginning of the hold, the material’s modulus is measured. The stiffness is measured continuously during the hold. 

RESULTS OF REFERECE CREEP TEST

Hardness and contact depth versus time measured during a one-hour Creep data from each temperature showing the evolution of indent depth during the
reference creep test utilizing quasi-static force held constant at 5 mN. test. (Right) Decaying hardness over time at each temperature associated
with increasing indent depth.
Frequency Sweep

When testing viscoelastic materials, it can be difficult to obtain meaningful data because the properties are very sensitive to frequency rates.
When testing such a material with quasi-static indentation, the choice of loading, hold, and unloading times can significantly affect the results.
In a frequency sweep, rather than attempting to work around the material’s frequency dependence, the dependence is characterized directly.
The quasi-static load is usually held constant while a dynamic load is applied at user-specified frequencies between 0.1 and 300 Hz, allowing storage
modulus, loss modulus, and tan δ to be measured as a function of frequency.

Force and displacement versus time from a portion of the test (inset), Storage modulus and tan δ versus frequency from a single 0.1 - 200
showing the force and displacement oscillations. Hz frequency sweep test. Note the tan δ peak around 10 Hz.
CMX Test

By oscillating while simultaneously increasing the quasi-static

load (and therefore, the indent depth), contact stiffness is
measured throughout the loading portion of a test, allowing the
hardness and dynamic moduli to be calculated continuously as
a function of depth within a single test.
This functionality yields far more information than a traditional
quasi-static test, which produces a single measurement at a
single depth. CMX is useful for quickly determining the
mechanical properties of the thin films coatings by
appropriately limiting the depth ranges to avoid substrate
effects.
CMX provides a quantitative and truly continuous measurement
of mechanical properties—including hardness, storage modulus,
loss modulus, complex modulus, and tan delta—as a function of
indentation depth.

Hardness versus contact depth from CMX tests performed at different strain
rates
XPM

Accelerated property mapping (XPM) can be

used to quickly map the elastic modulus and
hardness of local areas.
XPM is a technique for performing large
numbers of indentations in short periods of time,
up to six per second. Indents are performed in a
user defined grid.
Between indentations, a piezo laterally translates
the probe to a new indent location.
XPM can also be used to alleviate tip wear at
high temperature due to the speed of
indentation which reduces the exposure time of
the tip.
Quasistatic Nanoindentation

Nanoindentation is a quantitative approach to identify mechanical

properties ( hardness, elastic modulus, fracture toughness, stress
relaxation ) of different materials.
The diamond indenter is pushed in to a specimen and withdrawn
from the specimen, and the capacitive transducer continuously
monitors load applied by the diamond indenter and displacement
into the specimen in the range at nano-meter level with high
precision.
Which results in load displacement curve, data is further used for
analysis.
Nanoscratch

Tip is moved laterally across a surface while normal force is

varied or held constant.  Displacement into surface and
lateral (tangential) force is measured throughout.

Following mechanical properties can be identified using

Nano scratch :-
Co-efficient of Friction
Scratch Resistance
Film / Coating Adhesion & Delamination
Critical Load of thin film failure
Nanowear

Nanowear, when multiple passes at different loads are performed using a probe on the surface of the material
being tested. The material from the surface starts wearing off and below mentioned properties can be identified.

Multiple cycle wear resistance

Nanomachining
Quantify Wear Volume
Modulus Mapping

The Modulus Mapping package combines

the in-situ SPM imaging with nanoDMA® III.
During the imaging process, the system
continuously measures the stiffness and
phase lag of the sample as a function of the
position.
If the geometry of the probe is known, the
modulus can be calculated.
The probe geometry can be calibrated for
by mapping a reference sample such as
quartz.
The result is a set of point maps of the
mechanical properties and topography.

(a) Topography (b) Contact Stiffness and (c) Reduced Modulus maps performed on 3 µm x 3 µm areas. (d) Cross – sectional
profile of the Reduced Modulus as marked in exhibit (c)
in-situ Scanning Probe
Microscopy

This unique feature gives you a 3D

topographical image of the surface by raster
scanning the surface of the sample.
Surface roughness measurement
Researcher can pin point the location of
indent with +/- 10 nM accuracy
Avoid the sites with roughness value more,
which might hinder the test results.
 MAILING ADDRESS
INDUSTRON NANOTECHNOLOGY

Contact THEJASWINI BUILDING, 401, 4TH FLOOR

TECHNOPARK TRIVANDRUM, KERALA

Information
EMAIL ADDRESS
info@industronnano.com
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PHONE NUMBER
0471-2786500 // 7902516561