DMS Technologies Pvt. Ltd.

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Quality Policy

We are committed to provide Quality Printed Circuit Boards Through

Continual Improvement
Consistent Control
Team Work.

Quality Objectives

• Customer satisfaction by understanding real needs and expectations.

• Useful, Reliable, consistent customer service.
• Internationally Competitive.
• Suppliers based on quality criteria.
• Formal system of QA with in-process control.
• Formulate quality goals and achieve them through team work.
• Identify internal customers.
• Education, Motivation and Involvement of every employee.
Conformance Testing
DMS can provide customers with a range of Quality assurance certifications dependent on need. Certificates
of Conformance can be attained to customers own specifications IPC-6012, IPC –A-600.

Micro sectioning is the means by which Quality assurance can be tested but requires the destruction of the
good board. Rather than destroying a good board, teat Coupons (refer IPC-2221, IPC-2222 Section 12.4.3.1)
positioned alongside in the thief area will exhibit all the basic qualities of the production board. Tests and
Inspections that can be carried out are as follows.

VISUAL PHYSICAL ELECTRICAL MICROSECTION

General Appearance Plating Adhesion Continuity Plating Thickness
Cleanliness Conductor Peel Strength Insulation resistance Plating Quality
Plating Appearance Solder ability Dielectric withstanding voltage Interconnection hole /inner laye
Etched line widths Thermal Stress Internal annular ring
Layer registration
Inner Copper Thickness
Dielectric Separations

Handling and Storage of PCBs.

Aging and storage of your PCBs impacts upon solder ability and flatness therefore the following general
guidelines should be applied. Refer IPC-1601 Guideline for Handling and Storage on Printed Circuit
Boards.

- Clean, tidy environment

- avoid allowing the board to come into contact with silicones (hand creams, etc) sulphur containing
material which may degrade solder ability
- avoid abrasive materials, moisture and handling edge contacts.
- boards should be left in sealed and desiccated bags.
- Should be stored for a min. 6 hours 115-120 deg C in an air circulating oven immediately prior to
assembly to remove moisture wicking (ingress of moisture absorbed by epoxy glass at board edge ). Failure
to perform this function and applying rapid heating (eg. Hand soldering) can result in localized separation
of the innerlayer seperatioons (delamination).

Specific inspection, acceptability, packaging an handling methods are detailed in IPC-2221

 Selection of surface finishes

Finish Lead free ENIG

Attribute HASL
Fine line / Fine pitch Medium Good
Multiple solder Good Good
processes
Storage Good Good
Planarity Good Very good
Hole wetting Good good
Ultrasonic bonding Not Good
suitable
Thermal bonding Not Good
suitable
Press Fit Technology Medium Medium
Contact surface Not Good
suitable
Applications Wave Wave soldering, SMT reflow
soldering and of fine pitch components and
SMT reflow wire bonding. With careful
of low and design it is also suitable as a
medium pitch contacting surface.
components.
Material Selection

Laminate Selection

FR4 , by far the most commonly used material for printed circuits, is constructed of woven fiberglass cloths
impregnated with an epoxy resin or epoxy resin blend. The outstanding electrical, mechanical, and thermal
properties of FR-4 have made it an excellent material for a wide range of applications including computers
and peripherals, servers, telecommunications aerospace, industrial controls, and automotive applications.

Important Properties of the copper clad laminates are

• Glass transition Temperature (Tg).

• Dielectric Constant and Loss Tangent.
• Good Dimensional Stability.
• Low Coefficient of Thermal Expansion (CTE).
• High Thermal Conductivity.
• Low Z-Direction Expansion.
• Decomposition Temperature (Td).
• Moisture Absorption.
• Uncomplicated Processing.
• Time to Delamination (T-260 and T-288).

Type IPC 4101 B/ Applications

135 C Tg FR-4 21 Communications, Measuring Instruments, Digital home appliances,
Computers and peripherals, Industrial controls, and automotive.

170 C Tg FR-4 24, 26, 28 Getting higher yield in multiple heat assembly processes.
To be compatible with the gold wire bond processes.
Getting better reliability for applications with significant thermal cycling.
Multi-times rework of such devices as BGA.
Higher product operating temperature.
Semiconductor package, Communications

Polymide 40,41, 42 Military and aerospace.

Teflon / PTFE Military radar systems, missile guidance systems, point to point digital radio
antennas, millimeter wave applications, microstrip and stripline circuits,
commercial airline telephones.

Ceramic RF identifications tags, High frequency automotive electronics, automated test

equipment, spread spectrum communications systems.
What is the significance of UL Recognition of laminates?

Underwriters Laboratories recognizes laminate materials as a part of their overall

program of ensuring that systems and components of systems meet the
applicable safety standards. UL's primary focus has always been that of public
safety, and their focus is on those materials properties which, in failure, might
contribute to a public hazard. Fire safety is a major UL consideration and much
of our work with UL centers on UL-94 which is the basic standard for
flammability. Because they have extensive test facilities, Underwriters is
perceived to be an unbiased source of test data and results, and as a result they
have branched out into the testing of various functional properties of products
which may or may not be directly related to safety. Most commercial and
industrial electronics and electrical systems cannot be sold or installed in this
country unless they have the UL label.

Pre-preg selection

Prepreg consists of a single ply of woven glass cloth which is impregnated with a blended
epoxy resin and then partly polymerised to a ‘B-Stage’, the final polymerisation or curing
takes place during the bonding cycle.

The woven glass is made up of glass filaments approximately 6μm in diameter that are
bundled together and twisted at a set number of turns per inch to give a yarn. The yarns are
then woven together to give a glass cloth ready for impregnation.

The filament thickness, number of filaments in the yarn, the twist imparted in making the yarn
and the number of threads in the warp and weft, all have an impact on the finished board.
For instance, the prepreg chosen to manufacture a multilayer can have a direct and significant
effect on the amount of inner layer movement experienced during bonding.

Glass Style Resin Content (%) Thickness (mil) Thickness (mm )

106 64.1 1.5 0.0381
106 66.1 1.75 0.04445
106 69.7 2 0.0508
106 74.6 2.25 0.05715
1080 52.8 2.25 0.05715
1080 56.5 2.5 0.0635
1080 62.5 3 0.0762
2116 50.9 4.5 0.1143
2116 55.6 2.25 0.13335
7628 39.4 7 0.1778
7628 40.9 7.25 0.18415
7628 42.3 7.5 0.1905
7628 43.7 7.75 0.19685
For Flexible, Fexi-rigid

PCB Construction component Material Type

Base Di-electric film Polyimide Film (PI), PTFE (Polytetra fluoro ethylene), Epoxy, Cyramic
Conductor Electrodeposited copper foil
Adhesive and bonding films Polymide Film (PI)
Coverlay Polymide Film (PI)
Stiffener Polymide Film PI, FR4 Laminate
Copper clad Laminate FR4, Polymide Film PI, PTFE (Plolytetra fluoro ethylene).

Features and applications of Flexible circuits

Features Applications
High-density wiring in a small space Camera, video camera, ultrasound probe
Light weight Calculator
3-D wiring Automobile instrument panel, camera, notebook computer
Reliable wiring Aerospace applications, industrial applications.
Long Flexing endurance Printer, hard disk drive.

Comparison of stiffener materials

Glass Epoxy Polyimide
Thickness range - microns 100-2000 25-125
Soldering Possible Possible
Adhesion by thermo set resin Possible Possible
Cost High Medium

Copper Foil
The copper foil used on a PWB serves several functions. The primary use is as
a circuit line to carry electricity from one point to another to permit
interconnection of various components on the board. Copper also serves as
power and ground layers. And often copper layers carry away unwanted heat
from power devices.
All that being said, the designer of a PWB must determine several
characteristics of his board which will determine what type and thickness of
copper to use:
1. The power handling requirements of the board (thin copper won't handle as
much power as thicker copper, and too much power routed through a small
cross section could result in overheating and burnout -- almost as though it
were a fuse);
2. The size and spacing of the copper traces that must be etched on the
various layers (very fine lines and narrow spacing will generally require thinner
copper to minimize undercut during etching);
3. How much heat dissipation must be handled by the copper, especially in
inner layers (the heavier the copper, the more capacity it has to dissipate heat);
and
4. Other factors such as inner layer bonding, etc. which might require special
copper properties or finishes?
With these factors in mind, the designer specifies the type and thickness of foil.
Copper Foil gauge oz/ft2 g/m2
12 3/8 107
18 ½ 153
35 1 305
70 2 610
105 3 915
140 4 1221

4 layers with 18/18 micron outer and inner layers

Dielectric
CONDUCTIVE THICKNESS
MATERIAL DESCRIPTION Constant
LAYER NO. mm
1 MHz
1 Cu Cu foil 18m 0.018
Prepreg Prepreg 7628 4.6 0.180
Prepreg Prepreg 7628 4.6 0.180
2 Cu foil 18m 0.018
Copper clad
Core 4.6 0.710
laminate
3 Cu foil 18m 0.018
Prepreg Prepreg 7628 4.6 0.180
Prepreg Prepreg 7628 4.6 0.180
4 Cu Cu foil 18m 0.018
Total thickness calculated
1.502

Total thickness nominal

1.6±10%
6 layers with 18/35 micron outer and inner layers

Dielectric
CONDUCTIVE THICKNESS
MATERIAL DESCRIPTION Constant
LAYER NO. mm
1 MHz
1 Cu Cu foil 18m 0.018
Prepreg Prepreg 1080 4.0 0.065
Prepreg Prepreg 1080 4.0 0.065
2 Cu foil 35m 0.035
Copper clad
Core 4.6 0.200
laminate
3 Cu foil 35m 0.035
Prepreg Prepreg 7628 4.0 0.18
4 Cu foil 35m 0.035
Copper clad
Core 4.6 0.200
laminate
5 Cu foil 35m 0.035
Prepreg Prepreg 1080 4.0 0.065
Prepreg Prepreg 1080 4.0 0.065
6 Copper Foil Cu foil 18m 0.0018
Total thickness calculated 1.251
NOTE 1
Total thickness nominal
1.6±10%
 CONDUCTIVE Dielectric
THICKNESS
LAYER MATERIAL DESCRIPTION Constant
mm
NO 1 MHz
1 Cu Cu foil 18m 0.018
Prepreg Prepreg 1080 4.0 0.065
Prepreg Prepreg 1080 4.0 0.065
2 Cu foil 18m 0.018
Copper clad
Core 4.6 0.200
laminate
3 Cu foil 18m 0.018
Prepreg Prepreg 1080 4.0 0.065
Prepreg Prepreg 1080 4.0 0.065
4 Cu foil 18m 0.018
Copper clad
Core 4.6 0.200
laminate
5 Cu foil 18m 0.018
Prepreg Prepreg 1080 4.0 0.065
Prepreg Prepreg 1080 4.0 0.065
6 Cu foil 18m 0.018
Copper clad
Core 4.6 0.200
laminate
7 Cu foil 18m 0.018
Prepreg Prepreg 1080 4.0 0.065
Prepreg Prepreg 1080 4.0 0.065
8 Cu foil 18m 0.018
Total thickness calculated 1.528
NOTE 1
Total thickness nominal
1.6±10%

8 layers with 18/18 micron outer and inner layers

10 layers with 18/18 micron outer and inner layers.

CONDUCTIVE Dielectric
THICKNESS
LAYER MATERIAL DESCRIPTION Constant
mm
NO 1 MHz
 1 Cu Cu foil 18m 0.018
Prepreg Prepreg 1080 4.0 0.065
Prepreg Prepreg 1080 4.0 0.065
2 Cu foil 18m 0.018
Copper clad
Core 4.1 0.150
laminate
3 Cu foil 18m 0.018
Prepreg Prepreg 1080 4.0 0.065
Prepreg Prepreg 2116 4.2 0.100
4 Cu foil 18m 0.018
Copper clad
Core 4.1 0.150
laminate
5 Cu foil 18m 0.018
Prepreg Prepreg 2116 4.2 0.120
Prepreg Prepreg 2116 4.2 0.120
6 Copper clad Cu foil 18m 0.018
laminate Core 4.1 0.150
7 Cu foil 18m 0.018
Prepreg Prepreg 2116 4.2 0.100
Prepreg Prepreg 1080 4.0 0.065
8 Cu foil 18m 0.018
Copper clad
Core 4.1 0.150
laminate
9 Cu foil 18m 0.018
Prepreg Prepreg 1080 4.0 0.065
Prepreg Prepreg 1080 4.0 0.065
10 Cu foil 18m 0.018
Total thickness calculated 1.578
NOTE 1
Total thickness nominal 1.6±10%

Solder Mask Selection

a coating which masks off a printed wiring board surface and prevents those areas
from accepting any
solder during reflow or wave soldering processing.

The important function of a solder resist is to restrict the molten solder pickup or flow
in those
areas of the PWB, holes, pads, and conductor lines that are not covered by the solder
resist.
Apart from this table below lists the functions of solder resist.

1. Reduce the volume of solder pickup to obtain cost and weight savings.
2. Reduce solder pot contamination (copper and gold).
3. Protect PWB circuitry from handling damage, i.e., dirt, fingerprints, etc.
4. Provide an environmental barrier.
5. Fill space between conductor lines and pads with material of known dielectric
characteristics.
6. Provide an insulation or dielectric barrier between electrical components and
conductor lines or via
interconnections when components are mounted directly on top of the conductor
lines.

Major Factors of Solder Mask selection are

1. Colours
2. Surface Finish
3. Application Methods.
4. Specification as per IPC SM 840, UL 94.
5. Important Properties as below list.

• Pencil Hardness
• Dielectric Strength (IEC60243-1, 60464-2)
• Dielectric Loss
• Dielectric Constant
• Thermal Cycling
• Outgassing
• Thermal Shock
• Immersion Au, Sn and Ag Pass
• RoHS Compliant Pass
• Halogen-Free Pass