LTCC Packages for RF Modules | Ceramic Packages | Products about:reader?url=https://global.kyocera.

com/prdct/semicon/semi/ltcc/

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LTCC Packages for RF

Modules | Ceramic
Packages | Products
2-3 minutes

Kyocera offers Low Temperature Co-Fired

Ceramic (LTCC) materials with excellent
performance characteristics for a wide range
of packaging applications -- including
conductors with low electrical-resistance and
dielectrics with high flexural strength.

Material Properties

Typical Applications

The following Radio Frequency (RF)

modules and components are used in mobile
communication devices such as mobile
phones and mobile personal computers:
TV tuner modules, wireless LAN modules,
Bluetooth®* wireless modules, Ultra-Wide
Band (UWB) modules, front-end modules,
power amplifier modules, SAW filters and
duplexers

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TV: Television; LAN: Local Area Network;

SAW: Surface Acoustic Wave

Miniaturization of RF Modules

Reducing the size and thickness of RF

modules is possible by embedding passive
components -- such as band pass filters,
baluns and others -- in LTCC substrates.

LTCC Substrate with Embedded Passive

Components

High-Strength Materials (LTCC Hard) :

GL330

Kyocera's LTCC Hard materials have a high

flexural strength (400MPa) that is equivalent
to alumina ceramics. They offer excellent
resistance to the shock of drop-testing and
are well-suited as module substrate
materials in mobile communication devices.
As substitutes for conventional LTCC
materials, LTCC Hard substrate materials
maintain the same level of mechanical
integrity even with a reduction of
approximately 30% in thickness. This is a
result of the flexural strength of the LTCC
Hard materials being two times greater than
that of conventional LTCC materials.

* The Bluetooth word mark and logos are

owned by the Bluetooth SIG, Inc. and any

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use of such marks by KYOCERA

Corporation is under license.

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