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Thin-Film PV Research
R. Noufi T. Coutts R. Bhattacharya
X. Wu D. Albin B. Egaas
T. Gessert M. Contreras K. Ramanathan
J. Zhou X. Li J. Keane
C. DeHart R. Dhere M&C Division
Modification/improvement to capabilities
CdTe
Improved/Novel Buffers and Windows
(Compared to SnO2)
µ (cm2/V-S)
CdTe bandgap
CVD-c-SnO2
500-600°C
CVD-i-SnO2
500-600°C CSS-CdS
CSS-CdTe
550-620°C Efficiency =
500-600°C
CdCl2
15%
treatment
or CVD ~400°C
-CdS
~430°C Back contact
Formation
or CBD-CdS ~270°C
Temperature
~100°C
Back-contact
Formation
~270°C
Sputtered Sputtered Sputtered
Cd2SnO4 Zn2SnO4 CdS
~20°C ~20°C ~20°C
Time
Reduced CdTe Thickness from 8 µm to 3.5 µm
15%-efficient 3.5 µm CSS CdTe solar cell
20
10
-10
-20
Voltage (V)
QE (%)
02
01 nS 160
eT 2
)3mc/ta( noitartnecnoC
3
01 10
91
01 120
2
01
81 80 1
01 10
71
1
01 40
01
61 0
0 10
0
01 01
8 6 4 2 0 400 500 600 700 800 900 0 5 10 15 20
)snorcim( htpeD Wavelength (nm) Time (ns)
reliability
2
30 Recontact condition:
CuO
1. No etch
Current Density (mA/cm
Intensity
40
0
-10
20
-20
#8
0 -30
#5
300 400 500 600 700 800 900 0.0 0.2 0.4 0.6 0.8 1.0
Wavelength [nm] Voltage (V) 945 940 935 930
Binding Energy (eV)
• Needs further
understanding of
limitation at high Ga High
efficiency
– Understand the performance range
limiting mechanisms
– Bulk vs. interface
recombination
Absorber band gap (eV)
– Grainboundaries contribution
– Phase inhomogeneity
Robust processing
improved performance
Minimize the Thickness of CIGS while
Maintain High-efficiency and Stability
toward Lower Cost
80 Absorption
60 T
%T, A, QE QE
40
20
R of Cell
0
400 600 800 1000 1200 1400nm
Wavelength (nm)
Development of Alternative Buffer Layers
ZnO/CdS/Cu(In,Ga)Se2 Solar Cells
Improvements to current generation (short term)
- Current generation is limited by window materials, i.e., CdS
- Develop wider bandgap (alternative) buffer layers to CdS
- (Cd,Zn)S alloys, ZnS, InxSy, ZnSe, Cd+ PE, others
Quantum Efficiency of CIGS Solar Cells using CdS, CdZnS, and ZnS Buffer Layers
Improved
performance
CIGS R&D Platform
Type: New – Process Integration Development and Industry Support
Purpose/Application to Industry:
Narrow the performance
gaps between laboratory
and commercial devices by ZnO/TCOs Mo/other
providing flexible and Evaporation
CIGS metals
controllable device
Industry
“prototype” capabilities Access
In-situ
Timeline: Controls/ Bridge Load lock
Diagnostics
(phase 1 green
Load lock
shaded components)
Vendor chosen 10/06
POD
Analytical
Expected delivery 10/07 CIGS
Sputter
CdS
CdS Wet
Start operation 11/07 Sputter
CIGS
Low Temp/Low Cost
Device Stability
Study Intrinsic Device Stability
Ea =
Temperature-Dependent Degradation of CdTe Device 2.8 eV
ln(Time to Fail)
10
Stress Data Fit: y=b·xa
0 8 80
°C
T=60°C
-5 100
6 °C
%Change in Eff
-10 120
T=80°C °C
-3
-15 2.6 2.8 3.0x10
T=100°C Ea = -1
-20 0.63 eV 1/T (K )
T=120°C
-25
0 500 1000 1500 2000 Cu diffusivity in CdTe:
Stress Time (hrs)
D = 3.7 x 10-4 exp (-0.67 eV/kT)
Reliability protocol
Industry Support
Collaboration with Industry/Technology Transfer
ZnO/CdS “Complete
make-over”
High-quality
material, CIGS
NREL
Mo
Glass
Key FY06 Milestones
Milestone Status Due Date
1. Specs and engineering design for the CIGS cluster Complete 9/30/06
tool completed
2. Demonstrate a 14% efficient thin CdTe cell (2-3 µm) 15% 9/30/06
3. Demonstrate 17% efficiency for a solar cell using 17.2% 1/30/06
1 µm thick CIGS film
4. Assessment of the feasibility of a CVD-based CIGS Complete 9/30/06
deposition
5. Demonstrate high-performing (>18%) alternative Complete 8/30/06
buffers and windows 19%
Challenges
Forward
Closing the Gap Between
Laboratory Cells and Modules
What is the pathway?
Challenge 1
Adapt NREL’s high-efficiency CIGS and CdTe insights and
device processing to close the gap between laboratory
cells and modules.
• Formal/informal technology transfer
• Address manufacturing challenges by seeking
solutions on NREL’s equipment
to industrial processes
• Benchmark/Prototype industries POD
processes against NREL’s Analytical
CIGS
Sputter
CdS
CdS Wet
Sputter
Planned Date for Completion (2nd phase):
CIGS
01/09 if funds are authorized in FY07 Low Temp/Low Cost
CdTe Research Platform
Construction/development of new state-of-the-art capabilities aimed at
contribution to manufacturing improvements.
• Allow integration of processes
similar to what is practiced by
industry
• Derive measurable material
properties that are predictive
of device performance
• Couple the knowledge
to industrial processes
• Benchmark industries
processes against NREL’s
Planned Date for Completion (1st phase):
06/09 if funds are authorized in FY07
Approach (cont.)
CdTe platform
Timeline
• Phase inhomogeneity
l
Stu tiona
Device Resultant (Lower Jo, Higher Voc)
s
Contact
die
Starting Junction
nda
Point Fabrication Changes Reduced External Loss
Fou
(Lower RS, Higher RSH)
Sup strial
18 CSU 360°C
10 CSU 320°C CV from Agilent 4294A
t
por
CSU 280°C 100 KHz
VTD 360°C
10 mV osc amp Contact Diagnostic &
u
CSU VTD 320°C
VTD
VTD 280°C
I nd
10
17
0V 0V 0V
NREL 360°C Custom Engineering
NREL 320°C
NREL 280°C
NREL CSS
16 VTD
N (cm^-3)
10 0V 0V 0V
0V 0V 0V
In-Situ Diagnostics
15
10
Thin Device Designs
14
10
ts
Pro ure
Transparent Designs
d uc
t
Fu
0 1 2 3 4 5 6
Depletion Width (um) Substrate Designs
Tim Gessert
10/06
Challenge 4
Technology transfer/partnership with industry
• Position ourselves to partner with industry through the
TPP in a timely manner
• Continue technology transfer to industry not
participating in TPP
Key FY2007 Thin-Film Polycrystalline
Compounds Milestones
Planned
Milestones Completion
1 Validate readiness of the PDIL CIGS platform by performing
an acceptance test at NREL 10/07
2 In collaboration with industry, design a set of experiments to
perform in the CIGS platform whose outcome is transferable
to industry 09/07
3 Determine minimum absorber thickness for CIGS and CdTe 09/07
at which precipitous efficiency and stability drops will occur; conclusion of
transfer results to industry task
4 Correlate doping (with Cu) with lifetime and the effect on 09/07
operating parameters in the CdTe device conclusion of
task
5 Construct and test the integrity of the hardware elements in a
multi-source CdTe deposiyion system capable of versatile
and fast process aimed at high performance and lower cost 09/07
END
Additional Results and Accomplishment
Will Not Be Presented at The Review Meeting
Polycrystalline Thin-Film
Multi-Junction Solar Cell Research
EMD DIVISION
M&C DIVISION
Objective
Develop approaches toward improving
transparent top cells, an appropriate
bottom cell, and interconnect, toward a
target 25%-efficient polycrystalline thin-
film tandem solar cell.
• Assumes all 24
photons reach
28
the top absorber 26
+
26
• Absolute maximum 24
is 28.2%
• If realistic optical
properties of TCO 22
layers included,
maximum efficiency
20
26
only ~25% 24
18
16
14
Polycrystalline Thin-Film Tandem Pathways
CdSe, CGS,
CdTe, 13.9% Efficiency
CdZnTe,
CdMnTe,
CdMgTe
15.1% Efficiency
15.3% Efficiency
Goal: Monolithic Tandem Cell
Achieved:
• Bottom cell
with EG ≈ 1.1 eV and η ≈ 20%
• Tunnel contact TCO/Cu(InGa)Se2
To Do:
• Top cell
with EG ≈ 1.7 eV and η ≈ 20%
or at least 15%
• Transparency > 70% for E < EG
• Low-temperature process for
top cell (T < 200°C)
• or Temperature-stable bottom cell
(T > 450°C)
• or New idea
ZnO
CdS
Previous record
CIS Eff. = 3.9%
CIS bottom cell
Mo VOC = 0.456 V
(14.5%*)
Glass
Mo
Glass
High-Bandgap Structures/Operating Parameters
(NREL verified)
Organization High-Bandgap Top-Cell Structure Voc Jsc Fill Factor Efficiency Comments
(eV) (V) (mA/cm2) (%) (%)
CdTe
Eg (x)= 1.71x+1.46 eV
Device Performance of CMT Devices
14
Modified “ZnS” junction; different
characteristics on the same substrate
12
“Industrial” samples showed biggest
spread in light-soak behavior
Three-Stage CIGS (Contreras)
10 Three-Stage CIGS (Ramanathan)
Three-Stage CIGS (Contreras) + ZnS (Raghu)
Industrial; Small-Area Device (Ag contact)
The relevance of the research is thought to be quite strong. The work is described
as “[v]ery sound fundamental research addressing a significant barrier to large
scale utilization of CdTe.”
Peer Review FY05
IEC VTD Close-Spaced Sublimation (CSS)
Ta Wire Confined in BN Schematic
Heater/Enclosure
(Hot-Press boron
nitride (BN) with
borate binder) Halogen Lamp
CdTe Substrate
2”x6” Post-Heater
4”x6” Pre-Heater, 600°C
600°C
CdTe
4”x4” Substrate
Source
Halogen Lamp
Heater
Non-Heated Region
Constrains Deposit