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ICs for Audio Common Use

AN7396K
Sound signal processing with built-in Spatializer IC

■ Overview Unit: mm
Spatializer Audio Processor is a signal processing

0.5±0.1
1 30

technology, monopolized by Desper Products, Inc., that


was developed for commercial electronics and multime-

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0.9±0.25
dia markets, and is based on Desper's “PRO Spatializer”

26.7±0.3
that is a 3-D audio production system for business use.
The AN7396K utilizes the innovative technology adopted

1.778
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in that system. It provides sound enhancement effect and

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sound expansion with the conventional 2-speaker stereo

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system. Moreover, the AN7396K is a sound processing IC

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15 16
which incorporates the I2C Bus-controllable mute, sound 8.6±0.3 1.0±0.25

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AGC, bass reinforcement, tone (bass and treble), balance,

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4.7±0.25 3.3±0.25
and volume circuits.

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10.16±0.25 0.35–0.05
■ Features

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3° to 15°

• Provides deep 3-D sound with conventional 2-speaker

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SDIP030-P-0400
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• Performs optimal processing to the sound source re-
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to lead-free type (SDIP030-P-0400B). See the
corded with surround-effect so as not to give double

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new package dimensions section later of this


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effects.

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datasheet.

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• Provides the functions of muting, AGC, bass reinforce-
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ment, tone, balance, and volume control.

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• Supports I2C Bus controls.


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■ Applications
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• Televisions, videos, audio equipment, and game machines


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■ Block Diagram
SDA an
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Space

R-out
F-out

VREF
VCA

SCL
R-in
CC
an28 F-in

BB
27 /D

18 co
V

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30

29

26

25

24

23

17

16

Bass reinforcement
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Balance control/
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AGC Spatializer Tone control Volume control 2.2 kΩ Mute


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10

11

12

13

14

15
1

9
R-ret.

L-ret.

BL

BR

AGC

L-in

TIM2

TIM1

Mode

GND

L.T.

L.B.

B.D.

V.D.

L-out

Note) Spatializer and the device trademark of circle-in-square are owned by Desper Products Inc.
This product can be used with the consent of the Desper Products Inc.
Under the terms of the agreement between Matsushita Electric and Desper Products Inc., no technical information on the
Spatializer, which is applied to this product, shall be provided.

Publication date: November 2001 SDC00026BEB 1


AN7396K

■ Pin Descriptions
Pin No. Description Pin No. Description
1 R-ret. 16 I2C communication clock
2 L-ret. 17 I2C communication data
3 BL out 18 R-ch. output
4 BR out 19 Treble DAC output
5 AGC 20 Balance DAC output

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6 L-ch. input 21 R-ch. treble FC set
7 TIM2 22 R-ch. bass FC set

tin nc
8 TIM1 23 Bass MIX FC adjustment

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9 Mode DAC output 24 1/2 VCC

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10 GND 25 R-ch. input

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11 L-ch. treble FC set 26 Power supply

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12 L-ch. bass FC set 27 F-out

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13 Bass DAC output 28 F-in

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14 Volume DAC output 29 Space

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15 L-ch. output 30 VCA


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■ Absolute Maximum Ratings

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Parameter Symbol Rating Unit

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Supply voltage VCC


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11.0 V
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Supply current ICC 90 mA


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Power dissipation PD 990 mW


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Operating ambient temperature * Topr −25 to +75 °C


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Storage temperature * Tstg −55 to +150 °C


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Note) *: Except for the operating ambient temperature and storage temperature, all ratings are for Ta = 25°C.
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■ Recommended Operating Range


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Parameter Symbol Range Unit


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Supply voltage VCC 6.0 to 10.0 V


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2 SDC00026BEB
AN7396K

■ Electrical Characteristics at VCC = 9 V, Ta = 25°C ± 2°C


Parameter Symbol Conditions Min Typ Max Unit
Volume max. level *1 VVmax VIN = 1 V[rms], f = 1 kHz −1 0 1 dB
Volume 1/2 level *1 VV1/2 VIN = 1 V[rms], f = 1 kHz −14.5 −12.5 −10.5 dB
Volume min. level *1 VVmin VIN = 1 V[rms], f = 1 kHz  −100 −90 dB
Balance max. level *1 VBmax VIN = 1 V[rms], f = 1 kHz −1 0 1 dB
Balance min. level *1 VBmin VIN = 1 V[rms], f = 1 kHz  −82 −80 dB

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Bus bootstrap level VBB VIN = 400 mV[rms], f = 50 Hz 10 12.5 15 dB
Bus cut level VBC VIN = 400 mV[rms], f = 50 Hz −13.5 −11.0 −8.5 dB

tin nc
Treble bootstrap level VTB VIN = 400 mV[rms], f = 20 kHz 10 12.5 15 dB

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Treble cut level VTC VIN = 400 mV[rms], f = 20 kHz −13.5 −11.0 −8.5 dB

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Circuit current *1 ICCT VIN = 0 mV 45 65 90 mA

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*1 VIN = 1 V[rms], f = 1 kHz 
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Total harmonic distortion max. THDmax 0.1 0.3 %

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*1 THD = 1%, f = 1 kHz 

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Maximum input voltage VImax 2.0 2.2 V[rms]
*1 VMUTE VIN = 1 V[rms], f = 1 kHz  −100 −90

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Muting level dB

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Noise level at volume max. *2 VNmax VIN = 0 mV, RG = 4.7 kΩ  82 120 µV[rms]

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Noise level at volume min. *2 VNmin VIN = 0 mV, RG = 4.7 kΩ


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VIN = 400 mV[rms], f = 50 Hz
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Bass reinforcement max. level VXBmax 7 9 11 dB

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Bass reinforcement min. level VXBmin VIN = 400 mV[rms], f = 50 Hz 2 4 6 dB

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VIN = 50 mV[rms], f = 1 kHz
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Level at surround max. *1 VSU1 415 600 750 mV[rms]


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Noise level at surround max. *2 VSN VIN = 0 mV, RG = 4.7 kΩ  110 150 µV[rms]

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Total harmonic distortion at THDSU ic. t in


VIN = 50 mV[rms], f = 1 kHz  0.1 0.3 %
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surround max. *1
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Crosstalk *2 CT VIN = 1 V[rms], f = 1 kHz  −78 −66 dB


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Channel balance (max.) *1 CBmax VIN = 1 V[rms], f = 1 kHz −1 0 1 dB


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Channel balance (1/4) *1 CB1/4 VIN = 1 V[rms], f = 1 kHz −2 0 2 dB


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AGC
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AGC gain 1 *1 VAGC1 VIN = 50 mV[rms], f = 1 kHz 77 110 150 mV[rms]


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AGC gain 2 *1 VAGC2 VIN = 1 V[rms], f = 1 kHz 230 345 470 mV[rms]
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I2C interface
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Sink current at ACK IACK The maximum value of sink current 2.0 10  mA
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SCL, SDA signal input VIHI 3.5  5.0 V


high-level
SCL, SDA signal input VILO 0  0.5 V
low-level
Maximum input frequency fImax   100 Kbit/s
Note) *1: The DIN audio filter is used.
*2: The A-curve filter is used.

SDC00026BEB 3
AN7396K

■ Electrical Characteristics at VCC = 9 V, Ta = 25°C ± 2°C (continued)


• Design reference data
Note) The characteristics listed below are theoretical values based on the IC design and are not guaranteed.
Parameter Symbol Conditions Min Typ Max Unit
I2C Interface
Bus free before start tBUF 4.0   µs
Start condition set-up time tSU, STA 4.0   µs

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Start condition hold time tHD, STA 4.0   µs
SCL/SDA low period tLO 4.0   µs
SCL high period tHI 4.0   µs

tin nc   µs

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SCL/SDA rise time tR 1.0

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  µs

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SCL/SDA fall time tF 0.35
  µs

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Data set-up time (write) tSU, DAT 0.25
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Data hold time (write) tHD, DAT 0   µs

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Acknowledge set-up time tSU, ACK   3.5 µs

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Acknowledge hold time tHD, ACK 0   µs

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Stop condition set-up time tSU, STO 4.0   µs


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DAC
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1 LSB = (Data(max.) − Data(00))/63

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0.1 1.0 1.9 LSB


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VIN = 100 mV[rms], f = 1 kHz  
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AGC gain 3 VAGC3 150 mV[rms]


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(Sub address 04H: 05H) *1

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AGC gain 4 VAGC4 ic. t in


VIN = 140 mV[rms], f = 1 kHz  200  mV[rms]
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(Sub address 04H: 03H) *1


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AGC gain 5 VAGC5 VIN = 200 mV[rms], f = 1 kHz  250  mV[rms]


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(Sub address 04H: 01H) *1


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VIN = 280 mV[rms], f = 1 kHz  


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AGC gain 6 VAGC6 350 mV[rms]


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(Sub address 04H: 07H) *1


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AGC gain 7 VAGC7 VIN = 500 mV[rms], f = 1 kHz 180 290 430 mV[rms]
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(Sub address 04H: 03H) *1


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Note) *1: The DIN audio filter is used.


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• DAC timing chart


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Start Slave Sub Data Stop


condition address ACK address ACK byte ACK condition

SDA

tBUF tLO
tSU.DAT tHD.DAT tSU.STO
SCL
tSU.STA
tHD.STA tR tF tHI tLO

4 SDC00026BEB
AN7396K

■ Terminal Equivalent Circuits at VCC = 9 V, Ta = 25°C


Pin No. Pin name Equivalent circuit Description Voltage (V)
1 R-ret.  R return 4.5
2 L-ret.  L return 4.5
3 BL out L-ch. Spatializer output 4.5

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4 BR out R-ch. Spatializer output 4.5

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5 AGC AGC level sensor This parameter

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Level 2 Level 1

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d te t o

d fluctuates with

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the input level.

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pla m d m des

ic. t in 0.5 to 2.0


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430 Ω 50 kΩ
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6 L-in L-ch. input 4.5


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50 kΩ
1/2 VCC

SDC00026BEB 5
AN7396K

■ Terminal Equivalent Circuits at VCC = 9 V, Ta = 25°C (continued)


Pin No. Pin name Equivalent circuit Description Voltage (V)
7 TIM2 RMS detector 2 0.6

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8 TIM1 RMS detector 1 0.6

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9 MD  Mode DAC output


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fluctuates with

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I2C data.
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0.7 to 2.4
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10 GND  Ground 0

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11 L.T. 3 L-ch. treble FC set
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5.7 kΩ
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11
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1.5 kΩ
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1.5 kΩ 8 kΩ
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12 L.B. L-ch. bass FC set 4.5


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8.64 kΩ 12

1.36 kΩ

6 SDC00026BEB
AN7396K

■ Terminal Equivalent Circuits at VCC = 9 V, Ta = 25°C (continued)


Pin No. Pin name Equivalent circuit Description Voltage (V)
13 B.D. Bass DAC output This parameter
fluctuates with
I2C data.
13 250 Ω
1.1 to 2.3
250 Ω 9.4 kΩ

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1.62 V

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14 V.D. Volume DAC output This parameter

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3V fluctuates with

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5 kΩ I2C data.
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14 250 Ω

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2 to 3.8

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11 kΩ

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15 L-out L-ch. output 4.5


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15
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16 SCL I2C Bus clock input 


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1 kΩ
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17 SDA I2C Bus data input 

1 kΩ
17

SDC00026BEB 7
AN7396K

■ Terminal Equivalent Circuits at VCC = 9 V, Ta = 25°C (continued)


Pin No. Pin name Equivalent circuit Description Voltage (V)
18 R-out R-ch. output 4.5

18

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tin nc
19 T.D. Treble DAC output This parameter

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fluctuates with

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I2C data.
19 250 Ω

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1.1 to 2.3
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250 Ω 9.4 kΩ

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1.62 V

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20 BL.D. Balance DAC output This parameter

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fluctuates with
Di ain

3V

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5 kΩ I2C data.
d te t o

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20 250 Ω
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2 to 3

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250 Ω
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21 R.T. 4 R-ch. treble FC set 4.5


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5.7 kΩ
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1.5 kΩ
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1.5 kΩ 8 kΩ

8 SDC00026BEB
AN7396K

■ Terminal Equivalent Circuits at VCC = 9 V, Ta = 25°C (continued)


Pin No. Pin name Equivalent circuit Description Voltage (V)
22 R.B. R-ch. bass FC set 4.5

8.64 kΩ 22

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1.36 kΩ

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23 BB Bass MIX gain adjustment 4.5

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2.2 kΩ 23

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24 VREF Reference voltage 4.5
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stabilization

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50 kΩ
pla m d m des

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24
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50 kΩ
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25 R-in R-ch. input 4.5


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25 200 Ω
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50 kΩ
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26 VCC None Power supply VCC


27 F-out  F out 4.5
28 F-in  F in 4.5

SDC00026BEB 9
AN7396K

■ Terminal Equivalent Circuits at VCC = 9 V, Ta = 25°C (continued)


Pin No. Pin name Equivalent circuit Description Voltage (V)
29 Space VCC VCC VCC Space This parameter
fluctuates with
I2C data.
2 to 3
29

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tin nc
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30 VCA  VCA This parameter

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fluctuates with

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I2C data.
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2 to 3

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■ Conceptual Explanation of Spatializer Operation
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• Normal stereo
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All sounds are heard from only between two speakers, right
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and left.
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• Conventional surround
isc

The sound expands toward the outside of the speaker


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system, but the sound position comes apart mostly in the con-
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• Spatializer
The sound expands toward the outside of the two speakers,
and yet their positions are stable and an expanded, deep sound
are gotten.

10 SDC00026BEB
AN7396K

■ Precautions in Use and Application Method


• Method of setting AGC control
Turning on AGC, AGC is set to 0 dB for small signals, “Bootstrap” for medium signals, and “Gain Reduction” for
large signals. The AGC input-output characteristics can be controlled by I2C as follows.

AGC characteristic
1 000
AGC = Off
"11"

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"00"
AGC = On
"01"

"10"
Output level (mV[rms])

100

tin nc
d
.
Data of sub address 04H

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D2 D1

sta
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10

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1 mV 10 mV 100 mV 1V 10 V

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Input level (RMS)


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SDC00026BEB 11
12
R-ret. 1
M 30 VCA R-ret. 1 30 VCA
150 kΩ 22 µF
AN7396K

AGC
150 kΩ 22 µF

AGC
L-ret. 2 Ma 29 Space L-ret. 2 29 Space
1 µF 1 µF
Non-polarity

47 nF
47 nF
Non-polarity 28 F-in

47 nF
47 nF
BL 3
int
BL 3 en 28 F-in
10 nF
an
BR 4
ce 27 F-out 10 nF BR 4 27 F-out
Di ain
100 nF
/D
220 kΩ 220 kΩ
AGC 5 26
■ Application Circuit Examples

Spatializer
AGC 5

Spatializer
is26c 100 nF
V CC
VCC
• Bass reinforcement circuit example

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10 µF 10 µF
6 25
tin
6 25 L-in
L-in
u e R-in R-in
10 µF 10 µF d 10 µF 10 µF
TIM2 7 P 24 Vpl inc REF TIM2 7 24 VREF
l e a l 10 µF
Tone control
n µF u 10 µF

Tone control
10 µF
on na
10 e
23 BB
as
TIM1 8
de
TIM1 8 ev pla23 BBm dL+R-out m 10 µF 0.68 µF
sf
10 µF

SDC00026BEB
22 R.B.
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Mode 9 R.B.
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10 µF
/ 0.1 µF
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tin nc
21 R.T.
iscµF an an ng
R.T.
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GND 10 21 o
Volume control

Volume control
10 nF
w. ing nt ont ce ce fou GND 10
L.T. 11 11 20 BL.D.
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10 nF
mi 20R BL.D.ue ed e e rL.T.
c L 10 d
µF 10 nF
o 10 µF
2.2 kΩ

2.2 kΩ
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L.B. 12
u
L.B. c12 19 T.D.
Bass reinforcement

on ab ty typ

Bass reinforcement
0.1 µF 10 µF
.19pa T.D. ou pe ed t li
0.1 µF fe • Application circuit example of obtaining L+R output instead of bass reinforcement
B.D. 13 18
na 10 µFt la
so R-out
d B.D. 13 cy 18
10 µF
R-out
10 µF 10 µF 10 µF
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17
nic test
V.D. 14 17 i V.D. 14
SDA SDA
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Mute

Mute
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10 µF .jp rm 10 µF ge
15 16 / 15 . 16
Balance control/

SCL

Balance control/
L-out SCL en
10 µF
ati L-out
10 µF / on.
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26.68±0.30

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• SDIP030-P-0400B (Lead-free package)

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■ New Package Dimensions (Unit: mm)

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-0.05
0.50+0.10
-0.05
0.70+0.10
-0.05
0.90+0.10
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15

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SDC00026BEB
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4.83 ±0.25 ±0.25
tin nc
Seating plane
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13
AN7396K
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.

(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products, and no license is granted under any intellectual property right or other right owned by our company or any other
company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other
company which may arise as a result of the use of technical information described in this book.

(3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office
equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
– Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod-

ue e/
ucts may directly jeopardize life or harm the human body.
– Any applications other than the standard applications intended.

(4) The products and product specifications described in this book are subject to change without notice for modification and/or im-

tin nc
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product

d
.
Standards in advance to make sure that the latest specifications satisfy your requirements.

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(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute

cle
on na
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any

cy
defect which may arise later in your equipment.

life
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure

ct
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire

du
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.

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(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
.se ng ntin tin ty e ty ur
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
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damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.

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(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita

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Electric Industrial Co., Ltd.


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