The Occam Process

An Energy-efficient Approach to
Electronic Assembly, Interconnection,
and Data Transmission Management

Joseph Fjelstad
President
Verdant Electronics, Inc.
 Introduction
z Electronic products are the engine that has propelled the
exponential growth of global knowledge over the last half
century
z A steady stream of new products from the computer to
the cell phone allow us to connect seamlessly with nearly
every place and potentially every one on the planet by a
combination of land lines, wireless transmitters and
satellites.
z This comes at a cost however both in terms or materials
and energy, both of which have certain limits and there
are other challenges that we presently face that create a
greater sense of urgency.
z We cannot afford to turn off the engine but neither can we
continue on the path we are presently on.
Comparison of Projected Electricity
Use, All Scenarios, 2007 to 2011

Source: US EPA Report to Congress on Server and Data Center Energy Efficiency
 Redefining Connection Paths can Help
Reduce Power Requirements
Inductance Capacitance

Impedance changes Capacitance

Impedance
changes
Inductance

Signal Signal
reflections Dielectric &
conductor loss reflections

Patented
 20Gbps High Speed Copper Channel
Technological Advantages...
ƒ High speed flex based channel technology
ƒ Low power, non-enhanced, link between packages over extended
distance, with near zero skew at speeds to >20Gbps per channel.
ƒ Increased design flexibility and customization for performance
ƒ Chip interconnections and package can be a commodity item
ƒ Interconnection architecture can be standardized
ƒ All standard materials
ƒ Compatible with existing packaging assembly technology

ƒ Transmit energy conservation of up to 90%

 Civil Engineering for Electronics
High speed data channel
between chips and
connectors

Simple PCB for

power ground
and low speed
Patented
 Manufacturing’s Challenge
z As we progress, energy conservation along with materials
conservation will become ever more critical to meeting
the business and social objectives of expanding the reach
of technology into developing parts of the world.
z The challenge is multifaceted and includes a need to
address the environmental impact of these objectives
z The European Union passed and enacted in July of 2006
its Restriction of Hazardous Substances (RoHS)
legislation which among other substances banned lead
from electronic solders.
z The impact has been far reaching and has been fraught
with technical and economic challenges
z In this environment, an alternative approach to the
manufacture and interconnection electronic assemblies is
now being developed
 Current Manufacturing Paradigm
z Electronics manufacturing presently comprises three basic
manufacturing industries:
z Electronic component manufacturing industry
‹ ICs, electronic modules, discrete devices, etc.

z Electronic interconnection manufacturing industry

‹ PCBs, package substrates, sockets, connectors, cables, etc.)

z Electronic assembly industry

‹ Soldering, testing, box build, etc.

z Historically vertically integrated companies did it all...

 The Assembly Industry’s Challenge
z Electronics have historically increased functionality of
products while size, weight and cost have all decreased
with each new generation of product
z The trend continues but it slope of the curve is flattening
and becoming more asymptotic.
z Lead pitches are decreasing, this is impacting both
design and manufacture of PCBs and assemblies
z Product life and reliability are an ongoing concern
z Lead-free shifts to more expensive metal alloys
z Tin whiskers are a wild card issue now in the public eye
Lead-free concerns in the News
z “RoHS remains a $30B problem”
‹ Design News July 31st 2007

z “EU ban increases worries over 'whiskers' “

‹ San Jose Mercury News October 8th 2007

z “Peril: Tin ‘whiskers’ that ruin electronics”

‹ Corvallis Gazette October 8th 2007

z “Lead Phase-out May Destroy Electronics”

‹ LA Times October 9th 2007

z “'Tin whiskers' in electronics stoke anti-lead debate”

‹ San Jose Mercury News October 15th 2007
 The Value of Interconnections

z Interconnections have long been undervalued

are now gatekeepers of cost and performance
z Interconnections are also commonly the limiting
factor in product reliability
z Improved approaches to design and manufacture
of electroinic interconnections are required to
meet future requirements
 Solder - Past and Present Issues
z Solder has long been an important technology for
making electromechanical interconnections and has
been reasonably trustworthy.
z There are some intrinsic problems with solder but tin-
lead solders have met most challenges
z However component lead contact pitch continues to
drop and the problems with solder are becoming
increasing apparent.
z The list things to manage and control in the soldering
process is long and involved.
 Soldering Fishbone Diagram

Source: Interphase Corporation

The Ongoing Challenge

So
ld
er
Where are we today?
Current Electronic Manufacturing Process
PWB
FABRICATION
Engineering INVENTORY, SMT
STORAGE
ASSEMBLY
Laminate
PWB Drill
DESIGN
Plate Stencil paste
Image
Etch
Mask Inspect
Route
Place parts

ASSEMBLY Inspect
SCHEMATIC DESIGN
BOM RELIABILITY
ASSURANCE SOLDER, Reflow
PASTE, FLUX

Clean

Inspect
PARTS PROCURE
PARTS Storage &
ENGINEERING Inventory Test
 Basic PWB
Manufacturing
for Double Sided Boards
Select Appropriate Foil Clad
Laminate
Drill Hole Pattern for Vias &
Components
Make Through Holes Conductive
Coat Panel with Photoresist
Align Patterned Phototool to Hole
Pattern
Expose to UV Light Source
Develop Unexposed Pattern
Plate Copper on to Exposed
Pattern Area
 Plate Finishing Metal(s)
(Solder, Tin, Nickel, Palladium, Gold, etc. either Temporary or Permanent)
Strip Resist from Plated Circuit
Etch Background Copper Foil
Strip Etch Resist Metal
Coat with Solder Mask
(Screen Printed or Photoimaged)
 Coat Exposed Copper
(solder, electroless Ni/Au or OSP)
 Example of
Build-up Board
Manufacturing
Process Steps
Prepare Innerlayers
Laminate Layers
Drill Through Holes
Seed Hole with Conductive Film
Coat with Photoresist
Image Resist Pattern
Plate Copper Traces
Plate Etch Resist Metal
Strip Resist Exposing
Base Copper
Etch Background Copper
Strip Etch Resist Metal
Fill Holes with Resin
Coat with Photoimagable
or Filled Polymer
 Image and Develop or
Laser Drill Holes in Polymer
Metallize Surfaces with Copper
Expose and Develop Photoresist
Pattern Plate Copper Circuit Image
Strip Resist & Expose Seed Layer
Etch Copper Seed Layer
Coat with Soldermask
Expose and Develop Soldermask
Apply Solderable Finish (e.g. PbSn)
Basic Process Steps for SMT
z Fixture
z Stencil solder paste and inspect
z Place components and inspect
z Reflow solder
z Clean
z Underfill critical components
z Depanelize
z Test and rework
z Ship
 Abbreviated Occam Concept
1. Position and bond various tested components on
a temporary substrate or permanent carrier

2. Encapsulate the tested components in place

3. Remove from substrate, expose terminations.

4. Interconnect terminations by additive or semi-

additive board fab methods or alternative direct
interconnection methods.
 Sample
Process
Sequence

Patents pending
 The Basic Occam Process

ASSEMBLY CIRCUIT
DESIGN DESIGN Place fully
tested parts

Encapsulate
parts
SCHEMATIC RELIABILITY
BOM ASSURANCE Build up
circuits
Singulate

PARTS Storage & Test

PROCURE Inventory
ENGINEERING PARTS
 Supply Chain Compression

Components
IC Packages
Interconnections Resistors
Components
PCBs Capacitors
IC Packages
Sockets Inductors
Resistors
Connectors Diodes
Capacitors
Cables
Inductors
Diodes

Occam A ssembly
Pick and p lace
Assembly
Com ponen ts & C onn ecto rs
Stencil printing En cap su la te
Pick and place Bu ild u p C ircuits
Reflow Bo x build
Clean
Box build
 The Occam Approach is Novel
…but Not the Technologies
• Components can be placed conventionally
• Many suitable encapsulants available
• Suitable CTE, low shrinkage, high thermal conductivity
• Need not withstand soldering temperatures
• New low pressure molding techniques are available
• Many possible options for via creation
• Semi-additive fabrication process well established
– Improved process materials coming on line
• All copper system both possible and advantageous
• Appropriate for all classes of products
• Testing and rework... Philosophical questions?
• Why do parts fail? What are the causes of rejects?
Early “Kitchen” Prototypes
Occam Benefits Analysis
 No Printed Circuit Required
z No PCB procurement
z No PCB testing required
z No spare PCB inventory or shelf life issues
z No Conductive Anodic Filament (CAF) concern
z No surface finish process durability problems
z No high temp component warp or PCB damage
z Lower overall material use (near zero waste)
z All copper circuits created in situ
z Novel integral connector structure possibilities
 No Soldering Required
z Eliminates several manufacturing processes
z RoHS restricted material concerns obviated
z No solderability testing or surface finish concerns
z No high temperature damage to devices or PCB
z Energy use is reduced (no bakes or reflow)
z No solder shorts, opens, micro voids, copper
dissolution and the host of other common solder
related reliability issues and concerns
z Limited post assembly cleaning & testing issues
Reduced Component Concerns
z Only fully tested and protected components used
z No solder build up on tester/socket contacts
z No component leads = No coplanarity issues
z No surface finish solderability issues
z Fewer component types needed (LGA & QFN)
z Smaller component libraries possible (Pkgs)
z Lower cost (simpler) & higher yield on devices
z No MSL issues or popcorning concerns
z Improved routing for area array IC packages
z Overlapping of components is possible
Overlapping Components

Patents pending
Package Under Package (PuP)
 Copper Terminated MLC
Thin and Thick Film Terminations

0805 Thin Film 1206 32T Thin Film

Thick Film Thin Film

Termination Termination

2-4 mils (75 microns typ) >1 mil (20 microns typ)

Clearance (space between the part and the board)

0805 Thick Film

 Occam Benefits
Circuit Design Simplification
z Components can be placed closer together
z Increased routing capability
QFP/QFN Routing Advantage

Routing channel opportunities limited Routing channel opportunities increased on

on substrate because of solder lands substrate as circuits can be routed over lands
increasing layer count allowing for layer reduction
 BGA Routing Advantage

Routing channel opportunities limited Routing channel opportunities increased on both

on both substrate and package substrate and packing allowing for layer reduction
The 80% Design Rule Challenge
Effect of Multiple Pitch and Ball Variation
Effect of Multiple Pitch and Ball Variation

80% Rule for Pitch with 60% Rule for Pad

A Simpler Alternative?
Simplifying Layout
Single Lead Pitch Advantage
Improved Routing = Layer Reduction

Courtesy: Happy Holden

HDI - Price/Density Comparison

RCI: Rel price to 8L

DEN: Ave pins/sq.inch

Source: Happy Holden

The Future of Electronics?
 Occam Benefits
Circuit Design Simplification
z Components can be placed closer together
z Increased routing capability
z “Dead” leads ignored for additional routing
z Simpler and faster reconfiguration and ECOs
z Improved design security potential
z Integral heat spreader redefines placement rules
z Completed assemblies can interconnected
 Stacking Assemblies

Connectors

Vertical Via Grid Structure

Heat sink

Patents pending
 Occam Benefits
Circuit Design Simplification
z Components can be placed closer together
z Increased routing capability in less space
z “Dead” leads ignored for additional routing space
z Improved design security
z Integral heat spreader redefine placement rules
z Simpler and faster reconfiguration and ECOs
z Completed assemblies can interconnected
z Adaptable to optoelectronics
z Can be used for flexible circuits
 Occam Benefits
Reliability Improvement
z Simple structures with fewer elements
z Lower temperature processing avoids thermal
damage caused by lead-free soldering
z Components are fully encapsulated increasing
shock and vibration immunity
z Hermetic structure possibilities with full metal
jacket protection
z Total EMI and ESD protection possibilities
z Integral heat spreader improves device life
Solderless Assembly Allows Thermal
Concerns to Be Addressed Upfront

Patents pending
 What about Testing?
z Testing is believed to be critical… Why?
z Most testing is predicated on the anticipation of
manufacturing related defects and faults
‹ Shorts and opens are accepted as facts of life
‹ Lead-free assembly damage to assembly components
z Current assembly technology has limits
z Simpler processes should yield higher
z The ultimate test is assembly turn on
z Can time and money for test be better allocated?
What and Where are the Problems?

Stig Oresjo “Blending Test Strategies for Limited-Access Boards” Circuits Assembly
Aug 2002
Simple Cost
Comparison
Model
 Conventional SMT Line

Kitting,
Feeder Setup X-ray
$50K

Water Wash
Solder Printer P&P Reflow Oven
Machine
$75K Machine $55K
$80K
$200K

Solder Paste
Measurement Ionograph
Station $15K
$15K

Equipment with ~capital cost

Source: Richard Otte, Promex Industries

 Conventional SMT Line Cost

• Capital Cost 15+75+200+55+80 = $440K, 5yrs, 1 shift

• Sq ft. 50 x 10 = 500@ $2.00/mo
• Power, Kw 0.5+2+25+5 = 32.5 Kw @ $0.15/Kwh
• Operators 1.5 persons @ $20/hr
• Cost per hour = $80.72
• Line will place 10,000 parts/hr
• SAC305 costs 0.1 cent/part
or $10.00/hr @ 10,000 parts/hr.

Total Cost, ex-interconnect is:

$90.72/hr

Source: Richard Otte, Promex Industries

 Occam Process Line

Kitting, Feeder X-ray

Setup

Water Wash
Solder Printer P&P Machine Reflow Oven Machine
$200K

Solder Paste
Measurement Encapsulant Encapsulant Interconnect
Station Dispenser $75K Cure Station $5K deposition $?

Ionograph

Source: Richard Otte, Promex Industries

 Occam Process Line Cost

• Capital Cost 200+75+5 = $280K

• Sq ft. 20 x 10 = 200
• Power, Kw 2+1+5 = 8 Kw
• Operators 1.0 person
• Cost per hour = $50.38
• Line will place 10,000parts/hr
• Encapsulant costs 2 cents/cc
or 0.4cents/cm2 @ 2 mm thickness
or 0.1cents/pt. @4 parts/cc
or $10.00/hr @ 10,000 pts/hr.
Total cost, ex-interconnect is:
$60.38/hr, 33% less

Source: Richard Otte, Promex Industries

 Alternative
Solderless Structures
Alternative Solderless Structures

programmed

Patents Pending
 Direct Write

Rapid prototyping potential is compelling

Patents Pending
Co-Design to Compress Time

IC Design Package Design PCB Design

Time to Market Reduction

 Occam Roadmap
z Proof of concept
z Test vehicle identification and reliability testing
z Standards development – for design and performance
z Simple products first (like early SMT)
z Increase complexity with captured experience
z Explore alternative solderless assembly methods
z Engage Material & Equipment Suppliers with new product
and process opportunities
z Suitable materials identified and characterized
z Process qualification and technology transfer
Alternative Future?
“A mind, once stretched by a
new idea, never returns to its
original dimensions.”
~ Oliver Wendell Holmes ~
American Philosopher and Jurist

Thank you