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AN7396K
Sound signal processing with built-in Spatializer IC
■ Overview Unit: mm
Spatializer Audio Processor is a signal processing
0.5±0.1
1 30
ue e/
0.9±0.25
dia markets, and is based on Desper's “PRO Spatializer”
26.7±0.3
that is a 3-D audio production system for business use.
The AN7396K utilizes the innovative technology adopted
1.778
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in that system. It provides sound enhancement effect and
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sound expansion with the conventional 2-speaker stereo
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system. Moreover, the AN7396K is a sound processing IC
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15 16
which incorporates the I2C Bus-controllable mute, sound 8.6±0.3 1.0±0.25
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AGC, bass reinforcement, tone (bass and treble), balance,
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4.7±0.25 3.3±0.25
and volume circuits.
life
+0.1
ct
10.16±0.25 0.35–0.05
■ Features
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3° to 15°
system. .se 19 ng ntin tin ty e ty ur Note) The package of this product will be changed
• Performs optimal processing to the sound source re-
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to lead-free type (SDIP030-P-0400B). See the
corded with surround-effect so as not to give double
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datasheet.
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• Provides the functions of muting, AGC, bass reinforce-
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ment, tone, balance, and volume control.
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■ Applications
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■ Block Diagram
SDA an
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Space
R-out
F-out
VREF
VCA
SCL
R-in
CC
an28 F-in
BB
27 /D
18 co
V
p
ce
30
29
26
25
24
23
17
16
Bass reinforcement
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int
Balance control/
Ma
10
11
12
13
14
15
1
9
R-ret.
L-ret.
BL
BR
AGC
L-in
TIM2
TIM1
Mode
GND
L.T.
L.B.
B.D.
V.D.
L-out
Note) Spatializer and the device trademark of circle-in-square are owned by Desper Products Inc.
This product can be used with the consent of the Desper Products Inc.
Under the terms of the agreement between Matsushita Electric and Desper Products Inc., no technical information on the
Spatializer, which is applied to this product, shall be provided.
■ Pin Descriptions
Pin No. Description Pin No. Description
1 R-ret. 16 I2C communication clock
2 L-ret. 17 I2C communication data
3 BL out 18 R-ch. output
4 BR out 19 Treble DAC output
5 AGC 20 Balance DAC output
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6 L-ch. input 21 R-ch. treble FC set
7 TIM2 22 R-ch. bass FC set
tin nc
8 TIM1 23 Bass MIX FC adjustment
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9 Mode DAC output 24 1/2 VCC
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10 GND 25 R-ch. input
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11 L-ch. treble FC set 26 Power supply
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12 L-ch. bass FC set 27 F-out
ct
13 Bass DAC output 28 F-in
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14 Volume DAC output 29 Space
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■ Absolute Maximum Ratings
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Parameter Symbol Rating Unit
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Note) *: Except for the operating ambient temperature and storage temperature, all ratings are for Ta = 25°C.
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2 SDC00026BEB
AN7396K
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Bus bootstrap level VBB VIN = 400 mV[rms], f = 50 Hz 10 12.5 15 dB
Bus cut level VBC VIN = 400 mV[rms], f = 50 Hz −13.5 −11.0 −8.5 dB
tin nc
Treble bootstrap level VTB VIN = 400 mV[rms], f = 20 kHz 10 12.5 15 dB
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Treble cut level VTC VIN = 400 mV[rms], f = 20 kHz −13.5 −11.0 −8.5 dB
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Circuit current *1 ICCT VIN = 0 mV 45 65 90 mA
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*1 VIN = 1 V[rms], f = 1 kHz
on na
Total harmonic distortion max. THDmax 0.1 0.3 %
cy
*1 THD = 1%, f = 1 kHz
life
Maximum input voltage VImax 2.0 2.2 V[rms]
*1 VMUTE VIN = 1 V[rms], f = 1 kHz −100 −90
ct
Muting level dB
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Noise level at volume max. *2 VNmax VIN = 0 mV, RG = 4.7 kΩ 82 120 µV[rms]
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VIN = 50 mV[rms], f = 1 kHz
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Noise level at surround max. *2 VSN VIN = 0 mV, RG = 4.7 kΩ 110 150 µV[rms]
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surround max. *1
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AGC
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AGC gain 2 *1 VAGC2 VIN = 1 V[rms], f = 1 kHz 230 345 470 mV[rms]
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I2C interface
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Sink current at ACK IACK The maximum value of sink current 2.0 10 mA
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of pin 17 at ACK
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SDC00026BEB 3
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Start condition hold time tHD, STA 4.0 µs
SCL/SDA low period tLO 4.0 µs
SCL high period tHI 4.0 µs
tin nc µs
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SCL/SDA rise time tR 1.0
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µs
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SCL/SDA fall time tF 0.35
µs
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Data set-up time (write) tSU, DAT 0.25
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Data hold time (write) tHD, DAT 0 µs
life
Acknowledge set-up time tSU, ACK 3.5 µs
ct
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Acknowledge hold time tHD, ACK 0 µs
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6-bit DAC DNLE L6
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VIN = 100 mV[rms], f = 1 kHz
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(Sub address 04H: 05H) *1
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AGC gain 7 VAGC7 VIN = 500 mV[rms], f = 1 kHz 180 290 430 mV[rms]
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SDA
tBUF tLO
tSU.DAT tHD.DAT tSU.STO
SCL
tSU.STA
tHD.STA tR tF tHI tLO
4 SDC00026BEB
AN7396K
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3
tin nc
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4 BR out R-ch. Spatializer output 4.5
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5 AGC AGC level sensor This parameter
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Level 2 Level 1
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d fluctuates with
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the input level.
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430 Ω 50 kΩ
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50 kΩ
1/2 VCC
SDC00026BEB 5
AN7396K
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tin nc
8 TIM1 RMS detector 1 0.6
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8
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I2C data.
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0.7 to 2.4
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10 GND Ground 0
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11 L.T. 3 L-ch. treble FC set
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5.7 kΩ
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11
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1.5 kΩ
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1.5 kΩ 8 kΩ
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8.64 kΩ 12
1.36 kΩ
6 SDC00026BEB
AN7396K
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1.62 V
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14 V.D. Volume DAC output This parameter
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3V fluctuates with
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5 kΩ I2C data.
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14 250 Ω
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2 to 3.8
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11 kΩ
ct
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1 kΩ
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1 kΩ
17
SDC00026BEB 7
AN7396K
18
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tin nc
19 T.D. Treble DAC output This parameter
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fluctuates with
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I2C data.
19 250 Ω
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1.1 to 2.3
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250 Ω 9.4 kΩ
life
1.62 V
ct
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fluctuates with
Di ain
3V
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5 kΩ I2C data.
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20 250 Ω
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2 to 3
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250 Ω
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5.7 kΩ
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1.5 kΩ
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1.5 kΩ 8 kΩ
8 SDC00026BEB
AN7396K
8.64 kΩ 22
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1.36 kΩ
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23 BB Bass MIX gain adjustment 4.5
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2.2 kΩ 23
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24 VREF Reference voltage 4.5
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stabilization
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50 kΩ
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24
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50 kΩ
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25 200 Ω
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50 kΩ
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1/2 VCC
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SDC00026BEB 9
AN7396K
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30 VCA VCA This parameter
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fluctuates with
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I2C data.
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2 to 3
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• Normal stereo
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All sounds are heard from only between two speakers, right
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and left.
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• Conventional surround
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system, but the sound position comes apart mostly in the con-
ce
ventional systems.
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• Spatializer
The sound expands toward the outside of the two speakers,
and yet their positions are stable and an expanded, deep sound
are gotten.
10 SDC00026BEB
AN7396K
AGC characteristic
1 000
AGC = Off
"11"
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"00"
AGC = On
"01"
"10"
Output level (mV[rms])
100
tin nc
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Data of sub address 04H
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D2 D1
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10
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1 mV 10 mV 100 mV 1V 10 V
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SDC00026BEB 11
12
R-ret. 1
M 30 VCA R-ret. 1 30 VCA
150 kΩ 22 µF
AN7396K
AGC
150 kΩ 22 µF
AGC
L-ret. 2 Ma 29 Space L-ret. 2 29 Space
1 µF 1 µF
Non-polarity
47 nF
47 nF
Non-polarity 28 F-in
47 nF
47 nF
BL 3
int
BL 3 en 28 F-in
10 nF
an
BR 4
ce 27 F-out 10 nF BR 4 27 F-out
Di ain
100 nF
/D
220 kΩ 220 kΩ
AGC 5 26
■ Application Circuit Examples
Spatializer
AGC 5
Spatializer
is26c 100 nF
V CC
VCC
• Bass reinforcement circuit example
on
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10 µF 10 µF
6 25
tin
6 25 L-in
L-in
u e R-in R-in
10 µF 10 µF d 10 µF 10 µF
TIM2 7 P 24 Vpl inc REF TIM2 7 24 VREF
l e a l 10 µF
Tone control
n µF u 10 µF
Tone control
10 µF
on na
10 e
23 BB
as
TIM1 8
de
TIM1 8 ev pla23 BBm dL+R-out m 10 µF 0.68 µF
sf
10 µF
SDC00026BEB
22 R.B.
ne 10aµFin ain oll
Mode 9 R.B.
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10 µF
/ 0.1 µF
/ fol d 22 d en ten wi 10 µFMode 9
tin nc
21 R.T.
iscµF an an ng
R.T.
ww low isc 0.1
GND 10 21 o
Volume control
Volume control
10 nF
w. ing nt ont ce ce fou GND 10
L.T. 11 11 20 BL.D.
se U in10 nF inu typ typ r P
10 nF
mi 20R BL.D.ue ed e e rL.T.
c L 10 d
µF 10 nF
o 10 µF
2.2 kΩ
2.2 kΩ
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L.B. 12
u
L.B. c12 19 T.D.
Bass reinforcement
on ab ty typ
Bass reinforcement
0.1 µF 10 µF
.19pa T.D. ou pe ed t li
0.1 µF fe • Application circuit example of obtaining L+R output instead of bass reinforcement
B.D. 13 18
na 10 µFt la
so R-out
d B.D. 13 cy 18
10 µF
R-out
10 µF 10 µF 10 µF
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17
nic test
V.D. 14 17 i V.D. 14
SDA SDA
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Mute
Mute
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10 µF .jp rm 10 µF ge
15 16 / 15 . 16
Balance control/
SCL
Balance control/
L-out SCL en
10 µF
ati L-out
10 µF / on.
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1
30
Ma
(0.894)
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Di ain
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1.778
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26.68±0.30
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• SDIP030-P-0400B (Lead-free package)
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■ New Package Dimensions (Unit: mm)
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-0.05
0.50+0.10
-0.05
0.70+0.10
-0.05
0.90+0.10
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15
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SDC00026BEB
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4.83 ±0.25 ±0.25
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Seating plane
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3° to 15°
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n.p bo yp pe ct
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+0.10
0.30 -0.05
10.16
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13
AN7396K
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products, and no license is granted under any intellectual property right or other right owned by our company or any other
company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other
company which may arise as a result of the use of technical information described in this book.
(3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office
equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
– Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod-
ue e/
ucts may directly jeopardize life or harm the human body.
– Any applications other than the standard applications intended.
(4) The products and product specifications described in this book are subject to change without notice for modification and/or im-
tin nc
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
d
.
Standards in advance to make sure that the latest specifications satisfy your requirements.
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(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
cle
on na
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
cy
defect which may arise later in your equipment.
life
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
ct
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
du
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
mi UR ue ued pe pe Pro
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(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
.se ng ntin tin ty e ty ur
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
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damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
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(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita
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