CONTENTS

Page no.

• INTRODUCTION ………………………………. 4

• DESCRIPTION …………………………………. 7

• CIRCUIT DIAGRAM …………………………... 12

• P.C.B. LAYOUT ………………………………… 15

• WORKING ………………………………………. 18

• P.C.B. MANUFACTURING PROCESS ……… 21

• COMPONENT PART-LIST …………………… 28

• BASIC COMPONENT DESCRIPTION …….. 32

• IC DISCRIPTION …………………………….. 44

• ASSEMBLY CODING ………………………… 58

• APPLICATION ………………………. 66

• MERITS & DE-MERITS ……………………… 68

• CONCLUSION …………………………………. 70

• REFERENCES…………………………………… 71
“INTRODUCTION”

2
 INTRODUCTION

 HOW WE DECIDED ON THIS PROJECT

Project making is a task which can be divided into a number of steps. The most
important of these is actually deciding upon what actually to make. After a
month long search, we found that all the project ideas we were coming up with
were simple in principle and demonstration as well as hackneyed. What we
finally did was to put together these small-small ideas & principles, which laid
the foundation of our project.

"Security" that's all what people needs in today world. Human Beings are
adopting different measures & techniques to lead a safe & secured life.
Another thing they needs is convenience “control through messages”. This
system has both the things security as well as convenience.

This project is designed to provide the car security by GSM phone in following
ways:

 Each vehicle has a mobile number and you may start any of your
vehicles by sending a SMS to (your password) it.

 It can be programmed to limit its operation only through a particular

cell phone.

 It can send a SMS back to your mobile if any body else try to open the
door.

 Simultaneously, it can also send SMS to the other numbers.

3
  it is possible to change the password and the target notification number
from the voice menu.

 The tip connections can be made to any kind of sensor up to your

request or necessity. For instance, after you park your vehicle and lock
the doors with remote control. When the sensor trigged is increased, a
SMS is sent.

Moreover to increase the security of the vehicle, stroke sensor, motion sensor
etc. Can be placed.

4
“DESCRIPTION”

5
6
“CIRCUIT DIAGRAM”

7
 + 1 2 V
+ 1 2 V L C D 1 6 X 2
4 . 7 K
4 . 7 K
+ 5 V
+ 5 V
1 0 K
1 0 K

+ 5 V

+ 5 V 1 0 u f
3 41 0 3 9 3 8 1 41 51 6 2 8 2 1
9
1 0 k

1 2 1 1 1 0 1 81 9 2 0

3 3 p f 3 3 p f
1 k 1 k

m o b i l e

4 7 k
T x
+ 5 V
R x
1 K 6
G n d
2
1
1 0 2 P
7 3
+ 1 0 K +
5 1 0 4 P

v i b r a t i o n + 5 V
s e n s o r 1 k

5 4 8
5 4 8

C I R C U I T D A I G R A M

8
“P.C.B. LAYOUT”

9
“THE WORKING”

10
THE WORKING

11
 “P.C.B.
MANUFACTURING
PROCESS”

12
 P.C.B. MANUFACTURING PROCESS

It is an important process in the fabrication of electronic equipment.

The design of PCBs (Printed Circuit Boards) depends on circuit requirements
like noise immunity, working frequency and voltage levels etc. High power
PCBs requires a special design strategy.
The fabrication process to the printed circuit board will determine to a
large extent the price and reliability to the equipment. A common target aimed
is the fabrication of small series of highly reliable professional quality PCBs
with low investment cost. The target becomes especially important for custom
tailored equipment in the area of industrial electronics.
The layout of a PCB has to incorporate all the information of the board before
one can go on the artwork preparation. This means that a concept, that clearly
defined all the details of the circuit and partly also of the final equipment is
prerequisite before the actual lay out can start. The detailed circuit diagram is
very important for the layout designer but he must also be familiar with the
design concept and with the philosophy behind the equipment.
BOARD TYPES:
The two most popular PCB types are:
1. Single Sided Boards
The single sided PCBs are mostly used in entertainment electronics
where manufacturing costs have to be kept at a minimum. However in
industrial electronics cost factors cannot be neglected and single sided boards
should be used wherever a particular circuit can be accommodated on such
boards.
2. Double Sided Boards
Double-sided PCBs can be made with or without plated
through holes. The production of boards with plated through holes is
fairly expensive. Therefore plated through holes boards are only chosen
where the circuit complexities and density does not leave any other
choice.

13
 CHRONOLOGY

The following steps have been followed in carrying out the project.

1. Study the books on the relevant topic.

2. Understand the working of the circuit.

3. Prepare the circuit diagram.

4. Prepare the list of components along with their specification. Estimate

the cost and procure them after carrying out market survey.

5. Plan and prepare PCB for mounting all the components.

6. Fix the components on the PCB and solder them.

7. Test the circuit for the desired performance.

8. Trace and rectify faults if any.

9. Give good finish to the unit.

10. Prepare the project report.

14
DESIGN SPECIFICATION

(I) STEP TAKEN WHILE PREPARING CIRCUIT

(A) PCB DESIGNING
The main purpose of printed circuit is in the routing of electric
currents and signal through a thin copper layer that is bounded firmly to and
insulating base material some time called the substrate. This base is
manufactured with an integral bounded layers of thin copper foil which has to
be partly etched of other wise remove to arrive at a pre designed pattern to
suite the circuit connections or whatever other application is noted.
The term printed circuit board is derived from the original method
where by a printed pattern is used as the mask over wanted areas of copper.
The PCB provides an ideal baseboard upon which to assemble and hold firmly
most of the small components.
From the constructor’s point of view, the main attraction of using
PCB is its role as the mechanical support for small components. There is less
need for complicate and time consuming metal work of chassis contraception
except perhaps in providing the final enclosure. Most straight forward circuit
designs can be easily covered in to printed wiring layer the thought required to
carry out the inversion cab footed high light an possible error that would
otherwise be missed in conventional point to point wiring .The finished project
is usually neater and truly a work of art.
Actual size PCB layout for the circuit shown is drawn on the copper
board. The board is then immersed in FeCl3 solution for 12 hours. In this
process only the exposed copper portion that is etched out by the solution.
Now the petrol washes out the paint. Now the copper layout on PCB
is rubbed with a smooth sand paper slowly and lightly such that only the oxide
layers over the Cu is removed. Now the holes are drilled at the respective
places according to component layout as shown in figure.

(B) LAYOUT DESIGN:

When designing the layout one should observe the minimum size
(component body length and weight). Before starting to design the layout we
need all the required components in hand so that an accurate assessment of

15
space can be made. Other space consideration might also include from case of
mounted components over the printed circuit board or to access path to
present components.
It might be necessary to turn some components round to a
different angular position so that terminals are closer to the connections of the
components. The scale can be checked be positioning the components on the
squared paper. If any connection crosses, then one can reroute to avoid such
condition.
All common or earth lines should ideally be connected to a common
line routed around the perimeter of the layout. This will act as the ground
plane. If possible try to route the outer supply line to the ground plane. If
possible try to route the other supply lines around the opposite edge of the
layout to through the center. The first set is tearing the circuit to eliminate the
crossover with out altering the circuit detail in any way.
Plan the layout looking at the topside to this board. First this should
be translated inverse later for the etching pattern large areas rate
recommended to maintain good copper adhesive it is important to bear in
mind always that copper track width must be according to the recommended
minimum dimensions and allowance must be made for increased width where
termination holes are needed. From this aspect, it can become little tricky to
negotiate the route to connect small transistors.
There are basically two ways of copper interconnections pattern in
the under side to the board. The first is the removal of only the amount of
copper necessary to isolate the junction to the components to each other
resulting in the large areas of copper. The second is to make the
interconnection pattern looking more like conventional point wiring by routing
uniform width of copper from component to component.

(C) ETCHING PROCESS:

Etching process requires the use of chemicals acid resistant dishes
and running water supply. Ferric chloride is mostly used solution but other
etching materials such as ammonium per sulphate can be used. Nitric acid can
be used but in general it is not used due to poisonous fumes.

16
 The pattern prepared is glued to the copper surface of the board
using a latex type of adhesive that can be cubed after use. The pattern is laid
firmly on the copper using a very sharp knife to cut round the pattern
carefully to remove the paper corresponding to the required copper pattern
areas. Then apply the resist solution, which can be a kind of ink proportion for
the purpose of maintaining smooth clean outlines as far as possible. While the
board is drying, test all the components.
Before going to next stage, check the whole pattern and cross
check against the circuit diagram. Check for any free metal on the copper. The
etching bath should be in a glass or enamel disc. If using crystal of ferric-
chloride these should be thoroughly dissolved in water to the proportional
suggested. There should be 0.5 lt. of water for 125 gm of crystal.
Waste liquid should be thoroughly deflated and dried in water
land. Never pour down the drain. To prevent particles of copper hindering
further etching, agitate the solutions carefully by gently twisting or rocking the
tray.
The board should not be left in the bath a moment longer than is
needed to remove just the right amount of copper. Inspite of there being a
resistive coating there is no protection against etching away through exposed
copper edges. This leads to over etching. Have running water ready so that
etched board can be removed properly and rinsed. This will halt etching
immediately.
Drilling is one of those operations that calls for great care. For
most purposes a 1mm drill is used. Drill all holes with this size first those that
need to be larger can be easily drilled again with the appropriate larger size.

(D) COMPONENT ASSEMBLY: -

From the greatest variety of electronic components available,
which runs into thousands of different types it is often a perplexing task to
know which is right for a given job.
There could be damage such as hairline crack on PCB. If there
are, then they can be repaired by soldering a short link of bare copper wire
over the affected part.

17
 The most popular method of holding all the items is to bring the
wires far apart after they have been inserted in the appropriate holes. This will
hold the component in position ready for soldering.
Some components will be considerably larger .So it is best to start
mounting the smallest first and progressing through to the largest. Before
starting, be certain that no further drilling is likely to be necessary because
access may be impossible later.
Next will probably be the resistor, small signal diodes or other
similar size components. Some capacitors are also very small but it would be
best to fit these after wards. When fitting each group of componets mark off
each one on the components as it is fitted and if we have to leave the job we
know where to recommence.
Although transistors and integrated circuits are small items
there are good reasons for leaving the soldering of these until the last step. The
main point is that these components are very sensitive to heat and if subjected
to prolonged application of the soldering iron, they could be internally
damaged.
All the components before mounting are rubbed with sand
paper so that oxide layer is removed from the tips. Now they are mounted
according to the component layout.

(D) SOLDERING: -

This is the operation of joining the components with PCB after this operation
the circuit will be ready to use to avoid any damage or fault during this
operation following care must be taken.

1. A longer duration contact between soldering iron bit & components lead can
exceed the temperature rating of device & cause partial or total damage of the
device. Hence before soldering we must carefully read the maximum soldering
temperature & soldering time for device.

18
2. The wattage of soldering iron should be selected as minimum as permissible
for that soldering place.

3. To protect the devices by leakage current of iron its bit should be earthed
properly.

4. We should select the soldering wire with proper ratio of Pb & Tn to provide
the suitable melting temperature.

5. Proper amount of good quality flux must be applied on the soldering point to
avoid dry soldering.

19
 “COMPONENT LIST”

COMPONENT PART-LIST
ALL RESISTANCES ARE CARBON TYPE AND ARE OF QUARTER WATTS
WITH 5% TOLERANCES.

ELECTROLYTIC CAPACITORS ARE OF 25V WITH 20% TOLERANCES.

CERAMIC CAPACITORS ARE OF 50V WITH 5% TOLARANCES.

20
 COMPONENT LIST

1. IC’s

Number Quantity Rate/P.

AT89C52 1 150.00
LM358 1 22.00
LM7805 1 10.00

2. Transistors

BC548B 6 3.00

3. Light Emitting Diodes (LED’s)

Red 4 1.50

4. Diodes

1N4007 6 1.50

5. DISPLAY

LCD 1 340.00

6. Crystal

12 MHz 1 30.00

7. Electrolytic Capacitors

1000µ F/25V 1 7.00

10µ F/25V 3 3.00

8. Ceramic Capacitors

33pf 2 1.00

21
9. Variable Resistors

Preset 10K 1 5.00

10.Carbon Resistors (0.25W)

100K 1 0.25
10K 8 0.25
1K 4 0.25

11.Transformers

9/0/9 500mA 1 40.00

12. PCB

6” X 8” 1 90.00

13. Miscellaneous

IC Base (40 pin) 1 14.00

IC Base (16 pin) 1 5.00
IC Base (8 pin) 1 3.00
Mains Cable 1 15.00
Ferric Cloride 100gms. 40.00
Soldering Wire 20gms. 12.00
Connecting wires 3mtrs. 10.00
Soldering Paste 10gms. 5.00

22
 “COMPONENT
DESCRIPTION”

BASIC COMPONENT DESCRIPTION

 RESISTORS

A Resistor is a heat-dissipating element and in the electronic circuits it

is mostly used for either controlling the current in the circuit or developing a
voltage drop across it, which could be utilized for many application. There are

23
various types of resistors, which can be classified according to a number of
factors depending upon:
(1)Material used for fabrication
(2)Wattage and physical size
(3)Intended application
(4)Ambient temperature rating
(5)Cost

Basically the resistor can be splitted in to the following four parts with
the construction viewpoint.
(1) Base
(2) Resistance element
(3) Terminals
(4) Protective means.
The following characteristics are inherent in all resistors and may be
controlled by design considerations and choice of material i.e. Temperature
co–efficient of resistance, Voltage co–efficient of resistance, high frequency
characteristics, power rating and, tolerance voltage rating of Resistors.
Resistors may be classified as
(1) Fixed
(2) semi variable
(3) Variable resistor

 CAPACITORS

The fundamental relation for the capacitance between two flat

plates separate by a dielectric material is given by C=0.08854KA/D where
C= capacitance in pf.
K= dielectric constant

24
 A=Area per plate in square cm.
D=Distance between two plates in cm
Design of capacitor depends on the proper dielectric material with
particular type of application. The dielectric material used for capacitors may
be grouped in the various classes like Mica, Glass, air, ceramic, paper,
Aluminum, electrolytic etc. The value of capacitance never remains constant.
Under certain field condition it changes with temperature, frequency and
aging. The capacitance value marked on the capacitor strictly applies only at
specified room temperature and at low frequencies some of the capacitor used
in circuits are impregnated paper dielectric capacitor, glass dielectric
capacitors, vitreous enamel dielectric capacitors etc.

 DIODES

- +

It is a two terminal device consisting of a P-N junction formed either of

Ge or Si crystal. The P and N type regions are referred to as anode and
cathode respectively. Commercially available diodes usually have some means
to indicate which lead is P and which lead is N.

Diodes are constructed from the same type of silicon as transistors, but
they are simpler devices that have only two terminals. Called the anode and
cathode, the two ends of the diode are constructed of positively doped silicon
(the anode) joined directly to negatively doped silicon (the cathode). This pn-
junction exhibits the unique characteristic of allowing current to flow in only
one direction (from the anode to the cathode). Diodes have a minimum
threshold voltage (or Vth, usually around 0.7V) that must be present between
the anode and cathode in order for current to flow. If the anode voltage is not
at least Vth greater than the cathode voltage, no current will flow. Likewise, if
the cathode voltage is greater than the anode voltage, the diode is said to be
reverse-biased and no current will flow. In an ideal diode, if the diode voltage
equals the threshold voltage (plus a small amount), then unlimited current can
flow without causing the voltage across the diode to increase. And, if the diode

25
is reversed-biased, no current will flow regardless of reverse-voltage
magnitude.
Diodes have many uses in electronic circuits. As examples, they are
frequently employed in power supply circuits to turn alternating current (AC)
into direct current (DC), they are used to limit the amount of over-voltage that
can be applied to a given circuit node, and they are used to force given circuit
nodes to remain at or below a certain voltage. On the Digilab board, three
individual diodes are used to limit the voltages applied to the Red, Blue, and
Green pins of the VGA connector (J6) to 0.7VDC or less (VGA colour signals
must lie in that voltage range to meet relevant specifications - higher voltages
would damage computer display electronics).

Note the identification methods used to mark a diode's cathode

terminal: the schematic symbol has a line at the point of the triangle; the
physical diode has a dark line on the plastic component housing; and the silk-
screen pattern has both a line at the cathode end and a square pad for the
cathode lead. When loading a diode into a circuit board, make sure that the
dark line on the diode matches the line in the silk-screen pattern. Remember
that since diodes allow current to flow in only one direction, a backwards diode
will cause the circuit to malfunction.

 TRANSISTOR
A transistor consists of two junctions by sandwiching either p-type or n-
type semiconductor between a pair of opposite types. Accordingly, there are
two types of transistors namely:
(1) n-p-n-transistor (2) p-n-p-transistor

(NPN) (PNP)
An n-p-n- transistor is composed of two n-type semiconductors
separated by a thin section of p type. However a p-n-p transistor is formed by

26
two p-sections separated by a thin section of n-type. In each type of transistor
the following points may be noted.

1. These are two p-n junctions. Therefore a transistor may be regarded as

combination of two diodes connected back to back.
2. There are three terminals taken from each type of semiconductor.
3. The middle section is a very thin layer. This is the most important
factor in the function of a transistor.
4. Transistor can be used as an Amplifier.
A transistor raises the strength of a weak signal and thus acts as an
amplifier. The weak signal is applied between emitter base junction and output
is taken across the load Rc connected in the collector circuit. In order to
achieve faithful amplification, the input circuit should always remain forward
biased. To do so, a dc voltage is applied in the input in addition to the signal.
This dc Voltage is known as biasing voltage and its magnitude and polarity
should be such that it always keeps the input circuit forward biased regardless
of the polarity to the signal to be amplified.
As the input circuit has low resistance therefore a small change
in signal voltage causes an appreciable change in emitter current. This causes
almost the same change in collector current due to transistor action. The
collector current flowing through a high load resistance Rc produces a large
voltage across it. Thus a weak signal applied to the input circuit appears in the
amplified form in the collector circuit. It is in this way that a transistor acts as
an amplifier.

 TRANSFORMER

A TRANSFORMER is a device that transfers electrical energy from

one circuit to another by electromagnetic induction (transformer action). The
electrical energy is always transferred without a change in frequency, but may

27
involve changes in magnitudes of voltage and current. Because a transformer
works on the principle of electromagnetic induction, it must be used with an
input source voltage that varies in amplitude. There are many types of power
that fit this description; for ease of explanation and understanding,
transformer action will be explained using an ac voltage as the input source.
The alternating current has certain advantages over direct current. One
important advantage is that when ac is used, the voltage and current levels can
be increased or decreased by means of a transformer.

As you know, the amount of power used by the load of an electrical

circuit is equal to the current in the load times the voltage across the load, or P
= EI. If, for example, the load in an electrical circuit requires an input of 2
amperes at 10 volts (20 watts) and the source is capable of delivering only 1
ampere at 20 volts, the circuit could not normally be used with this particular
source. However, if a transformer is connected between the source and the
load, the voltage can be decreased (stepped down) to 10 volts and the current
increased (stepped up) to 2 amperes. Notice in the above case that the power
remains the same. That is, 20 volts times 1 ampere equals the same power as 10
volts times 2 amperes.

In the transformer shown in the cutaway view in figure, the primary

consists of many turns of relatively small wire. The wire is coated with varnish
so that each turn of the winding is insulated from every other turn. In a
transformer designed for high-voltage applications, sheets of insulating
material, such as paper, are placed between the layers of windings to provide
additional insulation. When the primary winding is completely wound, it is
wrapped in insulating paper or cloth. The secondary winding is then wound on
top of the primary winding. After the secondary winding is complete, it too is
covered with insulating paper. Next, the E and I sections of the iron core are
inserted into and around the windings as shown.

The leads from the windings are normally brought out through a hole in
the enclosure of the transformer. Sometimes, terminals may be provided on the
enclosure for connections to the windings. The figure shows four leads, two

28
from the primary and two from the secondary. These leads are to be connected
to the source and load, respectively.

Basic Operation of a Transformer

In its most basic form a transformer consists of:

A primary coil or winding.
• A secondary coil or winding.

• A core that supports the coils or windings.

Refer to the transformer circuit in figure -1 as you read the following

explanation: The primary winding is connected to a 60 hertz ac voltage source.
The magnetic field (flux) builds up (expands) and collapses (contracts) about
the primary winding. The expanding and contracting magnetic field around
the primary winding cuts the secondary winding and induces an alternating
voltage into the winding. This voltage causes alternating current to flow
through the load. The voltage may be stepped up or down depending on the
design of the primary and secondary windings.

Figure -1. - Basic transformer action.

-
The Components of a Transformer

Two coils of wire (called windings) are wound on some type of core
material. In some cases the coils of wire are wound on a cylindrical or
rectangular cardboard form. In effect, the core material is air and the
transformer is called an AIR-CORE TRANSFORMER. Transformers used at
low frequencies, such as 60 hertz and 400 hertz, require a core of low-

29
reluctance magnetic material, usually iron. This type of transformer is called
an IRON-CORE TRANSFORMER. Most power transformers are of the iron-
core type. The principle parts of a transformer and their functions are:

• The CORE, which provides a path for the magnetic lines of flux.

• The PRIMARY WINDING, which receives energy from the ac source.

• The SECONDARY WINDING, which receives energy from the primary

winding and delivers it to the load.

Core Characteristics

The composition of a transformer core depends on such factors as

voltage, current, and frequency. Size limitations and construction costs are also
factors to be considered. Commonly used core materials are air, soft iron, and
steel. Each of these materials is suitable for particular applications and
unsuitable for others. Generally, air-core transformers are used when the
voltage source has a high frequency (above 20 kHz). Iron-core transformers
are usually used when the source frequency is low (below 20 kHz). A soft-iron-
core transformer is very useful where the transformer must be physically
small, yet efficient. The iron-core transformer provides better power transfer
than does the air-core transformer. A transformer whose core is constructed of
laminated sheets of steel dissipates heat readily; thus it provides for the
efficient transfer of power. The majority of transformers you will encounter in
Navy equipment contain laminated-steel cores. These steel laminations are
insulated with a nonconducting material, such as varnish, and then formed
into a core. It takes about 50 such laminations to make a core an inch thick.
The purpose of the laminations is to reduce certain losses which will be
discussed later in this chapter. An important point to remember is that the
most efficient transformer core is one that offers the best path for the most
lines of flux with the least loss in magnetic and electrical energy.

30
 Crystal Oscillator

Crystal oscillators are oscillators where the primary frequency

determining element is a quartz crystal. Because of the inherent characteristics
of the quartz crystal the crystal oscillator may be held to extreme accuracy of
frequency stability. Temperature compensation may be applied to crystal
oscillators to improve thermal stability of the crystal oscillator.

Crystal oscillators are usually, fixed frequency oscillators where

stability and accuracy are the primary considerations. For example it is almost
impossible to design a stable and accurate LC oscillator for the upper HF and
higher frequencies without resorting to some sort of crystal control. Hence, is
the reason for crystal oscillators.

When power is first applied, random noise is generated within our

active device and then amplified. This noise is fed back positively through
frequency selective circuits to the input where it is amplified again and so on,
Ultimately a state of equilibrium is reached where the losses in the circuit are
made good by consuming power from the power supply and the frequency of
oscillation is determined by the external components, be they inductors and
capacitors (L.C.) or a crystal. The amount of positive feedback to sustain
oscillation is also determined by external components.

A well-designed crystal oscillator will provide good performance with

TTL gates. Two types of crystal oscillator circuits can be used: One with series
resonance, or one with parallel resonance.

31
 The Figure above shows implementation of a parallel resonant oscillator
circuit. The circuit is designed to use the fundamental frequency of the crystal.
The 74AS04 inverter performs the 180-degree phase shift that a parallel
oscillator requires. The 4K7 resistor provides the negative feedback for
stability.

32
The Figure above shows implementation of a series
resonant oscillator circuit, using TTL AND GATES.

LED
As its name indicates it is a forward biased P-N junction, which
emits visible light when energized. Charge carrier recombination takes place
when electrons from the N-side cross the junction and recombine with the
holes on the P side. Electrons are in the higher conduction band on the N side
whereas holes are in the lower valance band on the P side. During

33
recombination, some of the energy difference is given up in the form of heat
and light. In the case of semiconductor materials like Gallium arsenide (GaAs),
Gallium phoshide (Gap) and Gallium arsenide phoshide (GaAsP). A greater
percentage of energy is released during recombination and is given out in the
form of light .LED emits no light when p-n junction is reverse biased.

RELAY
In this circuit a 12V magnetic relay is used. In magnetic relay, insulated
copper wire coil is used to magnetize and attract the plunger .The plunger is
normally connected to N/C terminal. A spring is connected to attract the
plunger upper side. When output is received by relay, the plunger is attracted
and the bulb glows.

34
“IC DESCRIPTION”

35
 IC 7805 VOLTAGE REGULATORS

The IC used here in our project basically converts 9V supply to usable

5V. It is a positive voltage regulator.

89C51(MICROCONTR0LLER)

Features
• Compatible with MCS-51™ Products
• 4K Bytes of In-System Reprogrammable Flash Memory
– Endurance: 1,000 Write/Erase Cycles
• Fully Static Operation: 0 Hz to 24 MHz
• Three-level Program Memory Lock
• 128 x 8-bit Internal RAM

36
• 32 Programmable I/O Lines
• Two 16-bit Timer/Counters
• Six Interrupt Sources
• Programmable Serial Channel
• Low-power Idle and Power-down Modes
Description
The AT89C51 is a low-power, high-performance CMOS 8-bit microcomputer with 4K
bytes of Flash programmable and erasable read only memory (PEROM). The device
is manufactured using Atmel’s high-density nonvolatile memory technology and is
compatible with the industry-standard MCS-51 instruction set and pinout. The on-chip
Flash allows the program memory to be reprogrammed in-system or by a conventional
nonvolatile memory programmer. By combining a versatile 8-bit CPU with Flash
on a monolithic chip, the Atmel AT89C51 is a powerful microcomputer which provides
a highly-flexible and cost-effective solution to many embedded control applications.
PDIP

8-bit
Microcontroller
with 4K Bytes

Block Diagram
PORT 2 DRIVERS
PORT 2
LATCH
P2.0 - P2.7
FLASH
PORT 0
RAM LATCH
PROGRAM
ADDRESS
REGISTER
BUFFER
PC
INCREMENTER
PROGRAM
COUNTER
DPTR
RAM ADDR.
REGISTER
INSTRUCTION
REGISTER
B
REGISTER
INTERRUPT, SERIAL PORT,
AND TIMER BLOCKS
STACK
ACC POINTER
TMP2 TMP1
ALU
PSW
TIMING
AND
CONTROL
PORT 3
LATCH
PORT 3 DRIVERS
P3.0 - P3.7
PORT 1
LATCH
PORT 1 DRIVERS
P1.0 - P1.7
OSC
GND
VCC
PSEN
ALE/PROG
EA / VPP
RST
PORT 0 DRIVERS
P0.0 - P0.7

AT89C51

37
3
The AT89C51 provides the following standard features: 4K
bytes of Flash, 128 bytes of RAM, 32 I/O lines, two 16-bit
timer/counters, a five vector two-level interrupt architecture,
a full duplex serial port, on-chip oscillator and clock circuitry.
In addition, the AT89C51 is designed with static logic
for operation down to zero frequency and supports two
software selectable power saving modes. The Idle Mode
stops the CPU while allowing the RAM, timer/counters,
serial port and interrupt system to continue functioning. The
Power-down Mode saves the RAM contents but freezes
the oscillator disabling all other chip functions until the next
hardware reset.
Pin Description
VCC
Supply voltage.
GND
Ground.
Port 0
Port 0 is an 8-bit open-drain bi-directional I/O port. As an
output port, each pin can sink eight TTL inputs. When 1s
are written to port 0 pins, the pins can be used as highimpedance
inputs.
Port 0 may also be configured to be the multiplexed loworder
address/data bus during accesses to external program
and data memory. In this mode P0 has internal
pullups.
Port 0 also receives the code bytes during Flash programming,
and outputs the code bytes during program
verification. External pullups are required during program
verification.
Port 1
Port 1 is an 8-bit bi-directional I/O port with internal pullups.
The Port 1 output buffers can sink/source four TTL inputs.
When 1s are written to Port 1 pins they are pulled high by
the internal pullups and can be used as inputs. As inputs,
Port 1 pins that are externally being pulled low will source
current (IIL) because of the internal pullups.
Port 1 also receives the low-order address bytes during
Flash programming and verification.
Port 2
Port 2 is an 8-bit bi-directional I/O port with internal pullups.
The Port 2 output buffers can sink/source four TTL inputs.
When 1s are written to Port 2 pins they are pulled high by
the internal pullups and can be used as inputs. As inputs,
Port 2 pins that are externally being pulled low will source
current (IIL) because of the internal pullups.
Port 2 emits the high-order address byte during fetches
from external program memory and during accesses to
external data memory that use 16-bit addresses (MOVX @
DPTR). In this application, it uses strong internal pullups
when emitting 1s. During accesses to external data memory
that use 8-bit addresses (MOVX @ RI), Port 2 emits the
contents of the P2 Special Function Register.
Port 2 also receives the high-order address bits and some
control signals during Flash programming and verification.
Port 3
Port 3 is an 8-bit bi-directional I/O port with internal pullups.
The Port 3 output buffers can sink/source four TTL inputs.
When 1s are written to Port 3 pins they are pulled high by

38
the internal pullups and can be used as inputs. As inputs,
Port 3 pins that are externally being pulled low will source
current (IIL) because of the pullups.
Port 3 also serves the functions of various special features
of the AT89C51 as listed below:
Port 3 also receives some control signals for Flash programming
and verification.
RST
Reset input. A high on this pin for two machine cycles while
the oscillator is running resets the device.
ALE/PROG
Address Latch Enable output pulse for latching the low byte
of the address during accesses to external memory. This
pin is also the program pulse input (PROG) during Flash
programming.
In normal operation ALE is emitted at a constant rate of 1/6
the oscillator frequency, and may be used for external timing
or clocking purposes. Note, however, that one ALE
Port Pin Alternate Functions
P3.0 RXD (serial input port)
P3.1 TXD (serial output port)
P3.2 INT0 (external interrupt 0)
P3.3 INT1 (external interrupt 1)
P3.4 T0 (timer 0 extern
al input)
P3.5 T1 (timer 1 external input)
P3.6 WR (external data memory write strobe)
P3.7 RD (external data memory read strobe)

LM358

Low Power Dual Operational Amplifiers

General Description
The LM158 series consists of two independent, high gain, internally
frequency compensated operational amplifiers which
were designed specifically to operate from a single power
supply over a wide range of voltages. Operation from split
power supplies is also possible and the low power supply
current drain is independent of the magnitude of the power
supply voltage.
Application areas include transducer amplifiers, dc gain
blocks and all the conventional op amp circuits which now
can be more easily implemented in single power supply systems.
For example, the LM158 series can be directly operated
off of the standard +5V power supply voltage which is
used in digital systems and will easily provide the required
interface electronics without requiring the additional ±15V
power supplies.
The LM358 is also available in a chip sized package
(8-Bump micro SMD) using National’s micro SMD package
technology.
Unique Characteristics
n In the linear mode the input common-mode voltage
range includes ground and the output voltage can also
swing to ground, even though operated from only a
single power supply voltage.
n The unity gain cross frequency is temperature
compensated.
n The input bias current is also temperature compensated.
Advantages

39
n Two internally compensated op amps
n Eliminates need for dual supplies
n Allows direct sensing near GND and VOUT also goes to
GND
n Compatible with all forms of logic
n Power drain suitable for battery operation
n Pin-out same as LM1558/LM1458 dual op amp
Features
n Available in 8-Bump micro SMD chip sized package,
(See AN-1112)
n Internally frequency compensated for unity gain
n Large dc voltage gain: 100 dB
n Wide bandwidth (unity gain): 1 MHz
(temperature compensated)
n Wide power supply range:
— Single supply: 3V to 32V
— or dual supplies: ±1.5V to ±16V
n Very low supply current drain (500 μA)—essentially
independent of supply voltage
n Low input offset voltage: 2 mV
n Input common-mode voltage range includes ground
n Differential input voltage range equal to the power
supply voltage
n Large output voltage swing: 0V to V+− 1.5V

40
“APPLICATIONS”

41
 APPLICATIONS

The project finds wide range of applications in following areas:

 As we have presented in Vehicle Security .This system has both the things
security as well as convenience.

 It can be implemented anywhere but for an example let us take it at the door
of a house. The door is locked & owner is out, his family member is waiting
at the door for hours. But with this system owner can open the door by just a
click of his mobile buttons. This is the convenience person seek for.

 Suppose a person is out of house & someone entered the house either by
breaking the door or some other way. The mobile unit at home with message
the owner about someone's presence at home. This is security required to be
provided.

42
“MERITS &
DEMERITS”

43
 MERITS
 The circuitry involved is simple basically having only two main
sections namely transmitter and receiver.

 The software consists of simple coding and graphics in C .

 As compared to its wide range of applications it proves to be very

cheap.
 The transmitter section will remain on till the special pulse beat
sensor circuitry is sensing pulses of the bus movement is sent.

 The project can be extended for any number of users by simple

duplication of circuitry and by minor adjustments.

 The working range covers big area by simply increasing the power
transmitted.

 It provide the display that gives the information about the next
station and distance covered by the bus.

DE-MERITS

Each and every task done has some limitation & this project too have some but
instead of taking them as failures and sitting back, it should be taken as a scope
to improve and analyze in a better way. So some of them are:-

 The major drawback of this system is the power failure at the site. The
person who is giving the command expects the execution to be done, but

44
 the absence of supply at the mobile unit and computer can't help it.
Thus the person even after receiving acknowledgement of his message
didn't get the job done. This also misleads the user and creates
inconvenience to him.

 The second major draw back is due to the congestion in network. The
message is send by a user, but due to high traffic in route message got
delayed or sometimes due to collision the message is lost. In this case the
sender didn't get the acknowledgement as the message is undelivered, so
it keep sender waiting for long time & sometimes has to resend it. This
might also lead to delivery of more than one message to the mobile unit.

 Another reasons for inconvenience way be the absence of network to the

user. In this case user is unable to send message.

45
“CONCLUSION”

46
 CONCLUSION
At the fag end of the project we feel that the whole working period
was a great learning experience due to a number of friendly & unfriendly
encounters with various situations. We also came across a lot of new concepts
making our learning a value addition.
The project is only a demonstration of a system that can be
developed into a full scale commercial utility for modern day scientific as well
as corporate requirements. One of theimprove that is possible is:
In place of using RFID we can use GPRS to improve the
performance.
By incorporating advanced IC systems the size of all the hardware
units involved can be reduced to great limits. Also the number of tracking bus
can be increase by using different ID no.
By getting permission to use high power transmission we can
simply establish this project for controlling the city bus service by sitting in
control room.
Beside this there may be many more practical applications of this
system and there is a large scope of improvement in its current features.

THANK YOU

47
“REFERENCES”

48
REFRENCES

REFERENCE FOR TECHNICAL INFORMATION FROM FOLLOWING

BOOKS OF ELECTRONICS & COMMUNICATIONS ENGINEERING:

• “ELECTRONIC DEVICES AND CIRCUIT THEORY”

BY:- ROBERT L. BOYLESTAD
• “PRINCIPLES OF COMMUNICATION SYSTEMS”
BY:- TAUB SCHILLING
• “PROGRAMING IN C”
BY:-ROBERT LAFORE
• “A TEXT BOOK OF ELECTRICAL ENGINEERING VOL:IV”
BY:-B L THERAJA
• “ UP TO DATE C-MOS DATA & COMPARISION TABLE”
REFERENCE FOR ARTICLES & TECHNICAL INFORMATION ON
LOCAL POSITIONING SYSTEM FROM FOLLOWING SITES:

http://www.yahoo.com (yahoo search engine)

http://www.google.com (Google search engine)
http://www.national.com/pf/CD/CD4066.html
http://www.fairchildsemi.com/pf/1N/1N4007.html
http://www.ascom.com
http://www.dzu.inetg.bg/dzu/telecom.htm
http://www.electricomconsulting.co.uk/overview.html
http://www.electronicprojects.com

REFERENCE FROM DOWNLOADED FILES OF FOLLOWING URL:

FOR DIODE SPECIFICATIONS:

http://www.fairchildsemi.com/ds/1N/1N4007.pd

THANK YOU

49
50