DHANALAKSHMI COLLEGE OF ENGINEERING

MANIMANGALAM, CHENNAI

DEPARTMENT OF ELECTRONICS AND COMMUNICATION

ENGINEERING

EC6011- ELECTROMAGNETIC INTERFERENCE AND

COMPATIBILITY

PART-B QUESTION BANK

UNIT-1

1.Distinguish between the features of conducted EMI and radiated EMI.

2.Explain the different sources of EMI in detail. Give examples.

3.What are the sources and victims of EMI? Explain with examples.

4. Explain in detail classification of EMI/EMC. How do you minimize each?

5. Compare time domain EMI frequency domain EMI.

6. Explain ESD in detail. What are all the remedial procedures?

7. Why is EMI significant in system design? Explain with industry citations. What
are the sources and victims of EMI.

8.How do electrostatic discharge occurs? Explain in detail EMI radiation hazards.

9.How are the various sources of EMI kept under control and measured? What are
the various parameters of measurement? Give their relevant units.

10. Discriminate time domain and frequency domain EMI. Why does one analyze
frequency approach analysis, design and location of high voltages equipments?

11. Discuss how lighting discharges affect the transmission line communication.
Explain the transients, transient effects and how to minimize the transient effects?

12. Discuss in detail the design practice for minimizing conductive interference.
13. Discuss how lightning discharges affects the transmission line communication.

14. Explain in detail the conducted EMI and radiated EMI with examples.

15. An ESD discharge is modeled as a capacitance of 150 pf. Charged to 2KV

and discharged through a resistance of 1K ohms.

a) Write down the expression for the current waveform.

b) Approximating the current waveform as a short dipole, calculate the
interference power at a distance of 10cm and finds its variation with time.

16. Explain in detail classification of interference? How do you minimize each?

UNIT -2

1. Describe the differences between radiated DM and CM coupling with

examples.
2. With neat diagram, Explain near field coupling.
3. Discuss in detail with neat diagram about the ground loop coupling and
power supply coupling,(or) Explain in detail various coupling methods/
mechanisms.
4. Explain in detail the conducted, radiated and common impedance ground
coupling with examples.
5. What is radiated differential mode coupling? In what way this is different
from the radiated common mode coupling? Explain this with examples.
6. Explain cable coupling and its electro magnetic impact in system design.
7. What is Differential mode coupling(DMC)? How do radiated coupling and
transient coupling vary from DMC?
8. Discuss the impact of radiated common mode and radiated differential mode
coupling? Also explain how do common mains supply is a frequent source
of conducted interference. How do surges on main power supply affects
appliances? How to avoid it with appropriate design and location?
9. Give suitable examples for intentional and unintentional electromagnetic
emission during operation of various equipments. How to control them?
 Also list out electric field intensity levels of various home appliance Also
prove CE is more significant than radiated one.
10.How do cable coupling near and far coupling of EM fields produced can be
reduced? How to enhance immunity of circuits/ equipments systems.
11.Explain various remedial activities for coupling in circuits.
12.Explain how power supply main affects the system.
13.Explain the EMI coupling modes.
14.Discuss in detail about the various EMI coupling modes with CM and DM
current measurement.

Unit III

1. Explain about the various types of Non solid shielding techniques.

2. Describe the shielding effectiveness of both solid and non solid materials
including multiple soil shields and thin film shielding.
3. What are the factors including the EMI performs of the bonding? How can
bonding be made? Mention some guide lines for good bonds.
4. What are isolation transformers? Explain in detail.
5. Explain various method of grounding with examples.
6. How does an isolation transformer control EMI? Explain shielding and
filtering methods of controlling EMI.
7. Explain the basics of shielding and concepts of shielding.
8. Explain various grounding techniques used in electronic circuits.
9. What are the various precautions taken to reduced ground resistance?
10.Discuss in detail grounding design guidelines.
11.Illustrate how the effectiveness of shielding obtained in SMPS and Industrial
computers.
12.Differentiate between single and double shields.
13.What are EMI gaskets? Explain list the application of gaskets
14.What are the various types of filters and operations?
 Unit IV

1. Explain the civilian standards FCC, CISPR, IEC in detail.

2. What is need for EMI standards? Explain.
3. Explain the MIL STD 461E.
4. Why do the standards vary with reference to civilian and military
applications?
5. What are the various standards for civilian applications? How do they
evolve? Discuss in detail.
6. Explain various testing antenna and their frequencies as specified in CISPR
standards.
7. Compare and contrast these standards with reference to IEC and MIL 461 E
462.
8. Explain the test procedure MIL STD.
9. Discuss in detail about frequency assignment plan.
10.Explain spectrum conservation.

Unit V

1. Explain fully with diagram operation of artificial main network (LISN) and
it’s role in CE evaluation.
2. Explain various testing antenna and their frequencies as specified in CISPR
standards.
3. What is TEM cell? Explain in detail with neat diagram.
4. Explain about anechoic chamber.
5. Explain the procedure for selection of OATS.
6. Explain the test procedure for MIL STD.
7. Write a brief notes on feed through capacitors and sensors/ injector.
8. Explain the two types of OATS measurement of RE and RS.
9. Explain in detail spectrum analyzer operation with neat diagram.