CpEA 2202

Electronic Circuits

Diodes
One of the simplest form of semiconductor devices but plays a
vital role in electronic systems, having characteristics that closely
match those of a simple switch.
Diode

• A diode is defined as a two-terminal electronic

component that only conducts current in one
direction (so long as it is operated within a
specified voltage level). An ideal diode will have
zero resistance in one direction, and infinite
resistance in the reverse direction.
• The name diode is derived from “di–ode” which
means a device that has two electrodes.
Different Representations of a Diode

Diode in an axial lead package.

 tronics industry requires some understanding of the atomic structure of each and how the
atoms are bound together to form a crystalline structure. The fundamental components of
an atom are the electron, proton, and neutron. In the lattice structure, neutrons and protons
form the nucleus and electrons appear in fixed orbits around the nucleus. The Bohr model
for the three materials is provided in Fig. 1.3.

Semiconductors Valence shell (Four valence electrons) Valence electron

Shells

• The three (3) +

Orbiting
electrons
+

semiconductors used Nucleus

most frequently in the Silicon Germanium

(a) (b)
construction of electronic
Three valence Five valence
devices are Ge electrons electrons

(Germanium), Si (Silicon),
and GaAs (Gallium + +

Arsenide).
Gallium Arsenic

(c)

FIG. 1.3
Atomic structure of (a) silicon; (b) germanium; and
(c) gallium and arsenic.

As indicated in Fig. 1.3, silicon has 14 orbiting electrons, germanium has 32 electrons,
gallium has 31 electrons, and arsenic has 33 orbiting electrons (the same arsenic that is
a very poisonous chemical agent). For germanium and silicon there are four electrons in
the outermost shell, which are referred to as valence electrons. Gallium has three valence
 Because GaAs is a compound semiconductor, there is sharing between the two differ
atoms, as shown in Fig. 1.5. Each atom, gallium or arsenic, is surrounded by atoms of
complementary type. There is still a sharing of electrons similar in structure to that of
and Si, but now five electrons are provided by the As atom and three by the Ga atom.

– – – –
– – –
– As – – As –
– Si – – Si – – Si – – – Ga – –
– – – –
– –
Sharing of electrons Ga
– – – Ga
– – – – – As – –
– Si – – Si – – Si – – – – – – –
– – – – As – – – – As –
– – Ga Ga
– –
Valence electrons – –
– – –
– –
– Si – – Si – – Si –
– As –
– – – –

FIG. 1.5
FIG. 1.4
Covalent bonding of the GaAs crystal.
Covalent bonding of the silicon atom.
Because GaAs is a compound semiconductor, there is
In a pure silicon or germanium crystal the four valenceAlthough the sharing
covalentbetween
bond will theresult in a stronger
two different atoms,bond between
as shown the valence electr
in Fig.
re siliconelectrons
or germanium
of one atomcrystal
form the four valence
a bonding electrons
arrangement with of one atom
and their parent atom, form
it is still
1.5. Each atom, a
possible
galliumforor the valence
arsenic, electrons tobyabsorb sufficient kine
is surrounded
four adjoining atoms, as shown in Fig. 1.4. atoms of thecauses
complementary type. There is still and
a sharing
rrangement with four adjoining atoms, as shown in Fig. energy1.4from
. external natural to break the covalent bond assume the “free” sta
of electrons similar in structure to that of Ge and
The term free is applied to any electron that has separated from the fixed Si, but lattice structure a
ing of atoms, strengthened by the sharing of electrons, is called covalent
now five electrons are provided by the As atom and three
is very sensitive to
by any applied
the Ga atom.electric fields such as established by voltage sources or a
difference in potential. The external causes include effects such as light energy in the fo
e GaAs isThis
a compound
bondingsemiconductor, there is sharing
of atoms, strengthened ofbybetween
photons andthethermal
the sharing twoofdifferent
energy (heat) from
electrons, the surrounding
is called covalent medium. At room temperat
bonding.
10 3
shown in Fig. 1.5. Each atom, gallium or arsenic, isthere are approximately
surrounded by atoms1.5 10 free carriers in 1 cm of intrinsic silicon material, t
of :the
is, 15,000,000,000
ntary type. There is still a sharing of electrons similar in structure to(15thatbillion)
of Geelectrons in a space smaller than a small sugar cube—
now five electrons are provided by the As atom andenormous
three bynumber.
the Ga atom.
Semiconductors
• Although the covalent bond will result in a stronger bond
between the valence electrons and their parent atom, it
is still possible for the valence electrons to absorb
sufficient kinetic energy from external natural causes to
break the covalent bond and assume the “free” state.
• The term free is applied to any electron that has
separated from the fixed lattice structure and is very
sensitive to any applied electric fields such as
established by voltage sources or any difference in
potential.
n-type and p-type Materials

• A semiconductor material that has been

subjected to the doping process is called an
extrinsic material.
• An n-type material is made by adding an
impurity to a pure semiconductor such as silicon
or germanium. The impurities used may be
phosphorus, arsenic, antimony, bismuth or
some other chemical element.
n-type and p-type Materials

• A p-type material are created by doping an

intrinsic semiconductor with an electron
acceptor element during manufacture.
• In p-type semiconductors, holes are the
majority carriers and electrons are the minority
carriers. A common p-type dopant for silicon is
boron or gallium.
R Donor ions Acceptor ions

+ –– + – + – Majority
– –
– –
carriers – –
+
– + – – + – – – –
–
+ –
– + + Minority Majority – –
– + – – + carrier carriers – –
Minority
n-type p-type carrier

(a) (b)

FIG. 1.11
(a) n-type material; (b) p-type material.

The nn-
The andpp-type
- and materials
-type materials represent
represent the the basic
basic building
building blocksblocks of semiconductor
of semiconductor devices.
We will find in the next section that the “joining” of a single n-type material with a p-typeinma-
devices. The “joining” of a single n-type material with a p-type material will result a
semiconductor element of considerable importance in electronic systems, the
terial will result in a semiconductorsemiconductor
element of considerable
diode.
importance in electronic systems.

1.6 SEMICONDUCTOR DIODE

●
Semiconductor Diode
• Semiconductor diodes are the most common type
of diode.
• These diodes begin conducting electricity only if a
certain threshold voltage is present in the forward
direction (i.e. the “low resistance” direction).
• The diode is said to be “forward biased” when
conducting current in this direction.
• When connected within a circuit in the reverse
direction (i.e. the “high resistance” direction), the
diode is said to be “reverse biased”.
Terms

• Depletion Region - The region of uncovered

positive and negative ions is called the
depletion region due to the “depletion” of free
carriers in the region.
• Bias - refers to the application of an external
voltage across the two terminals of the device
to extract a response.
 Depletion region
No-BiasSEMICONDUCTOR
Condition DIODE
(V
11
D = 0V)

–– – ++
– – – + + + – – +–
– – – –– –– + + – + –
– ++
– – ++ + – + –
– – – ++ +
– – – – ++ – –
– – – + + +
– – – ++ – – + – Metal contact

p n

ID = 0 mA ID = 0 mA
+ VD = 0 V –
(no bias)
In the absence of an applied
(a)
bias across a semiconductor
diode, the net flow of charge
Minority carrier flow in one direction is zero.
+ VD = 0 V –
Ielectron Ihole
(no bias)

ID = 0 mA
Ihole Ielectron

p n
Majority carrier flow

(b) (c)

FIG. 1.12
A p–n junction with no external bias: (a) an internal distribution of charge; (b) a diode symbol,
with the defined polarity and the current direction; (c) demonstration that the net carrier
flow is zero at the external terminal of the device when VD ! 0 V.

The majority carriers (electrons) of the n-type material must overcome the attractive
forces of the layer of positive ions in the n-type material and the shield of negative ions in
 Is Minority-carrier flow
Imajority ! 0A Reverse-Bias Condition (VD < 0V)
– – –– – – + + + –+ –
–––+ + + + VD
– – – – – + + + –+ – +– +
– +
– – –––+ + + + – Is
–– – –+ + +
p n
Depletion region
p n
Is Is
– +
(Opposite)
–V +
D

(a) (b)

FIG. 1.13
Reverse-biased p–n junction: (a) internal distribution of charge under
reverse-bias conditions; (b) reverse-bias polarity and direction of reverse
saturation current.

dening of theThe
depletion region. of
widening This widening
the depletionof theregion
depletiondue
region will number
large establish too
of free electrons
eat a barrier for the majority carriers to overcome, effectively reducing the majority car-
drawn to the positive potential and increase of negative ions will establish
r flow to zero, as shown in Fig. 1.13a.
too great
The number of minority a barrier
carriers, however,forentering
the majority carriers
the depletion to overcome,
region will not change, effectively
reducing
sulting in minority-carrier flow vectors of thethe
samemajority carrier
magnitude flowin to
indicated Fig.zero.
1.12c
th no applied voltage.
he current that exists under reverse-bias conditions is called the reverse saturation
rrent and is represented by Is.
 The application of a forward-bias potential VD will “pressure” electrons in the n-type mate-
rial and holes in the p-type material to recombine with the ions near the boundary and reduce
the width of the depletion region as shown in Fig. 1.14a. The resulting minority-carrier flow

Forward-Bias Condition (VD > 0V)

– – –– +
– + + ++ +
– – ––
+
– – – –++
+ + +

+ –

(a) (b)

FIG. 1.14
Forward-biased p–n junction: (a) internal distribution of charge under forward-bias
conditions; (b) forward-bias polarity and direction of resulting current.

The application of a forward-bias potential VD will “pressure” electrons in the n-type

material and holes in the p-type material to recombine with the ions near the
boundary and reduce the width of the depletion region thus strong attraction for the
positive potential applied to the p-type material. As the applied bias increases in
magnitude, the depletion region will continue to decrease in width until a flood of
electrons can pass through the junction, resulting in an exponential rise in current as
shown in the forward-bias region.
 tion. An electron of the n-type material now “sees” a reduced barrier at the junction due to
the reduced depletion region and a strong attraction for the positive potential applied to the
p-type material. As the applied bias increases in magnitude, the depletion region will con-
tinue to decrease in width until a flood of electrons can pass through the junction, resulting
in an exponential rise in current as shown in the forward-bias region of the characteristics
General Characteristics of a
of Fig. 1.15. Note that the vertical scale of Fig. 1.15 is measured in milliamperes (although
Semiconductor Diode
some semiconductor diodes have a vertical scale measured in amperes), and the horizontal
scale in the forward-bias region has a maximum of 1 V. Typically, therefore, the voltage
across a forward-biased diode will be less than 1 V. Note also how quickly the current rises
• The general
beyond characteristics
the knee of the curve. of a semiconductor diode can be defined by the
following
It can equation, referred
be demonstrated to as
through theShockley’s equation,
use of solid-state physicsfor the
that theforward- and
general charac-
reverse-bias regions:
teristics of a semiconductor diode can be defined by the following equation, referred to as
Shockley’s equation, for the forward- and reverse-bias regions:

ID = Is(eVD>nVT - 1) (A) (1.2)

where Is is the reverse saturation current

VD is the applied forward-bias voltage across the diode
n is an ideality factor, which is a function of the operating conditions and physi-
cal construction; it has a range between 1 and 2 depending on a wide variety of
factors (n ! 1 will be assumed throughout this text unless otherwise noted).
The voltage VT in Eq. (1.1) is called the thermal voltage and is determined by

kTK
VT = (V) (1.3)
q

where k is Boltzmann’s constant ! 1.38 " 10#23 J/K

TK is the absolute temperature in kelvins ! 273 $ the temperature in °C
#19
 It can be demonstrated through the use of solid-state physics that the general charac-
teristics of a semiconductor diode can be defined by the following equation, referred to as
Shockley’s equation, for the forward- and reverse-bias regions:

General Characteristics of (A)a ID = Is(eVD>nVT - 1) (1.2)

Semiconductor Diode
where I is the reverse saturation
s current
VD is the applied forward-bias voltage across the diode
n is an ideality factor, which is a function of the operating conditions and physi-
• The voltage VT in itEq.
cal construction; has a(1.2) is called
range between 1 andthe thermal
2 depending on voltage and
a wide variety of
is determined
factors (n ! by:
1 will be assumed throughout this text unless otherwise noted).
The voltage VT in Eq. (1.1) is called the thermal voltage and is determined by

kTK
VT = (V) (1.3)
q

where k is Boltzmann’s constant ! 1.38 " 10#23 J/K

TK is the absolute temperature in kelvins ! 273 $ the temperature in °C
q is the magnitude of electronic charge ! 1.6 " 10#19 C

EXAMPLE 1.1 At a temperature of 27°C (common temperature for components in an

enclosed operating system), determine the thermal voltage VT.
Solution: Substituting into Eq. (1.3), we obtain
T = 273 + %C = 273 + 27 = 300 K
kTK (1.38 * 10-23 J/K)(30 K)
Example

• A p-n junction diode has a reverse saturation

current rating of 50 nA at 32°C. What should be
the value of the forward current for a forward
voltage drop of 0.5V. Assume VT = kTK/q at
32°C = 26 mv.
Solution

• Solving for ID (forward bias current)

ID = Is(e − 1)
VD
nVT Is = 5 x 10−8 A, VT = 26 x 10−3V, VD = 0.5V

Therefore:

ID = 11.24A
he scale of Fig. 1.15 is in tens of volts in the negative region, there is a point
lication of too negative a voltage with the reverse polarity will result in a
n the characteristics, as shown in Fig. 1.17. The current increases at a very
direction opposite to that of the positive voltage region. The reverse-bias
results in this dramatic change in characteristics is called the breakdown
Diode Characteristics (Breakdown Region)
s given the label VBV.

ID

Forward
The reverse-bias potential that
Is results in this dramatic change
VBV
in characteristics is called the
0 VD
breakdown potential and is
Reverse

given the label VBV. It is also

known as the Zener region.
Zener
region

FIG. 1.17
Breakdown region.

age across the diode increases in the reverse-bias region, the velocity of the
 SEMICONDUCTOR DIODE
ID (mA)

30

25

20
Ge Si GaAs
15

10

VBV (GaAs) 100 V 50 V

0.3 0.7 1.0 1.2 VD (V)
Is (GaAs)
VK (Ge) VK (Si) VK (GaAs)
5 !A
VBV (Si)
10 !A
Is (Si)

VBV (Ge)
1 µA
Is (Ge)

FIG. 1.18
Comparison of Ge, Si, and GaAs commercial diodes.

simply plots of Eq. 1.2 but the actual response of commercially available units. The total reverse TABLE 1.3
Example
• Using the curves of Fig 1.18:
1. Determine the voltage across each diode at a
current of 1 mA.
2. Repeat for a current of 4 mA.
3. Repeat for a current of 30 mA.
4. Determine the average value of the diode
voltage for the range of currents listed above.
5. How do the average values compare to the
knee voltages? 

Solution
1. VD(Ge) = 0.2 V, VD(Si) = 0.6 V, VD(GaAs) = 1.1 V
2. VD(Ge) = ︎0.3 V, VD(Si) = ︎0.7 V, VD(GaAs) = 1.2 V
3. VD(Ge) = 0.42 V, VD(Si) = 0.82 V, VD(GaAs) = 1.33 V
4. - Ge: Vav = (0.2 V ︎ 0.3 V ︎ 0.42 V)/3 = 0.307 V
- Si: Vav ︎= (0.6 V + 0.7 V + 0.82 V)/3 = 0.707 V
- GaAs: Vav = (1.1 V + 1.2 V + 1.33 V)/3 = 1.21 V
5. Very close correspondence.
- Ge: 0.307 V vs. 0.3 V
- Si: 0.707 V vs. 0.7 V
- GaAs: 1.21V vs. 1.2 V
Current Commercial Use of Ge, Is and GaAs

• Ge - Germanium is in limited production due to its

temperature sensitivity and high reverse saturation current.
• Si - Used most frequently for the full range of electronic
devices since it is readily available at low cost and has
relatively low reverse saturation currents, good temperature
characteristics and excellent breakdown voltage levels.
• GaAs - It will eventually take a good share of the
development from silicon devices, especially in very large
scale integrated circuits. It has high-speed characteristics,
low reverse saturation currents, excellent temperature
sensitivities and high breakdown voltages.
 Temperature Effects
Temperature can have a marked effect on the characteristics of a semiconductor diode, as
demonstrated by the characteristics of a silicon diode shown in Fig. 1.19:
In the forward-bias region the characteristics of a silicon diode shift to the left at a rate
of 2.5 mV per centigrade degree increase in temperature.

ID (mA)
Temperature Effects
Shift to left = (100°C)(–2.5 mV/°C) = –0.35 V

30

–75°C
125°C
25°C
25
In the forward-bias region the
characteristics of a silicon diode shift to
20
Increasing Decreasing the left at a rate of 2.5 mV per centigrade
temperature temperature degree increase in temperature.
15

10 In the reverse-bias region the reverse

current of a silicon diode doubles for
Silicon diode at
Is ! 0.01 !A 5 room temperature
every 10°C rise in temperature.

40 30 20 10
0.7 V
1 !A VD (V) The reverse breakdown voltage of a
Silicon diode at
room temperature Increasing semiconductor diode will increase or
temperature decrease with temperature.
Increasing
temperature

1 µA
–75°C

25°C

125°C

FIG. 1.19
Variation in Si diode characteristics with temperature change.
 CpEA 2202
Electronic Circuits

End of Lecture
This material is prepared by Van B. Patiluna with contents from the works of Engr.
Jefferson Canada (USC) and the reference textbook.

Reference:
Boylestad, R., Nashelsky, L. Electronic Devices and Circuit Theory, 10th
edition, Prentice Hall (2009).
 Solution to Seatwork 1a

• Solving for VD (forward bias current)

ID = Is(e ) − 1
VD
nVT

1.38 x 10−23 x 300

ID = 5 x 10−3 A, Is = 5 x 10−6 A, T = 300K VT = = 0.025875V
1.6x10−19
VD ID 5 x 10−3 4
e nVT
= +1= + 1 = 10
Is 5 x 10−6

Solving for VD where n = 1:

VD = nVT x ln104 = 1 x 0.025875 x 9.21034 = 0.23832V