ITEM DESCRIPTION SYMBOL VALUE

STEP 1
FIELD DATA
1 Dimension of the grid in E alignment direction (m): LE 123
2 Dimension of the grid in N alignment direction (m): LN 81
3 Soil resistivity (Ohm*m): r 210
4 Total enclosed area by ground grid (m2): A 9963

STEP 2
CONDUCTOR SIZE
5 Symmetrical grid current (A): Ig 1000.00
6 Duration of fault current (s): tc 0.3
7 Material thermal capacity per unit volume in Joules/cm3/ºC: TCAP 3.42
8 Ground conductor thermal coefficient of resistivity at 0 ºC: a0 0.0042735
9 Ground conductor thermal coefficient of resistivity at reference temperature of 20 ºC: at 0.00393
10 Ground conductor resistivity at reference temperature of 20 ºC: rt 1.72
11 Ko = 1 / a0 Ko 234
12 Maximum allowable temperature (ºC): Tm 250
13 Ambient temperature (ºC): Ta 40
14 Required conductor cross-section (mm2): Sm 3.23
15 Actual conductor cross-section (mm2): Sr 240

STEP 3
TOUCH & STEP CRITERIA
16 Surface layer thickness (m): hs 0.04
17 Surface layer resistivity (Ohm*m): rs 2,000
18 Surface layer derating factor: Cs 0.53
19 Tolerable touch voltage (V): Etouch50 546.10
20 Tolerable step voltage (V): Estep50 1549.03

STEP 4
INITIAL DESIGN
21 No. of parallel conductors in E alignment direction (m) 5
22 No. of parallel conductors in N alignment direction (m) 4
23 Spacing between parallel conductors in E alignment direction (m) 30.75
24 Spacing between parallel conductors in N alignment direction (m) 27.00
25 Number of ground rods: Nr 17.00
26 Length of each ground rod (m): Lr 3.05
27 Grid burial depth (m): h 0.75
28 Total length of grid conductor (m): Lc 939
29 Total effective length of grounding system conductor (m): LT 990.85

STEP 5
GRID RESISTANCE
30 Resistance of grounding system (W): Rg 1.1375

STEP 6 AND 7
31 IgxRg<Etouch50? NO

Page 1 465309512.xls
 STEP 8
MESH & STEP VOLTAGES
32 Corrective weighting factor: Kii 1
33 Corrective weighting factor: Kh 1.32
34 Peripheral length of the grid (m): Lp 408
35 Geometric factor: na 4.60
36 Geometric factor: nb 1.01
37 Geometric factor: nc 1.00
38 Geometric factor: nd 1.00
39 Geometric factor: n 4.65
40 Diameter of the conductor (m): d 0.02
41 Spacing factor for mesh voltage: Km 1.20
42 Correction factor for grid geometry: Ki 1.33
43 Effective length for mesh voltage: Lm 1,020.68
44 Actual mesh voltage (V): Em 330.33
45 Spacing factor for step voltage: Ks 0.23
46 Effective length for step voltage: Ls 748.32
47 Actual step voltage (V): Es 86.40

STEP 9
48 Em<Etouch? YES

STEP 10
49 Es<Estep? YES

Page 2 465309512.xls
 APPLIED EQUATIONS

4 A =LE × LN

11 1
K 0=
α0
Ig
14 S m=
K 0 +T m

√ ( )
ln
K 0 +T a
t c α t ρ t 104
TCAP

ρ
18
C s= 1−
(
0 . 09 1−
ρs )
2 h s + 0. 09

0.116
19 Ealignl¿ touch ¿¿= (1000 +1.5×Cs× ρs ) ¿
√t
20
0.116
E step= ( 1000+6 C s ρ s )
√t

29 LT =LC + N r xLr

1 1 1
30 R g =ρ
[ +
LT √ 20 A
1+
(
1+h √ 20 / A )]
32 Kii=1 (for grids with ground rods along the perimeter)

33 KKhh==√√1+h/h
1+h/h00 (ho=1 m reference depth of grid)

2 Lc
35 na =
Lp

Lp
36 nb =
√ 4 √A
nc = 1 for rectangular grids
37
38 nd = 1 for rectangular grids

39 n=na⋅n b⋅nc⋅nd

4S
40 d= √
π
1000
2
( D+2 h )2 h K ii
41 K m=
1
2π
ln
D
{[ + −
16 h d 8 D d 4 d K h
+ ln
8
π ( 2 n−1 ) ] }
42 K i=0. 644 +0 .148⋅n

Lr
43
[
LM = LC + 1 . 55+1. 22
(√ L2E + L2N )] Lr N r

44 ρ I g Km Ki
Em =
LM

1 1 1 1
Page 3
K s= [+
n−2
+ ( 1−0 .5 )
π 2 h h+D D ] 465309512.xls
 1 1 1 1
45 K s= [ +
n−2
+ ( 1−0 .5 )
π 2 h h+D D ]
46 Ls =0 . 75⋅LC + 0 . 85⋅Lr⋅N r

47
ρ Ig Ks Ki
E s=
Ls

Page 4 465309512.xls