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FGH40N60SMDF 600V, 40A Field Stop IGBT

May 2010

FGH40N60SMDF
600V, 40A Field Stop IGBT
Features General Description
• Maximum Junction Temperature : TJ =175oC Using Novel Field Stop IGBT Technology, Fairchild’s new series
• Positive Temperaure Co-efficient for easy parallel operating of Field Stop IGBTs offer the optimum performance for Solar
• High current capability Inverter, UPS, SMPS, IH and PFC applications where low con-
duction and switching losses are essential.
• Low saturation voltage: VCE(sat) =1.9V(Typ.) @ IC = 40A
• High input impedance
• Fast switching
• Tighten Parameter Distribution
• RoHS compliant

Applications
• Solar Inverter, UPS, SMPS, PFC
• Induction Heating

Absolute Maximum Ratings


Symbol Description Ratings Units
VCES Collector to Emitter Voltage 600 V
VGES Gate to Emitter Voltage ± 20 V
Collector Current @ TC = 25oC 80 A
IC
Collector Current @ TC = 100oC 40 A
ICM (1) Pulsed Collector Current 120 A
Diode Forward Current @ TC = 25oC 40 A
IF
Diode Forward Current @ TC = 100oC 20 A
IFM (1) Pulsed Diode Maximum Forward Current 120 A
Maximum Power Dissipation @ TC = 25oC 349 W
PD
Maximum Power Dissipation @ TC = 100oC 174 W
o
TJ Operating Junction Temperature -55 to +175 C
Tstg Storage Temperature Range -55 to +175 oC

Maximum Lead Temp. for soldering oC


TL 300
Purposes, 1/8” from case for 5 seconds

Notes:
1: Repetitive rating: Pulse width limited by max. junction temperature

©2010 Fairchild Semiconductor Corporation 1 www.fairchildsemi.com


FGH40N60SMDF Rev. B
FGH40N60SMDF 600V, 40A Field Stop IGBT
Thermal Characteristics
Symbol Parameter Typ. Max. Units
oC/W
R qJC(IGBT) Thermal Resistance, Junction to Case - 0.43
o
R qJC(Diode) Thermal Resistance, Junction to Case - 1.45 C/W
oC/W
R qJA Thermal Resistance, Junction to Ambient - 40

Package Marking and Ordering Information


Device Marking Device Package Reel Size Tape Width Quantity
FGH40N60SMDF FGH40N60SMDF TO-247 - - 30

Electrical Characteristics of the IGBT TC = 25°C unless otherwise noted

Symbol Parameter Test Conditions Min. Typ. Max. Units

Off Characteristics
BV CES Collector to Emitter Breakdown Voltage V GE = 0V, IC = 250mA 600 - - V
DBVCES Temperature Coefficient of Breakdown
DTJ Voltage
V GE = 0V, IC = 250mA - 0.6 - V/oC

ICES Collector Cut-Off Current V CE = VCES, VGE = 0V - - 250 mA


IGES G-E Leakage Current V GE = VGES, VCE = 0V - - ±400 nA

On Characteristics
V GE(th) G-E Threshold Voltage IC = 250mA, V CE = VGE 3.5 4.5 6.0 V
IC = 40A, VGE = 15V - 1.9 2.5 V
V CE(sat) Collector to Emitter Saturation Voltage
IC = 40A, VGE = 15V,
- 2.1 - V
TC = 175oC

Dynamic Characteristics
C ies Input Capacitance - 1880 - pF
C oes Output Capacitance V CE = 30V, V GE = 0V, - 180 - pF
f = 1MHz
C res Reverse Transfer Capacitance - 50 - pF

Switching Characteristics
td(on) Turn-On Delay Time - 12 16 ns
tr Rise Time - 20 28 ns
td(off) Turn-Off Delay Time V CC = 400V, IC = 40A, - 92 120 ns
tf Fall Time RG = 6W, VGE = 15V, - 13 17 ns
Inductive Load, TC = 25oC
E on Turn-On Switching Loss - 1.3 2.0 mJ
E off Turn-Off Switching Loss - 0.26 0.34 mJ
E ts Total Switching Loss - 1.56 2.34 mJ
td(on) Turn-On Delay Time - 15 - ns
tr Rise Time - 22 - ns
td(off) Turn-Off Delay Time V CC = 400V, IC = 40A, - 116 - ns
tf Fall Time RG = 6W, VGE = 15V, - 16 - ns
Inductive Load, TC = 175oC
E on Turn-On Switching Loss - 2.1 - mJ
E off Turn-Off Switching Loss - 0.6 - mJ
E ts Total Switching Loss - 2.7 - mJ

FGH40N60SMDF Rev. B 2 www.fairchildsemi.com


FGH40N60SMDF 600V, 40A Field Stop IGBT
Electrical Characteristics of the IGBT (Continued)

Symbol Parameter Test Conditions Min. Typ. Max Units


Qg Total Gate Charge - 119 180 nC
V CE = 400V, IC = 40A,
Qge Gate to Emitter Charge - 13 20 nC
V GE = 15V
Qgc Gate to Collector Charge - 58 90 nC

Electrical Characteristics of the Diode TC = 25°C unless otherwise noted

Symbol Parameter Test Conditions Min. Typ. Max Units


TC = 25oC - 1.3 1.7
V FM Diode Forward Voltage IF = 20A V
TC = 175oC - 1.15 -
E rec Reverse Recovery Energy TC = 175oC - 1.1 - mJ
TC = 25oC - 70 100
trr Diode Reverse Recovery Time IF =20A, dIF/dt = 200A/ms ns
TC = 175oC - 210 -
TC = 25oC - 250 350
Qrr Diode Reverse Recovery Charge nC
TC = 175oC - 1875 -

FGH40N60SMDF Rev. B 3 www.fairchildsemi.com


FGH40N60SMDF 600V, 40A Field Stop IGBT
Typical Performance Characteristics

Figure 1. Typical Output Characteristics Figure 2. Typical Output Characteristics


120 120
o 20V 12V o 20V 12V
TC = 25 C TC = 175 C
15V 15V 10V
100 10V 100
Collector Current, IC [A]

Collector Current, IC [A]


80 80

60 60

VGE = 8V VGE = 8V
40 40

20 20

0 0
0 2 4 6 0 2 4 6
Collector-Emitter Voltage, VCE [V] Collector-Emitter Voltage, VCE [V]

Figure 3. Typical Saturation Voltage Figure 4. Transfer Characteristics


Characteristics
120 120
Common Emitter
Common Emitter VCE = 20V
VGE = 15V
100 o
TC = 25 C
o
Collector Current, IC [A]

TC = 25 C 90 T = 175oC
Collector Current, IC [A]

o C
TC = 175 C
80

60 60

40
30
20

0 0
0 1 2 3 4 0 2 4 6 8 10 12
Collector-Emitter Voltage, VCE [V] Gate-Emitter Voltage,VGE [V]

Figure 5. Saturation Voltage vs. Case Figure 6. Saturation Voltage vs. VGE
Temperature at Variant Current Level
3.0
20
Common Emitter Common Emitter
Collector-Emitter Voltage, VCE [V]

VGE = 15V o
Collector-Emitter Voltage, VCE [V]

TC = -40 C
80A
2.5 16

12
2.0

40A 8

1.5 40A
80A
4
IC = 20A IC = 20A

1.0
25 50 75 100 125 150 175 0
o 4 8 12 16 20
Collector-EmitterCase Temperature, TC [ C] Gate-Emitter Voltage, VGE [V]

FGH40N60SMDF Rev. B 4 www.fairchildsemi.com


FGH40N60SMDF 600V, 40A Field Stop IGBT
Typical Performance Characteristics

Figure 7. Saturation Voltage vs. VGE Figure 8. Saturation Voltage vs. VGE
20 20
Common Emitter Common Emitter
o
Collector-Emitter Voltage, VCE [V]

TC = 25 C o
TC = 175 C

Collector-Emitter Voltage, VCE [V]


16 16

12 12

8 8

40A
80A 80A
4 4
40A
IC = 20A

IC = 20A
0 0
4 8 12 16 20 4 8 12 16 20
Gate-Emitter Voltage, VGE [V] Gate-Emitter Voltage, VGE [V]

Figure 9. Capacitance Characteristics Figure 10. Gate charge Characteristics


4000 15
Common Emitter
Common Emitter o
VGE = 0V, f = 1MHz TC = 25 C
400V
Gate-Emitter Voltage, VGE [V]

TC = 25 C
o 12
3000 VCC = 200V
Capacitance [pF]

300V
9
Cies
2000
6

1000 Coes
3

Cres

0 0
0.1 1 10 30 0 40 80 120
Collector-Emitter Voltage, VCE [V] Gate Charge, Qg [nC]

Figure 11. SOA Characteristics Figure 12. Turn-on Characteristics vs.


Gate Resistance
300 100
10ms
100
tr
100ms
1ms
Collector Current, Ic [A]

10 ms
Switching Time [ns]

10
DC td(on)
10
1
Common Emitter
VCC = 400V, VGE = 15V
*Notes: IC = 40A
0.1 o
1. TC = 25 C o
TC = 25 C
o
2. TJ = 175 C o
TC = 175 C
3. Single Pulse
0.01 1
1 10 100 1000 0 10 20 30 40 50
Collector-Emitter Voltage, VCE [V] Gate Resistance, RG [W]

FGH40N60SMDF Rev. B 5 www.fairchildsemi.com


FGH40N60SMDF 600V, 40A Field Stop IGBT
Typical Performance Characteristics

Figure 13. Turn-off Characteristics vs. Figure 14. Turn-on Characteristics vs.
Gate Resistance Collector Current
1000 1000
Common Emitter
VGE = 15V, RG = 6W
td(off) o
TC = 25 C
o
TC = 175 C

Switching Time [ns]


Switching Time [ns]

100 100 tr

tf

10 Common Emitter 10 td(on)


VCC = 400V, VGE = 15V
IC = 40A
o
TC = 25 C
o
TC = 175 C
1 1
0 10 20 30 40 50 20 30 40 50 60 70 80
Gate Resistance, RG [W] Collector Current, IC [A]

Figure 15. Turn-off Characteristics vs. Figure 16. Switching Loss vs.
Collector Current Gate Resistance
1000 5

Eon
td(off)
Switching Time [ns]

100
Switching Loss [mJ]

tf Eoff

Common Emitter
10 Common Emitter VCC = 400V, VGE = 15V
VGE = 15V, RG = 6W IC = 40A
o o
TC = 25 C TC = 25 C
o o
TC = 175 C TC = 175 C
1 0.1
20 30 40 50 60 70 80 0 10 20 30 40 50
Collector Current, IC [A] Gate Resistance, RG [W]

Figure 17. Switching Loss vs. Figure 18. Turn off Switching
Collector Current SOA Characteristics
6 200

100
Eon
Collector Current, IC [A]
Switching Loss [mJ]

10
Eoff
Common Emitter
VGE = 15V, RG = 6W
o
TC = 25 C Safe Operating Area
o o
TC = 175 C VGE = 15V, TC = 175 C
0.1 1
20 30 40 50 60 70 80 1 10 100 1000
Collector Current, IC [A] Collector-Emitter Voltage, VCE [V]

FGH40N60SMDF Rev. B 6 www.fairchildsemi.com


FGH40N60SMDF 600V, 40A Field Stop IGBT
Typical Performance Characteristics

Figure 19. Current Derating Figure 20. Load Current Vs. Frequency
90 120
Common Emitter Square Wave
80 VGE = 15V 110 o
TJ < 175 C, D = 0.5, VCE = 400V
100
70 VGE = 15/0V, RG = 6W
Collector Current, IC [A]

90

Collector Current, IC [A]


60 80
50 70 o
Tc = 75 C
60
40
50 o
Tc = 100 C
30 40
20 30
20
10
10
0
25 50 75 100 125 150 175 1k 10k 100k 1M
o
Collector-EmitterCase Temperature, TC [ C] Switching Frequency, f [Hz]

Figure 21. Forward Characteristics Figure 22. Reverse Current


100 1000
o
TC = 175 C
100
Reverse Currnet, ICES [mA]
Forward Current, IF [A]

o
TC = 175 C 10

o
TC = 75 C
10 1
o
TC = 25 C
0.1
o
TC = 25 C

0.01
o
TC = 25 C
o
TC = 175 C
1 1E-3
0 0.5 1.0 1.5 2.0 2.5 0 100 200 300 400 500 600
Forward Voltage, VF [V] VR [V]

Figure 23. Stored Charge Figure 24. Reverse Recovery Time


2750 400
o o
2500 TC = 25 C TC = 25 C
Stored Recovery Charge, Qrr [nC]

350
Reverse Recovery Time, trr [ns]

o o
2250 TC = 175 C TC = 175 C

2000 300

1750 250
1500
200
1250
di/dt = 100A/ms
1000 150
di/dt = 100A/ms
750 di/dt = 200A/ms di/dt = 200A/ms
100
500
50
250
0 0
0 5 10 15 20 25 30 35 40 45 0 5 10 15 20 25 30 35 40 45
Forwad Current, IF [A] Forward Current, IF [A]

FGH40N60SMDF Rev. B 7 www.fairchildsemi.com


FGH40N60SMDF 600V, 40A Field Stop IGBT
Typical Performance Characteristics

Figure 25.Transient Thermal Impedance of IGBT

1
Thermal Response [Zthjc]

0.5

0.1 0.2
0.1
0.05
0.02
0.01 single pulse PDM
0.01
t1
t2
Duty Factor, D = t1/t2
Peak Tj = Pdm x Zthjc + TC
0.001
1E-5 1E-4 1E-3 0.01 0.1 1
Rectangular Pulse Duration [sec]

FGH40N60SMDF Rev. B 8 www.fairchildsemi.com


FGH40N60SMDF 600V, 40A Field Stop IGBT
Mechanical Dimensions

TO - 247AB (FKS PKG CODE 001)

FGH40N60SMDF Rev. B 9 www.fairchildsemi.com


FGH40N60SMDF 600V, 40A Field Stop IGBT
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PRODUCT STATUS DEFINITIONS


Definition of Terms
Datasheet Identification Product Status Definition

Advance Information Formative / In Design Datasheet contains the design specifications for product development. Specifications
may change in any manner without notice.

Datasheet contains preliminary data; supplementary data will be published at a later


Preliminary First Production date. Fairchild Semiconductor reserves the right to make changes at any time without
notice to improve design.

No Identification Needed Full Production Datasheet contains final specifications. Fairchild Semiconductor reserves the right to
make changes at any time without notice to improve the design.

Obsolete Not In Production Datasheet contains specifications on a product that is discontinued by Fairchild
Semiconductor. The datasheet is for reference information only.

Rev. I47

FGH40N60SMDF Rev. B 10 www.fairchildsemi.com

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