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Figure 1 -I
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AVERAGE ENERGY LEVEL OF
- - --- OUTERMOST ELECTRONS.
THIS RANGE OF PARTIALLY
_
_ _ _ _
++++ ++ + ++ + +
OCCUPIED ENERGY LEVELS
INCREASES SLIGHTLY WITH
+ + + + TEMPERATURE.
ALL AVAILABLE ENERGY STATES
IN THIS RANGE ARE COMPLETELY
OCCUPIEO.
/
Figure 4
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"Doping"' of Semi-Conductors normally associated wit,h the bonding
function are able to absorb enough ener-
For practical semiconductor devices, gy to break loose and become charge
the pure semiconductor material is carriers, leaving behind a corresponding
"doped" by the controlled addition of number of vacancies or "holes" in the
specific impurities to modify the elec- valence band. Most of the electrons in
trical properties. So-called n-type the conduction band, however, are
germanium, for example, is formed by "donated" by the impurity atoms. Both
adding an impurity such as arsenic with the electrons and the "holes" are avail-
five rather than four electrons in the able as charge carriers. Electrons move
outer "shell." In moderate quantities, directly, usually in short hops between
atoms of the impurity material replace neighboring atoms. "holes" only appear
some of the germanium atoms in the crys- to move; when an electron from a given
tal structure, and each "donates" one atom moves over to occupy a vacant
surplus electron not needed for bonding, energy state in an adjacent atom, it
as shown by the sketch below. leaves behind a vacancy that has appar-
ently moved in the opposite direction.
Thus "holes" behave as if they were
positively-charged carriers of electric-
ity, even though it is always electrons
that do the actual moving. Holes are
only "minority carriers" in n-type
germanium because the impurity atoms
which donate most of the free electrons
do not form useful "holes." When an
electron breaks loose from one of the
impurity atoms, the atom becomes ionized
(positively charged), but it remains
locked in place in the crystal structure
EXTRA and does not offer an available energy
ELECTRON state into which electrons may move
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tend to pass through the junction to the
CONDUCTION BAND MINORITY less-populated valence band of the
4* CARRIERS
(ELECTRONS)
n7type material (this really means, of
course, that electrons form the valence
FORBI DDEN band of the n-type material move over to
REGION occupy some of the surplus vacancies at
ELECTRON MAJORITY the same energy levels in the p-type
ENERGY +V+N+ +B+A+
++ + + + 4 CARRIERS material). The net flow of electrons
+ ++ + + + (HOLES) from left to right continues only until
VALENCE BAND the right side becomes negatively
charged relative to the left by just
the right degree to form an electric
Figure 9 field across the Junction great enough
to maintain a right-to-left electron flow
exactly equal to the left-to-right flow.
The conductivity of either n-type The difference in charge raises the
or p-type semiconductor material can be absolute energy level of the p-type
controlled by varying the concentration material, and tends both to augment the
of the impurity material. For all p-to-n flow (by permitting the electrons
practical purposes, each impurity atom traveling in this direction to Wfall" to
donates one charge-carrying electron or lower energy states) and to diminish the
hole, so the number of impurity atoms n-to-p flow (by requiring the electrons
per unit volume is the primary factor in traveling in this direction to gain
determining conductivity. Tunnel diodes additional energy).
use semiconductor materials with approxi-
mately 1,000-times more impurity atoms When an external voltage is applied
per unit volume than the materials used, to an n-p junction in the reverse direc-
for conventional diodes and transistors. tion (that is, with the n-type material
To complete this brief explanation of positive), the height of the barrier in
tunnel diode behavior, we should examine the energy diagram is soon increased to
the properties of p-n junctions with the point where virtually no electrons
both low and high concentrations of from the n-type region can acquire
impurity atoms. enough energy to cross the junction.
Thus, there is no flow to cancel the
flow of electrons from the p-side to
Semi-Conductor Junctions the n-side, and a net current flows under
the influence of the applied potential,
When a junction is formed within a as shown at the lef t in Figure 11. The
single crystal between p-type and n-type magnitude of the current flow in the
materials, a permanent electric field is reverse-bias direction does not increase
established within the crystal, producing
the energy level- conditions shown in the
diagram below.
(MEASURED IN
ELECTRON VOLTS; ( -- | FORBIDDEN ELECTRON FLOWS
NEGATIVE REGION ACROSS THE JUNCTION
VOLTAGE REGION MUST
UPWARD) / ++ + + BALANCE WHEN THERE
/+1 +44+ + ARE NO EXTERNAL
++ + + CONNECTIONS
N-TYPE P-TYPE
REGION
VALENCE BAND
Figure 10
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significantly with increasing voltage The combination of the very thin j unc-
because of the very limited supply of tion and the substantially greater off-
minority carriers (thermally excited set in potential on the two sides of a
electrons and holes). When an external tunnel diode junction makes possible the
voltage applies a forward bias to the flow of electrons through the junction
junction, as shown at the right in the region by the process known as "tunnel-
sketch, the potential barrier is effec- ing." (The potential barrier is suf-
tively reduced so that substantial num- ficiently great that relatively few
bers of the majority carriers can acquire electrons are able to cross the junction
enough energy to pass through the junc- by acquiring enough energy to hurdle the
tion, permitting an appreciable current potential barrier.) The great majority
flow. When the forward bias becomes suf- of the free electrons which impinge
ficient to "wipe outn the potential upon the junction region in the course
barrier, the junction becomes, for all of their random motions are reflected
practical purposes, a linear resistance-- back into the same material from which
that is, the current changes become they came, but a small fraction of them
proportional to the voltage changes. are able to pass through the junction
and occupy some of the vacancies in the
Tunnel Diode Junctions partially-occupied energy levels on the
opposite side of the barrier. The
The effective width of the junction probability that a given electron will
region in a semiconductor diode is strong- pass through the junction is very low.,
ly influenced by the concentration of but the supply of "charge carriers" is
impurity atoms (i.e., the degree of so great that even the small fraction of
"doping"u), since the electric field in electrons which pass through can support
the junction region can be maintained an appreciable current flow. When no
only by the ionized impurity atoms locked external voltage is applied, the elec-
into place in the crystal structure. If trons flow in both directions in suf-
the impurity atoms are only sparsely ficient quantities to balance each other.
distributed through the crystal, the When a reverse bias is applied (n-type
space required to build up a sufficient material made positive), there is a
net difference in charge to balance the stronger net flow of electrons from the
electron flows is quite great, and the p-side to the n-side, corresponding to
junction region is relatively wide. point (A) on the characteristic curve
Conversely, a high concentration of shown in Fig. 13.
impurity atoms, as in a tunnel diode,
makes possible the creation of a very
narrow or abrupt junction. At the same
time, the high impurity concentrations
in the two materials used in a tunnel
diode lead to a considerable increase in ,T.
the magnitude of the difference in
potential required to balance the elec-
tron flow across the junction, as shown
by the energy diagram below.
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current minimum, point D, the tunneling properties have been so thoroughly ex-
effect has virtually ceased, but a small plored in conjuncti6n with transistors
current flow is possible because the and conventional diodes. Silicon does
potential barrier has been reduced suf- not appear particularly attractive for
ficiently that some electrons are able tunnel diodes because the effective "mass"
to acquire enough energy by thermal ex- of its charge carriers are somewhat
citation to cross the junction. As the greater than for the other materials,
forward bias is further increased to leading to impaired high frequency per-
point E or beyond, the device behaves formance. One of the most promising
essentially the same as a conventional materials is gallium arsenide, which not
junction diode. As noted earlier, it only offers a relatively wide voltage
is the negative resistance in the region swing in the negative resistance region
from (C) to (D) that accounts for most of (approximately 1 volt), but also operates
the tunnel diode' s useful properties. well at temperatures up to 4000C.
Materials for Tunnel Diodes Typical Applications
Some of the basic materials from Tunnel diodes show considerable
which experimental tunnel diodes have promise for a wide variety of applica-
been fabricated are listed below. tions, including the following:
1. Germanium 1. Oscillators (from low audio
2. Silicon frequencies up to the kilomegacycle
3. Gallium Arsenide region).
4. Indium Arsenside
5. Indium Antimonide 2. Mixers or heterodyne converters.
With any given material, the tunnel 3. Amplifiers.
diode characteristics are controlled
primarily by varying the concentration 4. A combined oscillator, mixer
of impurity atoms or the area of the and amplifier (all in a single diode!5.
junction. The voltages at which the
maxima and minima occur in the negative 5. Bi-stable memory element for
resistance characteristic tend to remain computers.
constant for a given material. For ex-
ample, in all germanium tunnel diodes, 6. High-speed. switching element for
the maxima and minima occur at about 50 logic circuits.
and 350 millivolts, respectively, as
shown in the following sketch. 7. Negative resistance element for
filters.
Ge TUNNEL DIODE
WITH GREATER DOPING 8. Rectifier, voltage regulator, or
OR INCREASED JUNCTION AREA small-signal detector. (Diodes for this
service may be processed to minimize the
first current peak, but will exploit the
I ,1E'GALLIUM ARSENIDE
TUNNEL DIODE high conductivity in the reverse direc-
I _~
y
/ XGe
<8TUNNEL
> I (APPROX.) tion.)
/ ~ DI / 6
Performance Characteristics
200 400 600 600 1000 1. As amplifiers, tunnel diodes
MILLIVOLTS offer low noise and high gain-bandwidth
Figure 14 products. In the microwave region, they
are expected to compete closely with
masers and parametric amplifiers with
If the degree of doping on the junction respect to low noise, and will be much
area is increased, the current values lower in cost.
change, but the curve retains essentially
the same shape, as shown by the dotted 2. As computer elements, tunnel
line. Use of a different material, such diodes offer extremely high switching
as gallium arsenide, may move the voltage speed, in the rmilli-microsecond region.
points, as indicated by the dashed line The high switching speed and the broad-
in the sketch. band amplification capabilities result
both from the extremely narrow junction
Germanium will-undoubtedly be a and from the basic nature of the t"tunnel-
popular material for much of the early ing" process, which is not greatly dif-
work with tunnel diodes, because its ferent from ordinary conduction in metals.
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3. Tunnel diodes operate over a Typical values for the negative
wide temperature range, extending from resistance (-R) might range from a frac-
absolute zero up to possibly 40°C (for tion of an ohm to about 100 ohms, de-
gallium arsenide units). This wide pending upon the material used, the degree
tolerance results from the fact that only of doping, and the junction area. The
majority carriers are used in the normal junction capacitance (c) likewise varies
operating regions. with the construction of the device, but
is typically of the order of 75-100
4. Tunnel diodes are relatively micro-micro-farads. The resistor r
insensitive to atomic radiation (their represents the dissipative resistance
tolerance is about 1,000 times greater of the ohmic contacts and the semi-
than for most transistors). conductor material itself. r is usually
small compared to -R, and can be neg-
5. In contrast to transistors, lected for many practical circuit
tunnel diodes will tolerate momentary analyses where first-order approxima-
overstress well beyond their normal tions are adequate.
operating conditions. In many cases, it
is actually quite difficult to dissipate 9. The tunnel diode operates at a
enough power in the junction to damage low power level, both with respect to
the device. input requirements and with respect to
available output. In particular, the
6. Both theory and preliminary voltage swing is definitely limited in
experimental results indicate that tunnel applications where operation must be
diodes are relatively immune to con- confined to the negative-resistance
tamination by moisture and atmospheric region.
gases, thus eliminating much of the need
for hermetic sealing. 10. The two-terminal nature of the
tunnel diode offers both advantages and
7. Because hermetic sealing is disadvantages. On the plus side, most
possibly not required, tunel diodes may tunnel diode circuits are extremely
be mounted in extremely small., light, simple, permitting significant reductions
encapsulated "packages," permitting even in size and weight and substantial
greater space and weight savings than improvements in reliability. On the
transistors. other hand, the lack of inherent isola-
tion between input and output is often
8. Tunnel diodes are inherently a disadvantage making it impossible, for
low-impedance devices with inherently example, to cascade amplifier stages in
high capacitance because of the "abrupt" the usual fashion. (I.t is expected,
junction. When biased for operation in however, that new circuit approaches can
the negative-resistance region, the be devised to overcome this handicap.)
equivalent circuit for a tunnel diode is
approximately as shown below. 11. Because of its inherently
simple construction and relatively non-
critical materials, there is good reason
to believe that tunnel diodes can be
produced at very low cost, once tech-
niques for mass production have been
developed.
12. The reliability of tunnel
diode devices is expected to be sub-
stantially better than transistors be-
cause of the combination of factors
listed above as items three through
seven, plus nine and ten.
-R Basic Circuit ConceDts
A comprehensive analysis of tunnel
diode circuits is beyond the scope of
this paper, but a few simple examples
can be presented to illustrate the
simplicity of tunnel diode circuits and
to show how it is possible to perform a
Figure 15 variety of functions with a two-terminal,
negative-resistance device.
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Low-Pass Amplifiers When the tunnel diode is in place,
the equivaleat circuit becomes:
A low pass amplifier may be con-
structed by connecting a tunnel diode,
biased for operation in the negative DIODE CAPACITANCE
resistance region, across the load
resistance (RL) of a signal source which
LS. 0
'lie'1
constants the same, the power gain is
simply the square of the voltage gain as
eR <RLI
expressed above.
The frequency response of the
amplifier is limited by the diode
capacitance (plus wiring capacitances)
Figure 17 shunted across the effective output
resistance. Although the capacitance
may be of the order of 100 uuf, the
The output voltage under these con- resistance values are sufficiently low
ditions (el ) is equal to the signal that the amplifier may have a gain-band-
current multiplied by the equivalent wridth product of 300 megacycles or better.
resistanice of Rs and RL in parallel. (A voltage gain of 10 over a bandwidth
In mathematical form, of 30 megacycles is easily achievedl)
RS RL
el mi sRs =R'is RT
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Band-Pass Amplifiers or Oscillators Logic Circuits
The following circuit configuration The very simple circuit shown below
can be used for either a band-pass ampli- is so versatile in performing logic
fier or oscillator, depending upon the functions that it is sometimes referred
choice of circuAit constants. to as a "universaln logic circuit.
INPUT/OUTPUT
TANK BLOCKING CHOKE RESET 0 OUTPUT
Li DC SUPPLY
TAPS ON COIL L2
MAY BE USED TUNNEL
FOR IMPEDANCE DIODE RB +
INPUT(S) R
MATCHING IF +
REOUIRED. 4C 1 Rp
Figure 19
EFFECTIVE I 1 I
IMPEDANCE 2 2 J
_ 2
OF TANK AT > ~~ .~
FREOUENCY o R S-RD CD .R aL
OF INTEREST ° <1 r 1.
Figure 20
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If an additional input connection for experimental purposes have been
is provided, the circuit can perform as constructed by soldering the se.aicon-
a gate for either land' or "lor" service. ductor pellet between two flat plates
For service as an t"or" gate, the operat- measuring about l/8 by 3/8 inch.
ing bias at point A should be adjusted Insulating spacers and encapsulants are
so that a positive pulse on either of used to hold the plates apart, forming
the two inputs will cause the circuit a "sandwich" about 10 mils thick. This
to switch to the B condition. For "and" structure not only miniimizes lead
service, the bias should be adjusted to inductances, but also lends itself
lower the position of the load line so readily to circuits constructed with
that it takes the presence of both input miiicrostrip transmission line. The forra
pulses simultaneously to cause the factor for production versions of the
switching action to occur. device has not yet been standardized,
but it is highly probably that some form
of flatplate mounting will be used. In
Physical Construction Techiciues general, circuit construction practices
will be similar to those currently used
Because of the very low impedances for UHF devices. Leads must be kept
associated with tunnel diodes, it is very short, and extensive uses should be
necessary to orinloyD construction tech- made of flat strips, in preference to
niques which minimize both the resist- round wires, to minimize unwanted in-
ance aad inductance of interconnecting ductances. The small dimensions associ-
leads. (Lead inductances can resonate ated with tunnel diodes are highly
with the diode capacitance to cause compatible with the Micro-Mlodule con-
parasi tic oscillations.) Tunnel diodes struction technique,.
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